CN209028108U - A kind of wafer is same to survey probe card - Google Patents
A kind of wafer is same to survey probe card Download PDFInfo
- Publication number
- CN209028108U CN209028108U CN201821396859.9U CN201821396859U CN209028108U CN 209028108 U CN209028108 U CN 209028108U CN 201821396859 U CN201821396859 U CN 201821396859U CN 209028108 U CN209028108 U CN 209028108U
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- Prior art keywords
- needle stand
- probe
- wafer
- test
- card
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- 239000000523 sample Substances 0.000 title claims abstract description 118
- 238000012360 testing method Methods 0.000 claims abstract description 58
- 238000009434 installation Methods 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- CBWUNQZJGJFJLZ-UHFFFAOYSA-N [Cl].Cl Chemical compound [Cl].Cl CBWUNQZJGJFJLZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The utility model provides a kind of wafer with probe card is surveyed, and belongs to wafer detection technique field.This wafer is same to survey probe card, including the pcb board with probe via hole, it is characterized in that, the first rectangular-shaped needle stand, the second needle stand and third needle stand are disposed in the probe via hole, several matrix arrangements are all had in first needle stand, the second needle stand and third needle stand for the card slot of installation test probe, it is provided with test probe in card slot, several input pins and output pin being connected with pcb board are additionally provided on the first needle stand, the second needle stand and third needle stand；First needle stand is staggered with the test probe on the second needle stand, second needle stand is correspondingly arranged with the test probe on third needle stand, and being provided between the pcb board and the first needle stand, the second needle stand and third needle stand can make the probe of test thereon in running order or the switch piece of off working state.The utility model has the advantages that chip on two rows of wafers can be detected simultaneously.
Description
Technical field
The utility model belongs to wafer detection technique field, is related to a kind of probe card, and especially a kind of wafer is the same as probing needle
Card.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore is refined via electric arc furnaces, hydrochloric acid chlorine
Change, and after distilling, the polysilicon of high-purity has been made, purity is up to 99.999999999%.
It is also increasingly to technical requirements such as semiconductor aging reliability and wafer tests with the development of semiconductor technology
It is high, it is desirable that need new breakthrough and improve partly to lead to meet reducing cost of material, reduction testing cost, shortening production life cycle etc.
The development in body field.Present various semiconductor aging reliabilities and screening all rest on package level mostly, need to be related to
One packaging cost and raw material expend problem.Although also there is part semiconductor aging reliability test to start to be applied to wafer scale,
Although but having on limitation and the test probe card that there is a problem of on ageing testing method.
Wafer is widely used in Modern Electronic industry by people, and whether the test of wafer mainly verifies product circuit
Well, whether the function of verifying wafer meets the demand of terminal applies.
And the test of wafer is mainly tested using exclusive test machine, and need to be through test fittings i.e. so-called
Probe card cooperation test program carry out wafer test.Traditional test mode is single IC test, it is necessary to through probe card with
IC contacts to test, and can only once test an IC, can not effectively play the function of test machine, also must in mass production
The manufacturing cost of many probe cards must additionally be put into.
After the completion of IC design, it can place an order and be made to wafer foundry, not yet cut encapsulation after the completion of wafer manufacturing
Border, in order to ensure wafer yield and avoids the waste encapsulated, and fabrication test and analysis processing procedure must be executed in manufacture of semiconductor,
Survey crystal grain by probe needle in probe card, filter out the undesirable chip of electrical functionality, avoid defective products cause back segment manufacture at
This waste.Under the trend that wafer package cost is gradually increased, wafer probing has become important and crucial in IC industry
One ring, and as the device size of integrated circuit becomes small, the precision requirement of test is also higher and higher, when to wafer test
Using to probe card configuration on improvement can greatly improve the precision of wafer test.Meanwhile the chip on wafer is only
It is tested in same row, to reduce the testing efficiency of wafer.
So needing to improve probe card in the prior art for those skilled in the art.
Summary of the invention
The purpose of this utility model is the presence of the above problem in view of the prior art, proposes a kind of wafer with probing needle
Card, technical problem to be solved in the utility model how are realized to wafer side by side with survey.
The purpose of this utility model can be realized by the following technical scheme: a kind of wafer is same to survey probe card, including has
The pcb board of probe via hole, which is characterized in that the first rectangular-shaped needle stand, the second needle are disposed in the probe via hole
Seat and third needle stand all have several matrix arrangements in the first needle stand, the second needle stand and third needle stand for installation test probe
Card slot is provided with test probe in card slot, is additionally provided on the first needle stand, the second needle stand and third needle stand several with pcb board phase
Input pin and output pin even；First needle stand is staggered with the test probe on the second needle stand, the second needle stand and third
Test probe on needle stand is correspondingly arranged, and is provided between the pcb board and the first needle stand, the second needle stand and third needle stand
Probe is in running order or the switch piece of off working state for the test that can make thereon.
This wafer is with probe card is surveyed, its working principle is that such: firstly, under the action of switch piece, it can be by first
Needle stand and the second needle stand move downward simultaneously, and the first needle stand and the second needle stand is made to be in work station, or by the second needle stand and
Third needle stand moves downward simultaneously, and the second needle stand and third needle stand is made to be in work station；Then, the test in probe card is visited
Needle directly on chip wafer weld pad or convex block directly contact, draw chip signal, then cooperate peripheral test instrument and software
Control can determine whether chip is qualified, makes marks on chip if unqualified, achievees the purpose that automatic measurement.
In above-mentioned wafer with surveying in probe card, the test probe includes probe column and probe, the probe
Column is the cylinder of hollow shape, and the probe is the cone of solid shape.
In above-mentioned wafer with surveying in probe card, the diameter of the probe column is 3~9mils.
In above-mentioned wafer with surveying in probe card, the spacing between the adjacent probe column is 1~2mils.
In above-mentioned wafer with surveying in probe card, being provided in the probe column can make probe and wafer to be measured complete
The ejector pin mechanism of Full connected, the ejector pin mechanism include probe springs and connection sheet, and one end of probe springs is respectively with first
Needle stand, the second needle stand and third needle stand are connected, and the other end and connection sheet of probe springs are connected, and above-mentioned probe is connected in company
In contact pin.Probe springs can play buffer function, and probe has a buffering when touching on the electrode protection pad (pad) of wafer
Process, then play good connection, preferable and stable test result can be obtained.
In above-mentioned wafer with surveying in probe card, the switch piece is toggle switch, is offered on the pcb board perpendicular
The regulating tank being directly arranged, the toggle switch are slidably arranged in the regulating tank, the first above-mentioned needle stand, the second needle stand and
Third needle stand is connected with toggle switch respectively.
In above-mentioned wafer with surveying in probe card, the pcb board is the printed circuit board equipped with test circuit, described
Printed circuit board is equipped with several welding positions with test circuit connection, and the welding position is welding hole.
It is asphalt mixtures modified by epoxy resin on first needle stand, the second needle stand and third needle stand in above-mentioned wafer with surveying in probe card
Encapsulated plastic plate made of rouge.
Compared with prior art, the utility model has the advantage that
1, the utility model by adjustable first needle stand of switch piece and the second needle stand work either the second needle stand and
The work of third needle stand, complies with the testing requirements of wafer, to realize to wafer side by side with survey.
2, the utility model is all mounted in card slot due to every test probe, and when replacing bad needle, directly extraction is damaged
Test probe more renews needle, simple and quick, not only reduces the injury to other probes, increases making for circuit board
With the service life, and reduce the number for sealing off package material, improves maintenance efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the positive structure diagram of the utility model.
Fig. 3 is the structural schematic diagram that probe is tested in the utility model.
Fig. 4 is the arrangement architecture schematic diagram that probe is tested in the utility model.
In figure, 1, pcb board；2, the first needle stand；3, the second needle stand；4, third needle stand；5, probe is tested；5a, probe column；
5b, probe；5c, probe springs；5d, connection sheet；6, toggle switch；7, welding hole.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
As illustrated in fig. 1 and 2, a kind of wafer is with surveying probe card, including the pcb board 1 with probe via hole, pcb board 1 be equipped with
The printed circuit board of circuit is tested, printed circuit board is equipped with the welding position of eight with test circuit connection, and welding position is welding hole
7.The first rectangular-shaped needle stand 2, the second needle stand 3 and third needle stand 4, the first needle stand 2, the second needle are disposed in probe via hole
It is encapsulated plastic plate made of epoxy resin on seat 3 and third needle stand 4.
Specifically, several matrix arrangements are all had in the first needle stand 2, the second needle stand 3 and third needle stand 4 to test for installation
The card slot of probe 5 is provided with test probe 5 in card slot, and test probe 5 includes probe column 5a and probe 5b, and probe column 5a is
The cylinder of hollow shape, probe 5b are the cone of solid shape；It is also set on first needle stand 2, the second needle stand 3 and third needle stand 4
It is equipped with several input pins and output pin being connected with pcb board 1.Preferably, the diameter of probe column 5a is 5mils, it is adjacent
Spacing between probe column 5a is 1mils, can specifically be determined according to the pitch size of WAFER.
As shown in figure 3, the ejector pin mechanism that probe 5b and wafer to be measured can be made to completely attach to is provided in probe column 5a,
Ejector pin mechanism includes probe springs 5c and connection sheet 5d, and probe 5b is connected on connection sheet 5d, one end point of probe springs 5c
It is not connected with the first needle stand 2, the second needle stand 3 and third needle stand 4, the other end and connection sheet 5d of probe springs 5c is connected.Probe
Spring 5c can play buffer function, and probe 5b has a process for buffering when touching on the electrode protection pad (pad) of wafer,
Then good connection is played, preferable and stable test result can be obtained.
As shown in figure 4, the first needle stand 2 is staggered with the test probe 5 on the second needle stand 3, the second needle stand 3 and third needle
Test probe 5 on seat 4 is correspondingly arranged, and is provided with energy between pcb board 1 and the first needle stand 2, the second needle stand 3 and third needle stand 4
Enough make test probe 5 thereon in running order or off working state switch piece, switch piece is toggle switch 6, pcb board
The regulating tank being vertically arranged is offered on 1, toggle switch 6 is slidably arranged in regulating tank, the first needle stand 2, the second needle stand 3 and
Three needle stands 4 are connected with toggle switch 6 respectively.
This wafer is with surveying probe card, its working principle is that such:, can be by the firstly, under the action of toggle switch 6
One needle stand 2 and the second needle stand 3 move downward simultaneously, and the first needle stand 2 and the second needle stand 3 is made to be in work station, or by second
Needle stand 3 and third needle stand 4 move downward simultaneously, and the second needle stand 3 and third needle stand 4 is made to be in work station；Then, by probe card
On test probe 5 directly on chip wafer weld pad or convex block directly contact, draw chip signal, then cooperate peripheral test
Instrument can determine whether chip is qualified, makes marks on chip if unqualified, reaches automatic measurement with software control
Purpose.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Although 1, pcb board is used more herein；2, the first needle stand；3, the second needle stand；4, third needle stand；5, test is visited
Needle；5a, probe column；5b, probe；5c, probe springs；5d, connection sheet；6, toggle switch；7, the terms such as welding hole, but do not arrange
A possibility that except other terms are used.The use of these items is only for be more convenient to describe and explain the sheet of the utility model
Matter；It is contrary to the spirit of the present invention to interpret them as any one of the additional limitations.
Claims (8)
1. a kind of wafer is with probe card is surveyed, including the pcb board with probe via hole, which is characterized in that in the probe via hole
It is disposed with the first rectangular-shaped needle stand, the second needle stand and third needle stand, in the first needle stand, the second needle stand and third needle stand
With several matrix arrangements for the card slot of installation test probe, be provided with test probe in card slot, the first needle stand, the second needle stand and
Several input pins and output pin being connected with pcb board are additionally provided on third needle stand；On first needle stand and the second needle stand
Test probe is staggered, and the second needle stand is correspondingly arranged with the test probe on third needle stand, the pcb board and the first needle
Being provided between seat, the second needle stand and third needle stand can make test probe thereon in running order or inoperative shape
The switch piece of state.
2. wafer according to claim 1 is the same as surveying probe card, which is characterized in that the test probe include probe column and
Probe, the probe column are the cylinder of hollow shape, and the probe is the cone of solid shape.
3. wafer according to claim 2 is the same as surveying probe card, which is characterized in that the diameter of the probe column is 3~
9mils。
4. wafer according to claim 3 is the same as surveying probe card, which is characterized in that the spacing between the adjacent probe column is
1~2mils.
5. wafer according to claim 4 is same to survey probe card, which is characterized in that being provided in the probe column can make
The ejector pin mechanism that probe and wafer to be measured completely attach to, the ejector pin mechanism includes probe springs and connection sheet, probe bullet
One end of spring is connected with the first needle stand, the second needle stand and third needle stand respectively, and the other end and connection sheet of probe springs are connected, on
The probe stated is connected in connection sheet.
6. wafer according to claim 1 is same to survey probe card, which is characterized in that the switch piece is toggle switch, institute
The regulating tank being vertically arranged is offered on the pcb board stated, the toggle switch is slidably arranged in the regulating tank, above-mentioned
First needle stand, the second needle stand and third needle stand are connected with toggle switch respectively.
7. wafer according to claim 1 is same to survey probe card, which is characterized in that the pcb board is equipped with test circuit
Printed circuit board, the printed circuit board is equipped with several welding positions with test circuit connection, and the welding position is
Welding hole.
8. wafer according to claim 1 is the same as surveying probe card, which is characterized in that first needle stand, the second needle stand and
It is encapsulated plastic plate made of epoxy resin on third needle stand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821396859.9U CN209028108U (en) | 2018-08-28 | 2018-08-28 | A kind of wafer is same to survey probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821396859.9U CN209028108U (en) | 2018-08-28 | 2018-08-28 | A kind of wafer is same to survey probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209028108U true CN209028108U (en) | 2019-06-25 |
Family
ID=66875474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821396859.9U Active CN209028108U (en) | 2018-08-28 | 2018-08-28 | A kind of wafer is same to survey probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209028108U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112051496A (en) * | 2020-07-31 | 2020-12-08 | 嘉兴威伏半导体有限公司 | System for realizing SLT automatic multi-chip simultaneous measurement on wafer |
| CN112069170A (en) * | 2020-07-31 | 2020-12-11 | 嘉兴威伏半导体有限公司 | Probe card cloud management system |
| CN114487789A (en) * | 2022-04-02 | 2022-05-13 | 浙江清华柔性电子技术研究院 | Wafer detection probe and wafer detection system |
| CN114814506A (en) * | 2021-01-27 | 2022-07-29 | 格科微电子（上海）有限公司 | Probe card for semiconductor chip and wafer test apparatus |
| CN114878877A (en) * | 2022-06-02 | 2022-08-09 | 中国农业大学 | Probe card and wafer testing method |
| CN114895082A (en) * | 2022-05-20 | 2022-08-12 | 丹东富田精工机械有限公司 | Wafer test probe module |
-
2018
- 2018-08-28 CN CN201821396859.9U patent/CN209028108U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112051496A (en) * | 2020-07-31 | 2020-12-08 | 嘉兴威伏半导体有限公司 | System for realizing SLT automatic multi-chip simultaneous measurement on wafer |
| CN112069170A (en) * | 2020-07-31 | 2020-12-11 | 嘉兴威伏半导体有限公司 | Probe card cloud management system |
| CN112069170B (en) * | 2020-07-31 | 2024-04-09 | 嘉兴威伏半导体有限公司 | Probe Card Cloud Management System |
| CN114814506A (en) * | 2021-01-27 | 2022-07-29 | 格科微电子（上海）有限公司 | Probe card for semiconductor chip and wafer test apparatus |
| CN114487789A (en) * | 2022-04-02 | 2022-05-13 | 浙江清华柔性电子技术研究院 | Wafer detection probe and wafer detection system |
| CN114895082A (en) * | 2022-05-20 | 2022-08-12 | 丹东富田精工机械有限公司 | Wafer test probe module |
| CN114878877A (en) * | 2022-06-02 | 2022-08-09 | 中国农业大学 | Probe card and wafer testing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A wafer co measuring probe card Effective date of registration: 20231010 Granted publication date: 20190625 Pledgee: Zhejiang Pinghu rural commercial bank Limited by Share Ltd. science and Technology Branch Pledgor: JIAXING WEIFU SEMICONDUCTOR Co.,Ltd. Registration number: Y2023980060437 |