CN117524964B - Method and system for detecting and correcting wafer center offset in conveying process - Google Patents
Method and system for detecting and correcting wafer center offset in conveying process Download PDFInfo
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Abstract
The invention discloses a method and a system for detecting and correcting wafer center offset in a conveying process, which belong to the technical field of wafer manufacturing detection and correction, and specifically comprise the following steps: the method comprises the steps of taking the center of a circle of the initial position of a wafer chassis as an origin, establishing a rectangular coordinate system, detecting the movement position information of the wafer by using a calibration sensor in the transmission process, calculating the theoretical position of the calibration sensor, judging that the center of the wafer deviates in the transmission process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor, calculating the deviation amount of the center of the wafer in the transmission process, identifying the notch position of the wafer, automatically adjusting the position of the wafer, and correcting the deviation.
Description
Technical Field
The invention belongs to the technical field of wafer manufacturing detection and correction, and particularly relates to a method and a system for detecting and correcting wafer center offset in a conveying process.
Background
Along with the continuous improvement of the wafer manufacturing process, the requirement on the wafer detection Alignment precision is higher and higher in the manufacturing process, and the problem that the defect position cannot be accurately positioned, the problems of feeding and discharging collision, clamping failure and the like are caused by the fact that the circle center position is deviated or the Alignment precision is insufficient in the wafer manufacturing process, so that Alignment or more precise adjustment is required in the transfer process, and the transfer device can be adjusted according to the calculated deviation position difference, so that the transfer device can maintain a good Alignment (Alignment) state or meet the higher precision requirement.
The prior art generally has the following treatment modes: (1) Acquiring an edge area image by matching with a set of vision system, acquiring edge information, and fitting a circle by adopting a least square method, wherein the calculation accuracy is inaccurate due to the reasons of edge information deficiency (such as a gap or an irregular shape) or distortion (such as inclination) and the like; (2) A plurality of measuring nodes are distributed on the periphery, each node is inherently provided with a specific angle and measures round edge information, then the maximum and minimum values are found, and a trigonometric function is fitted, so that the center of a circle is offset, but because the data acquisition resolution of the multi-measuring node method is limited, a complete mathematical model is not available, only the offset distance can be obtained, the offset angle can not be accurately obtained, and meanwhile, all measuring data can not be used, so that the measuring precision is not high. (3) Through the multi-sensor fusion method, high-precision and low-precision image acquisition systems are adopted, the low-precision systems are firstly adopted to adjust the high-precision range, then calculation is carried out through higher precision, and the double-setting method is adopted to improve the measurement precision. However, the process is complex, and a low-precision image system is redundant on the premise of meeting the required image field of view, and the measurement time is increased.
The patent application publication No. CN115763317A discloses a wafer offset detection method, which comprises the following steps: acquiring a first edge position of a scanning point, which is scanned by a sensor to the edge of the wafer, and generating a first scanning signal when the sensor scans to the scanning point; obtaining a first distance between the position of the manipulator and the second position when the first scanning signal is generated; obtaining a second edge position of the scanning point when the manipulator is located at the second position through the first edge position and the first distance; obtaining an offset circle center position when the wafer is offset through the second edge position and the radius of the wafer; the offset of the wafer is obtained through the position relation between the offset circle center position and the reference circle center position, and a centering unit is not required to be arranged in the equipment, so that the step of transporting the wafer to the centering unit is avoided, and the process efficiency is further improved.
The patent with the application publication number of CN114203575A discloses a wafer offset detection device, a wafer offset detection method and an etching system, belongs to the technical field of semiconductors, and solves the problem that the existing detection device cannot automatically correct wafer offset. The detection device comprises: a main control system computer for receiving the wafer image from the digital camera in real time during the etching process; comparing the reference image with the current image and judging whether the wafer is misplaced or not according to the comparison result; when the wafers are misplaced, obtaining deviation data according to a comparison result, wherein the deviation data comprises the deviation magnitude between the first wafer position in the reference image and the second wafer position in the current image and the deviation direction corresponding to the deviation; and a wafer adjustment unit for receiving the deviation data from the main control system computer and automatically adjusting the wafer according to the deviation data so as to realign the misplaced wafer. The wafer is automatically adjusted according to the deviation data to realign the wafer without stopping the process.
Problems with the above patents: the offset of the wafer cannot be accurately calculated, and the situation that the edge of the wafer has a gap is not considered, so that correction cannot be accurately performed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method and a system for detecting and correcting the center offset of a wafer in the conveying process, which take the center of a circle at the initial position of a wafer chassis as an origin, establish a rectangular coordinate system, use a calibration sensor to detect the movement position information of the wafer in the conveying process, calculate the theoretical position of the calibration sensor, judge the offset of the center of the wafer in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor, calculate the offset of the center of the wafer in the conveying process, identify the notch position of the wafer, automatically adjust the position of the wafer, correct the offset, calculate the center offset by accurately deducing a center offset formula, calculate the offset of the center of the circle by considering that the wafer has a notch, and greatly improve the accuracy of calculating the offset and the correction accuracy of the offset when the wafer with the defect is conveyed.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a method for detecting and correcting wafer center offset in a conveying process specifically comprises the following steps:
step S1: establishing a rectangular coordinate system by taking the center of a circle of the initial position of the wafer chassis as an origin;
step S2: in the transmission process, detecting the movement position information of the wafer by using a calibration sensor, and calculating the theoretical position of the calibration sensor;
step S3: judging that the center of the wafer deviates in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
step S4: calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer, and correcting the offset.
Specifically, the specific steps of the step S2 are as follows:
step S201: setting the coordinates of the actual position point B of the calibration sensor asCarrying out first transmission movement on the wafer to the direction of the position point B of the calibration sensor, and recording the position point +_ of the center of the wafer when the wafer bottom disc contacts the calibration sensor for the first time>Is +.>；
Step S202: continuing the second transfer movement of the wafer in the direction of the first transfer movement, and recording the position point of the center of the wafer when the wafer bottom disc leaves the calibration sensorIs +.>；
Step S203: setting upAnd->Is A, the coordinates of point A are +.>Straight line->Is 2L +.>The length of the straight line AB is H, +.>Wherein R represents the radius of the wafer chassis;
step S204: straight lineIs +.>，/>The direction vector of the straight line AB is +.>，/>Calculating the theoretical position of the calibration sensor +.>Is used for the purpose of determining the coordinates of (a),，/>；
step S205: taking outAnd->Is the nominal sensor theoretical position +.>Is defined by the coordinates of (a).
Specifically, the radius R of the wafer chassis in step S202 is a variable.
Specifically, the method for determining that the wafer center is shifted in the transfer process in step S3 includes: the coordinates of the actual position point B of the calibration sensorAnd calibrating the sensor theory position +.>Coordinates of->And comparing, and if the positions of the coordinate points are inconsistent, judging that the wafer is deviated in the conveying process.
Step S4, calculating precondition constraint conditions of the wafer offset: 1) The wafer is in a standard round shape; 2) The sensor triggers an absolute cartesian position accuracy of 50 microns; 3) When the sensor is triggered, the edge of the wafer is tangent to the sensor point.
Specifically, the specific steps of the step S4 are as follows:
step S401: setting Cartesian coordinates corresponding to 4 sensor trigger points of a wafer in the conveying process as、/>、And->The Cartesian coordinates of the calibration sensor are +.>And->The wafer has a deviation vector of +.>The 4 sensor trigger points of the wafer in the conveying process meet the following conditions: />，/>，/>，R represents the radius of the wafer chassis;
step S402: the conditions met by the trigger points of the 4 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
，
，
，
which is provided withIn (I)>Representing a matrix multiplication function;
step S403: setting a matrix M and a matrix V, wherein the matrix，Calculating the deviation vector of the wafer>The calculation formula is as follows:wherein->Representing an inverse trigonometric function, < >>Representing a dimension conversion function, converting two dimension dimensions of the matrix;
step S404: when the wafer bottom is placed in the notch and a notch exists at the position of the trigger point of the sensor, the size of the notch is considered, and the deviation vector of the wafer is recalculated to beAnd automatically adjusting the wafer position to correct the offset.
Specifically, the specific steps of step S404 are as follows:
step S4041: setting the precision threshold value asWhen the modulus of the error vector is not greater than the accuracy threshold +.>The wafer has a deviation vector of +>When the modulus of the error vector is larger than the accuracy threshold +.>Judging +.>，/>，And->Wherein->Representing vector modulo functions, setting
The corresponding points are notch points, and the notch points are removed;
step S4042: setting upFor notch points, after the notch points are removed, the conditions met by the trigger points of the 3 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
；
step S4043: calculating a wafer offset vectorAnd automatically adjusting the wafer position to correct the offset.
Specifically, the error vector in step S4041 is:。
a system for wafer center offset detection and correction during transfer, comprising: the system comprises a coordinate system building module, a sensor theoretical position calculating module, an offset judging module and an offset correcting module;
the coordinate system establishment module is used for establishing a rectangular coordinate system by taking the center of the circle of the initial position of the wafer bottom disc as the origin;
the sensor theoretical position calculation module is used for detecting the movement position information of the wafer by using the calibration sensor in the transmission process and calculating the theoretical position of the calibration sensor;
the offset judging module is used for judging that the center of the wafer is offset in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
the offset correction module is used for calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer and correcting the offset.
Specifically, the offset correction module comprises a wafer notch identification unit, a wafer offset amount calculation unit containing a notch and an offset correction unit;
the wafer notch identification unit is used for identifying the notch of the wafer;
the wafer offset amount calculating unit is used for calculating the offset amount of the wafer with the notch in the conveying process;
the offset correction unit is used for correcting the offset of the wafer in the conveying process.
An electronic device comprising a memory storing a computer program and a processor implementing steps of a method of wafer center offset detection and correction during transfer when the computer program is executed.
A computer readable storage medium having stored thereon computer instructions which when executed perform the steps of a method of wafer center offset detection and correction during transfer.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a system for detecting and correcting wafer center offset in a conveying process, which is optimized and improved in terms of architecture, operation steps and flow, and has the advantages of simple flow, low investment and operation cost and low production and working cost.
2. The invention provides a method for detecting and correcting the center offset of a wafer in the conveying process, which takes the center of a circle at the initial position of a wafer chassis as an origin, establishes a rectangular coordinate system, uses a calibration sensor to detect the movement position information of the wafer in the conveying process, calculates the theoretical position of the calibration sensor, judges the offset of the center of the wafer in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor, calculates the offset of the center of the wafer in the conveying process, identifies the notch position of the wafer, automatically adjusts the position of the wafer, corrects the offset, obtains the center offset by accurately deducing a center offset formula, calculates the offset of the wafer with defects in consideration of the existence of gaps of the wafer in the conveying process, and greatly improves the accuracy of calculating the offset and the accuracy of correction.
Drawings
FIG. 1 is a flow chart of a method for detecting and correcting wafer center offset during a transfer process according to the present invention;
FIG. 2 is a diagram of a method for detecting and correcting wafer center offset during a transfer process according to the present invention;
FIG. 3 is a schematic diagram illustrating a method for detecting and correcting wafer center offset during a transfer process according to the present invention;
FIG. 4 is a diagram of a system for wafer center offset detection and correction during transfer in accordance with the present invention;
FIG. 5 is a diagram of an electronic device for detecting and correcting wafer center offset during a transfer process according to the present invention.
Detailed Description
In order that the technical means, the creation characteristics, the achievement of the objects and the effects of the present invention may be easily understood, it should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "a", "an", "the" and "the" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The invention is further described below in conjunction with the detailed description.
Example 1
Referring to fig. 1-3, an embodiment of the present invention is provided: a method for detecting and correcting wafer center offset in a conveying process specifically comprises the following steps:
step S1: establishing a rectangular coordinate system by taking the center of a circle of the initial position of the wafer chassis as an origin;
step S2: in the transmission process, detecting the movement position information of the wafer by using a calibration sensor, and calculating the theoretical position of the calibration sensor;
step S3: judging that the center of the wafer deviates in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
step S4: calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer, and correcting the offset.
The specific steps of the step S2 are as follows:
step S201: setting the coordinates of the actual position point B of the calibration sensor asThe wafer is conveyed for the first time to the direction of the position point B of the calibration sensor, when the wafer bottom disc is contacted with the sensor for the first timeWhen calibrating the sensor, the position point of the wafer center is recorded +.>Is +.>；
Step S202: continuing the second transfer movement of the wafer in the direction of the first transfer movement, and recording the position point of the center of the wafer when the wafer bottom disc leaves the calibration sensorIs +.>；
Step S203: setting upAnd->Is A, the coordinates of point A are +.>Straight line->Is 2L +.>The length of the straight line AB is H, +.>Wherein R represents the radius of the wafer chassis;
step S204: straight lineIs +.>，/>The direction vector of the straight line AB is +.>，/>Calculating the theoretical position of the calibration sensor +.>Is used for the purpose of determining the coordinates of (a),，/>；
step S205: taking outAnd->Is the nominal sensor theoretical position +.>Is defined by the coordinates of (a).
The radius R of the wafer chassis in step S202 is a variable.
In step S3, the method for determining that the wafer center is shifted in the transfer process includes: the coordinates of the actual position point B of the calibration sensorAnd calibrating the sensor theory position +.>Coordinates of->And comparing, and if the positions of the coordinate points are inconsistent, judging that the wafer is deviated in the conveying process.
The specific steps of the step S4 are as follows:
step S401: setting Cartesian coordinates corresponding to 4 sensor trigger points of a wafer in the conveying process as、/>、And->The Cartesian coordinates of the calibration sensor are +.>And->The wafer has a deviation vector of +.>The 4 sensor trigger points of the wafer in the conveying process meet the following conditions: />，/>，/>，R represents the radius of the wafer chassis;
step S402: the conditions met by the trigger points of the 4 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
，
，
，
wherein->Representing a matrix multiplication function;
step S403: setting a matrix M and a matrix V, wherein the matrix，Calculating the deviation vector of the wafer>The calculation formula is as follows:wherein->Representing an inverse trigonometric function, < >>Representing a dimension conversion function, converting two dimension dimensions of the matrix;
step S404: when the wafer bottom is placed in the notch and a notch exists at the position of the trigger point of the sensor, the size of the notch is considered, and the deviation vector of the wafer is recalculated to beAnd automatically adjusting the wafer position to correct the offset.
The automatic deviation correcting method for the wafer mainly comprises two methods: vision-based methods and machine-based methods 1) vision-based methods, in which an image of the wafer surface is taken by a camera and then the wafer offset is calculated by an image processing algorithm. The method has the advantages that non-contact type wafer deviation correction can be realized, and the surface of the wafer is not damaged. However, this approach has high requirements for illumination conditions and reflectivity of the wafer surface, and may not work well for some specially shaped wafers, such as non-circular wafers; 2) The mechanical-based method is to move the wafer by a mechanical arm or a manipulator, thereby realizing the correction of the wafer. The method has the advantages of being applicable to wafers with various shapes, and having low requirements on illumination conditions and reflectivity of the surfaces of the wafers. However, this method requires a contact operation, and may damage the wafer surface.
The wafer automatic deviation rectifying process mainly comprises the following steps: 1) The wafer positioning is performed by first placing the wafer on a positioning table and positioning the wafer to a correct position by a robot arm or a manipulator. In vision-based methods, it is necessary to take an image of the wafer surface by a camera and then calculate the position of the wafer by an image processing algorithm; 2) Wafer scanning, in which vision-based methods require scanning the wafer surface with a camera to obtain an image of the wafer surface. In the mechanical-based method, a wafer needs to be moved to a scanning position by a mechanical arm or a mechanical hand, and information on the surface of the wafer is acquired by a sensor; 3) And correcting the deviation of the wafer, and after the information on the surface of the wafer is acquired, calculating the deviation of the wafer through an algorithm, and moving the wafer to a correct position through a mechanical arm or a mechanical arm. In vision-based methods, the wafer offset needs to be calculated by an image processing algorithm. In a mechanical-based approach, the wafer needs to be moved by a robot arm or hand; 4) And detecting the wafer, namely detecting the wafer after the correction of the wafer is completed, and ensuring the accurate position of the wafer. In vision-based methods, the wafer surface needs to be scanned again to detect if the wafer is positioned correctly. In a mechanical-based approach, it is necessary to detect whether the wafer position is correct by a sensor; 5) And placing the wafer, wherein after the wafer detection is completed, the wafer needs to be placed at a position of the next processing.
The specific steps of step S404 are:
step S4041: setting the precision threshold value asWhen the modulus of the error vector is not greater than the accuracy threshold +.>The wafer has a deviation vector of +>When the modulus of the error vector is larger than the accuracy threshold +.>Judging +.>，/>，And->Wherein->Representing vector modulo functions, setting
The corresponding points are notch points, and the notch points are removed;
step S4042: setting upFor notch points, after the notch points are removed, the conditions met by the trigger points of the 3 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
；
step S4043: calculating a wafer offset vectorAnd automatically adjusting the wafer position to correct the offset.
Setting matrixSum matrix->Wherein matrix->，Calculating a wafer offset vectorThe calculation formula is as follows:
wherein->Representing an inverse trigonometric function, < >>Representing a dimensional transformation function, transforming the two dimensional dimensions of the matrix.
The error vector in step S4041 is:。
example 2
Referring to fig. 4, another embodiment of the present invention is provided: a system for wafer center offset detection and correction during transfer, comprising: the system comprises a coordinate system building module, a sensor theoretical position calculating module, an offset judging module and an offset correcting module;
the coordinate system establishment module is used for establishing a rectangular coordinate system by taking the center of the circle of the initial position of the wafer bottom disc as the origin;
the sensor theoretical position calculation module is used for detecting the movement position information of the wafer by using the calibration sensor in the transmission process and calculating the theoretical position of the calibration sensor;
the offset judging module is used for judging that the center of the wafer is offset in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
the offset correction module is used for calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer and correcting the offset.
The offset correction module comprises a wafer notch identification unit, a wafer offset calculation unit containing a notch and an offset correction unit;
the wafer notch identification unit is used for identifying the notch of the wafer;
the wafer offset amount calculating unit is used for calculating the offset amount of the wafer with the notch in the conveying process;
the offset correction unit is used for correcting the offset of the wafer in the conveying process.
Example 3
Referring to fig. 5, an electronic device includes a memory and a processor, wherein the memory stores a computer program, and the processor implements steps of a method for detecting and correcting wafer center offset during a transfer process when executing the computer program.
A computer readable storage medium having stored thereon computer instructions which when executed perform the steps of a method of wafer center offset detection and correction during transfer.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the protection of the present invention.
Finally: the foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (8)
1. The method for detecting and correcting the wafer center offset in the transmission process is characterized by comprising the following steps of:
step S1: establishing a rectangular coordinate system by taking the center of a circle of the initial position of the wafer chassis as an origin;
step S2: in the transmission process, detecting the movement position information of the wafer by using a calibration sensor, and calculating the theoretical position of the calibration sensor;
step S3: judging that the center of the wafer deviates in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
step S4: calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer, and correcting the offset;
the specific steps of the step S4 are as follows:
step S401: setting Cartesian coordinates corresponding to 4 sensor trigger points of a wafer in the conveying process as、/>、/>And->The Cartesian coordinates of the calibration sensor are +.>And->The wafer has a deviation vector of +.>The 4 sensor trigger points of the wafer in the conveying process meet the following conditions: />，/>，/>，R represents the radius of the wafer chassis;
step S402: the conditions met by the trigger points of the 4 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
，
，
，
wherein->Representing a matrix multiplication function;
step S403: setting a matrix M and a matrix V, wherein the matrix，Calculating the deviation vector of the wafer>The calculation formula is as follows:wherein->Representing an inverse trigonometric function, < >>Representing a dimension conversion function, converting two dimension dimensions of the matrix;
step S404: when the wafer bottom is placed in the notch and a notch exists at the position of the trigger point of the sensor, the size of the notch is considered, and the deviation vector of the wafer is recalculated to beAnd automatically adjusting the position of the wafer to correct the offset;
the specific steps of the step S404 are as follows:
step S4041: setting the precision threshold value asWhen the modulus of the error vector is not greater than the accuracy threshold +.>The wafer has a deviation vector of +>When the modulus of the error vector is larger than the accuracy threshold +.>Judging +.>，/>，And->Wherein->Representing vector modulo functions, setting
The corresponding points are notch points, and the notch points are removed;
step S4042: setting upFor notch points, after the notch points are removed, the conditions met by the trigger points of the 3 sensors in the wafer conveying process are modified, and the modified equation formula is as follows:
，
，
；
step S4043: calculating a wafer offset vectorAnd automatically adjusting the position of the wafer to correct the offset;
the error vector in step S4041 is:。
2. the method for detecting and correcting wafer center shift in a transfer process according to claim 1, wherein the specific steps of step S2 are as follows:
step S201: setting the coordinates of the actual position point B of the calibration sensor asThe wafer is directed to the position of the calibration sensorThe first transfer movement is performed in the direction of the setpoint B, when the wafer bottom disk contacts the calibration sensor for the first time, recording the position point of the wafer center at the moment>Is +.>；
Step S202: continuing the second transfer movement of the wafer in the direction of the first transfer movement, and recording the position point of the center of the wafer when the wafer bottom disc leaves the calibration sensorIs +.>；
Step S203: setting upAnd->Is A, the coordinates of point A are +.>Straight line->Is 2L +.>The length of the straight line AB is H, +.>Wherein R represents the radius of the wafer chassis;
step S204: straight lineIs +.>，/>The direction vector of the straight line AB is +.>，/>Calculating the theoretical position of the calibration sensor +.>Is used for the purpose of determining the coordinates of (a),，/>；
step S205: taking outAnd->Is the nominal sensor theoretical position +.>Is defined by the coordinates of (a).
3. The method of claim 2, wherein the radius R of the wafer chassis in step S202 is a variable.
4. The method for detecting and correcting wafer center shift in a transfer process as claimed in claim 3, wherein the step S3 is to determine the waferThe method for offsetting the center of the circle in the transmission process comprises the following steps: the coordinates of the actual position point B of the calibration sensorAnd calibrating the sensor theory position +.>Coordinates of->And comparing, and if the positions of the coordinate points are inconsistent, judging that the wafer is deviated in the conveying process.
5. A system for transfer process wafer center offset detection and correction based on a method of transfer process wafer center offset detection and correction as claimed in any one of claims 1-4, comprising: the system comprises a coordinate system building module, a sensor theoretical position calculating module, an offset judging module and an offset correcting module;
the coordinate system establishment module is used for establishing a rectangular coordinate system by taking the center of the circle of the initial position of the wafer bottom disc as the origin;
the sensor theoretical position calculation module is used for detecting the movement position information of the wafer by using the calibration sensor in the transmission process and calculating the theoretical position of the calibration sensor;
the offset judging module is used for judging that the center of the wafer is offset in the conveying process according to the calculated theoretical position of the calibration sensor and the actual position of the calibration sensor;
the offset correction module is used for calculating the offset of the wafer center in the conveying process, identifying the position of the wafer notch, automatically adjusting the position of the wafer and correcting the offset.
6. The system for detecting and correcting wafer center offset during transfer as claimed in claim 5, wherein the offset correction module comprises a wafer gap identification unit, a wafer offset calculation unit with a gap, and an offset correction unit;
the wafer notch identification unit is used for identifying the notch of the wafer;
the wafer offset amount calculating unit is used for calculating the offset amount of the wafer with the notch in the conveying process;
the offset correction unit is used for correcting the offset of the wafer in the conveying process.
7. An electronic device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, carries out the steps of a method of wafer center offset detection and correction in a transfer process according to any one of claims 1-4.
8. A computer readable storage medium having stored thereon computer instructions which when executed perform the steps of a method of transfer process wafer center offset detection and correction as claimed in any one of claims 1 to 4.
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| CN105655266A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | DSP-based wafer eccentricity online detection apparatus and method |
| CN112775956A (en) * | 2019-11-08 | 2021-05-11 | 沈阳新松机器人自动化股份有限公司 | Implementation method of AWC (automatic guided wave control) deviation correcting system of manipulator |
| CN113380686A (en) * | 2021-05-18 | 2021-09-10 | 沈阳芯源微电子设备股份有限公司 | Automatic wafer centering method |
| CN116572236A (en) * | 2023-04-26 | 2023-08-11 | 深圳众为兴技术股份有限公司 | Wafer dynamic deviation correcting method and device and computer equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105655266A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | DSP-based wafer eccentricity online detection apparatus and method |
| CN112775956A (en) * | 2019-11-08 | 2021-05-11 | 沈阳新松机器人自动化股份有限公司 | Implementation method of AWC (automatic guided wave control) deviation correcting system of manipulator |
| CN113380686A (en) * | 2021-05-18 | 2021-09-10 | 沈阳芯源微电子设备股份有限公司 | Automatic wafer centering method |
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