JP2002280340A - Method of cleaning glass substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of cleaning a glass substrate which greatly improves processing capability by expanding the distance between transporting rolls to provide a large unit having a long unit length, while not allowing the glass substrate to meander even the glass substrate is as large as 1 m2 in cleaning a glass substrate, using a single-substrate cleaning apparatus in which water- saving megasonic units are installed. SOLUTION: A stainless plate, having a plurality of small holes or a porous plate, is arranged on the upper part of a lower housing, and the glass substrate is supported by the pressure of the cleaning water and is cleaned. Alternatively, a transfer belt is installed on the upper part of the lower housing, and the glass substrate in the unit is cleaned, while being supported and transferred by the belt: and further, a support roll is installed on the upper part of the lower housing, and the glass substrate in the unit is supported by the roll and is cleaned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning of a glass substrate used for a liquid crystal display device or the like, and particularly to a single-wafer cleaning device using ultrasonic waves, which greatly improves the processing capability. The present invention relates to a method for cleaning a glass substrate.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal display device and the like, a lot of cleaning is performed before and after each processing such as glass plate cleaning, cleaning before resist coating, cleaning after resist coating, and cleaning before thin film formation. This is an important step that affects the yield and productivity of the process. For wet physical cleaning applied to cleaning glass substrates used for liquid crystal display devices, etc.,
Examples include brush scrubbing cleaning, jet spray cleaning, ultrasonic cleaning, and ultra-sonic (megasonic) cleaning.

[0003] Ultrasonic cleaning utilizes cavitation (cavity phenomenon) in a liquid based on high-frequency vibrations having a frequency of about 400 kHz or less, and this cavitation is said to peel off contaminants from a substrate and dissolve them in the cleaning liquid. The megasonic cleaning is based on high-frequency vibration of about 1 MHz, and the acceleration increases as the frequency increases. The vibration acceleration enables cleaning of ultrafine particles. The megasonic cleaning includes a type in which megasonic is irradiated into the cleaning tank and a type called megasonic shower in which megasonic is superimposed on a flowing water film (wash water shower).

FIG. 4 is a sectional view showing the concept of an example of a water-saving nozzle type megasonic unit of the type called a megasonic shower. FIG. 4 shows a state in which the water-saving nozzle-type megasonic unit is attached to a single-wafer cleaning apparatus. Single-wafer cleaning equipment performs cleaning and drying processes one by one while transporting single-wafer-shaped glass substrates consistently and continuously.It can be integrated into various manufacturing processes and becomes the mainstream of cleaning equipment. Is what it is. In the single-wafer cleaning apparatus, the glass substrate is cleaned by the water-saving nozzle-type megasonic unit while being transported from the left to the right of the water-saving nozzle-type megasonic unit by the transport rolls, as indicated by the thick white arrow. It has become.

As shown in FIG. 4, a water-saving nozzle-type megasonic unit has an upper housing (40) having a vibrating element (41) provided above a glass substrate transfer line shown by a dotted line.
A), upper water supply pipe (46A), upper drain pipe (4
7A) and the lower housing (40) below the glass substrate transport line.
B), lower water supply pipe (46B), lower drain pipe (4
7B). Upper case (40A)
Is composed of an upper ultrasonic irradiation surface (42A), a side surface (43A), an upper surface (44A), and a side bottom surface (45A). A lower housing (40B) has a lower ultrasonic irradiation surface (42B) and a side surface (4A).
3B), a bottom surface (44B), and a side upper surface (45B). Then, the upper housing (40A) and the lower housing (40A)
B) is provided such that the upper ultrasonic irradiation surface (42A) and the lower ultrasonic irradiation surface (42B) face each other and sandwich a flowing water film (wash water shower) indicated by an arrow.

[0006] The cleaning water supplied from the upper water supply pipe (46A) and the lower water supply pipe (46B) flows between the upper ultrasonic irradiation surface (42A) and the lower ultrasonic irradiation surface (42B). ) Is formed, and the upper drain pipe (47A) and the lower drain pipe (4) sucked by the pump are formed.
7B), the leakage between the side bottom surface (45A) and the side top surface (45B) is minimized while maintaining the balance between the supply amount and the discharge amount. The megasonic of about 1 MHz from the vibrating element (41) is superimposed on the flowing water film (wash water shower). The thickness of the flowing water film (wash water shower) is set so as to minimize the megasonic attenuation. By setting, Megasonic removes and cleans ultra-fine particles effectively.

Further, the flow rate of the washing water is set to the minimum amount required for discharging the ultrafine particles so that the separated ultrafine particles do not adhere to the glass substrate again. And the distance between the glass substrate (1) and the lower ultrasonic irradiation surface (42B) and the glass substrate (1). That is, the glass substrate is cleaned with a minimum required amount of cleaning water by controlling the distance between the ultrasonic irradiation surface and the glass substrate, and the balance of supply and discharge of cleaning water, and is called a water-saving nozzle-type megasonic shower. As described above, the amount of washing water used is significantly smaller than that of other systems.

[0008] Further, the discharged washing water can be collected and reused. The lower ultrasonic irradiation surface (42B) reflects the megasonic from above and also cleans the back surface of the glass substrate (1), but the cleaning ability is lower than that of the front surface of the glass substrate (1). Therefore, it is preferable to provide another vibration element below the lower ultrasonic irradiation surface (42B).

Also, a solution obtained by adding a very small amount (50 ppm or less) of an additive (gas or chemical) to ultrapure water, for example, hydrogen water,
Ozone water, electrolytic ionic water, etc. are called functional water. By using functional water whose hydrogen ion concentration and oxidation-reduction potential are controlled as cleaning water, in addition to separating ultrafine particles from the substrate, organic substances, metals, etc. And contaminants such as oxide films can be removed. That is, by using the water-saving nozzle-type megasonic unit shown in FIG. 4 and the functional water together, this unit alone has a cleaning capability equal to or higher than that of another glass substrate cleaning device, and the device can be downsized. Can be done.

As described above, the single-wafer type cleaning apparatus, which is the mainstream of the cleaning apparatus, performs the cleaning process and the drying process continuously one by one while transporting a single glass substrate. Although it has the feature that it can be in-lined in various manufacturing processes, if the transfer and processing speed of the single wafer type cleaning device is not increased and the speed remains the same, the processing as the number of glass substrates with the increase in the size of the glass substrate There is a problem that the ability is reduced. The transport and processing speed of the current single-wafer cleaning apparatus is about 1.2 m / min, and when the size of the glass substrate is increased to about 1 m2,
The processing capacity is about 1 sheet / minute. About 1 sheet /
There is a strong demand that this processing capacity be greatly improved, for example, to about 2.5 sheets / minute or more, with respect to the processing capacity of about one minute.

[0011] Simply increasing the transport speed of the single-wafer cleaning apparatus would reduce the cleaning effect. To cope with this, the unit length (A4) of the water-saving nozzle-type megasonic unit was increased. Although it is conceivable to maintain the same cleaning effect even if the cleaning processing length (processing time) is increased and the transport speed is increased, it is difficult to increase the unit length (A4) due to structural limitations of the cleaning apparatus. That is what. That is, the interval (B4) between the transport rolls (48) for transporting the glass substrate is about 130 mm and the unit length (A4) is about 90 mm, but in order to increase the unit length (A4), Conveyance roll (4
If the interval (B4) of 8) is increased to about 130 mm or more, problems such as the glass substrate drooping and meandering between the transport rolls (48) may occur.

[0012]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and uses a single-wafer cleaning apparatus in which the water-saving nozzle-type megasonic unit is provided between transport rolls. In cleaning the glass substrate, even if a water-saving nozzle-type megasonic unit with a large unit length is provided to increase the cleaning process length (processing time) by extending the interval between the transport rolls, the glass substrate hangs between the transport rolls. In addition, cleaning can be performed without meandering, that is, cleaning can be performed without decreasing the cleaning effect even if the transport speed of the cleaning device is increased. It is another object of the present invention to provide a method for cleaning a glass substrate, which can significantly improve the processing capacity as a number of sheets, for example, to about 2.5 sheets / minute or more.

[0013]

SUMMARY OF THE INVENTION The present invention provides a water-saving nozzle type for cleaning a glass substrate with a minimum necessary amount of cleaning water by controlling a distance between an ultrasonic irradiation surface and the glass substrate and a balance between supply and drainage of cleaning water. In cleaning a glass substrate using a single-wafer cleaning apparatus provided with a megasonic unit, a stainless steel plate or a porous plate having a large number of small holes is provided above a lower housing of a water-saving nozzle-type megasonic unit. A glass substrate cleaning method characterized in that a glass substrate in a unit is supported by cleaning water pressure from a hole or a hole, and the glass substrate is cleaned while being transported by a transport roll.

Further, the present invention provides a water-saving nozzle-type megasonic unit for cleaning a glass substrate with a minimum necessary amount of cleaning water by controlling a distance between an ultrasonic irradiation surface and a glass substrate and a balance between supply and drainage of cleaning water. In cleaning a glass substrate using the provided single-wafer cleaning apparatus, a plurality of transfer belts having a circular cross section are provided above the lower housing of the water-saving nozzle-type megasonic unit, and the glass substrate in the unit is provided by the transfer belt. And cleaning while supporting and transporting the glass substrate.

The present invention also provides a water-saving nozzle-type megasonic unit for cleaning a glass substrate with a minimum required amount of cleaning water by controlling the distance between the ultrasonic irradiation surface and the glass substrate and the balance between supply and drainage of cleaning water. In cleaning the glass substrate using the provided single-wafer cleaning apparatus, a support roll is provided above the lower housing of the water-saving nozzle type megasonic unit, the glass substrate in the unit is supported by the support roll, and the glass is transported by the transfer roll. A method for cleaning a glass substrate, comprising cleaning the substrate while transporting the substrate.

[0016]

Embodiments of the present invention will be described below in detail. FIG. 1 is a partial cross-sectional view showing the concept of an embodiment of a single-wafer cleaning apparatus provided with a water-saving nozzle type megasonic unit used in the glass substrate cleaning method according to the present invention. The unit length (A1) of the water-saving nozzle type megasonic unit shown in FIG. 1 is the unit length (A) of the water-saving nozzle type megasonic unit in the conventional method.
For example, it is about 225 mm or more, which is about 2.5 times or more of about 90 mm of 4). Further, the interval (B1) between the transport rolls (18) is, for example, about 325 mm or more, which is about 2.5 times or more the interval (B4) of the transport rolls (48) in the conventional method. .

As shown in FIG. 1, the water-saving nozzle-type megasonic unit has an upper housing (10) having a vibrating element (11) provided above a glass substrate transfer line shown by a dotted line.
A), upper water supply pipe (16A), upper drain pipe (1
7A) and the lower housing (10
B), lower water pipe (16B), lower drain pipe (1
7B). Upper case (10A)
Is composed of an upper ultrasonic irradiation surface (12A), a side surface (13A), an upper surface (14A), and a side bottom surface (15A), and a lower housing (10B) is a stainless steel plate or a porous plate having many small holes. (12B), side (13B), bottom (14B),
It is composed of a side upper surface (15B). The upper housing (10A) and the lower housing (10B) are opposed to each other by an upper ultrasonic irradiation surface (12A) and a stainless steel plate or a porous plate (12B) having a large number of small holes, and a flowing water film indicated by an arrow. (Wash water shower).

The glass substrate (1) transported from the left side of the unit by the transport roll (18) is composed of an upper ultrasonic irradiation surface (12A) and a stainless or porous plate (12B) having a large number of small holes. When it reaches the flowing water film (washing water shower), it is supported by the washing water pressure from the small holes or the pores of the stainless plate or the porous plate (12B) having a large number of small holes, and the unit is transported by the transport roll (18). The cleaning process is performed while being transported inside, and is carried out to the right.

Therefore, the interval (B) between the transport rolls (18)
Even if 1) is as large as, for example, about 325 mm or more, which is about 2.5 times or more, the cleaning process is performed without the glass substrate hanging between the transport rolls (18) and meandering. . Unit length (A1) of the water-saving nozzle-type megasonic unit provided between the transport rolls (18)
Is, for example, about 225 mm or more. Therefore, even if the transport speed is increased to about 2.5 m × 2.5 = 3 m / min or more for about 2.5 sheets, the cleaning effect is not reduced.

That is, the processing capacity as the number of glass substrates is about 2.5 substrates / minute or more even when the size of the glass substrate is increased to about 1 m 2. In the embodiment shown in FIG. 1, since no transport roll is provided in the water-saving nozzle-type megasonic unit, no trouble such as damage to the rear surface of the glass substrate by the transport roll occurs in the unit. .

FIG. 2 is a partial sectional view showing the concept of an example of a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit used in the glass substrate cleaning method according to the second aspect. The unit length (A2) of the water-saving nozzle-type megasonic unit shown in FIG. 2 is, for example, about 2.5 times or more of about 90 mm of the unit length (A4) of the water-saving nozzle-type megasonic unit in the conventional method. 2
It is 25 mm or more. Also, the transport roll (28)
The distance (B2) of the transfer roller (48) in the conventional method is
The distance (B4) is about 130 mm, which is, for example, about 2.5 times or more, and is sufficiently large.

As shown in FIG. 2, the water-saving nozzle-type megasonic unit has an upper housing (20) having a vibrating element (21) provided above a glass substrate transfer line shown by a dotted line.
A), upper water supply pipe (26A), upper drain pipe (2
7A) and the lower housing (20) below the glass substrate transport line.
B), lower water pipe (26B), lower drain pipe (2
7B). Upper case (20A)
Is composed of an upper ultrasonic irradiation surface (22A), a side surface (23A), an upper surface (24A), and a side bottom surface (25A), and a lower housing (20B) has a lower ultrasonic irradiation surface (22B) and a side surface (2A).
3B), a bottom surface (24B), and a side upper surface (25B). Then, the upper housing (20A) and the lower housing (20
B) is provided such that the upper ultrasonic irradiation surface (22A) and the lower ultrasonic irradiation surface (22B) face each other and sandwich a flowing water film (wash water shower) indicated by an arrow.

Above the lower housing (20B), a plurality of conveyor belts (29) having a circular cross section are provided.
The drive roll (8) drives the glass substrate in the transport direction as indicated by the dotted arrow. The glass substrate (1) transported from the left side of the unit by the transport roll (28) is supported by a transport belt (29) in front of the unit, subjected to a cleaning process while being transported in the unit, and transported to the right. It is carried out to a roll (28).

Therefore, the distance (B) between the transport rolls (28)
Even if 2) is sufficiently large, for example, about 2.5 times or more, the cleaning process is performed without the glass substrate hanging between the transport rolls (28) and meandering.
The unit length (A2) of the water-saving nozzle-type megasonic unit provided between the transport rolls (28) is, for example, about 22
Since it is 5 mm or more, even if the transport speed is increased to about 2.5 m × 2.5 = 3 m / min or more for about 2.5 sheets, the cleaning effect is not reduced.

That is, the processing capacity as the number of glass substrates has a processing capacity of about 2.5 substrates / minute or more even when the size of the glass substrate is increased to about 1 m 2. In the example shown in FIG. 2, the transport belt (2
By using Kalrez, crystal rubber, or the like as the material of 9), troubles such as adhesion of dirt on the back surface of the glass substrate do not occur.

FIG. 3 is a partial sectional view showing the concept of an example of a single-wafer cleaning apparatus provided with a water-saving nozzle type megasonic unit used in the glass substrate cleaning method according to the third aspect. The unit length (A3) of the water-saving nozzle-type megasonic unit shown in FIG. 3 is, for example, about 2.5 times or more of about 90 mm of the unit length (A4) of the water-saving nozzle-type megasonic unit in the conventional method. 2
It is 25 mm or more. Also, the transport roll (38)
The distance (B3) of the transfer roller (48) in the conventional method
The distance (B4) is about 130 mm, which is about 2.5 times or more, for example, about 325 mm or more.

As shown in FIG. 3, the water-saving nozzle-type megasonic unit has an upper housing (30) having a vibrating element (31) provided above a glass substrate transfer line shown by a dotted line.
A), upper water supply pipe (36A), upper drain pipe (3
7A) and the lower housing (30) below the glass substrate transport line.
B), lower water pipe (36B), lower drain pipe (3
7B). Upper case (30A)
Is composed of an upper ultrasonic irradiation surface (32A), a side surface (33A), an upper surface (34A), and a side bottom surface (35A). A lower housing (30B) has a lower ultrasonic irradiation surface (32B) and a side surface (3A).
3B), a bottom surface (34B), and a side upper surface (35B). Then, the upper housing (30A) and the lower housing (30A)
B) is provided such that the upper ultrasonic irradiation surface (32A) and the lower ultrasonic irradiation surface (32B) face each other and sandwich a flowing water film (wash water shower) indicated by an arrow.

A support roll (39) is provided above the lower housing (30B) to support a glass substrate in the unit. A plurality of support rolls (39) may be provided according to the size of the interval (B3) between the transport rolls (38). The flowing water film (wash water shower) flows from the right to the left via the lower part of the support roll (39). The glass substrate (1) transported from the left side of the unit by the transport rolls (38) is supported by the support rolls (39) in the unit, undergoes a cleaning process while being transported in the unit, and is unloaded to the right. It is supposed to be.

Therefore, the distance (B) between the transport rolls (38)
Even if 3) is as large as, for example, about 325 mm or more, which is about 2.5 times or more, the glass substrate does not sag between the transport rolls (38), and the cleaning process is performed without meandering. . Unit length of the water-saving nozzle-type megasonic unit provided between the transport rolls (38) (A3)
Is, for example, about 225 mm or more. Therefore, even if the transport speed is increased to about 2.5 sheets of about 1.2 m × 2.5 = 3 m / min or more, the cleaning effect is not reduced. That is, the processing capacity as the number of glass substrates is about 2.times. Even when the size of the glass substrate is increased to about 1 m 2.
It has a processing capacity of 5 sheets / min or more.

As described above, according to the present invention, even if the distance between the transport rolls is increased and a water-saving nozzle-type megasonic unit having a large unit length is provided, the transport speed is increased without meandering the glass substrate. This is a method of cleaning a glass substrate that greatly improves the processing capacity of the cleaning apparatus. However, as in the conventional method, the processing capacity of the cleaning apparatus is also significantly improved while keeping the distance between the transport rolls at about 130 mm. The proposed cleaning method is described below in comparison with the present invention.

FIG. 5 is a sectional view showing a single-wafer cleaning apparatus provided with a water-saving nozzle type megasonic unit used in an example of the cleaning method of the trial. The length (unit length (A5B)) of the lower housing (50B) of the water-saving nozzle type megasonic unit shown in FIG. 5 is about 90 mm, which is the same as the unit length (A4) in the conventional method. The interval (B5) of 58) is about 130 mm, which is the same as the interval (B4) of the transport roll (48) in the conventional method. On the other hand, the length of the upper housing (50A) of the water-saving nozzle type megasonic unit (unit length (A5A))
Is, for example, about 225 mm.

In the single-wafer cleaning apparatus of this example, since the distance (B5) between the transport rolls is about 130 mm,
The glass substrate is transported without hanging between the transport rolls and meandering. The upper housing (50A) is enlarged in order to greatly improve the processing capacity of the cleaning device, but the flowing water film (cleaning water shower) has a facing upper ultrasonic irradiation surface (52A) and a lower supersonic irradiation surface (52A). Although formed in a region sandwiched by the ultrasonic wave irradiation surfaces (52B), the lower housing (50) and the lower part of the upper ultrasonic irradiation surface (52A) outside the region are formed.
B) It is not formed in the outer left and right regions. Therefore, the processing capacity cannot be significantly improved by this method.

The upper housing (50A) is moved to the left in FIG. 5 with respect to the lower housing (50B), and the lower housing (50A) is moved.
0B) and the right end of the upper housing (50A) are aligned, or the upper housing (50A) is moved to the right in FIG. Housing (5
0B) and the left end of the upper housing (50A) are aligned, the flowing water film (washing water shower) also has an upper ultrasonic irradiation surface (52A) and a lower ultrasonic irradiation surface (52B).
It is not formed outside the region sandwiched between the two, and the processing capability cannot be significantly improved.

[0034]

According to the present invention, there is provided a stainless steel plate having a large number of small holes at the upper part of a lower housing or a porous plate at the upper part of a lower housing in cleaning a glass substrate using a single wafer type cleaning apparatus provided with a water saving nozzle type megasonic unit. A glass plate is provided, the glass substrate in the unit is supported by the cleaning water pressure from the small holes or the holes, and the glass substrate is washed while being transported by the transport rolls. Even if a unit having a large unit length is provided to increase the glass substrate, the glass substrate does not hang between the transfer rolls, and the cleaning process can be performed without meandering, and therefore, even if the transfer speed of the cleaning device is increased. It is possible to greatly improve the processing capacity as a number of sheets even for a glass substrate of about 1 m2 without lowering the cleaning effect, for example, to about 2.5 sheets / min or more. This is a method for cleaning the glass substrate.

According to the present invention, in cleaning a glass substrate using a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit, a plurality of transfer belts having a circular cross-sectional shape are provided above the lower housing. Since the cleaning is performed while supporting and transporting the glass substrate in the unit by the transport belt, even if a unit having a large unit length is provided to increase the interval between the transport rolls and increase the cleaning processing length (processing time), The cleaning process can be performed without the substrate drooping and meandering between the transport rolls. Therefore, even if the transport speed of the cleaning device is increased, the cleaning effect is reduced without reducing the cleaning effect. However, the method for cleaning a glass substrate can greatly improve the processing capacity as the number of sheets, for example, to about 2.5 sheets / minute or more.

Further, according to the present invention, in cleaning a glass substrate using a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit, a support roll is provided above a lower housing,
The glass substrate in the unit is supported by the support roll,
Since the glass substrate is cleaned while being transported by the transport rolls, even if a large unit is provided to increase the cleaning processing length (processing time) by extending the interval between the transport rolls, the glass substrate is not transported between the transport rolls. The washing process can be performed without sagging and meandering. Therefore, even if the conveying speed of the washing device is increased, the washing effect is not reduced, and even if the glass substrate is about 1 m2 in size, it can be treated as a number of sheets. This is a method for cleaning a glass substrate that can greatly improve the capacity, for example, to about 2.5 sheets / minute or more.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view showing the concept of an embodiment of a single-wafer cleaning apparatus provided with a water-saving nozzle type megasonic unit used in the glass substrate cleaning method according to the present invention.

FIG. 2 is a partial cross-sectional view showing the concept of an example of a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit used in the glass substrate cleaning method according to claim 2;

FIG. 3 is a partial cross-sectional view showing the concept of an example of a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit used in the glass substrate cleaning method according to claim 3;

FIG. 4 is a sectional view showing the concept of an example of a water-saving nozzle-type megasonic unit.

FIG. 5 is a partial cross-sectional view showing a single-wafer cleaning apparatus provided with a water-saving nozzle-type megasonic unit used in an example of a trial cleaning method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Glass substrate 8 ... Driving roll 10A, 20A, 30A, 40A, 50A ... Upper housing | casing 10B, 20B, 30B, 40B, 50B ... Lower housing | casing 11, 21, 31, 41, 51: Vibration element 12A, 22A, 32A, 42A, 52A: Upper ultrasonic irradiation surface 12B: Stainless steel plate or porous plate having many small holes 13A, 23A, 33A, 43A: Side surface 13B, 23B, 33B, 43B ... side surface 14A, 24A, 34A, 44A ... top surface 14B, 24B, 34B, 44B ... bottom surface 15A, 25A, 35A, 45A ... side bottom surface 15B, 25B, 35B , 45B ... side upper surface 16A, 26A, 36A, 46A, 56A ... upper water supply pipe 16B, 26B, 36B, 46B, 56B ... lower water supply pipe 7A, 27A, 37A, 47A, 57A: upper drain pipe 17B, 27B, 37B, 47B, 57B: lower drain pipe 18, 28, 38, 48, 58: transport rolls 22B, 32B, 42B, 52B: Lower ultrasonic irradiation surface 29: Conveying belt 39: Support roll A1, A2, A3, A4: Unit length B1, B2, B3, B4, B5: Distance between conveying rolls A5A ... Length of upper case of trial unit A5B ... Length of lower case of trial unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Jun Miida 1-5-1, Taito, Taito-ku, Tokyo Inside Toppan Printing Co., Ltd. (72) Inventor Jun Satake 1-1-5-1 Taito, Taito-ku, Tokyo Toppan F-term (reference) in Printing Co., Ltd. 2H090 JB02 JC19 JD13 3B201 AA02 AB14 BB21 BB83 BB92 CD41

Claims (3)

[Claims] 1. A single wafer provided with a water-saving nozzle-type megasonic unit for cleaning a glass substrate with a minimum required amount of cleaning water by controlling a distance between an ultrasonic irradiation surface and a glass substrate and a balance between supply and drainage of cleaning water. In the cleaning of a glass substrate using a type cleaning device, a stainless steel plate or a porous plate having a large number of small holes is provided on the upper part of the lower housing of the water-saving nozzle type megasonic unit, and the cleaning water pressure from the small holes or the holes is used. A method for cleaning a glass substrate, comprising supporting a glass substrate in a unit and cleaning the glass substrate while transporting the glass substrate by a transport roll. 2. A single wafer provided with a water-saving nozzle-type megasonic unit for cleaning a glass substrate with a minimum required amount of cleaning water by controlling a distance between an ultrasonic irradiation surface and a glass substrate and a balance between supply and drainage of cleaning water. When cleaning glass substrates using a washing machine, a plurality of transport belts with a circular cross section are provided above the lower housing of the water-saving nozzle-type megasonic unit, and the transport belts support and transport the glass substrates in the unit. A method for cleaning a glass substrate, wherein the cleaning is performed while performing the cleaning. 3. A single wafer provided with a water-saving nozzle-type megasonic unit for cleaning a glass substrate with a minimum required amount of cleaning water by controlling a distance between an ultrasonic irradiation surface and a glass substrate and a balance between supply and drainage of cleaning water. In cleaning a glass substrate using a cleaning device, a support roll is provided above the lower housing of the water-saving nozzle type megasonic unit, the glass substrate in the unit is supported by the support roll, and the glass substrate is transported by the transport roll. A method for cleaning a glass substrate, wherein the cleaning is performed while the substrate is being cleaned.