CN102183880A - Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine - Google Patents

Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine Download PDF

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Publication number
CN102183880A
CN102183880A CN2011101200270A CN201110120027A CN102183880A CN 102183880 A CN102183880 A CN 102183880A CN 2011101200270 A CN2011101200270 A CN 2011101200270A CN 201110120027 A CN201110120027 A CN 201110120027A CN 102183880 A CN102183880 A CN 102183880A
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CN
China
Prior art keywords
pre
substrate
base plate
automatic exposure
exposure machine
Prior art date
Application number
CN2011101200270A
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Chinese (zh)
Inventor
刘卫东
何琪
戚琳
陈睿
Original Assignee
武汉东羽光机电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 武汉东羽光机电科技有限公司 filed Critical 武汉东羽光机电科技有限公司
Priority to CN2011101200270A priority Critical patent/CN102183880A/en
Publication of CN102183880A publication Critical patent/CN102183880A/en

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Abstract

The invention discloses a quick pre-locating device for a base plate of a light emitting diode (LED) automatic exposure machine. The device comprises a support frame consisting of a rod piece and a plate piece; an XY-directional moving working platform is arranged in the support frame; a rotation support shaft is vertically arranged on the XY-directional moving working platform; the upper end of the rotation support shaft is connected with a vacuum absorption base plate working platform; the rotation support shaft is connected with a rotatably-driving transmission mechanism; and an edge sensor is arranged on the support shaft and is arranged at one side of the vacuum absorption working platform. The device has a simple structure and is convenient to operate, a mode of jacking and pushing is not required during pre-locating, zero damage rate of wafers during moving is ensured, and the cost is reduced; meanwhile, the base plate is not needed to be placed at an approximate reference position during placing of the base plate and can be arbitrarily placed, so that the time of pre-locating the base plate can be greatly shortened to realize quick pre-locating and improve the efficiency.

Description

The quick device for pre-positioning of LED automatic exposure machine substrate

Technical field

The invention belongs to LED automatic exposure machine technology, be specifically related to a kind of quick pre-determined bit method of LED automatic exposure machine substrate.

Background technology

LED fully automatic exposure machine is that the substrate and the mask that scribble photoresist is overlapping, and mask patterns is fired equipment on the substrate, is one of equipment of semiconductor equipment most critical.

The key technical indexes of fully automatic exposure machine is embodied on the uniform and stable property of the resolution of accuracy, pre-determined bit and exposure locating accuracy, exposure optical system of conveyance control system and exposure light source, and pre-determined bit is one of gordian technique of this equipment, at present, this kind equipment still belongs to blank project at home, and abroad in pre-positioning system, mainly be the contact pre-determined bit mode that adopts.In the product description that dispatches from the factory as existing Japan, be as shown in Figure 1, to push substrate 1 to 2 reference pin 61 directions location to the pre-determined bit method with thimble 60; Thimble 60 is by cylinder and spring control.The defective of this pre-determined bit method is: 1, when the substrate placement location, be need be more accurately, substrate be placed and is required than higher like this; Adopt high-accuracy mechanical arm, substrate is sent into roughly reference position, 2, when utilizing thimble 60 pushing tow substrates, pressure and mobile accuracy to the pushing tow cylinder require very high, otherwise, will cause the semiconductor wafer breakage, thereby cause the increase and the semiconductor wafer waste of processing cost.This also is one of high reason of present LED fully automatic exposure processing cost.

Summary of the invention

The object of the present invention is to provide the quick device for pre-positioning of a kind of LED automatic exposure machine substrate, to address the above problem.

Technical scheme of the present invention is: the quick device for pre-positioning of LED automatic exposure machine substrate, it comprises by rod member and plate and constitutes bracing frame, be provided with XY direction mobile working platform in the bracing frame, vertically be provided with the rotation back shaft on the XY direction mobile working platform, rotation back shaft upper end is connected with the vacuum suction substrate stage, the rotation back shaft connects the rotation drive transmission device, and bracing frame is provided with edge sensor, and edge sensor is located at a side of vacuum suction substrate stage.

Also be provided with substrate size on the bracing frame and adjust slideway, substrate size is adjusted the support frame that slideway is provided with edge sensor, and edge sensor is connected with support frame.

Support frame is adjusted cylinder with substrate size and is connected.

Rotation back shaft and vacuum suction substrate stage are in support frame.

XY direction mobile working platform comprises workbench, and workbench has directions X moving track and Y direction moving track.

Substrate is placed on the vacuum suction substrate stage, substrate rotates a circle, utilize edge sensor to gather the electric potential signal data of the marginal point of substrate, utilize the electric potential signal data of marginal point then, each marginal point is carried out The Fitting Calculation obtain the substrate edges figure, determine the reference point location of substrate, obtain the deviation of reference point and rotary middle point, again by mobile XY direction mobile working platform and/or rotation rotation back shaft, make reference point enter the reference position, realize the contactless quick pre-determined bit of substrate.It is simple in structure, and is easy to operate, does not have the mode of using pushing tow in the pre-determined bit process, has avoided thrustor and contacting of semiconductor wafer substrate are caused the generation of semiconductor wafer damaging problem, guarantees that the breakage rate of wafer in conveyance is zero, reduces cost; Simultaneously, in the put procedure of substrate, need not substrate is sent into roughly reference position, can place substrate arbitrarily, can shorten the time of substrate pre-determined bit so greatly, realize quick pre-determined bit, raise the efficiency.

Description of drawings

Fig. 1 has contact pre-determined bit synoptic diagram now.

Fig. 2 principle of the invention synoptic diagram.

Fig. 3 principle of the invention schematic top plan view.

Fig. 4 substrate is placed reference position arbitrarily.

Fig. 5 apparatus of the present invention structure master looks synoptic diagram.

Fig. 6 apparatus of the present invention structure schematic top plan view.

Synoptic diagram is looked on Fig. 7 apparatus of the present invention structure right side.

Embodiment

Describe the technical scheme of claim of the present invention below in conjunction with accompanying drawing, so that understand content of the present invention, simultaneously, protection scope of the present invention is not limited to down the content of description.

As shown in Figure 2, substrate 1 is placed on the rotation back shaft 3 of XY direction mobile working platform 2, and edge sensor 4 is photosensitive analog edge sensor (Edge Sensor); Edge sensor 4 edges are r with the distance of the center line of rotation back shaft 3 1Be fixing constant value, that edge sensor 4 collects is the distance value r at substrate 1 edge and edge sensor 4 edges 2, measured value.

As shown in Figure 3, substrate 1 is a tangent plane formula reference field 6, and promptly the reference field of substrate is a straight flange after circle cuts certain-length garden arc, and reference point is the mid point 7 of straight flange.Substrate 1 is in the state signal of accurate pre-determined bit.

As shown in Figure 4, substrate is placed reference position arbitrarily, and reference point 7 is not in the accurate reference position of pre-determined bit.

This device as shown in Figure 5, bracing frame 100 is the supporting structures that are made of frame-type rod member and plate; Its top is the table top 101 of framework.Be provided with XY direction mobile working platform 2 in the bracing frame, XY direction mobile working platform 2 comprises workbench 2.1, and workbench has directions X moving track 2.2 (shown in Figure 5) and Y direction moving track 2.3 (shown in Figure 7); Directions X moving track 2.2 is driven to drive motor and gearing 2.4 by X, and Y direction moving track 2.3 is driven to drive motor and gearing 2.5 by Y.

Directions X moving track 2.2 and Y direction moving track 2.3 can be multiple version, as establishing slide plate on the bottom directions X moving track 2.2, establish Y direction moving track 2.3 on the slide plate, and workbench 2.1 is located at Y direction moving track 2.3.XY direction mobile working platform 2 is provided with four light sensors, is respectively applied for to detect directions X amount of movement and Y direction amount of movement.

Workbench 2.1 vertically is provided with rotation back shaft 3, and rotation back shaft 3 upper ends are connected with vacuum suction substrate stage 10.Rotation back shaft 3 connects rotation drive transmission device 11.

Shown in Fig. 5,7, establish substrate size on the table top 101 of the framework of bracing frame 100 and adjust slideway 102, substrate size is adjusted the support frame 103 that slideway 102 is provided with edge sensor, establishes by riser 104 on the support frame 103 of edge sensor 4, and edge sensor 4 is connected on the riser 104.As shown in Figure 6, rotation back shaft and vacuum suction substrate stage 10 are in support frame 103.Edge sensor 4 is located at a side of vacuum suction substrate stage 10.Rotation back shaft 3 and rotation drive transmission device 11 do not show among Fig. 7.

Support frame 103 is adjusted cylinder 105 with substrate size and is connected, and by mobile support frame 103, can realize the semiconductor substrate of different-diameter is positioned like this.

Also be provided with substrate in the support frame 103 and detect sensor 12, be used to detect on the vacuum suction substrate stage 10 whether by substrate, so that realize control automatically.

Edge sensor is photosensitive analog edge sensor, it is the critical component that reads in the semiconductor-based panel edges electric potential signal in the rotation, the precision of these parts and interference free performance, directly have influence on the precision of equipment, therefore, we select for use is the product of Japanese KNECE company, model position IG-028, and the instrumentation scope is that 0-28mm repeated measures precision is ± 10 μ m.

During work, substrate is placed reference position arbitrarily on vacuum suction substrate stage 10, vacuum suction substrate stage 10 is with substrate absorption, and rotation back shaft 3 rotates 360 °; Edge sensor 4 uniformly-spaced 4096 outer rim data reading of angle is r 2i4096 outer rim data are converted into x by polar coordinates, the coordinate figure of y coordinate system, again with 4096 outer rim point x, the coordinate figure of y coordinate system utilizes the electric potential signal data of marginal point to carry out The Fitting Calculation with robust method or least square method and obtains the substrate edges figure; Obtain the reference point on the reference field that the substrate circle cuts a straight flange behind the arc of certain-length garden, obtain the deviation of reference point and rotary middle point, again by mobile XY direction mobile working platform and/or rotation rotation back shaft, make reference point enter the reference position, realize the contactless quick pre-determined bit of substrate.

Claims (5)

1. quick device for pre-positioning of LED automatic exposure machine substrate, it comprises by rod member and plate and constitutes bracing frame, be provided with XY direction mobile working platform in the bracing frame, it is characterized in that vertically being provided with the rotation back shaft on the XY direction mobile working platform, rotation back shaft upper end is connected with the vacuum suction substrate stage, the rotation back shaft connects the rotation drive transmission device, and bracing frame is provided with edge sensor, and edge sensor is located at a side of vacuum suction substrate stage.
2. the quick device for pre-positioning of LED automatic exposure machine substrate according to claim 1 is characterized in that also being provided with on the bracing frame substrate size and adjusts slideway, and substrate size is adjusted the support frame that slideway is provided with edge sensor, and edge sensor is connected with support frame.
3. as the quick device for pre-positioning of LED automatic exposure machine substrate as described in the claim 2, it is characterized in that support frame and substrate size adjust cylinder and be connected.
4. as the quick device for pre-positioning of LED automatic exposure machine substrate as described in the claim 2, it is characterized in that rotating back shaft and vacuum suction substrate stage in support frame.
5. the quick device for pre-positioning of LED automatic exposure machine substrate according to claim 1 is characterized in that XY direction mobile working platform comprises workbench, and workbench has directions X moving track and Y direction moving track.
CN2011101200270A 2011-05-11 2011-05-11 Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine CN102183880A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011101200270A CN102183880A (en) 2011-05-11 2011-05-11 Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101200270A CN102183880A (en) 2011-05-11 2011-05-11 Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine

Publications (1)

Publication Number Publication Date
CN102183880A true CN102183880A (en) 2011-09-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103077915A (en) * 2013-01-09 2013-05-01 广东志成华科光电设备有限公司 Adjustable double swing arm system three-core alignment method of chip grading equipment
CN104616851A (en) * 2015-01-23 2015-05-13 洛阳冰岩激光设备有限公司 Laser resistor trimming machine
CN106550610A (en) * 2015-07-23 2017-03-29 大和股份有限公司 The method for shifting and shifting apparatus of printing distributing board to be exposed

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752898A (en) * 1987-01-28 1988-06-21 Tencor Instruments Edge finding in wafers
JP2007287729A (en) * 2006-04-12 2007-11-01 Yaskawa Electric Corp Wafer prealigning apparatus
CN101216686A (en) * 2008-01-10 2008-07-09 上海微电子装备有限公司 Wafer pre-aligning platform and wafer pre-alignment method using the platform
WO2009011417A1 (en) * 2007-07-18 2009-01-22 Nikon Corporation Inspecting apparatus and inspecting method
JP2010003795A (en) * 2008-06-19 2010-01-07 Sinfonia Technology Co Ltd Substrate position detector and substrate position detecting method
CN101794721A (en) * 2009-01-08 2010-08-04 日东电工株式会社 Alignment apparatus for semiconductor wafer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752898A (en) * 1987-01-28 1988-06-21 Tencor Instruments Edge finding in wafers
JP2007287729A (en) * 2006-04-12 2007-11-01 Yaskawa Electric Corp Wafer prealigning apparatus
WO2009011417A1 (en) * 2007-07-18 2009-01-22 Nikon Corporation Inspecting apparatus and inspecting method
CN101216686A (en) * 2008-01-10 2008-07-09 上海微电子装备有限公司 Wafer pre-aligning platform and wafer pre-alignment method using the platform
JP2010003795A (en) * 2008-06-19 2010-01-07 Sinfonia Technology Co Ltd Substrate position detector and substrate position detecting method
CN101794721A (en) * 2009-01-08 2010-08-04 日东电工株式会社 Alignment apparatus for semiconductor wafer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103077915A (en) * 2013-01-09 2013-05-01 广东志成华科光电设备有限公司 Adjustable double swing arm system three-core alignment method of chip grading equipment
CN103077915B (en) * 2013-01-09 2015-07-29 广东志成华科光电设备有限公司 A kind of adjustable double-pendulum arms system three-core alignment method of die grading equipment
CN104616851A (en) * 2015-01-23 2015-05-13 洛阳冰岩激光设备有限公司 Laser resistor trimming machine
CN104616851B (en) * 2015-01-23 2017-09-29 洛阳冰岩激光设备有限公司 A kind of laser resistance adjuster
CN106550610A (en) * 2015-07-23 2017-03-29 大和股份有限公司 The method for shifting and shifting apparatus of printing distributing board to be exposed
CN106550610B (en) * 2015-07-23 2019-03-12 大和股份有限公司 The method for shifting and shifting apparatus of printing distributing board to be exposed

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Application publication date: 20110914

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