JPH01206270A - Probe apparatus equipped with probe card automatic replacing function - Google Patents

Abstract

PURPOSE:To replace a probe card easily, rapidly and accurately, by making it possible to draw out a moving plate having the probe card arranged thereto from a stocker and replacing the probe card in a drawn-out state. CONSTITUTION:A moving plate 17 is provided at the housing position of a probe card 8 between upper and lower guide rollers 14, 15 so as to be capable of being drawn out while sliding in a horizontal direction, that is, in a lateral direction and drawn out on the rear side of a stocker 12. The card 8 arranged to the drawn-out moving plate 17 is detached and the card 8 of the other kind is arranged to the moving plate 8. After the card 8 is arranged, the moving plate 17 is pushed in the stocker 12. By this method, the replacement of the card 8 can be performed easily, rapidly and accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a probe device with an automatic probe card exchange function.

(Prior Art) A probe device measures the electrical characteristics of each IC chip formed in large numbers on an object to be measured, such as a semiconductor wafer, and eliminates chips determined to be defective before the assembly process, thereby reducing costs. This is a device that contributes to improving productivity and productivity.

In recent years, due to the high integration and diversification of IC chips, the number of low-volume, high-mix production processes has increased, and as a result, the number of operations required by operators has increased significantly. In particular, the probe card must be replaced for each type of IC chip to be measured and for each different arrangement pattern of electrode pads. In this type of probe card replacement means, an operator manually loosens screws and the like at the mounting portion of the probe card, removes the probe card, and then installs a subsequent probe card.

(Problem to be Solved by the Invention) However, in the above-mentioned probe device, the operator manually replaces the probe card every time the type of wafer is replaced, which is contrary to automation in the semiconductor manufacturing process. Of course, there is a limit in terms of positioning accuracy, and it is extremely difficult to improve productivity, yield, quality, etc.

In addition, as automatic exchange of probe cards, JP-A-58-1
No. 96029, JP-A-60-47433, JP-A-61
-15339 and Japanese Patent Laid-Open No. 61-283138, etc., have been proposed, but complete automatic exchange has not yet been put into practical use.

In particular, when automatically replacing probe cards, multiple probe cards of different types are stored in a storage container such as a stocker, but when inspecting wafers of a corresponding type other than those stored, When replacing an old probe card with a new probe card or performing maintenance and inspection of the probe card, it is necessary to remove the probe card from the storage container and store another probe card in its place. At this time, when the operator reaches out to the storage position to carry the probe card in and out, it takes time to set the probe card in the correct position, resulting in poor operability. Furthermore, if the operator carries out the operation of loading and unloading the probe card while the probe device is in operation,
There were problems such as damage to probe cards etc. due to the troublesome loading and unloading operations.

The present invention has been made to address the above-mentioned problems, and provides a probe device with an automatic probe card exchange function that allows the probe cards stored therein to be taken in and out easily, quickly, and accurately.

[Structure of the invention]

(Means for Solving Problem i1) The present invention provides a probe device that selects and mounts a desired probe card from a plurality of probe card storage positions for inspection, in which a movable plate is moved to the storage position of each probe card. The present invention is characterized in that the movable plate is horizontally slidable.

(Function and Effect) By providing a movable plate at the storage position of the probe card and making the movable plate slidable, it is possible to obtain the effect that the stored probe card can be taken in and out easily, quickly and accurately. .

(Embodiment) Next, an embodiment of the probe device with a probe card automatic exchange function of the present invention will be described with reference to the drawings.

The configuration of this device is mainly composed of a prober section 0) and a probe card exchange section (2).

As shown in FIG. 1, the prober section (G) places, for example, 25 objects to be inspected, such as semiconductor wafers (A), in a vertical line in a cassette (2) at predetermined intervals in the thickness direction.

The cassette (3) containing the wafers) is carried into the cassette storage section. The wafers (wafers) are taken out one by one from this storage section and transported to the preliminary positioning stage (2).

Rotate this preliminary positioning stage ■ to place the wafer (A).
After preliminary positioning to an accuracy of about 1° based on the orientation flat of , the wafer (2) is transferred to inspection stage 0. In order to accurately position the wafer 0) transferred to this inspection stage 0.

A pattern recognition mechanism using a CCD camera or a recognition mechanism using a laser is installed. After accurately positioning the wafer (A) based on the pattern using this recognition mechanism, the insert ring installed above inspection stage 0 is
With the probe card (8) attached to the probe card (8), touch each probe needle (9) of the probe card (6) on each electrode pad of the wafer (A) with contact overdrive, and then touch the probe card (8) above each electrode pad. The test head (10) installed on the wafer automatically measures and inspects the electrical characteristics of the wafer. When performing the measurement and inspection process on semiconductor wafers () using the prober section (2) with such a continuous automatic measurement function, it is necessary to use the electrode pad pattern of each type of semiconductor wafer (A), since the pattern of the electrode pads differs depending on the type of semiconductor wafer (A). It is necessary to replace the probe card (8) with a compatible probe card (8). Next, the probe card automatic exchange section (2) will be explained.

This automatic exchange part (2) is provided in the rotary base of a test head (10) used for testing high frequency characteristics. The probe card (2) is positioned in advance and mounted, for example, screwed, on the probe card holder (11). The probe cards (1) integrated with the holder (11) are stored in a stocker (12), which is a storage container capable of storing, for example, six types of probe cards in a column with appropriate intervals in the board thickness direction. This stocker (12) is configured so that each of the stored probe cards (8) can be independently slid and pulled out in a horizontal direction, that is, in a lateral direction. That is, as shown in FIGS. 2 and 3, upper and lower guide rollers ( 14) (15) are arranged at regular intervals, and the upper and lower guide rollers (14) (
A side guide roller (16) is disposed between the upper and lower guide rollers (14) and (15), and under the guidance regulating action of the side guide roller (16), the movable plate (17) is disposed between the upper and lower guide rollers (14) and (15). ) is provided so that it can be slid and pulled out in the horizontal direction, that is, in the lateral direction. Furthermore, if the drawer side of the movable plate (17) is the rear side of the stocker (12), the front side of the stocker (12) is open and the movable plate (17)
A stopper (18) is provided on at least one front side of the stocker (12) so as to come into contact with the bracket (13) when the movable plate (17) is slid horizontally by a predetermined amount and pulled out. It is permanently installed. This stopper (18) restricts the movement plate (17) from being pulled out. Similarly, when the movable plate (17) is pushed horizontally to the rear side of the movable plate (17), the movable plate (17)
In order to prevent overfilling, a stopper (19) is fixedly provided so as to abut against the bracket (13). Furthermore, a plurality of support pins (20) are erected at predetermined positions on the upper surface of the movable plate (17), and a plurality of support pins (20) are provided on the upper surface of the movable plate (17) to guide the probe card (1) or the probe card holder (11). The hole (21) is inserted into the support pin (20
), the probe card (1) can be reliably positioned on the movable plate (17) and supported in a removable manner.

In addition, in order to prevent this installation from having an adverse effect on the probe needles 0) provided on the probe card, the movable plate (17) is placed at a predetermined position, that is, a position facing the probe needle 0 array. is provided with, for example, a circular opening (22). A pullout mechanism such as a movable plate (17) on which probe cards (1) as described above are installed is provided corresponding to each probe card (2) stored in the stocker (12). A transport mechanism (23) is provided for selectively transporting the probe card (c) stored in such a stocker (12) together with the holder (11) to the insert ring (2), which is the probe card installation position of the prober unit (0). ing. As shown in FIGS. 4 and 5, this transport mechanism (23) is a telescoping arm (24) in which a number of links are connected in an X-shape with pivot pins, and a disc-shaped tip is attached to the tip. A probe card mounting plate (25) is attached. The arm (24) is engaged with a telescopic drive motor, a vertical drive motor, and a rotary drive motor (not shown), respectively, so that the arm (24) can extend and contract, move vertically, and rotate through θ. As described above,
a stocker (12) containing a probe card (8);
From the transport mechanism (23) that transports the probe card (8) from this stocker (12) to the probe card automatic exchange section
is configured.

Next, the operation of the probe device will be explained.

The prober section (2) recognizes the ID code of the semiconductor wafer () stored in the cassette (2), performs preliminary alignment, and transports it to the inspection stage 0.

At this point, align accurately and move the wafer (A) to the position facing the probe card (8) by performing a predetermined operation.
a. Next, the electrode pads of the IC chips formed on the wafer (wafer) and the probe card (8
) is connected to the probe needle (9), and in this connected state, the electrical characteristics of the IC chip are tested using a tester (not shown). After repeating the above-mentioned inspection and completing the inspection on the wafer of the relevant type, the probe card is replaced with a probe card (3) corresponding to the next type of wafer. Next, such a probe card automatic exchange operation will be explained.

First, the wafer (a) is identified by the ID code of the recognized wafer that is programmed in advance into the memory mechanism of the probe device CPU.
The probe card ■ corresponding to the wafer type is automatically selected based on the type information of the wafer type, and the probe card mounting plate (2) is automatically selected.
5) extends the arm (24) so as to insert it into the underside of the selected probe card (8) stored in the card storage stocker (12), and then the vertical drive motor (not shown)
is driven and raised, and the probe card 0 is placed on the probe card placement plate (25). Then, the probe card (8) is placed on a probe card alignment mechanism (not shown) and aligned.

After completing the alignment, place the probe card ■ again and drive the rotation motor (not shown) to rotate it 90 degrees.
Extend the arm (24) to transport the probe card (8) to the bottom of the insert ring (■) provided on the bottom of the test head (10) of the probe device, and then drive the vertical motor (not shown) to raise it. Then, touch the probe card (c) and insert ring ■. After that, the probe card (8) and the insert ring (2) are fixed by the probe card fixing mechanism.

As mentioned above, it is possible to automatically exchange the various probe cards (8) stored in the stocker (12), but it is possible to automatically replace the various types of probe cards (8) that are not stored in the stocker (12). If it is desired to inspect a corresponding type of wafer (a), it is necessary to replace the probe card (2) stored in the stocker (12) with a probe card (b) of another type in advance. In this exchange, a predetermined probe card (2) of the six types of probe cards 0 stored in the stocker (12), for example, is pulled out to the rear side of the stocker (12) by the movable plate (17) on which the probe card 0 is installed. At this time, the moving plate (17) is moved by the stopper (18).
), the withdrawal limit is regulated, so it is possible to prevent the probe card (c) from being adversely affected by excessive withdrawal. Next, the probe card (2) installed on this drawer moving plate (17) is removed, and a probe card (8) of another type is installed on this moving plate (17). At this time,
Insert the guide hole (21) provided in the probe card ■ or the holder (11) into the support pin (20) provided in the moving plate (17), and then insert the probe card (C).
Accurate positioning. After installing the probe card (2) as described above, the moving plate (17) is pushed into the stocker (12).

At this time, the movable plate (17) is regulated by the stopper (19), so that it is accurately installed at a predetermined position within the stocker (12).

Such an operation can be performed by the operator as a supplementary operation as appropriate even during a test operation using the prober.

As mentioned above, in the stocker in which the probe cards are stored, the movable plate on which the probe cards are installed can be pulled out from the stocker, and by replacing the probe cards in this pulled out state, it is possible to easily and quickly and accurately replace the probe cards. can be replaced, and furthermore,
Since the exchanging operation is not troublesome, there is no adverse effect such as vibration on the probe device, and the exchanging operation can be easily performed even during wafer inspection or automatic probe card exchange.

This invention is not limited to the above embodiments. For example, a stocker that stores multiple types of probe cards,
Slide the stocker upwards and remove it from the predetermined installation position, replace each probe card stored in this removed state as desired, and then install the stocker again from above at the predetermined position. Also good. This makes it possible to automatically exchange probe cards7. Also, the movable plate on which the probe card is installed may be slid laterally, and the movable plate provided in the stocker may be
It is not necessary to provide one for all types.

Furthermore, as shown in FIG. 6, there are engaging means (26a) and (26b) that engage with each other when the movable plate (17) is pulled out.
are provided at the rear end of the movable plate (17) and at the bottom defining the space, it becomes possible to reliably lock the movable plate (17) in the drawn-out position. In this example, the spring (27
) is pressed against the moving plate from below by a roll (26a
) and the engagement groove (26b) provided at the rear end of the moving plate (17).
Although the engaging means is constituted by the engaging means, such engaging means can be changed arbitrarily.

When replacing the probe card stored in the stocker in the above embodiment, an example was explained in which the probe card is pulled out horizontally and replaced. However, when replacing the probe card automatically, the storage shelf of the probe card selected to be replaced is pulled out and the probe card is replaced. The card may be configured to be easy to take out.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a probe device for explaining one embodiment of the present invention, FIGS. 2 and 3 are illustrations of the configuration of the stocker in FIG. 1, and FIGS. FIG. 6, which is a diagram for explaining automatic probe card exchange, is a diagram showing another example of FIG. 1. 1... Prober section 2... Probe card automatic exchange section 8... Probe card 9... Probe needle 12...
・Stocker 13...Mounting bracket 17・
...Moving plate 20...Support pin patent applicant
Tokyo Electron Ltd. Figure 1 Figure 2 /18 Figure 4 Figure 5

Claims (1)

[Claims] In a probe device that selects and attaches a desired probe card from a plurality of probe card storage positions for inspection, a movable plate is provided at the storage position of each probe card, and this movable plate can be slid horizontally. A probe device with an automatic probe card exchange function.