JPH0732175B2 - Probe device with automatic probe card exchange function - Google Patents

Description

TECHNICAL FIELD The present invention relates to a probe device with a probe card automatic exchange function.

[Conventional technology]

The probe device measures the electrical characteristics of each IC chip formed in large numbers on the object to be measured, for example, a semiconductor wafer, and eliminates the chips determined to be defective before the assembly process, thereby reducing costs and improving productivity. Is a device for contributing to.

In recent years, due to the high integration of IC chips and the increase in the number of products, the number of small-lot production of many products has increased, and the number of operations by operators has increased greatly. In particular, the probe card needs to be replaced for each type of measurement symmetrical IC chip and each time the arrangement pattern of the electrode pads is different. In such probe card exchanging means, an operator manually loosens a screw or the like on the probe card attaching portion to remove the probe card, and then attaches another probe card.

[Problems to be Solved by the Invention]

However, in the probe apparatus as described above, the operator artificially replaces the probe card every time the type of wafer is replaced, which of course conflicts with the automation in the semiconductor manufacturing process. However, it is extremely difficult to improve productivity, yield and quality.

Also, as an automatic method for replacing a probe card, Japanese Patent Laid-Open No. 58-19
6029, JP-A-60-47433, JP-A-61-15339
Although methods such as those disclosed in Japanese Patent Laid-Open No. 61-283138 and Japanese Patent Laid-Open No. 61-283138 have been proposed, a completely automatic exchange has not been put into practical use.

In particular, when automatically replacing the probe card, a plurality of different types of probe cards are stored in a storage container such as a stocker, but when inspecting wafers of a type other than this storage, When replacing an old probe card with a new probe card, or when performing a supplementary inspection of a probe card, it is necessary to take out the probe card from the storage container and store the other probe card at that position. At this time, when the operator extends the probe card to the storage position and carries out the loading / unloading operation, it takes time to set the probe card in the correct position and the operability is poor. Furthermore, when the operator carries out the loading / unloading operation of the probe card during the operation of the probe,
Since the loading and unloading operation is troublesome, there was a problem such as damage to the probe card.

The present invention has been made in consideration of the above points, and provides a probe device with a probe card automatic exchange function that allows the stored probe card to be easily inserted and removed quickly and accurately.

[Structure of Invention]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the first aspect of the present invention selects a desired probe card from a position where a plurality of probe cards are housed, mounts it on a probe card holder, and inspects In the probe device described above, a moving means for moving the probe card, which is slidable in the horizontal direction, is provided between the storage device for each probe card and the inspection position.

Further, in the present invention, the opening is provided at a position corresponding to the probe card needle stored in the storage position of the moving means.

Further, according to the present invention, the moving means is provided with a pin for supporting the probe card.

A second aspect of the present invention is a probe apparatus for selecting and mounting a desired probe card from a position where a plurality of probe cards are housed and inspecting the wafer. The probe card corresponding to the wafer type is selected and mounted based on the type information.

[Action]

By providing the movable plate that is slidable at the storage position of the probe card, it is possible to easily and quickly and accurately insert and remove the stored probe card by pulling out the movable plate.

〔Example〕

Next, an embodiment of the probe device with a probe card automatic exchange function of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic front view showing the overall configuration of the probe device of the present invention, FIG. 2 is a plan view of a card storage stocker, and FIG. 3 is a front view thereof. FIG. 4 is a perspective view of the probe device of the present invention, and FIG. 5 is a view showing the structure of a transport mechanism for taking out the probe card from the card storage stocker.

The configuration of this probe device is mainly composed of a prober unit (1) and a probe card exchange unit (2).

As shown in FIG. 1, the prober unit (1) has 25 wafers to be inspected, for example, semiconductor wafers (4) arranged in a row, for example, in the wafer cassette (3) at a predetermined interval in the plate thickness direction.
The wafer cassette (3) accommodating the wafer (4) is loaded into the wafer cassette accommodating portion. Wafers (4) are taken out of the storage unit one by one by a transfer mechanism and transferred to a preliminary positioning stage (5). The preliminary positioning stage (5) is rotated to perform preliminary positioning to an accuracy of about ± 1 ° with reference to the orientation flat of the wafer (4), and then the wafer (4) is transferred to the inspection stage (6). In order to accurately position the wafer (4) transferred to the inspection stage (6), a pattern recognition mechanism using a CCD camera or a recognition mechanism using a laser is installed.
After accurately locating the wafer (4) with the pattern as a reference using this recognition mechanism, the wafer (4) is mounted by the probe card (8) mounted on the insert ring (7) provided above the inspection stage (6). On each electrode pad of 4), each probe needle (9) of the probe card (8) is applied by contact overdrive and touched, and the probe card (8) is touched.
The test head (10) provided above automatically measures and inspects the electrical characteristics of the wafer (4). When the measurement inspection process of the semiconductor wafer (4) is performed by using the prober unit (1) having such a continuous automatic measurement function, the electrode pad pattern is different depending on the type of the semiconductor wafer (4). It is necessary to replace with a probe card (8) corresponding to the type of electrode pad pattern.

Next, the probe card automatic exchange section (2) will be described.

The probe card automatic exchange section (2) is provided in the rotary base of the test head (10) used for inspection of high frequency characteristics. The probe card (8) is adjusted in position in advance and mounted on the probe card holder (11), for example, by screwing. This probe card holder (11)
The probe cards (8) mounted on the card are stored in a card storage stocker (12), which is a storage container capable of storing, for example, six models, in a row at appropriate intervals in the plate thickness direction. The card storage stocker (12) is constructed so that each of the stored probe cards (8) can be independently slid in the horizontal direction, that is, in the lateral direction and pulled out. That is, as shown in FIGS. 2 and 3, corresponding to each probe card (8), the upper and lower guide rollers (13) are attached to the opposing side surfaces of the stocker (12) via the mounting brackets (13). The side guide rollers (16) are disposed between the upper and lower guide rollers (14) and (15) while the side guide rollers (16) are disposed at regular intervals. A movable plate (17) is provided between the upper and lower guide rollers (14) and (15) so as to be slidable in the horizontal direction, that is, the lateral direction so as to be drawn out. Further, when the pull-out side of the moving plate (17) is the rear side of the stocker (12), the front side of the stocker (12) is open and at least the front side of the moving plate (17) with respect to the stocker (12). A stopper (18) is fixedly provided on one side so as to come into contact with the bracket (13) when the moving plate (17) is slid horizontally and pulled out by a predetermined amount. The stopper (18) regulates the withdrawal of the moving plate (17). Similarly, the bracket (13) is also provided on the rear side of the moving plate (17) to prevent the moving plate (17) from being inserted too much when the moving plate (17) is pushed horizontally.
A stopper (19) is fixed so as to come into contact with.

Further, a plurality of support pins (20) are erected at predetermined positions on the upper surface of the moving plate (17), and the probe card (8) or the probe card holder (1
Insert the guide hole (21) provided in (1) into the support pin (2)
The probe card (8) can be inserted into the probe card (8).
Is securely positioned on the moving plate (17) and can be detachably supported.

In addition, this installation prevents the probe needle (9) provided on the probe card (8) from being adversely affected.
For example, a circular opening (22) is provided at a predetermined position of the moving plate (17), that is, a position facing the array of probe needles (9).
An escape consisting of is provided. A drawer mechanism such as the moving plate (17) on which the probe card (8) is installed is provided corresponding to each probe card (8) housed in the stocker (12). A transport mechanism (selectively transports the probe card (8) housed in the stocker (12) together with the probe card holder (11) to the insert ring (7) which is the probe card installation position of the prober unit (1). 23) is provided.

The transport mechanism (23) is, as shown in FIGS. 4 and 5, an expandable arm (24) in which, for example, a large number of links are connected to each other by an X-shaped pivot pin, and a disc-shaped arm is provided at the tip. The probe card mounting plate (25) is attached. The arm (24) is engaged with a telescopic drive motor, a vertical drive motor, and a rotary drive motor (not shown), respectively, so that the arm (24) can be telescopically, vertically moved, and rotated by θ.

As described above, the stocker (12) accommodating the probe card (8) and the transport mechanism (23) for transporting the probe card (8) from the stocker (12) constitute the probe card automatic exchange unit (2). ing.

Next, the operation of the probe device will be described.

In the prober unit (1), the ID code of the semiconductor wafer (4) housed in the cassette (3) is recognized and then transferred to the preliminary positioning stage 5, where preliminary alignment is performed using the orientation flat, and the inspection stage Transport to (6). Here, the wafer (4) is placed at a position facing the probe card (8) by performing a predetermined alignment with a correct alignment. Next, the inspection stage (6) is raised to raise the electrode pad of the IC chip formed on the wafer (4) and the probe needle (9) of the probe card (8).
Are connected, and in this connected state, the electric characteristics of each IC chip are inspected by a tester (not shown). When the inspection of all the chips in the wafer is completed, the inspection of the next wafer is executed in the same process. The inspection as described above is repeated for the wafers of the relevant type, and after all the inspections of the wafers (4) of the relevant type are completed, the probe card (8) corresponding to the next type is replaced.

Next, such a probe card automatic exchange operation will be described.

First, the ID code attached to the semiconductor wafer to be inspected is read, and the central processing unit (CP
The probe card (8) of the type corresponding to the wafer type is automatically selected based on the type information of the wafer (4) corresponding to the ID code programmed in the storage mechanism of U).
Next, the moving plate accommodating the probe card is determined based on the information stored in the storage mechanism, and the probe card mounting plate (25) is stored in the card storage stocker (12) and the selected probe card ( 8) Extend the arm (24) so that it is inserted into the lower surface, and then drive a vertical drive motor (not shown) to raise it, and mount the probe card (8) on the probe card mounting plate (25). Place. Then, the probe card (8) is temporarily placed on a probe card alignment mechanism (not shown) for alignment.

After the alignment is completed, the probe card (8) is placed again, the rotation motor (not shown) is driven to rotate 90 degrees, and then the arm (24) is extended to extend the lower surface of the test head (10) of the probe device. The probe card (8) is conveyed to the lower surface of the insert ring (7) provided on the base plate, and then a vertical motor (not shown) is driven to raise the probe card (8) and the insert ring (7). Abut. After that, the probe card (8) and the insert ring (7) are fixed by a probe card fixing mechanism (not shown). Based on this fixing, the probe card and the test head are electrically connected.

As described above, according to the present invention, various probe cards (8) stored in the card storage stocker (12) can be automatically replaced, but the various types of probe cards (8) are stored in the card storage stocker (12). When it is desired to inspect a wafer (4) of a type corresponding to a probe card (8) of a type that is not registered, the probe card (8) stored in the card storage stocker (12) in advance is used for a probe of another type. It is necessary to replace it with the card (8). For this replacement, for example, a predetermined probe card (8) among 6 types of probe cards (8) stored in the card storage stocker (12) is targeted, and a moving plate (17) on which the probe card (8) is installed. ) To the rear of the stocker (12). At this time, the moving plate (17) is restricted in the pulling-out limit by the stopper (18), so that it is possible to prevent the probe card (8) from being adversely affected by pulling out too much. Next, the probe card (8) installed on the drawer moving plate (17) is removed, and another applicable type of probe card (8) is installed on the moving plate (17). At this time, the guide hole (21) provided in the probe card (8) or the holder (11) is inserted into the support pin (20) provided in the moving plate (17), and the probe card (8) Perform accurate positioning. After replacement and installation on the new probe card (8), the moving plate (17) is pushed into the card storage stocker (12). At this time, since the moving plate (17) is regulated by the stopper (19), it is accurately installed at a predetermined position in the card storage stocker (12).

Such an operation can be appropriately executed by the operator as a supplement operation even during the test operation by the prober.

The present invention is not limited to the above embodiment. For example, slide the card storage stocker that stores multiple probe cards together with the card storage stocker upward to remove it from the specified installation position, and replace each probe card stored in this removed state as desired. Then, the card storage stocker may be installed again at a predetermined position from above. This allows automatic replacement of the probe card. Alternatively, the moving plate with the probe card installed may be slid horizontally.
Only one moving plate may be provided in the stocker, and it is not necessary to provide it for all types.

Further, as shown in FIG. 6, when the moving plate (17) is pulled out, the engaging means (26a), (26b) are mutually engaged with each other.
The movable plate (17) can be reliably locked in the pulled-out position by disposing the movable plate (17) at the rear end and the bottom defining the void. In this embodiment, the roll (26a) is pressed against the moving plate from below by the spring (27) and the engaging groove (26b) provided at the rear end of the moving plate (17) constitutes the engaging means. However, the engagement means can be changed arbitrarily.

In the above example, when the probe card stored in the stocker is replaced, the example in which the probe card is pulled out in the horizontal direction to be replaced has been described, but when automatically replacing the probe card, pull out the storage shelf of the selected probe card to be replaced, The card may be taken out easily.

〔The invention's effect〕

According to the probe device of the present invention, in the card storage stocker in which the probe card is stored, the moving means in which the probe card is installed can be pulled out from the stocker, and the probe card is exchanged in this pulled out state, so that it is easy, fast and accurate. Since the probe card can be replaced and the replacement operation is not bothersome, without adversely affecting the probe device such as vibration,
The swapping operation can be easily performed during the inspection of the wafer or the automatic exchange of the probe card.

Further, by providing an opening at a position corresponding to the probe needle of the probe card housed in the moving means, the probe needle corresponding to this opening can be brought into contact with the moving plate even if it is housed in close contact with the moving plate. As a result, it is possible to provide a space-efficient probe device that can store a plurality of probe cards in a small storage stocker without damaging the probe needles.

Further, since the support pins provided on the moving means and the guide holes provided on the probe card are used for guiding the storage of the probe card in the moving means, accurate positioning is possible when the probe card is stored in the storage position. You can
Therefore, it is possible to easily provide accurate positioning of the probe card at the measurement position during transportation to the mounting position, and to provide a probe device with an automatic probe card exchange function that facilitates accurate mounting.

In addition, select the probe card to be mounted by selecting the wafer ID.
Since it is performed based on the quality information of the wafer by the code, the wafer to be inspected and the probe card that comes into contact with it are accurately matched, and the probe needle may be accidentally brought into contact with the wafer not to be inspected, or the measurement result may be misjudged. It is possible to supply a probe device with an automatic probe card exchange function that can avoid the trouble that causes

[Brief description of drawings]

FIG. 1 is a diagram of a probe device for explaining an embodiment of the present invention, FIGS. 2 and 3 are configuration explanatory views of the stocker of FIG. 1, and FIGS. 4 and 5 are of FIG. FIG. 6 is a diagram for explaining the automatic exchange of the probe card, and FIG. 6 is a diagram showing another example of FIG. Explanation of code 1 …… Prober part 2 …… Probe card automatic exchange part 8 …… Probe card, 9 …… Probe needle 12 …… Stocker, 13 …… Mounting bracket 17 …… Movement plate, 20 …… Support pin

Claims (5)

[Claims] 1. A probe apparatus for selecting and mounting a desired probe card from a position where a plurality of probe cards are housed and inspecting the probe card in a horizontal direction between the housed position of each probe card and the inspection position. A probe device with a probe card automatic exchange function, which is provided with a moving means for sliding the probe card. 2. The probe card automatic exchange function according to claim 1, wherein the moving means slides a moving plate having an opening at a position corresponding to the probe needle of the probe card stored in the storage position. With probe device. 3. A probe device with a probe card automatic exchange function according to claim 2, wherein the movable plate has pins for supporting the probe card. 4. A probe device for selecting and mounting a desired probe card from a position where a plurality of probe cards are housed and inspecting the same, according to an ID code of a wafer to be recognized, which is programmed in advance in a storage mechanism of the probe device. A probe device with a probe card automatic exchange function, characterized in that a probe card corresponding to the wafer type is selected from the storage position and mounted based on wafer type information. 5. A probe device with a probe load automatic exchange function according to claim 4, further comprising a moving means for moving the probe card horizontally slidable at a storage position of each probe card.