200935535 九、發明說明 【發明所屬之技術領域】 本發明係關於使探針電氣 行該被檢査體之電氣特性之檢 尤其是，與測試頭之驅動部分 【先前技術】 Ο 半導體裝置之製造工程時 之各種電氣特性檢査，而在單 路晶片之良否。此種檢査’係 簡稱爲晶圓）載置於載置台’ 積體電路晶片之電極墊與探針 實施。此外’最近’亦在完成 判定到當時爲止所形成之電路 測。 Φ 此種探測裝置，具備：收 設有探針卡之框體所構成檢査 本體之上方位置與退避位置之 的測試頭。測試頭’係以水平 且，與探針卡之電極進行電氣 被檢査晶片（也包含製造途中 查晶片之電氣特性者。 其次，以旋動測試頭爲目 分開配設，其旋轉軸之中心係 接觸被檢査體之電極墊來進 測的探測裝置及探測方法， 相關。 ，藉由完成積體電路晶片後 片化前之狀態判定各積體電 藉由將半導體晶圓（以下， 使載置台上昇，使晶圓上之 卡之例如探測針進行接觸來 積體電路前之階段，實施以 部分之良否爲目的之此種探 容著載置台，由其天花板配 裝置本體；及在該檢査裝置 間旋動於水平旋轉軸之周圍 姿勢位於檢査裝置之上方， 接觸，介由探針卡對基板之 之晶片）提供檢査信號來調 的之絞鏈機構，與裝置本體 位於低於探針卡之上面的位 -4- 200935535 置。所以，因爲測試頭之旋轉半徑相對較長，探針卡之上 面附近之測試頭之前端部的移動軌跡’可謂係大致沿著垂 直方向。然而’隨著晶圓之大口徑化’要求裝置之設置空 間的狹窄化變強，所以，將絞鏈機構配載於裝置本體應較 爲有利。 然而，此種佈局，因爲絞鏈機構與測試頭之距離較短 ，而且，探針卡之上面低於絞鏈機構之旋轉軸，如第8圖 φ 所示，因爲測試頭100之旋轉半徑變短，探針卡101之上 面附近，測試頭100之前端部之移動軌跡之水平方向的移 動量變大。另一方面，探針卡101固定於裝置本體102之 上面之圓形開口部之下側，而位於低於裝置本體1 02之上 面的位置。所以，測試頭100之前端部，進入前述開口部 之中而接觸探針卡101，然而，測試頭100藉由絞鏈機構 103進行旋動時，於前述開口部之中，測試頭1〇〇之前端 部在水平方向移動時，可能與探針卡101之補強構件或開 ❹ 之周緣部發生干涉。絞鏈機構103除了旋動機構以外 ’尙持有昇降機構，即使使測試頭1 〇〇旋動至水平位置， 其後’再使其下降，因爲測試頭i 00以單側獲得旋轉臂 104之支撐，測試頭100之重量會導致旋轉臂104之變形 ’而可能與補強構件等發生干涉，此外，裝置之構造會繁 雜化而導致成本上揚。 專利文獻1所記載之技術，係藉由於裝置本體上垂直 抬筒測試頭並進行9 0。旋轉，而縮小測試頭之旋動空間來 進行測試頭與探針卡之接觸、及性能板之更換的技術。然 -5- 200935535 而’爲了更換裝設於測試頭之執行板（perf0rmance board )’作業者必須利用梯子在高處進行作業’而有不易維修 的問題。 此外，專利文獻2所記載之技術，係旋動測試頭使其 載置於預定之位置後’利用支撐機構實施測試頭位置及傾 斜的微調整技術’然而，並無法解決上述課題。 [專利文獻1]日本特開平8-148534 (段落（0016) ❹ 、第1圖、第2圖） [專利文獻2]日本特開平9-22927 (段落（0048)〜 (0053 )) 【發明內容】 本發明有鑑於上述情形，其目的在提供可將測試頭適 當地裝設於裝置本體之探測裝置及探測方法。 本發明之探測裝置，係將配列著多數被檢査晶片之基 φ 板載置於移動自如之基板載置台，使前述被檢査晶片之電 極墊接觸探針卡之探針來進行被檢査晶片之檢査的探測裝 置，其特徵爲具備：內部具備前述基板載置台，天花板部 配設著探針卡之檢査裝置本體；從該探針卡之上方接近並 電氣接觸前述探針卡之上面，進行信號之授受的測試頭； 使該測試頭，在前述探針卡之上方，於其下面成爲水平之 水平位置與離開前述檢査裝置本體之天花板之退避位置間 ，沿著水平旋轉軸之周圍旋動的旋轉驅動部；配設於前述 旋轉軸，用以保持前述測試頭的保持部；配設於前述檢査 -6 - 200935535 裝置本體，從前述保持部受取前述水平位置之測試頭，使 該測試頭下降至與探針卡進行電氣接觸之位置爲止，而且 ，使該測試頭上昇至前述水平位置爲止並交付給保持部的 昇降支撐機構；以及用以設定將測試頭保持於前述保持部 之保持狀態及解除保持之解除狀態之一方，以從前述保持 部將測試頭受取至前述昇降支撐機構時做爲解除狀態，此 外，以從前述昇降支撐機構將測試頭受取至前述保持部時 做爲保持狀態之保持/解除手段。 前述旋轉驅動部以配設於前述檢査裝置本體，前述旋 轉軸之中心，於前述測試頭電氣接觸於探針卡時，以設定 成高於該測試頭之下面的位置爲佳。 於前述保持部及測試頭之間，以配設著於上下方向導 引測試頭之導引機構爲佳。 以前述保持/解除手段位於測試頭電氣接觸探針卡之 位置時，該測試頭保持於前述保持部之狀態爲佳。 本發明之探測方法，係具備內部配設著移動自如之基 板載置台且天花板部配設著探針卡之檢査裝置本體，將配 列著多數被檢査晶片之基板載置於前述基板載置台，使前 述被檢査晶片之電極墊接觸前述探針卡之探針來進行被檢 査晶片之檢査的探測方法，其特徵爲含有：藉由使測試頭 保持於配設在水平旋轉軸之保持部而於該旋轉軸之周圍進 行旋動，而於前述探針卡之上方，從離開前述檢査裝置本 體之天花板之退避位置至其下面爲水平之水平位置爲止進 行旋動之程；以配設於前述檢査裝置本體之昇降支撐機構 -7- 200935535 支撐前述水平位置之測試頭之工程；其次’解解利 保持部之測試頭之保持，利用前述昇降支撐機構使 下降至該測試頭電氣接觸探針卡之位置爲止之工程 其後，使基板接觸探針卡之探針來進行前述基板之 晶片之檢査的工程。 利用前述昇降支撐機構使測試頭下降之工程， 利用配設於前述保持部與測試頭之間的導引機構進 一邊實施爲佳。 以於利用前述昇降支撐機構使該測試頭下降至 頭電氣接觸探針卡之位置之工程後，實施使其保持 保持部之工程。 本發明，於使探針電氣接觸被檢査體之電極墊 該被檢査體之電氣特性的檢測時，因爲使測試頭從 査裝置本體之天花板的退避位置旋轉至水平姿勢之 止後，藉由配設於檢査裝置本體之昇降支撐機構使 下降，即使測試頭之旋轉半徑較小，該測試頭亦不 置本體側之構件發生干涉，而確實地將測試頭裝設 本體。此外，即使測試頭之旋轉軸高於探針卡之上 試頭與探針卡亦可確實地電氣接觸，而可將旋動驅 載於裝置本體，進行實現裝置之小型化。 【實施方式】 參照第1圖〜第3圖，針對本發明之探測裝置 裝置進行說明。該探測裝置，具備檢査裝置本體之 用前述 測試頭 :以及 被檢査 以一邊 行導引 至測試 於前述 來進行 離開檢 位置爲 測試頭 會與裝 於裝置 面，測 動部配 之探測 探針器 -8 - 200935535 本體1 1、測試頭12、以及裝載部1 3。 探針器本體11，具備構成外裝部之框體20。於該框 體20內，如第2圖所示，配設著：用以載置表面配列著 多數被檢査晶片之被檢査基板之晶圓W的載置台21;及 使該載置台21於X、Y、Z方向移動並於垂直方向軸周圍 旋轉之移動機構22。該圖中，23係X方向移動部，24係 Y方向移動部，25係Z方向移動部。此外’於Z方向移 ^ 動部25，省略了圖示，配設著以拍攝後述探測針26爲目 ❿ 的之攝影機。 於框體20之天花板35，形成有圓形之開口部27，於 其周緣，藉由插入環28之凸緣部29之嵌合而固定著該插 入環28。該插入環28之下緣係內側有水平突出之環狀卡 止面部3 0。 其次，藉由用以保持探針卡31之保持環32之上部之 凸緣與插入環28之前述卡止面部30之卡止’使探針卡 φ 31固定於框體20之天花板35。所以’探針卡31之上面 ，係位於例如比天花板35之上面低3.9cm之高度水準的 位置。於該探針卡31之下面側’形成有例如相對於晶圓 W呈斜向延伸之探針的多數探測針26。此外’探針亦可 以爲垂直針或凸塊。於探針卡31之上面’以環繞電極之 配置區域且與探針卡31爲同心之方式’設置外徑小於探 針卡3 1之外徑的補強材3 3。該補強材3 3係用以抑制探 針卡3 1之變形。 於天花板35之下面側’設置著可於水平方向自由移 -9 - 200935535 動之以拍攝晶圓W表面爲目的之未圖示的攝 該攝影機、及配設於前面所述之z方向移動 示的攝影機，取得晶圓W上之被檢査晶片之 測針2 6之座標位置。 如第1圖及第3圖所示，於天花板35之 (以X方向爲左右方向來進行記載），以受 試頭1 2爲目的，昇降體4 0之前後，例如分別 H 。該昇降體40，可藉由例如氣筒（圖中看不 用驅動機構進行昇降，該實例係以昇降體40 昇降支撐機構。 此外，於天花板3 5之後緣側，配設著具^ 之絞鏈機構42、及使該旋轉軸41進行旋轉之 動部，於從絞鏈機構42朝右側突出之旋轉軸 長度較短之旋轉臂43。該實例，係以絞鏈機構 部構成旋動驅動部，後述之測試頭1 2，係於探 0 上方之平行於水平面的水平位置、及於探針器 後方之例如用以進行測試頭1 2之維修等之退 ’進行旋動。該退避位置之測試頭12，例如 極之下面側朝上之狀態。前述旋轉軸41之旋 定成例如比天花板35之上面高22.5cm之位置 於旋轉臂43之前端部，如第3圖所示， 左右分開朝前方延伸之腕部44、44之平面爲 持體45的後面部。以位於該腕部44、44之間 持之方式’槪略方形之測試頭〗2介由隨著沿辜 影機。藉由 ;25之未圖 電極墊與探 右緣及左緣 取並昇降測 配設著3個 到）之昇降 與氣筒構成 莆旋轉軸4 1 未圖示的驅 41，裝設著 ;42與驅動 針卡31之 本體11之 避位置之間 ，係具備電 轉中心，設 〇 連結著構成 3字形之保 而被左右夾 I1腕部44之 -10- 200935535 長度方向而形成之間隙52獲得保持。此外，第1圖之腕 部44’爲了方便観察則述之昇降體40，以切除下側之— 部分的方式來圖示。 於左右之兩腕部44之內側（測試頭〗2側）的側面， 配設著2組以相對於腕部44之長度方向並列之上下間隔 並列之例如2個導引座51之組，另一方面，以對應於該 2組之導引座51之位置的方式’於測試頭1 2之兩側面， φ 配設著從前述之上側之導引座51之上端，形成爲長於下 側之導引座51之下端且相對於前述導引座51進行滑動嵌 合之2個垂直導引63。所以，藉由該等導引座51及垂直 導引63之滑動作用’測試頭12受到兩腕部44之導引座 51的導引，且藉由前述之昇降體40進行昇降。該等導引 座51與垂直導引63構成導引機構。 於該腕部44、44之長度方向之槪略中央的上部，前 後（Y方向）並列地配設著沿著腕部44使鎖定銷47b進 0 退之鎖定銷進退部47a、及形成兩端部朝測試頭12伸出 之橫剖面形狀爲3字形之溝部的鎖定銷支撐部49。該鎖 定銷支撐部49，具有使鎖定銷4 7b貫通分別形成於前述 兩端部之貫通孔48並支撐的機能。其次，於測試頭12之 側面，以嵌入爲鎖定銷支撐部49之ϋ字部形狀部分所環 繞之溝部的方式配設著縱長之擋止部61，於該擋止部61 ，於分別對應於用以在保持體45與昇降體40之間進行測 試頭12之授受的上位置、及將測試頭12裝設於探針卡 31上之下位置之高度位置，形成上下2個之鎖定銷47b -11 - 200935535 之貫通孔62。所以，鎖定銷支撐部49之貫通孔48 止部61之貫通孔62成爲即後重疊之狀態下，藉由使 銷47b貫通該等貫通孔48、62而成爲鎖定狀態，亦 成爲測試頭12保持於保持體45之狀態，此外，藉由 銷47b從擋止部61退出，而成爲解除其保持之狀態 實例時，係藉由鎖定銷進退部47a、鎖定銷47b、鎖 支撐部49、及擋止部61來構成保持/解除手段46。 ^ 於測試頭1 2之下面側，裝設著以使該測試頭1 2 針卡31進行電氣接觸爲目的之中間環64，該中間環 外徑稍小於探針卡31之外徑，此外，內徑則稍大於 材33之外徑。此外，該中間環64之高度尺寸，設定 於從探針卡31之上面至天花板35之上面爲止之高度 。所以，使該中間環64下降而載置於探針卡31上時 試頭12不會衝擊天花板35。此外’測試頭12上昇 中間環64之下端面與探針卡31之上面的距離，設定 Q 如3.4cm，利用前述之旋轉臂43之測試頭12之旋動 例如，即使因爲該測試頭12之重量而使旋轉臂43變 ，亦不會與補強材3 3等發生干涉，而具有充份之間賴 於測試頭1 2之腕部44側之兩側面的下側，對應 昇降體40之各位置，背面固定於測試頭12’下端面 成從測試頭1 2水平延伸之L字形之座構件6 5 ’隔著 配設著3個。所以’以昇降體40受取座構件65，介 座構件6 5支撐測試頭1 2，於該狀態下使昇降體4 0 時，測試頭12可進行昇降。該測試頭12’介由纜線 與擋 鎖定 即， 鎖定 。本 定銷 與探 64， 補強 成大 尺寸 ，測 時之 成例 中， 形時 i ° 3個 配置 間隔 由該 昇降 連結 -12- 200935535 著測試機（皆未圖示），從該測試機傳送檢査晶® w之 電氣信號。 探針器本體11之右側，連結著裝載部13 ’該裝載部 13之框體71內之深側，藉由區隔壁72區隔成上方區域 73及下方區域74。於該上方區域73，設置著用以載置例 如可收容25片晶圓W之密閉型搬送容器F0UP2的載置 台75。FOUP2之右面之框體71形成闊口部76 ’介由該 φ 開口部76於未圖示之搬送手段與載置台75之間進行 FOUP2之授受。 於框體71之近側區域，配設著旋轉、昇降、及伸縮 自如之搬送臂77，於上方區域73之FOUP2與探針器本 體11之載置台21之間，介由形成於探針器本體11與裝 載部13之間的開口部78，進行晶圓W之授受。 於該探測裝置，如第3圖所示，配設著例如由電腦所 構成之控制部5，該控制部5，具備由程式儲存部、記憶 φ 體、CPU所構成之資料處理部等。儲存於該程式儲存部之 程式，具備：以對天花板3 5上之測試頭1 2實施卸裝爲目 的之步驟群、及以進行晶圓W之搬送及對位等之步驟群 。此外，例如，記憶體具備被寫入移動機構22之移動步 驟、或移動量等之處理參數之値的區域，CPU執行程式之 各命令時，讀取該處理參數，將對應該參數値之控制信號 傳送至該探測裝置之各部位》該程式（包含處理參數之輸 入操作及顯示相關之程式），被儲存於例如軟式磁碟、光 碟、MO(光磁碟）、硬碟等電腦記憶媒體之記憶部6並 -13- 200935535 被安裝至控制部5。 其次’針對本發明之探測方法進行說明。首先，如第 4(a)圖所示，使設定於離開天花板35上方之水平位置 的退避位置且利用保持/解除機構46固定於保持體45之 測試頭12朝下側旋轉。此時，如前面所述，因爲旋轉軸 41之旋轉中心設定成高於天花板35上面之位置，中間環 64及測試頭12之下面所描繪之軌跡，不會與補強材33 0 及插入環28等發生干涉。其次，使測試頭12停止於第4 (b)圖之水平位置。其次，使昇降體40上昇而接觸座構 件65之下面（第1 ( c)圖）。 其次，如第5(a)圖所示，從鎖定銷支撐部49拔出 鎖定銷47b，解除測試頭12之保持，而將測試頭12從保 持部45交付給昇降體40，測試頭12之荷重全部施加於 昇降體40。所以，使該昇降體40下降（第5(b)圖）， 測試頭12之垂直導引63 —邊接受保持體45之導引座51 Q 之導引，一邊使昇降體40下降直到中間環64之下面接觸 探針卡31之上面爲止之位置。其次，將鎖定銷4 7b插入 鎖定銷支撐部49內（第5(c)圖），再度使測試頭12 處於保持狀態。該測試頭1 2之再保持，係爲了防止例如 昇降體40之氣筒之故障等而導致測試頭12之全荷重施加 於探針卡31。第6圖與前述之第2圖相同，係改變視點 重新描繪第4圖、第5圖之圖，第6(a)圖係對應於第5 (a)圖，第6(b)圖係對應於第5(b)圖。 其後，利用未圖示之搬送手段將例如收容著2 5片晶 -14- 200935535 圓W之FOUP2載置於載置台75。其次，利用搬送臂77 從F〇 UP2取出1片晶圓w並載置於探針器本體u內之 載置台21。其次’如前面所述，進行探測針26與晶圓w 之對位，使探測針26接觸形成於該晶圓w上之被檢査晶 片的電極墊（第6(c)圖），從測試頭12，介由中間環 64、探針卡3 1、及探測針26，對該電極墊供應特定之電 氣信號，實施電氣特性之檢査。其後，依序使探測針26 φ 接觸晶圓w上之電極墊，對晶圓W之各晶片進行檢査。 此外’亦可以使探測針26整體接觸晶圓W之各晶片之全 部電極墊的方式。檢査完成後，利用搬送臂77將晶圓W 搬回FOUP2。 其次，例如’於晶圓W之各批次間，更換中間環64 時、或進行測試頭12之維修時等，如第7圖所示，使測 試頭12從天花板35之上方之水平位置旋動至探針器本體 Π之例如1 80°後側之退避位置之維修位置爲止。此外， φ 爲了簡化圖示，第4圖〜第7圖中，省略了部份圖示。此 外’第4圖（b)及（c)、第5(a)圖及第6(a)圖， 爲了容易觀看該圖，將中間環64之下面位置描繪成高於 天花板35之上面之位置，然而，實際上，如前面所述， 中間環64之下面位置會比天花板35之上面位置低5mm 〇 依據上述之實施形態，使探測針26電氣接觸於晶圓 W之電極墊來進行晶圓W之電氣特性的檢測時，以保持 體45保持測試頭12並從離開天花板35之退避位置旋轉 -15- 200935535 至水平姿勢之位置爲止後，將測試頭12從保持體45交付 給配設於探針器本體11之昇降體40並下降，故，即使測 試頭1 2之旋轉半徑較小，該測試頭1 2與探針器本體j】 側之構件’例如與補強材33及插入環28等不會發生干涉 ，而確實地將測試頭12裝設至探針器本體u。此外，即 使測試頭12之旋轉軸41高於探針卡31之上面，亦可以 確實地使測試頭12與探針卡31形成電氣接觸，故可將絞 φ 鏈機構42配載於探針器本體11而實現裝置之小型化。此 外’因爲測試頭12之旋動機構之絞鏈機構42與昇降機構 昇降體40係分開配設’故可簡化裝置之構成而實現低成 本化。 此外’非以旋轉軸4 1單側支撐測試頭1 2，而是藉由 水平支撐之昇降體40’且利用導引座51將垂直導引63 導引至下側’而使探針卡31與中間環64形成接觸，故可 以高精度進行測試頭12之定位。所以，例如，即使前述 φ 之補強材3 3之外徑較大’而中間環64之間隙較小時，亦 可以抑制補強材3 3與中間環6 4或測試頭1 2之干涉。 【圖式簡單說明】 第1圖係本發明之探測裝置之一例的透視圖。 第2圖係上述探測裝置的縱剖面圖。 第3圖係上述探測裝置的平面圖。 第4圖係連結於測試頭之下側之中間環與探針卡形成 接觸時之縱剖面圖。 -16- 200935535 第5圖係連結於測試頭之下側之中間環與探針卡形成 接觸時之縱剖面圖。 第6圖係連結於測試頭之下側之中間環與探針卡形成 接觸時之縱剖面圖。 第7圖係使測試頭旋動至維修位置爲止時之縱剖面圖 〇 第8圖係傳統探測裝置之測試頭位置不當時之側面圖 【主要元件符號說明】 1 1 :探針器本體 1 2 :測試頭 U :裝載部 31 :探針卡 3 3 :補強材 〇 4〇 :昇降體 41 :旋轉軸 42 :絞鏈機構 43 :旋轉臂 45 :保持體 46 :保持/解除機構 51 :導引座 63 :垂直導引 65 :座構件 -17-200935535 IX. INSTRUCTIONS OF THE INVENTION [Technical Field] The present invention relates to the electrical inspection of the probe to electrically conduct the inspection of the object to be inspected, in particular, with the driving portion of the test head [Prior Art] 制造 Manufacturing process of the semiconductor device Various electrical characteristics are checked, and the quality of the single-channel chip is good. This inspection is simply referred to as wafer mounting on the electrode pads and probes of the mounting stage's integrated circuit wafer. In addition, the 'recently' is also completing the circuit test that was formed until then. Φ This type of detecting device includes a test head that is formed by a frame body that houses the probe card and that is positioned above the inspection body and at the retracted position. The test head 'is horizontally and electrically inspected with the electrode of the probe card (also includes the electrical characteristics of the wafer during the manufacturing process. Secondly, the test head is separately arranged for the purpose of the rotary test head, and the center of the rotary axis Contacting the electrode pad of the object to be inspected to detect the detecting device and the detecting method, and determining the state of each integrated body by completing the state of the integrated circuit chip after the chip is formed (hereinafter, the mounting table is enabled) Raising to bring the card on the wafer, for example, to contact the probe to the stage before the integrated circuit, and to carry out the placement of the mounting table for the purpose of partial or not, and the ceiling assembly device body; and the inspection device a hinge mechanism in which a position around a horizontal rotation axis is located above the inspection device, and a contact signal is provided between the probe card and the substrate of the substrate, and the detection mechanism is adjusted to be lower than the probe card. The above bit is -4-200935535. Therefore, because the rotation radius of the test head is relatively long, the movement track of the front end of the test head near the top of the probe card can be described as In the vertical direction, however, 'the larger the diameter of the wafer' requires the narrowing of the installation space of the device, so it is advantageous to mount the hinge mechanism on the device body. However, this layout, Since the distance between the hinge mechanism and the test head is short, and the upper surface of the probe card is lower than the rotation axis of the hinge mechanism, as shown in Fig. 8 φ, since the rotation radius of the test head 100 becomes short, the probe card 101 In the vicinity of the upper surface, the amount of movement in the horizontal direction of the movement trajectory of the front end portion of the test head 100 becomes larger. On the other hand, the probe card 101 is fixed to the lower side of the circular opening portion above the apparatus body 102, and is located below the device. The position above the main body 102. Therefore, the front end of the test head 100 enters the opening portion and contacts the probe card 101. However, when the test head 100 is rotated by the hinge mechanism 103, the opening portion is opened. Among them, when the front end of the test head 1 在 moves in the horizontal direction, it may interfere with the reinforcing member of the probe card 101 or the peripheral portion of the opening. The hinge mechanism 103 has a lifting mechanism other than the rotating mechanism. Even if the test head 1 〇〇 is rotated to the horizontal position, it is 'reduced again' because the test head i 00 is supported by the rotating arm 104 on one side, and the weight of the test head 100 causes the deformation of the rotating arm 104' There may be interference with the reinforcing member or the like, and the structure of the device may be complicated and the cost may increase. The technique described in Patent Document 1 is performed by vertically lifting the test head on the apparatus body and performing 90 rotation. The technique of rotating the head to make contact between the test head and the probe card, and the replacement of the performance board. However -5-200935535 and 'in order to replace the perf0rmance board installed on the test head' Using a ladder to work at a high place' is difficult to maintain. Further, the technique described in Patent Document 2 is a technique for finely adjusting the position and inclination of the test head by the support mechanism after the test head is rotated to be placed at a predetermined position. However, the above problem cannot be solved. [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-148534 (paragraph (0016) 第, FIG. 1 and FIG. 2) [Patent Document 2] Japanese Patent Laid-Open No. 9-22927 (paragraph (0048) to (0053)) The present invention has been made in view of the above circumstances, and an object thereof is to provide a detecting device and a detecting method capable of appropriately mounting a test head to a device body. In the detecting device of the present invention, the base φ plate on which a plurality of inspected wafers are placed is placed on a movable substrate mounting table, and the electrode pads of the inspected wafer are brought into contact with the probe of the probe card to perform inspection of the inspected wafer. The detecting device includes: a substrate mounting table provided therein; and an inspection device body having a probe card disposed on a ceiling portion; and an upper surface of the probe card and electrically contacting the upper surface of the probe card to perform signalling a test head that is received and received; the test head is rotated above the probe card, between a horizontal position below the horizontal position and a retracted position of the ceiling of the inspection apparatus body a driving unit; the rotating shaft is disposed to hold the holding portion of the test head; and is disposed on the apparatus body of the inspection -6 - 200935535, and receives the test head of the horizontal position from the holding portion, and lowers the test head to The position at which the probe card is in electrical contact with the probe card, and the test head is raised to the horizontal position and delivered to the holding portion. And a lift support mechanism; and one of a state in which the test head is held in the holding portion and a release state in which the hold is released, and the release head is removed from the holding portion to the lift support mechanism, and The holding/releasing means is maintained in a holding state when the test head is taken up from the lifting support mechanism to the holding portion. The rotation driving unit is disposed in the inspection apparatus main body, and the center of the rotation shaft is preferably set to be higher than the lower surface of the test head when the test head is electrically contacted with the probe card. Preferably, a guide mechanism for guiding the test head to the upper and lower sides is disposed between the holding portion and the test head. When the holding/releasing means is located at the position where the test head is electrically contacted with the probe card, it is preferable that the test head is held in the state of the holding portion. The detection method of the present invention includes an inspection apparatus main body in which a substrate mounting table that is freely movable and a probe card is disposed in a ceiling portion, and a substrate on which a plurality of inspection wafers are arranged is placed on the substrate mounting table. A method for detecting an inspection of a wafer to be inspected by contacting an electrode pad of the wafer to be inspected with a probe of the probe card, wherein the method comprises: holding the test head in a holding portion disposed on the horizontal rotation axis; Rotating around the rotating shaft, and rotating above the probe card from a retracted position away from the ceiling of the inspection apparatus body to a horizontal horizontal position below the probe card; Lifting and supporting mechanism of the body-7-200935535 The project of supporting the test head of the above horizontal position; secondly, the maintenance of the test head of the retaining portion is performed, and the lifting support mechanism is used to lower the position of the test head to the probe card. After that, the substrate is brought into contact with the probe of the probe card to perform inspection of the wafer of the substrate. It is preferable that the lowering of the test head by the above-described lifting support mechanism is performed by the guide mechanism disposed between the holding portion and the test head. After the test head is lowered to the position where the head is electrically contacted with the probe card by the above-described lifting support mechanism, the work for holding the holding portion is carried out. According to the present invention, when the probe is electrically contacted with the electrode pad of the object to be inspected, the electrical characteristics of the object to be inspected are detected, and the test head is rotated from the retracted position of the ceiling of the device to the horizontal position. The lifting support mechanism provided on the main body of the inspection device is lowered. Even if the rotation radius of the test head is small, the test head does not interfere with the member on the main body side, and the test head is surely mounted on the main body. Further, even if the rotation axis of the test head is higher than the probe card, the test head and the probe card can be surely electrically contacted, and the rotation can be driven on the apparatus body to achieve miniaturization of the apparatus. [Embodiment] A probe device of the present invention will be described with reference to Figs. 1 to 3 . The detecting device includes the above-mentioned test head for inspecting the main body of the apparatus; and the detecting probe device which is inspected to be guided to the test to perform the leaving inspection position for the test head to be mounted on the device surface and the measuring portion -8 - 200935535 The body 1 1. The test head 12 and the loading unit 13 are. The prober body 11 includes a housing 20 that constitutes an exterior portion. In the housing 20, as shown in FIG. 2, a mounting table 21 for placing a wafer W on a surface of a substrate to be inspected on which a plurality of inspected wafers are mounted is disposed; and the mounting table 21 is placed in the X a moving mechanism 22 that moves in the Y and Z directions and rotates around the vertical axis. In the figure, 23 is an X-direction moving part, 24 is a Y-direction moving part, and 25 is a Z-direction moving part. Further, in the Z-direction moving portion 25, the illustration is omitted, and a camera for photographing the probe 26 to be described later is disposed. The circular opening portion 27 is formed in the ceiling 35 of the casing 20, and the insertion ring 28 is fixed to the periphery thereof by fitting of the flange portion 29 of the insertion ring 28. The lower edge of the insertion ring 28 has a ring-shaped engaging face portion 30 which protrudes horizontally on the inner side. Next, the probe card φ 31 is fixed to the ceiling 35 of the casing 20 by the engagement of the flange of the upper portion of the retaining ring 32 of the probe card 31 with the aforementioned locking surface portion 30 of the insertion ring 28. Therefore, the upper surface of the probe card 31 is located at a height level of, for example, 3.9 cm lower than the ceiling 35. A plurality of probe pins 26, for example, probes extending obliquely with respect to the wafer W are formed on the lower side of the probe card 31. In addition, the probe can also be a vertical needle or a bump. On the upper surface of the probe card 31, a reinforcing material 33 having an outer diameter smaller than the outer diameter of the probe card 31 is disposed in a manner surrounding the electrode arrangement area and concentric with the probe card 31. The reinforcing material 3 3 is for suppressing deformation of the probe card 31. The lower side of the ceiling 35 is provided with a camera that can move freely in the horizontal direction -9 - 200935535 to capture the surface of the wafer W, and is attached to the z-direction movement described above. The camera obtains the coordinate position of the stylus 26 of the wafer to be inspected on the wafer W. As shown in Fig. 1 and Fig. 3, in the ceiling 35 (described in the left-right direction in the X direction), for the purpose of the test head 12, for example, H is raised before and after the lifter 40. The lifting body 40 can be lifted and lowered by, for example, a gas cylinder (the driving mechanism is not used in the drawing, and the example is a lifting and lowering support mechanism by the lifting body 40. Further, on the rear edge side of the ceiling 35, a hinge mechanism with a ^ is provided 42. The moving portion for rotating the rotating shaft 41 is a rotating arm 43 having a short rotating shaft extending from the hinge mechanism 42 to the right side. In this example, the twisting mechanism portion constitutes a turning driving portion, which will be described later. The test head 12 is a horizontal position parallel to the horizontal plane above the probe 0, and is rotated behind the probe device, for example, for maintenance of the test head 12, etc. The test head of the retracted position 12, for example, a state in which the lower side of the pole is upward. The rotation shaft 41 is rotated, for example, at a position 22.5 cm higher than the upper surface of the ceiling 35 at the front end of the rotating arm 43, as shown in Fig. 3, left and right apart toward the front. The plane of the extended wrist portions 44, 44 is the rear portion of the holding body 45. The test head is placed between the wrist portions 44, 44 in a manner of "slightly square". ; 25 of the electrode pad is not connected with the right edge and the left edge The down-test is equipped with three up-and-down lifts and a gas cylinder, and the drive shaft 41 (not shown) is mounted, and 42 is provided with an electric rotation center between the avoidance position of the body 11 of the drive needle card 31. It is assumed that the gap 52 formed by the longitudinal direction of the 10-200935535 which is formed by the left and right clips I1 of the wrist portion 44 is connected and held. Further, the wrist portion 44' of Fig. 1 is shown in a manner to facilitate the inspection of the elevating body 40 as described above. On the side of the inner side of the left and right wrist portions 44 (the side of the test head 2), two sets of, for example, two guide seats 51 arranged side by side with respect to the longitudinal direction of the wrist portion 44 are disposed, and On the one hand, on both sides of the test head 12 in a manner corresponding to the positions of the guides 51 of the two groups, φ is disposed at the upper end of the guide seat 51 from the upper side, and is formed to be longer than the lower side. Two vertical guides 63 that are slidably fitted to the lower end of the guide seat 51 with respect to the aforementioned guide seat 51. Therefore, the test head 12 is guided by the guide seats 51 of the two arms 44 by the sliding action of the guides 51 and the vertical guides 63, and is lifted and lowered by the lifter 40 described above. The guides 51 and the vertical guides 63 constitute a guiding mechanism. In the upper portion of the center of the wrist portions 44 and 44 in the longitudinal direction, the lock pin advancing and retracting portion 47a for retracting the lock pin 47b along the arm portion 44 is disposed in parallel in the front and rear (Y direction), and both ends are formed. The cross-sectional shape that protrudes toward the test head 12 is a lock pin supporting portion 49 of a 3-shaped groove portion. The lock pin supporting portion 49 has a function of supporting the locking pin 47b through the through holes 48 formed at the both end portions. Next, on the side surface of the test head 12, a vertically long stopper portion 61 is disposed so as to be fitted into a groove portion surrounded by the U-shaped portion of the lock pin support portion 49, and the stopper portion 61 corresponds to the stopper portion 61. Two upper and lower locking pins are formed at an upper position for receiving and receiving the test head 12 between the holding body 45 and the lifting body 40, and a height position at which the test head 12 is mounted on the probe card 31. Through hole 62 of 47b -11 - 200935535. Therefore, the through-holes 62 of the locking pin support portion 49 are in a state in which the through-holes 62 of the stoppers 61 are overlapped, and the pin 47b is inserted into the through-holes 48 and 62 to be in a locked state, and the test head 12 is also held. In the state of the holding body 45, in addition, when the pin 47b is withdrawn from the stopper portion 61 and is an example of a state in which the holding is released, the locking pin advancing and retracting portion 47a, the locking pin 47b, the lock supporting portion 49, and the blocking portion are obtained by the locking pin. The stopper 61 constitutes a holding/releasing means 46. ^ On the lower side of the test head 12, an intermediate ring 64 is provided for the purpose of making electrical contact between the test head 12 pin card 31, the outer ring outer diameter being slightly smaller than the outer diameter of the probe card 31, and The inner diameter is slightly larger than the outer diameter of the material 33. Further, the height of the intermediate ring 64 is set to a height from the upper surface of the probe card 31 to the upper surface of the ceiling 35. Therefore, when the intermediate ring 64 is lowered and placed on the probe card 31, the test head 12 does not hit the ceiling 35. In addition, the distance between the lower end surface of the test head 12 rising intermediate ring 64 and the upper surface of the probe card 31 is set to be 3.4 cm, and the rotation of the test head 12 by the aforementioned rotating arm 43 is used, for example, even because of the test head 12 The weight of the rotating arm 43 is changed, and it does not interfere with the reinforcing material 3 3 or the like, and has a lower side corresponding to both sides of the wrist portion 44 side of the test head 12, corresponding to each of the lifting bodies 40. Positioned, the back surface is fixed to the lower end surface of the test head 12' so that the L-shaped seat member 6 5 ' extending horizontally from the test head 12 is disposed three. Therefore, the test head 12 is supported by the lifter 40 by the seat member 65 and the seat member 65. When the lifter 40 is raised in this state, the test head 12 can be raised and lowered. The test head 12' is locked by the cable and the lock, i.e., locked. The fixed pin and the probe 64 are reinforced into a large size. In the case of the measurement time, the shape is i°. The three configuration intervals are transmitted by the test machine (all not shown) from the lift link -12-200935535, and are transmitted from the test machine. Check the electrical signal of Crystal® w. The right side of the probe main body 11 is connected to the deep side of the casing 71 of the loading portion 13', and is partitioned into an upper region 73 and a lower region 74 by the partition wall 72. In the upper region 73, a mounting table 75 for mounting, for example, a sealed transfer container F0UP2 capable of accommodating 25 wafers W is disposed. The frame 71 on the right side of the FOUP 2 forms a wide mouth portion 76', and the FOUP 2 is transferred between the transfer means (not shown) and the mounting table 75 via the φ opening portion 76. In the proximal region of the frame 71, a transfer arm 77 for rotating, lifting, and telescopic is disposed between the FOUP 2 of the upper region 73 and the mounting table 21 of the prober body 11 via the prober. The opening 78 between the main body 11 and the loading unit 13 performs the transfer of the wafer W. As shown in Fig. 3, the detection device is provided with a control unit 5 composed of, for example, a computer. The control unit 5 includes a data storage unit including a program storage unit, a memory unit, and a CPU. The program stored in the program storage unit includes a step group for unloading the test head 1 2 on the ceiling 35, and a step group for performing the transfer and alignment of the wafer W. Further, for example, the memory includes an area in which the moving step of the moving mechanism 22 or the processing parameter of the moving amount or the like is performed, and when the CPU executes each command of the program, the processing parameter is read, and the corresponding parameter is controlled. The signal is transmitted to various parts of the detecting device. The program (including the input operation of the processing parameters and the display related program) is stored in a computer memory medium such as a floppy disk, a compact disk, an MO (optical disk), or a hard disk. The memory unit 6-13-200935535 is attached to the control unit 5. Next, the detection method of the present invention will be described. First, as shown in Fig. 4(a), the test head 12 set to the retracted position at the horizontal position above the ceiling 35 and fixed to the holder 45 by the holding/releasing mechanism 46 is rotated downward. At this time, as described above, since the center of rotation of the rotating shaft 41 is set higher than the position above the ceiling 35, the trajectory depicted by the intermediate ring 64 and the underside of the test head 12 does not match the reinforcing material 33 0 and the insertion ring 28 . Wait for interference. Next, the test head 12 is stopped at the horizontal position of the 4th (b)th map. Next, the elevating body 40 is raised to contact the lower surface of the seat member 65 (Fig. 1 (c)). Next, as shown in Fig. 5(a), the lock pin 47b is pulled out from the lock pin supporting portion 49, the holding of the test head 12 is released, and the test head 12 is delivered from the holding portion 45 to the lifter 40, and the test head 12 is The load is all applied to the lifting body 40. Therefore, the elevating body 40 is lowered (Fig. 5(b)), the vertical guide 63 of the test head 12 is guided by the guide seat 51 Q of the holding body 45, and the elevating body 40 is lowered until the intermediate ring The lower side of 64 contacts the position of the upper side of the probe card 31. Next, the lock pin 47b is inserted into the lock pin support portion 49 (Fig. 5(c)), and the test head 12 is again brought into a holding state. The test head 12 is held again to prevent the full load of the test head 12 from being applied to the probe card 31 in order to prevent malfunction of the air cylinder of the elevating body 40, for example. Fig. 6 is a view similar to Fig. 2, in which the fourth and fifth figures are redrawn, and the sixth (a) figure corresponds to the fifth (a) figure, and the sixth (b) figure corresponds to the figure. In Figure 5(b). Thereafter, for example, FOUP 2 in which 25 pieces of crystal -14 - 200935535 circle W are accommodated is placed on the mounting table 75 by a conveying means (not shown). Next, one wafer w is taken out from F〇 UP2 by the transfer arm 77 and placed on the mounting table 21 in the probe main body u. Next, as described above, the probe pin 26 is aligned with the wafer w so that the probe pin 26 contacts the electrode pad of the wafer to be inspected formed on the wafer w (Fig. 6(c)), from the test head 12, through the intermediate ring 64, the probe card 31, and the probe needle 26, a specific electrical signal is supplied to the electrode pad, and electrical characteristics are checked. Thereafter, the probe pin 26 φ is brought into contact with the electrode pad on the wafer w to inspect each wafer of the wafer W. Furthermore, it is also possible to have the probe needle 26 integrally contact the entire electrode pads of the wafers of the wafer W. After the inspection is completed, the wafer W is moved back to the FOUP 2 by the transfer arm 77. Next, for example, when the intermediate ring 64 is replaced between batches of the wafer W, or when the test head 12 is repaired, as shown in Fig. 7, the test head 12 is rotated from the horizontal position above the ceiling 35. Move to the maintenance position of the probe unit body 例如, for example, the retracted position on the rear side of the 80°. In addition, in order to simplify the illustration, in FIGS. 4 to 7, the partial illustration is omitted. Further, in FIGS. 4(b) and (c), 5(a) and 6(a), in order to easily view the figure, the lower position of the intermediate ring 64 is depicted as being higher than the upper surface of the ceiling 35. However, in fact, as described above, the lower position of the intermediate ring 64 is 5 mm lower than the upper position of the ceiling 35. According to the above embodiment, the probe 26 is electrically contacted with the electrode pad of the wafer W to perform wafer processing. When the electrical characteristics of the W are detected, the test head 12 is held from the holder 45 to the position where the holding head 45 holds the test head 12 and rotates from the retracted position away from the ceiling 35 to the position of the horizontal posture -15-200935535. The lifting body 40 of the prober body 11 is lowered, so that even if the radius of rotation of the test head 12 is small, the test head 12 and the member of the probe body body side are, for example, the reinforcing material 33 and the insertion ring 28 The interference does not occur, but the test head 12 is surely attached to the prober body u. In addition, even if the rotating shaft 41 of the test head 12 is higher than the upper surface of the probe card 31, the test head 12 can be surely brought into electrical contact with the probe card 31, so that the twisted φ chain mechanism 42 can be loaded on the prober. The body 11 realizes miniaturization of the device. Further, since the hinge mechanism 42 of the rotation mechanism of the test head 12 is disposed separately from the elevation mechanism lifting body 40, the configuration of the apparatus can be simplified and the cost can be reduced. In addition, the test head 12 is supported on one side by the rotating shaft 41, but the probe card 31 is guided by the horizontally supported lifting body 40' and the vertical guide 63 is guided to the lower side by the guiding seat 51. The contact with the intermediate ring 64 makes it possible to position the test head 12 with high precision. Therefore, for example, even if the outer diameter of the reinforcing material 3 3 of the above φ is large and the gap of the intermediate ring 64 is small, interference between the reinforcing material 3 3 and the intermediate ring 64 or the test head 12 can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a detecting device of the present invention. Fig. 2 is a longitudinal sectional view of the above detecting device. Figure 3 is a plan view of the above detecting device. Fig. 4 is a longitudinal sectional view showing the intermediate ring attached to the lower side of the test head in contact with the probe card. -16- 200935535 Figure 5 is a longitudinal section of the intermediate ring attached to the underside of the test head in contact with the probe card. Fig. 6 is a longitudinal sectional view showing the intermediate ring attached to the lower side of the test head in contact with the probe card. Figure 7 is a longitudinal sectional view of the test head when it is rotated to the maintenance position. Figure 8 is a side view of the position of the test head of the conventional detecting device. [Main component symbol description] 1 1 : Probe body 1 2 : Test head U : Loading portion 31 : Probe card 3 3 : Reinforcing material 〇 4 〇: Lifting body 41 : Rotary shaft 42 : Stroke mechanism 43 : Rotating arm 45 : Holding body 46 : Holding / releasing mechanism 51 : Guide Block 63: vertical guide 65: seat member -17-