CN101216686A - Wafer pre-aligning platform and wafer pre-alignment method using the platform - Google Patents

Wafer pre-aligning platform and wafer pre-alignment method using the platform Download PDF

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CN101216686A
CN101216686A CNA2008100325188A CN200810032518A CN101216686A CN 101216686 A CN101216686 A CN 101216686A CN A2008100325188 A CNA2008100325188 A CN A2008100325188A CN 200810032518 A CN200810032518 A CN 200810032518A CN 101216686 A CN101216686 A CN 101216686A
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wafer
platform
prealignment
handing
motion platform
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CN101216686B (en
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李若庆
曹其新
姜杰
程建瑞
宋海军
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Shanghai Micro Electronics Equipment Co Ltd
Shanghai Micro and High Precision Mechine Engineering Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
Shanghai Micro and High Precision Mechine Engineering Co Ltd
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Abstract

The invention discloses a wafer pre-alignment platform and a wafer pre-alignment method using the platform. The invention employs the quality center algorithm to acquire data on the radius and the angle of a sampling point on the edge of a wafer to be measured and generates a signal for adjusting the wafer position, and a four-axis series-connected adjusting mechanism adjusts the position of the wafer according to the signal; thereby completing the pre-alignment of the wafer. The platform may use or does not use a conjoining bracket. The platform can be adapted to the wafers with different sizes and pre-alignment requirements on different precisions. The wafer pre-alignment platform disclosed by the invention has the advantages of compact structure, wide application scope, flexible usage, flexible procedures, high efficiency and less pollution; and with the pre-alignment repetition precision up to plus or minus 6.5Mum, the platform can be universally applied in lithography and testing process.

Description

A kind of wafer prealignment platform and use the wafer prealignment method of this platform
Technical field
The present invention relates to the wafer aligned technology in the integrated circuit manufacturing, particularly the wafer prealignment technology before wafer exposure or the test.
Background technology
In the wafer printing process,, must carry out nanoscale before the wafer exposure and accurately aim at for alignment precision and the image quality that obtains to expect.The seizure visual field of considering accurate aligning is too little, the catching range of having only the alignment mark through the wafer of prealignment just can enter the alignment system visual field.Therefore, the performance that the performance of prealignment platform will directly affect litho machine realizes and production efficiency that quick, high precision wafer prealignment is the indispensable key link of high-performance photoetching machine.
For some wafer sort, the prealignment accuracy requirement is often lower, and prealignment efficient is then had relatively high expectations.
U.S. Pat 6,932,558 wafer aligner of describing adopt air bearings support measurement wafer and by a plurality of roller contact wafers edge wafer are implemented the heart, by several light sensor probes wafer breach, generation breach detectable signal, and directed in view of the above wafer.The described wafer aligned device of this patent (Waferaligner) adopts contact roller centering wafer, easily the wafer exposure face is caused particle contamination.
Summary of the invention
The object of the present invention is to provide a kind of prealignment method that is used for the wafer prealignment platform of integrated circuit manufacturing and uses this prealignment platform, aim at efficient, reduce pollution section, improve the prealignment repeatable accuracy to improve.
In order to achieve the above object, the invention provides a kind of wafer prealignment platform, comprise switch support, Y to first motion platform, X to second motion platform, θ to universal stage, Z to the 3rd motion platform, optical measuring system, vacuum cup and control system.As shown in Figure 1, this Y is to first motion platform and this X direction of motion quadrature to second motion platform, and all measures the aligned position plane parallel of wafer with this; This θ is vertical with this aligned position plane of measuring wafer to the turning axle of universal stage; This Z is vertical with this aligned position plane of measuring wafer to the direction of motion of the 3rd motion platform; This vacuum cup places this Z to inhale on the 3rd motion platform and puts the measurement wafer; This Y from bottom to up forms four spool series connection adjusting mechanisms to universal stage, Z to the 3rd motion platform and vacuum cup to second motion platform, θ to first motion platform, X, places to switch on the support; This switching support has Y, X to the motion adjusting mechanism, in order to adapt to the needs of different measuring wafer size; This optical measuring system is surveyed the positional information of this measurement wafer, places to switch on the support; This control system control this Y to first motion platform, X to second motion platform, θ to universal stage, Z to the 3rd motion platform, vacuum cup, switching support, measuring system, coordinate wafer prealignment flow process.
Switch support and adjust front and back, have the position handoff relation shown in the accompanying drawing 5 between the handing-over carriage of the measurement wafer of different size and correspondence thereof, laser displacement sensor, vacuum cup, laser infiltration type sensor.
This optical measuring system can be a laser infiltration type sensor, also can be the combination of laser infiltration type sensor and laser displacement sensor.This laser infiltration type sensor is fixed on this switching support and the locus remains unchanged, and the laser beam that this laser infiltration type sensor sends is surveyed Waffer edge perpendicular to the aligned position plane of this measurement wafer by the transmitted light territory.The laser beam that this laser displacement sensor sends is pointed to the axis of this measurement wafer ideal alignment position, surveys Waffer edge by the minor diameter folded light beam.This laser displacement sensor places on this switching support, and according to measuring needs, this switching support switches the measuring position of this laser displacement sensor to motion by X, the Y of inside.
This wafer prealignment platform can also comprise the handing-over carriage, and this handing-over carriage places to switch and can carry out X on the support and switch to the position.This handing-over carriage can be to inhale by vacuum to put the measurement wafer, also can be to adopt contact mat to place to measure wafer with certain elasticity and friction factor, as required, the function maskable of this handing-over carriage.
Have directed breach on this measurement wafer, this orientation breach is positioned at the edge of this measurement wafer.
The vertical detection wafer of this laser infiltration type sensor breach, laser displacement sensor is surveyed the wafer round edge.
The present invention also provides a kind of wafer prealignment method of using this wafer prealignment platform, comprises the steps:
(1) should measure wafer and be positioned on this wafer prealignment platform, and use this vacuum cup to suck this measurement wafer;
(2) start this θ to universal stage, survey the edge of this measurement wafer by this optical measuring system, the position data of generation imports this control system into to be handled;
(3) this control system goes out the position of form center and the breach direction of this measurement wafer according to the eigenvalue calculation of this positional information and measurement wafer;
(4) control system is measured wafer position of form center and breach direction according to this and is produced and adjust control signal, and will measure in the centre of form of wafer and the pose scope that the breach direction is adjusted to appointment by the motion of these four series connection adjusting mechanisms.
Method in this pose scope that the centre of form and the breach direction of wafer are adjusted to appointment, can be that the handing-over carriage is placed under this measurement wafer, move this Z to the 3rd motion platform, finish the wafer handing-over between vacuum cup and the handing-over carriage simultaneously, make this wafer break away from these four series connection adjusting mechanisms and place the handing-over carriage on, control system is adjusted the rotating shaft center of this universal stage, this rotating shaft center is overlapped with this measurement wafer centre of form, oppositely move this Z again to the 3rd motion platform, finish the wafer handing-over between handing-over carriage and the vacuum cup simultaneously, this measurement wafer is put back on the vacuum cup of these four series connection adjusting mechanisms.Also can be directly to adjust these four series connection adjusting mechanisms to make this measurement wafer in the space, be in the prealignment position.
The eigenwert of this measurement wafer comprises the wafer centre of form extent of the error in wafer diameter, wafer thickness, notch geometry, the preceding measurement coordinate system of adjustment.
Can adopt the method for frequency multiplication to mate rotating speed and the sampling number of this θ to universal stage.
This calculates the position of form center of wafer and the method for breach direction can be the mass cg method.
The present invention adopts the mass cg algorithm, obtains radius and the angle-data of measuring the Waffer edge sampled point and produces and measure wafer and adjust signal, and four series connection adjusting mechanisms are the pose of correcting measuring wafer in view of the above, finishes the wafer prealignment.
For the high operating mode of prealignment accuracy requirement, adopt the prealignment platform and the prealignment flow process thereof of band handing-over carriage, need adjustment to measure the putting position of wafer on vacuum cup in the prealignment process; For the not too high operating mode of prealignment accuracy requirement, adopt prealignment platform and the prealignment flow process thereof of not having the handing-over carriage, or the prealignment platform that adopts band handing-over carriage will join the operation shield of carriage and fall when carrying out the prealignment flow process, this prealignment flow process need not adjusted and measure the putting position of wafer on vacuum cup, therefore, avoid the flow process brought by the position of separating mechanism correcting measuring wafer on vacuum cup complicated, alleviated the wafer contamination that inter-agency measurement wafer handing-over is introduced.This platform is applicable to the inter process wafer handing-over operating mode that need carry out the lifting of Z axle.Because this platform can adapt to the prealignment requirement of the measurement wafer and the different accuracy of different size, therefore, wafer prealignment platform structure compactness described in the invention, applied widely, usage is flexible, flow process can letter can be numerous, can essence can be thick, the efficient height, pollution section is few, the prealignment repeatable accuracy generally is applicable to photoetching and test technology process up to ± 6.5 μ m.
Description of drawings
Fig. 1 is for adopting the wafer prealignment examples of platforms synoptic diagram of laser displacement sensor, laser infiltration type sensor measuring system and handing-over carriage;
Fig. 2 is for adopting the wafer prealignment examples of platforms synoptic diagram of laser infiltration type sensor and handing-over carriage;
Fig. 3 is for adopting laser displacement sensor, laser infiltration type sensor measuring system not with the wafer prealignment examples of platforms synoptic diagram of handing-over carriage;
Fig. 4 is for adopting laser infiltration type sensor not with the wafer prealignment examples of platforms synoptic diagram of handing-over carriage;
Fig. 5 adjusts front and back for switching support, the position handoff relation synoptic diagram of the survey sensor of the measurement wafer of different size and correspondence thereof, vacuum cup, handing-over tray chamber;
The radius length and the corresponding angle synoptic diagram of Waffer edge sampled point arrived at the universal stage center that Fig. 6 obtains for the detection Waffer edge;
The radius length and the corresponding angle synoptic diagram of wafer gap edge sampled point arrived at the universal stage center that Fig. 7 obtains for detection wafer breach;
Fig. 8 is wafer centre of form coordinate and breach direction synoptic diagram in the measurement coordinate system that obtains through calculating;
In the accompanying drawing: 101, switch support; 102, Y is to first motion platform; 103, X is to second motion platform; 104, θ is to universal stage; 105, Z is to the 3rd motion platform; 106, vacuum cup; 107, measure wafer; 108A, laser infiltration type sensor; 108B, laser displacement sensor; 109, control system; 110, handing-over carriage; Or, turntable rotation center; The turntable rotation center of Or1, measurement wafer 1 correspondence; The turntable rotation center of Or2, measurement wafer 2 correspondences; Ow, the wafer centre of form that calculates; ψ, breach deflection.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described.
Fig. 1 is 4 embodiment of wafer prealignment platform of the present invention to Fig. 4.
Fig. 1 shows the employing laser displacement sensor, the wafer prealignment examples of platforms synoptic diagram of laser infiltration type sensor measuring system and handing-over carriage, switching support 101 is at lowest order and have Y, directions X switches adjusts function, laser infiltration type sensor 108A is connected on the switching support and the locus remains unchanged, laser displacement sensor 108B can carry out Y with switching support, the directions X position is adjusted, equally, handing-over carriage 110 and Y are connected to switch on the support 101 and with switching support 101 to first motion platform 102 and can carry out the adjustment of directions X position, Y is to first motion platform, X is to second motion platform, θ is to universal stage, Z to the 3rd motion platform to going up down four series connection of prealignment fine-regulation system that formation can separate motion, vacuum cup 106 is installed in Z and is used for inhaling on the 3rd motion platform 105 putting and measures wafer 107, and Y is to first motion platform, X is to second motion platform, θ is to universal stage, Z forms four series connection adjusting mechanisms of prealignment jointly to the 3rd motion platform and vacuum cup.Therefore, four series connection adjusting mechanisms, optical measuring system, switching support 101, handing-over carriage 110 and control system 109 have been formed this wafer prealignment platform embodiment.Wherein, Y is to first motion platform 102, X is used in the measurement coordinate system location survey wafer centre of form to second motion platform 103, the θ that is installed on second motion platform 103 is used for cooperative sensor detection Waffer edge and directed wafer breach to universal stage 104, Z is installed in θ to the 3rd motion platform 105 and is used for and joins carriage 110 and external unit finish internal wafer handing-over and the handing-over of front and back inter process wafer respectively on universal stage 104, switch support 101 and be used to adapt to the wafer measurement of different-diameter and play whole the connection and supporting role, 109 of control system are used for coordinating, control wafer prealignment flow process.
Fig. 2 shows the wafer prealignment examples of platforms synoptic diagram that adopts laser infiltration type sensor 108A and handing-over carriage 110, switching support 101 is at lowest order and have directions X switching adjustment function, laser infiltration type sensor 108A is connected on the switching support 101 and the locus remains unchanged, handing-over carriage 110 and Y are connected to switch on the support 101 and with switching support to first motion platform 102 and can carry out the adjustment of directions X position, Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z to the 3rd motion platform 105 to going up down four series connection of prealignment fine-regulation system that formation can separate motion, vacuum cup 106 is installed in Z and is used for inhaling on the 3rd motion platform 105 putting and measures wafer 107, and Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z forms four series connection adjusting mechanisms of prealignment jointly to the 3rd motion platform 105 and vacuum cup.Therefore, four series connection adjusting mechanisms, laser infiltration type sensor 108A, switching support 101, handing-over carriage 110 and control system 109 have been formed this wafer prealignment platform embodiment.Wherein, Y is to first motion platform 102, X is used in the measurement coordinate system positions wafer centre of form to second motion platform 103, be installed in the θ of X on second motion platform 103 and be used for cooperative sensor detection Waffer edge and directed wafer breach to universal stage 104, Z is installed in θ to the 3rd motion platform 105 and is used for and joins carriage 110 and external unit finish internal wafer handing-over and the handing-over of front and back inter process wafer respectively on universal stage 104, switch support 101 and be used to adapt to the wafer measurement of different-diameter and play whole the connection and supporting role, 109 of control system are used for coordinating, control wafer prealignment flow process.
Fig. 3 shows and adopts laser displacement sensor 108B, laser infiltration type sensor 108A measuring system and not with the handing-over carriage wafer prealignment examples of platforms synoptic diagram, switching support 101 is at lowest order and have Y, directions X switches adjusts function, laser infiltration type sensor 108A is connected on the switching support 101 and the locus remains unchanged, laser displacement sensor 108B can carry out Y with switching support 101, the directions X position is adjusted, equally, Y is connected to switch on the support 101 to first motion platform 102 and can carries out the adjustment of directions X position with switching support, Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z to the 3rd motion platform 105 to going up down four series connection of prealignment fine-regulation system that formation can separate motion, vacuum cup 106 is installed in Z and is used for inhaling on the 3rd motion platform 105 putting and measures wafer 107, and Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z forms four series connection adjusting mechanisms of prealignment jointly to the 3rd motion platform 105 and vacuum cup.Therefore, four series connection adjusting mechanisms, optical measuring system, switching support 101 and control system 109 have been formed this wafer prealignment platform embodiment.Wherein, Y is used in the measurement coordinate system positions wafer centre of form to second motion platform 103 to first motion platform 102, X, be installed in the θ of X on second motion platform 103 and be used for cooperative sensor detection Waffer edge and directed wafer breach to universal stage 104, Z is installed in θ to the 3rd motion platform 105 and is used for finishing front and back inter process wafer handing-over with external unit on universal stage 104, switch support 101 and be used to adapt to the wafer measurement of different-diameter and play whole the connection and supporting role, 109 of control system are used for coordinating, control wafer prealignment flow process.
Fig. 4 shows and adopts laser infiltration type sensor 108A not with the wafer prealignment examples of platforms synoptic diagram of handing-over carriage, switching support 101 is at lowest order and have directions X switching adjustment function, laser infiltration type sensor 108A is connected on the switching support 101 and the locus remains unchanged, Y is connected to switch on the support 101 and with switching support to first motion platform 102 and can carries out the adjustment of directions X position, Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z to the 3rd motion platform 105 to going up down four series connection of prealignment fine-regulation system that formation can separate motion, vacuum cup 106 is installed in Z and is used for inhaling on the 3rd motion platform 105 putting and measures wafer 107, and Y is to first motion platform 102, X is to second motion platform 103, θ is to universal stage 104, Z forms four series connection adjusting mechanisms of prealignment jointly to the 3rd motion platform 105 and vacuum cup.Therefore, four series connection adjusting mechanisms, laser infiltration type sensor 108A, switching support 101 and control system 109 have been formed this wafer prealignment platform embodiment.Wherein, Y is used in the measurement coordinate system positions wafer centre of form to second motion platform 103 to first motion platform 102, X, be installed in the θ of X on second motion platform 103 and be used for cooperative sensor detection Waffer edge and directed wafer breach to universal stage 104, Z is installed in θ to the 3rd motion platform 105 and is used for finishing front and back inter process wafer handing-over with external unit on universal stage 104, switch support 101 and be used to adapt to the wafer measurement of different-diameter and play whole the connection and supporting role, 109 of control system are used for coordinating, control wafer prealignment flow process.
Fig. 5 has provided the relative position relation (herein measure center wafer with θ to universal stage center overlap) of the measurement wafer of two kinds of diameter specifications at desirable detecting position.Among the figure, Or1, Or2 represent the center of θ before and after universal stage switches respectively, before and after promptly E represents to switch turntable X to adjustment amount, if laser displacement sensor is arranged, before and after then E also represents to switch laser displacement sensor Y to and X to adjustment amount.Before and after switching, the breach detection position is constant.
Fig. 6 show survey θ that Waffer edge obtains to the universal stage center radius length and the corresponding angle synoptic diagram to the Waffer edge sampled point, wherein, the i time sample radius r iWith the i+1 time sample radius r I+1Between angle Δ θ=θ I+1-θ i, angle θ iAnd θ I+1Respectively with r iAnd r I+1Corresponding.
Fig. 7 show survey θ that the wafer breach obtains to the universal stage center radius length r to wafer gap edge sampled point iAnd corresponding angle θ iSynoptic diagram.
Fig. 8 shows through calculating wafer centre of form coordinate and breach direction synoptic diagram in the measurement coordinate system that obtains, and Or represents θ to the universal stage center, and Ow represents the wafer centre of form, ψ indication notch deflection.
In the prealignment process of case description, the collaborative θ of optical measuring system surveys Waffer edge and obtains coordinate (angle and the radius) data (Fig. 6, Fig. 7) of each sampled point of Waffer edge to universal stage, control system calculates the centre of form (or center of circle) coordinate and the breach direction (Fig. 8) of wafer in view of the above and produces the pose adjustment signal of location, directed wafer, finally finish the prealignment of wafer, thereby finish the prealignment flow process that arbitrarily is placed in the wafer on the prealignment vacuum cup in the certain position scope by four series connection adjusting mechanisms.Adopt the mass cg method to calculate centre of form coordinate and the breach direction of measuring wafer.Computing formula is as follows:
x ‾ = M y M = Σ i = 1 n m i x i Σ i - 1 n m i , y ‾ = M x M = Σ i = 1 n m i y i Σ i - 1 n m i
Wherein M = Σ i = 1 n m i Be the gross mass of calculating system of particles, M y = Σ i = 1 n m i x i , M x = Σ i = 1 n m i y i Be respectively the static moment of this system of particles to y axle and x axle,
Figure S2008100325188D00076
For calculating the mass cg coordinate of system of particles.The computing formula of calculating the wafer centre of form, the breach centre of form or direction is as follows respectively:
Wafer centre of form coordinate Calculation formula (please cooperate) with reference to Fig. 6:
x ‾ = Σ i = 1 N ∫ 0 r i r 2 dr ∫ θ i θ i + 1 cos θdθ Σ i = 1 N ∫ 0 r i rdr ∫ θ i θ i + 1 dθ = 1 3 Σ i = 1 N r i 3 [ sin θ i + 1 - sin θ i ] 1 2 Σ i = 1 N r i 2 [ θ i + 1 - θ i ]
y ‾ = Σ i = 1 N ∫ 0 r i r 2 dr ∫ θ i θ i + 1 sin θdθ Σ i = 1 N ∫ 0 r i rdr ∫ θ i θ i + 1 dθ = 1 3 Σ i = 1 N r i 3 [ cos θ i - cos θ i + 1 ] 1 2 Σ i = 1 N r i 2 [ θ i + 1 - θ i ]
Wherein, N counts θ for effectively segmenting sampling calculating iBe the angle value of i sampled point correspondence, θ I+1Be the angle value of i+1 sampled point correspondence, r iBe the radius value of i sampled point, r I+1Be the radius value of i+1 sampled point,
Figure S2008100325188D00083
Figure S2008100325188D00084
Centre of form coordinate figure for wafer.
Wafer breach centre of form coordinate Calculation formula (please cooperate) with reference to Fig. 7:
x ‾ = Σ i = 1 N ∫ r i r endi r 2 dr ∫ θ i θ i + 1 cos θdθ 1 2 r A r B sin ( θ B - θ A ) - Σ i = 1 N ∫ 0 r i rdr ∫ θ i θ i + 1 dθ = 1 3 Σ i = 1 N ( r endi 3 - r i 3 ) [ sin θ i + 1 - sin θ i ] 1 2 r A r B sin ( θ B - θ A ) - 1 2 Σ i = 1 N r i 2 [ θ i + 1 - θ i ]
y ‾ = Σ i = 1 N ∫ r i r endi r 2 dr ∫ θ i θ i + 1 sin θdθ 1 2 r A r B sin ( θ B - θ A ) - Σ i = 1 N ∫ 0 r i rdr ∫ θ i θ i + 1 dθ = 1 3 Σ i = 1 N ( r endi 3 - r i 3 ) [ cos θ i - cos θ i + 1 ] 1 2 r A r B sin ( θ B - θ A ) - 1 2 Σ i = 1 N r i 2 [ θ i + 1 - θ i ]
r endi = ( x 2 - x 1 ) y 1 - ( y 2 - y 1 ) x 1 ( x 2 - x 1 ) sin θ i - ( y 2 - y 1 ) cos θ i
x 1＝r Acosθ A
y 2＝r Asinθ A
x 2＝r Bcosθ B
y 2＝r Bsinθ B
Wherein, x 1, y 1And x 2, y 2Be the end points coordinate of breach ends A B, r iBe the radial distance of i point and rotation center on the gap edge, prolong r iWith breach ends A B line segment intersection, r EndiThen be the radial distance of intersection point and rotation center,
Figure S2008100325188D00088
Figure S2008100325188D00089
Centre of form coordinate figure for the wafer breach.Can draw the breach centre of form and the determined wafer breach of wafer centre of form line direction (that is: breach angle value) by the breach centre of form, the wafer centre of form (center of circle) and the θ position relation between the three of universal stage center.
For example down, this embodiment uses the handing-over carriage in a batch processing flow implementation of the prealignment method of use wafer prealignment platform of the present invention:
(1) initialization wafer prealignment plateform system.The detection system vacuum pressure, whether have wafer have (if any then at first carry out respective handling), carry out state-detection such as each motion platform, control integrated circuit board, sensor, solenoid valve and make zero if detecting on vacuum cup, the handing-over carriage;
(2) technological parameters such as the eigenwert of setting measurement wafer, prealignment accuracy of detection scope and maximum cycle detection number of times switch support the desirable detection position of wafer are set;
(3) wafer of execution exterior mechanical hand and wafer prealignment platform vacuum sucker handing-over thread;
(4) detect vacuum cup vacuum tightness in the time of setting, vacuum cup sucks the measurement wafer;
(5) withdraw outside last slice mechanical arm, wafer prealignment platform is finished contact pin;
(6) start first data acquisition, computational threads, the centre of form, gap position and the radius that survey and measure Waffer edge, calculate wafer;
(7) start the internal wafer handing-over thread of vacuum cup and handing-over carriage, Z descends to the 3rd motion platform, measures wafer and breaks away from sucker and also relay and join on the carriage;
(8) start heart thread, Y adjusts θ to universal stage to second motion platform according to measuring the wafer position of form center to first motion platform, X, and θ is overlapped with the measurement center wafer to the universal stage rotation center;
(9) the wafer handing-over thread of startup handing-over carriage and vacuum cup, Z rises to the 3rd motion platform, and vacuum cup contact pin is also got back to and is surveyed the position;
(10) start data acquisition for the second time, computational threads, accurately survey Waffer edge, calculate the offset at the relative turntable of wafer centre of form center, if measure the wafer offset in the prealignment accuracy of detection scope that allows then enter next step, otherwise in maximum cycle detection number of times of setting, go back to step (7) again;
(11) start the wafer centre of form, breach direction adjustment thread and the wafer breach is finally directed, finish the wafer prealignment;
(12) exterior mechanical hands movement sheet under the prealignment is waited for the position;
(13) wafer of execution wafer prealignment platform and exterior mechanical hand handing-over thread is finished sheet under the prealignment platform;
(14) outer subordinate's sheet mechanical arm is taken wafer away, and mechanical arm is withdrawn, sheet is finished down;
(1 5) prealignment plateform system makes zero, and goes back to step (3).
Above-mentioned respectively walk out of now undesired after, system all can send error message so that in time fix a breakdown.
For example down, this embodiment does not use the handing-over carriage in another batch processing flow implementation of the prealignment method of use wafer prealignment platform of the present invention:
(1) initialization wafer prealignment plateform system.The detection system vacuum pressure, whether have wafer have (if any then at first carry out respective handling), carry out state-detection such as each motion platform, control integrated circuit board, sensor, solenoid valve and make zero if detecting on the vacuum cup;
(2) technological parameters such as eigenwert of setting measurement wafer, switching support are provided with the desirable detection position of wafer;
(3) wafer of execution exterior mechanical hand and wafer prealignment platform vacuum sucker handing-over thread;
(4) vacuum tightness of detection vacuum cup in the time of setting, vacuum cup sucks wafer;
(5) withdraw outside last slice mechanical arm, wafer prealignment platform is finished contact pin;
(6) log-on data collection, computational threads are surveyed Waffer edge, calculate the centre of form, gap position and the radius of measuring wafer;
(7) the startup wafer centre of form, breach direction are adjusted thread and will be measured finally orientation of wafer breach, finish the wafer prealignment;
(8) exterior mechanical hands movement sheet under the prealignment is waited for the position;
(9) wafer of execution prealignment platform and exterior mechanical hand handing-over thread is finished sheet under the prealignment platform;
(10) outer subordinate's sheet mechanical arm is taken wafer away, and mechanical arm is withdrawn, sheet is finished down;
(11) the prealignment plateform system makes zero, and goes back to step (3).
Above-mentioned respectively walk out of now undesired after, system all can send error message so that in time fix a breakdown.

Claims (14)

1. a wafer prealignment platform is characterized in that, described wafer prealignment platform comprises:
Switch support;
Y is to first motion platform;
X is to second motion platform;
θ is to universal stage;
Z is to the 3rd motion platform;
Optical measuring system;
Vacuum cup; With
Control system;
Described Y is to first motion platform and the described X direction of motion quadrature to second motion platform, and all with the aligned position plane parallel of described measurement wafer; Described θ is vertical with the aligned position plane of described measurement wafer to the turning axle of universal stage; Described Z is vertical with the aligned position plane of described measurement wafer to the direction of motion of the 3rd motion platform; Described vacuum cup places described Z to inhale on the 3rd motion platform and puts the measurement wafer; Described Y from bottom to up forms four spool series connection adjusting mechanisms to universal stage, Z to the 3rd motion platform and vacuum cup to second motion platform, θ to first motion platform, X, places to switch on the support; Described switching support has Y, X to the motion adjusting mechanism, in order to adapt to the needs of different measuring wafer size; Described optical measuring system is surveyed the positional information of described measurement wafer, places to switch on the support; Described control system control described Y to first motion platform, X to second motion platform, θ to universal stage, Z to the 3rd motion platform, vacuum cup, switching support, measuring system, coordinate wafer prealignment flow process.
2. wafer prealignment platform according to claim 1 is characterized in that: described optical measuring system can be a laser infiltration type sensor, also can be the combination of laser infiltration type sensor and laser displacement sensor.
3. wafer prealignment platform according to claim 2, it is characterized in that: described laser infiltration type sensor is fixed on the described switching support and the locus remains unchanged, the laser beam that described laser infiltration type sensor sends is surveyed Waffer edge perpendicular to the aligned position plane of described measurement wafer by the transmitted light territory.
4. wafer prealignment platform according to claim 2 is characterized in that: the laser beam that described laser displacement sensor sends is pointed to the axis of described measurement wafer ideal alignment position, surveys Waffer edge by the minor diameter folded light beam.
5. wafer prealignment platform according to claim 4, it is characterized in that: described laser displacement sensor places on the described switching support, according to measuring needs, described switching support switches the measuring position of described laser displacement sensor to motion by X, the Y of inside.
6. wafer prealignment platform according to claim 1 is characterized in that: described wafer prealignment platform can also comprise the handing-over carriage, and described handing-over carriage places to switch and can carry out X on the support and switch to the position; Described handing-over carriage can be to inhale by vacuum to put wafer, also can be to adopt the contact mat with certain elasticity and friction factor to place wafer, as required, and the function maskable of described handing-over carriage.
7. wafer prealignment platform according to claim 1 is characterized in that: have directed breach on the described measurement wafer, described directed breach is positioned at the edge of described measurement wafer.
8. wafer prealignment platform according to claim 7 is characterized in that: the vertical detection wafer of described laser infiltration type sensor breach, laser displacement sensor is surveyed the wafer round edge.
9. a wafer prealignment method of using the described wafer prealignment of claim 1 platform is characterized in that, comprises the steps:
(1) described measurement wafer is positioned on the described wafer prealignment platform, uses described vacuum cup to suck described measurement wafer;
(2) start described θ to universal stage, survey the edge of described measurement wafer by described optical measuring system, the position data of generation imports described control system into to be handled;
(3) described control system goes out the position of form center and the breach direction of described measurement wafer according to the eigenvalue calculation of described positional information and measurement wafer.
(4) control system produces according to described measurement wafer position of form center and breach direction and adjusts control signal, and the motion by described four series connection adjusting mechanisms the centre of form and the breach direction of described measurement wafer are adjusted to appointment the pose scope in.
10. wafer prealignment method according to claim 9, it is characterized in that: described wafer prealignment platform also comprises the handing-over carriage, method in the described pose scope that the centre of form and the breach direction of wafer are adjusted to appointment, can be that the handing-over carriage is placed under the described measurement wafer, move described Z to the 3rd motion platform, finish the wafer handing-over between vacuum cup and the handing-over carriage simultaneously, make described wafer break away from described four series connection adjusting mechanisms and place the handing-over carriage on, control system is adjusted the rotating shaft center of described universal stage, described rotating shaft center is overlapped with the described measurement wafer centre of form, oppositely move described Z again to the 3rd motion platform, finish the wafer handing-over between handing-over carriage and the vacuum cup simultaneously, described measurement wafer is put back on the vacuum cup of described four series connection adjusting mechanisms.
11. wafer prealignment method according to claim 9, it is characterized in that: the method in the described pose scope that the centre of form and the breach direction of wafer are adjusted to appointment can be directly to adjust described four series connection adjusting mechanisms to make described measurement wafer be in the prealignment position in the space.
12. wafer prealignment method according to claim 9 is characterized in that: the eigenwert of described measurement wafer comprises the wafer centre of form extent of the error in wafer diameter, wafer thickness, notch geometry, the preceding measurement coordinate system of adjustment.
13. wafer prealignment method according to claim 9 is characterized in that: can adopt the method for frequency multiplication to mate rotating speed and the sampling number of described θ to universal stage.
14. wafer prealignment method according to claim 9 is characterized in that: describedly calculate the position of form center of wafer and the method for breach direction can be the mass cg method.
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