CN115763317A - Wafer offset detection method - Google Patents

Wafer offset detection method Download PDF

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Publication number
CN115763317A
CN115763317A CN202211520140.2A CN202211520140A CN115763317A CN 115763317 A CN115763317 A CN 115763317A CN 202211520140 A CN202211520140 A CN 202211520140A CN 115763317 A CN115763317 A CN 115763317A
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Prior art keywords
wafer
edge
sensor
circle center
offset
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CN202211520140.2A
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Inventor
吴天尧
彭雪亮
陈兴隆
苗涛
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Kingsemi Co ltd
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Kingsemi Co ltd
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Priority to CN202211520140.2A priority Critical patent/CN115763317A/en
Publication of CN115763317A publication Critical patent/CN115763317A/en
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Abstract

The invention provides a wafer offset detection method, which comprises the following steps: acquiring a first edge position of a scanning point of the edge of the wafer scanned by a sensor, wherein the sensor generates a first scanning signal when scanning the scanning point; obtaining a first distance between the position of the manipulator when the first scanning signal is generated and the second position; obtaining a second edge position of the scanning point when the manipulator is at the second position from the first edge position and the first distance; obtaining the offset circle center position of the wafer when the wafer is offset according to the second edge position and the radius of the wafer; the offset of the wafer is obtained through the position relation between the offset circle center position and the reference circle center position, and the invention does not need to arrange a centering unit in the equipment, thereby avoiding the step of transporting the wafer to the centering unit and further improving the process efficiency.

Description

Wafer offset detection method
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer offset detection method.
Background
In electronic semiconductor production and processing equipment, a wafer carrying manipulator is responsible for transferring wafers among stations and is a core moving part of a machine table, and the accuracy of the wafer placing position directly influences the yield of semiconductor processing. Therefore, it is important to improve the accuracy of wafer picking and placing.
In the prior art, in order to improve the accuracy of placing a wafer by a manipulator, before the wafer is sent into a key process unit, for example, before the wafer is sent into a glue homogenizing unit, the wafer is firstly put into a mechanical or optical centering unit, the centering unit can acquire position offset data of the wafer and correct the offset of the wafer relative to a mechanical finger, so that the wafer sent into the process unit each time is consistent with a teaching position, and the process stability is ensured.
Therefore, it is necessary to develop a new wafer offset detection method to improve the above-mentioned problems in the prior art.
Disclosure of Invention
The invention aims to provide a wafer offset detection method which can improve the process efficiency.
In order to achieve the above object, the wafer offset detecting method provided by the present invention comprises the following steps:
setting the reference circle center position of the wafer;
using a mechanical arm to drive the wafer to move from a first position to a second position of the path;
acquiring a first edge position of a scanning point of the edge of the wafer scanned by a sensor, wherein the sensor generates a first scanning signal when scanning the scanning point;
obtaining a first distance between the position of the manipulator when the first scanning signal is generated and the second position;
obtaining a second edge position of the scanning point when the manipulator is at the second position from the first edge position and the first distance;
obtaining the offset circle center position of the wafer when the wafer is offset according to the second edge position and the radius of the wafer;
and obtaining the offset of the wafer according to the position relation between the offset circle center position and the reference circle center position.
The wafer offset detection method provided by the invention has the beneficial effects that: in the process that a mechanical arm drives a wafer to move from a first position to a second position of a path, a first edge position of a scanning point of a wafer edge scanned by a sensor is obtained, the first scanning signal is generated, the first distance between a position when the mechanical arm is located at the first scanning signal and a position between the first position and the second position is obtained, the second edge position is obtained by increasing the first distance in the moving direction of the mechanical arm from the first edge position, the wafer edge is approximately circular, the second edge position is a point on a circle, the offset circle center position of the wafer which is offset at present can be obtained through the second edge position and the radius of the wafer, the offset of the wafer at present can be obtained by calculating the relation between the reference circle center position and the offset circle center position, the step of transporting the wafer to an alignment unit is avoided without arranging the alignment unit in equipment, and the process efficiency is improved.
Optionally, the first position is an extended position of the robot, the second position is a retracted position of the robot, and the first scanning signal is a signal output when the wafer is changed from being shielded by the sensor to being not shielded. The beneficial effects are that: in the process that the manipulator returns to the retraction position from the extension position of the stroke, the offset circle center position is closer to the reference circle center position, so that the error is reduced, and the offset detection precision is improved; meanwhile, the acceleration of the manipulator is negative when the manipulator is close to the retraction position, so that the recognition precision of the sensor to the edge of the wafer is improved, and the offset detection precision is improved.
Optionally, the obtaining a first edge position of a scanning point of the edge of the wafer scanned by the sensor includes: placing a wafer on a manipulator, and enabling the circle center of the wafer to be located at the reference circle center position; driving the wafer to move by using the manipulator, and obtaining a second circle center position when the sensor is shielded by the edge of the wafer; driving the wafer to continue moving by using the manipulator, and obtaining a third circle center position when the wafer does not shield the sensor any more; and obtaining the first edge position through the radius of the wafer, the position of the second circle center and the position of the third circle center. The beneficial effects are that: the method is favorable for reducing the setting error of the sensor and improving the precision of obtaining the position of the first edge.
Optionally, the obtaining of the offset circle center position when the wafer is offset through the second edge position and the radius of the wafer includes: obtaining two of the second edge positions using two of the sensors; obtaining two circle center positions to be determined according to the two second edge positions and the radius of the wafer; and calculating the distance between the two circle center positions to be determined and the reference circle center position respectively, and taking the closer one as the offset circle center position. The beneficial effects are that: the wafer is approximately circular, the second edge positions are points on the circle, when the offset circle center positions are determined through the two second edge positions and the radius of the wafer, the two circle center positions to be determined can be obtained, the offset circle center positions can be determined by judging the distance between the two circle center positions to be determined and the reference circle center position, the using number of the sensors is reduced, the structural design of equipment is simplified, and the cost is reduced.
Optionally, the driving the wafer by using the robot includes: the manipulator drives the wafer to move at a first speed; when the distance between the edge of the wafer and the position of the sensor is smaller than a threshold value, the manipulator drives the wafer to move at a second speed, and the second speed is smaller than the first speed. The beneficial effects are that: the speed of the manipulator is reduced when the wafer is close to the sensor, so that the recognition accuracy of the sensor on the edge of the wafer is improved, the delay of signal generation is reduced, and the detection accuracy of the offset is improved.
Optionally, the sensor is a correlation sensor, and a setting direction of the correlation sensor is perpendicular to the wafer.
Optionally, the sensor is connected to a servo system for driving the manipulator to move, and the servo system is used to obtain a moving distance of the manipulator after the sensor generates a signal.
Optionally, the sensors are respectively disposed at two sides of a moving path of the center of the wafer.
Optionally, before the obtaining sensor scans the first edge position of the scanning point on the edge of the wafer, the method further includes: acquiring delay of the sensor and moving speed of the manipulator; compensating the first edge position and the second edge position according to a delay of the sensor and a moving speed of the robot. The beneficial effects are that: and the delay of the sensor is compensated, so that the position precision of a scanning point of the edge of the wafer scanned by the sensor is improved.
Optionally, the obtaining the delay of the sensor includes: driving the wafer to move at a third speed and a fourth speed by using a manipulator respectively; respectively acquiring a third edge position and a fourth edge position of a scanning point of the edge of the wafer scanned by a sensor; obtaining a delay of the sensor according to a distance between the fourth edge position and the third edge position and a speed difference between the fourth speed and the third speed.
Optionally, before the obtaining sensor scans the first edge position of the scanning point on the edge of the wafer, the method further includes: calibrating a detection error of the sensor; the calibrating detection errors of the sensor comprises: detecting the position of a calibration point on the wafer by using the sensor to obtain a coordinate to be calibrated of the calibration point; detecting the position of the calibration point by using a calibration tool to obtain the actual coordinates of the calibration point; calculating the coordinate relation between the coordinate to be calibrated of the calibration point and the actual coordinate to obtain a position error value of the calibration point; and compensating the detection error according to the position error value. The beneficial effects are that: the position accuracy of the sensor at the specific scanning position is improved.
Optionally, before compensating the detection error according to the position error value, the method further includes: establishing a linear relation between coordinates to be calibrated of the calibration points and position error values of the calibration points, wherein the number of the calibration points is at least 2, and the calibration points are arranged at intervals; and obtaining a position error value of an intermediate point between the calibration points according to the linear relation. The beneficial effects are that: it is advantageous to improve the positional accuracy of the sensor scanning points on the path between particular locations.
Optionally, the calibration point is a center of the wafer.
Drawings
FIG. 1 is a flowchart illustrating a wafer offset detection method according to an embodiment of the present invention;
FIG. 2 is a flowchart of obtaining a first edge position of a scanning point where a sensor scans an edge of a wafer according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a process of obtaining a center offset position of a wafer by a second edge position and a radius of the wafer according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a first edge location, a second edge location, and a first distance in an embodiment of the present invention;
FIG. 5 is a diagram illustrating the determination of the offset circle center position by the second edge position according to the embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating an offset circle center position determined from two circle center positions to be determined according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of obtaining a first edge location according to an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating calibration of detection errors of the sensor according to an embodiment of the present invention.
Reference numerals:
1. calibrating points; 2. the path between calibration points.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In order to solve the problems in the prior art, an embodiment of the present invention provides a method for detecting a wafer offset, which includes the following steps with reference to fig. 1 and 4:
s01: setting a reference circle center position of the wafer, wherein the reference circle center position is a graphic o point;
s02: driving the wafer to move from a first position to a second position of a path along the direction A of the graph by using a manipulator, wherein the second position is the position of the manipulator when the circle center of the wafer is located at the position o' of the graph;
s03: acquiring a first edge position of a scanning point of the edge of the wafer scanned by a sensor, wherein the first edge position is a point a in the figure, and the sensor generates a first scanning signal when scanning the scanning point;
s04: obtaining a first distance between the position of the manipulator when the first scanning signal is generated and the second position, wherein the first distance is shown as a graph l1;
s05: obtaining a second edge position of the scanning point when the manipulator is located at the second position through the first edge position and the first distance, wherein the second edge position is a point b shown in the figure;
s06: obtaining the offset circle center position of the wafer when the wafer is offset according to the second edge position and the radius r of the wafer;
s07: and obtaining the offset of the wafer according to the position relation between the offset circle center position and the reference circle center position.
In some embodiments of the present invention, the step S03, the step S04, the step S05, the step S06, or the step S07 may be performed during the step S02.
In some embodiments of the present invention, referring to fig. 4, the reference circle center position is a graphic o point, the reference circle center position may be set according to a specific structure of the manipulator, and the reference circle center position may be a center point of a carrying finger of the manipulator under an ideal process condition.
In some embodiments of the present invention, referring to fig. 4, after the wafer is placed on the robot, an offset exists, the offset center position is an indicated o ' point, and the offset is an offset of the indicated o ' point relative to the indicated o ' point.
In some embodiments of the present invention, referring to fig. 5, two sensors are disposed to obtain two first edge positions, i.e., a point a1 and a point a2, and further obtain two second edge positions, i.e., a point b1 and a point b2, and the offset circle center position is determined by the point b1, the point b2 and a radius r.
In some embodiments of the present invention, the second edge position is obtained by using the first edge position as a starting point, the moving direction of the wafer as a direction, and the first distance as an interval.
In some embodiments of the invention, the wafer is approximately circular, the edge of the wafer is a circle, and the second edge position is a point on the circle.
In some embodiments of the present invention, at least three second edge positions are obtained by disposing at least three sensors to determine the offset circle center position when the wafer is offset.
In some embodiments of the present invention, the robot is driven by a servo system, the servo system includes a servo motor and a servo encoder connected to the robot, and the sensor is connected to a probe port of the servo encoder for the servo system to obtain the first scanning signal.
In some embodiments of the present invention, referring to fig. 4 and 5, the moving the wafer from the first position to the second position of the path by the robot comprises: the manipulator drives the wafer to move from the retraction position of the manipulator to the extension position of the manipulator, namely, the wafer moves along the direction A shown in the drawing; or the manipulator drives the wafer to move from the extending position of the manipulator to the retracting position of the manipulator, namely the wafer moves along the direction opposite to the direction A shown in the drawing.
In other embodiments of the present invention, the first position and the second position may be any path on the stroke of the robot arm, and the edge of the wafer is required to be identified by the sensor when the wafer moves on the path.
In some embodiments of the invention, a stop signal is generated when the robot arm is located at the second position, and the servo encoder obtains the number of rotations of the servo motor in a time period between two signals according to the first scanning signal and the stop signal to obtain the first distance.
In some embodiments of the present invention, the stop signal is generated when the manipulator is at the second position without being limited to using various types of displacement sensors.
In some embodiments of the present invention, the sensor is a correlation sensor, a connection line between a transmitting end and a receiving end of the correlation sensor is perpendicular to a plane where the wafer is located, and a setting position of the correlation sensor is the same as the first edge position at a viewing angle perpendicular to the wafer.
In some embodiments of the invention, the first scanning signal may be a signal generated when the sensor is occluded by the wafer or a signal generated when the sensor changes from being occluded to being unoccluded by the wafer during the movement of the wafer from the retracted position to the extended position.
In other embodiments of the present invention, the first scanning signal may be a signal generated when the sensor is occluded by the wafer or a signal generated when the sensor changes from being occluded to being unoccluded by the wafer during the movement of the wafer from the extended position to the retracted position.
In some embodiments of the present invention, the first edge position, the first distance, the second edge position, the reference circle center position, and the offset circle center position are all located in a plane where the wafer is located.
In some embodiments of the present invention, referring to fig. 4 and 5, the first position is an extended position of the robot, the second position is a retracted position of the robot, i.e., the robot is retracted in the direction of a, and the first scan signal is a signal output when the wafer is changed from being blocked by the sensor to being unblocked.
In some embodiments of the present invention, referring to fig. 2 and 7, the step S03 of scanning the first edge position of the scanning point of the wafer edge by the obtaining sensor includes:
s031: placing a wafer on a manipulator, and enabling the circle center of the wafer to be located at the position of the reference circle center, namely the graph o point;
s032: driving the wafer to move by using the manipulator, and obtaining a second circle center position when the sensor is shielded by the edge of the wafer, namely a graphic o1 point;
s033: driving the wafer to move continuously by using the manipulator to obtain a third circle center position when the wafer does not shield the sensor any more, namely a graph o2 point;
s034: and obtaining the first edge position, namely the point a shown in the figure, through the radius of the wafer, the position of the second circle center and the position of the third circle center.
In some embodiments of the present invention, referring to fig. 2 and 7, in the process that the robot drives the wafer to move from the reference circle center position in S032, that is, in the process of moving from the retracted position to the extended position along the direction of the diagram B, when the sensor is shielded by the edge of the wafer, the sensor generates a second scanning signal, and the servo system obtains a distance between positions where the robot is located at the retracted position and the position where the second scanning signal is generated, respectively, as a second distance, that is, the diagram l2; the manipulator drives the wafer to move continuously, when the sensor is not shielded by the edge of the wafer any more, the sensor generates a third scanning signal, and the servo system obtains the distance between the retracted position and the position of the manipulator when the third scanning signal is generated as a third distance, namely a graph l3; according to the movement direction of the manipulator, the reference circle center position, the second distance and the third distance, the second circle center position, namely a graph o1 point, and the third circle center position, namely a graph o2 point, can be obtained; according to the second center position, the third center position and the radius of the wafer, the first edge position scanned by the sensor to the edge of the wafer, namely the point a in the graph, can be obtained through a general equation or a pythagorean theorem which is not limited to a circle.
It should be noted that the sensor is a correlation sensor, and since a connection line between a transmitting end and a receiving end of the correlation sensor is perpendicular to a plane where the wafer is located, a setting position of the correlation sensor is the same as the first edge position at a viewing angle perpendicular to the wafer, that is, the first edge position is determined by the setting position of the correlation sensor.
In some embodiments, the sensor is an AWC sensor on a semiconductor device robot.
In some embodiments of the present invention, referring to fig. 3 and 6, the obtaining of the offset circle center position when the wafer is offset through the second edge position and the radius of the wafer in S06 includes:
s061: obtaining two second edge positions, namely a graph b1 point and a graph b2 point, by using two sensors;
s062: obtaining two circle center positions to be determined, namely a graph o 'point and a graph o' point, through the two second edge positions and the wafer radius;
s063: and calculating the distance between the two circle center positions to be determined and the reference circle center position respectively, and taking the closer one as the offset circle center position.
In some specific embodiments of the present invention, referring to fig. 6, two second edge positions are obtained by setting two sensors, the edge of the wafer is approximately circular, the two second edge positions are points on two circles, two circle center positions to be determined, namely, a graph o 'point and a graph o ″ point, can be obtained by combining the radius of the wafer, the offset circle center position is one of the two circle center positions to be determined, which is closer to the reference circle center position, and the o' point is finally determined to be the offset circle center position.
In some embodiments of the present invention, the driving the wafer by the robot comprises: the manipulator drives the wafer to move at a first speed; and when the distance between the edge of the wafer and the position of the sensor is smaller than a threshold value, the manipulator drives the wafer to move at a second speed, and the second speed is smaller than the first speed.
In some embodiments of the invention, the threshold is in the range of 1mm to 5 cm.
In some embodiments of the present invention, referring to fig. 4, 5 and 6, the sensors are respectively disposed at two sides of a moving path of a center of the wafer, that is, when the center of the wafer moves along the direction C, two of the sensors are disposed at two sides of the moving path of the center of the wafer.
In some embodiments of the present invention, the sensor is connected to a servo system for driving the robot to move, and the servo system is used to obtain the moving distance of the robot after the sensor generates a signal.
In some embodiments of the present invention, after the offset of the wafer is obtained, the position of the robot is adjusted by the motor so that the center of the wafer is located at the reference circle center position.
In some embodiments of the present invention, before the obtaining the first edge position of the scanning point of the wafer edge scanned by the sensor, the method further includes: acquiring delay of the sensor and moving speed of the manipulator; compensating the first edge position and the second edge position according to a delay of the sensor and a moving speed of the robot.
In some embodiments of the invention, the obtaining the delay of the sensor comprises: respectively driving the wafer to move at a third speed and a fourth speed by using a manipulator; respectively acquiring a third edge position and a fourth edge position of a scanning point of the edge of the wafer scanned by a sensor; obtaining a delay of the sensor according to a distance between the fourth edge position and the third edge position and a speed difference between the fourth speed and the third speed.
In some embodiments, the difference in speed between the fourth speed and the third speed ranges from 1mm/s to 600mm/s.
Further, the speed difference between the fourth speed and the third speed may range from 100, 200, 300, 400, 500, or 600mm/s.
Specifically, the third speed may be 1mm/s, and the fourth speed may be 600mm/s.
In some embodiments, the distance between the third edge position and the fourth edge position is obtained by a difference of distance traversed when the servo system receives the signals of the sensors, respectively.
In some embodiments, the delay td = (S2-S1)/(V2-V1) of the sensor, where S1 is a moving distance of the wafer when the sensor is received by the probe port of the wafer-moving servo system driven at the third speed, S2 is a moving distance of the wafer when the sensor is received by the probe port of the wafer-moving servo system driven at the fourth speed, (S2-S1) is a distance between the fourth edge position and the third edge position, V1 is the third speed, V2 is the fourth speed, and (V2-V1) is a speed difference between the fourth speed and the third speed.
In some embodiments of the present invention, before the obtaining the first edge position of the scanning point of the wafer edge is scanned by the obtaining sensor, the method further includes: calibrating a detection error of the sensor; the calibrating detection errors of the sensor comprises: detecting the position of a calibration point on the wafer by using the sensor to obtain a coordinate to be calibrated of the calibration point; detecting the position of the calibration point by using a calibration tool to obtain the actual coordinates of the calibration point; calculating the coordinate relation between the coordinate to be calibrated of the calibration point and the actual coordinate to obtain a position error value of the calibration point; and compensating the detection error according to the position error value.
In some embodiments of the present invention, before compensating the detection error according to the position error value, the method further includes: establishing a linear relation between coordinates to be calibrated of the calibration points and position error values of the calibration points, wherein the number of the calibration points is at least 2, and the calibration points are arranged at intervals; and obtaining a position error value of an intermediate point between the calibration points according to the linear relation.
In some embodiments, referring to fig. 8, the number of the calibration dots 1 may be 25, and 25 calibration dots 1 form a rectangular array to realize error position calibration of 25 dots in a rectangular area.
In some embodiments, referring to fig. 8, any two adjacent calibration points 1 in the 25 calibration points 1 are selected, and the linear relationship is established by the coordinates to be calibrated of the two adjacent calibration points 1 and the position error value of the calibration point, so as to realize error position calibration on any position on the path 2 between the two adjacent calibration points.
In some embodiments, the calibration point may be a center of the wafer, and the calibration for detecting the error is performed by setting the wafer at different positions and using the centers of the wafer at different positions as the calibration point.
In some embodiments of the present invention, the calibration tool may be various high-precision distance detection tools, and the specified point is used as an origin to establish a coordinate system and detect the actual coordinates of the calibration point.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (15)

1. A wafer offset detection method is characterized by comprising the following steps:
setting the reference circle center position of the wafer;
using a mechanical arm to drive the wafer to move from a first position to a second position of the path;
acquiring a first edge position of a scanning point of the edge of the wafer scanned by a sensor, wherein the sensor generates a first scanning signal when scanning the scanning point;
obtaining a first distance between the position of the mechanical arm and the second position when the first scanning signal is generated;
obtaining a second edge position of the scanning point when the manipulator is at the second position from the first edge position and the first distance;
obtaining the offset circle center position of the wafer when the wafer is offset according to the second edge position and the radius of the wafer;
and obtaining the offset of the wafer according to the position relation between the offset circle center position and the reference circle center position.
2. The wafer offset detecting method according to claim 1, wherein the first position is an extended position of the robot arm, the second position is a retracted position of the robot arm, and the first scanning signal is a signal output when the wafer is changed from an occluding state to a non-occluding state.
3. The method as claimed in claim 1, wherein the step of scanning the first edge position of the scanning point of the wafer edge by the capturing sensor comprises:
placing a wafer on a manipulator, and enabling the circle center of the wafer to be located at the reference circle center position;
driving the wafer to move by using the manipulator to obtain a second circle center position when the sensor is shielded by the edge of the wafer;
driving the wafer to move continuously by using the manipulator to obtain a third circle center position when the wafer does not shield the sensor any more;
and obtaining the first edge position through the radius of the wafer, the second circle center position and the third circle center position.
4. The method as claimed in claim 1, wherein the obtaining the position of the center of the offset circle when the wafer is offset according to the second edge position and the radius of the wafer includes:
obtaining two of the second edge positions using two of the sensors;
obtaining two circle center positions to be determined according to the two second edge positions and the radius of the wafer;
and calculating the distance between the two circle center positions to be determined and the reference circle center position respectively, and taking the closer one as the offset circle center position.
5. The method as claimed in any one of claims 1 to 4, wherein the using the robot to drive the wafer comprises:
the manipulator drives the wafer to move at a first speed;
when the distance between the edge of the wafer and the position of the sensor is smaller than a threshold value, the manipulator drives the wafer to move at a second speed, and the second speed is smaller than the first speed.
6. The method as claimed in claim 5, wherein the sensor is a correlation sensor, and the correlation sensor is disposed perpendicular to the wafer.
7. The method as claimed in claim 6, wherein the sensors are respectively disposed at two sides of a moving path of the center of the wafer.
8. The wafer offset detection method of claim 6, wherein the sensor is connected to a servo system for driving the robot to move, and the servo system is used to obtain the moving distance of the robot after the sensor generates the signal.
9. The method as claimed in claim 1, wherein before the first edge position of the scanning point of the wafer edge is scanned by the capturing sensor, the method further comprises:
acquiring delay of the sensor and moving speed of the manipulator;
compensating the first edge position and the second edge position according to a delay of the sensor and a moving speed of the robot.
10. The wafer offset detection method of claim 9, wherein the obtaining the delay of the sensor comprises:
driving the wafer to move at a third speed and a fourth speed by using a manipulator respectively;
respectively acquiring a third edge position and a fourth edge position of a scanning point of the edge of the wafer scanned by a sensor;
obtaining a delay of the sensor according to a distance between the fourth edge position and the third edge position and a speed difference between the fourth speed and the third speed.
11. The method as claimed in claim 8, wherein before the first edge position of the scanning point of the wafer edge is scanned by the capturing sensor, the method further comprises:
and acquiring the delay of a probe port of the servo system and the moving speed of the manipulator, and compensating the first edge position and the second edge position according to the delay of the probe port and the moving speed of the manipulator.
12. The method as claimed in claim 8, wherein the step of scanning the wafer edge by the capture sensor to the first edge position of the scanning point further comprises: and acquiring the encoder delay of the servo system and the moving speed of the manipulator, and compensating the first edge position and the second edge position according to the encoder delay and the moving speed of the manipulator.
13. The method as claimed in claim 1, wherein before the first edge position of the scanning point of the wafer edge is scanned by the capturing sensor, the method further comprises: calibrating a detection error of the sensor;
the calibrating detection errors of the sensor comprises:
detecting the position of a calibration point on the wafer by using the sensor to obtain a coordinate to be calibrated of the calibration point;
detecting the position of the calibration point by using a calibration tool to obtain the actual coordinates of the calibration point;
calculating the coordinate relation between the coordinate to be calibrated of the calibration point and the actual coordinate to obtain a position error value of the calibration point;
and compensating the detection error according to the position error value.
14. The method as claimed in claim 13, wherein before compensating the detection error according to the position error value, the method further comprises:
establishing a linear relation between the coordinates to be calibrated of the calibration points and the position error values of the calibration points, wherein the number of the calibration points is at least 2, and the calibration points are arranged at intervals;
and obtaining a position error value of an intermediate point between the calibration points according to the linear relation.
15. The method as claimed in claim 13, wherein the calibration point is a center of the wafer.
CN202211520140.2A 2022-11-30 2022-11-30 Wafer offset detection method Pending CN115763317A (en)

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CN115763317A true CN115763317A (en) 2023-03-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116525482A (en) * 2023-06-28 2023-08-01 东莞市兆恒机械有限公司 Method for calibrating semiconductor detection equipment
CN116705670A (en) * 2023-08-07 2023-09-05 拉普拉斯新能源科技股份有限公司 Grabbing method and device for height Wen Zhou

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116525482A (en) * 2023-06-28 2023-08-01 东莞市兆恒机械有限公司 Method for calibrating semiconductor detection equipment
CN116525482B (en) * 2023-06-28 2024-01-05 广东兆恒智能科技有限公司 Method for calibrating semiconductor detection equipment
CN116705670A (en) * 2023-08-07 2023-09-05 拉普拉斯新能源科技股份有限公司 Grabbing method and device for height Wen Zhou
CN116705670B (en) * 2023-08-07 2024-01-02 拉普拉斯新能源科技股份有限公司 Grabbing method and device for height Wen Zhou

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