CN206331005U

CN206331005U - The improved structure of wafer sort needle stand

Info

Publication number: CN206331005U
Application number: CN201621164379.0U
Authority: CN
Inventors: 陈福全
Original assignee: Wo Da Electronic Ltd By Share Ltd
Current assignee: Ambrose crown Technology Industrial Co. Ltd.
Priority date: 2016-11-01
Filing date: 2016-11-01
Publication date: 2017-07-14
Anticipated expiration: 2026-11-01

Abstract

The utility model provides a kind of improved structure of wafer sort needle stand, the circuit board bottom surface is in electrical contact substrate, and pad of the substrate opposing circuit board another side provided with the plural through hole of at least one layer of tool, pad opposite side is provided with needle stand again, surface is equipped with the perforation of plural number first plugged for plural probe respectively between upper base material and lower base material that its needle stand has and plural number second is perforated, and plural probe side is provided through the perforation of plural number first and plural through hole to form first end in electrical contact with substrate, and plural probe opposite side is provided through the perforation of plural number second and has electrical contact to wafer to be detected to carry out the second end of detection operation, its plural probe can be reduced to by least one layer of pad in detection operation produced by rock situation, to increase degree of accuracy during detection operation, and also can maintain the length that plural the second end is exposed to outside lower base material by least one layer of pad is taken out, and then increase the service life of plural probe, so save material cost.

Description

The improved structure of wafer sort needle stand

Technical field

The utility model is related to a kind of improved structure of wafer sort needle stand, espespecially provided with least one layer between substrate and needle stand Pad, when plural probe is arranged in pad and needle stand and electrically contacts on substrate, its plural probe can be dropped by pad Situation is rocked produced by low detection operation, and can reach that the plural probe of maintenance is exposed to outside needle stand using pad is taken out The effect of length.

Background technology

Press, the manufacture of modern semiconductors contains plural step, including lithographic, material depositing and etching step, with one Plural semiconductor device or integrated circuit chips are formed out on the single semiconductor silicon wafer of piece；Currently fabricated conventional partly leads Body crystalline substance diameter of a circle can be six inches or more than six inches, and wherein the wafer of the inch of diameter 12 is a kind of common size；So And, in the processing procedure of semiconductor manufacturing, the chip on the wafer may produce variation, damage etc. because of complicated fabrication schedule Problem is with some defects.

So integrated circuit chips are being utilized to wafer cutting mode before semiconductor crystal wafer separation, can be to plural chip The test of electrical performance and reliability is carried out, and is excited (the burned test of such as wafer scale) to it in a set period simultaneously, And these tests generally may contrast (layout versus schematic comprising layout with line map；LVS it is confirmation), quiet State testing current (IDDq testing) etc., and then by ATE (the au tomatic test of test circuit system equipment；ATE) catch with analysis from each chip or device under test (device under test；DUT produced by) Test result electrical signals, to judge whether tested chip has defect.

Furthermore, in order to help the burned test (burn-in testing) of wafer scale many on wafer with catching simultaneously The electrical signals of individual chip, are to use existing DUT board or probe card, its probe card is generally mounted to ATE In, and as the interface between chip or device under test and ATE, and probe card is printed circuit board (PCB) in itself (printed circuit board；PCB), for comprising the electrical probe of plural metal, to institute on the semiconductor wafer with wafer Corresponding plural electrical contact (contact) or joint (terminal) contact, due to each chip have plural contact or Joint, and each contact or joint must be tested, so, general wafer-level test needs progress to exceed well over 1000 Individual chip contact or joint are electrically connected to be tested between ATE test circuit systems, therefore, accurate in order to implement Ground wafer-level test, it is necessary to which the chip contact by substantial amounts of probe card contact and on wafer is accurately directed at and formed really electrical Connection.

It is the enlarged drawing of existing side cutaway view and Fig. 9 d parts however, referring to shown in Fig. 9, Figure 10, by can in figure It is apparent from, the side surfaces of circuit substrate A mono- are equiped with mounting ring B, and have been internally formed accommodation space B1 in mounting ring B, and The plate body B2 for being electrically connected at the side surfaces of circuit substrate A mono- and having default plural contact is equiped with accommodation space B1, then in peace Dress ring B is relative to being equiped with probe fixture C on another side surfaces of circuit substrate A, and probe fixture C is by top base C1 and bottom base C2 are constituted, and corresponding plural first through hole is equipped with respectively on its top base C1 and bottom base C2 surfaces C11 and plural second through hole C21, and the supporting plate C3 provided with a tool plurality of through holes C31 between top base C1 and bottom base C2, i.e., Plural number test probe D can be equipped with respectively in plural first through hole C11, plural second through hole C21 and plurality of through holes C31, Its plural number test probe D one end is connect to be each passed through plural first through hole C11 with the default plural number contacted to plate body B2 surfaces Point, and the plural number test probe D other ends are then each passed through plural second through hole C21, for having electrical contact to institute on wafer to be measured In corresponding plural test point (not shown), you can the operation tested wafer to be measured, to detect the wafer to be measured Whether there is defect.

End wear, abrasion can be made because test probe D is constantly tested, getting off for a long time just can not be with wafer shape to be measured Into in electrical contact, so that the test probe D that user must more renew could carry out test jobs again, but because of test probe The part that D is used only has test probe D end, in order to make whole test probe D all need replacement because of the abrasion of end, abrasion The waste in many materials can be then caused, and then improves material cost, and plural number test probe D is assembled in probe fixing dress Put the cost on C, thus most manufacturers test probe D dispatch from the factory that Shi Huixian designed it is longer, so as to be exposed to lower base Seat C2 outside end it is longer, supply with providing longer end wear away, if but during test end expose it is long, Plural number test probe D can be made to produce in testing to rock, so that plural number test probe D can not accurately be directed at answering on wafer to be measured Number test point, in turn results in the accuracy of test, disqualification rate and improves, so that causing on processing procedure in place of inconvenience.

It is that related dealer desires most ardently what research improved therefore how to try to solve above-mentioned existing missing and inconvenience Where direction.

Utility model content

Therefore, utility model designer, in view of above-mentioned missing, is to collect related data, via assessing and consider in many ways, and To engage in many years of experience of the industry accumulation, via constantly studying and changing, the beginning designs changing for such a wafer sort needle stand Enter the new patent of structure.

To achieve the above object, the technical solution adopted in the utility model is：

A kind of improved structure of wafer sort needle stand, including circuit board, substrate and needle stand, it is characterised in that：

Plural first metallic contact that the circuit board surface is electrically connected provided with confession with default detecting instrument, and circuit Plate bottom surface is provided with plural second metallic contact；

The electrical property of substrate is contacted with circuit board bottom surface, and is provided with and plural number the adjacent to the side surface of circuit board one in substrate Two metallic contacts form plural first contact in electrical contact, and substrate is then provided with relative to plural another side surface of first contact Plural second contact, then support and posted made by least one layer of isolation material on the adjacent plural side surface of second contact one of substrate Correspond on pad, and pad at plural second connecting point position and be equipped with plural through hole；

The needle stand is arranged at least one layer of pad in contrast at the one side of substrate and including upper base material, lower base material and plural number Probe, and be formed between upper base material and lower base material and place space, and upper substrate surface is equipped with plural number first and perforated, and under Substrate surface is then equipped with plural number second and perforated, then is inserted with conductive material system in the perforation of plural number first and the perforation of plural number second Into plural probe, the plural probe side is provided through the plural through hole and and base of the perforation of plural number first and at least one layer of pad Plural second contact of plate forms first end in electrical contact, and plural probe opposite side is then provided through plural number second and perforated The second end on the plural test point of crystal column surface to be detected is preset in place and electron-donating contact.

The improved structure of described wafer sort needle stand, wherein：The circuit board surface and positioned at plural first metallic contact Reinforcing ring pad is equiped with relative inner.

The improved structure of described wafer sort needle stand, wherein：It is located at plural second metallic contact in the circuit board bottom surface Outside is equiped with retainer ring pad, and is internally formed the accommodation space that substrate is inserted in retainer ring pad.

The improved structure of described wafer sort needle stand, wherein：Plural first contact and the plural number of circuit board of the substrate The plural tin ball for being electrically connected is provided between second metallic contact.

The improved structure of described wafer sort needle stand, wherein：Plural first perforated bottom of base material is formed with court on this First guiding incline of outer flaring, and plural second perforated top of lower base material is formed with the second guiding incline of flaring outwardly.

The improved structure of described wafer sort needle stand, wherein：It is provided with to be located between base material and lower base material on this and places sky In support chip, and correspond to be provided with the perforation of plural number first and plural second punch position on support chip and worn for plural probe The plural open-work crossed.

The improved structure of described wafer sort needle stand, wherein：In oblique mode in the upper base material and lower base material of the needle stand Plural probe is equipped with, the spacing for two first perforation that two adjacent probe sides are passed through is another more than two adjacent probes Two biperforate spacing that side is passed through.

The utility model also provides a kind of improved structure of wafer sort needle stand, upper base material and lower base material that the needle stand has Between be formed with and place space, and be equipped with plural number first in upper substrate surface and perforate, and lower substrate surface is equipped with plural number the Two perforation, then the plural probe that conductive material is made is inserted with the perforation of plural number first and the perforation of plural number second, and plural number is visited Pin side is provided through at plural first perforation and for forming first end in electrical contact with default substrate, then in plural probe Opposite side is provided through at plural second perforation and electron-donating contact preset on the plural test point of crystal column surface to be detected Two ends, it is characterised in that：

The pad posted made by least one layer of isolation material is supported on the upper substrate surface of the needle stand, and is corresponded on pad The plural through hole passed through for the first end of plural probe is equipped with plural first punch position.

Major advantage of the present utility model, which is in that the circuit board bottom surface is in electrical contact, substrate, and in substrate opposing circuit Plate another side is provided with least one layer of pad, and plural through hole is equipped with pad, then is provided with needle stand at pad opposite side, And surface is equipped with the perforation of plural number first plugged for plural probe and plural number respectively between the upper base material and lower base material that needle stand has Second perforation, its plural probe side is provided through the first end of the perforation of plural number first and plural through hole, and plural probe is another Side is then provided through plural biperforate the second end, and its first end can form in electrical contact with substrate, and the second end Portion can be contacted with fabrication to be detected, to carry out detection operation, due to being provided with least one layer of pad between substrate and needle stand, its Plural probe can reduce produced by detection operation by least one layer pad and rock situation, to increase during detection operation Stability, and then plural test point of the plural probe accurately with outside crystal column surface to be detected is formed in electrical contact, such as This maintains the accuracy of test, and user also can maintain the second end of plural probe to reveal by taking out at least one layer of pad For the length outside the lower base material of needle stand, to increase the service life of plural probe, and then reach the pin amount that adjusts out, save material Expect the purpose of cost.

Minor advantage of the present utility model is in that plural first perforated bottom that the upper base material of the needle stand has is formed with First guiding incline of flaring outwardly, and plural second perforated top of lower base material is then formed with the second guiding incline of flaring outwardly, The support chip for being located at and placing in space is provided between upper base material and lower base material again, and corresponds to plural number first on support chip and is perforated And provided with plural open-work at plural second punch position, when probe is intended to penetrate in the second perforation, you can by the second guiding incline Guide function, to make probe easily penetrate into the second perforation, and when user's probe to be replaced, just led using first The guide function on inclined-plane, to make probe easily extract, you can by the first guiding incline and the second guiding incline come easy for user Operation is assembled or separated, and then reaches lifting assembling and separates the purpose of fluency.

Another advantage of the present utility model is in that the plural probe is the upper base material that needle stand is inserted in using oblique mode And in lower base material, so that the spacing for 2 first perforation that two adjacent probe sides are passed through is to be worn more than opposite side is passed through 2 second The spacing in hole, and then substrate is connect with the spacing that two probes form 2 second contacts contacted also greater than wafer with the formation of two probes The spacing of two tactile test points, so making the size design of substrate can more increase, and then the plural probe of raising is contacted to plural number The second contact degree of accuracy, and be easier to because spacing increases also make to etch plural second contact on substrate, so that the line of substrate Road layout is easier to design, reaches substrate and is easier to make, reduces the purpose of design and reduction manufacturing cost.

Brief description of the drawings

Fig. 1 is side cutaway view of the present utility model.

Fig. 2 is the enlarged drawing of the utility model Fig. 1 a parts.

Fig. 3 is the side cutaway view before the utility model pad takes out.

Fig. 4 is the side cutaway view after the utility model pad takes out.

Fig. 5 is the side cutaway view of another embodiment of the utility model.

Fig. 6 is the enlarged drawing of the utility model Fig. 5 b parts.

Fig. 7 is the side cutaway view of the utility model another embodiment.

Fig. 8 is the enlarged drawing of the utility model Fig. 7 c parts.

Fig. 9 is existing side cutaway view.

Figure 10 is the enlarged drawing of existing Fig. 9 d parts.

Description of reference numerals：1- circuit boards；The metallic contacts of 11- first；The metallic contacts of 12- second；13- reinforcing ring pads；14- Retainer ring pad；140- accommodation spaces；2- substrates；The contacts of 21- first；211- tin balls；The contacts of 22- second；23- pads；231- leads to Hole；3- needle stands；30- places space；The upper base materials of 31-；311- first perforates；The guiding inclines of 3111- first；Base material under 32-；321- Two perforation；The guiding inclines of 3211- second；33- probes；331- first ends；332- the second ends；34- support chips；341- open-works； A- circuit substrates；B- mounting rings；B1- accommodation spaces；B2- plate bodys；C- probe fixtures；C1- top bases；C11- first leads to Hole；C2- bottom bases；The through holes of C21- second；C3- supporting plates；C31- perforates；D- tests probe.

Embodiment

To reach above-mentioned purpose and effect, technological means and its construction that the utility model is used hereby are drawn with regard to this reality It is as follows with new its feature of preferred embodiment elaborate and function, understand completely in order to sharp.

Refer to shown in Fig. 1, Fig. 2, be the enlarged drawing of side cutaway view of the present utility model and Fig. 1 a parts, by institute in figure Show it is clear that the utility model include circuit board 1, substrate 2 and needle stand 3, wherein：

The inside of circuit board 1 is to be provided with plural first metallic contact with default configuration, and on the surface of circuit board 1 11, and the bottom surface of circuit board 1 is then provided with plural second metallic contact 12.

The inside of the substrate 2 be with default configuration and it is electron-donating be contacted with the bottom surface of circuit board 1, and in the phase of substrate 2 It is provided with adjacent to the side surface of circuit board 1 one and in electrical contact answer is formed with plural second metallic contact 12 by plural tin ball 211 Several first contacts 21, and substrate 2 is then provided with plural second contact 22 relative to another side surface of plural first contact 21, then in base The pad 23 posted made by least one layer of isolation material, and pad 23 are supported on the adjacent plural side surface of second contact 22 1 of plate 2 It is upper to correspond at the plural position of second contact 22 provided with plural through hole 231.

The needle stand 3 is arranged at at least one layer of another side of 23 opposing substrate of pad 2 and including upper base material 31, lower base material 32 And plural probe 33, it is formed with wherein on this between base material 31 and lower base material 32 and places space 30, and patch is supported on the surface of upper base material 31 In at least one layer of pad 23 and be equipped with plural number first perforation 311, and the surface of lower base material 32 be then equipped with plural number second perforate 321, then plural probe 33 made by conductive material is inserted with the perforation of plural number first 311 and the perforation of plural number second 321, its The plural side of probe 33 is provided through the plural through hole 231 and substrate 2 of the perforation of plural number first 311 and at least one layer of pad 23 Plural second contact 22 forms first end 331 in electrical contact, and the plural opposite side of probe 33 is then provided through plural number second The second end 332 perforated at 321.

The above-mentioned surface of circuit board 1 and reinforcing ring pad 13 is equiped with the plural relative inner of first metallic contact 11, In the bottom surface of circuit board 1 and retainer ring pad 14 (mounting ring) is equiped with positioned at the plural outside of second metallic contact 12 again, And retainer ring pad 14 is internally formed the accommodation space 140 that substrate 2 is inserted, its reinforcing ring pad 13, circuit board 1 and retainer ring pad 14 is sequentially laminated, and are worn using plural lock member (such as screw) with reference to positioning, you can by reinforcing ring pad 13 and fixed Ring pad 14 increases the bulk strength of circuit board 1, to avoid circuit board 1 from bending or the feelings such as deformation in producing under high temperature or outer force environment Condition；And the needle stand 3 can also be used plural lock member to be locked in through at least one layer of pad 23 on circuit board 1, to reach It is firm to combine positioning.

Fig. 3, Fig. 4 are referred to again, are the side cutaway view before the utility model pad takes out and the side view after pad taking-up Profile, it can be clearly seen from the figure that, the utility model is when actually used, and the circuit board 1 is can rely on plural first metal Contact 11 is electrically connected with external detection instrument (not shown), meanwhile, its entirety can drive by external detection instrument It is dynamic, and the second end 332 of plural probe 33 is contradicted to the plural test point of outside crystal column surface to be detected and (do not show in figure Go out) to be electrically connected state, and for carrying out detection operation, and the testing electrical property signal that plural probe 33 is obtained is believed with power supply Number circuit board 1 can be transferred to by substrate 2, then transmit to external detection instrument to learn outside crystalline substance to be detected by circuit board 1 Whether circle has defect.

However, when plural probe 33 carries out detection operation for a long time, when the second end 332 is worn and is shortened, its User just can disassemble needle stand 3, and at least one layer of pad 23 is outwards taken out, then by plural probe 33 base material 32 down Direction elapses an appropriate pre-determined distance, the length increase for making plural the second end 332 be exposed to outside lower base material 32, you can will The installing of needle stand 3 is gone back, so that the first end 331 of plural probe 33 electrically contacts to plural second contact 22 of substrate 2 again On, and then for the operation that plural probe 33 is detected again, to complete of the present utility model use.

Above-mentioned original state when using, the second end 332 of its plural probe 33 is exposed to the length outside lower base material 32 Degree preferably maintains 0 ﹒ 3mm, so that plural probe 33 can stablize the plural number inspection for electrically contacting to outside crystal column surface to be detected On measuring point, and the overall thickness of at least one layer of pad 23 is preferably 0 ﹒ 2mm, after plural the second end 332 is worn, you can At least one layer of pad 23 is outwards taken out, and is pushed outwardly plural probe 33, so that the second end 332 is exposed to lower base material 32 Outside length maintains 0 ﹒ 3m m.

Provided with least one layer of pad 23 between the utility model substrate 2 and needle stand 3, its user can be by least one layer of pad Piece 23 increases stability of the plural probe 33 when detection operation, with produced by reducing plural probe 33 in detection operation Situation is rocked, and then plural test point formation of the plural probe 33 accurately with outside crystal column surface to be detected is electrically connected with Touch, so maintain the accuracy of test, and user can maintain the of plural probe 33 by taking out at least one layer of pad 23 Two ends 332 are exposed to the length outside the lower base material 32 of needle stand 3, to increase the service life of plural probe 33, and then reach Adjust out pin amount, save the effectiveness of material cost.

Fig. 5, Fig. 6 are referred to, is the side cutaway view of another embodiment of the utility model and the enlarged drawing of Fig. 5 b parts, by It can be seen that in figure, 311 bottoms of the perforation of plural number first that the upper base material 31 of the utility model needle stand 3 has are formed with outwardly gradually The first guiding incline 3111 expanded, and the top of the plural number second of lower base material 32 perforation 321 is formed with the second guiding incline of flaring outwardly 3211, then the support chip 34 for being located at and placing in space 30 is provided between upper base material 31 and lower base material 32, and it is right on support chip 34 Should be at 321 positions of the perforation of plural number first 311 and the perforation of plural number second provided with plural open-work 341, when probe 33 is sequentially through extremely When at the perforation of through hole 231, first 311 of few one layer of pad 23 and open-work 341, you can the guiding by the second guiding incline 3211 is made With, to make probe 33 easily penetrate into the second perforation 321, and if during user's probe 33 to be replaced, just led using first The guide function on inclined-plane 3111, to make the easily extraction of probe 33, its user assembles or separated in operation in plural probe 33, i.e., It can make assembling by the first guiding incline 3111 and the second guiding incline 3211 or separate operation easily to implement, and then reach lifting group Fill and separate the effectiveness of fluency.

Fig. 7, Fig. 8 are referred to again, are the side cutaway view of the utility model another embodiment and the enlarged drawing of Fig. 7 c parts, It can be clearly seen from the figure that, it is that plural number is equipped with oblique mode in the upper base material 31 and lower base material 32 of the utility model needle stand 3 Probe 33, you can the spacing for making 2 first perforation 311 that the side of two adjacent probe 33 passes through is 2 the passed through more than opposite side The spacing of two perforation 321, so make the spacing of 2 second contacts 22 that the formation of substrate 2 and two probes 33 contacts also greater than wafer and The spacing of two test points of two probes 33 formation contact, so that the spacing of 2 second contacts 22 can more increase, by make can Increase the size of substrate 2, and then improve plural probe 33 and contact to the plural degree of accuracy of second contact 22, so lifting product is qualified Rate, and be easier to because spacing increases also make to etch plural second contact 22 on substrate 2, so that the configuration of substrate 2 is more It is easily designed, by reaching substrate 2 to be easier to make, reduce the effectiveness of design and reduction manufacturing cost.

It is described above to be merely exemplary for the utility model, and nonrestrictive, those of ordinary skill in the art Understand, in the case where not departing from spirit and scope defined herein, can many modifications may be made, change or equivalent, but all It will fall within protection domain of the present utility model.

Claims

1. a kind of improved structure of wafer sort needle stand, including circuit board, substrate and needle stand, it is characterised in that：

Plural first metallic contact that the circuit board surface is electrically connected provided with confession with default detecting instrument, and circuit board bottom Face is provided with plural second metallic contact；

The electrical property of substrate is contacted with circuit board bottom surface, and is provided with and plural second gold medal adjacent to the side surface of circuit board one in substrate Category contact forms plural first contact in electrical contact, and substrate is then provided with plural number relative to plural another side surface of first contact Second contact, then the pad posted made by least one layer of isolation material is supported on the adjacent plural side surface of second contact one of substrate Correspond on piece, and pad at plural second connecting point position and be equipped with plural through hole；

The needle stand is arranged at least one layer of pad and visited in contrast at the one side of substrate and including upper base material, lower base material and plural number Pin, and be formed between upper base material and lower base material and place space, and upper substrate surface is equipped with plural number first and perforated, and lower base Material surface is then equipped with plural number second and perforated, then is inserted with conductive material in the perforation of plural number first and the perforation of plural number second and is made Plural probe, the plural probe side is provided through the plural through hole and and substrate of the perforation of plural number first and at least one layer of pad Plural second contact form first end in electrical contact, and plural probe opposite side is then provided through at plural second perforation And the second end on the plural test point of crystal column surface to be detected is preset in electron-donating contact.

2. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：The circuit board surface and it is located at Reinforcing ring pad is equiped with plural first metallic contact relative inner.

3. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：It is located in the circuit board bottom surface Plural second metallic contact outside is equiped with retainer ring pad, and is internally formed the accommodating sky that substrate is inserted in retainer ring pad Between.

4. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：The plural number first of the substrate connects The plural tin ball for being electrically connected is provided between plural second metallic contact of point and circuit board.

5. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：The plural number first of base material on this Perforated bottom is formed with the first guiding incline of flaring outwardly, and plural second perforated top of lower base material is formed with flaring outwardly Second guiding incline.

6. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：On this base material and lower base material it Between be provided with to be located at and place support chip in space, and correspond on support chip at the perforation of plural number first and plural second punch position Provided with the plural open-work passed through for plural probe.

7. the improved structure of wafer sort needle stand according to claim 1, it is characterised in that：The upper base material of the needle stand and under Plural probe is equipped with oblique mode in base material, the spacing for two first perforation that two adjacent probe sides are passed through is more than should Two biperforate spacing that two adjacent probe opposite sides are passed through.

8. a kind of improved structure of wafer sort needle stand, is formed between upper base material and lower base material that the needle stand has and places sky Between, and be equipped with plural number first in upper substrate surface and perforate, and lower substrate surface is equipped with plural number second and perforated, then in plural number the The plural probe that conductive material is made is inserted with one perforation and the perforation of plural number second, and plural probe side is provided through plural number At first perforation and for forming first end in electrical contact with default substrate, then plural number is provided through in plural probe opposite side At second perforation and the second end on the plural test point of crystal column surface to be detected is preset in electron-donating contact, it is characterised in that：

The pad posted made by least one layer of isolation material is supported on the upper substrate surface of the needle stand, and corresponds to plural number on pad The plural through hole passed through for the first end of plural probe is equipped with first punch position.

9. the improved structure of wafer sort needle stand according to claim 8, it is characterised in that：The plural number first of base material on this Perforated bottom is formed with the first guiding incline of flaring outwardly, and plural second perforated top of lower base material is formed with flaring outwardly Second guiding incline.