CN108288593B - Multi-size compatible automatic device for detecting thickness of LED and detection method thereof - Google Patents
Multi-size compatible automatic device for detecting thickness of LED and detection method thereof Download PDFInfo
- Publication number
- CN108288593B CN108288593B CN201810321347.4A CN201810321347A CN108288593B CN 108288593 B CN108288593 B CN 108288593B CN 201810321347 A CN201810321347 A CN 201810321347A CN 108288593 B CN108288593 B CN 108288593B
- Authority
- CN
- China
- Prior art keywords
- wafer
- wafer box
- inch
- manipulator
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 80
- 235000012431 wafers Nutrition 0.000 claims abstract description 268
- 239000004579 marble Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000004458 analytical method Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 4
- 230000007812 deficiency Effects 0.000 claims description 3
- 238000007667 floating Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic device for detecting the thickness of a multi-size compatible LED (light emitting diode), which comprises a wafer box warehouse, a manipulator, a prealignment platform and a marble Dan Qi floating platform, wherein the wafer box warehouse is arranged on one side of the manipulator, and the prealignment platform is arranged on the other side of the manipulator and at a position which forms ninety degrees with the wafer box warehouse; according to the invention, as 12 wafer libraries and the method of grabbing and placing the wafers by the mechanical arm are adopted, compared with the prior manual wafer placement method, the single-chip detection method has the advantage that the detection efficiency is greatly improved; the prealignment platform part is added before final detection, so that the placement and positioning precision of the wafer is far higher than that of manual placement, and the detection precision is greatly improved; compared with the traditional mechanical detection platform, the detection platform has the advantage that the detection precision is greatly improved due to the fact that the marble air-floating platform is adopted by the detection platform.
Description
Technical Field
The invention belongs to the technical field of LED thickness detection equipment, and particularly relates to multi-size compatible automatic equipment for LED thickness detection and a detection method thereof.
Background
With the rapid development of the domestic semiconductor industry in recent years, the demand of wafers, which are silicon chips used for manufacturing silicon semiconductor integrated circuits, is greatly increased, and the sizes of the wafers can be divided into 2 inches, 4 inches, 6 inches, 8 inches, 12 inches and the like according to the diameters; in the wafer production process, a series of processes such as cutting, grinding, polishing and the like are performed, and the thickness of the wafer has an important influence on the subsequent processing and production, so that the thickness detection of the wafer is necessary after each process of production.
In the current industry, the inspection equipment is manually mounted, the inspection efficiency is low, and the ever-increasing wafer yield cannot be met, so that the automatic wafer thickness inspection equipment is particularly necessary to meet the yield.
Disclosure of Invention
To solve the problems set forth in the background art. The invention provides an automatic device for detecting the thickness of a multi-size compatible LED and a detection method thereof, and the automatic device has the characteristics of capability of detecting wafers with different specifications, high detection precision and greatly improved detection efficiency.
The invention further aims to provide a detection method of the automatic equipment for detecting the thickness of the LED with multiple compatible sizes.
In order to achieve the above purpose, the present invention provides the following technical solutions: the automatic equipment for detecting the thickness of the LED with the multiple compatible sizes comprises a wafer box warehouse, a manipulator, a prealignment platform and a marble Dan Qi floating platform, wherein the wafer box warehouse is arranged on one side of the manipulator, the prealignment platform is arranged on the other side of the manipulator and at a position of ninety degrees with the wafer box warehouse, and the marble floating platform is arranged on one side, away from the wafer box warehouse, of the manipulator;
the wafer box storage is internally provided with twelve wafer box adapters, the twelve wafer box adapters are divided into an upper layer and a lower layer, one side of each wafer box adapter is provided with a second sensor, the bottom of each second sensor, which is close to the wafer box adapter, is provided with a first sensor, and a 2-inch wafer box or a 4-inch wafer box is arranged above each wafer box adapter;
one side of the manipulator is provided with a manipulator L-axis arm, the other side of the manipulator is provided with a manipulator R-axis arm, one sides of the manipulator R-axis arm and the L-axis arm are both provided with grabbing hands, the other side of the manipulator R-axis arm and the L-axis arm which are common is provided with a manipulator Z-axis arm, and the tail end of the manipulator L-axis arm is provided with a third sensor;
one side of the pre-alignment platform is provided with a CCD detector, and the other side of the pre-alignment platform is provided with an adjusting platform;
the marble air bearing table is characterized in that a thickness detection sensor is arranged at the middle position of the marble air bearing table, the upper part and the lower part are concentrically arranged, and a 2-inch and 4-inch compatible detection carrier movement table is arranged at the middle position of the two thickness detection sensors.
In the invention, the wafer box library, the pre-alignment platform and the marble air floatation table are all arranged on circles with different radiuses and taking the Z-axis arm of the manipulator as the circle center.
Further in the present invention, the cassette adapter is compatible with 2 inch cassettes and 4 inch cassettes.
In the invention, the adjusting table is composed of three moving shafts, wherein the three moving shafts are respectively a horizontal linear moving shaft X, a vertical linear moving shaft Z and a rotating shaft R.
In the present invention, further, the two thickness detection sensors can be finely tuned in the vertical direction.
In the invention, the detection stage can do X and Y two-dimensional motion on the horizontal plane.
In the invention, the method for detecting the thickness of the LED with multiple compatible sizes by using the automatic equipment mainly comprises the following steps:
(1) Placing a wafer box: placing a 2 inch wafer cassette or a 4 inch wafer cassette into a wafer cassette adapter in a wafer cassette library by an operator;
(2) Detecting whether a wafer box exists or not: the wafer box adapter is provided with a first sensor, can automatically detect whether a 2-inch wafer box or a 4-inch wafer box exists in the library, can automatically identify and distinguish whether an operator is put into the 2-inch wafer box or the 4-inch wafer box, and can only be put into operation when the first sensor detects the 2-inch wafer box or the 4-inch wafer box;
(3) Wafer tab detection: the second sensor can detect whether the wafer in the wafer box has a lug phenomenon, if the lug phenomenon occurs, the system can send out an alarm to remind an operator of correctly placing the wafer in the 2-inch wafer box or the 4-inch wafer box, and then the detection operation can be continued;
(4) Wafer position serial number detection: before grabbing the wafer, the manipulator scans the wafer box in the wafer box adapter by using a third sensor installed by the manipulator, records the position serial number of the wafer existing in the current 2-inch wafer box or 4-inch wafer box, and skips directly when the wafer is detected to be missing, so that time is saved;
(5) Wafer first transport: after the scanning is finished, grabbing the wafer by utilizing a grabbing hand according to a scanning result, and transmitting the wafer to an adjusting table of a pre-alignment platform to prepare for aligning the circle center and the edge of the wafer;
(6) Wafer alignment: firstly, an adjusting table adsorbs a wafer by vacuum, a rotating shaft R of the adjusting table rotates, at the moment, a CCD detector scans and detects the edge of the wafer, the error of the circle center and the edge defect of the wafer is judged, after error data are obtained, the circle center of the wafer is adjusted to be concentric by matching an X axis and a Z axis of the adjusting table, and the edge defect of the wafer is rotated to the same preset angle;
(7) And carrying out second transportation of the wafer: the manipulator uses the grabbing hand to remove the wafer with the circle center and the edge deficiency adjusted, and sends the wafer to the detection objective table of the marble air bearing table for thickness detection;
(8) And (3) detecting the thickness of the wafer: the detection object carrying moving table carries the wafer to perform two-dimensional motion in the X direction and the Y direction according to a preset program of an operator, the thickness detection sensor performs array scanning on the wafer on the detection object stage in the process to acquire data, and a series of important results such as TTV, BOW, WARP, LTV are obtained through analysis;
(9) Third transportation of the wafer: after the detection is finished, the manipulator sends the detected wafer back to a 2-inch wafer box or a 4-inch wafer box in the wafer box library by utilizing a grabbing hand;
(10) Repeating the steps of: repeating the four steps until the wafers to be detected in the whole wafer box warehouse are completely detected.
In the invention, the wafer box library, the prealignment platform and the marble air floatation table are all arranged on circles with different radiuses and taking a Z-axis arm of the manipulator as a circle center; the cassette adapter is compatible with 2 inch cassettes and 4 inch cassettes; the adjusting table consists of three moving shafts, wherein the three moving shafts are respectively a horizontal linear moving shaft X, a vertical linear moving shaft Z and a rotating shaft R; the two detection object stages are matched for use, and the two detection object stages can be finely adjusted in the vertical direction; the detection object stage can do X and Y two-dimensional motion on the horizontal plane.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, as the 12 wafer libraries and the method for grabbing and placing the wafers by the mechanical arm are adopted, compared with the prior manual wafer placement method, the single-chip detection method has the advantage that the detection efficiency is greatly improved.
2. The pre-alignment platform part is added before final detection, so that the placement and positioning precision of the wafer is far higher than that of manual placement, and the detection precision is greatly improved.
3. Compared with the traditional mechanical detection platform, the detection platform has the advantage that the detection precision is greatly improved due to the fact that the marble air-floating platform is adopted by the detection platform.
4. The invention is perfectly compatible with 2-inch and 4-inch wafers, can detect 2-specification wafers under the condition that the equipment is not changed at the later stage, and greatly saves the cost.
Drawings
FIG. 1 is a schematic view of the overall construction of the apparatus of the present invention;
FIG. 2 is a schematic view of a wafer cassette library according to the present invention;
FIG. 3-1 is a schematic view of the wafer cassette adapter (with a 2 inch wafer cassette positioned) of the present invention;
FIG. 3-2 is a schematic view of the wafer cassette adapter of the present invention (with a 4 inch wafer cassette positioned therein);
FIG. 4 is a schematic view of a manipulator according to the present invention;
FIG. 5 is a schematic view of the pre-alignment stage of the present invention;
FIG. 6 is a schematic view of a marble air bearing table according to the present invention;
in the figure: 1. a wafer cassette library; 11. a wafer cassette adapter; 12. a 4 inch wafer cassette; 13. a first sensor; 14. a second sensor; 15. 2 inch wafer cassette 2, robot; 21. grabbing hands; 22. a manipulator L-shaped shaft arm; 23. a third sensor; 24. a manipulator Z-axis arm; 25. a mechanical arm R shaft arm; 3. pre-aligning the platform; 31. a CCD detector; 32. an adjusting table; 4. a marble air floatation table; 41. a thickness detection sensor; 42. and detecting the objective table.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-6, the present invention provides the following technical solutions: the automatic equipment for detecting the thickness of the LED with the multiple-size compatibility comprises a wafer box warehouse 1, a manipulator 2, a pre-alignment platform 3 and a marble air floatation table 4, wherein the wafer box warehouse 1 is arranged on one side of the manipulator 2, the pre-alignment platform 3 is arranged on the other side of the manipulator 2 and at a ninety-degree position with the wafer box warehouse 1, and the marble air floatation table 4 is arranged on one side, away from the wafer box warehouse 1, of the manipulator 2;
the wafer box storage 1 is internally provided with twelve wafer box adapters 11, the twelve wafer box adapters 11 are divided into an upper layer and a lower layer, one side of the wafer box adapters 11 is provided with a second sensor 14, one side of the second sensor 14, which is close to the wafer box adapters 11, is provided with a first sensor 13, and a 2-inch wafer box 15 or a 4-inch wafer box 12 is arranged above the wafer box adapters 11;
a manipulator L-axis arm 22 is arranged on one side of the manipulator 2, a manipulator R-axis arm 25 is arranged on the other side of the manipulator 2, a grabbing hand 21 is arranged on one side of the manipulator R-axis arm 25, a manipulator Z-axis arm 24 is arranged on the other side of the manipulator R-axis arm 25, and a third sensor 23 is arranged at the tail end of the manipulator L-axis arm 22;
one side of the pre-alignment platform 3 is provided with a CCD detector 31, and the other side of the pre-alignment platform 3 is provided with an adjusting platform 32;
the marble air bearing table 4 is provided with a thickness detection sensor 41 in the middle position, and detection object tables 42 are symmetrically arranged on the upper side and the lower side of the thickness detection sensor 41 respectively.
In this embodiment, the wafer cassette library 1, the prealignment platform 3 and the marble air bearing table 4 are all mounted on circles with different radii with the manipulator Z-axis arm 24 as the center of a circle.
In this embodiment, the cassette adapter 11 is compatible with a 2 inch cassette 15 and a 4 inch cassette 12.
In the present embodiment, the adjustment table 32 is composed of three moving axes, which are a rectilinear moving axis X in the horizontal direction, a rectilinear moving axis Z in the vertical direction, and a rotation axis R, respectively.
In this embodiment, the two thickness detection sensors can be finely tuned in the vertical direction.
In this embodiment, the detection stage 42 is capable of X, Y two-dimensional motion in a horizontal plane.
In this embodiment, the method for detecting the thickness of the LED with multiple dimensions and compatibility by using the automated equipment mainly includes the following steps:
(1) Placing a wafer box: the operator places the 2 inch cassette 15 or the 4 inch cassette 12 into the cassette adapter 11 in the cassette library 1;
(2) Detecting whether a wafer box exists or not: the first sensor 13 is installed in the wafer box adapter 11, so that whether the 2-inch wafer box 15 or the 4-inch wafer box 12 exists in the library can be automatically detected, the wafer box 12 with the 2-inch wafer box 15 or the 4-inch wafer box 12 which is put into the box by an operator can be automatically identified and distinguished, and the corresponding wafer box adapter 11 can only be put into operation when the first sensor 13 detects the 2-inch wafer box 15 or the 4-inch wafer box 12;
(3) Wafer tab detection: the second sensor 14 can detect whether the wafer in the wafer box 12 has a lug phenomenon, if the lug phenomenon occurs, the system can send out an alarm to remind an operator to correctly place the wafer in the 2-inch wafer box 15 or the 4-inch wafer box 12, so that the detection operation can be continued;
(4) Wafer position serial number detection: before grabbing the wafer, the manipulator 2 scans the 2 inch wafer box 15 or the 4 inch wafer box 12 in the wafer box adapter 11 by utilizing the third sensor 23 installed on the manipulator, records the position serial number of the wafer existing in the current 2 inch wafer box 15 or the 4 inch wafer box 12, and skips directly when the wafer is detected to be missing, so as to save time;
(5) Wafer first transport: after the scanning is completed, the wafer is grabbed by utilizing the grabbing hand 21 according to the scanning result and is transmitted to the adjusting table 32 of the prealignment platform 3, and the wafer is prepared for aligning the circle center and the edge lack;
(6) Wafer alignment: firstly, the adjusting table 32 adsorbs a wafer by vacuum, the rotating shaft R of the adjusting table rotates, at the moment, the CCD detector 31 scans and detects the edge of the wafer, the error of the circle center and the edge defect of the wafer is judged, after error data are obtained, the X axis and the Z axis of the adjusting table 32 are matched, the circle center of the wafer is adjusted to the rotating center of the adjusting table 32, the wafer is concentric, and the edge defect of the wafer is rotated to the same preset angle;
(7) And carrying out second transportation of the wafer: the manipulator 2 uses the grabbing hand 21 to remove the wafer with the circle center and the edge deficiency adjusted, and sends the wafer to the detection objective table 42 of the marble air bearing table 4 for thickness detection;
(8) And (3) detecting the thickness of the wafer: the detecting carrier moving table 42 carries the wafer to perform two-dimensional motion in the X and Y directions according to a preset motion track by an operator according to a preset program, in this process, the thickness detecting sensor 41 performs array scanning on the wafer on the detecting carrier 42 to obtain data, and finally a series of important results such as TTV, BOW, WARP, LTV are obtained through analysis;
(9) Third transportation of the wafer: after the detection is completed, the manipulator 2 sends the detected wafers back to the 2-inch wafer cassette 15 or the 4-inch wafer cassette 12 in the wafer cassette library 1 by utilizing the grabbing hand 21;
(10) Repeating the steps of: repeating the four steps until the wafers to be detected in the whole wafer cassette library 1 are completely detected.
In the embodiment, the wafer box warehouse 1, the prealignment platform 3 and the marble air floatation table 4 are all arranged on circles with different radiuses and taking the Z-axis arm 24 of the manipulator as the circle center; the cassette adapter 11 is compatible with a 2 inch cassette 15 and a 4 inch cassette 12; the adjusting table 32 is composed of three moving axes, wherein the three moving axes are respectively a horizontal linear moving axis X, a vertical linear moving axis Z and a rotating shaft R; the two thickness detection sensors can be finely adjusted in the vertical direction; the detection stage 42 is capable of X, Y two-dimensional motion in a horizontal plane.
The CCD detector 31 in the present invention is a known technology which is widely used and used in daily life, and its working principle is as follows: the charge coupled device stores signal charges generated by light or electric excitation, and when a pulse of a specific timing is applied thereto, the stored signal charges can be directionally transferred within the CCD, and the main problems of the CCD operation process are generation, storage, transfer, and detection of the signal charges.
The thickness detection sensor 41 of the present invention is a known technology which is widely used and used in daily life, and its working principle is as follows: the laser displacement sensor is adopted, the laser beam is used as a mechanical probe in contact measurement, and photoelectric conversion is realized by using a charge coupled device.
The working principle of the embodiment is as follows: the operator puts the 2-inch wafer box 15 or the 4-inch wafer box 12 into the wafer box adapter 11 in the wafer box warehouse 1, the wafer box adapter 11 is internally provided with the first sensor 13, whether the 2-inch wafer box 15 or the 4-inch wafer box 12 exists in the warehouse or not can be automatically detected, whether the 2-inch wafer box or the 4-inch wafer box 12 is put into the warehouse or not can be automatically identified and distinguished, and only when the first sensor 13 detects the 2-inch wafer box 15 or the 4-inch wafer box 12, the corresponding wafer box adapter 11 can be put into operation, the second sensor 14 can detect whether the wafer in the 2-inch wafer box 15 or the 4-inch wafer box 12 has a lug phenomenon, if the lug phenomenon occurs, the system can send an alarm to remind the operator to correctly place the wafer in the 2-inch wafer box 15 or the 4-inch wafer box 12, and the detection operation can be continued; before grabbing the wafer, the manipulator 2 scans the 2 inch wafer box 15 or the 4 inch wafer box 12 in the wafer box adapter 11 by utilizing the third sensor 23 installed on the manipulator, records the position serial number of the wafer existing in the current 2 inch wafer box 15 or the 4 inch wafer box 12, skips directly when the wafer is detected to be lack of the wafer, so as to save time, after the scanning is completed, the grabbing hand 21 is utilized to grab the wafer according to the scanning result, and the grabbing hand is transmitted to the adjusting table 32 of the prealignment platform 3, so that the alignment work of the circle center and the lack of the wafer is prepared; firstly, an adjusting table 32 adsorbs a wafer by vacuum, a rotating shaft R of the adjusting table rotates, at the moment, a CCD detector 31 scans and detects the edge of the wafer, the error of the circle center and the edge defect of the wafer is judged, after error data are obtained, the X axis and the Z axis of the adjusting table 32 are matched, the circle center of the wafer is adjusted to the rotating center of the adjusting table 32 to be concentric, the edge defect of the wafer is rotated to the same preset angle, finally, a manipulator 2 uses a grabbing hand 21 to remove the wafer with the circle center and the edge defect adjusted, and the wafer is sent to a detection object stage 42 of a marble air floatation table 4 for thickness detection; the detecting carrier moving table 42 carries wafers to perform two-dimensional motion in the X and Y directions according to a preset program of an operator and a preset motion track, in the process, the thickness detecting sensor 41 performs array scanning on the wafers on the detecting carrier 42 to acquire data, a series of important results such as TTV, BOW, WARP, LTV are obtained through analysis, and after detection, the manipulator 2 sends the detected wafers back to the 2-inch wafer boxes 15 or 4-inch wafer boxes 12 in the wafer box library 1 by using the grabbing hand 21; repeating the four steps until the wafers to be detected in the whole wafer cassette library 1 are completely detected.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an automation equipment that multi-size compatible LED thickness detected, includes wafer box storehouse (1), manipulator (2), prealignment platform (3) and marble air supporting platform (4), its characterized in that: a wafer box warehouse (1) is arranged on one side of the manipulator (2), a pre-alignment platform (3) is arranged on the other side of the manipulator (2) and at a position forming ninety degrees with the wafer box warehouse (1), and a marble air floatation table (4) is arranged on one side, away from the wafer box warehouse (1), of the manipulator (2); the wafer box comprises a wafer box base (1), wherein a plurality of wafer box adapters (11) are arranged in the wafer box base (1), the wafer box adapters (11) are divided into an upper layer and a lower layer, a second sensor (14) is arranged at the front end of the wafer box adapters (11), a first sensor (13) is arranged at the bottom of the second sensor (14) close to the wafer box adapters (11), and a 2-inch wafer box (15) or a 4-inch wafer box (12) is arranged above the wafer box adapters (11); one side of the manipulator (2) is provided with a manipulator L-axis arm (22), the other side of the manipulator (2) is provided with a manipulator R-axis arm (25), one sides of the manipulator R-axis arm (25) and the L-axis arm (22) are both provided with a grabbing hand (21), the other side of the manipulator R-axis arm (25) which is common to the L-axis arm (22) is provided with a manipulator Z-axis arm (24), and the tail end of the manipulator L-axis arm (22) is provided with a third sensor (23); one side of the pre-alignment platform (3) is provided with a CCD detector (31), and the other side of the pre-alignment platform (3) is provided with an adjusting platform (32); a thickness detection sensor (41) is arranged at the middle position of the marble air floatation table (4), the upper part and the lower part are concentrically arranged, and a 2-inch and 4-inch compatible detection object carrying movement table (42) is arranged at the middle position of the two thickness detection sensors (41); the cassette adapter (11) is compatible with a 2 inch cassette (15) and a 4 inch cassette (12); the adjusting table (32) is composed of three moving shafts, wherein the three moving shafts are respectively composed of a linear moving shaft X in the horizontal direction, a linear moving shaft Z in the vertical direction and a rotating shaft R, and the object-carrying detecting moving table (42) can do X-Y two-dimensional movement on the horizontal plane.
2. An automated apparatus for multi-size compatible LED thickness detection according to claim 1, wherein: the wafer box warehouse (1), the prealignment platform (3) and the marble air floatation table (4) are all arranged on circles with different radiuses and taking a Z-axis arm (24) of the manipulator as a circle center.
3. An automated apparatus for multi-size compatible LED thickness detection according to claim 1, wherein: the two thickness detection sensors (41) can be finely tuned in the vertical direction.
4. The method for detecting the automation equipment for detecting the thickness of the multi-size compatible LED according to claim 1, mainly comprising the following steps:
(1) Placing a wafer box: placing a 2 inch wafer cassette (15) or a 4 inch wafer cassette (12) into a cassette adapter (11) in a cassette library (1) by an operator;
(2) Detecting whether a wafer box exists or not: the wafer box adapter (11) is provided with a first sensor (13), can automatically detect whether a 2-inch wafer box (15) or a 4-inch wafer box (12) exists in the library, can automatically identify and distinguish whether an operator is put into the 2-inch wafer box (15) or the 4-inch wafer box (12), and only when the first sensor (13) detects the 2-inch wafer box (15) or the 4-inch wafer box (12), the corresponding wafer box adapter (11) can be put into operation;
(3) Wafer tab detection: the second sensor (14) can detect whether the wafers in the 2-inch wafer box (15) or the 4-inch wafer box (12) have a lug phenomenon, if the lug phenomenon occurs, the system can send an alarm to remind an operator of correctly placing the wafers in the 2-inch wafer box (15) or the 4-inch wafer box (12) so as to continue the detection operation;
(4) Wafer position serial number detection: before grabbing the wafer, the mechanical arm (2) scans the 2 inch wafer box (15) or the 4 inch wafer box (12) in the wafer box adapter (11) by utilizing the third sensor (23) installed by the mechanical arm, and records the position serial number of the wafer existing in the current 2 inch wafer box (15) or the 4 inch wafer box (12), if the wafer is detected to be missing, the wafer is directly skipped when being grabbed, so that the time is saved;
(5) Wafer first transport: after the scanning is finished, the wafer is grabbed by utilizing a grabbing hand (21) according to a scanning result and is transmitted to an adjusting table (32) of a prealignment platform (3), and alignment work of circle centers and edges of the wafer is prepared;
(6) Wafer alignment: firstly, an adjusting table (32) adsorbs a wafer by utilizing vacuum, a rotation shaft R of the adjusting table rotates, at the moment, a CCD detector (31) scans and detects the edge of the wafer, the error of the circle center and the edge lack of the wafer is judged, after error data are obtained, the X axis and the Z axis of the adjusting table (32) are matched, the circle center of the wafer is adjusted to the rotation center of the adjusting table (32) to be concentric, and the edge lack of the wafer is rotated to the same preset angle;
(7) And carrying out second transportation of the wafer: the mechanical arm (2) uses the grabbing hand (21) to remove the wafer with the circle center and the edge deficiency adjusted, and sends the wafer to the detection objective table (42) of the marble air bearing table (4) for thickness detection;
(8) And (3) detecting the thickness of the wafer: the detection object carrying moving table (42) carries the wafer to carry out two-dimensional movement in the X direction and the Y direction according to a preset program of an operator and a preset movement track, in the process, the thickness detection sensor (41) can carry out array scanning on the wafer on the detection object carrying table (42) to obtain data, and finally a series of important results of TTV, BOW, WARP, LTV are obtained through analysis;
(9) Third transportation of the wafer: after the detection is finished, the manipulator (2) sends the detected wafer back to the 2-inch wafer box (15) or the 4-inch wafer box (12) in the wafer box warehouse (1) by utilizing the grabbing hand (21);
(10) Repeating the steps of: repeating the steps until the wafers to be detected in the whole wafer box warehouse (1) are completely detected.
5. The inspection method according to claim 4, wherein the wafer cassette library (1), the pre-alignment stage (3) and the marble air bearing table (4) are all mounted on circles of different radii with the manipulator Z-axis arm (24) as a center; the cassette adapter (11) is compatible with a 2 inch cassette (15) and a 4 inch cassette (12); the adjusting table (32) consists of three moving shafts, wherein the three moving shafts are respectively composed of a linear moving shaft X in the horizontal direction, a linear moving shaft Z in the vertical direction and a rotating shaft R; the two thickness detection sensors (41) can be finely adjusted in the vertical direction; the detection stage (42) is capable of X, Y two-dimensional movement in a horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810321347.4A CN108288593B (en) | 2018-04-11 | 2018-04-11 | Multi-size compatible automatic device for detecting thickness of LED and detection method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810321347.4A CN108288593B (en) | 2018-04-11 | 2018-04-11 | Multi-size compatible automatic device for detecting thickness of LED and detection method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108288593A CN108288593A (en) | 2018-07-17 |
| CN108288593B true CN108288593B (en) | 2023-09-05 |
Family
ID=62834394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810321347.4A Active CN108288593B (en) | 2018-04-11 | 2018-04-11 | Multi-size compatible automatic device for detecting thickness of LED and detection method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108288593B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146102A (en) * | 2018-11-02 | 2020-05-12 | 睿励科学仪器（上海）有限公司 | Apparatus and method for measuring wafer |
| CN113972158A (en) * | 2021-10-26 | 2022-01-25 | 上海广川科技有限公司 | Wafer transmission system |
| CN116864424B (en) * | 2023-09-05 | 2023-11-14 | 上海图双精密装备有限公司 | Tab self-correction system and method for silicon wafer cassette and lithography machine |
| CN117352438B (en) * | 2023-12-04 | 2024-03-22 | 北京锐洁机器人科技有限公司 | Multi-size wafer loading platform |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5420803A (en) * | 1992-11-18 | 1995-05-30 | Technology Development Group, Inc. | Enhanced resolution wafer thickness measurement system |
| US5735055A (en) * | 1996-04-23 | 1998-04-07 | Aluminum Company Of America | Method and apparatus for measuring the thickness of an article at a plurality of points |
| JP2008083059A (en) * | 2006-09-26 | 2008-04-10 | David S Marx | Measuring system and measuring device for wafer |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
| CN101390197A (en) * | 2006-02-22 | 2009-03-18 | 株式会社荏原制作所 | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| CN104142128A (en) * | 2014-06-25 | 2014-11-12 | 上海功源自动化技术有限公司 | Method and device for measuring warping degree of wafer |
| CN107546163A (en) * | 2016-06-24 | 2018-01-05 | 沈阳新松机器人自动化股份有限公司 | A kind of wafer transportation resources, wafer conveying arrangement and system |
| CN107768294A (en) * | 2017-11-01 | 2018-03-06 | 成都吱吖科技有限公司 | Wafer prealigning system positioning method, positioner and positioning circuit system |
| CN208028023U (en) * | 2018-04-11 | 2018-10-30 | 无锡纵合创星科技有限公司 | A kind of automation equipment of the LED Thickness sensitivities of more size compatibilities |
-
2018
- 2018-04-11 CN CN201810321347.4A patent/CN108288593B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5420803A (en) * | 1992-11-18 | 1995-05-30 | Technology Development Group, Inc. | Enhanced resolution wafer thickness measurement system |
| US5735055A (en) * | 1996-04-23 | 1998-04-07 | Aluminum Company Of America | Method and apparatus for measuring the thickness of an article at a plurality of points |
| CN101390197A (en) * | 2006-02-22 | 2009-03-18 | 株式会社荏原制作所 | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| JP2008083059A (en) * | 2006-09-26 | 2008-04-10 | David S Marx | Measuring system and measuring device for wafer |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
| CN104142128A (en) * | 2014-06-25 | 2014-11-12 | 上海功源自动化技术有限公司 | Method and device for measuring warping degree of wafer |
| CN107546163A (en) * | 2016-06-24 | 2018-01-05 | 沈阳新松机器人自动化股份有限公司 | A kind of wafer transportation resources, wafer conveying arrangement and system |
| CN107768294A (en) * | 2017-11-01 | 2018-03-06 | 成都吱吖科技有限公司 | Wafer prealigning system positioning method, positioner and positioning circuit system |
| CN208028023U (en) * | 2018-04-11 | 2018-10-30 | 无锡纵合创星科技有限公司 | A kind of automation equipment of the LED Thickness sensitivities of more size compatibilities |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108288593A (en) | 2018-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108288593B (en) | Multi-size compatible automatic device for detecting thickness of LED and detection method thereof | |
| US7976263B2 (en) | Integrated wafer transfer mechanism | |
| US6729462B2 (en) | Edge grip aligner with buffering capabilities | |
| CN216094907U (en) | Sorting device for front-end integrated wafers of semiconductor equipment | |
| US8961094B2 (en) | Method and device for aligning substrates | |
| CN107924863B (en) | Conveying system, conveying robot and teaching method thereof | |
| JP4465518B2 (en) | Rectangular wafer alignment system | |
| EP0547894A1 (en) | An automatic wafer lapping apparatus | |
| US20090081007A1 (en) | Transfer mechanism with multiple wafer handling capability | |
| WO2022151040A1 (en) | Measurement device for measuring battery | |
| US6478532B1 (en) | Wafer orienting and reading mechanism | |
| CN105789085B (en) | A kind of material transmission system of compatible kinds of processes silicon chip | |
| CN112146580A (en) | Wafer thickness detection equipment | |
| CN115295464A (en) | Wafer conveying system | |
| US11072502B2 (en) | Substrate tilt control in high speed rotary sorter | |
| CN208028023U (en) | A kind of automation equipment of the LED Thickness sensitivities of more size compatibilities | |
| CN103515273A (en) | Wafer transmission system | |
| CN111029287B (en) | Automatic wafer loading and unloading system | |
| CN202196084U (en) | Test probe table of image sensor chip | |
| CN216413014U (en) | Wafer detection device | |
| CN218765127U (en) | Automatic wafer thickness measuring instrument | |
| CN216957961U (en) | Double-side detection equipment | |
| CN214477368U (en) | Wafer chip product test braid equipment | |
| CN218867064U (en) | A deposit mascerating machine for wafer access | |
| CN218317511U (en) | Automatic braid equipment for packing of wafer ring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230731 Address after: 214000 innovation incubator A06, second floor, F11 building, No. 200, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Applicant after: WUXI XIVI TECHNOLOGY CO.,LTD. Address before: F7, China Sensor Network International Innovation Park, No. 200 Linghu Avenue, Wuxi City, Jiangsu Province, 214000 Applicant before: WUXI ZONGHE CHUANGXING TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |