KR100878211B1 - Probe station, and testing method of wafer using the same - Google Patents

Abstract

The present invention relates to a probe station for inspecting the wafer by contacting the probe card to the wafer seated on the chuck, and between the card holder portion and the card holder portion and the support provided on an upper portion of the support on which the chuck is installed. A holder support part installed on the main body and temporarily seated on the probe holder on which the probe card is seated, a seating member positioned on one side of the main body in a state provided in the holder support part, and on which the probe holder is placed; It includes a chuck drive for moving the position in the state holding the probe holder to the card holder, the main body is further connected to the seating member, characterized in that it further comprises a conveying member sliding relative to the horizontal member.

According to the present invention, a probe holder equipped with a probe card can be automatically carried in and out of a stage part to quickly perform replacement time and replacement work of the probe holder, and minimize the occurrence rate of safety accidents occurring at this time. Can be.

Wafer, Probe Station, Probing, Probe Card, Probe Holder, Test

Description

Probe station, and testing method of wafer using the same}

1 is a perspective view showing a conventional probe station,

Figure 2 is a perspective view of the loader portion provided in the conventional probe station,

3 is a perspective view showing a probe station of the present invention;

4 is a perspective view of a wafer chuck provided in the probe station of the present invention;

5 is an exploded perspective view of a main body and a card holder part provided in the probe station of the present invention;

6 is a plan view of a main body provided in the probe station of the present invention;

7 is a side view of the main body provided in the probe station of the present invention;

8 is a cross-sectional view of part A-A of FIG. 7 provided in the probe station of the present invention;

9A, 9B, and 9C are partial perspective views illustrating an operating state of a holder support provided in the probe station of the present invention.

Explanation of symbols on the main parts of the drawings

100: loader 110: transfer unit

200: stage portion 210: support

211: support member 220: main body

221: guide rail 222: sliding member

223: vertical member 224: horizontal member

225 drive unit 226 transfer member

230: holder support 231: inner member for each time

231-1: My home during the meeting

232: lifting cylinder 232 ': piston rod

233: lifting guide member 233 ': lifting guide projection

234: mounting member 234 ': guide protrusion

240: wafer chuck 250: chuck drive unit

251: first driver 252: second driver

253: holder support pin 300: tester

310: card holder PS: probe station

PH: Probe Holder PC: Probe Card

W: Wafer C: Cassette

The present invention relates to a probe station and a wafer inspection method using the same. More particularly, the present invention relates to a probe station and a wafer inspection method for transferring a probe holder on which a probe card is in contact with a wafer into the probe station. .

In general, a plurality of chips are regularly arranged on a semiconductor wafer. Each of the chips includes a number of electronic elements (e.g., transistors, capacitors, resistors and wirings connecting them) and a plurality of bonding pads for electrically connecting the electronic elements. It is formed through various process steps. In this case, the devices form a physical structure and electrical connection to perform a unique function according to the use of the chip.

For normal operation of these chips, the chips are electrically tested before packaging, ie at the wafer level.

Equipment used for the wafer test includes a tester and a probe station. The tester is a device for checking whether the chips function properly with an electrical input signal, and includes a computer with a predetermined test program, electrical signal source units, and electrical signal sensing. Electrical signal measurement units are provided.

In addition, the probe station is a device for accurately aligning / contacting a probe card having a plurality of probe needles with the chips so that the chips can be electrically tested. To this end, the probe station is equipped with a wafer chuck moving device that can change the position of the probe card, the wafer chuck (wafer chuck) and the wafer chuck in three dimensions.

As shown in FIGS. 1 and 2, a probe station (PS) for testing a wafer includes a loader part 10, a stage part 20, and a tester part. It is largely composed of a part (30).

The loader unit 10 includes a transfer unit 11 therein, and the transfer unit 11 includes an arm for carrying in and out of a plurality of wafers W stored in a cassette C. do. The cassette (C) is located on one side of the transfer unit (11), and the arm is repeatedly carried in and out of the cassette (C) and the stage unit (20) to convey and carry the wafer (W). will be.

In addition, the stage 20 has a chuck on which the wafer W is seated, and is provided with a plurality of probes, and a probe card contacting the wafer W is a probe holder. It is provided in a state seated on).

The tester 30 is positioned above the stage 20 and performs a test of the wafer W in a state in which the wafer W seated on the chuck is in contact with the probe card. To do.

On the other hand, the probe holder is provided with a probe holder of various shapes according to the diameter of the wafer (W), the probe card seated on the probe holder is also provided in various ways depending on the shape of the probe holder. And, the probe holder is provided to have a weight of approximately 20 ~ 30kg, the operator was supplied from the side of the stage 20.

That is, the probe holder should be replaced with another probe holder according to the diameter of the wafer W. In this case, after opening the tester 30 upward, the side cover 21 of the stage 20 is opened. The probe holder was supplied or replaced.

However, due to the weight of the probe holder, there is a problem of causing a safety accident when an operator supplies or replaces the probe holder.

In addition, in recent years, the diameter of the probe holder also increases with the wafer W due to the large diameter of the wafer W. Therefore, it is more difficult to supply or replace the probe holder to the stage unit 20.

An object of the present invention for solving the above problems is to provide a probe station capable of carrying in / out of the probe holder into the probe station without opening the tester unit and the stage unit.

The present invention for achieving the object as described above, the probe station for inspecting the wafer by contacting the probe card to the wafer seated on the chuck, the card holder portion provided on top of the support on which the chuck is installed; A holder support part installed in a main body provided between the card holder part and the support body, the probe holder on which the probe card is seated is temporarily located; A seating member positioned on one side of the main body in a state provided in the holder supporting part and on which the probe holder is placed; And a chuck driver configured to move the position while supporting the probe holder to fix the card holder, wherein the main body is connected to the seating member and slides with respect to the horizontal member. It is characteristic.

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In the probe station of the present invention, the main body further includes a driving unit connected to the transfer member, wherein the seating member is moved in position according to the operation of the driving unit, and the probe holder is supplied into the main body.

In the probe station of the present invention, the holder support portion is installed perpendicular to the corner portion of the main body, the vertical member for supporting the card holder portion; is further provided.

In the probe station of the present invention, the chuck driving unit includes: a first driver positioned below the probe holder supplied into the main body by moving the chuck in the X-axis and Y-axis directions; And a second driver configured to ascend in the Z-axis direction while supporting the probe holder.

On the other hand, the wafer inspection method using the probe station of the present invention, (a) a probe holder with a probe card is temporarily seated on the holder support; (b) moving the probe holder to fix it to a card holder; (c) seating the wafer supplied from the loader unit on the chuck; And (d) lifting the chuck drive unit to contact the wafer with the probe card, wherein step (a) includes (a ') moving the seating member outwardly of the main body to seat the probe holder. The step (a ') includes the step of sliding the seating member along the transfer member according to the operation of the drive unit.

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In the wafer inspection method using the probe station of the present invention, in the step (b), (b ') the chuck driving unit is driven in the X-axis, Y-axis, and Z-axis directions, respectively, to move the probe holder to the card holder. Fixing;

In the wafer inspection method using the probe station of the present invention, the step (b ') includes: firstly moving the chuck driving unit in the X-axis and Y-axis directions and positioned below the probe holder; Supporting the probe holder by first raising the chuck driving unit in the Z-axis direction; Moving the chuck driving unit in the X-axis and Y-axis directions in a second direction to locate the lower portion of the card holder; And fixing the probe holder to the card holder by secondly raising the chuck driving unit in the Z-axis direction.

In the wafer inspection method using the probe station of the present invention, the chuck driving unit, after the probe holder is fixed to the card holder, the step of lowering the wafer is seated on the chuck; And raising the chuck driving unit to contact the wafer with the probe card.

Hereinafter, the configuration and operation of the probe station PS of the present invention will be described with reference to the accompanying drawings.

First, the probe station PS is largely composed of a loader unit 100, a stage unit 200, and a tester unit 300. In addition, the probe station PS is supplied to the stage unit 200 through the transfer unit 110 provided in the loader unit 100 while the wafer W is loaded in the cassette C. The unit 200 contacts the probe card PC provided in the probe holder PH with the wafer W while the wafer W is seated thereon. Then, the tester 300 is to test the wafer (W). Description of the function and operation of the tester 300 for performing the test of the wafer (W) to refer to the prior art, hereinafter the probe holder (a) to the stage 200 provided in the probe station (PS) of the present invention Description will be made focusing on the configuration and operation of supplying PH).

As shown in FIG. 3, the stage part 200 provided in the probe station PS is largely composed of a support 210 and a main body 220, and a holder support 230 in the main body 220. Is further provided. In addition, the tester 300 includes a card holder 310.

The support 210 has a substantially rectangular parallelepiped shape and a plurality of support members 211 are fixed to the bottom side thereof so as to be supported on the bottom surface. In addition, the guide rail 221 is installed in the longitudinal direction on the upper surface of the support 210. In addition, a wafer chuck 240 is disposed above the support 210 in the X-axis direction with respect to the guide rail 221. The wafer chuck 240 is a wafer W is seated, it is a general configuration provided in the probe station (PS). Therefore, detailed description of the wafer chuck 240 will be omitted. However, the wafer chuck 240 is moved not only in the X-axis direction, but also in the Y-axis and Z-axis directions with respect to the support 210.

That is, the wafer chuck 240 has a sliding member 222 of the Y axis crossing the X axis at the lower end thereof, and the sliding member 222 is moved in the Y axis direction with respect to the upper surface of the guide rail 221. do.

In addition, the probe station PS is provided with a chuck driver 250 for driving the wafer chuck 240, as shown in FIG. The chuck driver 250 includes a first driver 251 and a second driver 252, and the first driver 251 moves the wafer chuck 240 in the X and Y axis directions, respectively. The second driver 252 serves to elevate the probe holder PH, which will be described later, in the Z-axis direction.

Although the first driver 251 is schematically illustrated in the drawing, the guide rails 221 and the sliding member 222 described above according to the operation of the first driver 251 in the X-axis and Y-axis directions. The wafer chuck 240 is moved. The wafer chuck 240 is provided with four holder support pins 253 on its outer circumferential surface. The holder support pin 253 is positioned to have the same radius at the center of the wafer chuck 240 and is elevated according to the operation of the second driver 252.

On the other hand, as shown in Figures 5 to 8 attached, the main body 220 is composed of a vertical member 223, a horizontal member 224, a drive unit 225, a transfer member 226 large.

The vertical member 223 is fixed to the lower end of the support 210, respectively, the upper end of the vertical member 223 is to be connected to the card holder unit 310 to be described later. The horizontal member 224 is provided in two. That is, the horizontal member 224 is connected to both ends of the support 210 disposed in the longitudinal direction of the main body 220. The horizontal member 224 has a form facing each other.

In addition, the driving unit 225 is respectively installed at one end of the horizontal member 224, it is provided with a cylinder that is operated by hydraulic or pneumatic. The driving unit 225 is positioned in parallel with the horizontal member 224. In addition, the driving unit 225 may be provided as a motor, and when the driving unit 225 is provided as a motor, it is most preferable that the driving unit 225 includes a timing belt and a pulley.

The transfer member 226 is slid with respect to the horizontal member 224, and is connected to the driving unit 225. That is, according to the operation of the driving unit 225, the transfer member 226 is reciprocated while sliding with respect to the horizontal member 224.

On the other hand, the main body is further provided with a holder support 230. The holder support part 230 serves to bring the probe holder PH into and out of the probe station PS, and the inner member 231, the lifting cylinder 232, and the lifting guide member 233 for a pair of times. ), The seating member 234 is large.

A pair of the inner member 231 is provided with a rectangular flat plate is coupled to the transfer member 226 described above. That is, the inner member 231 is rotated by the area of the transfer member 226 which is coupled to the lower end of the inner member 231 to the transfer member 226 so as to slide reciprocally with respect to the horizontal member 224. It is moved.

In addition, the inner member 231 is provided with an inner groove 231-1 and a lifting guide groove 231-2. The inner inner groove 231-1 is provided in the transverse direction at the upper end of the inner member 231, and the lifting guide groove 231-2 is in the longitudinal direction at one side of the inner member 231. It is provided. Here, the lifting guide groove (231-2) is preferably provided on the left side of the inner groove (231-1).

The lifting cylinder 232 is provided with one or two and is coupled to the inner member 231 in a vertical direction during the rotation. Here, the lifting cylinder 232 is installed so that the piston rod 232 'is located in the downward direction.

The lifting guide member 233 is coupled to the end of the piston rod 232 ', and is provided to have a length in the vertical direction. That is, the lifting guide member 233 is provided to have a length greater than the length of the piston rod 232 'or at least the same length as the piston rod 232'. In addition, the lifting guide member 233 is provided in the same number according to the number of the lifting cylinder 232. Here, the elevating cylinder 232 and the elevating guide member 233 is most preferably provided in two opposite positions.

The seating member 234 serves to substantially support the probe holder PH, which is carried in / out of the probe station PS. The seating member 234 has a shape of "[" when viewed in a plan view, and both ends thereof are respectively connected to the lifting guide member 233 and the inner member 231 during the rotation. In addition, a lower end of the seating member 234 is coupled to the lifting guide member 233 by a hinge, and an upper end of the seating member 234 is provided in the inner member 231 during the turn. It is inserted in 1).

In addition, guides 234 'are provided at both ends of the seating member 234, respectively. The guide protrusion 234 ′ protrudes outward on an upper side of the side edge portion of the seating member 234. The guide protrusion 234 ′ is inserted into the inner groove 231-1 formed in the inner member 231 during the rotation. The lower ends of both ends of the seating member 234 are coupled to the lifting guide member 233 and the hinge. In addition, the lower end portion of the elevating guide member 233 is provided with an elevating guide protrusion 233 'like the guide protrusion 234'. The lifting guide protrusion 233 'is inserted into the lifting guide groove 231-2 provided in the inner member 231 during the rotation.

On the other hand, the probe holder PH is provided to have a ring shape, it is composed of a seating portion and a fastening portion.

The probe holder PH has an inner and an outer circumferential surface having the same radius at the center, and the probe card PC is seated on the upper surface. That is, the seating portion is provided in the form of a groove between the inner circumferential surface and the outer circumferential surface of the probe holder PH, and a plurality of position guide grooves are formed. The location guide grooves are provided in a radial direction from the center of the probe holder (PH) at regular intervals. The location guide groove is inserted into the insertion protrusion provided on the bottom of the probe card (PC) to set the center of the probe card (PC) and the probe holder (PH).

In addition, the fastening part is formed on an outer circumferential surface of the probe holder PH. The fastening part is for fixing the probe holder PH to the card holder part 310 which will be described later, and comprises a fastening groove and a fastening protrusion. The fastening groove and the fastening protrusion are provided at the same distance from the center of the probe holder PH.

When explaining the state of use of the probe station (PS) of the present invention made as described above and the wafer inspection method using the same as follows.

First, a holder accommodating part (not shown) is provided at one side of the probe station PS, and the holder accommodating part accommodates various types of probe holders PH which are provided according to the diameter of the wafer (W). That is, the diameter of the wafer (W) is provided in a large diameter of approximately 200mm to 500mm, recently 700mm, the diameter of the probe card (PC) and the probe holder (PH) also varies according to the diameter of the wafer (W). .

The probe card PC is supplied to the probe station PS using a worker or a transfer device (not shown) using a separate arm in the holder housing. At this time, the holder support 230 provided in the probe station PS is positioned in an initial state as shown in FIG. 8, and the lifting cylinder 232 provided in the holder support 230 is operated to be shown. It is located in the same state as 9a.

That is, when the lifting cylinder 232 is operated, the piston rod 232 'provided in the lifting cylinder 232 gradually rises, and the seating member 234 connected to the piston rod 232' is gradually raised. Ascending, positioned horizontally. Here, when the piston rod 232 'is raised, the elevating guide member 233 coupled to the lower end of the piston rod 232' is raised, the seating member connected to the upper end of the elevating guide member 233 by a hinge 234 is gradually raised. In addition, the elevating guide protrusion 233 ′ provided at the upper end of the elevating guide member 233 is lifted along the elevating guide groove 231-2 provided in the inner member 231 during the rotation, and the seating member 234. Guide protrusion 234 ′ provided at the upper end of the slidably slides along the inner groove 231-1 provided in the inner member 231. Therefore, the seating member 234 is positioned in the shape shown in FIG. 9A.

In this state, the driving unit 225 provided in the main body 220 is operated so that the holder support 230 is transferred outwardly from the main body 220. That is, the driving unit 225 is respectively installed on the horizontal member 224 provided in the main body 220, the driving unit 225 and the transfer member 226 which is reciprocating sliding with respect to the horizontal member 224 and Is connected, the transfer member 226 is connected to the holder support 230. Accordingly, when the driving unit 225 is operated, the transfer member 226 is moved to move the holder support 230 to the outside of the main body 220.

And, as shown in Figure 9b, the probe holder (PH) with a probe card (PC) is temporarily seated on the mounting member 234 provided in the holder support (230). Thereafter, the driving unit 225 is operated again, and as shown in FIG. 9C, the holder supporting unit 230 is transferred into the main body 220.

On the other hand, the chuck driving unit 250 provided in the wafer chuck 240 is operated to be transferred to the lower side of the holder support 230. That is, the first driver 251 of the wafer chuck 240 is operated in the X-axis direction to move the wafer chuck 240 along the guide rail 221. Thereafter, the first driver 251 is operated in the Y-axis direction to move the wafer chuck 240 along the sliding member 222. This operation is for setting the center of the wafer chuck 240 and the center of the probe holder PH to be the same.

Thereafter, the second driver 252 provided in the wafer chuck 240 is operated to raise the holder support pin 253 provided in the wafer chuck 240. The holder support pin 253 raises the probe holder PH while supporting the lower surface of the probe holder PH.

Then, the first driver 251 is operated again. That is, the wafer chuck 240 is moved in the X-axis and Y-axis directions, respectively, so that the probe holder PH is positioned below the tester 300 provided in the probe station PS. That is, the position of the probe holder PH is moved to set the same as the center of the tester 300.

Thereafter, the second driver 252 provided in the wafer chuck 240 is operated again. That is, the second driver 252 is raised to fix the probe holder PH to the card holder 310 provided in the tester 300. At this time, the fastening part provided in the probe holder PH is fixed to the card holder part 310.

When the probe holder PH is fastened to the card holder 310, the wafer chuck 240 is lowered. That is, the second driver 252 is operated so that the wafer chuck 240 is lowered, and the loader unit 100 probes the wafers W stored in the cassette C one by one while such an operation is implemented. It is fed into the station PS.

When the wafer W transferred into the probe station PS is seated on an upper surface of the wafer chuck 240, the chuck driving part 250 provided in the wafer chuck 240 is raised. That is, the second driver 252 provided in the chuck driver 250 is operated to raise the wafer (W). At this time, the wafer (W) is in contact with the probe provided on the probe card (PC) to perform the test of the wafer (W).

When the test of the wafer W is completed, the transfer unit 110 accommodates the wafer W on which the inspection is completed, in a cassette C, and a wafer in a test standby state stored in the cassette C ( W) is repeatedly supplied into the probe station PS.

In addition, according to the diameter of the wafer (W) holder holder 230 to replace the corresponding probe holder (PH).

According to the probe station of the present invention and the wafer inspection method using the same, the probe holder equipped with the probe card can be carried in and out of the stage part automatically, and the replacement of the probe holder can be performed quickly.

In addition, since the holder support portion can be transferred outward from the main body, the operator can easily supply the probe holder to the holder support portion manually or automatically. Therefore, it is possible to reduce or minimize safety accidents generated during supply and replacement of the probe holder.

In addition, since the mounting member provided in the holder support can be positioned vertically when not in use, it is not necessary to expand the area of the probe station equipment or to provide a space of a separate holder support.

Claims (12)

In the probe station for inspecting the wafer by contacting the probe card to the wafer seated on the chuck, A card holder portion provided on an upper portion of the support on which the chuck is installed; A holder support part installed in a main body provided between the card holder part and the support body, the probe holder on which the probe card is seated is temporarily located; A seating member positioned on one side of the main body in a state provided in the holder supporting part and on which the probe holder is placed; Horizontal members connected to both ends of the support and disposed in the longitudinal direction of the main body; And And a chuck driving unit fixed to the card holder by moving the position while supporting the probe holder. The main body, And a transfer member connected to the seating member and sliding with respect to the horizontal member. delete delete The method of claim 1, The main body, Further comprising a drive unit connected to the transfer member, The mounting member is moved according to the operation of the drive unit, the probe holder characterized in that the probe holder is supplied into the main body. The method of claim 4, wherein The holder support portion, The probe station further comprises a vertical member installed perpendicular to the corner of the main body, the vertical member for supporting the card holder. The method of claim 1, The chuck drive unit, A first driver to position the chuck in the X and Y axis directions to be positioned below the probe holder supplied into the main body; And And a second driver configured to ascend in the Z axis direction while supporting the probe holder. (a) temporarily seating the probe holder with a probe card on the holder support; (b) moving the probe holder to fix it to a card holder; (c) seating the wafer supplied from the loader unit on the chuck; And (d) lifting the chuck drive to contact the wafer with the probe card; In step (a), (a ') positioning the probe holder by moving a seating member in an outward direction of the main body; and the step (a') includes sliding the seating member along a transfer member according to an operation of a driving unit; Wafer inspection method using the probe station, characterized in that. delete delete The method of claim 7, wherein In step (b), (b ') the chuck driving unit is driven in the X-axis, Y-axis, and Z-axis directions to fix the probe holder to the card holder, respectively. The method of claim 10, Step (b '), Firstly moving the chuck driving unit in the X-axis and Y-axis directions and positioned below the probe holder; Supporting the probe holder by first raising the chuck driving unit in the Z-axis direction; Moving the chuck driving unit in the X-axis and Y-axis directions in a second direction to locate the lower portion of the card holder; And And fixing the probe holder to the card holder by secondly raising the chuck driver in the Z-axis direction. The method according to claim 7 or 11, wherein The chuck drive unit, The probe holder is fixed to the card holder, and then lowered to seat the wafer on the chuck; Raising the chuck drive unit to contact the wafer with the probe card; Wafer inspection method using the probe station comprising a.

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