CN1697768A - Substrate-levitating device - Google Patents

Substrate-levitating device Download PDF

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Publication number
CN1697768A
CN1697768A CNA2004800004365A CN200480000436A CN1697768A CN 1697768 A CN1697768 A CN 1697768A CN A2004800004365 A CNA2004800004365 A CN A2004800004365A CN 200480000436 A CN200480000436 A CN 200480000436A CN 1697768 A CN1697768 A CN 1697768A
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CN
China
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mentioned
substrate
glass substrate
come
contact member
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Granted
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CNA2004800004365A
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Chinese (zh)
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CN1697768B (en
Inventor
冈平裕幸
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Olympus Corp
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Olympus Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A contact member (13) provided on the top of a support member (10) is lifted by a lifting mechanism (6) with a substrate (2) levitated. This causes the contact member (13) to be in contact with the back face of the substrate (2), limiting the movement of the substrate (2) being levitated.

Description

Substrate-levitating device
Technical field
The present invention relates to a kind of substrate-levitating device that makes as employed glass substrate come-up in the Liquid Crystal Display (LCD) flat-panel monitors (FPD) such as (LCD).
Background technology
For example under the situation that the LCD glass substrate is checked, must be registered to glass substrate on the reference position.For example the spy opens flat 8-313815 communique and discloses glass substrate positioning device.In this registration device, by ball roller (ball caster), will keep the platform mounting on XY worktable, this maintenance platform is used for absorption and keeps glass substrate, the application force that utilization compresses cylinder moves this maintenance platform, and the lateral margin of glass substrate directly is crimped onto on each reference pins aims at.
Along with the size increase of glass substrate, absorption keeps the maintenance platform of glass substrate and the size of XY worktable also increasing.Especially, in the XY worktable, come whole of observation glass substrate, must have 4 times the installing space that is equivalent to glass substrate, whole plant bulk is increased for mobile glass substrate on the XY direction and with microscope.And along with the increase that keeps the platform size, weight also increases, and keeps platform when moving, and when directly being crimped onto the lateral margin of glass substrate on each reference pins, its impulsive force might make glass substrate breakage.
And, open the spy that disclosed technology is in the 2000-9661 communique: on a plurality of rollers in the roller transport unit mounting under the state of glass substrate, utilize the action of cylinder, glass substrate is crimped onto on the locating dowel pin aims at.In this alignment methods, along with the increase of glass substrate, the friction force between glass substrate and a plurality of roller increases, and is difficult to glass substrate is pressed on the locating dowel pin with cylinder.And, when glass substrate with the perpendicular direction of the rotation direction of a plurality of rollers on when being pressed, glass substrate skids mobile on a plurality of rollers.Therefore, on the back side of glass substrate, might produce the Friction mark of roller.
In order to address these problems, can to consider glass substrate to be floated, thereby it is positioned by upwards blowing air.Because glass substrate external force a little can be moved, rebound again after running into reference pins, so, can not stop immediately, this makes the poor stability of aligning.Moreover, because the friction force between pneumatic come-up table top and the glass substrate face is minimum,,, might make glass substrate breakage so the impulsive force of reference pins is increased so along with the glass substrate size increases, the weight of glass substrate itself increases.And, owing to utilize air or static to wait glass substrate is floated, so the friction force between come-up table top and the glass substrate face is minimum, therefore the problem that produces is: when aiming at or transmit glass substrate, glass substrate is subjected to very little external force or the force of inertia of itself and moves.
Summary of the invention
According to main points of view of the present invention, a kind of like this substrate-levitating device can be provided, have: the last float means that makes substrate-levitating; The contact member at the back side that can contact substrate; Be provided with the supporting member of contact member at leading section; And lifting mechanism, above-mentioned supporting member is risen, make contact member contact the back side of the substrate that is floated by last float means, thereby the mobile of substrate limited.
Description of drawings
Fig. 1 is the constructional drawing that expression relates to the 1st embodiment of the 1st substrate-levitating device of the present invention.
Fig. 2 is the constructional drawing that expression relates to the 2nd substrate-levitating device of the present invention.
Fig. 3 is the constructional drawing of the substrate-levitating device of the expression LCD manufacturing line that is suitable for this device.
Fig. 4 is the constructional drawing of each transport unit in the LCD manufacturing line.
Fig. 5 is that expression utilizes this device to limit the figure of the state that moves of glass substrate.
Fig. 6 is the External view that is suitable for the come-up bench board of using in the substrate calibration unit of this device.
Fig. 7 is the constructional drawing that expression relates to the 2nd embodiment of substrate-levitating device of the present invention.
Fig. 8 is the figure of another maintaining body of the various contact membraneses in this device of expression.
The specific embodiment
Following with reference to accompanying drawing, describe the 1st embodiment of the present invention in detail.
Fig. 1 is the integral structure figure of the 1st substrate-levitating device.On the surperficial 1a of come-up bench board 1, a plurality of fumarole 1h for example are set regularly, described fumarole 1h is used for certain air pressure ejection air.In this come-up bench board 1, glass substrate 2 mountings on the surperficial 1a of bench board, by from each fumarole 1h injection air, come between the surperficial 1a of come-up bench board 1 and glass substrate 2, to form air layer, glass substrate 1 is floated at the surperficial 1a of come-up bench board 1.And come-up bench board 1 is not limited only to the air floating method, also can utilize methods such as static come-up or super sonic come-up, and glass substrate 2 is floated from work top.
On come-up bench board 1, be provided with the 1st substrate holding mechanism 3A.The 1st substrate holding mechanism 3A is set at from above-below direction and passes in the cylindrical hole 4 of come-up bench board 1.On the lower surface 1b of the come-up bench board 1 that is provided with this hole 4, be provided with U word shape supporting member 5, and u word base plate 5a is arranged on the below.At the lower surface of the U word base plate 5a of this U word shape supporting member 5, be provided with as transmission device as air cylinder 6.
The expansion link 7 of this air cylinder 6 is gone up set hole by U word base plate 5a, and is outstanding to the top of U word base plate 5a.At the leading section of the expansion link 7 of this air cylinder 6, the connecting part by being made of bolt part 8 and nut portions 9 has connected substrate holder 10.In this substrate holder 10, on expansion link 7 coaxial, be provided with supporting station 11 and support rod 12.Supporting station 11 forms cylindric, is attached to the leading section of expansion link 7 by bolt part 8 and nut portions 9.Support rod 12 is arranged on the supporting station 11, has formed external diameter than little cylindric of the external diameter of supporting station 11.
At the leading section of support rod 12, the cylindric contact member 13 that is formed by the resistance to abrasion resin has been installed.In this contact member 13, on bottom surfaces 15, be provided with the hole 13a that diameter is a bit larger tham the external diameter of support rod 12.In the hollow part of this contact member 13, inserted support rod 12 by hole 13a.
On support rod 12, be provided with contact member 13, between support rod 12 and contact member 13, be provided with ball bearing body 16 cylindraceous, ball bearing of main shaft 17, and make contact member 13 freely along the rotation of arrow A direction.
On the periphery of the support rod 12 between the upper side 11a of the bottom surfaces 15 of contact member 13 and supporting station 11, as coil spring 18 is set, contact member 13 is applied application force upwards as elastic component.The application force of this coil spring 18 (elastic force), the pressing force at the back side of the glass substrate 2 of 13 pairs of come-ups of contact member is set to optimum value, that is to say, this optimum value can make contact member 13 with less friction force, and contact the back side of glass substrate 2 with the pressing force that can not cause influences such as friction scar and distortion to glass substrate 2, described less friction force makes the glass substrate 2 of come-up, not can because of than with the following pressing force of press pad 43 or each transport unit external force little during 32～35 non-absorptions to the contact pressure of glass substrate 2, perhaps Zi Chong inertia and moving.This contact member 13 is supported in the leading section of support rod 12 by coil spring 18, and can move up and down on the arrow B direction.
The flexible stroke of the expansion link 7 that is produced by air cylinder 6 is set to such length in advance, this length equals:, add to produce the slight distance that makes the contact member 13 and the lower surface of the glass substrate 2 that floats contact, not make the contact resistance that glass substrate 2 moves in the upper side 14 of the contact member 13 when expansion link 7 shrinks on the distance of the lower surface that floats on the glass substrate 2 on the come-up bench board 1.
Fig. 2 is the integral structure figure of the 2nd substrate-levitating device.And, for the part identical, marking identical mark with Fig. 1, its detailed description is omitted.On come-up bench board 1, be provided with the 2nd substrate holding mechanism 3B.Leading section at the expansion link 7 of the air cylinder 6 of the 2nd substrate holding mechanism 3B by bolt part 8 and nut 9, has connected supporting frame 20.This supporting frame 20 for example forms cylindricly, and absorption layer mounting hole 21 is set in inside.In this absorption layer mounting hole 21, be provided with the ring-type translot portion 23 that moving up and down of absorption layer 22 limited.The internal diameter of this translot portion 23 is greater than the internal diameter of absorption layer mounting hole 21.
On the bottom surface of absorption layer mounting hole 21, be provided with absorption layer 22, and between the bottom surface and absorption layer 22 of absorption layer mounting hole 21, be provided with the bellows 25 as the absorption layer support unit, this bellows 25 is flexible on above-below direction, and is made of elastic components such as rubber, resin, metals.
Absorption layer 22 is also used as the resistance to abrasion resin as forming discoideus contact member.In this absorption layer 22, form as circular pad groove 26 on top; Form the set collar 27 that limits moving up and down in the bottom.This set collar 27 is installed in the translot portion 23.
Between absorption layer 22 and bellows 25 and supporting frame 20, be provided with each air by-pass passage 28a～28c.Air by-pass passage 28c is crooked in supporting frame 20, arrives the outside wall surface of supporting frame 20, forms air suction inlet 29 on this outside wall surface.On this air suction inlet 29, be connected on the asepwirator pump by suction pipe 24 grades.
Utilize asepwirator pump to pass through each air by-pass passage 28a～28c aspirated air, the absorption of the back side of glass substrate 2 is fixed on the absorption layer 22.The attractive force of asepwirator pump also can be set to such size, and promptly the friction force that produces between the back side of the glass substrate 2 of absorption layer 22 (contact member) and come-up makes that glass substrate 2 can be because of the mobile size of the inertia that is subjected to very little external force or deadweight.
The application force of this bellows 25 (elastic force), the pressing force at the back side of the glass substrate 2 of 22 pairs of come-ups of absorption layer is set to optimum value, that is to say, this optimum value can make absorption layer 22 with less friction force and contact the back side of glass substrate 2 with the pressing force that can not cause influences such as friction scar and distortion to glass substrate 2, described less friction force makes the glass substrate 2 of come-up, can be because of the little external force of the contact pressure of glass substrate 2 or the inertia of deadweight generation not being moved than with the following pressing force of press pad 43 or 32～35 non-absorption of each transport unit the time.
The flexible stroke of the expansion link 7 that is produced by air cylinder 6 is preestablished such length, this length equals:, add to produce the slight distance that makes the absorption layer 22 and the lower surface of the glass substrate 2 that floats contact, not make the contact resistance that glass substrate 2 moves in the upper side of the absorption layer 22 when expansion link 7 shrinks on the distance of the lower surface that floats on the glass substrate 2 on the come-up bench board 1.
Below explanation is applicable to the action of the substrate holding mechanism of said structure the situation of the substrate inspection process of LCD manufacturing line.
Fig. 3 is the constructional drawing of the substrate-levitating device of the expression LCD manufacturing line that is suitable for the 1st and the 2nd substrate holding mechanism 3A, 3B.On the surperficial 1a of the come-up bench board 1 that transmits usefulness, be provided with a plurality of fumarole 1h regularly on the direction in length and breadth.
On the two sides of come-up bench board 1, be provided with each guide rail 30,31 of linearity respectively.On these guide rails 30,31, for example be provided with each each transport unit 32,33 and 34,35 of 2 groups, and each transport unit 32,33 and 34,35 can be moved by linear motor driven.Each transport unit 32,33 of one group synchronously on each guide rail 30,31, moves back and forth by the arrow C direction mutually; Each transport unit 34,35 of another group also mutually synchronously on each guide rail 30,31, moves back and forth by arrow D direction.
Fig. 4 is the constructional drawing of each transport unit 32～35.These transport units 32～35 have same structure, so only transport unit 32 is illustrated.On transport unit 32, utilize each lifting supporting member 36,37, be provided with absorption objective table 38.Each lifting supporting member 36,37 synchronously makes absorption objective table 38 go up lifting at above-below direction (Z direction).On this absorption objective table 38, on the direction identical, be provided with a plurality of as 5 substrate absorption devices 39 with the direction of transfer E of glass substrate 2.And the quantity that is provided with of substrate absorption device 39 is not limited only to 5, also any amount can be set.Each substrate absorption device 39 adsorbs the back side of glass substrate 2 by suction air.
On the come-up bench board 1 of LCD manufacturing line, have: substrate transfer part S 1, the glass substrate 2 that sends from upstream side is delivered to the S of check portion of downstream side 2And the S of check portion 2, be arranged on this substrate transfer part S 1Downstream side.
At substrate transfer part S 1In come-up bench board 1 on, be provided with a plurality of cylindrical holes 4, in these cylindrical holes 4, be provided with the 1st substrate holding mechanism 3A shown in Figure 1 respectively.These the 1st substrate holding mechanisms 3A is set on rectangular each corner location, and described rectangular length direction is on LCD manufacturing line direction.The 1st substrate holding mechanism 3A utilizes air, can make glass substrate 2 float into the approximate horizontal state in come-up on the bench board 1, so, also can be arranged on as on 1 position corresponding to the substantial middle position of glass substrate 2.
At the S of check portion 2On, be provided with each reference pins 42 that fixedly installs, and can respectively press pad 43 what the direction that the edge of glass substrate 2 is pushed (arrow G direction) go up to move.At the S of this check portion 2On, H-frame pole 44 be arranged to across the come-up bench board 1 state.This H-frame pole 44 can be gone up in the direction identical with the direction of transfer E of glass substrate 2 (arrow F direction) and move.On this H-frame pole 44, be provided with microlens 45, and it can be moved going up with the perpendicular direction (arrow J direction) of direction of transfer E.If can make glass substrate 2 under the state of come-up on the come-up bench board 1, utilize each transport unit 34,35 as prescribed spacing on the arrow E direction to move, so, also can H-frame pole 44 be set fixed form.
At the S of check portion 2In come-up bench board 1 on, also can for example on pairing 4 positions of rectangular each corner location that has length direction on the LCD manufacturing line direction, 4 holes be set respectively, in these holes 4, be provided with the 2nd substrate holding mechanism 3B shown in Figure 2 respectively.
Below, the transmission of the glass substrate 2 in the above-mentioned LCD manufacturing line and the action of substrate check are described.
Come-up bench board 1 if from a plurality of fumarole 1h with uniform air pressure ejection air, then between the surperficial 1a of come-up bench board 1 and glass substrate 2, form air layer, glass substrate 2 floats on the surperficial 1a of come-up bench board 1.
Each substrate absorption device 39 of each transport unit 32,33 adsorbs maintenance to the two edges of the front of the direction of transfer E in the glass substrate 2 of pneumatic come-up.This transport unit 32,33 is being adsorbed glass substrate 2 under the state of maintenance, towards the direction of transfer E of LCD manufacturing line, synchronously moves on each guide rail 30,31 respectively.Like this, by the glass substrate 2 that air blows floating, along with moving of each transport unit 32,33, E transmits at a high speed to direction of transfer.
When glass substrate 2 arrives substrate transfer part S 1The time, each transport unit 32,33 stops to move.Make glass substrate 2 by under the state that blows floating, each the 1st substrate holding mechanism 3A stretches upwards each expansion link 7 of each cylinder 6 mutually synchronously according to predefined flexible stroke.Along with the extension of these expansion links 7, each contact member 13 rises along each support rod 12.When the rise height that extends when each expansion link 7 reached predetermined height, each cylinder 6 made each expansion link 7 stop to extend respectively.
Its result, the upper side 14 of each contact member 13 of each cylinder 6 as shown in Figure 5, contacts with the back side of the glass substrate 2 that is blowed floating.The upper side 14 of each contact member 13 at this moment is under the application force of each coil spring 18 with the back side of glass substrate 2, with less friction force and can glass substrate 2 not caused the pressing force of influences such as friction scar and distortion contact.The feasible glass substrate 2 that is blowed floating of described less friction force can be because of not moving the contact pressure of the glass substrate 2 little external force or the inertia that produces of conducting oneself with dignity during 32～33 non-absorptions than each transport unit.
Each contact member 13 is made of resin, being mounted on each support rod 12 can be by ball bearing of main shaft 17 rotation, and, utilize the application force of each coil spring 18, move up at upper and lower, so, postures such as mutual inclination when contacting, glass substrate 2 and each contact member 13 along with the back side with glass substrate 2, be rotated or move up and down, and contact with the back side of glass substrate 2.
Like this, under the state that makes glass substrate 2 come-ups, make the back side of each contact member 13 contact glass substrate 2, reduce so be applied to the weight of each contact member 13.Therefore, the upward friction drag between facial 14 of glass substrate 2 and each contact member 13 only is reduced to otherwise applies the degree that external force just can not make glass substrate 2 move.And each contact member 13 is owing to the predetermined altitude of each expansion link 7 to each cylinder 6 extends, so stop on the position of sustained height.Like this, glass substrate 2 on even keels keep down not moving.
Then, each transport unit 32,33 stops the absorption of glass substrate 2 is kept, and what turn back to glass substrate 2 sends into side (upstream side).
Each transport unit 32,33 turn back to send into side in, each transport unit 34,35 moves to substrate transfer part S 1The front side of the direction of transfer E of middle glass substrate 2, each substrate absorption device 39 in these transport units 34,35 begin the absorption action.When 32,33 pairs of glass substrates of each transport unit 2 finished absorption, each the 1st substrate holding mechanism 3A synchronously made each contraction pole 7 of each cylinder 6 shrink mutually.Each the 1st substrate holding mechanism 3A leaves the back side of glass substrate 2, and glass substrate 2 floats on come-up bench board 1.
These transport units 34,35 are being adsorbed glass substrate 2 under the state of maintenance, respectively synchronously on each guide rail 30,31, move to the downstream side of LED manufacturing line, and glass substrate 2 high speeds are sent to the S of check portion 2
When glass substrate 2 arrives the check S of portion 2The time, each transport unit 34,35 stops to move.Under the state that makes glass substrate 2 come-ups, the S of check portion 2In each substrate holding mechanism 3B shown in Figure 2 mutually synchronously, by predetermined flexible stroke, each expansion link 7 of each cylinder 6 is stretched upwards.Along with the elongation of this expansion link 7, the absorption layer 22 that is arranged on the supporting frame 20 rises.When expansion link 7 was elongated to predetermined flexible stroke, cylinder 6 made expansion link 7 stop elongation.Like this, each absorption layer 22 contacts with the back side of the glass substrate 2 that is blowed floating.At this moment each absorption layer 22 and the contact pressure of glass substrate 2, under the application force of bellows 25, with the glass substrate 2 of come-up not can because of by pad 43 push or the friction force that move, less of conducting oneself with dignity contact with the back side of substrate 2, and the glass substrate 2 that limit to float is mobile.That is to say that each absorption layer 22 is followed respectively by the moving of pad 43, the friction force that glass substrate 2 is moved is with the friction force on the back side that acts on glass substrate 2, and glass substrate 2 is temporarily stopped.
Under this state, in the time of on the edge that respectively is pressed into glass substrate 2 by pad 43, glass substrate 2 is followed respectively by pad 43 (glass substrate 2 does not break away from respectively the state by pad 43) and is moved, and the adjacent both sides of glass substrate 2 abut on each reference pins 42, and are registered on the reference position.Before beginning this aligning, each transport unit 34,35 stops the absorption of glass substrate 2 is kept, and moves to substrate transfer part S 1Side.
Then, air suctiton inlet 29, suction pipe by air by-pass passage 28a～28c utilize the asepwirator pump aspirated air.Like this, from each absorption layer 22 aspirated air, this air is by being inhaled in the air by-pass passage 28a～28c that is communicated with between bellows 25, supporting member 24, the supporting frame 20.When sucking owing to this air between the back side that makes each absorption layer 22 and glass substrate 2 when inaccessible, in being communicated to air by-pass passage 28a～28c between bellows 25, supporting member 24, the supporting frame 20, the pad groove 26 of absorption layer 22 forms negative pressure, bellows is inhaled flat, and each absorption layer 22 is adsorbed onto on the back side of glass substrate 2.Like this, glass substrate 2 maintenance that is fixed.
Absorption layer 22 descends.The shackle 27 of butt absorption layer 22 on the lower end in the translot portion 23 of ring-type, thus restriction absorption layer 22 descends.
Like this, glass substrate 2 is fixedly remained under the state of come-up bench board 1 by each absorption layer 22, H-frame pole 42 is gone up in the direction identical with the direction of transfer E of glass substrate 2 (arrow E direction) to be moved, and microlens 43 is moved in the perpendicular direction (arrow J direction) of H-frame pole 42 upper edges and direction of transfer E, thus glass substrate 2 is tested.
When the test ending of glass substrate 2, from other each transport unit of downstream side to the S of check portion 2Move, absorption keeps the front of glass substrate 2 and is sent to downstream side.
Transmit the substrate transfer part S of the LED manufacturing line of (エ ア one conveyance) glass substrate 2 at such air 1On, the 1st substrate holding mechanism 3A is set, at the S of check portion 2On the 2nd substrate holding mechanism 3B is set.At substrate transfer part S 1In, even each transport unit 32,33 stops the absorption of glass substrate 2 is kept, also can utilize the 1st substrate holding mechanism 3A to keep glass substrate 2 temporarily, make it stop to move.If only be in free state because of blowing floating, then glass substrate 2 for example moves because of a little inclination or external force such as flow downward.But also can utilize the friction force of the 1st substrate holding mechanism 3A and glass substrate 2, limit moving of glass substrate 2.
At substrate transfer part S 1In, utilizing the friction drag that produces with contacting of the 1st substrate holding mechanism 3A, under the state that moves of the glass substrate 2 that restriction is blowed floating, can stably be delivered to glass substrate 2 each transport unit 34,35 of downstream side.
At substrate transfer part S 1In, when the back side of the glass substrate 2 that is blowed floating contacts with the 1st substrate holding mechanism 3A, also be because the application force of coil spring 18 is set to optimum value, so, even glass substrate 2 slides, also can not influence the back side of glass substrate 2 on the 1st substrate holding mechanism 3A.
At the S of check portion 2In, the come-up glass substrate 2 mountings on each absorption layer 22, friction force between utilization and the 2nd substrate holding mechanism 3B, working fastening glass substrate 2, and under this state,, can be pressed into glass substrate 2 on each reference pins 42, by the pushing of pad 43 by respectively so can stably be registered to glass substrate 2 on the reference position.And, can utilize each absorption layer 22 absorption fixing glass substrate 2 behind the aligning, so glass substrate 2 can not produce offset, and can check glass substrate 2.
The 1st substrate holding mechanism 3A structurally utilizes cylinder 6 to make substrate holder 10 liftings of supporting contact member 13.The 2nd substrate holding mechanism 3B utilizes cylinder 6, makes absorption layer 22 liftings, so the 1st and the 2nd substrate holding mechanism 3A, 3B all can miniaturizations, and is assembled into the substrate transfer part S of LCD manufacturing line easily respectively 1With the S of check portion 2In.
The glass substrate 2 that transmits by air on the LCD manufacturing line is at substrate transfer part S 1In, glass substrate 2 by under the state that blows floating, is transmitted between each transport unit 32,33 and 34,35, so, can carry out air at a high speed and transmit, can shorten the required time of inspection process of glass substrate 2, shorten check pitch time (tact time).
Below use the situation of substrate holding mechanism on the come-up bench board that uses in the explanation substrate calibration unit.
Fig. 6 is the External view of the come-up bench board that uses in the substrate calibration unit.On rectangular-shaped come-up bench board 100, for example be provided with each the 1st substrate holding mechanism 3A shown in Figure 1 at 4 positions.The position that the 1st substrate holding mechanism 3A is set is can be from the position of the glass substrate 2 of rear support come-up, as is arranged on and cooresponding 4 positions of rectangular each corner location.
At the peripheral part of come-up bench board 1, each reference pins 50 that constitutes detent mechanism is fixedly installed on each limit of XY, and with opposed limit, these limits on be provided with respectively by pad 51, and make respectively and can move by pad 51.
Make glass substrate 2 under the state that floats on the come-up bench board 1, if the expansion link 7 of each the 1st substrate holding mechanism 3A is extended upward by predetermined flexible stroke, then as shown in Figure 5, the back side of the upper side 14 contact glass substrates 2 of each contact member 13 of each cylinder 6.Contact member 13 contacts with the back side of less pressing force with the glass substrate 2 of come-up under the application force of each coil spring 18, and described less contact force makes the glass substrate 2 of come-up not move under less than the external force effect of the pressing force of pressing pad 51.And contact member 13 can not impact the back side of glass substrate 2, can make glass substrate 2 on even keels of come-up keep down not moving.
Under this state, when when respectively making glass substrate 2 be crimped onto each reference pins 50 by pushing of pad 51, glass substrate 2 can stably be registered on the reference position.
After the aligning of glass substrate 2 finished, each cylinder 6 shrank expansion link 14.When expansion link 14 shrinks, glass substrate 2 at the state float downward that keeps aiming at above bench board 100.
Under this state, the H-frame pole 44 of microlens shown in Figure 3 45 grades for example has been installed, on directions X, move, and microlens 45 moves on the Y direction and glass substrate 2 is tested.
When being applicable to the come-up bench board 100 of substrate calibration unit as described above, also can contact the friction force that produces with each contact member 13 by the glass substrate 2 of come-up, limit the moving of glass substrate 2 of come-up, and follow the tracks of and respectively be crimped on each reference pins 50 by pad 51.So, the same in the time of can be with the substrate inspection process that is applicable to the LCD manufacturing line, can stably be positioned at glass substrate 2 on the reference position.
The 2nd embodiment of the present invention below is described.And for the part mark identical mark identical with Fig. 1, its detailed description is omitted.
Fig. 7 is the constructional drawing of substrate holding mechanism.On the peristome of cylindrical hole 4 set on the come-up bench board 1, be provided with annular support member 60.This annular support member 60 has a pair of ring- type holding piece 60a, 60b on above-below direction.On this annular support member 60, utilize holding piece 60a, 60b to carry out clamping, make contact membranes 61 be in the state of being tightened up.This contact membranes 61 forms uniform thickness by the resistance to abrasion resin, and can stretch.And the contact membranes 61 of annular support member 60 also can be as shown in Figure 8, and 2 layers of 2 different ring- type holding piece 60a, 60b of external diameter being set inside and outside in the horizontal carries out clamping.
4 bottom is provided with pipeline 63 by connecting piece 62 in the hole.The other end at this pipeline 63 has connected compressed-air supply portion 64.This compressed-air supply portion 64 supplies pressurized air by pipeline 63 in hole 4.
On this pipeline 63, be provided with air pressure control cock 65.This air pressure control cock 65 is regulated air supplied flow in hole 4 by adjusting aperture, perhaps carries out the open and close that air is supplied with by opening action and closing movement.This air pressure control cock 65 is regulated the compressed-air supply amount in hole 4 like this: by supplying with pressurized air, pressure in the hole 4 is risen, make the friction force at the back side of glass substrate 2 of contact membranes 61 when contact membranes 61 is upwards heaved and come-up, the mobile of glass substrate 2 limited, and can not cause influences such as damage the back side of glass substrate 2.
Below explanation utilizes the mobile action that limit of the substrate holding mechanism of said structure to glass substrate 2.
Under the state that floats on the glass substrate 2 on the come-up bench board 1, in hole 4, supply with pressurized air by pipeline 33.At this moment, air pressure control cock 65 is opened valve, and regulate in hole 4 charge air of supplying with by the aperture that regulates the valves, make the air delivery volume reach following state: the pressure in the hole 4 rises, make the friction force at the back side of glass substrate 2 of contact membranes 61 when contact membranes 61 upwards expands and come-up, the mobile of glass substrate 2 limited, and can not cause influences such as damage the back side of glass substrate 2.
When in hole 4, supplying with pressurized air, form sealing in the hole 4, so hole 4 pressure inside increase, meanwhile, the pressure that is added on the contact membranes 61 also increases.Therefore, contact membranes 61 expands shown in the dotted line of Fig. 7 upward.This expansion makes contact membranes 61 form homogeneous thickness, so the rise height of the central portion of contact membranes 61 reaches the highest, along with leaving central portion, this reduces highly gradually.
Because this contact membranes 61 expands, when its central portion contacted the back side of glass substrate 2, because the less friction force between glass substrate 2 and the contact membranes 61, glass substrate 2 can not move, but remains on the contact membranes 61.At this moment contact membranes 61 expands because of supplying with pressurized air, and has elasticity, so, flexibly abut to glass substrate 2, can not cause influences such as damage to the back side of glass substrate 2.
This substrate holding mechanism is used for replacing the substrate transfer part S of the come-up bench board 1 of LCD manufacturing line as shown in Figure 3 1The 1st substrate holding mechanism 3A of last setting, set the 1st substrate holding mechanism 3A on the come-up bench board 100 of substrate calibration unit perhaps shown in Figure 6 can obtain respectively and the identical effect of above-mentioned the 1st embodiment.According to this substrate holding mechanism, utilize the simple structure that contact membranes 61 is expanded, can access and the identical effect of above-mentioned the 1st embodiment.
The present invention is not limited only to above-mentioned the 1st～the 3rd embodiment, also can carry out various distortion.The situation of the come-up bench board 100 of the come-up bench board 1 that is applicable to the LCD manufacturing line or substrate calibration unit for example has been described in the respective embodiments described above, but be not limited to this, also go for the bench board 100 that respectively floats that sending in substrate calibration unit or the various apparatus for manufacturing substrate sent side.
Below explanation for example, on the come-up bench board 1 of sending into side on the LCD manufacturing line, is provided with the situation of the 1st substrate holding mechanism 3A with elevating function.The side of sending at come-up bench board 1 is provided with to send into and uses manipulator.Each the 1st substrate holding mechanism 3A utilizes the driving of air cylinder 6, makes each contact member 13 rise to the height that receives glass substrate 2 from the absorption layer of sending into the side manipulator.Under this state, send into manipulator absorption layer is descended, on each contact member 13 of the 1st substrate holding mechanism 3A of glass substrate 2 mountings to the come-up bench board 1.
Then, come-up bench board 1 sprays air from a plurality of fumarole 1h.Under this state, air cylinder 6 descends each the 1st substrate holding mechanism 3A, and glass substrate 2 stops at than on the high slightly position, pneumatic come-up position.At this moment, glass substrate 2 under the pneumatic come-up state by mounting to each contact member 13, so, under pneumatic come-up state, can not move yet.Then, with shown in Figure 3 identical, use by reference pins 42 with by the aligning guide that pad 43 constitutes and aim at.
The substrate transfer part S of LCD manufacturing line 1Or the S of check portion 2In the 1st, the 2nd substrate holding mechanism 3A, 3B quantity is set, do not only limit to 4 positions respectively, also can be as constituting 3 positions on leg-of-mutton each summit, perhaps making glass substrate 2 keep a plurality of positions stable and that the friction force between glass substrate 2 and each contact member 13 is not increased.
Contact member 13 is carried out flexibly mounted member be not limited to coil spring 18, also can adopt to form rubber cylindraceous.
Also can change the area of contact size at 22 pairs of glass substrate 2 back sides of contact member 13 and absorption layer, adjust and glass substrate 2 between the size of the friction drag that produced.Like this, even air jet forces is identical, when the size of change glass substrate 2, the deadweight of glass substrate 2 changes according to size, so can adapt to the deadweight of this glass substrate 2.
Make the method for glass substrate 3 come-ups be not limited to pneumatic come-up, the present invention also can be applicable to the static come-up, the mobile situation about limiting of the glass substrate of super sonic come-up.
Utilizability on the industry
The present invention has been illustrated the transmission of the large-area glass substrate 1 that for example is applicable to liquid crystal display Situation, but also can be applicable to the transmission of semiconductor wafer or various parts.
Claims
(according to the modification of the 19th of treaty)
1 (revising the back), a kind of substrate-levitating device is characterized in that having:
Make the last floating platform of aforesaid substrate come-up;
Contact member, with on float on the above-mentioned back side of going up the aforesaid substrate on the floating platform and contact, restriction aforesaid substrate mobile; And
Lifting mechanism, be arranged on the above-mentioned come-up table top, when aforesaid substrate is transmitted under the state of come-up in location under the state of come-up or with aforesaid substrate, make above-mentioned contact member rise to the height and position of the aforesaid substrate back side being given friction force, this friction force does not move aforesaid substrate, perhaps, when aforesaid substrate is transmitted under the state of come-up, above-mentioned contact member is descended to the direction of leaving the aforesaid substrate back side.
2, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member is formed by the resin with resistance to abrasion.
3 (revise back), substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member is arranged on respect on the vertical supporting member of aforesaid substrate face with being rotated freely, and forms and follow moving of aforesaid substrate and rotation cylindric.
4 (revising the back), substrate-levitating device as claimed in claim 1, it is characterized in that: above-mentioned contact member is arranged on the above-mentioned lifting mechanism, and between above-mentioned contact member and above-mentioned lifting mechanism, be provided with elastic component, so that above-mentioned contact member is given little friction force, this little friction force does not move aforesaid substrate because of the inertia to aforesaid substrate externally applied forces or deadweight generation.
5 (revise back), substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned go up floating platform have will come-up aforesaid substrate be positioned on the reference position reference pins and by pad,
When with aforesaid substrate under the state of come-up when locating, above-mentioned liter rises above-mentioned contact member mechanism, and gives friction force to the back side of aforesaid substrate it is temporarily stopped.
6 (revising the back), substrate-levitating device as claimed in claim 5, it is characterized in that: above-mentioned contact member contacts with the back side of aforesaid substrate with little friction force by the above-mentioned pressing force of pressing pad.
7 (revising the back), substrate-levitating device as claimed in claim 1, it is characterized in that: the above-mentioned floating platform of going up has substrate transfer mechanism, this substrate transfer mechanism along to the upstream side of the transmission position of aforesaid substrate and downstream with the manufacturing line that the edge absorption of aforesaid substrate keeps and transmits, move back and forth;
Above-mentioned lifting mechanism is under the state that aforesaid substrate is being floated, from the substrate transfer mechanism of above-mentioned upstream side when the substrate transfer mechanism in above-mentioned downstream is transmitted, make above-mentioned contact member rising and give friction force, thereby the restriction aforesaid substrate is mobile the aforesaid substrate back side.
8 (revising the back), substrate-levitating device as claimed in claim 7, it is characterized in that: it is small that above-mentioned lifting mechanism rises to apart from the distance of the substrate back of above-mentioned come-up above-mentioned contact member, makes aforesaid substrate not because of the contact resistance of the mobile degree of inertia so that produce.
9 (revising the back), substrate-levitating device as claimed in claim 8, it is characterized in that: above-mentioned contact member contacts with the aforesaid substrate back side, during with the non-absorption of convenient aforesaid substrate connecting gear,, produce and make the not friction force of mobile degree of aforesaid substrate by contact pressure to aforesaid substrate.
10 (revising the back), substrate-levitating device as claimed in claim 10, it is characterized in that: in the above-mentioned contact member, with be adsorbed in the absorption layer at the aforesaid substrate back side and the cylindric elastic component that this absorption layer can be supported movably on above-below direction, be installed on the framework;
Above-mentioned lifting mechanism makes above-mentioned framework move up at upper and lower, so that above-mentioned absorption layer contacts with the aforesaid substrate back side.
11 (revising the back), substrate-levitating device as claimed in claim 10 is characterized in that:
When on the inner air intake passage that forms of above-mentioned elastic component, connecting asepwirator pump, when above-mentioned absorption layer contacts with the aforesaid substrate back side, above-mentioned contact member is attracted to above-mentioned substrate back with suction pressure by above-mentioned asepwirator pump, and this suction pressure can not move by inertia the substrate of above-mentioned come-up.
12 (revising the back), a kind of substrate-levitating device is characterized in that having:
Make the last floating platform of aforesaid substrate come-up;
Be arranged on the hole on the above-mentioned come-up table top;
Contact membranes is by constituting at the resin with the peristome setting in the opposed above-mentioned hole of aforesaid substrate;
Compressed-air supply mechanism be communicated with to be provided with in above-mentioned hole, and supplies with pressurized air to above-mentioned contact membranes so that above-mentioned contact membranes expands and with on float on the above-mentioned aforesaid substrate back side of going up on the floating platform and contact, thereby the restriction aforesaid substrate is mobile.
13 (revising the back), substrate-levitating device as claimed in claim 12 is characterized in that:
Compressed-air supply mechanism has and regulates the control cock that air is pressed, and opening action and closing movement by above-mentioned control cock come control is opened/closed in the supply of air, and regulate the delivery volume of the above-mentioned air in above-mentioned hole.

Claims (13)

1, a kind of substrate-levitating device is characterized in that having:
Make the last float means of aforesaid substrate come-up;
Can contact the contact member at the back side of aforesaid substrate;
Be provided with the supporting member of above-mentioned contact member at leading section; And
Lifting mechanism rises above-mentioned supporting member, and above-mentioned contact member is contacted with the back side of the aforesaid substrate that is floated by above-mentioned upward float means, and the mobile of aforesaid substrate limited.
2, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member is formed by the resin with resistance to abrasion.
3, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member forms cylindric, the back side of a peristome contact aforesaid substrate.
4, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member is arranged on the above-mentioned supporting member, is provided with elastic component between above-mentioned contact member and above-mentioned supporting member.
5, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member is arranged on the above-mentioned supporting member rotationally by ball bearing of main shaft.
6, substrate-levitating device as claimed in claim 4, it is characterized in that: above-mentioned elastic component has pressing force, the pressing force of the contact resistance that the aforesaid substrate that this pressing force makes above-mentioned contact member float with the generation restriction moves contacts with the back side of aforesaid substrate.
7, substrate-levitating device as claimed in claim 4 is characterized in that: above-mentioned elastic component is coil spring or rubber cylindraceous.
8, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned lifting mechanism has the transmission device of band expansion link.
9, substrate-levitating device as claimed in claim 8 is characterized in that: the above-mentioned float means of going up has the come-up bench board that sprays air,
Above-mentioned transmission device makes above-mentioned expansion link flexible by following stroke distances, this distance be with the upper side of the above-mentioned contact member when above-mentioned expansion link shrinks to the come-up height of the distance of the upper surface of above-mentioned come-up bench board, aforesaid substrate, be used to produce the distance apart from addition of above-mentioned pressing force, above-mentioned pressing force produces the above-mentioned contact resistance that the restriction aforesaid substrate moves.
10, substrate-levitating device as claimed in claim 1 is characterized in that: above-mentioned contact member forms and the contacted absorption layer in the aforesaid substrate back side, and above-mentioned supporting member has: the mounting hole that can install above-mentioned absorption layer movably to top; Elastic component at the above-mentioned absorption layer of above-mentioned mounting hole internal support; Between above-mentioned absorption layer, above-mentioned elastic component and above-mentioned supporting member, be communicated with the air intake passage that is provided with.
11, substrate-levitating device as claimed in claim 10 is characterized in that: above-mentioned elastic component is formed by bellows.
12, substrate-levitating device as claimed in claim 10 is characterized in that: when by above-mentioned air intake passage extracting air, above-mentioned absorption layer absorption is aforesaid substrate fixedly.
13, a kind of substrate-levitating device is characterized in that having:
Make the last float means of substrate-levitating; Be arranged on above-mentioned hole of going up on the float means; Contact membranes is made of the resin in the peristome setting in above-mentioned hole; And,
Compressed-air supply mechanism supplies with pressurized air by above-mentioned hole to above-mentioned contact membranes, and above-mentioned contact membranes is expanded, and above-mentioned contact membranes is pressed into by on the back side of the aforesaid substrate of above-mentioned upward float means come-up, limits moving of aforesaid substrate.
CN2004800004365A 2003-04-30 2004-04-26 Substrate-levitating device Expired - Fee Related CN1697768B (en)

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CN1697768B (en) 2011-03-30
JPWO2004096679A1 (en) 2006-07-13
TWI368757B (en) 2012-07-21
JP4418428B2 (en) 2010-02-17
KR20060015414A (en) 2006-02-17
WO2004096679A1 (en) 2004-11-11
CN102152966A (en) 2011-08-17
TW200500635A (en) 2005-01-01
CN102152966B (en) 2013-03-27

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