JP2011216729A - Semiconductor wafer conveying apparatus - Google Patents

Semiconductor wafer conveying apparatus Download PDF

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Publication number
JP2011216729A
JP2011216729A JP2010084415A JP2010084415A JP2011216729A JP 2011216729 A JP2011216729 A JP 2011216729A JP 2010084415 A JP2010084415 A JP 2010084415A JP 2010084415 A JP2010084415 A JP 2010084415A JP 2011216729 A JP2011216729 A JP 2011216729A
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Prior art keywords
wafer
unit
light
light projecting
receiving unit
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JP2010084415A
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Japanese (ja)
Inventor
Koichi Hashimoto
Yasumichi Mieno
Toru Saeki
Yuji Urabe
靖理 三重野
亨 佐伯
雄士 占部
浩一 橋本
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Sinfonia Technology Co Ltd
シンフォニアテクノロジー株式会社
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Priority to JP2010084415A priority Critical patent/JP2011216729A/en
Publication of JP2011216729A publication Critical patent/JP2011216729A/en
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Abstract

Provided is a semiconductor wafer transfer device that facilitates optical axis adjustment of a light projecting function and a light receiving function and can detect a storage state including the presence or absence of a wafer.
When a wafer 7 is put in and out of a wafer storage case and carried, a detection unit 4 for detecting the storage state of the wafer 7 is provided, and the detection unit 4 is an arbitrary peripheral end portion of the wafer 7 The light projecting / receiving unit 44 and the reflector 43 are arranged so as to be sandwiched at least between the two points. The light receiving unit 44 receives light.
[Selection] Figure 1

Description

  The present invention relates to a semiconductor wafer transfer apparatus in which detection of a semiconductor wafer in a wafer storage case is optimized.

Conventionally, silicon-made thin disk-shaped wafers used in the manufacture of semiconductors are called FOUP (Front
It is housed in a wafer storage case called “Open Unified Pod”, and a receiving surface is provided in multiple stages in the wafer storage case so as to store several tens of wafers at a predetermined pitch. An apparatus for taking out and carrying wafers one by one from this wafer storage case is known as a semiconductor wafer carrying apparatus.

  As described in Patent Documents 1 and 2, this semiconductor wafer transfer apparatus is provided with a holding unit for holding a wafer on a transfer base, and the holding unit is inserted into a wafer storage case. The wafer stored in the case is transferred to and held on the upper surface of the holding unit, and the wafer is transferred by moving the transfer base to an appropriate apparatus in this state.

  At this time, the storage state in the wafer storage case is detected by a detection mechanism provided separately from the holding unit.

  Japanese Patent Application Laid-Open No. 2004-228561 includes a wafer transfer device including a wafer detection mechanism using a wafer holding unit and a transmission sensor, and determines the wafer storage state in the wafer storage case based on output information from the sensor light receiving unit. Specifically, the wafer detection mechanism is provided with a light projecting unit and a light receiving unit spaced apart from each other on a pair of arms, and the light projected by the light projecting unit is moved between the pair of arms moved to a position sandwiching the wafer. It is configured to receive light, and by moving the arm up and down, the tilt of the wafer is detected from the apparent thickness of the wafer obtained through the interval at which light is blocked by the wafer.

  Patent Document 2 discloses that a beam can be projected from the side surface direction of the storage container toward the peripheral edge of the wafer, the projected beam is reflected by the wafer, and the amount of reflected light is detected. An overlap or the like is detected.

Japanese Patent No. 2868645 JP 2003-92338 A

  However, in the configuration of Patent Document 1, since it is necessary to align the sensor optical axes of the light projecting unit and the light receiving unit in a straight line, it takes time to adjust the installation direction and position of each light projecting unit and the light receiving unit. There is a problem. Further, since the light projecting unit and the light receiving unit are provided in different paths, it is necessary to secure a wiring space on the arm for each, and the configuration becomes complicated.

  On the other hand, in the configuration of Patent Document 2, the surface may be clouded by a film formed on the wafer surface in the semiconductor manufacturing process, and the reflected light quantity is not uniform depending on the wafer material. A structure that receives reflected light may not be used for detecting the presence or absence of a wafer unless the amount of light emitted is adjusted.

  The present invention has been made paying attention to such problems, and it is an object of the present invention to newly provide a semiconductor wafer transfer apparatus that facilitates optical axis adjustment and simplifies the wiring and configuration of the transfer apparatus. .

  In order to achieve this object, the present invention takes the following measures.

  That is, the semiconductor wafer transfer apparatus according to the present invention is for carrying in and out the wafer and transferring the wafer to and from the wafer storage case, and includes a detection unit for detecting the storage state of the wafer. The light emitting / receiving part and the reflector are arranged so as to be spaced apart so as to sandwich at least two arbitrary points at the end part of the wafer, and the light projected by the light projecting / receiving part is reflected by the wafer or the reflector and then reflected. The light is received by the light projecting / receiving unit.

  With this configuration, the reflector has a characteristic of reflecting toward the optical axis projected from the light projecting / receiving unit, so there is no need to finely adjust the direction of the reflector when adjusting the optical axis, and the strictness of the light projecting / receiving unit is determined. Angle and position adjustments are also unnecessary.

  In addition, since the light projecting function and the light receiving function are combined and installed as a light projecting / receiving unit, it is possible to reduce the installation space of the wiring for supplying power and transmitting the detection signal provided in the detection unit. Can be simplified.

  In the present invention, as described above, the light projecting and receiving functions are combined into a light projecting / receiving unit, and the light projecting / receiving unit is used in a pair with a reflector. In addition, there is an excellent effect that a semiconductor wafer transfer apparatus can be provided that realizes a simple configuration that eliminates the need for wiring and wiring space and that does not require the use of a plurality of sets of reflective sensors.

1 is an overall perspective view showing a semiconductor wafer transfer device according to an embodiment of the present invention. The side view corresponding to FIG. The block diagram which shows the function structure of the control system element in the embodiment. The top view which shows the modification of this invention. The perspective view corresponding to FIG. 4 which removed the holding | maintenance part and was seen from the front.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 and 2 show the semiconductor wafer transfer apparatus of this embodiment. The semiconductor wafer transfer apparatus includes a transfer base 1 serving as a base, an up-and-down moving unit 11 provided on the transfer base 1, and a tip 22b in a horizontal plane with a base end 21a supported by the up-and-down moving unit 11. The horizontal movement unit 2 that can be moved at the same time, the holding unit 3 and the detection unit 4 that are provided at the front end 22b of the horizontal movement unit 2 and that are integrally provided at opposite positions across the rotation fulcrum, and these are controlled. The control unit 5 (see FIG. 3) is configured to store the wafer 7 in the wafer storage case 6 and to take out the transferred wafer 7 and transport it.

  If it demonstrates concretely, the conveyance base 1 will be installed in the fixed state in the place which needs conveyance.

  The elevating / lowering unit 11 moves up and down the horizontal moving unit 2 attached to the upper end side by a built-in motor 11a.

  The horizontal movement unit 2 includes a first arm 21 and a second arm 22. Specifically, the base end 21a of the first arm 21 is attached to the upper end side of the lifting / lowering moving unit 11 via a rotation support shaft (this is referred to as the first joint portion 2A), and the distal end 21b of the first arm 21 is attached. The base end 22a of the second arm 22 is attached to the top end of the second arm 22 via the rotation support shaft in a state of overlapping from the upper side (this is referred to as the second joint portion 2B), and the detection portion 4 is held on the tip end 22b of the second arm 22 The connection part 34 which connects between the parts 3 is attached via the rotation spindle so that it may cover from upper direction (this is set as the 3rd joint part 2C). In order to drive the first, second, and third joint portions 2A, 2B, and 2C, a drive unit (not shown) (for example, a motor, a gear, an air cylinder, a ball screw, a belt, and the like) is connected to the transport base 1, the first, They are respectively provided in the second arms 21 and 22 and can rotate independently to change the angles of the arms 21 and 22.

  The holding portion 3 includes an arc-shaped step portion 31x on a part of the upper surface, and the wafer 7 is placed in the concave portion 31 located on the tip side thereof.

  In the detection unit 4, the first protrusion 41 and the second protrusion 42 that are bifurcated extend substantially parallel to each other with a predetermined distance, and the interval Δ between the respective tip portions 41 a and 42 a. Is configured to be able to enter the wafer storage case 6 shown as a schematic plan view in FIG. 3 and to be narrower than the diameter 7 r of the wafer 7. And the reflector 43 and the light projection / reception part 44 are provided in the corresponding position of those projection parts 41 and 42 facing each other. The light projecting / receiving unit 44 and the reflector 43 are spaced apart so as to sandwich at least two arbitrary points on the peripheral end 7 a of the wafer 7.

  The reflector 43 is a reflecting plate that reflects light along the optical axis ΔX of input light, has a good light reflectivity and a stable light quantity, and is used for, for example, a bicycle safety display or a road construction warning display. It is general.

  The light projecting / receiving unit 44 is configured by a reflective photoelectric sensor or the like, and as shown in FIG. 3, when the detection light α is projected and the reflected light β with respect to the projected detection light α is returned. It also has a function to detect this optically. Here, reference numeral 44 a shown in FIG. 1 indicates a wiring provided on one projecting portion 42 for supplying power and transmitting a detection signal to the light projecting and receiving unit 44, and is provided on the projecting portion 43 on the reflector 43 side. Since no power supply is required, no wiring is provided.

  The control means 5 shown in FIG. 3 is composed of a normal microcomputer unit having a CPU, a memory, and an interface, and a necessary program such as a transfer control routine is written in the memory. By calling and executing, the desired transport operation is realized in cooperation with peripheral hardware resources.

  Specifically, the control means 5 inputs / outputs a signal to / from the light projecting / receiving unit 44 to determine the presence / absence of the wafer 7, and controls the raising / lowering moving unit 11 and the horizontal moving unit 2 to control the holding unit 3 and detection. An arm control unit 52 that moves the unit 4 to a predetermined position, and is configured to control these operations.

  Hereinafter, a processing procedure for detecting a storage state including the presence / absence of the wafer 7 stored in the wafer storage case 6 using such a semiconductor wafer transfer apparatus is taken out of the wafer storage case 6 and transferred. The processing procedure will be mainly described as an example.

  First, the control unit 5 issues a control signal to the horizontal moving unit 2 and the lifting / lowering moving unit 11 via the arm control unit 52, and inserts the detecting unit 4 near the bottom wall 61 in the wafer storage case 6 shown in FIG. . 1 and 2 show a state in which the holding unit 3 is positioned at the tip of the holding unit 3 and the detection unit 4 supported by the horizontal moving unit 2, but when the detection unit 4 is operated. Rotate the connecting portion 180 degrees around the third indirect portion C to position the detecting portion 4 on the tip side. As a result, the reflector 43 and the light projecting / receiving unit 44 provided on the first projection 41 and the second projection 42 of the detection unit 4 are inserted into the wafer storage case 6 as shown in FIG. Then, the determination control unit 51 and the arm control unit 52 are activated in conjunction with each other, and the presence / absence of the wafer 7 is determined by the determination control unit while changing the height of the arm.

  For example, if the wafer 7 does not exist between the first protrusion 41 and the second protrusion 42, the detection light α from the light projecting / receiving unit 44 reaches the reflector 43 and then follows the optical axis ΔX. The reflected light β is recursively received by the light projecting / receiving unit 44, and the determination control unit 51 determines that there is no light shielding by the wafer, but the detection light α from the light projecting / receiving unit 44 is the peripheral edge 7a of the wafer 7. If the light is blocked, the light projecting / receiving unit 44 does not detect the reflected light β, and the determination control unit 51 can detect that the position is shielded by the wafer 7.

  In this way, by raising the detection unit 4 to the height of the uppermost storage position in the wafer storage case 6, the presence / absence and storage state of the wafer 7 is detected for each stage in the wafer storage case 6. The storage state refers to whether a plurality of wafers are stacked or not stored in different levels.

  When the detection is completed, the control unit 5 drives the horizontal movement unit 2 via the arm control unit 52 to remove the detection unit 4 from the wafer storage case 6 and then connects the connection unit 34 around the third joint 2C. Is rotated 180 ° to change the posture so that the holding part 3 faces the tip side. Then, the arm control unit 52 advances the holding unit 3 into the wafer storage case 6 and inserts the holding unit 3 in a non-contact state below the wafer 7 from the stage where the storage of the wafer 7 is confirmed. Subsequently, the holding unit 3 is lifted by using the up-and-down moving unit 11 to place the wafer 7 on the arc-shaped recess 31 provided in the holding unit 3. Then, the horizontal movement unit 2 retracts the holding unit 3 toward the conveyance base 1 side. Finally, the wafer 7 is transferred to an appropriate apparatus and the process is terminated.

  As described above, the semiconductor wafer transfer apparatus according to the present embodiment includes the detection unit 4 for detecting the storage state of the wafer 7 when the wafer 7 is put in and out of the wafer storage case 6 and transferred. The detection unit 4 includes a light projecting / receiving unit 44 and a reflector 43 that are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge with the wafer 7, and the detection light α projected by the light projecting / receiving unit 44. After being reflected by the wafer 7 or the reflector 43, the reflected light β is received by the light projecting / receiving unit 44.

  Since the reflector 43 has a characteristic of reflecting toward the optical axis ΔX projected from the light projecting / receiving unit 44, there is no need to finely adjust the direction of the reflector side when adjusting the optical axis ΔX. It is only necessary to adjust the optical axis ΔX of only the second projecting portion 42 arranged, and it is not necessary to strictly adjust the angle and position of the light projecting / receiving portion 44, so that assembly and setting are extremely simple. Is possible.

  In addition, since the light projecting function and the light receiving function are combined and installed as the light projecting / receiving unit 44, the installation space for the wiring 44a for supplying power and transmitting the detection signal provided in the detection unit 4 can be reduced, The wiring 44a of the device and its wiring processing can be simplified.

  Further, since the reflected light β from the reflector 43 is used for detection and the presence or absence of the wafer 7 and the state of the wafer 7 are detected depending on whether the reflected light β is incident or blocked, the peripheral edge of the wafer 7 is detected. Compared to the case where the reflected light β from the portion 7a is used or the case where the reflected light β from only the first protrusion 41 is used without installing the reflector 43, the detection accuracy can be effectively improved. . Of course, when the wafer 7 is present, it is usual that the light does not enter the light projecting / receiving unit 44. However, even if the light is diffusely reflected and incident, it is reflected by the reflector 43 from the intensity of the light. It is easy to identify the reflection.

  In addition, since it is not necessary to separately provide a plurality of sets of light projecting units and light receiving units, it is possible to reduce the manufacturing cost of the semiconductor wafer transfer device and further simplify the configuration of the entire device.

  Further, the holding unit 3 that holds the wafer 7 is integrally provided at a position facing the detection unit 4 across the rotation fulcrum that constitutes the third joint portion 2C, and can be reversed around the rotation fulcrum. Since it is supported by the common up-and-down moving unit 11 and the horizontal moving unit 2, the mechanism and control of the semiconductor wafer transfer device can be further simplified.

  In particular, in the manufacturing process of the wafer 7, there are cases where the wafer 7 is in a high temperature state or a chemical is applied to the surface of the wafer 7, and the arm 31 on which the wafer 7 on the holding unit 3 is placed is detected. If the portion 4 is provided, there is a possibility that the light receiving portion and the like constituting the detection portion 4 may be adversely affected. However, in the present embodiment, the detection portion 4 is provided at a position separated from the holding portion 3. Problems can be avoided effectively.

  As mentioned above, although one Embodiment of this invention was described, the specific structure of each part is not limited only to embodiment mentioned above.

  For example, FIGS. 4 and 5 show different semiconductor wafer transfer apparatuses, FIG. 4 shows a plan view of the semiconductor wafer transfer apparatus, and FIG. 5 is a perspective view as seen from the front with the holding unit 103 removed. FIG.

  More specifically, the semiconductor wafer transfer apparatus includes a transfer base 101 that can move along the base rail 100, an up-and-down movement unit 111 provided in the transfer base 101, and the up-and-down movement unit 111. In this embodiment, the holding unit 103 and the detection unit 104 are configured independently of each other.

  The horizontal moving unit 102 includes a first arm 121 and a second arm 122 provided symmetrically. More specifically, the base end 121a of the first arm 121 is attached via a rotation support shaft directly above the lifting and lowering moving unit 111 (this is referred to as the first joint portion 102A), and the first arm 121 is attached. The base end 122a of the second arm 122 is attached to the upper side of the distal end 121b of the second arm 122 via a rotation support shaft (this is referred to as a second joint portion 102B). And the holding | maintenance part 103 is provided in the front-end | tip 122b of a pair of 2nd arm 122 via the rotation spindle (this is made into the 3rd joint part 102C).

  Each of the first and second arms 121 and 122 is provided with a driving unit (not shown) (for example, a motor, a gear, an air cylinder, a ball screw, a belt, etc.) inside each of the first and second arms 121 and 122. The joint portions 102 </ b> A, 102 </ b> B, and 102 </ b> C are driven so that the holding portion 103 can be horizontally moved in a direction orthogonal to the base rail rail 100.

  The detection unit 104 advances and retreats in the same direction as the movement direction of the holding unit 103 along the intermediate rail 145 provided between the base ends 121a and 121a of the first arms 121 and 121 on the upper end side of the up-and-down movement unit 111. It is possible to move. The detection unit 104 is divided into two branches as in the embodiment, and the first and second protrusions 141 and 142 of the detection unit 104 are provided with a reflector 143 and a light projecting / receiving unit 144, respectively. . The light projecting / receiving unit 144 and the reflector 143 are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge of the wafer, as in the above embodiment.

  A wiring 144 a that transmits power supply and detection signals to the light projecting and receiving unit 144 is provided on the second protrusion 142 of the detection unit 104.

  When detecting the storage state including the presence or absence of a wafer in a wafer storage case (not shown) using the semiconductor wafer transfer apparatus as described above, the control means is in a state where the holding unit 103 is retracted by the horizontal moving unit 102, The detection unit 104 is advanced along the intermediate rail 145, and the projection using the reflection at the reflector 143 is performed while the detection unit 104 is raised from the lowermost stage to the uppermost stage of the wafer storage case by the up-and-down moving unit 111 as in the embodiment. Based on the projection and reception of the detection light by the light receiving unit 144, the determination control unit provided in the control means determines the storage state including the presence or absence of the wafer.

  Even if comprised in this way, the effect similar to the said embodiment can be acquired through a simple structure.

  Other configurations can be variously modified without departing from the spirit of the present invention.

4, 104 ... detection unit 6 ... wafer storage case 7 ... wafer 43, 143 ... reflector 44, 144 ... light projecting / receiving unit α ... detection light β ... reflected light

Claims (1)

  1. A semiconductor wafer transfer device for transferring wafers in and out of a wafer storage case,
    Comprising a detector for detecting the storage state of the wafer;
    The detection unit includes a light projecting / receiving unit and a reflector that are spaced apart so as to sandwich at least two arbitrary points on the peripheral edge of the wafer, and the light projected by the light projecting / receiving unit is reflected by the wafer or the reflector. A semiconductor wafer transfer apparatus characterized in that the reflected light is received by the light projecting / receiving unit.
JP2010084415A 2010-03-31 2010-03-31 Semiconductor wafer conveying apparatus Pending JP2011216729A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103983468A (en) * 2014-05-13 2014-08-13 北京七星华创电子股份有限公司 Method for detecting durability of semiconductor fetching and placing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153818A (en) * 1993-11-30 1995-06-16 Daihen Corp Semiconductor wafer recognition equipment
JPH0883833A (en) * 1994-09-13 1996-03-26 Tokyo Electron Kyushu Kk Processing equipment
JP2003092341A (en) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd Load port apparatus
JP2004327501A (en) * 2003-04-21 2004-11-18 Kawasaki Heavy Ind Ltd Mapping system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153818A (en) * 1993-11-30 1995-06-16 Daihen Corp Semiconductor wafer recognition equipment
JPH0883833A (en) * 1994-09-13 1996-03-26 Tokyo Electron Kyushu Kk Processing equipment
JP2003092341A (en) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd Load port apparatus
JP2004327501A (en) * 2003-04-21 2004-11-18 Kawasaki Heavy Ind Ltd Mapping system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103983468A (en) * 2014-05-13 2014-08-13 北京七星华创电子股份有限公司 Method for detecting durability of semiconductor fetching and placing equipment

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