KR102096906B1 - Automatic test machine for burn-in board - Google Patents

Abstract

The present invention relates to an automatic test machine for a burn-in board (B) for full automation of burn-in board (B) testing. The machine includes: a base (12); a seating portion (40) where the test-purpose burn-in board (B) is seated; a loading unit (30) loading a test-purpose semiconductor chip (D); an X-axis unit (200); a Y-axis unit (210); a Z-axis unit; a pickup position alignment unit (60); and a control unit. The seating portion (40) is provided with a seating plate (46) having an upper surface, on which the burn-in board (B) is seated, and installed so as to be slidably withdrawable. A plurality of seating protrusions (47) are installed on the upper surface of the seating plate (46). The seating protrusion (47) is smaller in diameter than a heat dissipation hole (HH) formed in a bottom surface (BS) when the bottom surface (BS) is coupled to a lower surface of the burn-in board (B). Therefore, both a burn-in board (B) having a lower surface to which the bottom surface (BS) is coupled and a burn-in board (B) having a lower surface to which the bottom surface (BS) is not coupled are seated at the same height onto the upper surface of the seating plate (46).

Description

Automatic test machine for burn-in board

The present invention relates to a burn-in board (B) inspection device, in particular, the burn-in board (B) inspection process is performed automatically, the burn-in board (B) automatic inspection device.

The burn-in board B is typically used to burn-in a packaged semiconductor chip (device). On the upper surface of the burn-in board B, a plurality of sockets on which semiconductor chips are tested are installed side by side.

However, as the burn-in board (B) is repeatedly used, the contact may be contaminated and various foreign substances may be caught, so cleaning is necessary. In addition, the newly manufactured burn-in board B itself needs to be tested to see if the performance is normal.

The test of the burn-in board B consists of a resistance value and various other electric conduction tests to determine whether the semiconductor chip operates normally when the semiconductor chip is mounted on the sockets installed on the upper surface of the burn-in board B.

Conventionally, in order to test the burn-in board B, the test is performed by manually inserting the semiconductor chip D for testing into the socket manually. However, this process is also subject to considerable worker fatigue, and it may take a considerable amount of time and effort because a situation in which the test must be repeatedly performed may occur due to the chaos of the test sequence.

Registered Patent Publication No. 10-1249011 (Announcement date: 2013.04.02.)

Accordingly, the present invention can be performed automatically for all sockets installed in the burn-in board (B) performance test, which was conventionally performed manually, and burn-in by automatically opening the socket with a constant force during the performance test process. It is intended to provide a burn-in board (B) automatic test device capable of performing a performance test for each burn-in board (B) having sockets of various sizes as one test device without any damage to the board (B).

The burn-in board (B) automatic test apparatus according to the present invention for achieving this purpose is installed on the base 12 and the base 12, has a certain area, and burn-in board (B) for semiconductor device testing on the upper surface A test for determining whether the performance of the socket is normal to one of a plurality of sockets that are installed on the upper surface of the burn-in board (B), which is spaced apart from the upper part of the seating part 40 and the seating part 40 The loading unit 30 for loading the semiconductor chip D for use, the X-axis unit 200 for changing the loading unit 30 in the width direction of the seating unit 40, and the loading unit 30 for the seating The Y-axis unit 210 that changes in the horizontal depth direction of the unit 40, the Z-axis unit that changes the loading unit 30 in the vertical direction, and the loading unit 30 pick up the semiconductor chip at a preset position. It consists of an alignment unit 60 for aligning the pick-up position of the semiconductor chip, and a control unit for controlling the X-axis unit 200, the Y-axis unit 210, the Z-axis unit and the loading unit 30.

The seating portion 40 is provided with a seating plate 46 on which the burn-in board B is mounted on the upper surface and is removably installed in a sliding manner, and a plurality of seating projections 47 are provided on the upper surface of the seating plate 46. Is installed, the seating projection 47 is formed by a smaller diameter than the heat dissipation hole (HH) formed in the bottom plate (BS) when the bottom plate (BS) is coupled to the bottom surface of the burn-in board (B), the bottom plate ( It is characterized in that the burn-in board (B) to which the BS) is coupled and the burn-in board (B) to which the bottom plate (BS) is not coupled to the bottom surface are all landed on the upper surface of the seating plate 46 at the same height.

Here, preferably, the upper surface of the seating plate 46 is formed with a plurality of projection grooves into which seating projections 47 are inserted in the longitudinal and transverse directions, so that the heat dissipation holes HH formed in the bottom plate BS are formed. It is possible to change the installation number and position of the projection grooves to correspond to various numbers and positions.

In this case, the seating projection 47 preferably has a magnetic body built in, and the seating projection 47 is magnetically coupled when coupled to the projection groove.

In addition, the seating projection 47 is preferably an upper portion is inserted into the elastic tube 472, the shock is mitigated when the inner peripheral surface of the heat dissipation hole (HH) and the outer peripheral surface of the seating projection 47 are contacted.

At this time, since the upper portion of the seating protrusion 47 is inserted into the elastic tube 472, preferably, the upper end of the elastic tube 472 protrudes further than the upper surface of the seating protrusion 47, and the seating protrusion 47 and When the bottom of the burn-in board (B) is in contact, the bottom of the burn-in board (B) is protected by the cushioning action of the elastic tube (472).

On the other hand, the alignment unit 60 preferably comprises an alignment block 61 with a waiting pocket disposed before loading the test semiconductor chip D to the loading unit 30, and the test semiconductor chip D. When the size is changed, it is made of a gauge that changes the size of the standby pocket corresponding to the size of the changed semiconductor chip.

Here, the gauge is preferably an X-axis gauge 62 for adjusting the size of the standby pocket in the X-axis direction, in which the X-axis unit 200 is variable, and a direction in which the Y-axis unit 210 is variable. It consists of a Y-axis gauge (63) for adjusting the size of the atmospheric pocket in the Y-axis direction.

And, the seating portion 40 is preferably provided with a shock absorber comprising a shock absorber installed at the front end and the rear end of the section in which the seating plate 46 slides.

On the other hand, the control unit is preferably composed of a power supply mechanism and a calculation module and a storage module built into the base 12, a monitor 51 installed outside the base 12, a command input module and an emergency control panel, and the calculation module Performs a performance test by sequentially inserting and then testing semiconductor chips D in a plurality of sockets arranged on an upper surface of the burn-in board B according to a preset order, and performing a performance test on the storage module. Performance measurement results are stored in each performance test order, and the performance measurement results are displayed on the monitor 51, and the arrangement of each socket mark arranged on the monitor 51 is mounted on the seating plate 46 for testing. It matches the arrangement of the actual sockets placed on the burn-in board (B).

The burn-in board (B) automatic inspection device according to the present invention can be performed automatically for all sockets installed in the burn-in board (B) performance test, which was conventionally performed manually, can be performed automatically in the performance test process. There is no damage to the burn-in board (B) by automatically opening the socket by force, and it is possible to perform a performance test for each burn-in board (B) having sockets of various sizes with one test device.

1 is a perspective view showing an embodiment of an automatic inspection device according to the present invention,
Figure 2a is a front view of Figure 1,
Figure 2b is a picture of an automatic inspection device according to the embodiment of Figure 1,
Figure 3a is a view showing an embodiment of the seating portion 40,
Figure 3b is a view showing Figure 3a from a different angle,
Figure 3c is a picture of the seating portion 40 according to Figure 3a,
Figure 3d is a perspective view of the bottom cover of the burn-in board (B),
3E is an enlarged perspective view of the seating projection 47,
Figure 3f is a photograph of the clamp for fixing the burn-in board (B),
Figure 3g is a photograph showing the shock absorber,
4 is a front view of the X-axis unit 200,
5 is a front view and a top view of the X-axis unit 200,
6 is a bottom plan view and a side view of the Y-axis unit 210,
Figure 7a is a side view of a Z-axis unit,
Figure 7b is an internal front view of the Z-axis unit,
Figure 7c is a plan view showing the operating state of the Z-axis unit in order,
Figure 7d is a photograph of the Z-axis unit,
8A is a perspective view of the loading unit 30,
8B and 8C are front views showing the operation of the loading unit 30 in order,
8D is a perspective view showing the opener 34 and the loading unit 30 separated,
9A to 9E are control screens displayed on the monitor 51,

The specific structure or functional descriptions presented in the embodiments of the present invention are exemplified for the purpose of describing the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention may be implemented in various forms. In addition, it should not be construed as being limited to the embodiments described herein, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Burn-in board (B) automatic inspection device according to the present invention, as shown in Figure 1 base 12, seating portion 40, loading unit 30, X-axis unit 200, and Y-axis It includes a unit 210, a Z-axis unit 220, 230, an alignment unit 60, and a control unit.

The base 12 has a seating portion 40, a loading portion 30, an X-axis unit 200, a Y-axis unit 210, a Z-axis unit, as shown in FIGS. 1 to 2B, It is a structure that supports the lower portion of all components such as the alignment unit 60. In FIG. 1, it is manufactured in a housing shape, but there is no particular limitation on the shape. In addition, the control unit is installed inside the base 12, so that the calculation means and the power supply mechanism can be prevented from occupying an unnecessary space. Here, as shown in FIG. 1, the base 12 may be a lower configuration of a case forming an entire skeleton in which each configuration is embedded. At this time, since the upper skeleton is a box shape, it will be referred to as a box frame 11.

Briefly explaining the configuration of the embodiment shown in FIGS. 1 to 2B, the burn-in board B manufactured for testing a semiconductor chip is mounted on the seat 40. At this time, the seating portion 40 is provided with a tray in the form of a plate having an area similar to the burn-in board B. The tray is made to be able to be pulled out in a sliding manner similar to the drawer shape.

The loading unit 30 loads a semiconductor chip (D) for testing a burn-in board (B) (hereinafter referred to as a " semiconductor chip ") into a socket installed on the burn-in board B mounted on the seat 40. It is a configuration.

The plurality of sockets installed on the burn-in board (B) is installed side by side in a horizontal and vertical direction, and the loading section 30 is not manufactured as many as the number of sockets, but only one is installed. do. Here, the configuration for moving the loading unit 30 is an X-axis unit 200, a Y-axis unit 210, and a Z-axis unit.

The X-axis unit 200, the Y-axis unit 210, and the Z-axis unit are configured as a robot mechanism that moves the loading unit 30 three-dimensionally by operating at the same time.

The configuration that enables each of the X-axis unit 200, the Y-axis unit 210, and the Z-axis unit to be variable can be any hydraulic or pneumatic method, or any other known means such as a motor method.

And in the embodiment shown in Figures 1 to 2b, as shown in Figure 2a, the Z-axis unit changes the loading section 30 up and down, and the X-axis unit 200 is the Z-axis unit and loading section 30 , And the Y-axis unit 210 is configured to vary the X-axis unit 200 and the Z-axis units 220 and 230 and the loading unit 30 in the depth direction together. However, the X-axis unit 200 may be configured to vary the Y-axis unit 210 and the Z-axis unit and the loading unit 30 together.

In the embodiment shown in FIG. 4, the X-axis unit 200 includes an X-axis servo motor, an X-axis guide 202, an X-axis ball screw 203, an X-axis limit sensor 204, and an X-axis coupling. 205 and X-axis unit support plate 206. In this embodiment, by adopting a servo motor and a ball screw, movement in the X-axis direction is precisely controlled, and excessive movement in one direction is prevented due to the action of the X-axis limit sensor 204.

Since the basic configuration of the Y-axis unit 210 is the same as that of the X-axis unit 200, it will be omitted.

The Z-axis units 220 and 230 are composed of two units as described later. The two units constituting the Z-axis unit are the first Z-axis unit 220 and the second Z-axis unit 230, respectively. The configuration of the first Z-axis unit 220 is the same as the X-axis or Y-axis unit 210, Z-axis servo motor 221, Z-axis guide 222, Z-axis ball screw 223, Z It consists of an axis limit sensor 224, a Z axis coupling 225 and a Z axis unit support plate 226. The second Z-axis unit 230 for operating the loading unit 30 on which the direct opener 34 is mounted will be described in detail later.

Since the configuration of FIGS. 1 to 2B has been briefly described above, the structure of each component and the organic relationship between the components will be described in detail below.

The burn-in board B is mounted on the upper surface of the seating plate 46. Therefore, when the upper surface of the seating plate 46 and the bottom surface of the burn-in board B make contact with each other, scratches may occur due to friction between each other, and in particular, heat is smoothly released through the bottom surface of the burn-in board B. It can be disturbed.

Therefore, a plurality of seating projections 47 that are spaced apart from the bottom surface of the burn-in board B and the upper surface of the seating plate 46 are installed on the upper surface of the seating plate 46 as shown in FIG. 3C.

However, since the burn-in board (B) test is often performed after the cleaning or repair of the burn-in board (B) or after the repair, the heat dissipation hole (HH) shown in FIG. 3D is formed on the bottom of the burn-in board (B). In some cases, the bottom plate (BS) may be combined or removed.

Therefore, the seating projection 47 is disposed at a position where the top of the seating projection 47 passes through the heat dissipation hole HH formed in the bottom plate BS and directly contacts the bottom surface of the burn-in board B, as shown in FIG. 3D. do. However, depending on the type of the burn-in board (B), the position of the heat dissipation hole (HH) formed in the bottom plate (BS) may also be different. In this case, the seating protrusion 47 may be disposed only in the position of the heat dissipation hole (HH) in the case of any burn-in board B, but in the other type of burn-in board B, the heat dissipation hole (HH) of the bottom plate BS Since the position is also different, the seating projection 47 may be disposed at a position other than the heat dissipation hole HH, so that the height of the burn-in board B may be increased.

If the height of the burn-in board (B) is changed, it is necessary to change the range of motion of the set Z-axis unit again. Rescue is required.

Therefore, in the present invention, as shown in Figure 3e, the seating projection 47 has a detachable structure. The seating projection 47 has a magnetic body (not shown) built in to be detachable. However, even if the magnetic material (not shown) is built in and detachable, the position of the seating protrusion 47 may not be fixed securely by only magnetic coupling. Therefore, a plurality of detachable grooves 462 into which the seating protrusions 47 can be inserted are formed on the upper surface of the seating plate 46.

When the seating protrusion 47 is inserted into the detachable groove 462, the position of the seating protrusion 47 can be fixed due to the detachable groove 462, but is also more stable because it is magnetically coupled to the detachable groove 462 due to the magnetic material. Position can be fixed. Therefore, in the present invention, the request that the seating protrusion 47 should be able to move as needed, and the contradictory request that it should be fixed securely while being moved quickly and simply, due to the magnetic coupling with the detachable groove 462 It is achieved perfectly.

And when the top of the seating projection 47 is in contact with the bottom surface of the burn-in board B, it should be prevented that damage to the bottom of the burn-in board B, the seating projection 47 is the upper portion as shown in Figure 3e Is inserted into the elastic tube 472, in particular, the upper end of the elastic tube 472 is coupled to protrude more upwards than the upper surface of the seating projection 47, so that the bottom of the burn-in board (B) due to the upper end of the elastic tube 472 The phenomenon that damage is applied is prevented.

In addition, the elastic tube 472 is a heat dissipation hole due to the contact of the seating protrusion 47 on the inner circumferential surface of the heat dissipation hole (HH) in the process of passing through the heat dissipation hole (HH) formed on the bottom plate (BS). HH) Inner damage can also be prevented.

On the other hand, as shown in FIGS. 3A and 3C, an alignment unit 60 is installed on the front surface of the seating unit 40. The alignment unit 60 is configured to wait for the test semiconductor chip D to be loaded into the loading unit 30 as shown in FIG. 3A.

Since the size of the semiconductor chip varies, the size of the socket installed on the burn-in board B for the burn-in test of the semiconductor chip must be varied correspondingly. And when the loading unit 30, which will be described later, attempts to pick up the semiconductor chip D for testing and move it toward the burn-in board B, even if the position of the burn-in board B is settled at the correct position, it is used for the test to be picked up. If the position of the semiconductor chip (D) is in the wrong place, there is no choice but to follow the set path, and the loading part (30) and each robot unit of the X, Y, and Z axes are located in the wrong place rather than the point where the burn-in board (B) is placed. ).

However, if this requires that a separate alignment unit 60 must be manufactured for each type according to the size of the semiconductor chip D, the manufacturing cost of the device is inevitably increased. Therefore, in the present invention, the alignment unit 60 is provided with alignment means to enable alignment of various types of semiconductor chips D even with one alignment unit 60.

Specifically, referring to FIG. 3A, the alignment unit 60 includes an alignment block 61 in which an alignment pocket is disposed before the test semiconductor chip D is loaded in the loading unit 30, and the semiconductor chip for testing D ) Is made of a gauge that changes the size of the alignment pocket to correspond to the size of the changed semiconductor chip D when the size is changed.

At this time, the gauge is an X-axis gauge 62 for adjusting the size of the alignment pocket in the X-axis direction, in which the X-axis unit 200 is variable, and an alignment pocket in the Y-axis direction, which is the direction in which the Y-axis unit 210 is variable. It consists of a Y-axis gauge 63 to adjust the size of.

In this case, the alignment block 61 is formed with a pocket on which the semiconductor chip for test D is seated, and the precise pick-up position adjustment of the semiconductor chip for test D within the pocket is controlled by the X-axis gauge 62 and the Y-axis gauge. (63). In addition, if there is a semiconductor chip for test D that is subsequently required, the standby block 64 is installed on the right side of the alignment block 61 and a similar pocket is formed in the standby block 64 so that it can be held in advance. Chip D can be idle.

On the other hand, the seating portion 40 is provided with a shock absorber consisting of a front shock absorber 44 installed at the front end of a section in which the seating plate 46 slides and a rear shock absorber 43 installed at the rear end. The front shock absorber 44 and the rear shock absorber 43 are respectively installed to prevent a stop shock and a shock at the time of withdrawal when the burn-in board B is seated on the seating plate 46 and are moved to the test position by sliding operation. .

In addition, the control unit includes a power mechanism built in the base 12, a calculation module (not shown) and a storage module (not shown), a monitor 51 installed outside the base 12, a keyboard 52, and a mouse 53 It consists of a command input module and an emergency control panel 54, the operation module (not shown) is sequentially tested in a plurality of sockets (not shown) arranged on the burn-in board (B) according to a preset order. The performance test is performed by inserting and then picking up the semiconductor chip D for use, and the performance measurement results are stored in the storage module (not shown) in the performance test order as shown in FIG. 9E for each socket where the performance test is performed. .

At this time, the result of the performance measurement is displayed on the monitor 51, but the arrangement of each socket display arranged on the monitor 51 is of the actual socket placed on the burn-in board B which is mounted on the seating plate 46 and tested. Can be set to match the array. 9A to 9E, a state in which the control process of the operation module is displayed by the monitor 51 is expressed.

Hereinafter, the configuration and operation of the mechanisms for testing the performance of the burn-in board B while moving for each socket of the burn-in board B through the interaction of the second Z-axis unit and the loading unit 30 will be described.

As shown in Figure 7b, the loading unit 30 is equipped with an opener 34 that opens the center of the socket by pressing the upper edge of the socket installed on the burn-in board B. The Z-axis units 220 and 230 are composed of a first Z-axis unit 220 for elevating the loading unit 30 and a second Z-axis unit 230 for elevating a semiconductor chip for testing D as described above. .

The second Z-axis unit 230 is installed on the first Z-axis unit 220, and when the first Z-axis unit 220 is elevated, the second Z-axis unit 230 is also elevated. The second Z-axis unit 230 serves to elevate the semiconductor chip adsorption mechanism 237 installed under the second Z-axis unit 230.

That is, the first Z-axis unit 220 lifts the opener 34 to open the socket, and the second Z-axis unit 230 opens a socket (not shown) to the opener 34 to test semiconductor chips ( D) It acts to load or pick up.

The opening of the socket (not shown) and the loading of the test semiconductor chip D may be performed simultaneously in time, but since they are distinct operations that are clearly separated, they are located in only one position when both opening and loading are performed with one instrument. If it is wrong, there is a risk of damage to the test semiconductor chip (D) or the socket (not shown) itself, and before the latch (not shown) of the socket is opened, the test semiconductor chip (D) is dropped and loaded. Failure to do so can lead to problems in which the test procedure has to be done from scratch. In the present invention, this problem is solved by configuring the first Z-axis unit 220 and the second Z-axis unit so that two separate mechanisms, in which the socket opening and loading are separated from each other, can work together.

The opener 34 is formed of an opener body 341 and a plurality of jigs 342 formed under the opener body 341 to press the socket rim as shown in FIG. 8A. In addition, a hollow through which the lower end of the second Z-axis unit can pass is formed at the center of the opener body 341 as illustrated in FIG. 8D, and the semiconductor chip is held at the lower end of the second Z-axis unit, so that the opener 34 is opened. When the socket rim is lowered and pressed against the jig 342, the semiconductor chip penetrates the center of the opener 34 and is mounted inside the socket.

In the present invention, the reason why the hollow is installed at the center of the opener 34 is that the opening of the socket and the loading of the chip, which should work independently of each other but must be interlocked and performed almost simultaneously, should be performed in a situation where the centers are precisely aligned with each other. This is to solve the problem.

In addition, the adsorption mechanism 237 is installed at the bottom of the second Z-axis unit 230, passes through the hollow formed in the center of the opener 34, and the bottom of the second Z-axis unit 230 is tested for a semiconductor into the socket at a constant height. The chip D is freely dropped to mount the test semiconductor chip D inside the socket, and the test semiconductor chip D is adsorbed and picked up from the inside of the tested socket.

Here, the loading unit 30 includes a loading block 33 and a loading block 33 for fixing the posture of the opener 34 such that the jig 342 of the opener 34 faces downward, as shown in FIG. 8C. It includes a connection guide connected to the lower end of the first Z-axis unit 220. The connection guide consists of a compression spring 31 and a guide rod 32, which will be described later.

The loading block 33 is formed with an opener 34 groove into which the body of the opener 34 is inserted at the center of the bottom surface. As shown in FIG. 8D, the opening of the opener 34 is formed in such a way that the front and rear of the opening 34 is opened from the front to the rear of the loading block 33, and both sides of the opening of the opening 34 have a lower opening body. It is formed to extend inward toward the center of the opener 34 so as to contact the rim bottom surface of 341.

Therefore, the opener 34 can be inserted into the front of the opener 34 groove, and the opener 34 can be mounted without being dropped while being inserted into the opener 34 groove by being caught in a portion formed to extend inward.

And the connection guide for connecting the loading block 33 and the first Z-axis unit 220, once as shown in FIG. 8A, only one of the lower surface of the first Z-axis unit 220 or the upper surface of the loading block 33 This fixed and the other end is made of a guide rod 32 which is a free end, and a compression spring 31 whose upper and lower ends are fixed to the lower surface of the first Z-axis unit 220 and the upper surface of the loading block 33, respectively. The spring 31 is installed in a form surrounding the guide rod 32.

At this time, a groove in which the free end can be inserted is formed on the bottom surface of the first Z-axis unit 220 or the top surface of the loading block 33.

As a result of the configuration of the guide rod 32 and the compression spring 31 as described above, the jig protruding from the bottom surface of the opener 34 set under the loading block 33 where the first Z-axis unit 220 descends and descends together. After the lower end of the 342 contacts the socket rim, the force that the first Z-axis unit 220 descends is converted into the elastic force of the compression spring 31.

Because one end of the guide rod 32 is a free end, the free end is formed with a groove that can be inserted into the bottom surface of the first Z-axis unit 220 or the upper surface of the loading block 33, and the jig ( Even if the 342) descends to the socket surface and is in contact, while the free end is inserted into the groove, the descending force of the first Z-axis unit 220 is not transmitted to the socket as it is, and the compression spring 31 is compressed while the first Z This is because the gap between the lower portion of the shaft unit 220 and the upper portion of the loading block 33 is only reduced.

In the present invention, by configuring as described above, first, when the socket is opened, it can be opened with a uniform force. The reason why uniform force is important is that the socket of the burn-in board B is not manufactured to a uniform level to a fine level.

If the height difference between the sockets remains to open the socket only by the descending force of the first Z-axis unit 220, some of the sockets may be damaged or another socket may not be opened and the semiconductor chip for testing (D) may fall.

Second, when a mismatch between the X-axis unit 200 and the Y-axis unit 210 moving point setting and the socket location of the burn-in board B occurs, the opener is used as the descending force of the first Z-axis unit 220 ( If 34) presses the burn-in board B, damage that may occur to the burn-in board B is prevented.

Meanwhile, the opener 34 is provided with a plurality of openers 34 having different jig 342 intervals to correspond to various sizes of the semiconductor chip D for testing as shown in FIG. 8D. Here, the replacement of any one opener 34 with an opener 34 having a different standard is made by inserting or withdrawing through the front of the groove of the opener 34. At this time, the opener 34 is formed in the groove of the opener 34 so that it can be mounted inside the groove of the opener 34, so that a separate configuration for suspending the opener 34 is unnecessary.

At this time, as shown in FIG. 8B, the opener 34 may fall out of the opener 34 groove only when it is inserted into the opener 34 groove. Therefore, in the present invention, a variable locking pin 36 is installed on the front of the loading block 33 to open or block the front of the opener 34 groove while sliding up and down, and the opener 34 inserted into the opener 34 groove is provided. ) Position can be fixed and aligned.

In addition, a finger hole 361 is formed on the variable locking pin 36 so as to be variable by hanging a finger on the variable locking pin 36.

Here, the variable locking pin 36 is assembled with a horizontal arm connecting the pin arm 382 and the pin arm 382, which are partially inserted into the loading block 33, as shown in FIG. The arm 382, the horizontal arm and the locking pin are integrally variable.

At this time, the pin arm 382 is inserted or withdrawn from the loading block 33 similarly to the guide rod 32 described above. Therefore, a groove on which the pin arm 382 is inserted or withdrawn is formed on the upper surface of the loading block 33. A tension spring 37 is installed in the groove formed in the loading block 33 and the pin arm 382 is inserted, and the tension spring 37 is a tension spring 37 when the pin arm 382 is overdrawn. Is inserted back into the groove formed in the loading block 33 to return the original position. Accordingly, when the finger is released from the finger hole 361 in the state where the variable locking pin 36 is open, the variable locking pin 36 immediately returns to a position to block the front of the opening 34 groove.

By configuring as described above, when the locking pin is placed on the finger hole 361 by lifting a finger upward, the groove of the opener 34 is opened to easily replace the opener 34, and after the replacement of the opener 34, the finger hole 361 When the finger is pulled out, the locking pin blocks the groove of the opener 34 by the action of the tension spring 37, so that the opener 34 is stably engaged inside the groove of the opener 34 and aligned to the correct position.

In addition, as shown in FIGS. 8A to 8D, an elevation groove corresponding to a trajectory of the pin arm 382 is formed at a portion where the groove of the opener 34 is formed in front of the loading block 33. The lifting groove is formed in front of the groove of the opener 34 to form a part of the upper surface of the loading block 33 from the top of the groove of the opener 34. Accordingly, the opener 34 can be stably positioned inside the groove of the opener 34.

On the other hand, the second Z-axis unit 230 is vertically along the lifting rail 234 and the lifting rail 234, the length of which is fixedly installed in the vertical direction to the first Z-axis unit 220 as shown in Figure 7b The variable plate 232 that is variable, the rack gear 2321 installed or formed on the variable plate 232, the pinion gear 233 rotatably installed on the first Z-axis unit 220, and the first A second Z-axis servo motor 231 that is fixedly installed on the Z-axis unit 220 and rotates the pinion gear 233, and a vertical moving bar 236 fixedly installed on the variable plate 232 and lifted together, It consists of a semiconductor chip adsorption mechanism 237 coupled to the bottom of the vertical moving bar 236.

Here, the rack gear 2321 is formed on the side of the variable plate 232, the pinion gear 233 is disposed on the same plane as the variable plate 232 and is operated in engagement with the rack gear 2321.

At this time, the portion corresponding to the main variable body of the second Z-axis unit 230 is formed of a plate-shaped variable plate 232, and the rack gear 2321 is formed on the side surface of the variable plate 232, so that the second Z The space occupied by the entire shaft unit 230 may be minimized.

By constructing in this way, the present invention opens the socket with a uniform force in loading the test semiconductor chip (D) into the burn-in board (B) socket, so that loading is made without damaging the socket, and separate vertical axis units interlocked with each other. As the opening and loading are performed, alignment is performed at the correct loading position, so that the test process of the burn-in board B, which was conventionally performed manually, is accurately and stably implemented in a fully automatic manner.

The present invention described above is not limited by the above-described embodiments and accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the present invention without departing from the technical spirit of the present invention. It will be obvious to those who have the knowledge of.

B: Burn-in board D: Semiconductor chip
BS: Bottom plate HH: Heat dissipation hole
10: case 11: box frame
12: base 30: loading unit
31: compression spring 32: guide rod
33: loading block 34: opener
35: opener groove 36: variable locking pin
37: tension spring 38: horizontal arm
40: seating portion 41: lever
42: side clamp 43: rear shock absorber
44: front shock absorber 45: cable conveyor
46: seating plate 47: seating projection
48: withdrawal guide rail 49: seat plate handle
50: control unit 51: monitor
52: keyboard 53: mouse
54: emergency control panel 60: alignment unit
61: alignment block 62: X-axis gauge
63: Y-axis gauge 64: standby block
200: X-axis unit 201: X-axis servo motor
202: X-axis guide 203: X-axis ball screw
204: X-axis limit sensor 205: X-axis coupling
206: X-axis unit support plate 210: Y-axis unit
211: Y-axis servo motor 202: Y-axis guide
213: Y-axis ball screw 214: Y-axis limit sensor
215: Y-axis coupling 220: 1st Z-axis unit
221: Z-axis servo motor 222: Z-axis guide
223: Z-axis ball screw 224: Z-axis limit sensor
225: Z-axis coupling 226: Z-axis unit support plate
227: main lift plate 230: second Z-axis unit
231: Second Z-axis servo motor 232: Variable plate
233: pinion gear 234: lifting rail
235: second Z-axis limit sensor 236: vertical movement bar
237: semiconductor chip adsorption mechanism 341: opener body
342: jig 361: finger hole
382: pin arm 462: ?? home
471: projection body 472: elastic tube
473: center projection 2321: rack gear

Claims (9)

A base 12;
A mounting portion 40 installed on the base 12, having a certain area, and having a burn-in board B for semiconductor device testing mounted on the upper surface;
It is installed to be spaced apart from the upper portion of the seating portion 40, and loads a semiconductor chip (D) for testing to determine whether the performance of the socket is normal to any one of a plurality of sockets disposed on the burn-in board (B). Part 30;
An X-axis unit 200 for varying the loading portion 30 in the width direction of the seating portion 40;
A Y-axis unit 210 for varying the loading portion 30 in the horizontal depth direction of the seating portion 40;
A Z-axis unit for varying the loading section 30 in the vertical direction;
An alignment unit 60 for aligning the pickup position of the semiconductor chip so that the loading unit 30 can pick up the semiconductor chip at a preset position; And,
Consists of a control unit for controlling the X-axis unit 200, Y-axis unit 210, Z-axis unit and loading unit 30,
The seating portion 40 is provided with a seating plate 46 on which the burn-in board B is mounted on the upper surface and is removably installed in a sliding manner, and a plurality of seating projections 47 are provided on the upper surface of the seating plate 46. Is installed, the seating projection 47 is formed by a smaller diameter than the heat dissipation hole (HH) formed in the bottom plate (BS) when the bottom plate (BS) is coupled to the bottom surface of the burn-in board (B),
The burn-in board B with the bottom plate BS coupled to the bottom surface and the burn-in board B with the bottom plate BS not coupled to the bottom surface all landed on the upper surface of the seating plate 46 at the same height,
The alignment unit 60 includes an alignment block 61 in which an alignment pocket is disposed before the test semiconductor chip D is loaded in the loading unit 30,
When the size of the semiconductor chip for testing (D) is changed, it is made of a gauge that changes the size of the alignment pocket to correspond to the size of the changed semiconductor chip,
The gauge includes an X-axis gauge 62 for adjusting the size of the alignment pocket in the X-axis direction, in which the X-axis unit 200 is variable, and a Y-axis direction in which the Y-axis unit 210 is variable. Burn-in board (B) automatic inspection device, characterized in that consisting of a Y-axis gauge (63) for adjusting the size of the alignment pocket. According to claim 1,
The upper surface of the seating plate 46 is formed with a plurality of detachable grooves 462 into which seating projections 47 are inserted in the longitudinal and transverse directions, and the number of heat dissipation holes HH formed in the bottom plate BS Burn-in board (B) automatic inspection device, characterized in that it is possible to change the installation number and position of the removable groove 462 to correspond to a variety of positions. According to claim 2,
The seating projection (47) has a magnetic material built-in, the seating projection (47) is burn-in board (B) automatic inspection device, characterized in that coupled by magnetic force when coupled to the detachable groove (462). According to claim 2,
The seating projection 47 is a burn-in board characterized in that the upper portion of the projection body is inserted into the elastic tube 472 so that the impact is relieved when the inner circumferential surface of the heat dissipation hole (HH) and the outer circumferential surface of the seating projection 47 contact. B) Automatic inspection device. The method of claim 4,
Since the upper portion of the seating protrusion 47 is inserted into the elastic tube 472, the upper end of the elastic tube 472 protrudes upward more than the upper surface of the seating protrusion 47, so that the seating protrusion 47 and the burn-in board B ) Burn-in board (B) automatic inspection device, characterized in that the bottom of the burn-in board (B) is protected by the buffer action of the elastic tube 472 when the bottom contact. delete delete According to claim 1,
Burn-in board (B) automatic inspection device, characterized in that installed in the shock absorber consisting of a shock absorber installed at the front end and the rear end of the seating plate (46) sliding section (40). According to claim 1,
The control unit is composed of a power mechanism built in the base 12, a calculation module and a storage module, a monitor 51 installed outside the base 12, a command input module, and an emergency control panel,
The operation module performs a performance test by sequentially inserting and picking up a semiconductor chip (D) for testing in order to a plurality of sockets arranged on an upper surface of the burn-in board (B) in a predetermined order, and performing a performance test on the storage module. Performance measurement results are stored in the performance test order for each socket
The result of the performance measurement is displayed on the monitor 51, but the arrangement of each socket display arranged on the monitor 51 is placed on the seating plate 46 and placed on the burn-in board B to be tested. Burn-in board (B) automatic inspection device, characterized in that the arrangement of the.

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