CN103575294B - Silicon micro-gyroscope chip probe card - Google Patents
Silicon micro-gyroscope chip probe card Download PDFInfo
- Publication number
- CN103575294B CN103575294B CN201210263955.7A CN201210263955A CN103575294B CN 103575294 B CN103575294 B CN 103575294B CN 201210263955 A CN201210263955 A CN 201210263955A CN 103575294 B CN103575294 B CN 103575294B
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- Prior art keywords
- probe
- upper cover
- chip
- arc
- hole
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of silicon micro-gyroscope chip probe card.The present invention includes base, upper cover, elastic clamping mechanism and some probes; Described elastic clamping mechanism is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base; The centre of described upper cover is hole, matches with size with the position of elastic clamping mechanism with size in the position in hole; Described probe is the contact type probe that can regulate to, radial three degree of freedom at height, arc; Probe is arranged on and covers, and with radiate, probe tip concentrates near institute's test chip electrode position; Base and upper cover are connected through the hinge; Base there are some limited posts, are above stamped some spacing holes matched with limited post.Use the present invention, complete after first probe location regulates to chip under test, its structure makes probe positioning keep accurately, after this without the need to just can realize by microscope similar chip repeatedly and repeated test, can greatly improve the efficiency criticizing production testing.
Description
Technical field
The invention belongs to aviation technical field of inertial, relate to a kind of silicon micro-gyroscope chip probe card.
Background technology
According to the growth requirement of silicon micro-gyroscope problem, its chip-scale detects and screening can be on the one hand improvement that structural design and technique makes and optimization provides raw data, also can provide qualified gauge outfit chip for circuit joint-trial on the other hand.And the connection of multiple microelectrode and the collection of feeble signal thereof are the basic demands of chip-scale test on silicon micro-gyroscope chip, then to consider batch the workload needed for producing and consistance, the test of chip stage silicon microthrust test and screening are had higher requirement.We adopt probe station to realize the connection of chip electrode at present, but the signals collecting that its limited number of probes cannot meet more than ten electrode on silicon micro-gyroscope chip is connected with shielding, thus have impact on the measuring accuracy of feeble signal; And the accurate contact need of each electrode and probe completes under the microscope, this makes the efficiency of batch detection very low.
Summary of the invention
Technical matters to be solved by this invention is: proposition one can meet silicon micro-gyroscope chip multi-electrode and reliably connect, and can realize the chip-scale test probe card of high-level efficiency fine registration.
Technical scheme of the present invention is: a kind of silicon micro-gyroscope chip probe card, comprises base, upper cover, elastic clamping mechanism and some probes; Described elastic clamping mechanism is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base; The centre of described upper cover is hole, matches with size with the position of elastic clamping mechanism with size in the position in hole; Described probe is the contact type probe that can regulate to, radial three degree of freedom at height, arc; Probe is arranged on and covers, and with radiate, probe tip concentrates near institute's test chip electrode position; Base and upper cover are connected through the hinge; Base there are some limited posts, are above stamped some spacing holes matched with limited post.
The advantage that the present invention has and beneficial effect: use the present invention, after chip under test being completed to the adjustment of first probe location, its structure makes probe positioning keep accurately, after this without the need to just can realize by microscope similar chip repeatedly and repeated test, not only meet the requirement of feeble signal to precision and stability, and coordinate test macro to use the efficiency that can greatly improve batch production testing.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of silicon micro-gyroscope chip probe card of the present invention;
Fig. 2 is the understructure schematic diagram in a kind of embodiment of microthrust test chip probe card of the present invention;
Fig. 3 is the elastic clamping mechanism schematic diagram in a kind of embodiment of microthrust test chip probe card of the present invention;
Fig. 4 is the probe schematic diagram in a kind of embodiment of microthrust test chip probe card of the present invention;
Wherein, 1-base, 2-elastic clamping mechanism, 3-limited post, 4-upper cover, 5-clamp ring, 6-probe, 7-spacing hole, 8-hinge, 9-support column, 10-resilient clamp bar, 11-chip positioning sheet, 12-tweezers clamping hole, 13-tungsten tipped probe, 14-insulating trip, 15-radiai adjustment bar, 16-height adjusting holes, 17-radiai adjustment hole, 18-arc are to adjuster bar, 19-arc to adjustment hole.
Embodiment
Below in conjunction with Figure of description, the specific embodiment of the present invention is described further.
See Fig. 1, Fig. 2, Fig. 3.Silicon micro-gyroscope chip probe card of the present invention, comprises base 1, upper cover 4, elastic clamping mechanism 2 and some probes 6; Described elastic clamping mechanism 2 is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base 1; The centre of described upper cover 4 is hole, matches with size with the position of elastic clamping mechanism with size in the position in hole; Described probe 6 is the contact type probe that can regulate to, radial three degree of freedom at height, arc; Probe 6 is arranged on upper cover 4, and with radiate, probe tip concentrates near institute's test chip electrode position; Base 1 is connected by hinge 8 with upper cover 4; Base 1 has some limited posts 3, upper cover 4 has some spacing holes 7 matched with limited post 3.
See Fig. 3, above-mentioned elastic clamping mechanism 2 comprises chip positioning sheet 11, the resilient clamp bar 10 that two panels is mutually right angle, and wherein a slice chip positioning sheet is with can the tweezers clamping hole 12 of chip placement.
See Fig. 4, above-mentioned probe 6 comprises tungsten tipped probe 13, insulating trip 14, radiai adjustment bar 15, arc to adjuster bar 18; Arc has one to raise up position to adjuster bar 18 stage casing, bottom is fixed on probe upper cover 4 to adjustment hole 19 by screw with arc; Tungsten tipped probe 13 is fixed on the one side of insulating trip 14; Insulating trip 14 another side is fixed on the front end of radiai adjustment bar 15; Having height adjusting holes 16 and radiai adjustment hole 17 before and after radiai adjustment bar 15, is all slideway shape elongated hole; Radiai adjustment bar 15 is fixing to adjuster bar 18 to threaded hole and the arc of adjuster bar 18 boss through radiai adjustment hole 17, arc by screw; Height adjusting holes 16 is equipped with screw, and screw head contacts with the non-crowning in front end of arc to adjuster bar 18.
Above-mentioned upper cover 4 has the clamp ring 5 for the fixing shielding line be connected with probe 6, and have some when being installed chip for supporting the support column 9 of upper cover 4.
As can be seen from Figure 1, base 1 part of this probe primarily of fixed chip and the upper cover 4 part composition of installation probe.Silicon micro-gyroscope chip can be limited to two panels and be mutually between the chip positioning sheet 11 at right angle by the elastic clamping mechanism 2 be fixed on base 1, wherein a slice chip positioning sheet with can the tweezers clamping hole 12 of chip placement, and by the elastic force of resilient clamp bar 10, chip to be completely fixed.Several probes 6 being arranged on upper cover 4 concentrate near chip electrode position at disk diameter to " radial ", and wherein insulating trip 14 can make probe 6 and radiai adjustment bar 15 keep insulating; Probe 6 can be made by adjustment radiai adjustment hole 17 and arc radially to keep appropriate length to the relative position of adjuster bar 18 screwing; Arc can be made by adjustment arc to turn to correct position to adjuster bar 19 to the screw of adjustment hole 19; Probe pinpoint and chip electrode can be made by adjustment height adjusting holes 16 and arc to be in same level to the screw between adjuster bar 18, and reliable contacts; Clamp ring 5 can be used to the fixing shielding line be connected with probe, fixes to keep test signal line position; Two support columns 9 be arranged on upper cover 4 can be played a supporting role to it when opening upper cover 4; Finally, the probe 6 that can realize by being fixed on spacing hole 7 corresponding in limited post 3 on base and upper cover 4 is aimed at the accurate of chip electrode position.
Silicon micro-gyroscope chip is fixed in the elastic clamping mechanism 2 on probe base by the present invention, as shown in Figure 1, Figure 2 and Figure 3, coordinated the relative position of fixed cover 4 and base 1 by limited post 3 and spacing hole 7 after, the probe 6 in upper cover 1 is regulated to make it contact with chip electrode one_to_one corresponding.Concrete operation step is as follows:
1. chip is installed: open probe upper cover 4, silicon micro-gyroscope chip is fixed on the correspondence position of elastic clamping mechanism 2;
2. aim at: upper cover 4 and base 1 are closely fastened by limited post 3 and spacing hole 7, probe location need be regulated, until make each probe 6 and corresponding chip electrode reliable contacts at height, arc on, radial three degree of freedom direction respectively by microscope when first time test;
3. test: according to testing requirement probe 6 corresponding in probe be connected with testing apparatus and complete test;
4. batch detection: after completing steps 2, only need repeat step 1 and step 3 to the chip detection of equivalent constructions.
Claims (5)
1. silicon micro-gyroscope chip probe card, is characterized by: described probe comprises base (1), upper cover (4), elastic clamping mechanism (2) and some probes (6); Described elastic clamping mechanism (2) is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base (1); The centre of described upper cover (4) is hole, matches with size with the position of elastic clamping mechanism with size in the position in hole; Described probe (6) is the contact type probe that can regulate to, radial three degree of freedom at height, arc; Probe (6) is arranged on upper cover (4), and with radiate, probe tip concentrates near institute's test chip electrode position; Base (1) is connected by hinge (8) with upper cover (4); Base (1) has some limited posts (3), upper cover (4) has some spacing holes (7) matched with limited post (3).
2. probe according to claim 1, it is characterized by: described elastic clamping mechanism (2) comprises chip positioning sheet (11), the resilient clamp bar (10) that two panels is mutually right angle, wherein a slice chip positioning sheet is with can the tweezers clamping hole (12) of chip placement.
3. probe according to claim 1, is characterized by: described probe (6) comprises tungsten tipped probe (13), insulating trip (14), radiai adjustment bar (15), arc to adjuster bar (18); Arc has one to raise up position to adjuster bar (18) stage casing, bottom is fixed on probe upper cover (4) to adjustment hole (19) by screw with arc; Tungsten tipped probe (13) is fixed on the one side of insulating trip (14); Insulating trip (14) another side is fixed on the front end of radiai adjustment bar (15); Having height adjusting holes (16) and radiai adjustment hole (17) before and after radiai adjustment bar (15), is all slideway shape elongated hole; Radiai adjustment bar (15) is fixing to threaded hole and the arc of adjuster bar (18) boss to adjuster bar (18) through radiai adjustment hole (17), arc by screw; (16) are equipped with screw to height adjusting holes, and screw head contacts with the non-crowning in front end of arc to adjuster bar (18).
4. probe according to claim 3, is characterized by: described upper cover (4) has the clamp ring (5) for the fixing shielding line be connected with probe (6).
5. the probe according to any one of claim 1 to 4, is characterized by: described upper cover (4) has some when being installed chip for supporting the support column (9) of upper cover (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210263955.7A CN103575294B (en) | 2012-07-27 | 2012-07-27 | Silicon micro-gyroscope chip probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210263955.7A CN103575294B (en) | 2012-07-27 | 2012-07-27 | Silicon micro-gyroscope chip probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103575294A CN103575294A (en) | 2014-02-12 |
| CN103575294B true CN103575294B (en) | 2016-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210263955.7A Active CN103575294B (en) | 2012-07-27 | 2012-07-27 | Silicon micro-gyroscope chip probe card |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111964690B (en) * | 2020-07-15 | 2022-09-20 | 北京自动化控制设备研究所 | Quartz tuning fork gyroscope gauge outfit screening test device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681106A (en) * | 2004-04-09 | 2005-10-12 | 株式会社瑞萨科技 | Manufacturing method of semiconductor integrated circuit device and probe card |
| JP2009060037A (en) * | 2007-09-03 | 2009-03-19 | Tokyo Electron Ltd | Probe device and probe method |
| CN101487709A (en) * | 2009-02-27 | 2009-07-22 | 哈尔滨工程大学 | Micro-miniature inertial measuring unit |
| CN101515016A (en) * | 2008-02-22 | 2009-08-26 | 东京毅力科创株式会社 | Probe apparatus, probing method, and storage medium |
| CN101769944A (en) * | 2009-12-30 | 2010-07-07 | 东莞华中科技大学制造工程研究院 | Micro detection device used for detecting LED chip |
-
2012
- 2012-07-27 CN CN201210263955.7A patent/CN103575294B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681106A (en) * | 2004-04-09 | 2005-10-12 | 株式会社瑞萨科技 | Manufacturing method of semiconductor integrated circuit device and probe card |
| JP2009060037A (en) * | 2007-09-03 | 2009-03-19 | Tokyo Electron Ltd | Probe device and probe method |
| CN101515016A (en) * | 2008-02-22 | 2009-08-26 | 东京毅力科创株式会社 | Probe apparatus, probing method, and storage medium |
| CN101487709A (en) * | 2009-02-27 | 2009-07-22 | 哈尔滨工程大学 | Micro-miniature inertial measuring unit |
| CN101769944A (en) * | 2009-12-30 | 2010-07-07 | 东莞华中科技大学制造工程研究院 | Micro detection device used for detecting LED chip |
Non-Patent Citations (1)
| Title |
|---|
| CMOS图像传感器的并行测试开发;黄海华;《中国优秀硕士学位论文全文数据库 信息科技辑》;20120115(第1期);第41页 * |
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| Publication number | Publication date |
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| CN103575294A (en) | 2014-02-12 |
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