TW201929139A - Transfer apparatus, and electronic device forming method - Google Patents
Transfer apparatus, and electronic device forming method Download PDFInfo
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- TW201929139A TW201929139A TW108112908A TW108112908A TW201929139A TW 201929139 A TW201929139 A TW 201929139A TW 108112908 A TW108112908 A TW 108112908A TW 108112908 A TW108112908 A TW 108112908A TW 201929139 A TW201929139 A TW 201929139A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/16—Pneumatic conveyors
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- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Advancing Webs (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
- Liquid Crystal (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Handling Of Sheets (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
本發明係關於圖案形成裝置。 The present invention relates to a patterning device.
本申請係根據2012年4月3日申請之日本特願2012-084819號主張優先權,並將其內容援引於此。 This application claims priority based on Japanese Patent Application No. 2012-084819 for which it applied on April 3, 2012, and uses the content here.
作為構成顯示器裝置等顯示裝置之顯示元件,已知例如有液晶顯示元件、有機電致發光(有機EL)元件、使用於電子紙之電泳元件等。作為製作組裝有此等元件之顯示器面板等電子元件之手法之一,例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下,簡記為「捲軸方式」)之手法廣為人知(例如,參照專利文獻1)。 As a display element constituting a display device such as a display device, a liquid crystal display element, an organic electroluminescence (organic EL) element, an electrophoretic element used in electronic paper, and the like are known, for example. As one of the methods of manufacturing electronic components such as a display panel in which these components are assembled, for example, there is a method known as a roll-to-roll method (hereinafter, simply referred to as a “roll method”) (for example, refer to Patent Document 1).
捲軸方式,係將捲繞在基板供應側之供應用滾筒之1片片狀基板送出且一邊將送出之基板以基板回收側之滾筒加以捲取,一邊搬送基板,在基板送出至被捲取為止之期間,於基板上依序形成電子元件(顯示像素電路、驅動器電路、配線等)用之圖案。近年,已提出形成高精度之圖案之處理裝置。 The reel method is to send out one piece of a substrate on a supply roller wound on the substrate supply side, and while the rolled substrate is being wound by a roller on the substrate recovery side, the substrate is transported and the substrate is sent out until it is wound. During this period, patterns for electronic components (display pixel circuits, driver circuits, wiring, etc.) are sequentially formed on the substrate. In recent years, a processing device for forming a high-precision pattern has been proposed.
先行技術文獻 Advance technical literature
專利文獻1:國際公開第2006/100868號 Patent Document 1: International Publication No. 2006/100868
然而,在對應圖案之更高精度化或顯示面板之高精細化之情 形,係被要求提高基板之搬送精度。例如,在藉由處理裝置進行處理之期間,係被要求將基板之表面維持於一定之狀態下搬送。 However, in the case of higher accuracy of the corresponding pattern or higher definition of the display panel, it is required to improve the substrate transfer accuracy. For example, during processing by a processing device, it is required to transport the substrate while maintaining the surface of the substrate.
本發明之態樣,其目的在於提供能將基板之表面維持於一定之狀態下搬送之搬送裝置。 In an aspect of the present invention, it is an object of the present invention to provide a transfer device capable of transferring a surface of a substrate in a certain state.
又,本發明之其他態樣,其目的在於提供能一邊將基板之表面維持於一定之狀態下搬送、一邊於該基板之表面形成電子元件之方法。 Another aspect of the present invention is to provide a method capable of forming an electronic component on the surface of the substrate while carrying the surface of the substrate in a constant state.
依據本發明之態樣,提供一種搬送裝置,係搬送基板,其具備:支承構件,具有支承基板之一面之支承面,形成有貫通支承面與支承面之背面之複數個貫通孔;以及保持機構,具備與支承構件之背面中包含複數個貫通孔之第一區域對向配置之氣體吸引部、以及與支承構件之背面中不同於第一區域之第二區域對向配置之氣體供應部,藉由對支承構件之背面進行氣體之供應及吸引,以非接觸狀態保持支承構件之背面,且透過複數個貫通孔使基板吸附於支承面。 According to an aspect of the present invention, there is provided a conveying device for conveying a substrate, comprising: a supporting member, a supporting surface having one surface of the supporting substrate, a plurality of through holes penetrating the supporting surface and the back surface of the supporting surface, and a holding mechanism A gas suction portion disposed opposite to a first region including a plurality of through holes in the back surface of the support member, and a gas supply portion disposed opposite to a second region different from the first region on the back surface of the support member, The back surface of the support member is supplied and sucked by gas, the back surface of the support member is held in a non-contact state, and the substrate is adsorbed on the support surface through a plurality of through holes.
依據本發明之其他態樣,提供一種電子元件形成方法,係將長條狀之可撓性基板搬送於長邊方向,於基板之表面形成電子元件之方法,其包含:在以剛性較基板高之材料作成薄板狀、且形成有貫通表面與背面之複數個貫通孔之支承構件之表面載置基板;藉由與支承構件之背面中包含複數個貫通孔之第一區域對向配置之氣體吸引部,透過複數個貫通孔將基板吸附於支承構件之表面;藉由與支承構件之背面中不同於第一區域之第二區域對向配置之氣體供應部,藉由氣體層支承支承構件之背面;於支承構件之表面吸附基板,在以氣體層支承有支承構件之背面之狀態下藉由驅動部使支承構件移動於長邊方向;以及藉由圖案形成裝置將電子元件用之圖案形成於藉由支承構件之移動而被搬送之基板之表面之既定區域。 According to another aspect of the present invention, there is provided a method for forming an electronic component, which is a method for transporting a long flexible substrate in a long-side direction and forming an electronic component on a surface of the substrate, including: The material is formed on a surface of a support member having a thin plate shape and a plurality of through-holes penetrating the surface and the back surface, and the substrate is placed on the surface of the support member and attracted by the gas disposed opposite to the first region including the plurality of through-holes. The substrate is adsorbed on the surface of the support member through a plurality of through holes; the gas supply section disposed opposite to the second region of the back surface of the support member which is different from the first region, supports the back surface of the support member by a gas layer ; The substrate is adsorbed on the surface of the support member, and the support member is moved in the long-side direction by the driving part while the back surface of the support member is supported by the gas layer; A predetermined area of the surface of the substrate to be transferred by the movement of the support member.
根據本發明之態樣,能提供能將基板維持於一定之狀態來搬送 之搬送裝置。 According to the aspect of the present invention, it is possible to provide a transfer device capable of carrying a substrate while maintaining the substrate in a constant state.
又,根據本發明之其他態樣,提供一種電子元件形成方法,其能藉由將基板維持於一定之狀態來搬送,而於基板上形成高精度、高精細之電子元件。 In addition, according to another aspect of the present invention, a method for forming an electronic component is provided, which is capable of forming a high-precision, high-definition electronic component on a substrate by carrying the substrate in a certain state for transportation.
10‧‧‧處理裝置 10‧‧‧Processing device
20‧‧‧搬送裝置 20‧‧‧ transport device
21‧‧‧基板洗淨部 21‧‧‧ Substrate cleaning department
22、23‧‧‧靜電除去部 22, 23‧‧‧ Static Elimination Department
25‧‧‧吸引部 25‧‧‧Attraction
26‧‧‧驅動部 26‧‧‧Driver
30‧‧‧基板支承機構 30‧‧‧ substrate support mechanism
31‧‧‧皮帶部 31‧‧‧Belt Department
31a‧‧‧支承面 31a‧‧‧bearing surface
31b‧‧‧背面 31b‧‧‧Back
31c‧‧‧位置基準部 31c‧‧‧ Position Reference Section
31h‧‧‧貫通孔 31h‧‧‧through hole
32‧‧‧皮帶搬送部 32‧‧‧Belt Transfer Department
32a~32d‧‧‧搬送滾筒 32a ~ 32d‧‧‧Transport roller
33‧‧‧導引載台 33‧‧‧Guide Stage
33a‧‧‧導引面 33a‧‧‧Guide plane
33b‧‧‧底面 33b‧‧‧underside
33s‧‧‧氣體吸引部 33s‧‧‧Gas suction section
33t‧‧‧氣體供應部 33t‧‧‧Gas Supply Department
35‧‧‧吸引系 35‧‧‧ Attraction
36‧‧‧供應系 36‧‧‧ Supply Department
AR1‧‧‧第一區域 AR1‧‧‧First Zone
AR2‧‧‧第二區域 AR2‧‧‧Second Area
CONT‧‧‧控制部 CONT‧‧‧Control Department
EC‧‧‧編碼器 EC‧‧‧ Encoder
R‧‧‧導引滾筒 R‧‧‧Guide roller
R1、R2‧‧‧夾持滾筒 R1, R2‧‧‧Clamping roller
R3‧‧‧張力調整滾筒 R3‧‧‧Tension adjustment roller
R4‧‧‧基板吸附滾筒 R4‧‧‧ substrate adsorption roller
R4a‧‧‧外周面 R4a‧‧‧outer surface
R5、R6‧‧‧夾持滾筒 R5, R6‧‧‧‧Clamping roller
S‧‧‧基板 S‧‧‧ substrate
Sa‧‧‧被處理面 Sa‧‧‧ treated surface
Sb‧‧‧被支承面 Sb‧‧‧ Supported surface
圖1係顯示本實施形態之基板處理裝置之構成的示意圖。 FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus according to this embodiment.
圖2係顯示本實施形態之搬送裝置之構成之立體圖。 Fig. 2 is a perspective view showing the structure of a conveying device according to this embodiment.
圖3係顯示本實施形態之搬送裝置之構成之俯視圖。 FIG. 3 is a plan view showing the configuration of the conveying device according to this embodiment.
圖4係顯示本實施形態之搬送裝置之構成之剖面圖。 Fig. 4 is a cross-sectional view showing the structure of a conveying device according to this embodiment.
圖5係顯示本實施形態之搬送裝置之動作之動作圖。 Fig. 5 is an operation diagram showing the operation of the conveying device in this embodiment.
圖6係顯示本實施形態之基板處理裝置之其他構成的圖。 FIG. 6 is a diagram showing another configuration of the substrate processing apparatus according to this embodiment.
圖7係顯示本實施形態之基板處理裝置之其他構成的圖。 FIG. 7 is a diagram showing another configuration of the substrate processing apparatus according to this embodiment.
以下,參照圖式說明本實施形態。 Hereinafter, this embodiment will be described with reference to the drawings.
圖1係顯示本實施形態之基板處理裝置100之構成的示意圖。 FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 100 according to this embodiment.
如圖1所示,基板處理裝置100具有:供應形成為帶狀(長條狀)之基板(例如帶狀之薄膜構件)S之基板供應部2、對基板S之表面(被處理面)Sa進行處理之基板處理部3、回收基板S之基板回收部4、控制此等各部之控制部(控制裝置)CONT。基板處理部(圖案形成裝置)3係在從基板供應部2送出基板S後至藉由基板回收部4回收基板S之期間對基板S之表面執行各種處理。此基板處理裝置100,可使用於在基板S上形成例如有機EL元件、液晶顯示元件等主動矩陣方式之顯示元件(電子元件)之情形。 As shown in FIG. 1, the substrate processing apparatus 100 includes a substrate supply unit 2 that supplies a substrate (for example, a strip-shaped thin film member) S formed in a strip shape (long strip), and a surface (processed surface) Sa of the substrate S. The substrate processing section 3 that performs processing, the substrate recovery section 4 that recovers the substrate S, and a control section (control device) CONT that controls these sections. The substrate processing section (pattern forming device) 3 performs various processes on the surface of the substrate S after the substrate S is sent from the substrate supply section 2 to the time when the substrate S is recovered by the substrate recovery section 4. This substrate processing apparatus 100 can be used in the case where an active matrix display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the substrate S.
此外,本實施形態中,係如圖1所示設定XYZ正交座標系統,以下適當使用此XYZ正交座標系統來進行說明。XYZ正交座標系統,例如沿水平面設定X軸及Y軸,沿垂直方向朝上設定Z軸。又,基板處理裝置100係整體沿X軸從其負側(-X側)往正側(+X側)搬送基板S。此時,帶狀之基板S之寬度方向(短邊方向)設定於Y軸方向。 In addition, in the present embodiment, the XYZ orthogonal coordinate system is set as shown in FIG. 1, and this XYZ orthogonal coordinate system is appropriately used for description below. The XYZ orthogonal coordinate system, for example, sets the X axis and the Y axis along the horizontal plane, and sets the Z axis upward in the vertical direction. In addition, the substrate processing apparatus 100 as a whole transfers the substrate S from the negative side (−X side) to the positive side (+ X side) along the X axis. At this time, the width direction (short side direction) of the strip-shaped substrate S is set in the Y-axis direction.
作為在基板處理裝置100成為處理對象之基板S,可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂等材料。 As the substrate S to be processed in the substrate processing apparatus 100, a foil such as a resin film or stainless steel can be used. For the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, Ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, Materials such as polycarbonate resin, polystyrene resin, vinyl acetate resin, etc.
基板S,以承受例如200℃程度之熱其尺寸亦無變化之熱膨脹係數較小者較佳。例如可將無機填料混合於樹脂膜以降低熱膨脹係數。作為無機填料,例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。又,基板S亦可係以浮動法等製造之厚度100μm程度之極薄玻璃之單體、或於該極薄玻璃貼合上述樹脂膜或鋁箔而成之積層體。 The substrate S is preferably one having a small thermal expansion coefficient that does not change in size even when subjected to heat at about 200 ° C. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. In addition, the substrate S may be a single body of ultra-thin glass having a thickness of about 100 μm manufactured by a floating method or the like, or a laminated body in which the resin film or aluminum foil is bonded to the ultra-thin glass.
基板S之寬度方向(短邊方向)之尺寸係形成為例如1m~2m程度、長度方向(長邊方向)之尺寸則形成為例如10m以上。當然,此尺寸僅為一例,並不限於此。例如基板S之Y軸方向之尺寸為1m以下或50cm以下亦可、亦可為2m以上。又,基板S之X軸方向之尺寸亦可在10m以下。 The size of the substrate S in the width direction (short-side direction) is, for example, about 1 m to 2 m, and the size in the length direction (long-side direction) is, for example, 10 m or more. Of course, this size is only an example, and it is not limited to this. For example, the dimension in the Y-axis direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. The size of the substrate S in the X-axis direction may be 10 m or less.
基板S係形成為具有可撓性。此處,所謂可撓性,係指對基板施以自重程度之力亦不會斷裂或破裂、而能將該基板加以彎折之性質。又,藉由自重程度之力而彎折之性質亦包含於可撓性。又,上述可撓性會隨著該基板材質、大小、厚度、或温度等之環境等而改變。此外,基板S可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。 The substrate S is formed to have flexibility. Here, the term "flexible" refers to a property that the substrate can be bent without breaking or cracking by applying a force of a self-weight to the substrate. In addition, the property of bending by the force of the degree of self-weight is also included in the flexibility. In addition, the flexibility described above may vary depending on the environment, such as the material, size, thickness, and temperature of the substrate. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.
基板供應部2係將例如捲成捲軸狀之基板S送出供應至基板處理部3。此情形下,於基板供應部2,設有用以例如捲繞基板S之軸部或使該軸部旋轉之旋轉驅動裝置等。除此之外,亦可係設置例如用以覆蓋捲成捲軸狀狀態之基板S的覆蓋部等。此外,基板供應部2不限定於送出捲成捲軸狀之基板S之機構,只要係包含將帶狀之基板S於其長度方向依序送出之機構(例如夾持式之驅動滾筒等)者即可。 The substrate supply unit 2 sends out and supplies the substrate S rolled into a reel shape to the substrate processing unit 3, for example. In this case, the substrate supply unit 2 is provided with, for example, a rotation driving device for winding the shaft portion of the substrate S or rotating the shaft portion. In addition, a covering portion or the like for covering the substrate S in a rolled state may be provided. In addition, the substrate supply unit 2 is not limited to a mechanism for sending out the substrate S rolled into a reel, as long as it includes a mechanism for sequentially sending out the strip-shaped substrate S in its longitudinal direction (such as a clamp-type drive roller, etc.) can.
基板回收部4係將通過基板處理裝置100之基板S例如捲取成捲軸狀加以回收。於基板回收部4,與基板供應部2同樣的,設有用以捲繞基板S之軸部及使該軸部旋轉之旋轉驅動源、以及覆蓋回收之基板S的覆蓋部等。此外,在基板處理部3將基板S例如切成平板(panel)狀之場合等時,亦可為例如將基板S回收成重疊狀態等與捲繞成捲軸狀之狀態不同之狀態回收基板S之構成。 The substrate recovery unit 4 winds up, for example, a substrate S that has passed through the substrate processing apparatus 100 into a reel shape. Similar to the substrate supply unit 2, the substrate recovery unit 4 is provided with a shaft portion for winding the substrate S, a rotation drive source for rotating the shaft portion, and a cover portion for covering the recovered substrate S and the like. In addition, when the substrate processing unit 3 cuts the substrate S, for example, into a panel shape, the substrate S may be recovered, for example, in a state in which the substrate S is recovered in an overlapped state and a state different from the state in which the substrate S is wound into a roll shape. Make up.
基板處理部3,將從基板供應部2供應之基板S搬送至基板回收部4,並在搬送過程對基板S之被處理面Sa進行處理。基板處理部3具有例如處理裝置10、搬送裝置20。 The substrate processing unit 3 transfers the substrate S supplied from the substrate supply unit 2 to the substrate recovery unit 4 and processes the processed surface Sa of the substrate S during the transfer process. The substrate processing unit 3 includes, for example, a processing device 10 and a transfer device 20.
處理裝置10具有用以對基板S之被處理面Sa形成例如有機EL元件之各種裝置。作為此種裝置,例如有用以在被處理面Sa上形成間隔壁之間隔壁形成裝置、用以形成電極的電極形成裝置、以及用以形成發光層之發光層形成裝置等。 The processing device 10 includes various devices for forming, for example, an organic EL element on the processing surface Sa of the substrate S. Examples of such a device include a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, and a light emitting layer forming device for forming a light emitting layer.
更具體而言,有液滴塗布裝置(例如噴墨型塗布裝置等)、成膜裝置(例如鍍敷裝置、蒸鍍裝置、濺鍍裝置等)、曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等。此等之各裝置,係沿基板S之搬送路徑適當設置。 More specifically, there are a droplet coating device (for example, an inkjet type coating device), a film forming device (for example, a plating device, a vapor deposition device, a sputtering device, etc.), an exposure device, a developing device, a surface modification device, Washing equipment, etc. Each of these devices is appropriately installed along the conveyance path of the substrate S.
搬送裝置20具有在基板處理部3內導引基板S之複數個導引滾筒(搬送機構,圖1中僅例示兩個滾筒5、6)與支承基板S之基板支承機構(保持機構)30。導引滾筒5(搬送機構)於基板S之搬送路徑配置於處理裝置10之上游側, 導引滾筒(搬送機構)6於基板S之搬送路徑配置於處理裝置10之下游側。於複數個導引滾筒(搬送機構)中至少一部分之導引滾筒安裝有旋轉驅動機構(未圖示)。本實施形態中,在搬送裝置20之基板S在搬送路徑之長度為例如全長數百公尺程度。 The conveying device 20 includes a plurality of guide rollers (conveying mechanism (only two rollers 5 and 6 are illustrated in FIG. 1)) for guiding the substrate S in the substrate processing section 3 and a substrate supporting mechanism (holding mechanism) 30 that supports the substrate S. The guide roller 5 (conveying mechanism) is disposed on the upstream side of the processing apparatus 10 in the conveyance path of the substrate S, and the guide roller (conveyance mechanism) 6 is disposed on the downstream side of the processing apparatus 10 in the conveyance path of the substrate S. A rotation drive mechanism (not shown) is mounted on at least a part of the plurality of guide rollers (conveying mechanisms). In the present embodiment, the length of the substrate S in the transfer device 20 in the transfer path is, for example, approximately several hundred meters in total length.
圖2係顯示搬送裝置20一部分之剖面圖。 FIG. 2 is a cross-sectional view showing a part of the transfer device 20.
如圖2所示,搬送裝置20係從長條狀之基板S之搬送方向上游側起依序具有導引滾筒5(參照圖1)、夾持滾筒(搬送機構)R1及R2、基板洗淨部21、張力調整滾筒(搬送機構)R3、靜電除去部(除去裝置)22、基板支承機構30、靜電除去部(除去裝置)23、基板吸附滾筒(搬送機構)R4、夾持滾筒(搬送機構)R5及R6、導引滾筒6(參照圖1)。其中,導引滾筒5、夾持滾筒R1及R2、張力調整滾筒R3、基板吸附滾筒R4、夾持滾筒R5及R6、導引滾筒6係沿基板S之搬送路徑設置,係包含於上述複數個導引滾筒之構成。 As shown in FIG. 2, the conveying device 20 has a guide roller 5 (see FIG. 1), a clamping roller (conveying mechanism) R1 and R2, and substrate cleaning in order from the upstream side in the conveying direction of the long substrate S. Section 21, tension adjustment roller (conveying mechanism) R3, static electricity removing section (removing device) 22, substrate supporting mechanism 30, static electricity removing section (removing device) 23, substrate adsorption roller (conveying mechanism) R4, nip roller (conveying mechanism) ) R5 and R6, guide roller 6 (see Figure 1). Among them, the guide roller 5, the clamp rollers R1 and R2, the tension adjustment roller R3, the substrate adsorption roller R4, the clamp rollers R5 and R6, and the guide roller 6 are arranged along the conveying path of the substrate S, and are included in the above-mentioned plural Structure of the guide roller.
首先,說明搬送基板S之夾持滾筒R1及R2、張力調整滾筒R3、基板吸附滾筒R4、夾持滾筒R5及R6。各滾筒R1~R6之中心軸(在為能旋轉之滾筒之情形係旋轉軸)彼此於Y軸方向配置成平行。 First, the holding rollers R1 and R2, the tension adjusting roller R3, the substrate suction roller R4, and the holding rollers R5 and R6 will be described. The central axes of the rollers R1 to R6 (in the case of a rotatable roller, the rotation axis) are arranged parallel to each other in the Y-axis direction.
夾持滾筒R1及R2,以將透過圖1之導引滾筒5搬送來之基板S夾持之狀態下旋轉,將前述基板S往搬送方向下游側(+Z軸側)移送。藉由夾持滾筒R1及R2夾著基板S,能抑制從前述夾持滾筒R1及R2上游側透過基板S傳遞之振動。 The holding rollers R1 and R2 are rotated while holding the substrate S carried through the guide roller 5 in FIG. 1, and the substrate S is transferred to the downstream side (+ Z axis side) in the conveying direction. By sandwiching the substrate S with the clamping rollers R1 and R2, it is possible to suppress vibration transmitted through the substrate S from the upstream sides of the clamping rollers R1 and R2.
張力調整滾筒R3係一邊調整基板S之短邊方向(寬度方向)之張力一邊旋轉,將基板S往搬送方向下游側移送。張力調整滾筒R3例如形成為直徑從中心軸方向兩端部往中央部徐徐變小。藉由張力調整滾筒R3調整基板S之短邊方向之長度。此外,張力調整滾筒R3係將往+Z軸方向搬送來之基板S之搬送方向轉換為+X軸方向。 The tension adjusting roller R3 rotates while adjusting the tension in the short-side direction (width direction) of the substrate S, and transfers the substrate S to the downstream side in the conveying direction. The tension adjustment roller R3 is formed, for example, so that the diameter gradually decreases from the both end portions in the center axis direction to the center portion. The length in the short-side direction of the substrate S is adjusted by the tension adjustment roller R3. In addition, the tension adjustment roller R3 converts the transport direction of the substrate S that is transported in the + Z axis direction to the + X axis direction.
基板吸附滾筒R4藉由氣體能通過之多孔質材料形成。基板吸附滾筒R4之外周面發揮導引基板S之背面之導引面R4a之功能。基板吸附滾筒R4具有從導引面R4a往滾筒內部側吸引氣體之吸引部25。吸引部25具有連接於基板吸附滾筒R4內部之吸引路徑25b。於吸引路徑25b設有吸引泵25a。藉由吸引泵25a之吸引動作,基板吸附滾筒R4內部之壓力降低,藉此基板吸附滾筒R4周圍之氣體從導引面R4a被吸引至內部。基板吸附滾筒R4能藉由此吸引力將例如基板S吸附於導引面R4a。 The substrate adsorption roller R4 is formed of a porous material through which a gas can pass. The outer peripheral surface of the substrate suction roller R4 functions as a guide surface R4a that guides the rear surface of the substrate S. The substrate adsorption roller R4 includes a suction portion 25 that sucks gas from the guide surface R4a toward the inside of the roller. The suction section 25 has a suction path 25b connected to the inside of the substrate suction drum R4. A suction pump 25a is provided in the suction path 25b. By the suction operation of the suction pump 25a, the pressure inside the substrate adsorption roller R4 is reduced, whereby the gas around the substrate adsorption roller R4 is sucked from the guide surface R4a to the inside. The substrate suction roller R4 can suck, for example, the substrate S on the guide surface R4a by the attraction force.
基板吸附滾筒R4具有驅動部26。驅動部26藉由控制部CONT之控制使基板吸附滾筒R4旋轉驅動。控制部CONT能控制驅動部26之驅動之時點或驅動力等。基板吸附滾筒R4能藉由在使基板S吸附於導引面R4a之狀態下繞圖中順時針旋轉,而將基板S往+X軸側搬送。如此,基板吸附滾筒R4藉由使吸引部25及驅動部26作動,發揮對基板S賦予既定張力之張力賦予機構之功能。此外,能藉由控制部CONT調整驅動部26之驅動力來調整對基板S賦予之張力。因此,基板吸附滾筒(第一滾筒)R4、吸引部25、驅動部26及控制部CONT發揮調整對基板S賦予之張力之調整部之功能。 The substrate suction roller R4 includes a driving section 26. The driving unit 26 rotates and drives the substrate suction roller R4 under the control of the control unit CONT. The control unit CONT can control the timing of driving, the driving force, and the like of the driving unit 26. The substrate adsorption roller R4 can rotate the substrate S to the + X axis side by rotating it clockwise around the figure while the substrate S is adsorbed on the guide surface R4a. As described above, the substrate suction roller R4 operates the suction unit 25 and the driving unit 26 to function as a tension applying mechanism that applies a predetermined tension to the substrate S. In addition, the control unit CONT can adjust the driving force of the driving unit 26 to adjust the tension applied to the substrate S. Therefore, the substrate suction roller (first roller) R4, the suction section 25, the driving section 26, and the control section CONT function as an adjustment section that adjusts the tension applied to the substrate S.
夾持滾筒R5及R6,以將透過基板吸附滾筒R4搬送來之基板S夾持之狀態下旋轉,將前述基板S往搬送方向下游側移送。藉由夾持滾筒R5及R6夾著基板S,能抑制從前述夾持滾筒R5及R6下游側透過基板S傳遞之振動。此外,基板吸附滾筒R4、夾持滾筒R5及R6,係以基板S中之前述基板吸附滾筒R4與夾持滾筒R5及R6間之部分成為鬆弛狀態之方式來搬送基板S。因此,夾持滾筒(第二滾筒)R5及R6發揮調整對基板S賦予之張力之調整部一部分之功能。 The holding rollers R5 and R6 are rotated while holding the substrate S conveyed through the substrate adsorption roller R4, and the substrate S is moved downstream in the conveying direction. By sandwiching the substrate S with the clamping rollers R5 and R6, it is possible to suppress vibration transmitted through the substrate S from the downstream sides of the clamping rollers R5 and R6. In addition, the substrate adsorption roller R4, the clamping rollers R5, and R6 transport the substrate S such that a portion between the substrate adsorption roller R4 and the clamping rollers R5 and R6 in the substrate S becomes a relaxed state. Therefore, the nip rollers (second rollers) R5 and R6 function as a part of the adjustment section that adjusts the tension applied to the substrate S.
又,基板洗淨部21設於夾持滾筒R1及R2與張力調整滾筒R3間之位置。基板洗淨部21具有例如未圖示之超音波產生裝置及吸引裝置等。基板洗淨部21能以利用超音波之乾燥洗淨器等對從夾持滾筒R1及R2往張力調整滾筒 R3搬送之基板S之被處理面Sa除去前述基板S上之異物。此外,作為基板洗淨部21,亦能使用具備液體吹附及乾燥功能之洗淨裝置。 The substrate cleaning section 21 is provided at a position between the nip rollers R1 and R2 and the tension adjustment roller R3. The substrate cleaning unit 21 includes, for example, an ultrasound generating device and a suction device (not shown). The substrate cleaning section 21 can remove foreign matter on the substrate S by using a ultrasonic cleaner or the like on the processed surface Sa of the substrate S transferred from the clamping rollers R1 and R2 to the tension adjusting roller R3. In addition, as the substrate cleaning section 21, a cleaning device having a liquid blowing and drying function can also be used.
靜電除去部22,設於張力調整滾筒R3之基板S之搬送方向下游側、例如在張力調整滾筒R3與基板支承機構30之間隔著基板S之上方。靜電除去部22係除去被基板支承機構30搬送之基板S所帶靜電(電荷)。又,靜電除去部23,設於基板吸附滾筒R4之上游側、例如在基板支承機構30與基板吸附滾筒R4之間隔著基板S之上方。靜電除去部23係除去從基板支承機構30搬送至下游側之基板S所帶靜電(電荷)。 The static electricity removing unit 22 is provided on the downstream side of the substrate S in the tension adjustment roller R3 in the conveying direction, and is, for example, above the substrate S between the tension adjustment roller R3 and the substrate support mechanism 30. The static electricity removing unit 22 removes static electricity (charge) from the substrate S carried by the substrate supporting mechanism 30. The static electricity removing unit 23 is provided on the upstream side of the substrate adsorption roller R4, for example, above the substrate S with the substrate support mechanism 30 and the substrate adsorption roller R4 interposed therebetween. The static electricity removing unit 23 removes static electricity (charge) from the substrate S carried from the substrate supporting mechanism 30 to the downstream side.
基板支承機構30配置於張力調整滾筒R3與基板吸附滾筒R4之間。此外,於基板S中之前述張力調整滾筒R3與基板吸附滾筒R4間之部分,設定處理裝置10之處理區域10p。基板支承機構30,係一邊支承基板S中通過處理區域10p之部分、一邊以與在張力調整滾筒R3與基板吸附滾筒R4間之基板S之搬送速度同步之速度支承前述基板S之背面。 The substrate support mechanism 30 is disposed between the tension adjustment roller R3 and the substrate adsorption roller R4. In addition, a processing area 10 p of the processing device 10 is set at a portion between the aforementioned tension adjustment roller R3 and the substrate adsorption roller R4 in the substrate S. The substrate support mechanism 30 supports the back surface of the substrate S while supporting the portion of the substrate S passing through the processing area 10p at a speed synchronized with the conveyance speed of the substrate S between the tension adjustment roller R3 and the substrate adsorption roller R4.
基板支承機構30具有皮帶部(支承構件)31、皮帶搬送部32及導引載台33。又,基板支承機構30具有洗淨皮帶部31表面之皮帶洗淨部37與除去皮帶部31所帶之靜電之靜電除去部38。 The substrate support mechanism 30 includes a belt portion (support member) 31, a belt transfer portion 32, and a guide stage 33. In addition, the substrate supporting mechanism 30 includes a belt cleaning portion 37 that cleans the surface of the belt portion 31, and a static electricity removing portion 38 that removes static electricity carried by the belt portion 31.
皮帶部31係使用將剛性較基板S高之材料、例如不鏽鋼等金屬材料加工成薄板狀之構件形成為無端狀。皮帶部31藉由設於外周面之支承面31a支承基板S之被支承面(相對處理面為背面)Sb。於皮帶部31環繞一周設置有排列配置於周方向之複數個貫通孔31h。各貫通孔31h係貫通皮帶部31之支承面31a與設於前述支承面31a背側之背面31b間而形成。本實施形態中,此複數個貫通孔31h於Y軸方向形成有五列。皮帶部31之一部分與基板S之被支承面Sb對向配置。 The belt portion 31 is formed into an endless shape by using a material that has a higher rigidity than the substrate S, such as a metal material such as stainless steel, to form a thin plate. The belt portion 31 supports a supported surface (back side opposite to the processing surface) Sb of the substrate S via a support surface 31a provided on the outer peripheral surface. A plurality of through-holes 31h arranged in a circumferential direction are provided around the belt portion 31 in a circle. Each of the through holes 31h is formed between a support surface 31a of the belt portion 31 and a back surface 31b provided on the back side of the support surface 31a. In this embodiment, the plurality of through holes 31h are formed in five rows in the Y-axis direction. A part of the belt portion 31 is arranged to face the supported surface Sb of the substrate S.
皮帶部31係支承基板S之被支承面Sb。此外,在Y軸方向之複數個貫通孔 31h之列數目不限於五列,幾列均可。又,環繞一周設置之貫通孔31h之數目亦可係任意。 The belt portion 31 is a supported surface Sb of the support substrate S. In addition, the number of rows of the plurality of through holes 31h in the Y-axis direction is not limited to five rows, and several rows may be used. The number of through holes 31h provided around a circle may be arbitrary.
皮帶搬送部32具有四個搬送滾筒(驅動部)32a~32d。於搬送滾筒32a~32d捲掛有皮帶部31。亦即,四個搬送滾筒32a~32d接觸於皮帶部31之內周面。四個滾筒中之兩個搬送滾筒32a及搬送滾筒32b,配置於較導引載台33更靠基板S之搬送方向上游側(-X軸側)。其他兩個搬送滾筒32c及搬送滾筒32d,配置於較導引載台33更靠基板S之搬送方向下游側(+X軸側)。因此,係構成為皮帶部31對處理裝置10之處理區域10p於X軸方向橫越移動。 The belt transfer section 32 includes four transfer rollers (drive sections) 32a to 32d. A belt portion 31 is wound around the transfer rollers 32a to 32d. That is, the four conveyance rollers 32 a to 32 d are in contact with the inner peripheral surface of the belt portion 31. Two of the four rollers 32 a and 32 b are disposed on the upstream side (−X axis side) of the substrate S in the conveying direction from the guide stage 33. The other two transfer rollers 32c and 32d are disposed on the downstream side (+ X-axis side) in the transfer direction of the substrate S from the guide stage 33. Therefore, the belt portion 31 is configured to move across the processing region 10p of the processing device 10 in the X-axis direction.
搬送滾筒32a及搬送滾筒32b配置成其軸方向平行於Y軸方向。又,搬送滾筒32a及搬送滾筒32b以於Z軸方向排列之方式彼此隔開間隔配置。同樣地。搬送滾筒32c及搬送滾筒32d配置成其軸方向平行於Y軸方向。又,搬送滾筒32c及搬送滾筒32d以於Z軸方向排列之方式彼此隔開間隔配置。 The conveyance roller 32a and the conveyance roller 32b are arrange | positioned so that the axial direction may become parallel to a Y-axis direction. The transfer rollers 32a and 32b are arranged at intervals from each other so as to be aligned in the Z-axis direction. Similarly. The conveyance roller 32c and the conveyance roller 32d are arrange | positioned so that the axial direction may become parallel to a Y-axis direction. Moreover, the conveyance roller 32c and the conveyance roller 32d are arrange | positioned at intervals from each other so that it may be arranged in a Z-axis direction.
搬送滾筒32a~32d,位置被調整成以皮帶部31具有張力之狀態旋轉移動。在搬送滾筒32b與搬送滾筒32c之間、以及搬送滾筒32d與搬送滾筒32a之間,以在X軸方向之位置一致之狀態下配置成皮帶部31與X軸方向平行地移動。 The conveyance rollers 32 a to 32 d are adjusted so as to rotate while the belt portion 31 is under tension. Between the transfer drum 32b and the transfer drum 32c, and between the transfer drum 32d and the transfer drum 32a, the belt portion 31 is arranged to move parallel to the X-axis direction with the positions in the X-axis direction being aligned.
搬送滾筒(驅動部)32a~32d中之至少一個為驅動皮帶部31之驅動滾筒。於搬送滾筒32d設有驅動部32e。本實施形態中,例如搬送滾筒(驅動部)32d係驅動滾筒,剩下之搬送滾筒32a~32c為從動滾筒。此外,亦可將驅動滾筒之搬送滾筒32d以例如多孔質材料形成,接著連接於未圖示之吸引裝置,使皮帶部31吸附於外周面,來將動力傳達至皮帶部31。 At least one of the conveyance rollers (driving sections) 32 a to 32 d is a driving roller that drives the belt section 31. A driving portion 32e is provided on the conveyance roller 32d. In this embodiment, for example, the conveyance roller (driving unit) 32d is a drive roller, and the remaining conveyance rollers 32a to 32c are driven rollers. In addition, the conveying roller 32d of the driving roller may be formed of, for example, a porous material, and then connected to a suction device (not shown), and the belt portion 31 may be adsorbed on the outer peripheral surface to transmit power to the belt portion 31.
導引載台33藉由例如組合複數個氣體能通過之多孔質材而形成。導引載台33之形狀為矩形之板狀。導引載台33之+Z軸側之面(導引面)33a,形成為與XY平面平行。導引載台33係將基板S導引成往基板S之長度方向及皮 帶部31移動之方向(X軸方向)移動。 The guide stage 33 is formed, for example, by combining porous materials through which a plurality of gases can pass. The shape of the guide stage 33 is a rectangular plate. A surface (guide surface) 33a on the + Z axis side of the guide stage 33 is formed parallel to the XY plane. The guide stage 33 guides the substrate S so as to move in the longitudinal direction of the substrate S and the direction (X-axis direction) in which the belt portion 31 moves.
導引載台33於X軸方向配置於搬送滾筒32b與搬送滾筒32c之間。又,導引載台33於Y軸方向配置成與皮帶部31重疊。導引載台33配置於皮帶部31之內側。導引載台33之導引面33a,與皮帶部31之背面(內周面)31b對向設置。導引載台33之位置藉由未圖示之固定機構固定。 The guide stage 33 is arranged between the transfer roller 32b and the transfer roller 32c in the X-axis direction. The guide stage 33 is arranged in the Y-axis direction so as to overlap the belt portion 31. The guide stage 33 is disposed inside the belt portion 31. The guide surface 33a of the guide stage 33 is provided to face the back surface (inner peripheral surface) 31b of the belt portion 31. The position of the guide stage 33 is fixed by a fixing mechanism (not shown).
圖3係顯示從+Z軸側觀看基板支承機構30時之構成之圖。圖3中,於皮帶部31之下方配置有導引載台33。 FIG. 3 is a diagram showing the configuration of the substrate support mechanism 30 when viewed from the + Z axis side. In FIG. 3, a guide stage 33 is disposed below the belt portion 31.
氣體吸引部33s藉由延伸於X軸方向之多孔質材形成,與皮帶部31背面中形成有貫通孔31h之列之第一區域AR1對向配置。因此,在皮帶部31旋轉移動後,各列之貫通孔31h係在氣體吸引部33s上移動。 The gas suction portion 33s is formed of a porous material extending in the X-axis direction, and is arranged to face the first area AR1 in the row of the through holes 31h formed on the back surface of the belt portion 31. Therefore, after the belt portion 31 rotates, the through-holes 31h in each row move on the gas suction portion 33s.
氣體供應部33t與氣體吸引部33s同樣地,藉由延伸於X軸方向之多孔質材形成,氣體吸引部33s與氣體供應部33t,於Y軸方向(寬度方向)交互設置。氣體吸引部33s與氣體供應部33t之間被分隔構件34區隔。分隔構件34設置成在X軸方向橫越導引載台33,從導引載台33之-X軸側之端部至+X軸側之端部。 The gas supply portion 33t is formed of a porous material extending in the X-axis direction similarly to the gas suction portion 33s. The gas suction portion 33s and the gas supply portion 33t are alternately provided in the Y-axis direction (width direction). The gas suction part 33s and the gas supply part 33t are partitioned by the partition member 34. The partition member 34 is provided so as to traverse the guide stage 33 in the X-axis direction, from the end portion on the -X axis side of the guide stage 33 to the end portion on the + X axis side.
氣體供應部33t係與皮帶部31背面中不同於第一區域AR1之第二區域AR2對向配置。亦即,氣體供應部33t係與皮帶部31背面中之貫通孔31h列之間對向配置。此外,第二區域AR2形成於相對皮帶部31之Y軸方向形成於五處之各第一區域AR1之間。因此,於皮帶部31,在Y軸方向交互配置有第二區域AR2與第一區域AR1,於皮帶部31之Y軸方向兩端配置有第二區域AR2。 The gas supply portion 33t is disposed to face the second area AR2 different from the first area AR1 on the back surface of the belt portion 31. That is, the gas supply portion 33t is arranged to face the row of the through holes 31h in the back surface of the belt portion 31. The second area AR2 is formed between each of the first areas AR1 formed at five locations in the Y-axis direction with respect to the belt portion 31. Therefore, the second region AR2 and the first region AR1 are alternately disposed in the Y-axis direction on the belt portion 31, and the second regions AR2 are disposed on both ends in the Y-axis direction of the belt portion 31.
圖4係顯示沿圖3之A-A剖面之構成之圖。 Fig. 4 is a view showing the structure taken along the A-A section of Fig. 3.
如圖4所示,氣體吸引部33s連接於吸引系35。吸引系35具有吸引泵35a及吸引路徑35b。氣體吸引部33s透過吸引路徑35b連接於吸引泵35a。吸引路徑35b連接於導引載台33之底面(-Z軸側之面)33b側。因此,氣體吸引部33s,係從導引 面33a通過氣體吸引部33s而往底面33b脫離之方向吸引氣體。 As shown in FIG. 4, the gas suction portion 33 s is connected to the suction system 35. The suction system 35 includes a suction pump 35a and a suction path 35b. The gas suction unit 33s is connected to a suction pump 35a through a suction path 35b. The suction path 35b is connected to the bottom surface (the surface on the -Z axis side) 33b side of the guide stage 33. Therefore, the gas suction portion 33s sucks the gas in a direction from the guide surface 33a through the gas suction portion 33s to the bottom surface 33b.
又,氣體供應部33t連接於供應系36。供應系36具有氣體供應源36a及供應路徑36b。氣體供應部33t透過供應路徑36b連接於氣體供應源36a。供應路徑36b連接於導引載台33之底面33b側。因此,在氣體供應部33t,係從底面33b通過氣體供應部33t而往導引面33a脫離之方向供應氣體。 The gas supply unit 33t is connected to the supply system 36. The supply system 36 includes a gas supply source 36a and a supply path 36b. The gas supply unit 33t is connected to a gas supply source 36a through a supply path 36b. The supply path 36b is connected to the bottom surface 33b side of the guide stage 33. Therefore, the gas supply unit 33t supplies the gas in a direction from the bottom surface 33b to the guide surface 33a through the gas supply unit 33t.
此外,如圖3所示,於上述皮帶部31形成有位置基準部31c。位置基準部31c例如於周方向形成於皮帶部31之-Y軸側端部。 As shown in FIG. 3, a position reference portion 31 c is formed on the belt portion 31. The position reference portion 31 c is formed on the −Y-axis side end portion of the belt portion 31 in the circumferential direction, for example.
位置基準部31c顯示用以檢測基板S之X軸方向或Y軸方向之位置之基準。於皮帶部31之+Z軸側設有檢測位置基準部31c之編碼器EC。編碼器EC之檢測結果發送至控制部CONT。 The position reference portion 31 c displays a reference for detecting a position in the X-axis direction or the Y-axis direction of the substrate S. An encoder EC of a detection position reference portion 31c is provided on the + Z axis side of the belt portion 31. The detection result of the encoder EC is sent to the control unit CONT.
藉由控制部CONT之控制,依編碼器EC之檢測結果,進行例如搬送滾筒32d之旋轉速度與基板S之搬送速度之調整。 Under the control of the control unit CONT, for example, the rotation speed of the transfer drum 32d and the transfer speed of the substrate S are adjusted according to the detection result of the encoder EC.
如上述構成之基板處理裝置100,藉由控制部CONT之控制,藉由捲軸方式製造有機EL元件、液晶顯示元件等顯示元件(電子元件)。 The substrate processing apparatus 100 configured as described above, under the control of the control unit CONT, manufactures display elements (electronic elements) such as organic EL elements and liquid crystal display elements by a reel method.
以下,說明使用上述構成之基板處理裝置100製造顯示元件之步驟。 Hereinafter, the steps for manufacturing a display element using the substrate processing apparatus 100 configured as described above will be described.
首先,將捲繞於未圖示之滾筒之帶狀基板S安裝於基板供應部2。 First, a strip-shaped substrate S wound around a roller (not shown) is mounted on the substrate supply unit 2.
藉由控制部CONT之控制,以從此狀態之基板供應部2送出前述基板S之方式使未圖示之滾筒旋轉。接著,以設於基板回收部4之未圖示之滾筒捲取通過基板處理部3之前述基板S。藉由控制此基板供應部2及基板回收部4,能將基板S之被處理面Sa對基板處理部3連續搬送。 A roller (not shown) is rotated by the control unit CONT so that the substrate S is sent out from the substrate supply unit 2 in this state. Next, the substrate S passing through the substrate processing section 3 is taken up by a roller (not shown) provided in the substrate recovery section 4. By controlling the substrate supply unit 2 and the substrate recovery unit 4, the processed surface Sa of the substrate S can be continuously transferred to the substrate processing unit 3.
藉由控制部CONT之控制,在基板S從基板供應部2送出後至以基板回收部4捲取之期間,係一邊藉由基板處理部3之搬送裝置20使基板S在前述基板處理部3內搬送、一邊藉由處理裝置10於基板S上依序形成顯示元件之構成要件。 Under the control of the control unit CONT, the substrate S is placed in the substrate processing unit 3 by the transfer device 20 of the substrate processing unit 3 after the substrate S is sent out from the substrate supply unit 2 and wound up by the substrate recovery unit 4. The components of the display device are sequentially formed on the substrate S by the processing device 10 while being transported inward.
在進行處理裝置10之處理時,在使用搬送裝置20之基板支承機構30搬送基板S之情形,藉由控制部CONT之控制,首先使之成為基板S被夾持滾筒R1及R2夾著之狀態。藉由此動作,來自前述夾持滾筒R1及R2上游側之振動不易傳達至基板S。 When processing the processing device 10, when the substrate S is transferred using the substrate support mechanism 30 of the transfer device 20, under the control of the control unit CONT, it is first brought into a state where the substrate S is sandwiched by the clamping rollers R1 and R2. . With this operation, vibrations from the upstream sides of the nip rollers R1 and R2 are not easily transmitted to the substrate S.
藉由控制部CONT之控制,使用夾持滾筒R1及R2使基板S被往張力調整滾筒R3搬送。藉由控制部CONT之控制,在基板S到達張力調整滾筒R3之途中,使用基板洗淨部21進行基板S之洗淨。藉由基板S到達張力調整滾筒R3並掛於前述張力調整滾筒R3,而對基板賦予Y軸方向之張力。 Under the control of the control unit CONT, the substrate S is transferred to the tension adjustment roller R3 using the nip rollers R1 and R2. Under the control of the control unit CONT, the substrate S is cleaned using the substrate cleaning unit 21 while the substrate S reaches the tension adjustment roller R3. When the substrate S reaches the tension adjustment roller R3 and hangs on the tension adjustment roller R3, a tension in the Y-axis direction is applied to the substrate.
藉由控制部CONT之控制,使用張力調整滾筒R3使基板S被往基板吸附滾筒R4搬送。又,藉由控制部CONT之控制,皮帶部31旋轉。此時,藉由控制部(控制裝置)CONT之控制,基板吸附滾筒R4之旋轉與搬送滾筒32d之旋轉被同步成基板S之移動速度與皮帶部31之移動速度成為相等。在基板S到達基板支承機構30之前,藉由控制部CONT之控制,使用靜電除去部22除去基板S所帶靜電。藉由控制部CONT之控制,在基板S配置於基板支承機構30上游側之期間被進行靜電之除去。 Under the control of the control unit CONT, the substrate S is transferred to the substrate adsorption roller R4 by using the tension adjustment roller R3. In addition, the belt section 31 rotates under the control of the control section CONT. At this time, under the control of the control unit (control device) CONT, the rotation of the substrate suction roller R4 and the rotation of the transfer roller 32d are synchronized so that the moving speed of the substrate S and the moving speed of the belt portion 31 become equal. Before the substrate S reaches the substrate support mechanism 30, the static electricity removed by the substrate S is removed by the static electricity removing unit 22 under the control of the control unit CONT. Under the control of the control unit CONT, static electricity is removed while the substrate S is disposed on the upstream side of the substrate support mechanism 30.
其後,藉由控制部CONT之控制,基板S被往+X軸側搬送,基板支承機構30於+X軸方向通過。此時,藉由控制部CONT之控制,使用靜電除去部23除去基板S之靜電。藉由控制部CONT之控制,使用基板吸附滾筒R4對基板S賦予X軸方向之張力。 Thereafter, the substrate S is conveyed to the + X axis side by the control of the control unit CONT, and the substrate support mechanism 30 passes in the + X axis direction. At this time, the static electricity of the substrate S is removed by the static electricity removing unit 23 under the control of the control unit CONT. Under the control of the control unit CONT, a tension in the X-axis direction is applied to the substrate S using the substrate suction roller R4.
在對基板S賦予X軸方向之張力後,藉由控制部CONT之控制,從氣體供應部33t被供應氣體,且氣體吸引部33s吸引氣體,藉此基板S吸附於皮帶部31之支承面31a。此外,控制部CONT係控制成在使基板S吸附於皮帶部31之支承面31a之瞬間基板S之搬送速度較皮帶部31之旋轉速度高。 After applying tension in the X-axis direction to the substrate S, the gas is supplied from the gas supply portion 33t and the gas suction portion 33s is controlled by the control portion CONT, whereby the substrate S is attracted to the support surface 31a of the belt portion 31 . In addition, the control unit CONT is controlled so that the conveyance speed of the substrate S is higher than the rotation speed of the belt portion 31 at the moment when the substrate S is attracted to the support surface 31 a of the belt portion 31.
圖5係顯示沿圖3之A-A剖面之構成之圖。圖5係顯示已進行氣體 供應部33t之氣體供應及氣體吸引部33s之氣體吸引之情形之態樣之圖。 Fig. 5 is a view showing the constitution along the A-A section of Fig. 3. Fig. 5 is a diagram showing a state where the gas supply of the gas supply portion 33t and the gas suction of the gas suction portion 33s have been performed.
如圖5所示,在從氣體供應部33t供應氣體後,前述氣體係於導引載台33之導引面33a與皮帶部31之背面31b之間形成氣體層。又,在藉由氣體吸引部33s進行吸引後,構成氣體層之一部分氣體則會被氣體吸引部33s吸引。此時,控制部CONT藉由調整氣體之供應量與吸引量,而能將氣體層保持於一定之厚度。此時控制部CONT之調整量,能使用預先藉由進行實驗或模擬等而取得之資料等。 As shown in FIG. 5, after the gas is supplied from the gas supply portion 33 t, the aforementioned gas system forms a gas layer between the guide surface 33 a of the guide stage 33 and the back surface 31 b of the belt portion 31. After being sucked by the gas suction portion 33s, a part of the gas constituting the gas layer is sucked by the gas suction portion 33s. At this time, the control unit CONT can maintain the gas layer to a certain thickness by adjusting the supply amount and the suction amount of the gas. At this time, the adjustment amount of the control unit CONT can use data obtained in advance through experiments, simulations, and the like.
又,藉由氣體吸引部33s之吸引,透過對向於前述氣體吸引部33s之皮帶部31之各貫通孔31h,於支承面31a吸附基板S之被支承面Sb。 In addition, by the suction of the gas suction portion 33s, the supporting surface Sb of the substrate S is adsorbed on the support surface 31a through the through holes 31h of the belt portion 31 facing the gas suction portion 33s.
如上述,基板支承機構30中,導引載台33係以非接觸狀態支承皮帶部31之背面31b,且皮帶部31使基板S吸附於支承面31a來支承。此時,由於藉由基板吸附滾筒R4對基板S賦予X軸方向之張力,且藉由張力調整滾筒R3對基板S賦予Y軸方向之張力,因此不會於基板S產生皺紋等,而能以平坦之狀態加以保持。藉由控制部CONT之控制,在此狀態下,使用處理裝置10對基板S之被處理面Sa進行處理。 As described above, in the substrate supporting mechanism 30, the guide stage 33 supports the back surface 31b of the belt portion 31 in a non-contact state, and the belt portion 31 supports the substrate S by being attracted to the supporting surface 31a. At this time, since the substrate S is applied with tension in the X-axis direction to the substrate S by the substrate adsorption roller R4, and the substrate S is provided with tension in the Y-axis direction by the tension adjustment roller R3, wrinkles and the like are not generated on the substrate S, so that Keep it flat. Under the control of the control unit CONT, in this state, the processing surface Sa of the substrate S is processed using the processing apparatus 10.
又,藉由控制部(控制裝置)CONT之控制,在此狀態下,藉由基板吸附滾筒R4旋轉且搬送滾筒32d旋轉,而能使基板S之搬送速度與皮帶部31之移動速度以等速同步。因此,係一邊維持基板S之平坦狀態,一邊使基板S與皮帶部31往+X軸方向移動。又,藉由控制部(位置調整部)CONT之控制,使用編碼器EC檢測出形成於皮帶部31之支承面31a之位置基準部31c,根據其檢測結果調整基板S與皮帶部31之間之位置關係。此外,藉由控制部CONT之控制,使用皮帶洗淨部37適當進行皮帶部31之洗淨,且使用靜電除去部38進行皮帶部31之靜電除去。 In addition, under the control of the control unit (control device) CONT, in this state, the substrate adsorption roller R4 rotates and the transfer roller 32d rotates, so that the substrate S can be transported at the same speed as the movement speed of the belt portion 31 Synchronize. Therefore, the substrate S and the belt portion 31 are moved in the + X axis direction while maintaining the flat state of the substrate S. In addition, under the control of the control unit (position adjustment unit) CONT, the encoder EC detects the position reference portion 31c formed on the support surface 31a of the belt portion 31, and adjusts the distance between the substrate S and the belt portion 31 based on the detection result. Positional relationship. In addition, under the control of the control section CONT, the belt section 31 is appropriately cleaned using the belt cleaning section 37, and the static electricity is removed from the belt section 31 using the static electricity removing section 38.
如以上所述,本實施形態之搬送裝置20,由於具備基板支承機 構30,其具備:皮帶部31,具有支承基板S之被支承面Sb之支承面31a,形成有貫通支承面31a與前述支承面31a之背面31b之複數個貫通孔31h;氣體吸引部33s,與皮帶部31之背面31b中包含複數個貫通孔31h之第一區域AR1對向配置;以及氣體供應部33t,與皮帶部31之背面31b中不同於第一區域AR1之第二區域AR2對向配置,藉由對皮帶部31之背面31b進行氣體之供應及吸引,來以非接觸狀態保持皮帶部31之背面31b,並透過複數個貫通孔31h使基板S吸附於支承面31a,因此,能將基板S以平坦之狀態加以保持,且能將前述基板S以平坦之狀態搬送。 As described above, the transfer device 20 of this embodiment includes the substrate support mechanism 30, which includes the belt portion 31, the support surface 31a having the supported surface Sb of the substrate S, and the through support surface 31a and the aforementioned support. The plurality of through-holes 31h on the back surface 31b of the surface 31a; the gas suction portion 33s is arranged opposite to the first area AR1 including the plurality of through-holes 31h on the back surface 31b of the belt portion 31; The second area AR2 of the back surface 31b, which is different from the first area AR1, is oppositely arranged. By supplying and attracting gas to the back surface 31b of the belt portion 31, the back surface 31b of the belt portion 31 is held in a non-contact state and transmitted Since the plurality of through holes 31h attract the substrate S to the support surface 31a, the substrate S can be held in a flat state, and the substrate S can be transported in a flat state.
本發明之技術範圍並不限於上述實施形態,在不脫離本發明之趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the embodiments described above, and appropriate changes can be made without departing from the scope of the present invention.
例如,上述實施形態中,雖舉出處理裝置10之處理區域10p形狀為矩形之形狀之構成為例進行了說明,但不限定於此。 For example, in the above embodiment, the configuration in which the shape of the processing region 10p of the processing device 10 is rectangular has been described as an example, but it is not limited thereto.
例如,如圖6所示,在設有具有複數個投影光學系(PL1~PL5)之曝光裝置EX作為處理裝置10時,投影光學系PL1~PL5之投影區域為處理區域10p。 For example, as shown in FIG. 6, when an exposure device EX having a plurality of projection optical systems (PL1 to PL5) is provided as the processing device 10, the projection area of the projection optical systems PL1 to PL5 is the processing area 10p.
圖6中,投影光學系PL1、PL3及PL5沿Y軸方向於基板S之搬送方向上游側配置成一列,投影光學系PL2及PL4沿Y軸方向於基板S之搬送方向下游側配置成一列。如上述,曝光裝置EX為投影光學系PL1、PL3及PL5與投影光學系PL2及PL4於X軸方向偏離配置之構成。此外,投影光學系PL1~PL5之各投影區域10p,配置成在從X軸方向觀看時在與彼此相鄰之投影區域10p之間其Y軸方向一部分重疊。 In FIG. 6, the projection optical systems PL1, PL3, and PL5 are arranged in a row along the Y-axis direction on the upstream side of the substrate S in the transport direction, and the projection optical systems PL2 and PL4 are arranged in a row along the Y-axis direction on the downstream side of the substrate S in the transport direction. As described above, the exposure device EX has a configuration in which the projection optical systems PL1, PL3, and PL5 and the projection optical systems PL2 and PL4 are arranged in an offset from the X-axis direction. In addition, each of the projection areas 10p of the projection optical systems PL1 to PL5 is arranged so as to partially overlap in the Y-axis direction between adjacent projection areas 10p when viewed from the X-axis direction.
此外,投影光學系之數目及配置不限於圖6所示之例。例如,亦可係投影光學系配置有四個以下或六個以上之構成。又,亦可係複數個投影光學系配置成一列之構成或複數個投影光學系配置成三列以上之構成。 In addition, the number and arrangement of the projection optical systems are not limited to the example shown in FIG. 6. For example, the projection optical system may have a configuration in which four or less or six or more are arranged. It is also possible to have a configuration in which a plurality of projection optical systems are arranged in one row or a configuration in which a plurality of projection optical systems are arranged in three or more rows.
又,如圖7所示,亦可係複數個處理頭H排列配置之構成。此情 形下,於基板S之搬送方向上游側設有一個處理頭H,於基板S之搬送方向下游側設有兩個處理頭H。因此,處理區域10p形成於基板S上之三處。此情形亦同樣地,亦可係處理頭H配置有兩個或四個以上之構成,亦可係以與圖7之配置不同之配置設置。 Further, as shown in FIG. 7, a plurality of processing heads H may be arranged in an array. In this case, one processing head H is provided on the upstream side of the substrate S in the conveying direction, and two processing heads H are provided on the downstream side of the substrate S in the conveying direction. Therefore, the processing regions 10 p are formed at three places on the substrate S. In this case as well, the processing head H may be configured with two or four or more, or may be configured differently from the configuration shown in FIG. 7.
又,上述實施形態中,雖舉出導引載台33中於氣體吸引部33s與氣體供應部33t之間設有遮斷氣體之分隔構件34之構成為例進行了說明,但不限於此。例如亦可係未設有分隔構件34之構成。 Moreover, in the said embodiment, although the structure which provided the partition member 34 which interrupts a gas between the gas suction part 33s and the gas supply part 33t in the guide stage 33 was demonstrated as an example, it is not limited to this. For example, it may be a structure in which the partition member 34 is not provided.
又,本實施形態中,雖說明了設置靜電除去部22、23及基板洗淨部21之構成,但亦可省略靜電除去部22、23及基板洗淨部21之兩方或任一方。 In this embodiment, although the configuration in which the static electricity removing sections 22 and 23 and the substrate cleaning section 21 are provided has been described, both or any of the static electricity removing sections 22 and 23 and the substrate cleaning section 21 may be omitted.
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JPWO2013150677A1 (en) | 2015-12-17 |
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TWI590369B (en) | 2017-07-01 |
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