CN103575294A - Silicon micro-gyroscope chip probe card - Google Patents

Silicon micro-gyroscope chip probe card Download PDF

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Publication number
CN103575294A
CN103575294A CN201210263955.7A CN201210263955A CN103575294A CN 103575294 A CN103575294 A CN 103575294A CN 201210263955 A CN201210263955 A CN 201210263955A CN 103575294 A CN103575294 A CN 103575294A
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CN
China
Prior art keywords
probe
chip
upper cover
arc
clamping mechanism
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Application number
CN201210263955.7A
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Chinese (zh)
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CN103575294B (en
Inventor
肖鹏
王刚
王小斌
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No 618 Research Institute of China Aviation Industry
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No 618 Research Institute of China Aviation Industry
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Priority to CN201210263955.7A priority Critical patent/CN103575294B/en
Publication of CN103575294A publication Critical patent/CN103575294A/en
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Publication of CN103575294B publication Critical patent/CN103575294B/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a silicon micro-gyroscope chip probe card. The silicon micro-gyroscope chip probe card comprises a pedestal, a top cover, an elastic clamping mechanism and several probes; the elastic clamping mechanism is a clamping mechanism having chip positioning and elastic clamping functions, and is fixed on the middle part of the pedestal; the middle of the top cover is a hole, and the hole cooperates with the elastic clamping mechanism in position and size; the probes are contact probes which can be adjusted in three degrees of freedom comprising height, arc direction and radial direction; the probes are installed on the top cover, are arranged in a radial manner, and are concentrated nearby the electrode position of a test chip; the pedestal and the top cover are hinged; and the pedestal is provided with a plurality of spacing pillars, and the top cover has a plurality of spacing holes cooperating with the spacing pillars. After the primary probe position adjustment of the test chip is carried out by using the silicon micro-gyroscope chip probe card, the structure of the card allows the positioning of the probes to be accurate, so the multi-time repeated test of like chips can be realized without a microscope, thereby the batch production detection efficiency is greatly improved.

Description

Silicon micro-gyroscope chip probe card
Technical field
The invention belongs to aviation inertial navigation technology field, relate to a kind of silicon micro-gyroscope chip probe card.
Background technology
According to the growth requirement of silicon micro-gyroscope problem, improvement and optimization that its chip-scale detection and screening can be structural design and technique making on the one hand provide raw data, also can provide qualified gauge outfit chip for circuit joint-trial on the other hand.And the connection of a plurality of microelectrodes and the collection of feeble signal thereof are the basic demands of chip-scale test on silicon micro-gyroscope chip, then consider and batch produce required workload and consistance, the test of chip-scale silicon micro-gyroscope and screening are had higher requirement.We adopt probe station to realize the connection of chip electrode at present, but the signals collecting that its limited number of probes cannot meet more than ten electrode on silicon micro-gyroscope chip is connected with shielding, thereby have affected the measuring accuracy of feeble signal; And the accurate contact need of each electrode and probe completes under the microscope, this makes the efficiency of batch detection very low.
Summary of the invention
Technical matters to be solved by this invention is: propose a kind ofly can meet silicon micro-gyroscope chip multi-electrode and reliably connect, and can realize the chip-scale test probe card of high-level efficiency fine registration.
Technical scheme of the present invention is: a kind of silicon micro-gyroscope chip probe card, comprises base, upper cover, elastic clamping mechanism and some probes; Described elastic clamping mechanism is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base; The centre of described upper cover is to match with size with the position of elastic clamping mechanism with size in ,Kong position, hole; Described probe is can be at height, arc to, contact type probe that radially three degree of freedom regulates; Probe is arranged on and covers, and with radial arrangement, probe tip concentrates near institute's test chip electrode position; Base and upper cover are connected through the hinge; On base, there are some limited posts, are above stamped some spacing holes that match with limited post.
The advantage that the present invention has and beneficial effect: use the present invention, after chip under test being completed to first probe location adjusting, its structure keeps accurately probe positioning, after this without by microscope, just can realize similar chip repeatedly and repeated test, not only meet the requirement of feeble signal to precision and stability, and coordinate test macro to use the efficiency that can greatly improve batch production testing.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of silicon micro-gyroscope chip probe card of the present invention;
Fig. 2 is the understructure schematic diagram in a kind of embodiment of the micro-GYROCHIP probe of the present invention;
Fig. 3 is the elastic clamping mechanism schematic diagram in a kind of embodiment of the micro-GYROCHIP probe of the present invention;
Fig. 4 is the probe schematic diagram in a kind of embodiment of the micro-GYROCHIP probe of the present invention;
Wherein, 1-base, 2-elastic clamping mechanism, 3-limited post, 4-upper cover, 5-clamp ring, 6-probe, 7-spacing hole, 8-hinge, 9-support column, 10-resilient clamp bar, 11-chip positioning sheet, 12-tweezers clamping hole, 13-tungsten tipped probe, 14-insulating trip, 15-radiai adjustment bar, 16-height adjustment hole, 17-radiai adjustment hole, 18-arc are to adjuster bar, 19-arc to adjustment hole.
Embodiment
Below in conjunction with Figure of description, the specific embodiment of the present invention is described further.
Referring to Fig. 1, Fig. 2, Fig. 3.Silicon micro-gyroscope chip probe card of the present invention, comprises base 1, upper cover 4, elastic clamping mechanism 2 and some probes 6; Described elastic clamping mechanism 2 is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base 1; The centre of described upper cover 4 is to match with size with the position of elastic clamping mechanism with size in ,Kong position, hole; Described probe 6 is can be at height, arc to, contact type probe that radially three degree of freedom regulates; Probe 6 is arranged on upper cover 4, and with radial arrangement, probe tip concentrates near institute's test chip electrode position; Base 1 is connected by hinge 8 with upper cover 4; On base 1, have some limited posts 3, upper cover 4 has some spacing holes 7 that match with limited post 3.
Referring to Fig. 3, above-mentioned elastic clamping mechanism 2 comprises two mutual rectangular chip positioning sheets 11, resilient clamp bar 10, and wherein a slice chip positioning sheet is with tweezers clamping hole 12 that can chip placement.
Referring to Fig. 4, above-mentioned probe 6 comprises that tungsten tipped probe 13, insulating trip 14, radiai adjustment bar 15, arc are to adjuster bar 18; Arc has the position that raises up to adjuster bar 18 stage casings, bottom is fixed on probe upper cover 4 with arc to adjustment hole 19 and by screw; Tungsten tipped probe 13 is fixed on the one side of insulating trip 14; Insulating trip 14 another sides are fixed on the front end of radiai adjustment bar 15; Radiai adjustment bar 15 front and back have height adjustment hole 16 and radiai adjustment hole 17, are all slideway shape elongated hole; It is fixing to adjuster bar 18 to threaded hole and the arc of adjuster bar 18 boss that radiai adjustment bar 15 passes radiai adjustment hole 17, arc by screw; On height adjustment hole 16, screw is housed, screw head contacts with the non-crowning of front end of arc adjuster bar 18.
On above-mentioned upper cover 4, be useful on the clamp ring 5 of the fixing shielding line being connected with probe 6, and have some when being installed chip for supporting the support column 9 of upper cover 4.
As can be seen from Figure 1, this probe is mainly comprised of base 1 part of fixed chip and upper cover 4 parts of installation probe.The elastic clamping mechanism 2 being fixed on base 1 can be limited to silicon micro-gyroscope chip between two mutual rectangular chip positioning sheets 11, wherein a slice chip positioning sheet with can chip placement tweezers clamping hole 12, and by the elastic force of resilient clamp bar 10, chip is completely fixed.Several probes 6 that are arranged on upper cover 4 are at disk diameter to concentrating on " radial " near chip electrode position, and wherein insulating trip 14 can make probe 6 and radiai adjustment bar 15 keep insulation; By adjusting radiai adjustment hole 17 and arc, to the relative position of adjuster bar 18 screwings, can make probe 6 radially keep appropriate length; By adjusting arc, to the screw of adjustment hole 19, can make arc turn to correct position to adjuster bar 19; By adjusting height adjustment hole 16 and arc, to the screw of 18 of adjuster bars, can make probe pinpoint and chip electrode be in same level, and reliably contact; Clamp ring 5 can be used to the fixing shielding line being connected with probe, to keep test signal line position to fix; Two support columns 9 that are arranged on upper cover 4 can be played a supporting role to it when opening upper cover 4; Finally, by being fixed on the probe 6 of can realizing of spacing hole 7 corresponding in limited post 3 on base and upper cover 4, aim at the accurate of chip electrode position.
The present invention is fixed on silicon micro-gyroscope chip in the elastic clamping mechanism 2 on probe base, as shown in Figure 1, Figure 2 and Figure 3, by limited post 3 and spacing hole 7, be fixed after the relative position of upper cover 4 and base 1, regulate the probe 6 in upper cover 1 to make itself and chip electrode corresponding contact one by one.Concrete operation step is as follows:
1. chip is installed: open probe upper cover 4, silicon micro-gyroscope chip is fixed on to the correspondence position of elastic clamping mechanism 2;
2. aim at: upper cover 4 and base 1 are closely fastened by limited post 3 and spacing hole 7, need be by microscope when testing for the first time respectively at height, arc to, three degree of freedom direction adjusted probe location radially, until each probe 6 is reliably contacted with corresponding chip electrode;
3. test: according to testing requirement, corresponding probe 6 in probe be connected with testing apparatus and complete test;
4. batch detection: after completing steps 2, the chip detection of equivalent constructions is only needed to repeating step 1 and step 3.

Claims (5)

1. silicon micro-gyroscope chip probe card, is characterized by: described probe comprises base (1), upper cover (4), elastic clamping mechanism (2) and some probes (6); Described elastic clamping mechanism (2) is the mechanism that is installed with chip positioning and resilient clamp function, and is fixed on the middle part of base (1); The centre of described upper cover (4) is to match with size with the position of elastic clamping mechanism with size in ,Kong position, hole; Described probe (6) is can be at height, arc to, contact type probe that radially three degree of freedom regulates; It is upper that probe (6) is arranged on upper cover (4), and with radial arrangement, probe tip concentrates near institute's test chip electrode position; Base (1) is connected by hinge (8) with upper cover (4); On base (1), have some limited posts (3), upper cover (4) has some spacing holes (7) that match with limited post (3).
2. probe according to claim 1, it is characterized by: described elastic clamping mechanism (2) comprises two mutual rectangular chip positioning sheets (11), resilient clamp bar (10), wherein a slice chip positioning sheet is with tweezers clamping hole (12) that can chip placement.
3. probe according to claim 1, is characterized by: described probe (6) comprises that tungsten tipped probe (13), insulating trip (14), radiai adjustment bar (15), arc are to adjuster bar (18); Arc has the position that raises up to adjuster bar (18) stage casing, bottom is fixed on probe upper cover (4) with arc to adjustment hole (19) and by screw; Tungsten tipped probe (13) is fixed on the one side of insulating trip (14); Insulating trip (14) another side is fixed on the front end of radiai adjustment bar (15); Before and after radiai adjustment bar (15), having height adjustment hole (16) and radiai adjustment hole (17), is all slideway shape elongated hole; It is fixing to adjuster bar (18) to threaded hole and the arc of adjuster bar (18) boss that radiai adjustment bar (15) passes radiai adjustment hole (17), arc by screw; On height adjustment hole (16), screw is housed, screw head contacts with the non-crowning of front end of arc adjuster bar (18).
4. probe according to claim 3, is characterized by: the clamp ring (5) that is useful on the fixing shielding line being connected with probe (6) on described upper cover (4).
5. according to the probe described in any one of claim 1 to 4, it is characterized by: on described upper cover (4), have some when being installed chip for supporting the support column (9) of upper cover (4).
CN201210263955.7A 2012-07-27 2012-07-27 Silicon micro-gyroscope chip probe card Active CN103575294B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111964690A (en) * 2020-07-15 2020-11-20 北京自动化控制设备研究所 Quartz tuning fork gyroscope gauge outfit screening test device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1681106A (en) * 2004-04-09 2005-10-12 株式会社瑞萨科技 Manufacturing method of semiconductor integrated circuit device and probe card
JP2009060037A (en) * 2007-09-03 2009-03-19 Tokyo Electron Ltd Probe device and probe method
CN101487709A (en) * 2009-02-27 2009-07-22 哈尔滨工程大学 Micro-miniature inertial measuring unit
CN101515016A (en) * 2008-02-22 2009-08-26 东京毅力科创株式会社 Probe apparatus, probing method, and storage medium
CN101769944A (en) * 2009-12-30 2010-07-07 东莞华中科技大学制造工程研究院 Micro detection device used for detecting LED chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1681106A (en) * 2004-04-09 2005-10-12 株式会社瑞萨科技 Manufacturing method of semiconductor integrated circuit device and probe card
JP2009060037A (en) * 2007-09-03 2009-03-19 Tokyo Electron Ltd Probe device and probe method
CN101515016A (en) * 2008-02-22 2009-08-26 东京毅力科创株式会社 Probe apparatus, probing method, and storage medium
CN101487709A (en) * 2009-02-27 2009-07-22 哈尔滨工程大学 Micro-miniature inertial measuring unit
CN101769944A (en) * 2009-12-30 2010-07-07 东莞华中科技大学制造工程研究院 Micro detection device used for detecting LED chip

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
黄海华: "CMOS图像传感器的并行测试开发", 《中国优秀硕士学位论文全文数据库 信息科技辑》, no. 1, 15 January 2012 (2012-01-15) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111964690A (en) * 2020-07-15 2020-11-20 北京自动化控制设备研究所 Quartz tuning fork gyroscope gauge outfit screening test device
CN111964690B (en) * 2020-07-15 2022-09-20 北京自动化控制设备研究所 Quartz tuning fork gyroscope gauge outfit screening test device

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