CN105752686A - Substrate Processing Device - Google Patents
Substrate Processing Device Download PDFInfo
- Publication number
- CN105752686A CN105752686A CN201610210419.9A CN201610210419A CN105752686A CN 105752686 A CN105752686 A CN 105752686A CN 201610210419 A CN201610210419 A CN 201610210419A CN 105752686 A CN105752686 A CN 105752686A
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- China
- Prior art keywords
- substrate
- bearing member
- board treatment
- roller
- treatment according
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/16—Pneumatic conveyors
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Liquid Crystal (AREA)
- Advancing Webs (AREA)
- Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Handling Of Sheets (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
A transfer apparatus for transferring a substrate is provided with: a supporting member which has a supporting surface that supports one surface of the substrate, and has a plurality of through holes formed therein, said through holes penetrating between the supporting surface and the surface on the reverse side of the supporting surface; and a holding mechanism, which is provided with a gas suction section disposed to face a first region of the rear surface of the supporting member, said first region including the holes, and a gas supply section disposed to face a second region of the rear surface of the supporting member, said second region being different from the first region. The holding mechanism holds the rear surface of the supporting member in a non-contact state and sucks the substrate to the supporting surface via the through holes by supplying and sucking a gas with respect to the rear surface of the supporting member.
Description
The present patent application is international filing date to be on November 01st, 2012, international application no be PCT/JP2012/078378, the national applications number entering National Phase in China are 201280072170.X, denomination of invention is the divisional application of patent application of " forming method of Handling device and electronic device ".
Technical field
The present invention relates to Handling device.
Japan's Patent 2012-084819 that the application applied for according on April 3rd, 2012 requires priority, and its content is incorporated herein.
Background technology
As the display element constituting the display devices such as display equipment, it is known to the electrophoresis element etc. used in such as liquid crystal display cells, organic electroluminescent (organic EL) element, Electronic Paper.A method of the electronic device of the display pannel etc. of these elements is had as fabrication and installation, such as known have volume to volume (rolltoroll) mode that is referred to as (following, be abbreviated as " spool mode ") method (for example, referring to patent documentation 1).
Spool mode is following method: sent by the substrate of a piece of lamellar on the roller being wound on substrate supply side, and while batching, with the roller of substrate recovery side, the substrate sent, carrying substrate on one side, pass out to from substrate be taken up till between, substrate sequentially forms the pattern for electronic device (display pixel circuits, drive circuit, wiring etc.).In recent years it has been proposed that form the process device of high-precision pattern.
At first technical literature
Patent documentation
Patent documentation 1: International Publication the 2006/100868th
Summary of the invention
But, when the high-precision refinement wanting higher precision and the display floater tackling pattern, it is desirable to improve the carrying precision of substrate.Such as, during being processed by process device, it is desirable to is carried under the state that the surface of substrate is maintained certain state.
The purpose of the solution of the present invention is in that, it is provided that the Handling device of carrying under the state that the surface of substrate can be maintained certain state.
Additionally, the purpose of other schemes of the present invention is in that, it is provided that carrying substrate under the state that the surface of substrate is maintained certain state, the method forming electronic device on a surface of the substrate simultaneously.
For solving the means of problem
According to the solution of the present invention, it is provided that a kind of Handling device, it is the Handling device of carrying substrate, has: a bearing member, there is the bearing-surface in the face of a side of supporting substrates, be formed with multiple through holes at the back side of through bearing-surface and this bearing-surface；Maintaining body, it has and the gas suction unit of in back side of a bearing member, to comprise multiple hole first area relative configuration, and with the gas supply part of the second area relative configuration in the back side of bearing member, this second area is the region different from first area, maintaining body by carrying out supply and the attraction of gas relative to the back side of a bearing member, the back side of a bearing member is kept with contactless state, and, make substrate adsorption on the bearing surface via multiple through holes.
Other scheme according to the present invention, the forming method of a kind of electronic device is provided, it it is the method forming electronic device on the surface of the flexible substrate of strip, comprise: at the surface of bearing member mounting substrate, bearing member is laminated shape by the material higher than substrate rigidity, and is formed with multiple through holes at through surface and the back side；By gas suction unit, making substrate adsorption on the surface of a bearing member via multiple through holes, gas suction unit is oppositely disposed with in back side of a bearing member, the to comprise multiple through hole first area；Based on gas supply part, by the back side of gas blanket supporting bearing member, gas supply part and the second area relative configuration in the back side of a bearing member, this second area is the region different from first area；When substrate is attracted on the surface propping up bearing member and is propped up the back side of bearing member by gas blanket supporting, a bearing member is made to move at long side direction by drive division；On the regulation region on the surface of the substrate carried by propping up the movement of bearing member, the pattern for electronic device is formed by patterning device.
Invention effect
According to the solution of the present invention, using the teaching of the invention it is possible to provide a kind of Handling device, it is possible to carry while substrate is maintained at certain state.
Additionally, other the scheme according to the present invention, using the teaching of the invention it is possible to provide the forming method of a kind of electronic device, it is possible to by carrying while substrate is maintained at certain state, substrate is formed the electronic device of high accuracy, fine.
Accompanying drawing explanation
Fig. 1 indicates that the schematic diagram of the structure of the substrate board treatment of present embodiment.
Fig. 2 indicates that the axonometric chart of the structure of the Handling device of present embodiment.
Fig. 3 indicates that the top view of the structure of the Handling device of present embodiment.
Fig. 4 indicates that the sectional view of the structure of the Handling device of present embodiment.
Fig. 5 indicates that the action diagram of the action of the Handling device of present embodiment.
Fig. 6 indicates that the figure of other structures of the substrate board treatment of present embodiment.
Fig. 7 indicates that the figure of other structures of the substrate board treatment of present embodiment.
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of present embodiment.
Fig. 1 indicates that the schematic diagram of the structure of the substrate board treatment 100 of embodiments of the present invention.
As shown in Figure 1, substrate board treatment 100 has: supply is formed as the substrate supply unit 2 of substrate (such as, the film structural component of the banding) S of banding (strip), the processing substrate portion 3 that surface (processed surface) Sa of substrate S is processed, reclaims the substrate recoverer 4 of substrate S, controls control portion (control device) CONT in these each portions.The surface of substrate S is performed various process substrate S to being reclaimed by substrate recoverer 4 sending substrate S from substrate supply unit 2 by processing substrate portion (patterning device) 3.This substrate board treatment 100 can be used in being formed the situation of the display floater (electronic device) of the such as active matrix such as organic EL element, liquid crystal display cells mode on substrate S.
It addition, in the present embodiment, set XYZ coordinate system as shown in Figure 1, be below suitably used this XYZ coordinate system and illustrate.XYZ coordinate system such as sets X-axis and Y-axis along horizontal plane, sets Z axis upward along vertical.Additionally, substrate board treatment 100 entirety is along X-axis, from X-axis minus side (-X-axis side) to the positive side of X-axis (+X-axis side) carrying substrate S.Now, the width (short side direction) of belt base plate S is set as Y direction.
Substrate board treatment 100 can use the paper tinsel (foil) of such as resin molding or rustless steel etc. as the substrate S processing object.Such as, resin molding can use the materials such as polyvinyl resin, acrylic resin, polyester resin, Ethylene Vinyl Ester Copolymers resin (Ethylenevinylcopolymer), Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin.
The substrate that the preferred thermal coefficient of expansion of substrate S is little, even if so that bearing the heat of such as about 200 DEG C, the size of substrate is also constant.Such as can inorganic filler be blended in resin molding and reduce thermal coefficient of expansion.As the example of inorganic filler, titanium oxide, zinc oxide, aluminium oxide, silicon oxide etc. can be listed.Additionally, substrate S also is able to be the monomer of the very thin glass of the thickness about 100 μm manufactured by floating method etc., or the duplexer of fit on this very thin glass above-mentioned resin molding or aluminium foil.
The width (short side direction) of substrate S be dimensioned so as to such as about 1m～2m, length direction (long side direction) be dimensioned so as to such as more than 10m.Certainly, this size is only an example, however it is not limited to this.Such as, the size in the Y direction of substrate S can be below 1m or below 50cm, it is also possible at more than 2m.Additionally, the size in the X-direction of substrate S can also at below 10m.
Substrate S is formed as having flexibility.So-called flexible at this, even if referring to and substrate being applied the power of deadweight degree without cracking or fracturing, it is possible to make the character that aforesaid substrate bends.Additionally, the character bent because of the power of degree of conducting oneself with dignity is also contained in flexibility.Additionally, above-mentioned flexibility changes according to environment such as the material of aforesaid substrate, size, thickness or temperature etc..It addition, as substrate S, it is possible to use the substrate of a piece of banding, it is possible to use connect multiple unit substrate and be formed as the structure of banding.
The substrate S of such as rolled shaft-like is sent and supplies to processing substrate portion 3 by substrate supply unit 2.In this case, in substrate supply unit 2, it is provided with the axle portion of winding substrate S and the rotating driving device etc. making above-mentioned axle portion rotate.In addition, it is also possible to be configured to: be provided with the substrate S of such as state by the shaft-like wound into a roll cover portion etc. covered.It addition, substrate supply unit 2 is not limited to send the mechanism of the substrate S of shaft-like wound into a roll, as long as comprising the mechanism's (such as clipping driving roller etc.) sent successively in its longitudinal direction by the substrate S of banding.
Substrate recoverer 4 reclaims such as coiling into reel by the substrate S after substrate board treatment 100.In substrate recoverer 4, identically with substrate supply unit 2, the axle portion for winding substrate S and the rotary driving source making above-mentioned axle portion rotate, the cover portion etc. covering the substrate S reclaimed it are provided with.It addition, substrate S is cut in processing substrate portion 3 in the situation etc. of plate (panel) shape, it is also possible to be configured to: such as with states different from the state of shaft-like wound into a roll such as the state recovery that substrate S is overlapping to reclaim substrate S.
The substrate S supplied from substrate supply unit 2 is carried to substrate recoverer 4 by processing substrate portion 3, and processed surface Sa process to substrate S in the process of carrying.Processing substrate portion 3 has process device 10 and Handling device 20.
Process device 10 and there are the various devices for the processed surface Sa of substrate S is formed such as organic EL element.As such device, can list such as forming the next door forming apparatus in next door on processed surface Sa, for forming the electrode forming apparatus of electrode, for forming the luminescent layer forming apparatus etc. of luminescent layer.
More specifically, apparatus for coating liquid droplet (such as inkjet type apparatus for coating etc.), film formation device (such as electroplanting device, evaporation coating device, sputtering unit etc.), exposure device, developing unit, surfaction device, rinser etc. can be listed.These each devices are suitably arranged along the transport path of substrate S.
Handling device 20 has multiple guide reels (carrying mechanism illustrate only two rollers 5,6 in FIG) of guiding substrate S in processing substrate portion 3 and the base supporting mechanism (maintaining body) 30 of supporting substrates S.Guide reel 5 (carrying mechanism) is arranged in, about the transport path of substrate S, the upstream side processing device 10, and guide reel (carrying mechanism) 6 is arranged in, about the transport path of substrate S, the downstream processing device 10.At least some of guide reel in multiple guide reels (carrying mechanism) is provided with rotary drive mechanism (not shown).In the present embodiment, the length of the transport path of the substrate S in Handling device 20 is about such as total length hundreds of meters.
Fig. 2 indicates that the structure chart of a part for Handling device 20.
As in figure 2 it is shown, Handling device 20 has successively from the upstream side in the carrying direction of the substrate S of strip: guide reel 5 (with reference to Fig. 1), niproll (carrying mechanism) R1 and R2, base-plate cleaning portion 21, tension adjustment roller (carrying mechanism) R3, electrostatic removing unit (removing device) 22, base supporting mechanism 30, electrostatic removing unit (removing device) 23, substrate adsorption roller (carrying mechanism) R4, niproll (carrying mechanism) R5 and R6, guide reel 6 (with reference to Fig. 1).Wherein, guide reel 5, niproll R1 and R2, tension adjustment roller R3, substrate adsorption roller R4, niproll R5 and R6, guide reel 6 are to arrange along the transport path of substrate S, are contained in the structure in above-mentioned multiple guide reel.
First, illustrate about niproll R1 and R2 of carrying substrate S, tension adjustment roller R3, substrate adsorption roller R4, niproll R5 and R6.The central shaft (being rotating shaft when the roller for rotating) of each roller R1～R6 configures each other in the Y-axis direction abreast.
Niproll R1 and R2 carries the state rotation of the substrate S come to clip via the guide reel 5 in Fig. 1, is transferred to the downstream (+Z axis side) in carrying direction by aforesaid substrate S.Substrate S is clamped, it is possible to suppress from the upstream side of above-mentioned niproll R1 and R2 via the substrate S vibration transmitted by niproll R1 and R2.
Tension adjustment roller R3 adjusts the tension force of the short side direction (width) of substrate S while rotating, and is transferred to the downstream in carrying direction by substrate S.Tension adjustment roller R3 tapers into central part from the both ends of central axis direction for example formed as diameter.The length of the short side direction of substrate S is adjusted by tension adjustment roller R3.It addition, the carrying direction transformation of substrate S next for the carrying of edge+Z-direction is+X-direction by tension adjustment roller R3.
The porous material that substrate adsorption roller R4 can be passed through by gas is formed.The outer peripheral face of substrate adsorption roller R4 plays a role as the guide surface R4a at the back side guiding substrate S.Substrate adsorption roller R4 has the suction unit 25 attracting gas from guide surface R4a to roller private side.Suction unit 25 has the attraction path 25b that the inside with substrate adsorption roller R4 is connected.It is provided with suction pump 25a in attracting path 25b.Reduced the internal pressure of substrate adsorption roller R4 by the attraction action of suction pump 25a, thus the gas of the surrounding of substrate adsorption roller R4 is attracted to inside from guide surface R4a.Such as substrate S can be adsorbed onto guide surface R4a by this captivation by substrate adsorption roller R4.
Substrate adsorption roller R4 has drive division 26.Drive division 26 rotates driving substrate adsorption roller R4 by the control of control portion CONT.Control portion CONT can control the timing and driving force etc. of the driving undertaken by drive division 26.Substrate adsorption roller R4 when making substrate S be adsorbed in guide surface R4a, deasil can rotate along figure, thus, by substrate S to the carrying of+X-axis side.So, substrate adsorption roller R4 is as by making suction unit 25 and drive division 26 work give the tension force imparting mechanism of the tension force specified to substrate S and play a role.It addition, control portion CONT is by adjusting the driving force of drive division 26, it is possible to adjust the substrate S tension force given.Therefore, substrate adsorption roller (the first roller) R4, suction unit 25, drive division 26 and control portion CONT play a role as adjusting the adjustment portion to the tension force that substrate S gives.
Niproll R5 and R6 rotates when hold via the substrate S that substrate adsorption roller R4 carrying is next, is transferred to the downstream in carrying direction by aforesaid substrate S.Substrate S is clipped, it is possible to suppress from the downstream of above-mentioned niproll R5 and R6 via the substrate S vibration transmitted by niproll R5 and R6.Additionally, the part between aforesaid substrate adsorption roller R4 and niproll R5 and R6 that substrate adsorption roller R4, niproll R5 and R6 are in substrate S becomes carrying substrate S in the way of lax state.Therefore, niproll (the second roller) R5 and R6 plays a role as the part in the adjustment portion adjusted the tension force that substrate S gives.
Additionally, base-plate cleaning portion 21 is arranged on the position between niproll R1 and R2 and tension adjustment roller R3.Base-plate cleaning portion 21 has such as not shown ultrasonic wave generator and suction device etc..Base-plate cleaning portion 21 can pass through to employ hyperacoustic dry clean device (drycleaner) etc. to the foreign body on the processed surface Sa removing aforesaid substrate S of substrate S carry from niproll R1 and R2 to tension adjustment roller R3.It addition, also be able to as base-plate cleaning portion 21 use the rinser with liquid spray and functions/drying.
Electrostatic removing unit 22 is arranged on the carrying downstream in direction of the substrate S of tension adjustment roller R3, between such as tension adjustment roller R3 and base supporting mechanism 30, and is arranged on the top across substrate S.Electrostatic removing unit 22 removes the substrate S carried by base supporting mechanism 30 electrostatic (electric charge) being with.Additionally, electrostatic removing unit 23 is arranged between the upstream side of substrate adsorption roller R4, such as base supporting mechanism 30 and substrate adsorption roller R4, and it is arranged on the top across substrate S.Electrostatic removing unit 23 removes the electrostatic (electric charge) being with of the substrate S from the carrying of base supporting mechanism 30 downstream side.
Base supporting mechanism 30 is arranged between tension adjustment roller R3 and substrate adsorption roller R4.It addition, the mentioned strain in substrate S adjusts the section sets between roller R3 and substrate adsorption roller R4 the processing region 10p processing device 10.By the part of processing region 10p in base supporting mechanism 30 supporting substrates S, simultaneously with the back side of the speed supporting aforesaid substrate S Tong Bu with the transporting velocity of the substrate S between tension adjustment roller R3 and substrate adsorption roller R4.
Base supporting mechanism 30 has band portion (bearing member) 31, band trucking department 32 and guide table 33.Additionally, base supporting mechanism 30 has the electrostatic removing unit 38 of the electrostatic being with cleaning part 37 and removing on the surface in cleaning tape portion 31 with portion 31.
Use the material higher than substrate S rigidity with portion 31, for instance the laminal component of metal material processing of rustless steel etc., be formed as ring-type.Supported surface (back side relative to the face of the process) Sb of the bearing-surface 31a supporting substrates S being arranged on outer peripheral face is passed through with portion 31.With portion 31 is provided with the multiple through hole 31h being arranged in the circumferential with rounding.Each through hole 31h is formed as through between the bearing-surface 31a with portion 31 and the back side 31b of the dorsal part being arranged on above-mentioned bearing-surface 31a.In the present embodiment, the plurality of through hole 31h is formed with five row in the Y-axis direction.The supported surface Sb of the part with portion 31 and substrate S is arranged as opposed to.
Supported surface Sb with portion 31 supporting substrates S.It addition, the quantity of the row of multiple through hole 31h in Y direction is not limited to five row, it is possible to for any row.The quantity of the through hole 31h arranged additionally, round can also be arbitrary.
Band trucking department 32 has four transport roller (drive division) 32a～32d.Band portion 31 is hung with in transport roller 32a～32d roll.That is, four transport roller 32a～32d contact with the inner peripheral surface with portion 31.Two transport roller 32a and transport roller 32b in four rollers are arranged in the upstream side (-X-axis side) in the carrying direction of substrate S compared with guide table 33.Other two transport roller 32c and transport roller 32d are arranged in the downstream (+X-axis side) in the carrying direction of substrate S compared with guide table 33.Therefore, being configured to portion 31 with relative to the processing region 10p processing device 10, the mode crossed in the X-axis direction moves.
The direction of principal axis of transport roller 32a and transport roller 32b configures in the Y-axis direction abreast.Additionally, transport roller 32a and transport roller 32b separated from each other compartment of terrain configuration in the way of arranging in the Z-axis direction.In the same manner, the direction of principal axis of transport roller 32c and transport roller 32d configures in the Y-axis direction abreast.Additionally, transport roller 32c and transport roller 32d separated from each other compartment of terrain configuration in the way of arranging in the Z-axis direction.
The position of transport roller 32a～32d be adjusted to make with portion 31 when having tension force in rotary moving.Additionally, about, between transport roller 32b and transport roller 32c and between transport roller 32d and transport roller 32a, configuring when the position consistency of X-direction, so that band portion 31 is moved parallel in the X-axis direction.
At least one in transport roller (roller component) 32a～32d is drive the driving roller with portion 31.Transport roller 32d is provided with drive division 32e.In the present embodiment, for instance transport roller (drive division) 32d is for driving roller, and remaining transport roller 32a～32c is driven voller.Alternatively, it is also possible to be, formed as the transport roller 32d driving roller by such as porous material, and, transport roller 32d is connected with not shown suction device, makes to be adsorbed in portion 31 outer peripheral face of transport roller 32d, power is transferred to band portion 31.
Guide table 33 by such as combine multiple gas can by Porous material and formed.The tabular being shaped as rectangle of guide table 33.Guide table 33+face (guide surface) 33a of Z axis side is formed parallel to X/Y plane.Guide table 33 guides substrate S in the way of mobile to the long side direction of substrate S and the direction (X-direction) moved with portion 31.
Guide table 33 is arranged between transport roller 32b and transport roller 32c in the X-axis direction.Additionally, guide table 33 is configured to overlapping with band portion 31 in the Y-axis direction.Guide table 33 is arranged in the inner side with portion 31.The guide surface 33a of guide table 33 is relatively arranged with the back side (inner peripheral surface) 31b with portion 31.Guide table 33 is by not shown fixed mechanism fixed position.
Fig. 3 indicates that the figure of structure when observing base supporting mechanism 30 from+Z axis side.In figure 3, there iing guide table 33 with the configured under of portion 31.
Gas suction unit 33s is formed by the Porous material extended in the X-axis direction, and the first area AR1 formed with row in the back side with portion 31, through hole 31h is arranged as opposed to.Therefore, when band portion 31 is in rotary moving, the through hole 31h of each row becomes and moves on the 33s of gas suction unit.
Gas supply part 33t is identical with gas suction unit 33s, the Porous material extended in the X-axis direction formed, and gas suction unit 33s and gas supply part 33t is alternately arranged in Y direction (width).Separated by partition member 34 between gas suction unit 33s and gas supply part 33t.Partition member 34 be arranged to from guide table 33-end of the end of X-axis side to+X-axis side crosses guide table 33 in the X-axis direction.
Gas supply part 33t is arranged as opposed to the second area AR2 in the back side with portion 31, and wherein, second area AR2 is the region different from first area AR1.That is, it is arranged as opposed between the row of the through hole 31h in gas supply part 33t and the back side with portion 31.It addition, second area AR2 is formed at between each first area AR1 being formed at five places relative to Y direction in portion 31.Thus, in band portion 31, being alternately configured with second area AR2 and first area AR1 in the Y-axis direction, the two ends in the Y direction with portion 31 are configured with second area AR2.
Fig. 4 indicates that the figure of the structure along the A-A section in Fig. 3.
As shown in Figure 4, gas suction unit 33s is connected with attraction system 35.Attraction system 35 has suction pump 35a and attracts path 35b.Gas suction unit 33s is connected with suction pump 35a via attraction path 35b.Path 35b is attracted to be connected to bottom surface (face of-Z axis side) the 33b side of guide table 33.Therefore, in the 33s of gas suction unit, attract gas by gas suction unit 33s to the direction departing from bottom surface 33b from guide surface 33a.
Additionally, gas supply part 33t is connected with feed system 36.Feed system 36 has gas supply source 36a and feed path 36b.Gas supply part 33t is connected with gas supply source 36a via feed path 36b.Feed path 36b is connected to the 33b side, bottom surface of guide table 33.Therefore, in gas supply part 33t, from bottom surface 33b by the gas supply part 33t direction supply gas to disengaging guide surface 33a.
It addition, as shown in Figure 3, above-mentioned band portion 31 is formed with position reference portion 31c.Position reference portion 31c be such as formed in the circumferential direction with portion 31-end of Y-axis side on.
Position reference portion 31c represents the benchmark of the position for the X-direction or Y direction detecting substrate S.With portion 31+Z axis side be provided with detection position reference section 31c encoder EC.The testing result of encoder EC sends to control portion CONT.
By the control of control portion CONT, the testing result according to encoder EC, carry out the rotary speed of such as transport roller 32d and the adjustment of the transporting velocity of substrate S.
The substrate board treatment 100 constituted as described above, under the control of control portion CONT, manufactures the display element such as organic EL element, liquid crystal display cells (electronic device) by spool mode.
Following description uses the substrate board treatment 100 of above-mentioned composition to manufacture the operation of display element.
First, the substrate S of the banding being wound on not shown roller is arranged on substrate supply unit 2.
By the control of control portion CONT, in the way of sending aforesaid substrate S from the substrate supply unit 2 of this state, not shown roller is made to rotate.Then, the not shown roller by being arranged on substrate recoverer 4 batches the aforesaid substrate S after by processing substrate portion 3.By controlling this substrate supply unit 2 and substrate recoverer 4, it is possible to relative to the processed surface Sa of processing substrate portion 3 carrying substrate S continuously.
Control by control portion CONT, after substrate S sends from substrate supply unit 2 to being batched by substrate recoverer 4 between, while carrying aforesaid substrate S in aforesaid substrate process portion 3 by the Handling device 20 in processing substrate portion 3, on substrate S, sequentially form the element of display element by processing device 10.
When passing through process device 10 and processing, when using the base supporting mechanism 30 carrying substrate S of Handling device 20, by the control of control portion CONT, first become the state of held roller R1 and the R2 clamping of substrate S.By this action, the vibration from the upstream side of above-mentioned niproll R1 and R2 is difficult to be transferred to substrate S.
By the control of control portion CONT, substrate S is made to carry to tension adjustment roller R3 by niproll R1 and R2.By the control of control portion CONT, arrive the midway of tension adjustment roller R3 at substrate S, use base-plate cleaning portion 21 that substrate S is carried out.Arrive tension adjustment roller R3 by substrate S and hang on mentioned strain adjustment roller R3, and substrate S is given the tension force of Y direction.
Based on the control of control portion CONT, substrate S is made to carry to substrate adsorption roller R4 by tension adjustment roller R3.Additionally, make band portion 31 rotate by the control of control portion CONT.Now, by the control of control portion (control device) CONT, the rotation of substrate adsorption roller R4 and the rotation of transport roller 32d is made to synchronize, so that the translational speed of substrate S and the translational speed with portion 31 become equal.Before substrate S arrives base supporting mechanism 30, by the control of control portion CONT, electrostatic removing unit 22 is used to remove the substrate S electrostatic being with.By the control of control portion CONT, the period being arranged in the upstream side of base supporting mechanism 30 at substrate S carries out the removing of electrostatic.
Then, by the control of control portion CONT, substrate S is carried to+X-axis side, by base supporting mechanism 30 in+X-direction.Now, by the control of control portion CONT, electrostatic removing unit 23 is used to remove the electrostatic of substrate S.By the control of control portion CONT, use substrate adsorption roller R4, substrate S is given the tension force of X-direction.
After substrate S gives the tension force of X-direction, by the control of control portion CONT, from gas supply part 33t supply gas, and gas suction unit 33s attracts gas, and thus, substrate S is adsorbed in the bearing-surface 31a with portion 31.The substrate S moment being adsorbed in the bearing-surface 31a with portion 31 is made to make the transporting velocity of substrate S higher than the rotary speed in band portion 31 it addition, CONT control in control portion is formed in.
Fig. 5 indicates that the figure of the structure along the A-A section in Fig. 3.Fig. 5 indicates that the supply carried out by the gas of gas supply part 33t and the figure of state by the attraction of the gas of gas suction unit 33s when.
As it is shown in figure 5, when from gas supply part 33t supply gas, above-mentioned gas the guide surface 33a of guide table 33 and with the back side 31b in portion 31 between form gas blanket.Additionally, when being attracted by gas suction unit 33s, the gas of the part constituting gas blanket is attracted by gas suction unit 33s.Now, control portion CONT can pass through to adjust quantity delivered and the traffic attraction of gas, makes gas blanket be maintained at certain thickness.About the adjustment amount based on control portion CONT now, it is possible to use and carry out in advance testing or simulation etc. and the data etc. that obtain.
Additionally, by the attraction of gas suction unit 33s, via each through hole 31h with portion 31 relative with above-mentioned gas suction unit 33s, the supported surface Sb of substrate S is adsorbed on bearing-surface 31a.
Like this, in base supporting mechanism 30, guide table 33 is with the contactless state supporting back side 31b with portion 31, and band portion 31 makes substrate S be adsorbed on bearing-surface 31a to support.Now, owing to substrate S to be given by substrate adsorption roller R4 the tension force of X-direction, and by tension adjustment roller R3, substrate S is given the tension force of Y direction, thus without forming gauffer etc. on substrate S, keep in a flattened condition.By the control of control portion CONT, in this condition, use processes the device 10 processed surface Sa process to substrate S.
Additionally, by the control of control portion (control device) CONT, in this condition, substrate adsorption roller R4 rotates and transport roller 32d rotates, thereby, it is possible to make the transporting velocity of substrate S and the translational speed with portion 31 synchronize with constant speed.Therefore, maintain the smooth state of substrate S, while making substrate S and band portion 31 move to+X-direction.Additionally, by the control of control portion (position adjustment portion) CONT, use encoder EC, detection is formed at the position reference portion 31c on the bearing-surface 31a in portion 31, adjusts substrate S and with the position relationship between portion 31 based on this testing result.It addition, by the control of control portion CONT, use and be properly carried out the cleaning with portion 31 with cleaning part 37, and use electrostatic removing unit 38 to carry out the removing of the electrostatic with portion 31.
As described above, the Handling device 20 of present embodiment has: band portion 31, has the bearing-surface 31a of the supported surface Sb of supporting substrates S, is formed with multiple through hole 31h of the back side 31b of through bearing-surface 31a and above-mentioned bearing-surface 31a；With base supporting mechanism 30, it has: gas suction unit 33s, is oppositely disposed with the first area AR1 comprising multiple through hole 31h in the back side 31b in portion 31；And gas supply part 33t, it is oppositely disposed with the second area AR2 in the back side 31b in portion 31, wherein, second area AR2 is the region different from first area AR1, described base supporting mechanism 30 by carrying out supply and the attraction of gas relative to the back side 31b with portion 31, the back side 31b with portion 31 is kept with contactless state, and, substrate S is made to be adsorbed on bearing-surface 31a via multiple through hole 31h, it is possible to keep substrate S with smooth state, further, it is possible to smooth state carrying aforesaid substrate S.
The technical scope of the present invention is not limited to above-mentioned embodiment, can apply suitable change in without departing from the main scope of the present invention.
Such as, in the above-described embodiment, although illustrate the structure being shaped as rectangular shape of the processing region 10p processing device 10, but be not limited to this.
Such as, as shown in Figure 6, when being provided with the exposure device EX with multiple projection optical system (PL1～PL5) as process device 10, the view field of projection optical system PL1～PL5 is processing region 10p.
In figure 6, projection optical system PL1, PL3 and the PL5 upstream side in the carrying direction of substrate S is configured to string, projection optical system PL2 and PL4 along Y direction and is configured to string in the downstream in the carrying direction of substrate S along Y direction.So, exposure device EX is configured to projection optical system PL1, PL3 and PL5 and projection optical system PL2 and PL4 configures with staggering in the X-axis direction.It addition, each view field 10p of projection optical system PL1～PL5 is configured to a part for Y direction overlap between mutually adjacent view field 10p when observing from X-direction.
It addition, about the quantity of projection optical system and configuration, be not limited to the example shown in Fig. 6.For example, it is also possible to be equipped with the structure of less than four or more than six projection optical systems.Further, it is also possible to be multiple projection optical system structure of being configured to string, or multiple projection optical system is configured to the structure that three row are above.
Additionally, as shown in Figure 7, it is also possible to it is multiple process head H structure being arranged.In this case, the upstream side in the carrying direction of substrate S is provided with one and processes head H, is provided with two in the downstream in the carrying direction of substrate S and processes head H.Therefore, processing region 10p is formed at three positions on substrate S.In this case, it is also possible to be equipped with the structure of two or four process above head H, it is also possible to be set to the differently configured configuration with Fig. 7.
Additionally, in the above-described embodiment, although illustrate in guide table 33, between gas suction unit 33s and gas supply part 33t, be provided with the structure of the partition member 34 blocking gas, but be not limited to this.It can also be the structure being such as not provided with partition member 34.
Additionally, in the present embodiment, be illustrated about the structure being provided with electrostatic removing unit 22,23 and base-plate cleaning portion 21 but it also may omit the both sides in electrostatic removing unit 22,23 and base-plate cleaning portion 21 or either one.
Description of reference numerals
S: substrate；CONT: control portion；EL: organic；Sa: processed surface；Sb: supported surface；R: guide reel；R1, R2: niproll；R3: tension adjustment roller；R4: substrate adsorption roller；R5, R6: niproll；R4a: outer peripheral face；EC: encoder；AR1: first area；AR2: second area；10: process device；20: Handling device；21: base-plate cleaning portion；22,23: electrostatic removing unit；25: suction unit；26: drive division；30: base supporting mechanism；31: band portion；31a: bearing-surface；31b: the back side；31c: position reference portion；31h: through hole；32: band trucking department；32a～32d: transport roller；33: guide table；33a: guide surface；33b: bottom surface；33s: gas suction unit；33t: gas supply part；35: attraction system；36: feed system.
Claims (15)
1. a substrate board treatment, for being carried on long side direction by the flexible substrate of strip, and carries out being formed on the surface of described substrate the process of electronic device, has:
Bearing member, it has the bearing-surface in face of the side supporting described substrate, and is formed multiple through holes through for the back side of described bearing-surface and described bearing-surface；
Maintaining body, it comprises gas suction unit and gas supply part, this gas suction unit is relative with first area in the back side of described bearing member, that comprise the plurality of through hole supplies negative pressure, for by the described negative pressure via the plurality of through hole by the described substrate adsorption described bearing-surface described bearing member, this gas supply part with in the back side of described bearing member, avoid that the second area of the plurality of through hole is relative supplies gas-pressurized, for being supported the described back side of a described bearing member by gas blanket；And
Processing device, it is attracted on the described bearing-surface of a described bearing member and the back side of described bearing member is supported by described gas blanket at described substrate, and described substrate carries out the process for forming described electronic device.
2. substrate board treatment according to claim 1, also has:
Carrying mechanism, it carries described substrate on described long side direction；
Drive division, it drives a described bearing member on described long side direction；And
Controlling device, it controls described carrying mechanism and described drive division, and synchronizes to drive described substrate and described bearing member.
3. substrate board treatment according to claim 2, wherein,
Described maintaining body has guide table, and this guide table is formed with the guide surface at the back side of the described bearing-surface propping up bearing member on described long side direction described in guiding,
Described gas supply part and described gas suction unit are arranged in described guide table.
4. the substrate board treatment according to Claims 2 or 3, wherein,
The plurality of through hole is configured at least arrange more than string on described long side direction.
5. the substrate board treatment according to Claims 2 or 3, wherein,
Described gas suction unit is configured at least arrange more than string on described long side direction.
6. substrate board treatment according to claim 3, wherein,
The guide surface of described guide table uses porous material to be formed.
7. the substrate board treatment according to Claims 2 or 3, wherein,
Described bearing member has the laminal band portion that rigidity is higher than described substrate,
Described drive division has makes the described roller component sent with portion to described long side direction.
8. the substrate board treatment according to Claims 2 or 3, wherein,
There is the tension force imparting mechanism that described substrate gives tension force,
Described substrate is adsorbed on the described bearing-surface of a described bearing member with the state being endowed tension force.
9. substrate board treatment according to claim 8, wherein,
Described tension force imparting mechanism has the adjustment portion adjusted the tension force that described substrate gives.
10. substrate board treatment according to claim 9, wherein,
Described adjustment portion has the first roller, and this first roller is arranged in the downstream of the described long side direction about described bearing member, and adsorbs the back side of described substrate and at the upstream side of described long side direction, described substrate is applied tension force.
11. substrate board treatment according to claim 10, wherein,
Described adjustment portion has the second roller, and this second roller is in the downstream of described first roller, so that the state of described substrate flexure guides described substrate.
12. substrate board treatment according to any one of claim 1 to 3, wherein,
Also having removing device, this removing device removes the electric charge that the one party of described substrate and described bearing member is with.
13. substrate board treatment according to any one of claim 1 to 3, wherein,
Also there is the cleaning part cleaning described bearing-surface.
14. substrate board treatment according to any one of claim 1 to 3, wherein,
Described process device is some in apparatus for coating liquid droplet, film formation device, exposure device, developing unit, surfaction device.
15. substrate board treatment according to claim 14, wherein,
Described bearing member is the laminal metal material that rigidity is higher than described substrate,
The plurality of through hole by formed along described long side direction row and described in be listed on the short side direction orthogonal with described long side direction to arrange multiple row in the way of formed on described laminal metal material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012084819 | 2012-04-03 | ||
| JP2012-084819 | 2012-04-03 | ||
| CN201280072170.XA CN104203779B (en) | 2012-04-03 | 2012-11-01 | The formation method of Handling device and electronics package |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280072170.XA Division CN104203779B (en) | 2012-04-03 | 2012-11-01 | The formation method of Handling device and electronics package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105752686A true CN105752686A (en) | 2016-07-13 |
| CN105752686B CN105752686B (en) | 2018-09-21 |
Family
ID=49300192
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610210419.9A Active CN105752686B (en) | 2012-04-03 | 2012-11-01 | Substrate board treatment |
| CN201280072170.XA Active CN104203779B (en) | 2012-04-03 | 2012-11-01 | The formation method of Handling device and electronics package |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280072170.XA Active CN104203779B (en) | 2012-04-03 | 2012-11-01 | The formation method of Handling device and electronics package |
Country Status (6)
| Country | Link |
|---|---|
| JP (3) | JP6137171B2 (en) |
| KR (5) | KR102000430B1 (en) |
| CN (2) | CN105752686B (en) |
| HK (2) | HK1203183A1 (en) |
| TW (3) | TWI674645B (en) |
| WO (1) | WO2013150677A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013150677A1 (en) | 2015-12-17 |
| KR101854959B1 (en) | 2018-05-04 |
| HK1224264A1 (en) | 2017-08-18 |
| KR20190010732A (en) | 2019-01-30 |
| KR20180072871A (en) | 2018-06-29 |
| TW201836046A (en) | 2018-10-01 |
| JP2018199580A (en) | 2018-12-20 |
| TWI590369B (en) | 2017-07-01 |
| JP6593507B2 (en) | 2019-10-23 |
| WO2013150677A1 (en) | 2013-10-10 |
| KR101879162B1 (en) | 2018-07-16 |
| JP2017144433A (en) | 2017-08-24 |
| CN104203779A (en) | 2014-12-10 |
| KR20180038071A (en) | 2018-04-13 |
| JP6137171B2 (en) | 2017-05-31 |
| TW201929139A (en) | 2019-07-16 |
| HK1203183A1 (en) | 2015-10-23 |
| KR101962083B1 (en) | 2019-03-25 |
| JP6414270B2 (en) | 2018-10-31 |
| CN105752686B (en) | 2018-09-21 |
| KR101809001B1 (en) | 2017-12-13 |
| TWI674645B (en) | 2019-10-11 |
| CN104203779B (en) | 2016-04-20 |
| KR102000430B1 (en) | 2019-07-15 |
| TWI660449B (en) | 2019-05-21 |
| KR20150000476A (en) | 2015-01-02 |
| KR20170095395A (en) | 2017-08-22 |
| TW201351555A (en) | 2013-12-16 |
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