CN101382580A - Detector device and detection method - Google Patents
Detector device and detection method Download PDFInfo
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- CN101382580A CN101382580A CNA2008102118163A CN200810211816A CN101382580A CN 101382580 A CN101382580 A CN 101382580A CN A2008102118163 A CNA2008102118163 A CN A2008102118163A CN 200810211816 A CN200810211816 A CN 200810211816A CN 101382580 A CN101382580 A CN 101382580A
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- measuring head
- probe
- maintaining part
- detector
- main body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a detector device and detecting method capable of detecting the electrical characteristics of the detected objects causing the detector to electrically contact with the electrode slice of the detected object, thereby realizing the miniaturization of the device and suitably install the testing head on the detector body. The method comprises keeping the testing head by using the keeping body to cause it to rotate from the retraction position leaving the top plate of the detector body to the horizontal position, connecting the testing head to a lifting support mechanism provided on the detector body, and using the lifting support mechanism to descend the testing head and installing the detector body on the testing head. Because the testing head does not interfere with the parts of the detector body in the rotating and descending process, the device is able to carry the hinge mechanism of the testing head on the upper surface of the detector body, thereby realizing the miniaturization of the device.
Description
Technical field
The present invention relates to make electric detector assembly and the detection method that detects with to this tested electrical specification of having a medical check-up that contact of detector (probe) and tested electrode slice of having a medical check-up (pad), particularly the drive part of measuring head (test head).
Background technology
In the manufacturing process of semiconductor equipment,, make whether the good and the bad is judged to each integrated circuit (IC) chip under the state before the independent by after finishing in integrated circuit (IC) chip it being carried out various electrical specification inspections.This inspection is carried out as following, promptly, semiconductor wafer (being designated hereinafter simply as " wafer ") is positioned on the mounting table, mounting table is risen, thereby the electrode slice of the integrated circuit (IC) chip on the wafer is contacted with for example probe of probe (probe card).In addition, recently, in the stage before integrated circuit is finished,, the good and the bad of the circuit part that forms before this also utilize probe to survey like this for being judged.
This detector assembly comprises: by the testing fixture main body that framework constitutes, it is used to accommodate mounting table, and is provided with probe at its top board; And measuring head (test head), it can rotate around feathering axis between the top position of this testing fixture main body and the retreating position.For measuring head, it is positioned at the top of testing fixture with flat-hand position, and contacts with the electrode of probe is electric, sends and checks signal by the chip (comprising manufacturing chip midway) that is examined of probe to substrate, thereby electrical specification is checked.
In addition, be used to make the linkage and the apparatus main body of measuring head rotation independently to be provided with, its turning axle be centered close to the place lower than the upper surface of probe.Therefore, because the radius of turn of measuring head is long, so near the motion track of the leading section of the measuring head the upper surface of probe can be thought roughly along vertical direction.Yet along with the heavy caliberization of wafer, the requirement that device is provided with narrow and smallization in space is further strengthened, and thinks that thus it is favourable on apparatus main body that linkage is carried.
But, if carry out design arrangement like this, then the distance of linkage and measuring head shortens, and compare with the turning axle of linkage, because the upper surface of probe one side's step-down, therefore, as shown in Figure 8, the radius of turn of measuring head 100 shortens, thereby near the upper surface of probe 101, the mobile quantitative change in the horizontal direction of the motion track of the leading section of measuring head 100 is big.On the other hand, probe 101 is fixed on the downside of peristome of circle of the upper surface of apparatus main body 102, compares with the upper surface of apparatus main body 102 to be positioned at lower position.Therefore, the leading section of measuring head 100 enters into above-mentioned peristome and contacts with probe 101, but when utilizing linkage 103 to make measuring head 100 rotations, if the leading section along continuous straight runs of measuring head 100 moves in above-mentioned peristome, then might interfere with the reinforcing member of probe 101, the circumference of peristome.On linkage 103, except that having rotating mechanism, also has elevating mechanism, measuring head 100 is rotated to till the horizontal level, make its decline afterwards, utilize pivot arm 104 from one-sided support test head 100, so, because of the weight of measuring head 100 causes pivot arm 104 bendings, finally might cause the interference with reinforcing member etc., Zhuan Zhi structure complicated causes cost to increase in addition.
In patent documentation 1, disclosing has following technology, promptly, by vertical lifting measuring head on apparatus main body, at place, this place it is revolved and turn 90 degrees, the revolution space of measuring head is diminished, carry out contacting and the exchange of feature board (performance board) of measuring head and probe thus.But for the feature board that is installed on the measuring head is exchanged, the operator must use ladder etc. to carry out operation aloft, has the problem that is not easy to carry out upkeep operation.
In addition, in patent documentation 2, disclosing has following technology, that is, making the measuring head rotation and carrying after the precalculated position, utilize supporting mechanism that the position and the degree of tilt of measuring head are carried out inching, but this technology can not address the above problem.
Patent documentation 1: Japanese kokai publication hei 8-148534 (paragraph (0016), Fig. 1, Fig. 2)
Patent documentation 2: Japanese kokai publication hei 9-22927 (paragraph (0048)～(0053))
Summary of the invention
The present invention proposes in order to address the above problem, and its purpose is to provide a kind of detector assembly and detection method that probe can be properly mounted on the apparatus main body.
A first aspect of the present invention provides a kind of detector assembly, this detector assembly has a plurality of substrate-placings of chip that are examined on the substrate-placing platform that moves freely with alignment arrangements, make the described electrode slice that is examined chip contact with the detector of probe to being examined chip inspection, this detector assembly is characterised in that, comprising:
The testing fixture main body has described substrate-placing platform and is provided with probe at top plate portion in inside;
Measuring head, and electric contact to carry out the transmitting-receiving of signal approaching from the top of this probe with the upper surface of described probe;
Rotary driving part, be used to make this measuring head above the described probe its lower surface become the horizontal level of level and the retreating position that leaves from the top board of described testing fixture main body between rotation around the feathering axis;
Be arranged on the described turning axle and be used to keep the maintaining part of described measuring head;
The lifting supporting mechanism, be arranged on the described testing fixture main body, accept to be in the measuring head of described horizontal level and this measuring head is dropped to and the electric position contacting of probe from described maintaining part, and make this measuring head rise to described horizontal level and it is handover on the maintaining part; With
Maintenance/releasing unit, be used to set the side that measuring head is maintained at the hold mode on the described maintaining part and removes the disarm state of this maintenance, when when described maintaining part is handover to measuring head described lifting supporting mechanism, becoming disarm state, when measuring head being handover on the described maintaining part, become hold mode in addition from described lifting supporting mechanism.
Preferred described rotary driving part is set on the described testing fixture main body,
The high position of lower surface of this measuring head when center of described turning axle is set to and contacts than described measuring head and probe are electric.
Preferably between described maintaining part and measuring head, be provided with along the guiding mechanism of above-below direction guiding measuring head.
Preferred described maintenance/releasing unit constitutes becomes the state that this measuring head is remained on the described maintaining part when measuring head is placed in the electric position contacting of probe.
The invention provides a kind of detection method, this detection method uses to have and is provided with the detector assembly that moves substrate-placing platform freely and be provided with the testing fixture main body of probe at top plate portion in inside, alignment arrangements there are a plurality of substrate-placings of chip that are examined on described substrate-placing platform, make the described electrode slice that is examined chip and the detector of described probe contact and be examined chip inspection described, this detection method is characterised in that, comprising:
Measuring head is remained on be arranged on the maintaining part on the feathering axis and make its rotation around this turning axle, thus, rotate to the operation that above described probe its lower surface becomes the horizontal level of level from the retreating position of the top board that leaves described testing fixture main body;
The measuring head that is in described horizontal level is supported on be arranged at the operation on the lifting supporting mechanism on the described testing fixture main body;
Then remove of the maintenance of described maintaining part, utilize described lifting supporting mechanism to make measuring head drop to the operation of this measuring head and the electric position contacting of probe measuring head; With
Afterwards, thus make substrate contact the operation that chip is checked that is examined with the detector of probe to described substrate.
The operation of preferably utilizing described lifting supporting mechanism that measuring head is descended is to utilize the guiding mechanism that is arranged between described maintaining part and the measuring head to guide to carry out.
Preferably utilizing described lifting supporting mechanism to make after measuring head drops to operation with the electric position contacting of probe, carrying out this measuring head is remained on operation on the described maintaining part.
The present invention makes electric contact of detector and tested electrode slice of having a medical check-up measure this tested electrical specification of having a medical check-up, rotate to horizontal level in the retracted position that makes measuring head from the top board that leaves detector body, this measuring head is handover on the lifting supporting mechanism that is arranged on the detector body, utilize this lifting supporting mechanism that measuring head is descended, detector body is installed on the measuring head.Because in the rotation of measuring head and decline process, do not interfere with the parts of detector body, so can reliably measuring head be installed on the detector body, therefore the linkage of measuring head can be carried upper surface at detector body, thus the miniaturization of implement device.
Description of drawings
Fig. 1 is the stereographic map of an example of expression detector assembly of the present invention.
Fig. 2 is the longitudinal section of the above-mentioned detector assembly of expression.
Fig. 3 is the planimetric map of the above-mentioned detector assembly of expression.
Fig. 4 is the longitudinal section of adapter ring that expression is connected the measuring head downside state when contacting with probe.
Fig. 5 is the longitudinal section of adapter ring that expression is connected the measuring head downside state when contacting with probe.
Fig. 6 is the longitudinal section of adapter ring that expression is connected the measuring head downside state when contacting with probe.
Fig. 7 is the longitudinal section of the state of expression measuring head when rotating to maintenance position.
Fig. 8 is the side view that the position of the detecting head in the existing detector assembly of expression produces unfavorable condition.
Label declaration
11 detectors (probe) main body
12 measuring heads (test head)
13 loading parts
31 probe (probe card)
33 reinforcements
40 lifting bodies
41 turning axles
42 hinges (hinge) mechanism
43 pivot arms
45 keep body
46 maintenance/cancel systems
51 guides receiving portions
63 vertically-guided devices
65 accept parts
Embodiment
With reference to Fig. 1～Fig. 3, the detector assembly as detector assembly of the present invention is described.This detector assembly comprises: as the detector body 11 of testing fixture main body; Measuring head 12; With loading part 13.
Be formed with circular peristome 27 on the top board 35 of framework 20, it is fixing to insert ring 28 by embedding the flange part 29 that inserts ring 28 at its periphery.The lower edge of this insertion ring 28 forms the locking surface portion 30 of the ring-type that level is outstanding to the inside.
The flange on the top of the retaining ring 32 by keeping probe 31 and the above-mentioned locking surface portion 30 that inserts ring 28 card mutually end, and probe 31 are fixed on the top board 35 of framework 20.Therefore, the upper surface of probe 31 is positioned at the low for example high-level position of 3.9cm of upper surface than top board 35.Lower face side in this probe 31 is formed with a plurality of probes 26 as detector that for example tilt to stretch out with respect to wafer W.Wherein, as detector, also can for vertical needle and projection (bump).At the upper surface of probe 31, in the mode of the configuring area that surrounds electrode or to dispose the external diameter reinforcement 33 littler than the external diameter of probe 31 with the concentric mode of probe 31.This reinforcement 33 is used to suppress the distortion of probe 31.
In the lower face side of top board 35, be provided with in the mode that can move freely and be used for the unshowned camera of figure made a video recording in the surface of wafer W along horizontal direction.By this camera and the above-mentioned unshowned camera of figure that on Z direction moving part 25, is provided with, obtain the electrode slice that is examined chip on the wafer W and the coordinate position of probe 26.
As Fig. 1 and shown in Figure 3, right border and left border (directions X is represented as left and right directions) at top board 35 make its lifting in order to accept measuring head 12, for example respectively are provided with 3 lifting bodies 40 respectively in front and back.This lifting body 40 can by lifting with driving mechanism for example cylinder (scheming not shown) carry out lifting, in this example, constitute the lifting supporting mechanism by lifting body 40 and cylinder.
In addition, in the trailing edge side of top board 35, the unshowned drive division of figure that is provided with the linkage 42 with turning axle 41 and this turning axle 41 is rotated is being equipped with the short pivot arm 43 of length from the outstanding to the right turning axle 41 of linkage 42.In this example, constitute rotary driving part by linkage 42 and drive division, constitute measuring head 12 described later can above the probe 31 at the horizontal level parallel with for example carrying out at the rear of detector body 11 rotating between the retreating position of maintenance etc. of measuring head 12 with surface level.Measuring head 12 in this retreating position become the lower face side that for example has electrode towards above state.The rotation center of above-mentioned turning axle 41 is set to than the upper surface of top board 35 position of high 22.5cm for example.
In the top ends of pivot arm 43, as shown in Figure 3, connecting along about open and the plane of forwards stretching out and be formed with wrist 44,44 is the rear face of the maintenance body 45 of " コ " font.With between this wrist 44,44 from about the mode that clips, the measuring head 12 that the gap 52 that forms by the whole length direction along wrist 44 will roughly be square keeps.In addition, for the wrist among Fig. 1 44, for convenience's sake, cut the part of downside in the mode that can observe above-mentioned lifting body 40.
About the side of inboard (measuring head 12 1 sides) of two wrists 44, for separately along the devices spaced apart for example group of two guides receiving portions 51 arranged side by side up and down, be arranged side by side the group of two groups of these guides receiving portions 51 with respect to the length direction of wrist 44, on the other hand, corresponding with the position of this guides receiving portion 51 of two groups, in the two sides of measuring head 12, with length than sliding and chimeric mode is provided with two vertically-guided devices 63 from the upper end of the guides receiving portion 51 of above-mentioned upside to the distance of the lower end of the guides receiving portion 51 of downside and with respect to above-mentioned guides receiving portion 51.Therefore, by the slip effect of these guides receiving portions 51 and vertically-guided device 63, measuring head 12 guides in the guides receiving portion 51 of two wrists 44, carries out lifting by above-mentioned lifting body 40.These guides receiving portions 51 and vertically-guided device 63 constitute guiding mechanism.
On the top of the substantial middle of the length direction of this wrist 44,44, (Y direction) is set side by side with along front and back: the stop pin advance and retreat 47a of portion that makes stop pin 47b advance and retreat along wrist 44; Be formed with the stop pin support portion 49 that the shape of cross section that stretches out at both ends forms the slot part of " コ " font towards measuring head 12.Thereby the effect with its support of the through hole 48 that stop pin 47b connected form is played in this stop pin support portion 49 on each of above-mentioned both ends.Side at measuring head 12, the slot part mode that partly surrounds with " コ " font that enters into by stop pin support portion 49 is provided with the retainer 61 of lengthwise, on this retainer 61, with the transition handing-over that is keeping carrying out between body 45 and the lifting body 40 measuring head 12 on the position and on probe 31 the corresponding respectively height and position of upper/lower positions of installation testing head 12, about two places be provided with the through hole 62 of stop pin 47b.Therefore, the through hole 48 of stop pin support portion 49 and the through hole 62 of retainer 61 are under the state that fore-and-aft direction overlaps, by making stop pin 47b connect these through holes 48,62, become lock-out state promptly at the state that keeps keeping on the body 45 measuring head 12, in addition, by being extracted, stop pin 47b becomes the state of removing this maintenance from retainer 61.In this example, constitute maintenance/releasing unit 46 by the stop pin advance and retreat 47a of portion, stop pin 47b, stop pin support portion 49 and retainer 61.
In the lower face side of measuring head 12, be equipped with and be used to make this measuring head 12 and the probe 31 electric adapter rings that contact 64, these adapter ring 64 its external diameters are slightly littler than the external diameter of probe 31, and internal diameter is bigger slightly than the external diameter of reinforcement 33 in addition.In addition, the height dimension of this adapter ring 64 is set to bigger to the distance of the upper surface of top board 35 than the upper surface from probe 31.Therefore, when this adapter ring 64 descends, on probe 31 time, measuring head 12 does not clash with top board 35 by mounting.In addition, the distance of the lower surface of the adapter ring 64 when measuring head 12 rises and the upper surface of probe 31 for example is set to 3.4cm, in the rotation of the measuring head 12 that utilizes above-mentioned pivot arm 43 to carry out, even if when for example causing that because of the weight of this measuring head 12 turning axle 43 is crooked, also not can with reinforcement 33 interference such as grade, can access sufficient gap (clearance).
Downside in the two sides of wrist 44 sides of measuring head 12, in the mode corresponding with the position separately of 3 lifting bodies 40, what devices spaced apart was provided with 3 back sides are fixed on the measuring head 12 and the lower surface disposes from measuring head 12 along horizontal-extending L font accepts parts 65.Therefore, utilize lifting body 40 to accept parts 65, accept parts 65 support test head 12, if under this state, make lifting body 40 liftings, then measuring head 12 liftings via this.On this measuring head 12, be connected with tester (all not shown among the figure), be used to check the electric signal of wafer W from this tester transmission via cable.
Be connected with loading part 13 on the right side of detector body 11, the depth side (inboard) in the framework 71 of this loading part 13 is divided wall 72 and is divided into upper area 73 and lower zone 74.Be provided with mounting as taking in for example mounting table 75 of the FOUP (front opening integral box) 2 of the hermetic type conveyance container of 25 wafer W at this upper area 73.The framework 71 on the right side of FOUP2 becomes peristome 76, carries out the handing-over of FOUP2 between figure unshowned conveyance unit and mounting table 75 via this peristome 76.
Zone in the front face side (side in front) of framework 71, be provided with and rotate freely lifting and flexible carrying arm 77, between the mounting table 21 of the FOUP2 in zone 73 and detector body 11, carry out the handing-over of wafer W up by the peristome 78 that between detector body 11 and loading part 13, forms.
In this sniffer, as shown in Figure 3, be provided with the control part 5 that for example constitutes, data processing division that this control part 5 has program storage part, storer, be made of CPU etc. by computing machine.Program stored has the step group that is used to implement carry out the loading and unloading of measuring head 12 on top board 35 in this program storage part, carries out the conveyance or the localization step group of wafer W.In addition, for example in storer, zone with process parameter values of the mobile step that is used to write travel mechanism 22 or amount of movement etc., CPU is when carrying out the various command of program, read these processing parameters, be sent to each position of this detector assembly according to the control signal of its parameter value.This program (comprise with the input operation of processing parameter, show relevant program) is stored in computer-readable storage medium for example in the storage part 6 of floppy disk, CD (compact disc), MO (photomagneto disk), hard disk etc. and be loaded in the control part 5.
Then, detection method of the present invention is described.At first, shown in Fig. 4 (a), make be set to the retreating position that leaves from the horizontal level of the top of top board 35, utilize maintenances/cancel system 46 to be fixed on measuring head 12 downward sideway swivels on the maintenance body 45.At this moment, as mentioned above, because the rotation center of turning axle 41 is set at the position higher than the upper surface of top board 35, so the describing track and reinforcement 33, insert ring 28 etc. and do not interfere of the lower surface of adapter ring 64, measuring head 12.In the horizontal level of Fig. 4 (b), measuring head 12 is stopped.Then, lifting body 40 is risen, contact with the lower surface of accepting parts 65 (Fig. 1 (c)).
Shown in Fig. 5 (a), extract stop pin 47b from stop pin support portion 49, remove maintenance to measuring head 12, thus, if measuring head 12 is transitted to lifting body 40 from maintaining part 45, then the load of measuring head 12 all is applied on the lifting body 40.Therefore, if make this lifting body 40 declines (Fig. 5 (b)), then the vertically-guided device 63 of the measuring head 12 guides receiving portion 51 that is held body 45 guides, and drops to the lower surface of adapter ring 64 and the upper surface position contacting of probe 31 with lifting body 40.Then, stop pin 47b is inserted in the stop pin support portion 49 (Fig. 5 (c)), makes measuring head 12 become hold mode once more.The maintenance once more of this measuring head 12 is for example to be used to prevent that the fault etc. because of the cylinder of lifting body 40 causes that whole loads of measuring head 12 are applied to probe 31.Fig. 6 is identical with above-mentioned Fig. 2, is the figure that changes viewpoint depiction 4, Fig. 5, and Fig. 6 (a) is corresponding with Fig. 5 (a), and Fig. 6 (b) is corresponding with Fig. 5 (b).
Then, utilization is schemed unshowned conveyance unit and for example will be taken in that the FOUP2 of 25 wafer W is positioned on the mounting table 75.Then, utilize carrying arm 77 from FOUP2, to take out a wafer W, and with on the mounting table 21 of its mounting in detector body 11.Then, as mentioned above, position to probe 26 and wafer W positions, the electrode slice that is examined on the chip on making probe 26 and being formed at this wafer W contacts (Fig. 6 (c)), supply with regulation electric signal via adapter ring 64, probe 31 and probe 26 to this electrode slice from measuring head 12, carry out the electrical specification inspection thus.Then, probe 26 is contacted in turn with electrode slice on the wafer W, each chip of wafer W is checked.Wherein, the mode that also can make employing that the electrode slice of each chip of wafer W is all contacted with probe 26 in the lump.After checking end, utilize carrying arm 77 to make wafer W turn back to FOUP2.
Then, for example during each batch of wafer W, during underway ring 64 exchange or when carrying out the safeguarding of measuring head 12, as shown in Figure 7, measuring head 12 is rotated, from the horizontal level of the top of top board 35 to maintenance position as for example retreating position of 180 degree rear sides of detector body 11 till.Wherein, simplify,, omit a part and describe for Fig. 4～Fig. 7 in order to make diagram.In addition, in Fig. 4 (b), (c), Fig. 5 (a) and Fig. 6 (a), in order to be easy to see these drawings, depict the lower surface position of adapter ring 64 as upper surface position height than top board 35, but in fact, as mentioned above, the lower surface position of adapter ring 64 is compared with the upper surface position of top board 35 and is entered (being absorbed in) 5mm.
In the above-described embodiment, by make the probe 26 and the electrode slice of wafer W electric contact the electrical specification of wafer W is measured, measuring head 12 remained on keep on the body 45 and rotate to the position of flat-hand position from the retreating position that leaves top board 35 after, make measuring head 12 from keeping body 45 and be handed off on the lifting body 40 that is arranged on the detector body 11 and making its decline, therefore, even if the radius of turn of measuring head 12 is little, this measuring head 12 also not with the parts of detector body 11 sides reinforcement 33 for example, insert ring 28 grades and interfere, can reliably measuring head 12 be installed on the detector body 11.In addition, because even if the turning axle 41 of measuring head 12 is than the upper surface height of probe 31, measuring head 12 and probe 31 are electrically connected reliably, so linkage 42 can be carried on detector body 11 miniaturization that therefore can implement device.In addition, because be provided as respectively measuring head 12 rotating mechanism linkage 42 and as the lifting body 40 of elevating mechanism, so simplification that can the implement device structure and realize cost degradation.
In addition, it is not turning axle 41 from one-sided support test head 12, but the lifting body 40 by horizontal support, further utilize guides receiving portion 51 to downside to 63 channeling conducts of vertically-guided device, probe 31 is contacted with adapter ring 64, so, can position measuring head 12 accurately.Therefore, for example promptly the external diameter of the above-mentioned reinforcement 33 of box lunch big, with the little situation in the space of adapter ring 64 under, also can suppress reinforcement 33 and adapter ring 64 or with the interference of measuring head 12.
Claims (8)
1. detector assembly, this detector assembly has a plurality of substrate-placings of chip that are examined on the substrate-placing platform that moves freely with alignment arrangements, make the described electrode slice that is examined chip contact with the detector of probe to being examined chip inspection, this detector assembly is characterised in that, comprising:
The testing fixture main body has described substrate-placing platform and is provided with probe at top plate portion in inside;
Measuring head, and electric contact to carry out the transmitting-receiving of signal approaching from the top of this probe with the upper surface of described probe;
Rotary driving part, be used to make this measuring head above the described probe its lower surface become the horizontal level of level and the retreating position that leaves from the top board of described testing fixture main body between rotation around the feathering axis;
Be arranged on the described turning axle and be used to keep the maintaining part of described measuring head;
The lifting supporting mechanism, be arranged on the described testing fixture main body, accept to be in the measuring head of described horizontal level and this measuring head is dropped to and the electric position contacting of probe from described maintaining part, and make this measuring head rise to described horizontal level and it is handover on the maintaining part; With
Maintenance/releasing unit, be used to set the side that measuring head is maintained at the hold mode on the described maintaining part and removes the disarm state of this maintenance, when when described maintaining part is handover to measuring head described lifting supporting mechanism, becoming disarm state, when measuring head being handover on the described maintaining part, become hold mode in addition from described lifting supporting mechanism.
2. detector assembly as claimed in claim 1 is characterized in that:
Described rotary driving part is set on the described testing fixture main body,
The high position of lower surface of this measuring head when center of described turning axle is set to and contacts than described measuring head and probe are electric.
3. detector assembly as claimed in claim 1 or 2 is characterized in that:
Between described maintaining part and measuring head, be provided with along the guiding mechanism of above-below direction guiding measuring head.
4. as each described detector assembly in the claim 1～3, it is characterized in that:
Described maintenance/releasing unit constitutes becomes the state that this measuring head is remained on the described maintaining part when measuring head is placed in the electric position contacting of probe.
5. detection method, this detection method uses to have and is provided with the detector assembly that moves substrate-placing platform freely and be provided with the testing fixture main body of probe at top plate portion in inside, alignment arrangements there are a plurality of substrate-placings of chip that are examined on described substrate-placing platform, make the described electrode slice that is examined chip and the detector of described probe contact and be examined chip inspection described, this detection method is characterised in that, comprising:
Measuring head is remained on be arranged on the maintaining part on the feathering axis and make its rotation around this turning axle, thus, rotate to the operation that above described probe its lower surface becomes the horizontal level of level from the retreating position of the top board that leaves described testing fixture main body;
The measuring head that is in described horizontal level is supported on be arranged at the operation on the lifting supporting mechanism on the described testing fixture main body;
Then remove of the maintenance of described maintaining part, utilize described lifting supporting mechanism to make this measuring head drop to the operation of this measuring head and the electric position contacting of probe measuring head; With
Afterwards, thus make substrate contact the operation that chip is checked that is examined with the detector of probe to described substrate.
6. detection method as claimed in claim 5 is characterized in that:
Described turning axle is set on the described testing fixture main body,
The high position of lower surface of this measuring head when center of described turning axle is set to and contacts than described measuring head and probe are electric.
7. as claim 5 or 6 described detection methods, it is characterized in that:
The operation of utilizing described lifting supporting mechanism that measuring head is descended is to utilize the guiding mechanism that is arranged between described maintaining part and the measuring head to guide to carry out.
8. as each described detection method in the claim 5～7, it is characterized in that:
Utilizing described lifting supporting mechanism to make after measuring head drops to operation with the electric position contacting of probe, carrying out this measuring head is remained on operation on the described maintaining part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-228078 | 2007-09-03 | ||
| JP2007228078A JP5076750B2 (en) | 2007-09-03 | 2007-09-03 | Probe apparatus and probe method |
| JP2007228078 | 2007-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101382580A true CN101382580A (en) | 2009-03-11 |
| CN101382580B CN101382580B (en) | 2011-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102118163A Active CN101382580B (en) | 2007-09-03 | 2008-09-03 | Detector device and detection method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5076750B2 (en) |
| KR (1) | KR101025389B1 (en) |
| CN (1) | CN101382580B (en) |
| TW (1) | TWI453846B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104620121B (en) * | 2012-06-08 | 2017-09-12 | 斯蒂汀康提纽提特贝耶尔特工程公司 | Probe device |
| CN110023773A (en) * | 2017-02-22 | 2019-07-16 | 新东工业株式会社 | Test macro |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101688049B1 (en) | 2010-12-03 | 2016-12-20 | 삼성전자 주식회사 | Tester and test apparatus comprising the same tester |
| CN102507996B (en) * | 2011-09-27 | 2014-02-26 | 沈玉良 | Probe card lifting mechanism |
| CN103575294B (en) * | 2012-07-27 | 2016-02-24 | 中国航空工业第六一八研究所 | Silicon micro-gyroscope chip probe card |
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| JP6041175B2 (en) | 2015-03-30 | 2016-12-07 | 株式会社東京精密 | Prober |
| CN105080803B (en) * | 2015-08-21 | 2018-08-07 | 京东方科技集团股份有限公司 | Base plate carrying structure, decompression drying equipment and decompression drying method |
| KR102446953B1 (en) * | 2016-02-24 | 2022-09-23 | 세메스 주식회사 | Alignment jig and method of aligning test head with probe station using the same |
| JP7267058B2 (en) * | 2019-03-26 | 2023-05-01 | 東京エレクトロン株式会社 | inspection equipment |
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| JP2965174B2 (en) * | 1991-07-05 | 1999-10-18 | 株式会社東京精密 | Semiconductor device inspection equipment |
| JP3095318B2 (en) * | 1993-11-25 | 2000-10-03 | 東京エレクトロン株式会社 | Test equipment for test object |
| JP2967798B2 (en) * | 1993-12-16 | 1999-10-25 | 株式会社東京精密 | Wafer prober |
| JP2967860B2 (en) * | 1994-11-15 | 1999-10-25 | 株式会社東京精密 | Wafer prober |
| JPH1050778A (en) * | 1996-08-03 | 1998-02-20 | Tokyo Electron Ltd | Heavy object moving system and inspection system |
| US6048750A (en) | 1997-11-24 | 2000-04-11 | Micron Technology, Inc. | Method for aligning and connecting semiconductor components to substrates |
| KR19990028749U (en) * | 1997-12-27 | 1999-07-15 | 구본준 | Semiconductor Prover Equipment |
| US6441629B1 (en) | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
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- 2007-09-03 JP JP2007228078A patent/JP5076750B2/en active Active
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2008
- 2008-07-04 KR KR1020080064975A patent/KR101025389B1/en active IP Right Grant
- 2008-09-02 TW TW097133597A patent/TWI453846B/en active
- 2008-09-03 CN CN2008102118163A patent/CN101382580B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104620121B (en) * | 2012-06-08 | 2017-09-12 | 斯蒂汀康提纽提特贝耶尔特工程公司 | Probe device |
| CN110023773A (en) * | 2017-02-22 | 2019-07-16 | 新东工业株式会社 | Test macro |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101382580B (en) | 2011-07-20 |
| JP5076750B2 (en) | 2012-11-21 |
| KR101025389B1 (en) | 2011-03-29 |
| JP2009060037A (en) | 2009-03-19 |
| TW200935535A (en) | 2009-08-16 |
| KR20090024056A (en) | 2009-03-06 |
| TWI453846B (en) | 2014-09-21 |
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