CN102012640B - Pre-alignment method and device for being compatible with broken silicon wafers - Google Patents
Pre-alignment method and device for being compatible with broken silicon wafers Download PDFInfo
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- CN102012640B CN102012640B CN 200910195195 CN200910195195A CN102012640B CN 102012640 B CN102012640 B CN 102012640B CN 200910195195 CN200910195195 CN 200910195195 CN 200910195195 A CN200910195195 A CN 200910195195A CN 102012640 B CN102012640 B CN 102012640B
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Abstract
The invention discloses a pre-alignment method and device for being compatible with broken silicon wafers. The method comprises the following steps of: vacuumizing a vacuum cylinder, driving a guide structure to move by a piston of the vacuum cylinder under the action of air pressure, and enabling a pre-alignment mechanism to be in a retraction state by spring deformation of the inner part of thepre-alignment mechanism; putting a silicon wafer on a sucking disc by a transmission mechanism; removing vacuum in the vacuum cylinder so as to recover the air pressure in the vacuum cylinder to the normal state, and driving the guide structure to expand or sway by a spring under the action of elastic force so as to enable the pre-alignment mechanism to be in a protruding state; fixing a rolling bearing on the top part of the guide structure to push the outer edge of the silicon wafer so as to enable the silicon wafers to move under the action of external force; and completing pre-alignment till two positioning edges of the silicon wafer are stuck in positioning pins. The invention also discloses a pre-alignment device for being compatible with broken silicon wafers. The pre-alignment device has simple structure, is compatible with broken silicon wafers, and can realize automatic control of pre-alignment actions by utilizing the actions of the vacuum cylinder through guiding of doubleguiding shafts and spring reset.
Description
Technical field
The present invention relates to the substrate prealignment method in a kind of semiconductor fabrication, be specifically related to a kind of prealignment method of compatible broken silicon wafers.The invention still further relates to a kind of prealignment device that uses the compatible broken silicon wafers of said method.
Background technology
In semiconductor production, silicon chip be exposed, before scribing, bonding die and the test, the general prealignment that all can require silicon chip is carried out certain precision, and the individual user has higher requirement to this is as also carrying out prealignment to 1/4, non-standard and random silicon chip.In order to reach this requirement, all be through the physical construction of silicon chip sucker and the improvement of prealignment method are realized usually.
As shown in Figure 1, US Patent No. 6583858B2 discloses a kind of being used for non-standard silicon chip has been fixed and the method for prealignment.It is three kinds of size differences and the non-standard silicon chip of appearance similar that silicon chip fixing still adopts traditional vacuum suction method, the silicon chip 801,802 of absorption, 803, and above-mentioned silicon chip correspondence has vacuum suction mouth 804,805,806; This patent adopts the both direction location, and the method for its diagonally opposing corner direction backup realizes prealignment.At three kinds of silicon chips that vary in size, fix three kinds of register pins 807,808,809 at base station 800 during prealignment, also be provided with groove 813 on the base station 800 simultaneously.Prealignment device comprises: the prealignment roller 812 of prealignment seat 810, the spring 811 that links to each other with prealignment seat 810 and ejection silicon chip.This prealignment device stretches by spring 811 prealignment roller 812 is advanced in groove 813, and then the ejection silicon chip, and silicon chip is stuck in corresponding register pin place, realizes prealignment.This prealignment method is simple to operate, and prerequisite is: non-standard silicon chip need have two gulde edges or two anchor points, and near the backup limit sharp wedge angle can not be arranged.But weak point is to fail to realize robotization, and the slide construction that backup has adopted spring and sheet spring to form needs by manually finishing, and has increased operator's labour intensity, has reduced labour productivity.
Summary of the invention
Technical matters to be solved by this invention provides a kind of prealignment method of compatible broken silicon wafers, and it can finish the prealignment of silicon chip automatically, and is simple to operate.The present invention also needs to provide a kind of prealignment device of the compatible broken silicon wafers based on said method.
In order to solve above technical matters, the invention provides a kind of prealignment method of compatible broken silicon wafers, be used for aiming at silicon chip, described silicon chip has two gulde edges, and method of the present invention comprises the steps:
(1) vacuum reservoir vacuumizes, and the piston in the vacuum reservoir drives the guide frame motion under gas pressure, make prealignment mechanism be in retracted state by the in-house spring deformation of prealignment;
(2) by transport sector silicon chip is placed on the sucker;
(3) lay down the vacuum of vacuum reservoir, make the vacuum reservoir internal gas pressure revert to normality, described spring drives guide frame extrapolation or side-sway under the elastic force effect, make prealignment mechanism be in overhanging state;
(4) outer rim of a rolling bearing ejection silicon chip is fixed at the guide frame top, makes silicon chip mobile under external force, is stuck in the register pin place to two gulde edges of silicon chip and finishes prealignment.
The invention provides a kind of prealignment device of compatible broken silicon wafers based on said method, be used for that the silicon chip on the sucker is pushed away card to register pin place and finish prealignment, described silicon chip has two gulde edges, the inventive system comprises: be fixed on the prealignment seat on the sucker, the vacuum reservoir of fixedlying connected with described prealignment seat, the guide frame of fixedlying connected with the piston in the vacuum reservoir and a prealignment roller of fixing at the guide frame top; Described guide frame is connected with at least one spring, makes described spring generation deformation simultaneously away from described silicon chip under the piston of described guide frame in described vacuum reservoir drives.
The present invention has the following advantages:
1. can compatible fragment, 1/4 fragment of main compatible same specification size;
2. utilize the vacuum reservoir action to be realized the automatic control of prealignment action by two axis of guide guiding, spring reset.
Description of drawings
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail.
Fig. 1 is the prealignment device structural drawing of prior art;
Fig. 2 is prealignment principle schematic of the present invention;
Fig. 3 is the prealignment device structural drawing of embodiment 1 and embodiment 2;
Fig. 4 is that the B of Fig. 3 is to cross-sectional view;
Fig. 5 is the prealignment device structural drawing of embodiment 3.
The Reference numeral of prior art is among Fig. 1: 800, sucker; 801, fragment; 802, fragment; 803, fragment; 804, vacuum suction mouth; 805, vacuum suction mouth; 806, vacuum suction mouth; 807, register pin; 808, register pin; 809, register pin; 810, prealignment seat; 811, spring; 812, prealignment roller; 813, groove.
Reference numeral of the present invention is among Fig. 2 to Fig. 5: 1, sucker; 11, vacuum inlet; 12, vacuum hole; 13, groove; 2, silicon chip; 2a, standard silicon chip; 2b, fragment; 21, absorption vacuum port; 21a, standard film absorption vacuum port; 21b, fragment absorption vacuum port; 3, register pin; 3a, standard silicon chip register pin; 3b, fragment register pin; 4, prealignment device; 41, prealignment seat; 42, vacuum reservoir; 421, piston; 43, vacuum nozzle; 44, spring; 45, guide frame; 46, prealignment roller.
Embodiment
As shown in Figure 2, the prealignment device 4 of compatible broken silicon wafers of the present invention is used for that the silicon chip 2 on the sucker 1 is pushed away card to register pin 3 places and finishes prealignment.Silicon chip 2 has two gulde edges, in view of silicon chip 2 comprises full wafer and broken silicon wafers, and the position difference that corresponding register pin 3 is set, correspondence is arranged on two gulde edges of silicon chip 2.
As shown in Figure 3 and Figure 4, prealignment device 4 of the present invention comprises: be fixed on the prealignment seat 41 on the sucker 1, the vacuum reservoir 42 of fixedlying connected with prealignment seat 41, the guide frame 45 of fixedlying connected with the piston 421 in the vacuum reservoir and the prealignment roller of fixing at the guide frame top 46 (can adopt a rolling bearing); Guide frame 45 is connected with at least one compression spring 44, compressible compression spring 44 when bouncing back under the piston 421 of guide frame 45 in vacuum reservoir drives.
Please refer to Fig. 3 and Fig. 4, the prealignment method of compatible broken silicon wafers of the present invention specifically comprises:
The first step, take out air in the vacuum reservoir 42 from vacuum nozzle 43, piston 421 in the vacuum reservoir drives guide frame 45 motions under gas pressure, guide frame 45 is the two-way guide shaft of pair of parallel, corresponding have two compression springs 44 to be set in parallel double axis of guide outside in that prealignment is in-house, and spring 44 is consistent with the flexible direction of the parallel double axis of guide.The parallel double axis of guide makes prealignment mechanism be in retracted state at the drive lower compression spring 44 of vacuum reservoir piston 421.
Second step, by transport sector (for example mechanical arm) a standard silicon chip 2a is placed on the sucker 1, can utilize traditional vacuum adsorption method that standard silicon chip 2a is fixed on the sucker 1, realize structure such as Fig. 3 of vacuum suction silicon chip, be provided with vacuum inlet 11 and vacuum hole 12 at sucker 1, be provided with standard film absorption vacuum port 21a at standard silicon chip 2a.
In the 3rd step, the vacuum nozzle 43 of opening vacuum reservoir makes the vacuum reservoir internal gas pressure revert to normality, and at this moment, compressed spring 44 extends under the elastic force effect, and then drives guide frame 45 extrapolations, makes prealignment mechanism 4 be in overhanging state.
In the 4th step, a prealignment roller 46 (can adopt rolling bearing) is fixed at guide frame 45 tops, and corresponding on the sucker 1 have a groove 13, and this groove 13 is the scope of activities of rolling bearing.Guide frame 45 drives the outer rim of rolling bearing ejection silicon chip 2a, makes silicon chip 2a mobile under external force, is stuck in three register pin 3a places to two gulde edges of silicon chip 2a and has then finished prealignment work.
The silicon chip 2 that prealignment device 4 among the embodiment 1 is aimed at can be standard silicon chip 2a, can be fragment 2b equally, only need the position of register pin 3 is adjusted to by the position of standard silicon chip register pin 3a the position of the fragment register pin 3b that can fix 1/4 silicon chip, fragment 2b has corresponding fragment absorption vacuum port 21b and can be fixed on the sucker 1, and the step of aligning is identical with embodiment 1.
As shown in Figure 5, the structure of prealignment device 4 can conversion, still comprise: be fixed on the prealignment seat 41 on the sucker 1, the vacuum reservoir 42 of fixedlying connected with prealignment seat 41, one end of guide frame 45 is fixedlyed connected with the piston 421 in the vacuum reservoir, a prealignment roller 46 (i.e. rolling bearing) is fixed at other end top, extension spring 44 1 ends are connected with guide frame 45 (guide frame is a swing arm), the other end is fixed on the prealignment seat 41, and is an angle between guide frame 45 and the extension spring 44.Elongate extension spring 44 when the piston 421 of guide frame 45 in vacuum reservoir drives turning down, prealignment mechanism steps down.When laying down vacuum, extension spring 44 bounces back under the spring force effect and drives guide frame 45 side-swaies, the same promotion that realizes silicon chip 2 (standard silicon chip 2a or fragment 2b) makes silicon chip 2 be stuck in register pin 3 (standard silicon chip register pin 3a or fragment register pin 3b) and locates, and finishes prealignment work.
The method of standard silicon chip 2a and fragment 2b being carried out prealignment based on said structure is identical with the method for embodiment 1 and embodiment 2.
The present invention is simple in structure, compatible fragment (fragment of different size only needs to change alignment pin position according to the position of silicon chip gulde edge), and utilize vacuum reservoir action, spring reset can realize the automatic control of prealignment action.
Claims (10)
1. the prealignment method of a compatible broken silicon wafers is used for aiming at silicon chip, and described silicon chip has two gulde edges, it is characterized in that, comprises the steps:
(1) vacuum reservoir vacuumizes, and the piston in the vacuum reservoir drives the guide frame motion under gas pressure, make prealignment mechanism be in retracted state by the in-house spring deformation of prealignment;
(2) by transport sector silicon chip is placed on the sucker;
(3) lay down the vacuum of vacuum reservoir, make the vacuum reservoir internal gas pressure revert to normality, described spring drives guide frame extrapolation or side-sway under the elastic force effect, make prealignment mechanism be in overhanging state;
(4) outer rim of a rolling bearing ejection silicon chip is fixed at the guide frame top, make silicon chip mobile under external force, be stuck in the register pin place to two gulde edges of silicon chip and finish prealignment, described silicon chip comprises full wafer and broken silicon wafers, and the set position of described register pin is corresponding full wafer and broken silicon wafers respectively.
2. the prealignment method of compatible broken silicon wafers as claimed in claim 1 is characterized in that, step (2) comprises utilizes vacuum adsorption method that described silicon chip is fixed on the described sucker.
3. the prealignment device of a compatible broken silicon wafers is finished prealignment for the silicon chip on the sucker is pushed away card to register pin place, described silicon chip has two gulde edges, it is characterized in that, comprise the prealignment seat that is fixed on the sucker, the vacuum reservoir of fixedlying connected with described prealignment seat, the guide frame of fixedlying connected with the piston in the vacuum reservoir, and the prealignment roller that is fixed on the guide frame top; Described guide frame is connected with at least one spring, under driving, the piston of described guide frame in described vacuum reservoir make described spring generation deformation simultaneously away from described silicon chip, described silicon chip comprises full wafer and broken silicon wafers, the position corresponding full wafer of difference and broken silicon wafers that described register pin is set.
4. the prealignment device of compatible broken silicon wafers as claimed in claim 3 is characterized in that, described broken silicon wafers is 1/4 silicon chip.
5. the prealignment device of compatible broken silicon wafers as claimed in claim 3 is characterized in that, described register pin is distributed on two gulde edges of described silicon chip.
6. the prealignment device of compatible broken silicon wafers as claimed in claim 3, it is characterized in that described prealignment roller is a rolling bearing, have a groove on the described sucker, described prealignment roller is mobile in described groove, and the described silicon chip of ejection is finished prealignment work.
7. the prealignment device of compatible broken silicon wafers as claimed in claim 3 is characterized in that, described guide frame is the parallel double axis of guide.
8. the prealignment device of compatible broken silicon wafers as claimed in claim 7 is characterized in that, described spring is the compression spring, and it is set in described parallel double axis of guide outside, and described compression spring is consistent with the flexible direction of the described parallel double axis of guide.
9. the prealignment device of compatible broken silicon wafers as claimed in claim 3 is characterized in that, described guide frame is a swing arm.
10. the prealignment device of compatible broken silicon wafers as claimed in claim 9, it is characterized in that described spring is extension spring, the one end is connected with described swing arm, the other end is fixed on the described prealignment seat, has an angle between described swing arm and the described extension spring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200910195195 CN102012640B (en) | 2009-09-04 | 2009-09-04 | Pre-alignment method and device for being compatible with broken silicon wafers |
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| CN 200910195195 CN102012640B (en) | 2009-09-04 | 2009-09-04 | Pre-alignment method and device for being compatible with broken silicon wafers |
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| CN102012640A CN102012640A (en) | 2011-04-13 |
| CN102012640B true CN102012640B (en) | 2013-09-11 |
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| CN103246166B (en) * | 2012-02-02 | 2015-03-25 | 上海微电子装备有限公司 | Silicon wafer prealignment measuring apparatus |
| CN106527062B (en) * | 2017-01-11 | 2018-11-27 | 惠科股份有限公司 | Exposure machine and image offset prevention method and system thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249337B1 (en) * | 1999-11-03 | 2001-06-19 | Orc Manufacturing Co. | Alignment mechanism and process for light exposure |
| CN1937202A (en) * | 2006-10-13 | 2007-03-28 | 大连理工大学 | Silicon wafer prealigning device |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
| CN101436004A (en) * | 2008-12-01 | 2009-05-20 | 上海微电子装备有限公司 | Method for pre-aligning silicon chip |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249337B1 (en) * | 1999-11-03 | 2001-06-19 | Orc Manufacturing Co. | Alignment mechanism and process for light exposure |
| CN1937202A (en) * | 2006-10-13 | 2007-03-28 | 大连理工大学 | Silicon wafer prealigning device |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
| CN101436004A (en) * | 2008-12-01 | 2009-05-20 | 上海微电子装备有限公司 | Method for pre-aligning silicon chip |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
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