CN113013075A - Wafer detection device and method - Google Patents
Wafer detection device and method Download PDFInfo
- Publication number
- CN113013075A CN113013075A CN202110212887.0A CN202110212887A CN113013075A CN 113013075 A CN113013075 A CN 113013075A CN 202110212887 A CN202110212887 A CN 202110212887A CN 113013075 A CN113013075 A CN 113013075A
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- wafer
- connecting plate
- ball screw
- arm
- correlation sensor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
The invention provides a wafer detection device which comprises a mechanical arm, a connecting plate and an end effector, wherein the end effector is positioned at one end of the connecting plate, the other end, opposite to the end effector, of the connecting plate comprises a correlation sensor, and the connecting plate is fixed at one end of the mechanical arm and can rotate around one end of the mechanical arm; still include the action wheel on the connecting plate, follow driving wheel, driving motor and ball, the action wheel is connected to the driving motor output, the action wheel passes through the transmission band and connects from the driving wheel, connect ball from the driving wheel, ball includes levogyration ball and dextrorotation ball, correlation sensor includes relative transmitting terminal and receiving terminal, transmitting terminal and receiving terminal are respectively through nut fixed connection on levogyration ball and dextrorotation ball. The invention improves the wafer detection and transportation efficiency; the application range of the wafer detection device and the accuracy of the detection result are improved.
Description
Technical Field
The invention belongs to the field of wafer detection, and particularly relates to a wafer detection device and method.
Background
In a semiconductor manufacturing process, a wafer storage is generally used to store wafers, and a wafer transfer robot is used to transfer the wafers. Before the wafer is transported, it is usually necessary to detect the wafer at a specific position, and if there is a wafer at the position, the transport robot is controlled to transport the wafer, and if there is no wafer, the position adjustment is necessary to transport the wafer again.
For different wafer storages, the stored wafers have different sizes, so that the inspection device is often replaced for different wafer storages to better identify the wafer position. In the prior art, a wafer detection device and a carrier device are usually separately arranged, and wafer detection is firstly carried out and then wafer carrying is carried out.
The wafer detection device commonly used in the prior art includes two types, one type is to detect a wafer by using a reflection sensor, and the main principle is to emit light at a certain angle to the wafer, and to confirm whether the wafer exists or not by receiving the reflected light from the edge of the wafer. The device can correspond to different types of wafer storage devices, but the detection result is not accurate enough, the condition of misreading can be frequently generated, and the result of the existence of the wafer is frequently displayed as no wafer.
Another method of detecting the presence of a wafer in the prior art is to use a correlation sensor to detect the presence of the wafer, which is based on the principle that light is emitted from one side of the wafer and received from the other side of the wafer, and the presence of the wafer is determined by whether the wafer is shielded or not. The method can accurately detect whether the wafer memory contains the wafer, but can not correspond to different types of wafer memory devices. For different wafer storage devices, different types of correlation sensors need to be replaced.
Meanwhile, the wafer detection device and the wafer carrying device in the prior art are independent systems, and before carrying the wafer, the position of the wafer in the wafer storage needs to be detected, and then the wafer detection device is removed, and the wafer carrying device is adopted to carry the wafer. The separately arranged detection and transportation system causes the low efficiency of wafer detection and transportation, and seriously restricts the development of the semiconductor industry.
Disclosure of Invention
The invention aims to provide a wafer detection device and a wafer detection method, which can detect wafers aiming at wafer storages of different models, can combine the wafer detection and the wafer transportation in the same device, and greatly improve the wafer detection and transportation efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme: a wafer detection device comprises a mechanical arm, a connecting plate and an end effector, wherein the end effector is positioned at one end of the connecting plate, the other end of the connecting plate, which is opposite to the end effector, comprises a correlation sensor, and the connecting plate is fixed at one end of the mechanical arm and can rotate around one end of the mechanical arm;
the correlation sensor comprises a transmission end and a receiving end which are opposite, and the transmission end and the receiving end are fixedly connected to the left-handed ball screw and the right-handed ball screw respectively through nuts;
the driving motor drives the left-handed ball screw and the right-handed ball screw to rotate through the driving wheel, the transmission belt and the driven wheel respectively, the left-handed ball screw and the right-handed ball screw convert the rotary motion into the linear motion of the nut, and then the distance between the transmitting end and the receiving end is changed.
Furthermore, the left-handed ball screw and the right-handed ball screw are integrated.
Furthermore, levogyration ball and dextrorotation ball are located two ball, and two ball pass through the coupling joint.
Further, the mechanical arm comprises a large arm and a small arm, one end of the small arm is connected to the large arm, and the other end of the small arm is connected to the connecting plate.
Furthermore, the small arm is connected with a small arm motor, the large arm is connected with a large arm motor, the small arm motor drives the small arm to rotate around the large arm, and the large arm motor drives the large arm and the small arm to rotate.
Furthermore, one end of the small arm, which is far away from the large arm, is fixed on the side edge of the connecting plate, the connecting plate is connected to a connecting plate motor, and the connecting plate motor drives the connecting plate to rotate around the small arm.
Further, the wafer storage device is further included, and a plurality of stacked wafers are placed in the wafer storage device.
Furthermore, the connecting plate also comprises an amplifier and a control center, wherein the amplifier is used for connecting the correlation sensor and the control center and transmitting the signals sensed by the correlation sensor to the control center.
A method of wafer inspection comprising the steps of:
s01: the connection plate motor drives the correlation sensor in the connection plate to rotate to a position facing the wafer memory;
s02: the driving motor drives the left-handed ball screw and the right-handed ball screw to rotate, so that the transmitting end and the receiving end of the correlation sensor are positioned on two sides of the wafer in the wafer storage;
s03: if the ray emitted by the emitting end is received by the receiving end, the current position of the memory is indicated to have no wafer, and the connecting plate drives the correlation sensor to adjust the position to continue wafer detection;
if the ray emitted by the emitting end is not received by the receiving end, the current position of the storage is indicated to have the wafer, the connecting plate motor drives the connecting plate to rotate until the end effector faces the wafer storage, and the end effector carries out wafer handling.
The invention has the following effective effects: according to the wafer detection device, the correlation sensor and the end effector are creatively integrated on two sides of the connecting plate, so that after the wafer detection is finished, the end effector at the other end can be adopted for carrying wafers only by rotating the connecting plate, and the wafer detection and carrying efficiency is greatly improved; the invention creatively converts the rotary motion of the ball screw into the linear motion between the transmitting end and the receiving end in the correlation sensor, can quickly and accurately adjust the distance between the transmitting end and the receiving end in the correlation sensor aiming at different types of wafer storages and different types of wafers, and greatly improves the application range of the wafer detection device and the accuracy of the detection result.
Drawings
FIG. 1 is a schematic view of the overall structure of the wafer inspection apparatus of the present invention;
FIG. 2 is a schematic structural diagram of a connection board in the wafer inspection apparatus of the present invention;
reference numerals: the device comprises a connecting plate 1, a driving wheel 11, a driven wheel 12, a driving motor 13, a left-handed ball screw 14, a right-handed ball screw 15, a linear guide rail 16, an amplifier 17, a transmission belt 18, a coupler 19, a transmitting end 21, a receiving end 22, a wafer storage 3, a wafer 31, a small arm 41, a large arm 42 and an end effector 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1-2, a wafer detecting apparatus includes a mechanical arm, a connecting plate 1 and an end effector 5, wherein the end effector 5 is located at one end of the connecting plate 1, the other end of the connecting plate 1 opposite to the end effector 5 includes a correlation sensor, and the connecting plate 1 is fixed at one end of the mechanical arm and can rotate around one end of the mechanical arm; the connecting plate 1 further comprises a driving wheel 11, a driven wheel 12, a driving motor 13 and a ball screw, the output end of the driving motor 13 is connected with the driving wheel 11, the driving wheel 11 is connected with the driven wheel 12 through a transmission belt 18, the driven wheel 12 is connected with the ball screw, the ball screw comprises a left-handed ball screw 14 and a right-handed ball screw 15, the correlation sensor comprises a transmitting end 21 and a receiving end 22 which are opposite, and the transmitting end 21 and the receiving end 22 are fixedly connected to the left-handed ball screw 14 and the right-handed ball screw 15 through nuts respectively; the driving motor 13 drives the left-handed ball screw 14 and the right-handed ball screw 15 to rotate through the driving wheel 11, the transmission belt 18 and the driven wheel 12 respectively, the left-handed ball screw 14 and the right-handed ball screw 15 convert the rotation motion into the linear motion of the nut, and then the distance between the transmitting end 21 and the receiving end 22 is changed.
According to the invention, the left-handed ball screw 14 and the right-handed ball screw 15 are integrated ball screws, the output end of the driven wheel 12 is connected with the integrated ball screws, and when the driven wheel 12 rotates, the left-handed ball screw and the right-handed ball screw in the integrated ball screws respectively rotate towards two different directions. The left-handed ball screw is positioned at the left end of the right-handed ball screw. For example, when the driven wheel rotates clockwise, the levorotatory ball screw performs levorotatory motion, the dextrorotatory ball screw performs dextrorotatory motion, and simultaneously, the levorotatory ball screw converts the levorotatory motion into the levorotatory motion of corresponding nut, and the dextrorotatory ball screw converts the dextrorotatory motion into the dextrorotatory motion of corresponding nut, and thus, the interval between transmitting terminal and the receiving terminal among the correlation sensor becomes big. When the driven wheel rotates anticlockwise, the levogyration ball screw moves rightwards, the dextrorotation ball screw moves leftwards, meanwhile, the levogyration ball screw converts the dextrorotation movement into the rightwards movement of the corresponding nut, and the dextrorotation rolling screw converts the levorotation movement into the leftwards movement of the corresponding nut, so that the distance between the transmitting end and the receiving end in the correlation sensor is increased.
As shown in fig. 2, the left-handed ball screw and the right-handed ball screw of the present invention are connected to the emitting end and the receiving end through nuts, and the rotational motion of the left-handed ball screw and the right-handed ball screw is converted into the linear motion of the nuts. The invention preferably provides linear guides 16 in the connecting plate, outside the ball screw in the connecting plate, for guiding the linear movement of the nut.
As shown in fig. 2, the left-handed ball screw and the right-handed ball screw may be located on two ball screws, and the two ball screws are connected through a coupling 19. The two ball screws connected by the coupling are similar to the integrated ball screw, and in this case, the rotation modes of the left-handed ball screw and the right-handed ball screw are the same as those described above, and are not described in detail here. The rotation of the ball screw is combined with the transmitting end and the receiving end of the correlation sensor, so that the detection range of the correlation sensor can be quickly and accurately adjusted for different types of wafers, and further, the wafer detection can be carried out on the wafer storage devices with different types without replacing the detection device.
The connecting board also comprises an amplifier 17 and a control center, wherein the amplifier 17 is used for connecting the correlation sensor and the control center and transmitting signals sensed by the correlation sensor to the control center. In this application driving motor and forearm motor, big arm motor connection board motor all are connected to control center, by the operation of each motor of control center unified control. In the application, the correlation sensor transmits the optical fiber signal which senses whether the wafer exists to the amplifier through the optical fiber connector, the amplifier converts the optical fiber signal into a digital signal and transmits the digital signal to the control center, and then the control center can acquire the wafer detection result.
The mechanical arm comprises a large arm 42 and a small arm 41, wherein one end of the small arm 41 is connected to the large arm 42, and the other end of the small arm 41 is connected to the connecting plate 1; the other end of the large arm 42 may be fixed to the carrier body. The small arm is connected with a small arm motor, the large arm is connected with a large arm motor, the small arm motor drives the small arm to rotate around the large arm, and the large arm motor drives the large arm and the small arm to rotate. The one end that the forearm kept away from big arm is fixed at the side of connecting plate, and the connecting plate is connected to the connecting plate motor, and the connecting plate motor drives the connecting plate and rotates round the forearm. In addition, the large arm and the small arm can perform linear motion under the control of a motor, namely move towards the direction far away from or close to the wafer storage.
The invention also comprises a wafer storage 3, wherein a plurality of stacked wafers 31 are placed in the wafer storage. A fixed distance is arranged between the adjacent upper and lower wafers. According to the invention, the large arm and the small arm can move up and down under the control of the motor, so that the height of the connecting plate is aligned with wafers with different heights in the wafer storage, and then the wafers are detected and transported.
The correlation sensor and the end effector on the connecting plate are oppositely arranged, namely, the correlation sensor and the end effector are respectively arranged at two ends of the connecting plate, meanwhile, the connecting plate can rotate around one end fixed with the small arm under the driving of the connecting plate motor, and the aim of the arrangement is to select whether the correlation sensor faces to a wafer memory or the end effector faces to the wafer memory in the rotating process of the connecting plate. When wafer detection is needed, the connecting plate motor drives the connecting plate to rotate around the end fixed with the small arm until the transmitting end and the receiving end in the correlation sensor are positioned at two sides of the wafer to be detected; when the wafer needs to be transported, the connecting plate motor drives the connecting plate to rotate around the end fixed with the small arm until the end effector faces the wafer to be transported. According to the invention, wafer detection and carrying are integrated through the connecting plate, so that a wafer detection or carrying device does not need to be frequently replaced, and only a connecting plate motor needs to be controlled; and then wafer detection and handling efficiency has been improved greatly.
The invention provides a wafer detection method, which comprises the following steps:
s01: the connection plate motor drives the correlation sensor in the connection plate to rotate to a position facing the wafer memory; in this step, the heights of the large arm and the small arm and the distance between the large arm and the wafer storage can be controlled by a motor.
S02: the driving motor drives the left-handed ball screw and the right-handed ball screw to rotate, so that the transmitting end and the receiving end of the correlation sensor are positioned on two sides of the wafer in the wafer storage. In the invention, the rotation directions of the left-handed ball screw and the right-handed ball screw are opposite no matter the driving motor rotates forwards or reversely; and then through the corotation or the reversal of driving motor, control the distance between levogyration ball screw and the dextrorotation ball screw, the distance between transmitting terminal and the receiving terminal in the correlation sensor.
S03: if the ray emitted by the emitting end is received by the receiving end, the current position of the memory is indicated to have no wafer, and the connecting plate drives the correlation sensor to adjust the position to continue to detect the wafer;
if the ray emitted by the emitting end is not received by the receiving end, the current position of the storage is indicated to have the wafer, the connecting plate motor drives the connecting plate to rotate until the end effector faces the wafer storage, and the end effector carries out wafer handling.
According to the wafer detection device, the correlation sensor and the end effector are creatively integrated on two sides of the connecting plate, so that after the wafer detection is finished, the end effector at the other end can be adopted for carrying wafers only by rotating the connecting plate, and the wafer detection and carrying efficiency is greatly improved; the invention creatively converts the rotary motion of the ball screw into the linear motion between the transmitting end and the receiving end in the correlation sensor, can quickly and accurately adjust the distance between the transmitting end and the receiving end in the correlation sensor aiming at different types of wafer storages and different types of wafers, and greatly improves the application range of the wafer detection device and the accuracy of the detection result.
The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the scope of the appended claims.
Claims (9)
1. The wafer detection device is characterized by comprising a mechanical arm, a connecting plate and an end effector, wherein the end effector is positioned at one end of the connecting plate, the other end, opposite to the end effector, of the connecting plate comprises a correlation sensor, and the connecting plate is fixed at one end of the mechanical arm and can rotate around one end of the mechanical arm;
the correlation sensor comprises a transmission end and a receiving end which are opposite, and the transmission end and the receiving end are fixedly connected to the left-handed ball screw and the right-handed ball screw respectively through nuts;
the driving motor drives the left-handed ball screw and the right-handed ball screw to rotate through the driving wheel, the transmission belt and the driven wheel respectively, the left-handed ball screw and the right-handed ball screw convert the rotary motion into the linear motion of the nut, and then the distance between the transmitting end and the receiving end is changed.
2. The wafer inspection device of claim 1, wherein said left-handed and right-handed ball screws are one-piece ball screws.
3. The wafer detecting device as claimed in claim 1, wherein the left-handed ball screw and the right-handed ball screw are disposed on two ball screws, and the two ball screws are connected by a coupling.
4. The wafer inspection device according to claim 1, wherein the robot arm includes a large arm and a small arm, one end of the small arm is connected to the large arm, and the other end of the small arm is connected to the connection plate.
5. The wafer detecting apparatus as claimed in claim 4, wherein the small arm is connected to a small arm motor, the large arm is connected to a large arm motor, the small arm motor rotates the small arm around the large arm, and the large arm motor rotates the large arm and the small arm.
6. The wafer inspection apparatus as claimed in claim 5, wherein the end of the small arm remote from the large arm is fixed to a side of the connection plate, the connection plate is connected to a connection plate motor, and the connection plate motor rotates the connection plate around the small arm.
7. The wafer inspection device of claim 1, further comprising a wafer storage device, wherein a plurality of stacked wafers are disposed in the wafer storage device.
8. The wafer detection device as claimed in claim 1, wherein the connection board further comprises an amplifier and a control center, the amplifier is used for connecting the correlation sensor and the control center and transmitting the signal sensed by the correlation sensor to the control center.
9. A method for wafer inspection, comprising the steps of:
s01: the connection plate motor drives the correlation sensor in the connection plate to rotate to a position facing the wafer memory;
s02: the driving motor drives the left-handed ball screw and the right-handed ball screw to rotate, so that the transmitting end and the receiving end of the correlation sensor are positioned on two sides of the wafer in the wafer storage;
s03: if the ray emitted by the emitting end is received by the receiving end, the current position of the memory is indicated to have no wafer, and the connecting plate drives the correlation sensor to adjust the position to continue wafer detection;
if the ray emitted by the emitting end is not received by the receiving end, the current position of the storage is indicated to have the wafer, the connecting plate motor drives the connecting plate to rotate until the end effector faces the wafer storage, and the end effector carries out wafer handling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110212887.0A CN113013075A (en) | 2021-02-25 | 2021-02-25 | Wafer detection device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110212887.0A CN113013075A (en) | 2021-02-25 | 2021-02-25 | Wafer detection device and method |
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| CN113013075A true CN113013075A (en) | 2021-06-22 |
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| CN202110212887.0A Pending CN113013075A (en) | 2021-02-25 | 2021-02-25 | Wafer detection device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885090A (en) * | 2021-08-30 | 2022-01-04 | 上海广川科技有限公司 | Wafer detection device |
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| CN214201803U (en) * | 2021-02-25 | 2021-09-14 | 上海广川科技有限公司 | Wafer detection device with variable spacing |
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Application publication date: 20210622 |