TWI574904B - A substrate tray, a substrate storage device and a substrate processing system - Google Patents
A substrate tray, a substrate storage device and a substrate processing system Download PDFInfo
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- TWI574904B TWI574904B TW100112411A TW100112411A TWI574904B TW I574904 B TWI574904 B TW I574904B TW 100112411 A TW100112411 A TW 100112411A TW 100112411 A TW100112411 A TW 100112411A TW I574904 B TWI574904 B TW I574904B
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- sheet
- guiding
- roller
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/30—Arrangements for accumulating surplus web
- B65H20/32—Arrangements for accumulating surplus web by making loops
- B65H20/34—Arrangements for accumulating surplus web by making loops with rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2402/00—Constructional details of the handling apparatus
- B65H2402/50—Machine elements
- B65H2402/52—Bearings, e.g. magnetic or hydrostatic bearings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/13—Details of longitudinal profile
- B65H2404/131—Details of longitudinal profile shape
- B65H2404/1313—Details of longitudinal profile shape concave
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/13—Details of longitudinal profile
- B65H2404/131—Details of longitudinal profile shape
- B65H2404/1314—Details of longitudinal profile shape convex
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/13—Details of longitudinal profile
- B65H2404/132—Details of longitudinal profile arrangement of segments along axis
- B65H2404/1321—Segments juxtaposed along axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2408/00—Specific machines
- B65H2408/20—Specific machines for handling web(s)
- B65H2408/21—Accumulators
- B65H2408/217—Accumulators of rollers type, e.g. with at least one fixed and one movable roller
- B65H2408/2172—Accumulators of rollers type, e.g. with at least one fixed and one movable roller several cascaded loops of rollers
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Storing, Repeated Paying-Out, And Re-Storing Of Elongated Articles (AREA)
- Advancing Webs (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Packaging Frangible Articles (AREA)
Description
本發明係關於一種基板匣、基板保管裝置及基板處理系統。The present invention relates to a substrate cassette, a substrate storage device, and a substrate processing system.
本申請係根據2010年4月9日申請之美國臨時申請61/322360號及2010年12月15日申請之美國臨時申請61/423207號主張優先權,並將其內容援引於此。Priority is claimed on U.S. Provisional Application No. 61/322,360, filed on Apr. 9, 2010, the entire disclosure of which is incorporated herein by reference.
作為構成顯示器裝置等顯示裝置之顯示元件,例如有液晶顯示元件、有機電致發光(有機EL)元件。目前,此等顯示元件係以與各像素對應在基板表面形成薄膜電晶體(Thin Film Transistor:TFT)之主動元件(Active device)漸為主流。Examples of the display elements constituting the display device such as a display device include a liquid crystal display element and an organic electroluminescence (organic EL) element. At present, such display elements are becoming mainstream with active devices that form thin film transistors (TFTs) on the surface of the substrate corresponding to the respective pixels.
近年來,提出了一種在片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術,例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下,簡記為「捲軸方式」)者廣為人知(例如,參照專利文獻1)。捲軸方式,係將捲繞在基板供應側之供應用滾筒之一片之片狀基板(例如,帶狀之薄膜構件)送出、並一邊將送出之基板以基板回收側之回收用滾筒加以捲繞一邊藉由設置在供應用滾筒與回收用滾筒之間之處理裝置對基板施加所欲加工。In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, a sheet-like substrate (for example, a strip-shaped film member) wound around one of the supply rollers on the substrate supply side is fed, and the fed substrate is wound on the substrate recovery side. The desired processing is applied to the substrate by a processing device disposed between the supply roller and the recovery roller.
在基板送出至被捲繞為止之期間,例如一邊使用複數個搬送滾筒等搬送基板、一邊使用複數個處理裝置(單元)來形成構成TFT之閘極電極、閘極絕緣膜、半導體膜、源極-汲極電極等,在基板之被處理面上依序形成顯示元件之構成要件。例如,在形成有機EL元件之情形時,係於基板上依序形成發光層、陽極、陰極、電路等。During the transfer of the substrate to the winding, the gate electrode, the gate insulating film, the semiconductor film, and the source of the TFT are formed using a plurality of processing devices (units) by using a plurality of transfer rollers or the like. - a gate electrode or the like, which sequentially forms constituent elements of the display element on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.
在將捲繞於回收滾筒之基板送出時,在捲繞時原本最末端之部分成為前端而送出基板。因此,在對基板反覆進行圖案形成之情形,在基板之捲繞時與基板之送出時,必須考慮使圖案形成處理之順序相反。如上述,必須每次管理基板之前端與最末端,因此會有管理上之負擔變大之情形。When the substrate wound around the recovery roller is fed out, the most end portion at the time of winding becomes the leading end and the substrate is fed out. Therefore, in the case where the substrate is repeatedly patterned, it is necessary to consider the order of the pattern forming process to be reversed when the substrate is wound and the substrate is fed. As described above, it is necessary to manage the front end and the end of the substrate each time, so that there is a problem that the management burden becomes large.
專利文獻1:國際公開第2006/100868號小冊子Patent Document 1: International Publication No. 2006/100868
在捲軸對捲軸方式中,由於基板一片之長度長,因此謀求減輕基板管理之負擔。In the reel-to-reel method, since the length of one substrate is long, the burden of substrate management is reduced.
本發明之形態之目的在於提供一種能減輕基板管理上之負擔之基板管理裝置、基板匣及基板處理系統。It is an object of the present invention to provide a substrate management apparatus, a substrate stack, and a substrate processing system capable of reducing the burden on substrate management.
一形態之基板匣,具備:收容部,收容形成為帶狀之基板;搬出口,係設於該收容部,用以將基板搬出;搬入口,係設於收容部,用以將基板搬入;以及導引部,將收容於收容部之基板之前端部從該搬入口導引至搬出口。a substrate 一 having a accommodating portion for accommodating a substrate formed in a strip shape; an unloading port disposed in the accommodating portion for carrying out the substrate; and a loading port being disposed in the accommodating portion for loading the substrate; And a guiding portion that guides the end portion of the substrate received in the accommodating portion from the loading port to the carrying port.
一形態之基板處理系統,具備:本發明第一形態之基板匣;以及基板處理裝置,具有與該基板匣連接之連接部。A substrate processing system according to a first aspect of the invention includes: a substrate according to a first aspect of the present invention; and a substrate processing apparatus having a connection portion connected to the substrate.
一形態之基板保管裝置,係將形成為帶狀且具有可撓性之基板在長邊方向複數次折返並保持,其特徵在於,具備:第一折返部,係以基板之表面彼此對向之方式將該基板折返;第二折返部,係以基板中之相對於第一折返部折返至一側之第一部分之背面彼此對向之方式將第一部分折返;方向轉換部,係使基板中之藉由第二折返部折返至與第一折返部相反側之第二部分朝向第一折返部方向轉換;以及第三折返部,係以基板中之被方向轉換部方向轉換後之第三部分之一部分沿著基板中之藉由第一折返部折返至第一部分之另一側之第四部分之表面或背面之方式將第三部分折返。In a substrate storage device according to one aspect, a substrate having a strip shape and having flexibility is folded back and held in a plurality of times in a longitudinal direction, and is characterized in that: a first folded portion is provided such that surfaces of the substrate face each other The second folded portion is configured to fold back the first portion in such a manner that the back surface of the first portion of the substrate that is folded back to one side with respect to the first folded portion is opposite to each other; the direction changing portion is configured to be in the substrate The second folded portion is folded back to the second portion opposite to the first folded portion toward the first folded portion; and the third folded portion is the third portion of the substrate that is converted by the direction changing portion. A portion of the third portion is folded back along the surface or back of the fourth portion of the substrate that is folded back to the other side of the first portion by the first folded portion.
根據本發明之形態,能減輕基板管理上之負擔。According to the aspect of the invention, the burden on the substrate management can be reduced.
(第一實施形態)(First embodiment)
參照圖式說明第一實施形態。The first embodiment will be described with reference to the drawings.
圖1係顯示本實施形態之基板匣CTR之構成的側剖面圖。Fig. 1 is a side cross-sectional view showing the configuration of a substrate 匣CTR of the present embodiment.
如圖1所示,基板匣(或片儲藏庫)CTR具備收容形成為帶狀之片狀基板(例如,帶狀之膜構件)之收容部1、將片狀基板搬入該收容部1之搬入口2、將片狀基板從該收容部1搬出之搬出口3、在收容部1內將片狀基板從搬入口2導引至搬出口3之導引部4、控制部5、及被連接口6。基板匣CTR係載置在例如製造工廠之地面F等來使用。As shown in FIG. 1, the substrate 匣 (or the sheet storage) CTR includes an accommodating portion 1 for accommodating a sheet-like substrate (for example, a strip-shaped film member), and carrying the sheet-like substrate into the accommodating portion 1 Port 2, a transfer port 3 for carrying out the sheet substrate from the accommodating portion 1, and a guide portion 4 for guiding the sheet substrate from the carry-in port 2 to the transfer port 3, the control portion 5, and the connected portion in the accommodating portion 1. Interface 6. The substrate 匣CTR is placed on, for example, the floor F of a manufacturing plant.
以下之說明中,設定XYZ正交座標系統,一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。具體而言,設與地面F平行之平面上之既定方向為X軸方向、在該平面上與X軸方向正交之方向為Y軸方向、與該平面垂直之方向為Z軸方向。又,設繞X軸、Y軸、Z軸之旋轉(傾斜)方向分別為θX、θY、θZ方向。In the following description, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. Specifically, the predetermined direction on the plane parallel to the ground surface F is the X-axis direction, the direction orthogonal to the X-axis direction on the plane is the Y-axis direction, and the direction perpendicular to the plane is the Z-axis direction. Further, the directions of rotation (inclination) around the X-axis, the Y-axis, and the Z-axis are θX, θY, and θZ directions, respectively.
作為片狀基板,可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂等材料。As the sheet substrate, for example, a resin film or a foil such as stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like may be used. Materials such as polycarbonate resin, polystyrene resin, and vinyl acetate resin.
片狀基板之Y方向(短邊方向)之尺寸係形成為例如50cm~2m程度、X方向(長邊方向)之尺寸則形成為例如10m以上。當然,此尺寸僅為一例,並不限於此例。例如片狀基板之Y方向之尺寸為50cm以下亦可、亦可為2m以上。本實施形態中,即使是Y方向之尺寸超過2m之片狀基板亦適用。又,片狀基板之X方向之尺寸亦可在10m以下。The size of the sheet-like substrate in the Y direction (short side direction) is, for example, about 50 cm to 2 m, and the dimension in the X direction (longitudinal direction) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the size of the sheet substrate in the Y direction may be 50 cm or less, or may be 2 m or more. In the present embodiment, a sheet substrate having a size of more than 2 m in the Y direction is also applicable. Further, the dimension of the sheet substrate in the X direction may be 10 m or less.
片狀基板係形成為例如具有1mm以下之厚度且具有可撓性。此處,所謂可撓性,係指例如對基板施以至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外,例如因上述既定力而彎折之性質亦包含於所指之可撓性。又,上述可撓性會隨著該基板材質、大小、厚度、以及温度等之環境等而改變。再者,片狀基板可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。The sheet substrate is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a predetermined force to at least its own weight. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, as the sheet substrate, a strip-shaped substrate may be used, or a plurality of unit substrates may be connected to form a strip shape.
片狀基板,以承受例如200℃程度之熱其尺寸亦無變化之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填料,例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。The sheet substrate is preferably one which is less subject to heat such as 200 ° C and which has a small thermal expansion coefficient. For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.
收容部1具有例如具有複數個壁面之盒體10。該複數個壁面係配置在構成例如長方體之各面之位置。盒體10亦能以例如-Z側之面直接接觸於地面F之方式載置,亦可為透過例如腳輪等設置在地面F之構成。為在盒體10設有可開閉之蓋部(未圖示)之構成亦可。The accommodating portion 1 has, for example, a casing 10 having a plurality of wall surfaces. The plurality of wall surfaces are disposed at positions that constitute, for example, the respective faces of the rectangular parallelepiped. The casing 10 can also be placed such that the surface on the -Z side is directly in contact with the floor surface F, or can be placed on the floor F through, for example, a caster. The cover 10 may be provided with an openable and closable cover portion (not shown).
搬入口2係形成在盒體10之中例如+X側之壁面10a。在搬入口2設有例如導引板21及22、搬入滾筒(驅動滾筒)23。導引板21及22係設在挾持片狀基板之表面及背面之位置。導引板21係形成為相對於導引板22往+X側突出。搬入滾筒23將從搬入口2搬入之片狀基板導引至收容部1之內部。The carry-in 2 is formed in the wall 10a of the case X, for example, on the +X side. For example, the guide plates 21 and 22 and the carry-in drum (drive roller) 23 are provided in the carry-in port 2. The guide sheets 21 and 22 are disposed at positions on the front and back surfaces of the sheet-like substrate. The guide plate 21 is formed to protrude toward the +X side with respect to the guide plate 22. The loading roller 23 guides the sheet substrate carried in from the loading port 2 to the inside of the housing portion 1.
搬出口3係形成在盒體10之中例如+X側之壁面10a。再者,搬出口3係形成在該壁面10a之中上方側(+Z側)。搬出口3係配置在例如搬入口2之下方側(-Z側)。如上述,本實施形態中,搬入口2與搬出口3係配置在盒體10之相同之壁面10a。又,在該壁面10a設有與外部之被連接口6。在搬出口3設有例如導引板31及32、搬出滾筒(驅動滾筒)33。導引板31及32係設在挾持片狀基板之表面及背面之位置。導引板31係形成為相對於導引板32往+X側突出。搬出滾筒33將盒體10內之片狀基板導引至搬出口3。The outlet 3 is formed in the wall 10a of the case X, for example, on the +X side. Further, the unloading port 3 is formed on the upper side (+Z side) of the wall surface 10a. The transfer port 3 is disposed, for example, on the lower side (-Z side) of the carry-in port 2. As described above, in the present embodiment, the carry-in port 2 and the carry-out port 3 are disposed on the same wall surface 10a of the casing 10. Further, the wall surface 10a is provided with a connected port 6 to the outside. For example, the guide plates 31 and 32 and the carry-out drum (drive drum) 33 are provided in the carry-out port 3. The guide sheets 31 and 32 are disposed at positions on the front and back surfaces of the sheet-like substrate. The guide plate 31 is formed to protrude toward the +X side with respect to the guide plate 32. The carry-out drum 33 guides the sheet substrate in the casing 10 to the carry-out port 3.
導引部4係設在盒體10之內部。導引部4具有固定導引板41、第一滾筒(驅動滾筒)42、平行導引板43、第二滾筒(驅動滾筒)44、可動導引板45及複數個折返機構46。此折返機構46係從配置有搬入口2及搬出口3之壁面10a沿著盒體10之深度方向配置有複數個。The guide portion 4 is provided inside the casing 10. The guiding portion 4 has a fixed guiding plate 41, a first roller (driving roller) 42, a parallel guiding plate 43, a second roller (driving roller) 44, a movable guiding plate 45, and a plurality of folding mechanisms 46. The folding mechanism 46 is disposed in plural in the depth direction of the casing 10 from the wall surface 10a on which the inlet 2 and the outlet 3 are disposed.
固定導引板41係從緊鄰搬入滾筒23之後方至緊鄰第一滾筒42之前方、水平固定在盒體10之內壁之板狀構件。固定導引板41係與例如X方向平行配置。固定導引板41之Y方向之尺寸係形成為大於例如片狀基板之短邊方向之尺寸,但構成為支承片狀基板之Y方向之寬度之兩側、不支承片狀基板之寬度方向之中央部亦可。又,為將固定導引板41分割成複數個導引板、將該複數個導引板沿著X方向相隔等間隔配置之構成亦可。固定導引板41將藉由例如搬入滾筒23搬入之片狀基板導引至-X方向。The fixed guide plate 41 is a plate-like member that is horizontally fixed to the inner wall of the casing 10 from immediately after the loading roller 23 to immediately before the first roller 42. The fixed guide plate 41 is disposed in parallel with, for example, the X direction. The dimension of the fixed guide plate 41 in the Y direction is formed to be larger than, for example, the dimension of the short side direction of the sheet substrate, but is configured to support both sides of the width of the sheet substrate in the Y direction and not to support the width direction of the sheet substrate. The central department is also available. Further, the fixed guide plate 41 may be divided into a plurality of guide plates, and the plurality of guide plates may be arranged at equal intervals in the X direction. The fixed guide plate 41 guides the sheet-like substrate carried in, for example, the loading roller 23 to the -X direction.
第一滾筒42係配置在固定導引板41之-X側端部之附近。第一滾筒42係以可在θZ方向旋轉之方式固定在盒體10之內壁。第一滾筒42將藉由固定導引板41導引之片狀基板搬送至平行導引板43。The first roller 42 is disposed in the vicinity of the -X side end portion of the fixed guide plate 41. The first roller 42 is fixed to the inner wall of the casing 10 so as to be rotatable in the θZ direction. The first roller 42 conveys the sheet substrate guided by the fixed guide plate 41 to the parallel guide plate 43.
平行導引板43係固定在盒體10之板狀構件。平行導引板43具有配置在+X側之內側導引板43a、及配置在-X側之外側導引板43b。內側導引板43a及外側導引板43b係以相對於水平面豎立之狀態、亦即板面與YZ平面平行之狀態對向配置。The parallel guide sheets 43 are fixed to the plate-like members of the casing 10. The parallel guide plate 43 has an inner guide plate 43a disposed on the +X side and an outer side guide plate 43b disposed on the -X side. The inner guide plate 43a and the outer guide plate 43b are disposed to face each other in a state of being erected with respect to a horizontal plane, that is, a state in which the plate surface is parallel to the YZ plane.
內側導引板43a與外側導引板43b隔著片狀基板可通過之間隙(本實施形態中,X方向之間隙)配置。內側導引板43a及外側導引板43b,分別之+Z側之端部朝向例如第一滾筒42往+X側彎曲形成,且分別之-Z側之端部朝向例如第二滾筒44往+X側彎曲形成。The inner guide plate 43a and the outer guide plate 43b are disposed via a gap through which the sheet substrate can pass (in the present embodiment, a gap in the X direction). The end portions of the inner guide plate 43a and the outer guide plate 43b on the +Z side are formed to be bent toward the +X side, for example, toward the first roller 42, and the end portions on the -Z side are respectively directed toward, for example, the second roller 44 toward + The X side is curved to form.
第二滾筒44係配置在盒體10內部之深度側(-X側)之端部且為平行導引板43之-Z側端部之附近。第二滾筒44係設成可在θY方向旋轉。第二滾筒44挾持藉由平行導引板43導引之片狀基板之表面及背面,搬送至可動導引板45。在第一滾筒42及第二滾筒44連接有例如未圖示之旋轉驅動機構。The second roller 44 is disposed at an end portion on the depth side (-X side) inside the casing 10 and is in the vicinity of the -Z-side end portion of the parallel guide plate 43. The second roller 44 is configured to be rotatable in the θY direction. The second roller 44 holds the front and back surfaces of the sheet substrate guided by the parallel guide sheets 43 and conveys them to the movable guide sheets 45. A rotation drive mechanism (not shown) is connected to the first roller 42 and the second roller 44, for example.
可動導引板45導引藉由第二滾筒44搬送之片狀基板。圖2係顯示沿著圖1中A-A剖面之構成的圖。如圖2所示,在盒體10之+Y側之壁部10b及-Y側之壁部10c之內面分別形成有凹部11。該凹部11係形成為例如在X方向成為長邊。在凹部11設有安裝成例如可在θX方向旋轉之軸部12。The movable guide plate 45 guides the sheet substrate conveyed by the second roller 44. Fig. 2 is a view showing the configuration along the A-A cross section of Fig. 1. As shown in FIG. 2, a recessed portion 11 is formed in each of the inner surface of the wall portion 10b on the +Y side and the wall portion 10c on the -Y side of the casing 10. The concave portion 11 is formed to have a long side in the X direction, for example. The recessed portion 11 is provided with a shaft portion 12 that is attached to, for example, a rotation in the θX direction.
可動導引板45係透過軸部12安裝在盒體10。軸部12可在θX方向旋轉。軸部12係連接於未圖示之旋轉驅動機構。該旋轉驅動機構係藉由例如控制部5之控制調整軸部12之旋轉角度、旋轉速度、旋轉時序等,但基本動作如圖2所示,只要能在可動導引板45成為大致水平之狀態、與收納於凹部11之大致垂直之狀態之間旋動即可。The movable guide plate 45 is attached to the casing 10 through the shaft portion 12. The shaft portion 12 is rotatable in the θX direction. The shaft portion 12 is connected to a rotation drive mechanism (not shown). The rotation drive mechanism adjusts the rotation angle, the rotation speed, the rotation timing, and the like of the shaft portion 12 by, for example, the control unit 5, but the basic operation is as shown in FIG. 2, as long as the movable guide plate 45 is substantially horizontal. It suffices to rotate between the state of being substantially perpendicular to the recessed portion 11.
藉由調整軸部12之旋轉角度,例如可動導引板45在例如與Y方向平行之狀態和與Z方向平行之狀態(前端部朝向-Z方向之狀態)切換。可動導引板45,在例如與Y方向平行之狀態,分別支承藉由第二滾筒44搬送之片狀基板之Y方向之兩端部。又,可動導引板45,在例如與Z方向平行之狀態,收容於凹部11內。如上述,可動導引板45係設成可在片狀基板之導引路徑上進出。By adjusting the rotation angle of the shaft portion 12, for example, the movable guide plate 45 is switched between a state parallel to the Y direction and a state parallel to the Z direction (a state in which the front end portion faces the -Z direction). The movable guide plate 45 supports both end portions of the sheet-like substrate conveyed by the second roller 44 in the Y direction, for example, in a state parallel to the Y direction. Moreover, the movable guide plate 45 is housed in the recessed portion 11 in a state parallel to the Z direction, for example. As described above, the movable guiding plate 45 is provided to be able to enter and exit on the guiding path of the sheet substrate.
如圖1所示,複數個折返機構46具有第一移動滾筒47及第二移動滾筒48。折返機構46分別彼此為相同構成。第一移動滾筒47係例如在片狀基板之-Z側配置有複數個。複數個第一移動滾筒47係沿著例如X方向相隔既定間隔配置。第二移動滾筒48係例如在片狀基板之+Z側配置有複數個。複數個第二移動滾筒48係沿著例如X方向相隔既定間隔配置。As shown in FIG. 1, a plurality of folding mechanisms 46 have a first moving roller 47 and a second moving roller 48. The folding mechanisms 46 are configured to be identical to each other. The first moving roller 47 is disposed, for example, in plural on the -Z side of the sheet substrate. The plurality of first moving rollers 47 are disposed at predetermined intervals along the X direction, for example. The second moving roller 48 is disposed, for example, in plural on the +Z side of the sheet substrate. The plurality of second moving rollers 48 are disposed at predetermined intervals, for example, along the X direction.
各第二移動滾筒48,在X方向,配置在分別相鄰之第一移動滾筒47之間。因此,第一移動滾筒47與第二移動滾筒48在例如X方向交互配置。又,例如第一移動滾筒47與第二移動滾筒48係配置成在例如XY面上觀察時不重疊。圖3係顯示折返機構46之構成的圖。Each of the second moving rollers 48 is disposed between the adjacent first moving rollers 47 in the X direction. Therefore, the first moving roller 47 and the second moving roller 48 are alternately arranged, for example, in the X direction. Further, for example, the first moving roller 47 and the second moving roller 48 are disposed so as not to overlap when viewed on, for example, the XY plane. FIG. 3 is a view showing the configuration of the folding mechanism 46.
如圖3所示,第一移動滾筒47及第二移動滾筒48分別為相同構成,藉由將圖3所示之狀態之折返機構46安裝在圖2所示之盒體10內下側,構成第一移動滾筒47,藉由使圖3所示之狀態之折返機構46上下反轉並安裝在圖2所示之盒體10之上側,構成第二移動滾筒48。第一移動滾筒47及第二移動滾筒48分別具有固定部51、可動部52、支承部53及滾筒部54。As shown in FIG. 3, the first moving roller 47 and the second moving roller 48 have the same configuration, respectively, and the folding mechanism 46 in the state shown in FIG. 3 is attached to the lower side of the casing 10 shown in FIG. The first moving roller 47 constitutes the second moving roller 48 by reversing the folding mechanism 46 in the state shown in Fig. 3 upside down and attaching it to the upper side of the casing 10 shown in Fig. 2 . The first moving roller 47 and the second moving roller 48 have a fixing portion 51, a movable portion 52, a support portion 53, and a roller portion 54, respectively.
固定部51具有例如固定在盒體10之內壁之一對驅動源51a、及連結該一對驅動源51a之棒狀導桿51b。固定部51係以例如導桿51b與Y軸平行之方式使一對驅動源51a對準固定。一對驅動源51a可使用例如使用空壓或油壓式活塞或滾珠螺桿與螺帽之構成等。驅動源51a係藉由例如控制部5控制驅動量、驅動時序等。The fixing portion 51 has, for example, a pair of driving walls 51a fixed to the inner wall of the casing 10, and a rod-shaped guiding rod 51b that connects the pair of driving sources 51a. The fixing portion 51 aligns and fixes the pair of driving sources 51a such that the guide bar 51b is parallel to the Y axis. For the pair of driving sources 51a, for example, a configuration using a pneumatic or hydraulic piston or a ball screw and a nut can be used. The drive source 51a controls the amount of driving, the drive timing, and the like by, for example, the control unit 5.
可動部52具有可沿著導桿51b移動之一對滑件52a、及隨著該一對滑件52a之移動在Z方向伸縮之伸縮部52b。一對滑件52a係藉由例如一對驅動源51a移動。圖3所示之構成,藉由例如一對滑件52a在左右方向之中央移動,伸縮部52b在+Z側伸長。又,藉由例如一對滑件52a在圖中左右方向之端部移動,伸縮部52b在-Z方向縮短。The movable portion 52 has a pair of sliders 52a movable along the guide bar 51b, and an expansion and contraction portion 52b that expands and contracts in the Z direction in accordance with the movement of the pair of sliders 52a. The pair of sliders 52a are moved by, for example, a pair of driving sources 51a. In the configuration shown in Fig. 3, for example, the pair of sliders 52a are moved in the center in the left-right direction, and the stretchable portion 52b is elongated on the +Z side. Further, for example, the pair of sliders 52a are moved at the end portions in the horizontal direction in the drawing, and the elasticized portion 52b is shortened in the -Z direction.
此外,將折返機構46之伸縮部52b縮最短之狀態作為初始狀態。Further, the state in which the expansion-contraction portion 52b of the folding-back mechanism 46 is minimized is taken as an initial state.
支承部53係固定於伸縮部52b之+Z側之前端。支承部53係設成可藉由伸縮部52b之伸縮動作在Z方向移動。在支承部53安裝有滾筒部54。滾筒部54係設成例如可在θY方向旋轉。滾筒部54係懸掛有例如片狀基板之部分。此外,使片狀基板彎折之滾筒部54之直徑係設定在使片狀基板U字狀折返時片狀基板不會塑性變形之範圍內。例如即使是厚度50μm程度之PET(聚對苯二甲酸乙二酯)或PEN(聚萘二甲酸乙二醇酯)之片狀基板,在未加工之狀態與在片狀表面沉積有鋁等之金屬皮膜或UV硬化樹脂層等之加工狀態,U字狀折返時所容許之最小曲率半徑亦不同,因此可考慮待保管之片狀基板之狀態(例如,對片狀基板進行處理之處理程序之內容等)來選擇滾筒部54之直徑。The support portion 53 is fixed to the front end of the +Z side of the expansion and contraction portion 52b. The support portion 53 is configured to be movable in the Z direction by the expansion and contraction operation of the expansion and contraction portion 52b. A roller portion 54 is attached to the support portion 53. The roller portion 54 is configured to be rotatable in the θY direction, for example. The roller portion 54 is suspended with a portion such as a sheet substrate. Further, the diameter of the roller portion 54 that bends the sheet substrate is set within a range in which the sheet substrate is not plastically deformed when the sheet substrate is folded in a U shape. For example, even a sheet substrate of PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 50 μm is deposited in an unprocessed state and on the surface of the sheet. The processing state of the metal film or the UV-curable resin layer or the like, and the minimum radius of curvature allowed in the U-shaped folding back are also different, so that the state of the sheet substrate to be stored can be considered (for example, the processing procedure for processing the sheet substrate) The content, etc.) is used to select the diameter of the roller portion 54.
圖1、圖2中,針對第一移動滾筒47及第二移動滾筒48分別顯示伸縮部52b縮短之狀態。藉由該伸縮部52b成為伸長之狀態,如圖1所示,滾筒部54,就第一移動滾筒47而言係配置在位置47S,就第二移動滾筒48而言係配置在位置48S。In FIGS. 1 and 2, the first moving roller 47 and the second moving roller 48 respectively show a state in which the elasticized portion 52b is shortened. As the expansion/contraction portion 52b is in an extended state, as shown in FIG. 1, the roller portion 54 is disposed at the position 47S with respect to the first movement roller 47, and is disposed at the position 48S with respect to the second movement roller 48.
圖4係顯示本發明實施形態之基板處理系統SYS之構成的圖。Fig. 4 is a view showing the configuration of a substrate processing system SYS according to an embodiment of the present invention.
如圖4所示,基板處理系統SYS具有供應片狀基板FB之基板供應部SU、對片狀基板FB之被處理面Fp進行處理之基板處理裝置PR、回收片狀基板FB之基板回收部CL、及控制該等各部之控制裝置CONT。As shown in FIG. 4, the substrate processing system SYS has a substrate supply unit SU that supplies the sheet substrate FB, a substrate processing apparatus PR that processes the processed surface Fp of the sheet substrate FB, and a substrate recovery unit CL that collects the sheet substrate FB. And controlling the control unit CONT of the various departments.
本實施形態中,作為兼用基板供應部SU與基板回收部CL之裝置,係使用上述基板匣CTR。在基板處理裝置PR設有與基板匣CTR之連接部CN。基板處理裝置PR之該連接部CN為例如連接於基板匣CTR之被連接口6之構成。該基板處理系統SYS係設置在例如工廠等。本實施形態中,基板匣CTR之搬出口3係作用為基板供應部SU,搬入口2係作用為基板回收部CL。In the present embodiment, the substrate 匣CTR is used as the device for the substrate supply unit SU and the substrate recovery unit CL. A connection portion CN to the substrate 匣CTR is provided in the substrate processing apparatus PR. The connection portion CN of the substrate processing apparatus PR is configured, for example, to be connected to the connected port 6 of the substrate 匣CTR. The substrate processing system SYS is installed, for example, at a factory or the like. In the present embodiment, the transfer port 3 of the substrate 匣CTR functions as the substrate supply unit SU, and the transfer port 2 functions as the substrate recovery unit CL.
基板處理系統SYS,係在從基板匣CTR之搬出口3送出片狀基板FB後至以基板匣CTR之搬入口2將片狀基板FB回收之期間對片狀基板FB之表面進行各種處理。基板處理系統SYS,可使用於在片狀基板FB上形成例如有機EL元件、液晶顯示元件等顯示元件(電子元件)之情形。當然,在形成此等元件以外之元件之情形使用基板處理系統SYS亦可。In the substrate processing system SYS, various processes are performed on the surface of the sheet substrate FB while the sheet substrate FB is fed from the substrate 匣CTR transfer port 3 and the sheet substrate FB is recovered by the substrate 匣CTR transfer port 2. The substrate processing system SYS can be used to form a display element (electronic element) such as an organic EL element or a liquid crystal display element on the sheet substrate FB. Of course, the substrate processing system SYS may be used in the case of forming components other than these components.
基板匣CTR將收容在收容部1之片狀基板FB從搬出口3送出並供應至基板處理裝置PR。又,基板匣CTR將來自基板處理裝置PR之片狀基板FB從搬入口2回收。再者,基板匣CTR係藉由導引部4將例如從搬入口2回收之片狀基板FB之前端部導引至搬出口3。The substrate 匣CTR feeds the sheet substrate FB accommodated in the accommodating portion 1 from the delivery port 3 and supplies it to the substrate processing apparatus PR. Further, the substrate 匣CTR collects the sheet substrate FB from the substrate processing apparatus PR from the transfer port 2. Further, the substrate 匣CTR is guided by the guide portion 4 to the front end portion of the sheet substrate FB collected from the carry-in port 2, for example, to the carry-out port 3.
基板處理裝置PR將從基板匣CTR之搬出口3供應之片狀基板FB搬送至該基板匣CTR之搬入口2,且在搬送之過程對片狀基板FB之被處理面Fp進行處理。基板處理裝置PR具有例如處理裝置PA、搬送裝置CV及對準裝置(未圖示)等。The substrate processing apparatus PR transports the sheet substrate FB supplied from the substrate 3 of the substrate 匣CTR to the transfer port 2 of the substrate 匣CTR, and processes the processed surface Fp of the sheet substrate FB during the transfer. The substrate processing apparatus PR includes, for example, a processing apparatus PA, a conveying apparatus CV, and an aligning apparatus (not shown).
處理裝置PA具有用以對片狀基板FB之被處理面Fp形成TFT或有機EL元件之各種處理部。作為此種處理部,可舉出例如在被處理面Fp上形成分隔壁之分隔壁形成裝置、形成用以驅動TFT或有機EL元件之電極之電極形成裝置、用以形成發光層之發光層形成裝置等。更具體而言,可舉出液滴塗布裝置(例如噴墨型塗布裝置、網版印刷型塗布裝置等)、蒸鍍裝置、濺鍍裝置等成膜裝置、或曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等。此等各裝置係適當設在例如片狀基板FB之搬送路徑上。此外,作為處理裝置PA,使用在例如片狀基板FB之搬送方向之前端部安裝導頭部之導頭安裝部亦可。The processing device PA has various processing units for forming a TFT or an organic EL element on the processed surface Fp of the sheet substrate FB. The processing unit includes, for example, a partition wall forming device that forms a partition wall on the surface Fp to be processed, an electrode forming device that forms an electrode for driving the TFT or the organic EL element, and a light-emitting layer for forming a light-emitting layer. Device, etc. More specifically, a film forming apparatus such as a droplet applying apparatus (for example, an ink jet type coating apparatus or a screen printing type coating apparatus), a vapor deposition apparatus, and a sputtering apparatus, or an exposure apparatus, a developing apparatus, and a surface modification may be mentioned. Quality device, cleaning device, etc. Each of these devices is suitably provided, for example, on a transport path of the sheet substrate FB. Further, as the processing device PA, a lead attaching portion to which a guide head is attached to the end portion of the sheet substrate FB in the transport direction may be used.
搬送裝置CV具有在基板處理裝置PR內將例如片狀基板FB搬送至搬入口2側之滾筒裝置R。滾筒裝置R係沿著片狀基板FB之搬送路徑例如設置複數個。在複數個滾筒裝置R中之至少一部分滾筒裝置R安裝有驅動機構(未圖示)。藉由使此種滾筒裝置R旋轉,將片狀基板FB在X軸方向搬送。複數個滾筒裝置R中之例如一部分滾筒裝置R為設成可在與搬送方向正交之方向移動之構成亦可。又,搬送裝置CV,在片狀基板FB之前端部安裝有導頭之情形,為具有保持該導頭之導頭保持部CVL之構成亦可。The transport device CV has a roller device R that transports, for example, the sheet substrate FB to the loading port 2 side in the substrate processing device PR. The roller device R is provided in a plurality of transport paths along the sheet substrate FB, for example. A drive mechanism (not shown) is attached to at least a part of the plurality of roller devices R. The sheet substrate FB is conveyed in the X-axis direction by rotating the roller device R. For example, a part of the plurality of roller devices R may be configured to be movable in a direction orthogonal to the conveying direction. Further, the transfer device CV may have a configuration in which a lead is attached to an end portion of the sheet substrate FB, and may have a configuration in which the guide holding portion CVL of the guide is held.
搬送裝置CV係以片狀基板FB之搬入位置與搬出位置皆成為基板處理裝置PR之+X側之方式搬送片狀基板FB。例如,搬送裝置CV具有折返滾筒RR。藉由此折返滾筒RR,搬送裝置CV係以將例如從基板處理裝置PR之+X側端部供應之片狀基板FB搬送至-X側、藉由折返滾筒RR折返至+X側以返回該基板處理裝置PR之+X側端部之方式搬送片狀基板FB。In the transport apparatus CV, the sheet-like substrate FB is transported so that the loading position and the carry-out position of the sheet substrate FB are both the +X side of the substrate processing apparatus PR. For example, the conveying device CV has a folding drum RR. By the folding roller RR, the conveying device CV conveys, for example, the sheet substrate FB supplied from the +X side end portion of the substrate processing apparatus PR to the -X side, and returns to the +X side by the folding roller RR to return to the side. The sheet substrate FB is conveyed so that the end portion of the substrate processing apparatus PR is on the +X side.
對準裝置檢測設在例如片狀基板FB之寬度方向之兩端部之對準標記,根據該檢測結果,進行片狀基板FB對處理裝置PA之對準動作。對準裝置具有檢測設在片狀基板FB之對準標記之對準攝影機、或根據該對準攝影機之檢測結果將片狀基板FB在例如X方向、Y方向、Z方向、θX方向、θY方向、θZ方向之中至少一方向微調整之調整機構等。The alignment device detects alignment marks provided at both end portions in the width direction of the sheet substrate FB, for example, and performs an alignment operation of the sheet substrate FB on the processing device PA based on the detection result. The alignment device has an alignment camera that detects an alignment mark provided on the sheet substrate FB, or the sheet substrate FB is in the X direction, the Y direction, the Z direction, the θX direction, and the θY direction according to the detection result of the alignment camera. An adjustment mechanism that finely adjusts at least one of the θZ directions.
以上述方式構成之基板處理系統SYS,係藉由控制裝置CONT之控制製造有機EL元件、液晶顯示元件等之顯示元件(電子元件)。以下,參照圖5說明使用上述構成之基板處理系統SYS製造顯示元件之步驟。In the substrate processing system SYS configured as described above, display elements (electronic elements) such as an organic EL element or a liquid crystal display element are manufactured under the control of the control unit CONT. Hereinafter, a procedure for manufacturing a display element using the substrate processing system SYS having the above configuration will be described with reference to FIG.
首先,將基板匣CTR安裝在基板處理裝置PR之連接部CN。在基板匣CTR,由於將片狀基板FB搬入之搬入口2、將片狀基板FB搬出之搬出口3如圖1所示係設在相同之壁面10a,因此將該壁面10a之被連接口6連接於連接部CN即可。亦即,能以連接部CN與基板匣側之被連接口6之機械連結精度將基板匣CTR簡單且正確地連接至基板處理裝置PR。First, the substrate 匣CTR is mounted on the connection portion CN of the substrate processing apparatus PR. In the substrate 匣CTR, since the transfer port 2 into which the sheet substrate FB is carried and the transfer port 3 for carrying out the sheet substrate FB are provided on the same wall surface 10a as shown in Fig. 1, the port 6a of the wall surface 10a is connected. It can be connected to the connection unit CN. In other words, the substrate 匣CTR can be simply and accurately connected to the substrate processing apparatus PR by the mechanical connection accuracy of the connection portion CN and the connected port 6 on the substrate 匣 side.
此外,收容於基板匣CTR之片狀基板FB,如圖6所示,捲繞懸掛在複數個第一滾筒42及複數個第二滾筒44,以折返複數次之狀態收容。接著,藉由後述方法,將來自基板匣CTR之片狀基板FB搬出。Further, as shown in FIG. 6, the sheet substrate FB accommodated in the substrate 匣CTR is wound around a plurality of first rollers 42 and a plurality of second rollers 44, and is accommodated in a state of being folded back a plurality of times. Next, the sheet substrate FB from the substrate 匣CTR is carried out by a method described later.
將基板匣CTR安裝後,控制部5使搬出滾筒33旋轉以將片狀基板FB從搬出口3送出。控制裝置CONT,在片狀基板FB從搬出口3送出至往搬入口2回收之期間,一邊藉由基板處理裝置PR之搬送裝置CV在該基板處理裝置PR內適當搬送片裝基板FB、一邊藉由處理裝置PA將顯示元件之構成元件依序形成在片狀基板FB上。After the substrate 匣CTR is mounted, the control unit 5 rotates the carry-out drum 33 to feed the sheet substrate FB from the delivery port 3. The control device CONT transfers the chip substrate FB in the substrate processing device PR while the sheet substrate FB is being transported from the transfer port 3 to the transfer port 2, and the substrate processing device PR is transported by the substrate processing device PR. The constituent elements of the display elements are sequentially formed on the sheet substrate FB by the processing device PA.
另一方面,控制部5將藉由基板處理裝置PR處理之該片狀基板FB以搬入口2之搬入滾筒23引入基板匣CTR內。藉由此種搬出滾筒33及搬入滾筒23之控制,能對基板處理裝置PR連續地搬送片狀基板FB之被處理面Fp。在基板匣CTR,經過基板處理裝置PR之片狀基板FB係透過搬入滾筒23導引至固定導引板41。On the other hand, the control unit 5 introduces the sheet substrate FB processed by the substrate processing apparatus PR into the substrate cassette CTR by the loading roller 23 of the loading port 2. By the control of the carry-out roller 33 and the carry-in roller 23, the processed surface Fp of the sheet-form substrate FB can be continuously conveyed to the substrate processing apparatus PR. In the substrate 匣CTR, the sheet substrate FB passing through the substrate processing apparatus PR is guided to the fixed guide sheet 41 through the carry-in drum 23.
導引至固定導引板41之片狀基板FB,例如圖5所示,透過第一滾筒42、平行導引板43、第二滾筒44到達可動導引板45。此時,控制部5預先使一對可動導引板45皆成為與Y方向平行之狀態,且預先使具有第一移動滾筒47之折返機構46之伸縮部52b及具有第二移動滾筒48之折返機構46之伸縮部52b成為收縮狀態(圖2之狀態)。亦即,使折返機構46之伸縮部52b成為初始狀態。The sheet substrate FB guided to the fixed guide plate 41, for example, as shown in FIG. 5, passes through the first roller 42, the parallel guide plate 43, and the second roller 44 to reach the movable guide plate 45. At this time, the control unit 5 causes the pair of movable guide plates 45 to be in a state of being parallel to the Y direction in advance, and the expansion and contraction portion 52b of the folding mechanism 46 having the first moving roller 47 and the folding of the second moving roller 48 are previously made. The expansion/contraction portion 52b of the mechanism 46 is in a contracted state (state of Fig. 2). That is, the expansion-contraction portion 52b of the folding mechanism 46 is brought into an initial state.
於是,片狀基板FB之前端部係在Y方向之兩端支承在可動導引板45之狀態下往+X方向導引。控制部5,在經過搬出滾筒33之片狀基板FB之前端部成為支承在導引板31之狀態(圖5之狀態)後,使搬出滾筒33之驅動停止。Then, the front end portion of the sheet-like substrate FB is guided in the +X direction while the both ends of the Y-direction are supported by the movable guide plate 45. The control unit 5 stops the driving of the carry-out roller 33 after the end portion of the control unit 5 is supported by the guide sheet 31 (the state of FIG. 5) before passing through the sheet substrate FB of the carry-out roller 33.
使搬出滾筒33之驅動停止後,控制部5使搬入滾筒23暫時停止,挾持片狀基板FB之前端部。控制部5將第一滾筒42及第二滾筒44之驅動從驅動軸切離,且藉由片狀基板FB之移動使其成為可從動旋轉之狀態。之後,控制部5使搬入滾筒23之驅動再開。After the driving of the carry-out roller 33 is stopped, the control unit 5 temporarily stops the loading roller 23 and grips the front end portion of the sheet substrate FB. The control unit 5 cuts off the driving of the first roller 42 and the second roller 44 from the drive shaft, and is in a state of being rotatable by the movement of the sheet substrate FB. Thereafter, the control unit 5 reopens the drive of the carry-in drum 23.
搬入滾筒23之驅動再開後,片狀基板FB再次藉由搬入口2送入,透過搬入滾筒23、第一滾筒42及第二滾筒44往可動導引板45導引。控制部5,在將可動導引板45收容於凹部11內後,根據來自第二滾筒44之片狀基板FB之搬送量,以第一移動滾筒47(54)及第二移動滾筒48(54)逐漸往上方或下方移動之方式使折返機構46之伸縮部52b延伸,據以使過多之張力不會施加在片狀基板FB。After the driving of the loading roller 23 is resumed, the sheet substrate FB is again fed by the loading port 2, and is guided to the movable guiding plate 45 through the loading roller 23, the first roller 42 and the second roller 44. After the movable guide plate 45 is housed in the recessed portion 11, the control unit 5 has the first moving roller 47 (54) and the second moving roller 48 (54) based on the amount of conveyance from the sheet substrate FB of the second roller 44. The extension portion 52b of the folding mechanism 46 is extended so as to gradually move upward or downward, so that excessive tension is not applied to the sheet substrate FB.
藉由此動作,第一移動滾筒47從片狀基板FB之-Z側之面將該片狀基板FB逐漸往+Z方向上壓。另一方面,第二移動滾筒48從片狀基板FB之+Z側之面將該片狀基板FB逐漸往-Z方向下壓。其結果,如圖6所示,具有第一移動滾筒47之折返機構46之伸縮部52b及具有第二移動滾筒48之折返機構46之伸縮部52b皆成為伸長狀態。又,片狀基板FB係捲繞懸掛在該第一移動滾筒47之一部分及第二移動滾筒48之一部分,以在X方向折返複數次之狀態收容。第一移動滾筒47及第二移動滾筒48成為伸長至最大可動範圍之狀態後,控制部5使搬入滾筒23之驅動停止。By this operation, the first moving roller 47 gradually presses the sheet substrate FB from the surface on the -Z side of the sheet substrate FB in the +Z direction. On the other hand, the second moving roller 48 gradually presses the sheet substrate FB toward the -Z direction from the surface on the +Z side of the sheet substrate FB. As a result, as shown in Fig. 6, the elasticized portion 52b of the folding mechanism 46 having the first moving roller 47 and the elasticized portion 52b of the folding mechanism 46 having the second moving roller 48 are in an extended state. Further, the sheet substrate FB is wound around one of the first moving roller 47 and one of the second moving roller 48, and is housed in a state of being folded back in the X direction. When the first moving roller 47 and the second moving roller 48 are in a state of being extended to the maximum movable range, the control unit 5 stops the driving of the loading roller 23.
由於第一移動滾筒47及第二移動滾筒48係配置成在X方向位置不會重疊,在使該第一移動滾筒47及第二移動滾筒48移動之過程中,片狀基板FB不會接觸且捲繞懸掛在該第一移動滾筒47及第二移動滾筒48並折返。因此,即使在第一移動滾筒47及第二移動滾筒48移動至可動範圍內之最大位置之狀態,片狀基板FB彼此亦成為不會接觸之狀態(非接觸狀態)。Since the first moving roller 47 and the second moving roller 48 are disposed so as not to overlap in the X direction, the sheet substrate FB does not contact during the movement of the first moving roller 47 and the second moving roller 48. The winding is suspended from the first moving roller 47 and the second moving roller 48 and folded back. Therefore, even when the first moving roller 47 and the second moving roller 48 are moved to the maximum position within the movable range, the sheet substrates FB are in a state of not contacting each other (non-contact state).
在將片狀基板FB從此狀態搬出時,控制部5在使搬入滾筒23之驅動停止之狀態下(挾持片狀基板FB之終端部之狀態下),驅動搬出滾筒33或第一滾筒42、第二滾筒44等。同時,控制部5以具有第一移動滾筒47之折返機構46之伸縮部52b及具有第二移動滾筒48之折返機構46之伸縮部52b逐漸收縮之方式控制驅動源51a。此時,較佳為,控制部5,在複數個折返機構46之伸縮部52b之中,從基板匣CTR之深度方向側朝向壁面10a側依序使折返機構46之伸縮部52延伸。片狀基板FB在第二滾筒44與搬出滾筒33之間成為大致水平張開之狀態後,控制部5從搬入滾筒23解放片狀基板FB之終端,且使可動導引板45成為與Y方向平行之狀態,將片狀基板FB之終端導引至搬出滾筒33。以此方式一邊供應片狀基板FB、一邊回收並在基板處理裝置PR對片狀基板FB進行處理。When the sheet-like substrate FB is carried out from this state, the control unit 5 drives the carry-out roller 33 or the first roller 42 in a state where the driving of the loading roller 23 is stopped (in the state in which the end portion of the sheet-like substrate FB is held) Two rollers 44 and the like. At the same time, the control unit 5 controls the drive source 51a such that the expansion and contraction portion 52b of the folding mechanism 46 having the first moving roller 47 and the expansion and contraction portion 52b of the folding mechanism 46 having the second moving roller 48 are gradually contracted. In this case, the control unit 5 sequentially extends the expansion-contraction portion 52 of the folding-back mechanism 46 from the depth direction side of the substrate 匣CTR toward the wall surface 10a side in the expansion-contraction portion 52b of the plurality of folding mechanisms 46. After the sheet substrate FB is substantially horizontally opened between the second roller 44 and the carry-out roller 33, the control unit 5 releases the terminal of the sheet substrate FB from the loading roller 23, and the movable guiding plate 45 is parallel to the Y direction. In the state, the terminal end of the sheet substrate FB is guided to the carry-out drum 33. In this manner, while the sheet substrate FB is supplied, the sheet substrate FB is recovered and processed in the substrate processing apparatus PR.
如上述,根據本實施形態,由於具備收容片狀基板FB之收容部1、設在該收容部1且將片狀基板FB搬出之搬出口3、設在收容部1且將片狀基板FB搬入之搬入口2、將收容在收容部1之片狀基板FB之前端部Fh從該搬入口2導引至搬出口3之導引部4,因此在將收容在基板匣CTR之片狀基板FB送出時,以片狀基板FB在收容時之前端部Fh成為前端之方式送出。因此,不需每次管理片狀基板FB之前端與最末端。藉此,在基板處理系統SYS可減輕片狀基板FB之管理上之負擔。As described above, according to the present embodiment, the accommodating portion 1 for accommodating the sheet-like substrate FB, the transfer port 3 for accommodating the sheet-like substrate FB, and the accommodating portion 1 are provided, and the sheet-like substrate FB is carried in. In the transfer port 2, the end portion Fh of the sheet substrate FB accommodated in the accommodating portion 1 is guided from the transfer port 2 to the guide portion 4 of the transfer port 3, so that the sheet substrate FB accommodated in the substrate 匣CTR is FB At the time of delivery, the sheet substrate FB is fed so that the end portion Fh is at the front end during storage. Therefore, it is not necessary to manage the front end and the extreme end of the sheet substrate FB each time. Thereby, the burden on the management of the sheet substrate FB can be alleviated in the substrate processing system SYS.
(第二實施形態)(Second embodiment)
接著,說明本發明之第二實施形態。Next, a second embodiment of the present invention will be described.
本實施形態之基板匣,可動導引板45之構成與第一實施形態不同,因此以該相異點為中心進行說明。其他構成與第一實施形態相同,因此省略或簡化其說明。In the substrate 本 of the present embodiment, the configuration of the movable guiding plate 45 is different from that of the first embodiment. Therefore, the difference will be mainly described. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted or simplified.
圖7係顯示本實施形態之基板匣CTR2之構成的圖。圖8係顯示沿著圖7中B-B剖面之構成的圖。Fig. 7 is a view showing the configuration of the substrate 匣CTR2 of the present embodiment. Fig. 8 is a view showing the configuration along the line B-B in Fig. 7.
如圖7及圖8所示,本實施形態中,可動導引板45在X方向分割,複數個板狀構件45a係以在X方向彼此分離之狀態配置。亦即,可動導引板45係形成為例如矩形。各板狀構件45a為設成例如可個別旋轉之構成亦可,為例如複數個板狀構件45a可一體旋轉之構成亦可。又,為各板狀構件45a之一部分彼此互相連結之形狀(梳狀)亦可。As shown in FIG. 7 and FIG. 8, in the present embodiment, the movable guide plate 45 is divided in the X direction, and a plurality of plate-like members 45a are disposed in a state of being separated from each other in the X direction. That is, the movable guiding plate 45 is formed, for example, in a rectangular shape. Each of the plate-like members 45a may be configured to be individually rotatable, for example, and may be configured such that a plurality of plate-like members 45a are integrally rotatable. Moreover, the shape (comb shape) in which one of the plate-shaped members 45a is connected to each other may be used.
藉由將可動導引板45形成為矩形(或梳狀),在例如片狀基板FB之前端部Fh從第二滾筒44送至搬出滾筒33之期間,可預先將各第一移動滾筒47之滾筒部54舉起至位置54F。該位置54F係構成可動導引板45之複數個板狀構件45a之上面與各滾筒部54之外周上面成為大致相同高度(Z方向之位置)之位置。因此,能穩定地確保片狀基板FB之搬送導引路徑。By forming the movable guide plate 45 into a rectangular shape (or a comb shape), for example, during the period from the second roller 44 to the carry-out roller 33 before the end portion Fh of the sheet substrate FB, the first moving roller 47 can be previously moved. The roller portion 54 is lifted up to the position 54F. The position 54F is a position at which the upper surface of the plurality of plate-like members 45a constituting the movable guide plate 45 and the outer circumferential surface of each of the roller portions 54 have substantially the same height (position in the Z direction). Therefore, the conveyance guide path of the sheet substrate FB can be stably ensured.
本發明之技術範圍並不限於上述實施形態,在不脫離本發明之趣旨之範圍內可施加適當變更。The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.
例如,上述實施形態中,以搬入口2配置在+Z側、搬出口配置在-Z側之構成為例進行說明,但並不限於此。例如圖9A所示,為搬入口2配置在-Z側(下側)、搬出口3配置在+Z側(上側)之構成亦可。在圖9A所示之構成,從-Z側之搬入口2搬入之片狀基板FB,在藉由配置在-Z側之固定導引板41往-X方向導引後,透過第一滾筒(驅動滾筒)42及平行導引板43往+Z方向導引。經過平行導引板43及第二滾筒(驅動滾筒)44之片狀基板FB,係導引至例如配置在+Z側之可動導引板45及折返機構46。For example, in the above-described embodiment, the configuration in which the transfer inlet 2 is disposed on the +Z side and the transfer port is disposed on the -Z side will be described as an example, but the invention is not limited thereto. For example, as shown in FIG. 9A, the transfer inlet 2 may be disposed on the -Z side (lower side), and the transfer port 3 may be disposed on the +Z side (upper side). In the configuration shown in FIG. 9A, the sheet substrate FB carried in from the loading port 2 on the -Z side is guided by the fixed guide plate 41 disposed on the -Z side in the -X direction, and then transmitted through the first roller ( The drive roller 42 and the parallel guide plate 43 are guided in the +Z direction. The sheet-like substrate FB passing through the parallel guide plate 43 and the second roller (driving roller) 44 is guided to, for example, the movable guide plate 45 and the folding-back mechanism 46 disposed on the +Z side.
先前之實施形態中,為在折返機構46配置在片狀基板FB之表面側及背面側之第一移動滾筒47及第二移動滾筒48之兩方在Z方向之反方向上下動之構成,但在本實施形態中,例如圖9A所示,為在片狀基板FB之裝填初始狀態、亦即片狀基板FB之前端部到達搬出口3且在搬出口3至滾筒44之間片狀基板FB保持大致水平之狀態時使位於片狀基板上方之第二移動滾筒48往-Z方向移動之構成。因此,第一移動滾筒47可旋動地軸支在基板匣CTR內之上方(+Z方向)位置。In the above-described embodiment, the first moving roller 47 and the second moving roller 48 disposed on the front side and the back side of the sheet substrate FB in the folding mechanism 46 are configured to move up and down in the opposite direction of the Z direction, but In the present embodiment, for example, as shown in FIG. 9A, the sheet substrate FB is placed in the initial state, that is, the end portion of the sheet substrate FB before reaching the outlet 3, and the sheet substrate FB between the outlet 3 and the drum 44 is shown. When the state is substantially horizontal, the second moving roller 48 located above the sheet substrate is moved in the -Z direction. Therefore, the first moving roller 47 can be pivotally supported at a position above the substrate 匣CTR (+Z direction).
在圖9A所示之構成中,為例如第一移動滾筒47固定、僅第二移動滾筒48被在基板匣CTR之兩側壁(與圖9A之紙面平行之面內之側壁)於Z方向細長形成之導引槽導引而可在Z方向移動之構成。因此,在第二移動滾筒48分別之兩端,與例如圖9A所示之第一移動滾筒47同樣地形成有突出之軸部以卡合於該導引槽。In the configuration shown in Fig. 9A, for example, the first moving roller 47 is fixed, and only the second moving roller 48 is elongated in the Z direction on both side walls of the substrate 匣CTR (the side wall in the plane parallel to the paper surface of Fig. 9A). The guide groove is guided to move in the Z direction. Therefore, at both ends of the second moving roller 48, similarly to the first moving roller 47 shown in Fig. 9A, for example, a protruding shaft portion is formed to be engaged with the guiding groove.
在固定配置之第一移動滾筒47,例如圖9B所示,在滾筒47之兩端側突出之軸部47A分別可旋動地設有環狀軸承47B,在此軸承47B安裝有可動導引板45之上方兩端。因此,第一移動滾筒47,即使在θY方向旋轉,可動導引板45亦切換於圖9A中以實線所示之大致水平狀態(與X方向大致平行)或以虛線所示之大致垂直狀態(與Z方向大致平行)。此切換係對應於片狀基板FB之搬送程序,藉由未圖示之驅動機構對軸支在複數個第一移動滾筒47分別之可動導引板45同時或依序(程序性)進行。In the fixed moving first moving roller 47, for example, as shown in FIG. 9B, the shaft portion 47A projecting on both end sides of the drum 47 is rotatably provided with an annular bearing 47B, respectively, and the bearing 47B is mounted with a movable guiding plate. Above the 45. Therefore, even if the first moving roller 47 rotates in the θY direction, the movable guiding plate 45 is switched to a substantially horizontal state (substantially parallel to the X direction) indicated by a solid line in FIG. 9A or a substantially vertical state indicated by a broken line. (substantially parallel to the Z direction). This switching is performed in accordance with the transport procedure of the sheet substrate FB, and the movable guide plates 45 respectively supported by the plurality of first moving rollers 47 are simultaneously or sequentially (procedural) by a drive mechanism (not shown).
可動導引板45,在配置成與例如X方向平行(或在片狀基板行進方向賦予若干上升梯度之傾斜)之狀態下,成為配置成埋設在相鄰之第一移動滾筒47之間之狀態。然而,如圖9A所示,設置導引板45之前端與相鄰之滾筒47不接觸程度之間隙亦可。又,在配置成與Z方向平行之狀態下,如圖9B所示,成為從相鄰之第一移動滾筒47之間退開之狀態。The movable guide plate 45 is disposed in a state of being disposed between the adjacent first moving rollers 47 in a state of being disposed parallel to, for example, the X direction (or an inclination of a plurality of ascending gradients in the traveling direction of the sheet substrate). . However, as shown in FIG. 9A, a gap in which the front end of the guide plate 45 is not in contact with the adjacent roller 47 may be provided. Moreover, in a state of being arranged in parallel with the Z direction, as shown in FIG. 9B, the state is retracted from between the adjacent first moving rollers 47.
又,圖9A所示之構成中,設有調整第二移動滾筒48往Z方向之移動時序之滑件構件49。滑件構件49具有卡合於各第二移動滾筒48之兩端之軸部之支承部(爪部)、及導引該軸部之導引凹部槽。以例如相鄰之二個第二移動滾筒48為例進行說明。Further, in the configuration shown in Fig. 9A, a slider member 49 for adjusting the timing of the movement of the second moving roller 48 in the Z direction is provided. The slider member 49 has a support portion (a claw portion) that engages with a shaft portion at both ends of each of the second moving rollers 48, and a guide recess groove that guides the shaft portion. For example, two adjacent second moving rollers 48 will be described as an example.
如圖10所示,該滑件構件49具有支承例如相鄰之二個第二移動滾筒48之軸部48Aa及48Ab之支承部(爪部)49c,49d、及導引該軸部48Aa及48Ab之導引凹部槽49a,49b。相鄰之支承部49c,49d分別之X方向之尺寸不同。具體而言,支承部49c之X方向之尺寸形成為較支承部49d之X方向之尺寸大。As shown in Fig. 10, the slider member 49 has support portions (claw portions) 49c, 49d for supporting the shaft portions 48Aa and 48Ab of the adjacent two second moving rollers 48, and guiding the shaft portions 48Aa and 48Ab. The guide recess grooves 49a, 49b. The adjacent support portions 49c, 49d have different dimensions in the X direction. Specifically, the dimension of the support portion 49c in the X direction is formed to be larger than the dimension of the support portion 49d in the X direction.
因此,如圖11A、圖11B、圖11C及圖11D所示,使滑件構件49往+X方向移動之情形,X方向之尺寸較短之支承部49d所支承之軸部48Ab先解除支承狀態,具有該軸部48Ab之第二移動滾筒48一邊將片狀基板FB下壓一邊往-Z方向移動。若進一步使滑件構件49往+X方向移動,則X方向之尺寸較大之支承部49c所支承之軸部48Aa解除支承狀態,具有該軸部48Aa之第二移動滾筒48亦一邊將片狀基板FB下壓一邊往-Z方向移動。如上述,由於滑件構件49形成為具有X方向之尺寸不同既定量之支承部,因此藉由使例如滑件構件49往+X方向移動,可調整配置在X方向之第二移動滾筒48之-Z方向之移動(下降)時序。Therefore, as shown in FIGS. 11A, 11B, 11C, and 11D, when the slider member 49 is moved in the +X direction, the shaft portion 48Ab supported by the support portion 49d having a short dimension in the X direction is first released from the support state. The second moving roller 48 having the shaft portion 48Ab moves in the -Z direction while pressing the sheet substrate FB. When the slider member 49 is further moved in the +X direction, the shaft portion 48Aa supported by the support portion 49c having a large dimension in the X direction is released from the support state, and the second moving roller 48 having the shaft portion 48Aa is also in the form of a sheet. The substrate FB is pressed down and moved in the -Z direction. As described above, since the slider member 49 is formed to have a support portion having a different size in the X direction, the second moving roller 48 disposed in the X direction can be adjusted by, for example, moving the slider member 49 in the +X direction. - Z direction movement (falling) timing.
又,藉由滑件構件49再次保持各第二移動滾筒48之軸部之情形,例如圖12A所示,在所有第二移動滾筒48與第一移動滾筒47之Z方向之位置大致相同之狀態下,例如使滑件構件49整體從-Z側往+Z側移動。亦即,如圖9A所示,從所有第二移動滾筒48位於最下側且片狀基板FB收容(貯存)最長之狀態將片狀基板FB從搬出口3依序引出至處理裝置側時,藉由設為驅動停止狀態之第一滾筒(驅動滾筒)42或第二滾筒(驅動滾筒)44將片狀基板FB不滑動地壓接(夾住),則各第二移動滾筒48對應片狀基板FB從搬出口3之送出量逐漸往上方(+Z方向)移動,成為圖12A所示之狀態。之後,如圖12B所示,使滑件構件49往X方向移動以使導引凹部槽49e及導引凹部槽49f與分別之第二移動滾筒48之軸部48Aa,48Ab之位置一致,使軸部48Aa,48Ab分別進入導引凹部槽49e,49f。在成為滑件構件49支承所有第二移動滾筒48之軸部之狀態後,例如使第二滾筒44及搬出滾筒33驅動,將片狀基板FB搬出。Further, by the slider member 49, the shaft portion of each of the second moving rollers 48 is held again, for example, as shown in Fig. 12A, the positions of all the second moving rollers 48 and the first moving roller 47 in the Z direction are substantially the same. Next, for example, the entire slider member 49 is moved from the -Z side to the +Z side. In other words, as shown in FIG. 9A, when all of the second moving rollers 48 are located at the lowermost side and the sheet substrate FB is stored (storage) for the longest state, the sheet-like substrate FB is sequentially taken out from the delivery port 3 to the processing apparatus side. Each of the second moving rollers 48 corresponds to a sheet shape by pressing (clamping) the sheet substrate FB without sliding by the first roller (driving roller) 42 or the second roller (driving roller) 44 that is in a driving stop state. The amount of conveyance of the substrate FB from the delivery port 3 gradually moves upward (+Z direction), and the state shown in FIG. 12A is obtained. Thereafter, as shown in Fig. 12B, the slider member 49 is moved in the X direction so that the guide recess groove 49e and the guide recess groove 49f coincide with the positions of the shaft portions 48Aa, 48Ab of the respective second moving rollers 48, so that the shaft The portions 48Aa, 48Ab enter the guide recess grooves 49e, 49f, respectively. After the slider member 49 supports the shaft portions of all the second moving rollers 48, for example, the second roller 44 and the carry-out roller 33 are driven to carry out the sheet substrate FB.
此外,如圖13A及圖13B所示,為在滑件構件49之一部分設置例如卡合邊緣部49g之構成亦可。此情形,預先將導引凹部槽49a之X方向之尺寸L1與導引凹部槽49b之X方向之尺寸L2形成為相同之尺寸。此情形,如圖13B所示,在所有第二移動滾筒48移動至-Z方向之最下部後,使滑件構件49直接往-Z方向移動之情形,卡合於導引凹部槽49a之軸部48Aa可在其位置透過導引凹部槽49h自由往+Z側移動。另一方面,卡合於導引凹部槽49b之軸部48Ab,係藉由該卡合邊緣部49g卡止往+Z側之移動。Further, as shown in FIG. 13A and FIG. 13B, a configuration in which, for example, the engagement edge portion 49g is provided in one portion of the slider member 49 may be employed. In this case, the dimension L1 in the X direction of the guide recess groove 49a and the dimension L2 in the X direction of the guide recess groove 49b are formed in the same size in advance. In this case, as shown in Fig. 13B, after all of the second moving rollers 48 are moved to the lowermost portion in the -Z direction, the slider member 49 is moved directly in the -Z direction, and is engaged with the axis of the guiding recess groove 49a. The portion 48Aa is freely movable to the +Z side through the guide recess groove 49h at its position. On the other hand, the shaft portion 48Ab that is engaged with the guide recess groove 49b is locked by the engagement edge portion 49g to the +Z side.
以上實施形態中,由於藉由第二移動滾筒48之本身重量將片狀基板FB往-Z側下壓,因此若假設將片狀基板FB從搬出口3引出時,各第二移動滾筒48之轉動摩擦極小,則與第二移動滾筒48之本身重量對應之張力賦予至片狀基板FB。因此,藉由選定第二移動滾筒48之重量,可將送入至處理裝置之片狀基板FB之張力設定在適當範圍。In the above embodiment, since the sheet substrate FB is pressed down toward the -Z side by the weight of the second moving roller 48, when the sheet substrate FB is taken out from the delivery port 3, each of the second moving rollers 48 is When the rotational friction is extremely small, the tension corresponding to the weight of the second moving roller 48 itself is imparted to the sheet substrate FB. Therefore, by selecting the weight of the second moving roller 48, the tension of the sheet substrate FB fed to the processing apparatus can be set to an appropriate range.
又,上述實施形態中,為在基板匣CTR之盒體10之相同壁面10a設置搬入口2及搬出口3之構成,但並不限於此,例如圖14所示,為搬入口2及搬出口3配置在盒體10之不同壁面之構成亦可。Further, in the above-described embodiment, the inlet 2 and the outlet 3 are provided on the same wall surface 10a of the casing 10 of the substrate 匣CTR. However, the present invention is not limited thereto. For example, as shown in Fig. 14, the inlet 2 and the outlet are provided. 3 may be disposed on different wall surfaces of the casing 10.
如圖14所示,在基板匣CTR之盒體10設置例如壁面10a及10d。其中,在壁面10a設置搬入口2。在壁面10d設置搬出口3。此外,圖14雖顯示搬入口2配置在+Z側、搬出口3配置在-Z側之構成,但並不限於此,搬入口2及搬出口3之Z方向上之位置可任意設定(+Z側、-Z側、Z方向之中央等可適當設定)。又,在壁面10a及壁面10d分別設有被連接口6A及6D。As shown in FIG. 14, for example, wall faces 10a and 10d are provided in the casing 10 of the substrate 匣CTR. Among them, the inlet 2 is provided in the wall surface 10a. The carry-out port 3 is provided in the wall surface 10d. Further, although FIG. 14 shows a configuration in which the carry-in 2 is disposed on the +Z side and the transfer port 3 is disposed on the -Z side, the present invention is not limited thereto, and the positions of the carry-in 2 and the transfer 3 in the Z direction can be arbitrarily set (+ The Z side, the -Z side, the center of the Z direction, and the like can be appropriately set). Further, the connected ports 6A and 6D are provided on the wall surface 10a and the wall surface 10d, respectively.
圖15係顯示使用圖14所示之基板匣CTR之基板處理系統SYS之構成的概略圖。Fig. 15 is a schematic view showing the configuration of a substrate processing system SYS using the substrate 匣CTR shown in Fig. 14.
如圖15所示,此情形,基板處理裝置PR在+X側及-X側之兩端部連接於基板匣CTR。例如,+X側之端部之連接部CN係連接於基板匣CTR之壁面10a側之被連接口6A。又,-X側之端部之連接部CN係連接於基板匣CTR之壁面10d側之被連接口6D。如上述,作為基板供應部SU及基板回收部CL,個別使用基板匣CTR亦可。此情形,在設置在基板供應部SU之基板匣CTR如上述圖6、圖9A所示保管片狀基板,在基板回收部CL配置空的基板匣CTR,將以基板處理裝置PR處理加工後之片狀基板以基板回收部CL側之基板匣CTR回收亦可。As shown in FIG. 15, in this case, the substrate processing apparatus PR is connected to the substrate 匣CTR at both end portions on the +X side and the -X side. For example, the connection portion CN at the end portion on the +X side is connected to the connected port 6A on the wall surface 10a side of the substrate 匣CTR. Further, the connection portion CN of the end portion on the -X side is connected to the connected port 6D on the wall surface 10d side of the substrate 匣CTR. As described above, the substrate 匣CTR may be used as the substrate supply unit SU and the substrate collection unit CL. In this case, the substrate 匣CTR provided in the substrate supply unit SU stores the sheet substrate as shown in FIGS. 6 and 9A, and the substrate 匣CTR is disposed in the substrate collection unit CL, and is processed by the substrate processing apparatus PR. The sheet substrate may be recovered by the substrate 匣CTR on the substrate collection portion CL side.
又,上述實施形態中,以基板匣CTR之搬入口2及搬出口3分別設置一個之構成為例進行說明,但並不限於此,為搬入口2及搬出口3之至少一方設置複數個之構成亦可。例如圖16所示之構成中,為在一個盒體10設置複數個搬出口(例如二個搬出口3A及3B)之構成。又,導引部4具有切換收容在盒體10之片狀基板FB從搬入口2至搬出口3A及3B之導引路徑之路徑切換機構(可動導引板等)40。該路徑切換機構40之切換動作可藉由例如控制部5控制。此外,圖16所示之構成,以設有複數個搬出口3A,3B之構成為例進行說明,但並不限於此,例如為搬入口2設有複數個(二個或三個以上)之構成亦可,為搬出口3設置三個以上之構成亦可。又,圖16所示之構成中,以將搬入口2與搬出口3(3A及3B)配置在個別壁面10a,10d之例進行說明,但並不限於此,為在相同壁面形成有複數個搬入口2與搬出口3之構成亦可。當然,為在複數個壁面(例如壁面10a及10d分別)形成有複數個搬入口2與搬出口3之構成亦可。In the above-described embodiment, the configuration in which one of the inlet 2 and the outlet 3 of the substrate 匣CTR is provided is described as an example. However, the present invention is not limited thereto, and a plurality of the inlet 2 and the outlet 3 are provided in plurality. It can also be constructed. For example, in the configuration shown in Fig. 16, a plurality of outlets (for example, two outlets 3A and 3B) are provided in one casing 10. Further, the guide portion 4 has a path switching mechanism (movable guide plate or the like) 40 that switches the guide path of the sheet substrate FB of the casing 10 from the carry-in port 2 to the carry-out ports 3A and 3B. The switching operation of the path switching mechanism 40 can be controlled by, for example, the control unit 5. In addition, although the configuration shown in FIG. 16 is described by taking a configuration in which a plurality of the outlets 3A and 3B are provided as an example, the present invention is not limited thereto. For example, the plurality of (two or more) inlets 2 are provided. The configuration may be such that three or more configurations may be provided for the outlet 3 . In the configuration shown in Fig. 16, the case where the carry-in port 2 and the transfer port 3 (3A and 3B) are disposed on the individual wall faces 10a and 10d will be described. However, the present invention is not limited thereto, and a plurality of the same wall faces are formed. The configuration of the entrance 2 and the outlet 3 may be adopted. Of course, a plurality of the inlets 2 and the outlets 3 may be formed in a plurality of wall surfaces (for example, the wall surfaces 10a and 10d, respectively).
再者,搬入口、搬出口設在基板匣CTR之盒體10之頂部亦可,如此,在製造工廠之二樓設置基板處理裝置PR群之情形,在設置在一樓之基板匣CTR與樓上之基板處理裝置PR之間可高效率搬送片狀基板。Further, the transfer port and the transfer port may be provided on the top of the case 10 of the substrate 匣CTR. Thus, in the case where the substrate processing apparatus PR group is provided on the second floor of the manufacturing plant, the substrate 匣CTR and the floor are provided on the first floor. The sheet substrate can be efficiently transported between the upper substrate processing apparatuses PR.
(第三實施形態)(Third embodiment)
接著,參照圖17說明本發明之第三實施形態。Next, a third embodiment of the present invention will be described with reference to Fig. 17 .
本實施形態之基板匣,在其內部將片狀基板折返複數次之第一移動滾筒47與第二移動滾筒48之上下動之構成與上述第一實施形態不同,因此以該相異點為中心進行說明。其他構成與第一實施形態相同,因此省略或簡化其說明。In the substrate cassette of the present embodiment, the configuration in which the first moving roller 47 and the second moving roller 48 are folded back in the plurality of times in the inside of the substrate substrate is different from that in the first embodiment, and therefore the difference is centered on the difference Be explained. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted or simplified.
在上述圖5~圖8所示之第一實施形態中,彼此相鄰之第一移動滾筒47與第二移動滾筒48之Z方向之移動成為相反相位(相補)。因此,如圖17所示,使彼此相鄰之第一移動滾筒47與第二移動滾筒48之對為在正時皮帶103A,103B之兩端吊掛之構成。該正時皮帶103A,103B為在可旋轉地軸支在例如基板匣內之側壁上方之滑輪100A,100B懸掛成逆U字狀之構成。In the first embodiment shown in Figs. 5 to 8, the movement of the first moving roller 47 and the second moving roller 48 adjacent to each other in the Z direction is reversed (compensated). Therefore, as shown in Fig. 17, the pair of the first moving roller 47 and the second moving roller 48 adjacent to each other is suspended at both ends of the timing belts 103A, 103B. The timing belts 103A, 103B are configured such that the pulleys 100A, 100B rotatably supported above the side walls of the substrate, for example, are suspended in an inverted U shape.
各正時皮帶103A,103B之端部係固定在將滾筒47,48之兩端之軸部可旋動地支承之軸承47B,48B。若第一移動滾筒47與第二移動滾筒48之各本身重量大致相同,則即使在理想狀態對滑輪100A,100B不賦予旋轉驅動力(轉矩),滾筒47,48之各高度位置亦持續保持其位置。The ends of the timing belts 103A, 103B are fixed to bearings 47B, 48B which are rotatably supported by the shaft portions at both ends of the rollers 47, 48. If the weights of the first moving roller 47 and the second moving roller 48 are substantially the same, even if the rotational driving force (torque) is not applied to the pulleys 100A, 100B in an ideal state, the height positions of the rollers 47, 48 are continuously maintained. Its location.
在同軸構成之一對滑輪100A,100B之一方、例如滑輪100A側,與滑輪100A,100B同軸固定有驅動滑輪102,在與於X方向相鄰之驅動滑輪102之間掛架有無端帶104。是以,若以馬達驅動位在X方向最端部之驅動滑輪102,則所有驅動滑輪102、亦即所有滑輪100A,100B以相同速度旋轉,例如,所有第一移動滾筒47一起往上方移動時,所有第二移動滾筒48一起往下方移動。The drive pulley 102 is coaxially fixed to one of the pulleys 100A, 100B, for example, on the side of the pulley 100A, coaxially with the pulleys 100A, 100B, and the endless belt 104 is hung between the drive pulleys 102 adjacent to the X direction. Therefore, when the drive pulley 102 positioned at the extreme end in the X direction is driven by the motor, all the drive pulleys 102, that is, all the pulleys 100A, 100B are rotated at the same speed, for example, when all of the first moving rollers 47 move upward together All of the second moving rollers 48 move together downward.
圖17係顯示上述第一實施形態之圖5(或圖7)之狀態(初始裝填狀態),片狀基板FB係裝填在各第一移動滾筒47之上方且為各第二移動滾筒48之下方之空間。在此狀態下,若使藉由馬達驅動之驅動滑輪102旋轉,則所有第一移動滾筒47一起往上方移動,一邊支承片狀基板FB之背面一邊舉起至最上方位置,同時,所有第二移動滾筒48一起往下方移動,一邊與片狀基板FB之表面接觸一邊下拉至最下方位置,藉此,以與上述圖6同樣之狀態將片狀基板FB保管在基板匣內。Fig. 17 is a view showing the state (initial loading state) of Fig. 5 (or Fig. 7) of the first embodiment, and the sheet substrate FB is loaded above each of the first moving rollers 47 and below each of the second moving rollers 48. Space. In this state, when the driving pulley 102 driven by the motor is rotated, all of the first moving rollers 47 move upward together, and while supporting the back surface of the sheet substrate FB, they are lifted up to the uppermost position, and at the same time, all the second The moving roller 48 moves downward together and pulls down to the lowest position while being in contact with the surface of the sheet substrate FB, whereby the sheet substrate FB is stored in the substrate stack in the same manner as in the above-described FIG.
(第四實施形態)(Fourth embodiment)
圖18係顯示第四實施形態之基板保管裝置之構成的立體圖。Fig. 18 is a perspective view showing the configuration of a substrate storage device according to a fourth embodiment.
如圖18所示,基板保管裝置STR具備收容形成為帶狀且具有可撓性之基板S之容器CT、及懸掛有基板S之複數個折返部RC。基板保管裝置STR,在例如載置在地面FL之容器CT收容基板S且以懸掛在複數個折返部RC之狀態保管。As shown in FIG. 18, the substrate storage device STR includes a container CT that accommodates a flexible substrate S in a strip shape, and a plurality of folded portions RC on which the substrate S is suspended. The substrate storage device STR stores the substrate S in a container CT placed on the floor surface FL, for example, and is stored in a state of being suspended in a plurality of folded portions RC.
以下,在基板保管裝置STR之說明中,設定XYZ正交座標系統,一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。以下之圖示中,XYZ正交座標系統之中設地面FL為XY平面。XY平面之中設基板S之短邊方向為Y軸方向、與Y軸方向正交之方向為X軸方向。又,設與地面FL(XY平面)垂直之方向為Z軸方向。Hereinafter, in the description of the substrate storage device STR, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following illustration, the ground FL is set to the XY plane among the XYZ orthogonal coordinate systems. Among the XY planes, the short side direction of the substrate S is the Y-axis direction, and the direction orthogonal to the Y-axis direction is the X-axis direction. Further, it is assumed that the direction perpendicular to the floor surface FL (XY plane) is the Z-axis direction.
容器CT例如外形係形成為長方體,具有六個壁面。在容器CT內部形成有以該六個壁面包圍之收容室RM。容器CT在相同壁面CTa具有二個開口部(EN,EX)。一方之開口部係將基板搬入至收容室RM之基板搬入口EN。另一方之開口部係將收容室RM之基板搬出之基板搬出口EX。本實施形態中,以基板搬入口EN配置在基板搬出口EX之-Z側之構成為例進行說明,但為相反之配置當然亦可。The container CT, for example, is formed into a rectangular parallelepiped shape having six wall faces. A housing chamber RM surrounded by the six wall faces is formed inside the container CT. The container CT has two openings (EN, EX) on the same wall surface CTa. The opening of one of the substrates is carried into the substrate transfer inlet EN of the storage chamber RM. The other opening is a substrate carrying outlet EX that carries out the substrate of the storage chamber RM. In the present embodiment, the configuration in which the substrate loading port EN is disposed on the -Z side of the substrate carrying-out port EX will be described as an example. However, the arrangement may be reversed.
在收容室RM之中基板搬入口EN附近設有搬入滾筒Rn。搬入滾筒Rn在於Z方向挾持基板S之位置設有一對。搬入滾筒Rn能以將從基板搬入口EN搬入之基板S引入至收容室RM之方式旋轉。A carry-in roller Rn is provided in the vicinity of the substrate transfer inlet EN in the storage chamber RM. The loading roller Rn is provided with a pair at a position where the substrate S is held in the Z direction. The loading roller Rn can be rotated in such a manner that the substrate S carried in from the substrate loading port EN is introduced into the storage chamber RM.
在收容室RM之中基板搬出口EX附近設有搬出滾筒Rx。搬出滾筒Rx在於Z方向挾持基板S之位置設有一對。搬出滾筒Rx能以將從基板搬出口EX搬出之基板S送出至收容室RM外部之方式旋轉。A carry-out roller Rx is provided in the vicinity of the substrate discharge port EX in the storage chamber RM. The carry-out roller Rx is provided with a pair at a position where the substrate S is held in the Z direction. The carry-out roller Rx can be rotated so that the substrate S carried out from the substrate discharge port EX is sent out to the outside of the storage chamber RM.
複數個折返部RC具有設在收容室RM之複數個(此處為15個)滾筒R1~R15之任一個。各滾筒R1~R15分別具有與Y方向平行之軸部Ra。各滾筒R1~R15,該軸部Ra係可旋轉地支承在例如容器CT之+Y側及-Y側之壁部。在各滾筒R1~R15之軸部Ra之周圍設有懸掛有收容之基板S之圓筒狀之外周部Rb。The plurality of folded portions RC have any one of a plurality of (here, 15) rollers R1 to R15 provided in the storage chamber RM. Each of the rollers R1 to R15 has a shaft portion Ra parallel to the Y direction. Each of the rollers R1 to R15 is rotatably supported by, for example, a wall portion on the +Y side and the -Y side of the container CT. A cylindrical outer peripheral portion Rb on which the accommodated substrate S is suspended is provided around the shaft portion Ra of each of the rollers R1 to R15.
各滾筒R1~R15係依序配置在從基板搬入口EN至基板搬出口EX之基板S之搬送路徑。以下,針對滾筒R1~R15之配置具體進行說明。Each of the rollers R1 to R15 is disposed in the transport path of the substrate S from the substrate transfer inlet EN to the substrate discharge port EX. Hereinafter, the arrangement of the rollers R1 to R15 will be specifically described.
複數個滾筒R1~R15之中,4個滾筒R1,R3,R5及R7係並排配置在與X軸方向平行之直線上。同樣地,3個滾筒R2,R4及R6係並排配置在與X軸方向平行之直線上。該3個滾筒R2,R4及R6係配置在較上述4個滾筒R1,R3,R5及R7更靠-Z側。Among the plurality of rollers R1 to R15, four rollers R1, R3, R5 and R7 are arranged side by side on a straight line parallel to the X-axis direction. Similarly, the three rollers R2, R4, and R6 are arranged side by side on a straight line parallel to the X-axis direction. The three rollers R2, R4 and R6 are disposed on the -Z side of the four rollers R1, R3, R5 and R7.
又,複數個滾筒R1~R15之中,4個滾筒R9,R11,R13及R15係並排配置在與X軸方向平行之直線上。該4個滾筒R9,R11,R13及R15係相鄰配置在上述4個滾筒R1,R3,R5及R7之+Z側。Further, among the plurality of rollers R1 to R15, four rollers R9, R11, R13 and R15 are arranged side by side on a straight line parallel to the X-axis direction. The four rollers R9, R11, R13 and R15 are arranged adjacent to the +Z side of the four rollers R1, R3, R5 and R7.
再者,複數個滾筒R1~R15之中,3個滾筒R10,R12及R14係並排配置在與X軸方向平行之直線上。該3個滾筒R10,R12及R14係配置在較上述4個滾筒R1,R3,R5及R7更靠-Z側且相鄰配置在上述3個滾筒R2,R4及R6之+Z側。Further, among the plurality of rollers R1 to R15, three rollers R10, R12 and R14 are arranged side by side on a straight line parallel to the X-axis direction. The three rollers R10, R12, and R14 are disposed on the -Z side of the four rollers R1, R3, R5, and R7, and are disposed adjacent to the +Z sides of the three rollers R2, R4, and R6.
以上述方式在X方向並排之滾筒之列係在Z方向設有4列。The row of rollers arranged side by side in the X direction in the above manner is provided in four rows in the Z direction.
4列滾筒之中,配置在Z方向之兩端之2列(+Z側端部:滾筒R9,R11,R13及R15,-Z側端部:滾筒R2,R4及R6)滾筒,相較於其他2列滾筒之徑形成為較大。Among the four rows of rollers, two rows at the two ends of the Z direction (+Z side ends: rollers R9, R11, R13, and R15, -Z side ends: rollers R2, R4, and R6) are compared with the drums. The diameter of the other two rows of rollers is formed to be large.
如上述,滾筒R1~R15之中徑不同之滾筒R1與滾筒R15之二個在Z方向相鄰並排配置(其中,滾筒R1之徑<滾筒R15之徑。以下,僅記載為「R1<R15」)。又,滾筒R2及R14(R14<R2)、滾筒R3及R13(R3<R13)、滾筒R4及R12(R12<R4)、滾筒R5及R11(R5<R11)、滾筒R6及R10(R10<R6)、滾筒R7及R9(R9<R7)分別亦在Z方向相鄰並排配置。As described above, the two rollers R1 and R15 having different diameters among the rollers R1 to R15 are arranged adjacent to each other in the Z direction (wherein the diameter of the roller R1 is smaller than the diameter of the roller R15. Hereinafter, only "R1 < R15" is described. ). Further, rollers R2 and R14 (R14 < R2), rollers R3 and R13 (R3 < R13), rollers R4 and R12 (R12 < R4), rollers R5 and R11 (R5 < R11), rollers R6 and R10 (R10 < R6) ), the rollers R7 and R9 (R9 < R7) are also arranged adjacent to each other in the Z direction.
基板S依序懸掛在滾筒R1~R15,藉此導引從基板搬入口EN至基板搬出口EX之搬送路徑。基板S在+X方向依序懸掛在從基板搬入口EN至滾筒R7之各滾筒。具體而言,基板S係藉由滾筒R1往-Z方向折返。基板S之中滾筒R1之下游側係藉由滾筒R2往+Z方向折返。基板S之中滾筒R2之下游側係藉由滾筒R3往-Z方向折返。以上述方式,從滾筒R1至滾筒R7,基板S在+Z方向與-Z方向交互折返。The substrate S is suspended from the rollers R1 to R15 in order to guide the transport path from the substrate carry-in EN to the substrate transfer exit EX. The substrate S is sequentially suspended in the +X direction from the respective rollers from the substrate carry-in EN to the roller R7. Specifically, the substrate S is folded back in the -Z direction by the roller R1. The downstream side of the drum R1 among the substrates S is folded back in the +Z direction by the drum R2. The downstream side of the drum R2 among the substrates S is folded back in the -Z direction by the drum R3. In the above manner, from the drum R1 to the drum R7, the substrate S is alternately folded back in the +Z direction and the -Z direction.
懸掛在滾筒R7之基板S經由方向轉換用之滾筒R8懸掛在滾筒R9。此基板S在-X方向依序懸掛在從滾筒R9至基板搬出口EX之各滾筒(R9~R15)。具體而言,基板S係藉由滾筒R9往-Z方向折返。基板S之中滾筒R9之下游側係藉由滾筒R10往+Z方向折返。基板S之中滾筒R10之下游側係藉由滾筒R11往-Z方向折返。以上述方式,從滾筒R9至滾筒R15,基板S在+Z方向與-Z方向交互折返,收容成基板S在X方向重疊。The substrate S suspended from the drum R7 is suspended from the drum R9 via a drum R8 for direction change. The substrate S is sequentially suspended in the -X direction from the respective rollers (R9 to R15) from the drum R9 to the substrate discharge port EX. Specifically, the substrate S is folded back in the -Z direction by the roller R9. The downstream side of the drum R9 among the substrates S is folded back in the +Z direction by the drum R10. The downstream side of the drum R10 among the substrates S is folded back in the -Z direction by the drum R11. In the above manner, from the drum R9 to the drum R15, the substrate S is alternately folded back in the +Z direction and the -Z direction, and the substrate S is accommodated so that the substrate S overlaps in the X direction.
在上述搬送路徑從基板搬入口EN導引至基板搬出口EX之基板S,在基板搬入口EN成為第一面Sa朝向+Z側、第二面Sb朝向-Z側之狀態。又,在基板搬出口EX成為第一面Sa朝向-Z側、第二面Sb朝向+Z側之狀態。In the substrate S in which the transport path is guided from the substrate transfer inlet EN to the substrate discharge port EX, the substrate transfer inlet EN is in a state in which the first surface Sa faces the +Z side and the second surface Sb faces the -Z side. In addition, the substrate carrying-out port EX is in a state in which the first surface Sa faces the -Z side and the second surface Sb faces the +Z side.
本實施形態中,在滾筒R6,以基板S之第一面Sa彼此對向之方式將基板S折返。此外,將基板S之中藉由滾筒R6折返至該滾筒R6之下游側之部分記載為第一部分S1。又,將基板S之中藉由滾筒R6折返至與第一部分S1反方向之部分記載為第四部分S4。In the present embodiment, the substrate S is folded back in the drum R6 so that the first surface Sa of the substrate S faces each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R6 by the roller R6 is referred to as a first portion S1. Further, the portion of the substrate S that is folded back by the roller R6 to the opposite direction to the first portion S1 is referred to as a fourth portion S4.
在滾筒R7,以第一部分S1之第二面Sb彼此對向之方式將該第一部分S1折返。此外,將基板S之中藉由滾筒R7折返至該滾筒R7之下游側之部分記載為第二部分S2。In the drum R7, the first portion S1 is folded back such that the second surface Sb of the first portion S1 faces each other. Further, a portion of the substrate S which is folded back to the downstream side of the roller R7 by the roller R7 is referred to as a second portion S2.
在滾筒R8及滾筒R9,以該第二部分S2朝向滾筒R6之方式進行方向轉換。此外,將基板S之中藉由滾筒R8及滾筒R9方向轉換後之部分記載為第三部分S3。In the drum R8 and the drum R9, the direction is switched such that the second portion S2 faces the drum R6. Further, a portion of the substrate S that has been converted by the direction of the drum R8 and the drum R9 is referred to as a third portion S3.
在滾筒R10,該第三部分S3係以沿著第四部分S4之第一面Sa之方式折返。同時,以例如在基板S例如從基板搬入口EN往基板搬出口EX移動之狀態下第三部分S3與第四部分S4往相反方向移動之方式,藉由滾筒R10將該第三部分S3折返。In the drum R10, the third portion S3 is folded back along the first surface Sa of the fourth portion S4. At the same time, for example, the third portion S3 is folded back by the roller R10 so that the third portion S3 and the fourth portion S4 move in opposite directions in a state where the substrate S moves from the substrate carry-in EN to the substrate carry-out EX.
由於從滾筒R6至滾筒R10以上述方式將基板S折返,因此基板S之中懸掛在滾筒R1~R7之部分與基板S之中懸掛在滾筒R9~R15之部分配置成在Z方向重疊。本實施形形態中,收容室RM之中中央部側之滾筒列較Z方向之端面側之滾筒列滾筒之徑變小,因此基板S之中在Z方向重疊之部分彼此不會接觸。Since the substrate S is folded back from the drum R6 to the drum R10 in the above-described manner, the portion of the substrate S suspended from the rollers R1 to R7 and the portion of the substrate S suspended from the rollers R9 to R15 are arranged to overlap in the Z direction. In the embodiment, the diameter of the roller row on the central portion side of the storage chamber RM is smaller than the diameter of the roller row roller on the end surface side in the Z direction. Therefore, the portions of the substrate S that overlap in the Z direction do not contact each other.
懸掛在滾筒R1~R15之基板S之中滾筒R1與滾筒R2之間之部分與YZ平面平行。如上述,以配置在上述4列滾筒列之中構成從+Z側起第2列之滾筒列之4個滾筒R1,R3,R5及R7、與構成最-Z側之滾筒列之3個滾筒R2,R4及R6之間之基板S與YZ平面平行之方式,調整滾筒R1~R7之X方向之位置。The portion between the drum R1 and the drum R2 suspended in the substrate S of the rollers R1 to R15 is parallel to the YZ plane. As described above, the four rollers R1, R3, R5, and R7 constituting the roller row in the second row from the +Z side among the four rows of the roller rows, and the three rollers constituting the roller column of the most-Z side are arranged. The position of the rollers R1 to R7 in the X direction is adjusted such that the substrate S between R2 and R4 and R6 is parallel to the YZ plane.
同樣地,以配置在上述4列滾筒列之中構成最+Z側之滾筒列之4個滾筒R9,R11,R13及R15、與構成從-Z側起第2列之滾筒列之3個滾筒R10,R12及R14之間之基板S與YZ平面平行之方式,調整滾筒R9~R15之X方向之位置。Similarly, the four rollers R9, R11, R13, and R15 constituting the most +Z side roller row among the four rows of the roller rows, and the three rollers constituting the second column from the -Z side are arranged. The position of the drums R9 to R15 in the X direction is adjusted such that the substrate S between R10 and R12 and R14 are parallel to the YZ plane.
此外,上述說明中,以基板S從基板搬入口EN朝向基板搬出口EX在收容室RM移動之情形為例進行說明,但例如基板S從基板搬出口EX朝向基板搬入口EN在收容室RM移動之情形,亦可進行相同說明。此外,此情形,由於基板S之移動方向與上述說明相反,因此以基板搬出口EX側為上游側、基板搬入口EN側為下游側來進行說明。In the above description, the case where the substrate S moves from the substrate carry-in EN toward the substrate transfer opening EX in the storage chamber RM will be described as an example. However, for example, the substrate S moves from the substrate transfer opening EX toward the substrate transfer inlet EN in the storage chamber RM. In the case of the same, the same description can be made. In this case, since the moving direction of the substrate S is opposite to the above description, the substrate carrying-out EX side is the upstream side and the substrate carrying-in EN side is the downstream side.
如圖18所示,例如在滾筒R10,以基板S之第二面Sb彼此對向之方式將基板S折返。此外,將基板S之中藉由滾筒R10折返至該滾筒R10之下游側之部分記載為第一部分T1。又,將基板S之中藉由滾筒R10折返至與第一部分T1反方向之部分記載為第四部分T4。As shown in FIG. 18, for example, in the drum R10, the substrate S is folded back so that the second surface Sb of the substrate S faces each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R10 by the roller R10 is referred to as a first portion T1. Further, a portion of the substrate S which is folded back by the roller R10 to the opposite direction to the first portion T1 is referred to as a fourth portion T4.
在滾筒R9,以第一部分T1之第一面Sa彼此對向之方式將該第一部分T1折返。此外,將基板S之中藉由滾筒R9折返至該滾筒R9之下游側之部分記載為第二部分T2。In the drum R9, the first portion T1 is folded back in such a manner that the first surface Sa of the first portion T1 opposes each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R9 by the roller R9 is referred to as a second portion T2.
在滾筒R9及滾筒R8,以該第二部分T2朝向滾筒R10之方式進行方向轉換。此外,將基板S之中藉由滾筒R8及滾筒R9方向轉換後之部分記載為第三部分T3。In the drum R9 and the drum R8, the direction is switched such that the second portion T2 faces the drum R10. Further, a portion of the substrate S that has been converted by the direction of the drum R8 and the drum R9 is referred to as a third portion T3.
在滾筒R6,該第三部分T3係以沿著第四部分T4之第二面Sb之方式折返。同時,以例如在基板S例如從基板搬出口EX往基板搬入口EN移動之狀態下第三部分T3與第四部分T4往相反方向移動之方式,藉由滾筒R6將該第三部分T3折返。In the drum R6, the third portion T3 is folded back along the second surface Sb of the fourth portion T4. At the same time, the third portion T3 is folded back by the roller R6 so that the third portion T3 and the fourth portion T4 move in opposite directions in a state where the substrate S moves from the substrate carry-out exit EX to the substrate carry-in EN, for example.
如上述,在基板S從基板搬出口EX往基板搬入口EN移動之情形,從滾筒R10至滾筒R6以上述方式將基板S折返。因此基板S之中懸掛在滾筒R1~R7之部分與基板S之中懸掛在滾筒R9~R15之部分配置成在Z方向重疊。As described above, when the substrate S moves from the substrate unloading port EX to the substrate carrying-in EN, the substrate S is folded back from the drum R10 to the drum R6 in the above-described manner. Therefore, the portion of the substrate S that is suspended from the rollers R1 to R7 and the portion of the substrate S that is suspended from the rollers R9 to R15 are arranged to overlap in the Z direction.
如上述,根據本實施形態,由於基板S在波狀折返成在X方向重疊且配置成在Z方向複數重疊之狀態下收容在收容室RM,因此可對收容室RM之有限空間高效率收容基板S。藉此,可獲得基板S之收容能力高之基板保管裝置STR。As described above, according to the present embodiment, the substrate S is accommodated in the storage chamber RM in a state in which the substrate S is folded in the wavy direction and arranged to overlap in the Z direction. Therefore, the substrate can be efficiently accommodated in the limited space of the storage chamber RM. S. Thereby, the substrate storage device STR having a high storage capacity of the substrate S can be obtained.
(第五實施形態)(Fifth Embodiment)
接著,說明本發明之第五實施形態。Next, a fifth embodiment of the present invention will be described.
圖19係顯示本實施形態之基板保管裝置STR2之構成的圖。本實施形態中,複數個折返部RC之構成與第四實施形態不同,因此以該點為中心進行說明。此外,其他構成與第四實施形態相同。針對與第四實施形態相同之構成,賦予相同符號以省略或簡化其說明。此外,本實施形態中,與第四實施形態相同使用XYZ正交座標系統進行說明。Fig. 19 is a view showing the configuration of the substrate storage device STR2 of the present embodiment. In the present embodiment, the configuration of the plurality of folded portions RC is different from that of the fourth embodiment. Therefore, the description will be focused on this point. Further, other configurations are the same as those of the fourth embodiment. The same components as those in the fourth embodiment are denoted by the same reference numerals to omit or simplify the description. Further, in the present embodiment, the XYZ orthogonal coordinate system will be described in the same manner as the fourth embodiment.
如圖19所示,基板保管裝置STR2,以基板S在Z方向三重配置之方式構成複數個折返部RC。折返部RC具有複數個滾筒R21~滾筒R44之任一個。As shown in FIG. 19, the substrate storage device STR2 constitutes a plurality of folded portions RC such that the substrate S is triple-arranged in the Z direction. The folded portion RC has any one of a plurality of rollers R21 to R44.
滾筒R21~R44之中,相對於收容室RM之Z方向中央部在-Z側配置有11個滾筒。其中,4個滾筒R21,R23,R25及R27、4個滾筒R29,R31,R33及R35、3個滾筒R37,R39及R41分別在X方向並排一列。Among the rollers R21 to R44, eleven rollers are arranged on the -Z side with respect to the central portion of the storage chamber RM in the Z direction. Among them, four rollers R21, R23, R25 and R27, four rollers R29, R31, R33 and R35, and three rollers R37, R39 and R41 are arranged side by side in the X direction.
又,滾筒R21~R44之中,相對於收容室RM之Z方向中央部在+Z側配置有13個滾筒。其中,3個滾筒R22,R24及R26、4個滾筒R28,R30,R32及R34、4個滾筒R36,R38,R40及R42分別在X方向並排一列。又,沿著容器CT之+Z側內壁設有滾筒R43及R44。Further, among the rollers R21 to R44, 13 rollers are arranged on the +Z side with respect to the central portion of the storage chamber RM in the Z direction. Among them, three rollers R22, R24 and R26, four rollers R28, R30, R32 and R34, and four rollers R36, R38, R40 and R42 are arranged side by side in the X direction. Further, rollers R43 and R44 are provided along the inner wall of the +Z side of the container CT.
如上述,本實施形態中,在X方向並排之滾筒列在Z方向設有6列。此6列之滾筒列,從收容室RM之Z方向中央部在+Z側設有3列,在-Z側設有3列。收容室RM之中從Z方向之端部側之滾筒列朝向中央部側之滾筒列滾筒之徑階段性變小。As described above, in the present embodiment, the row of the rollers arranged in the X direction is provided in six rows in the Z direction. The row of the six rows of rollers is provided in three rows on the +Z side from the central portion of the storage chamber RM in the Z direction, and three rows on the -Z side. Among the accommodating chambers RM, the diameter of the roller row from the end portion side in the Z direction toward the roller row of the center portion side is gradually reduced.
基板S在從基板搬入口EN透過搬入滾筒Rn搬入至收容室RM後,藉由滾筒R21往+Z方向折返。基板S之中滾筒R21之下游側係藉由滾筒R22往-Z方向折返。該基板S在滾筒R23~R27,同樣地交互在+Z方向及-Z方向折返。After the substrate S is carried into the storage chamber RM through the loading roller Rn from the substrate loading inlet EN, the substrate S is folded back in the +Z direction by the roller R21. The downstream side of the drum R21 among the substrates S is folded back in the -Z direction by the drum R22. The substrate S is similarly reciprocated in the +Z direction and the -Z direction on the rollers R23 to R27.
基板S之中滾筒R27之下游側係藉由方向轉換用之滾筒R28折返而轉換方向。基板S之中滾筒R28之下游側在滾筒R29~R34在+Z方向及-Z方向交互折返,藉由方向轉換用之滾筒R35折返而再次轉換方向。The downstream side of the roller R27 in the substrate S is folded back by the roller R28 for direction change to change the direction. The downstream side of the roller R28 in the substrate S is alternately folded back in the +Z direction and the -Z direction by the rollers R29 to R34, and is re-turned by the roller R35 for direction change.
基板S之中滾筒R35之下游側在滾筒R36~R41在+Z方向及-Z方向交互折返,藉由方向轉換用之滾筒R42及R43折返而轉換方向。以上述方式,基板S係以在X方向重疊之狀態配置。又,基板S之中滾筒R43之下游側朝向基板搬出口EX,懸掛在滾筒R44後,透過搬出滾筒Rx從基板搬出口EX搬出。The downstream side of the drum R35 in the substrate S is alternately folded back in the +Z direction and the -Z direction by the rollers R36 to R41, and is turned by the rollers R42 and R43 for direction change. In the above manner, the substrate S is disposed in a state of being overlapped in the X direction. Further, the downstream side of the drum R43 in the substrate S faces the substrate discharge port EX, is suspended by the drum R44, and is carried out from the substrate discharge port EX through the carry-out drum Rx.
懸掛在滾筒R21~R42之基板S之中例如滾筒R21與滾筒R22之間之部分與YZ平面平行。如上述,以基板S之中跨越收容室RM之Z方向中央部懸掛之部分與YZ平面平行之方式,調整滾筒R21~R42之X方向之位置。Among the substrates S suspended by the rollers R21 to R42, for example, a portion between the rollers R21 and the roller R22 is parallel to the YZ plane. As described above, the positions of the rollers R21 to R42 in the X direction are adjusted so that the portion of the substrate S that hangs from the center portion in the Z direction of the storage chamber RM is parallel to the YZ plane.
本實施形態中,在滾筒R26,以基板S之第二面Sb彼此對向之方式將基板S折返。此外,將基板S之中藉由滾筒R26折返至該滾筒R26之下游側之部分記載為第一部分S21。又,將基板S之中藉由滾筒R26折返至與第一部分S21反方向之部分記載為第四部分S24。In the present embodiment, the substrate S is folded back in the drum R26 so that the second surface Sb of the substrate S faces each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R26 by the roller R26 is referred to as a first portion S21. Further, the portion of the substrate S that is folded back by the roller R26 to the opposite direction to the first portion S21 is referred to as a fourth portion S24.
在滾筒R27,以第一部分S21之第一面Sa彼此對向之方式將該第一部分S21折返。此外,將基板S之中藉由滾筒R27折返至該滾筒R27之下游側之部分記載為第二部分S22。In the drum R27, the first portion S21 is folded back such that the first surface Sa of the first portion S21 opposes each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R27 by the roller R27 is referred to as a second portion S22.
在滾筒R28及滾筒R29,以該第二部分S22朝向滾筒R26之方式進行方向轉換。此外,將基板S之中藉由滾筒R28及滾筒R29方向轉換後之部分記載為第三部分S23。In the drum R28 and the drum R29, the direction is switched such that the second portion S22 faces the drum R26. Further, a portion of the substrate S that has been converted by the direction of the drum R28 and the drum R29 is referred to as a third portion S23.
在滾筒R30,該第三部分S23係以沿著第四部分S24之第一面Sa之方式折返。同時,以例如在基板S例如從基板搬入口EN往基板搬出口EX移動之狀態下第三部分S23與第四部分S24往相反方向移動之方式,藉由滾筒R30將該第三部分S23折返。In the drum R30, the third portion S23 is folded back along the first surface Sa of the fourth portion S24. At the same time, for example, the third portion S23 is folded back by the roller R30 so that the third portion S23 and the fourth portion S24 move in opposite directions in a state where the substrate S moves from the substrate carry-in EN to the substrate carry-out EX.
由於從滾筒R26至滾筒R30以上述方式將基板S折返,因此基板S之中懸掛在滾筒R21~R27之部分與基板S之中懸掛在滾筒R29~R35之部分配置成在Z方向重疊。Since the substrate S is folded back from the drum R26 to the drum R30 in the above-described manner, the portion of the substrate S suspended from the rollers R21 to R27 and the portion of the substrate S suspended from the rollers R29 to R35 are arranged to overlap in the Z direction.
又,在滾筒R33,以基板S之第二面Sb彼此對向之方式將基板S折返。此外,將基板S之中藉由滾筒R33折返至該滾筒R33之下游側之部分記載為第一部分T21。又,將基板S之中藉由滾筒R33折返至與第一部分T21反方向之部分記載為第四部分T24。Further, in the drum R33, the substrate S is folded back so that the second surface Sb of the substrate S faces each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R33 by the roller R33 is referred to as a first portion T21. Further, a portion of the substrate S that is folded back by the roller R33 to the opposite direction to the first portion T21 is referred to as a fourth portion T24.
在滾筒R34,以第一部分T21之第一面Sa彼此對向之方式將該第一部分T21折返。此外,將基板S之中藉由滾筒R34折返至該滾筒R34之下游側之部分記載為第二部分T22。In the drum R34, the first portion T21 is folded back in such a manner that the first surface Sa of the first portion T21 opposes each other. Further, a portion of the substrate S that is folded back to the downstream side of the roller R34 by the roller R34 is referred to as a second portion T22.
在滾筒R35及滾筒R36,以該第二部分T22朝向滾筒R33之方式進行方向轉換。此外,將基板S之中藉由滾筒R35及滾筒R36方向轉換後之部分記載為第三部分T23。In the drum R35 and the drum R36, the direction is switched such that the second portion T22 faces the drum R33. Further, a portion of the substrate S that has been converted by the direction of the drum R35 and the drum R36 is referred to as a third portion T23.
在滾筒R37,該第三部分T23係以沿著第四部分T24之第一面Sa之方式折返。同時,以例如在基板S例如從基板搬入口EN往基板搬出口EX移動之狀態下第三部分T23與第四部分T24往相反方向移動之方式,藉由滾筒R37將該第三部分T23折返。In the drum R37, the third portion T23 is folded back along the first surface Sa of the fourth portion T24. At the same time, the third portion T23 is folded back by the roller R37 so that the third portion T23 and the fourth portion T24 move in opposite directions in a state where the substrate S moves from the substrate carry-in EN to the substrate carry-out EX, for example.
由於從滾筒R33至滾筒R37以上述方式將基板S折返,因此基板S之中懸掛在滾筒R29~R35之部分與基板S之中懸掛在滾筒R36~R42之部分配置成在Z方向重疊。Since the substrate S is folded back from the drum R33 to the drum R37 in the above-described manner, the portion of the substrate S suspended from the rollers R29 to R35 and the portion of the substrate S suspended from the rollers R36 to R42 are arranged to overlap in the Z direction.
本實施形態中,由於收容室RM之中從Z方向之端部側之滾筒列朝向中央部側之滾筒列滾筒之徑階段性變小,因此基板S之中在Z方向重疊之部分彼此不會接觸。In the present embodiment, since the diameter of the roller row from the end portion on the end side in the Z direction toward the center portion on the side of the storage chamber RM is small, the portions of the substrate S that overlap in the Z direction do not overlap each other. contact.
此外,徑小之滾筒之直徑之決定方法與上述第一實施形態之說明相同。Further, the method of determining the diameter of the roller having a small diameter is the same as that of the first embodiment described above.
如上述,根據本實施形態,由於基板S在波狀折返成在X方向重疊且配置成在Z方向成為三重之狀態下收容在收容室RM,因此可對收容室RM之有限空間高效率收容基板S。藉此,可獲得基板S之收容能力高之基板保管裝置STR2。As described above, according to the present embodiment, the substrate S is accommodated in the storage chamber RM in a state in which the substrate S is folded in the wavy direction and arranged in the Z direction, so that the substrate can be efficiently accommodated in the limited space of the storage chamber RM. S. Thereby, the substrate storage device STR2 having a high housing capacity of the substrate S can be obtained.
(第六實施形態)(Sixth embodiment)
接著,說明本發明之第六實施形態。Next, a sixth embodiment of the present invention will be described.
圖20係顯示本實施形態之基板保管裝置STR3之構成的圖。本實施形態中,基板搬入口EN與基板搬出口EX設在容器CT之中不同面之點與上述第五實施形態不同。又,伴隨於此,折返部RC之構成與第五實施形態不同。其他構成與第五實施形態相同。此外,本實施形態中,與上述實施形態相同使用XYZ正交座標系統進行說明。Fig. 20 is a view showing the configuration of the substrate storage device STR3 of the present embodiment. In the present embodiment, the substrate carrying-in EN and the substrate carrying-out EX are different from each other in the container CT, which is different from the fifth embodiment. Further, the configuration of the folded portion RC is different from that of the fifth embodiment. The other configuration is the same as that of the fifth embodiment. Further, in the present embodiment, the XYZ orthogonal coordinate system will be described in the same manner as the above embodiment.
如圖20所示,基板搬入口EN係設在容器CT之中-X側之壁部CTa。相對於此,基板搬出口EX係設在容器CT之中+X側之壁部CTb。如上述,基板搬入口EN與基板搬出口EX係設在容器CT之中X方向上之不同壁部。As shown in FIG. 20, the substrate carry-in EN is provided in the wall portion CTa on the -X side of the container CT. On the other hand, the substrate discharge port EX is provided in the wall portion CTb on the +X side of the container CT. As described above, the substrate carrying-in EN and the substrate carrying-out EX are provided in different wall portions in the X direction in the container CT.
滾筒R21~R42之配置與第五實施形態相同。是以,基板S之第一部分S21~第四部分S24、第一部分T21~第四部分T24之位置關係亦與第五實施形態相同。本實施形態中,未設置第五實施形態之滾筒R43及R44,因此可對應地縮小收容室RM之空間。The arrangement of the rollers R21 to R42 is the same as that of the fifth embodiment. Therefore, the positional relationship between the first portion S21 to the fourth portion S24 and the first portion T21 to the fourth portion T24 of the substrate S is also the same as that of the fifth embodiment. In the present embodiment, since the rollers R43 and R44 of the fifth embodiment are not provided, the space of the storage chamber RM can be correspondingly reduced.
又,由於基板S在滾筒R43無折返,因此能使從基板搬入口EN搬入之基板S之第一面Sa及第二面Sb之位置關係與從基板搬出口EX搬出之基板S之第一面Sa及第二面Sb之位置關係相同。具體而言,在基板搬入口EN及基板搬出口EX皆為基板S之第一面Sa朝向+Z側,第二面Sb朝向-Z側。Further, since the substrate S is not folded back in the drum R43, the positional relationship between the first surface Sa and the second surface Sb of the substrate S carried in from the substrate loading port EN and the first surface of the substrate S carried out from the substrate carrying-out port EX can be made. The positional relationship between Sa and the second side Sb is the same. Specifically, both the substrate carry-in EN and the substrate carry-out EX are the first surface Sa of the substrate S facing the +Z side, and the second surface Sb is facing the -Z side.
本發明之技術範圍並不限於上述實施形態,在不脫離本發明之趣旨之範圍內可施加適當變更。The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.
例如,上述第五實施形態與第六實施形態中,以基板S之中跨越收容室RM之Z方向中央部懸掛之部分與YZ平面平行之方式調整滾筒R21~R42之X方向之位置之構成為例進行說明,但並不限於此。For example, in the fifth embodiment and the sixth embodiment, the position of the rollers R21 to R42 in the X direction is adjusted such that the portion of the substrate S that hangs in the central portion in the Z direction of the storage chamber RM is parallel to the YZ plane. The examples are described, but are not limited thereto.
若為收容室RM之中從Z方向之端部側朝向中央部側,配置在X方向之滾筒R36,R38,R40,R42之徑、配置在X方向之滾筒R28,R30,R32,R34之徑、配置在X方向之滾筒R22,R24,R26之徑階段性變小,且從收容室RM之中央部側朝向地面側,配置在X方向之滾筒R37,R39,R41之徑、配置在X方向之滾筒R35,R33,R31,R29之徑、配置在X方向之滾筒R21,R23,R25,R27之徑階段性變大之構成,則例如圖21所示,為以基板S之中跨越收容室RM之Z方向中央部懸掛之部分相對於YZ平面傾斜之方式配置滾筒R21~R42之構成亦可。此情形,相較於上述第五實施形態與第六實施形態,滾筒之X方向之距離變小。因此,能使容器CT在X方向小型化。The diameter of the rollers R36, R38, R40, and R42 arranged in the X direction and the diameters of the rollers R28, R30, R32, and R34 disposed in the X direction are the end portions of the storage chamber RM from the end portion side toward the center portion side in the Z direction. The diameters of the rollers R22, R24, and R26 arranged in the X direction are gradually reduced, and the diameters of the rollers R37, R39, and R41 disposed in the X direction are arranged in the X direction from the center portion side of the storage chamber RM toward the ground side. The diameters of the rollers R35, R33, R31, and R29 and the diameters of the rollers R21, R23, R25, and R27 disposed in the X direction are gradually increased. For example, as shown in FIG. 21, the substrate S is placed across the storage chamber. It is also possible to arrange the rollers R21 to R42 so that the portion in which the center portion of the RM is suspended in the Z direction is inclined with respect to the YZ plane. In this case, compared with the fifth embodiment and the sixth embodiment, the distance of the drum in the X direction is small. Therefore, the container CT can be miniaturized in the X direction.
此外,圖21中,關於最小徑之滾筒R24,R37之直徑之限制如上述第一實施形態所說明。又,關於圖20中最小徑之複數個各滾筒之直徑之限制亦相同。Further, in Fig. 21, the limitation of the diameter of the rollers R24 and R37 of the minimum diameter is as described in the first embodiment. Further, the limits of the diameters of the plurality of rollers of the minimum diameter in Fig. 20 are also the same.
此外,圖21中,雖以滾筒R23,R33及R37與滾筒R24,R32及R38之間之基板S為代表來進行說明,但在其他部分亦可進行相同說明。又,第四實施形態中,由於從收容室RM之中Z方向之端部側之滾筒R36,R38,R40,R42之列朝向中央部側之滾筒R22,R24,R26之列滾筒之徑階段性變小,因此可進行相同說明。In FIG. 21, the substrate S between the rollers R23, R33, and R37 and the rollers R24, R32, and R38 is described as a representative, but the same portions may be similarly described. Further, in the fourth embodiment, the row of the rollers R36, R38, R40, and R42 from the end portion of the storage chamber RM in the Z direction faces the roller R22, R24, and R26 of the center portion side. It becomes smaller, so the same explanation can be made.
又,上述實施形態之各構成中,為將以從基板搬入口EN搬入基板S後使基板S懸掛在各滾筒R21~R42之方式導引該基板S之導引部適當設在收容室RM之構成亦可。藉此,可將基板S確實懸掛在各滾筒R21~R42。In each of the above-described embodiments, the guide portion for guiding the substrate S so as to carry the substrate S from the substrate loading port EN and then suspending the substrate S from the respective rollers R21 to R42 is appropriately provided in the storage chamber RM. It can also be constructed. Thereby, the substrate S can be surely suspended from the respective rollers R21 to R42.
又,作為上述實施形態之變形例,例如圖22所示之滾筒之配置亦可能。針對複數個滾筒之中在Z方向相鄰之3個滾筒R43,R28,R42、3個滾筒R27,R29,R41、3個滾筒R26,R30,R40、3個滾筒R25,R31,R39、3個滾筒R24,R32,R38、3個滾筒R23,R33,R37、3個滾筒R22,R34,R36分別將在Y方向延伸之軸Ra(圖18)之兩端藉由連結構件210(此連結構件210可在Z方向移動)連結。亦即,3個滾筒R43,R28,R42係安裝在連結構件210a,3個滾筒R27,R29,R41係安裝在連結構件210b,3個滾筒R26,R30,R40係安裝在連結構件210c,3個滾筒R25,R31,R39係安裝在連結構件210d,3個滾筒R24,R32,R38係安裝在連結構件210e,3個滾筒R23,R33,R37係安裝在連結構件210f,3個滾筒R22,R34,R36係安裝在連結構件210g。此外,以各3個滾筒之中2個在X方向並排且剩下一個滾筒在+Z側及-Z側交互露出之方式預先配置連結構件210a~210g。亦即,滾筒R42,R29,R40,R31,R38,R33,R36在X方向並排配置,滾筒R28,R27,R30,R25,R32,R23,R34在X方向並排配置。又,滾筒R41,R39,R37在+Z側露出,滾筒R43,R26,R24,R22在-Z側露出。在X方向並排之2列滾筒之中,在滾筒R28,R27,R30,R25,R32,R23,R34之列之+X側配置固定滾筒220A,在滾筒R42,R29,R40,R31,R38,R33,R36之列之-X側配置固定滾筒220B。Further, as a modification of the above embodiment, for example, the arrangement of the drum shown in Fig. 22 is also possible. For the three rollers R43, R28, R42, three rollers R27, R29, R41, three rollers R26, R30, R40, three rollers R25, R31, R39, 3 in the Z direction The rollers R24, R32, R38, the three rollers R23, R33, R37, and the three rollers R22, R34, and R36 respectively connect the ends of the shaft Ra (Fig. 18) extending in the Y direction by the joint member 210 (this joint member 210) Can be moved in the Z direction). That is, the three rollers R43, R28, and R42 are attached to the connecting member 210a, the three rollers R27, R29, and R41 are attached to the connecting member 210b, and the three rollers R26, R30, and R40 are attached to the connecting member 210c, and three. The rollers R25, R31, and R39 are attached to the connecting member 210d, and the three rollers R24, R32, and R38 are attached to the connecting member 210e, and the three rollers R23, R33, and R37 are attached to the connecting member 210f and the three rollers R22 and R34. The R36 is attached to the joint member 210g. Further, the connecting members 210a to 210g are disposed in advance so that two of the three rollers are arranged side by side in the X direction and the remaining one of the rollers is alternately exposed on the +Z side and the -Z side. That is, the rollers R42, R29, R40, R31, R38, R33, and R36 are arranged side by side in the X direction, and the rollers R28, R27, R30, R25, R32, R23, and R34 are arranged side by side in the X direction. Further, the rollers R41, R39, and R37 are exposed on the +Z side, and the rollers R43, R26, R24, and R22 are exposed on the -Z side. Among the two rows of rollers arranged side by side in the X direction, a fixed roller 220A is disposed on the +X side of the rollers R28, R27, R30, R25, R32, R23, and R34, and rollers R42, R29, R40, R31, R38, and R33 are disposed. A fixed roller 220B is disposed on the -X side of the R36.
在此狀態下,如圖22所示,首先從搬入滾筒Rn將基板S往+X方向直線狀搬送,以穿過滾筒R34與滾筒R22之間、滾筒R32與滾筒R24之間、滾筒R30與滾筒R26之間、滾筒R28與滾筒R43之間之方式到達+X側之固定滾筒220A,以該固定滾筒220A往-X方向折返。接著,以穿過滾筒R28與滾筒R42之間、滾筒R29與滾筒R27之間、滾筒R40與滾筒R30之間、滾筒R31與滾筒R25之間、滾筒R38與滾筒R32之間、滾筒R33與滾筒R32之間、滾筒R36與滾筒R34之間之方式到達-X側之固定滾筒220B,以該固定滾筒220B往+X方向折返。之後,以穿過滾筒R37與滾筒R33之間、滾筒R39與滾筒R31之間、滾筒R41與滾筒R29之間之方式到達搬出滾筒Rx。In this state, as shown in FIG. 22, the substrate S is first linearly transported from the loading roller Rn in the +X direction to pass between the drum R34 and the drum R22, between the drum R32 and the drum R24, and between the drum R30 and the drum. The fixed roller 220A on the +X side is reached between R26 and between the roller R28 and the roller R43, and is folded back in the -X direction by the fixed roller 220A. Next, to pass between the drum R28 and the drum R42, between the drum R29 and the drum R27, between the drum R40 and the drum R30, between the drum R31 and the drum R25, between the drum R38 and the drum R32, the drum R33 and the drum R32 Between the roller R36 and the roller R34, the fixed roller 220B on the -X side is reached, and the fixed roller 220B is folded back in the +X direction. Thereafter, the carry-out roller Rx is reached so as to pass between the drum R37 and the drum R33, between the drum R39 and the drum R31, and between the drum R41 and the drum R29.
接著,如圖23所示,使連結構件210a,210c,210e,210g往+Z側移動,使連結構件210b,210d,210f往-Z側移動。藉由此動作,成為在各滾筒懸掛有基板S之狀態。藉由此構成,能以短時間將基板S懸掛在各滾筒。Next, as shown in FIG. 23, the connection members 210a, 210c, 210e, and 210g are moved to the +Z side, and the connection members 210b, 210d, and 210f are moved to the -Z side. By this operation, the substrate S is suspended in each of the rollers. With this configuration, the substrate S can be suspended in each of the rollers in a short time.
又,上述實施形態中,關於各滾筒之構成,以具有軸部Ra及外周部Rb之構成、外周部Rb形成為圓筒狀之構成為例進行說明,但並不限於此。In the above-described embodiment, the configuration of each of the rollers is described as an example in which the configuration of the shaft portion Ra and the outer peripheral portion Rb and the outer peripheral portion Rb are formed in a cylindrical shape. However, the present invention is not limited thereto.
例如圖24A及圖24B所示,作為用以使片狀基板FB折返之折返部之滾筒R22,為具備具有軸部231及複數個凸緣部232之圓盤滾筒233之構成亦可。此情形,軸部231兼用為將複數個凸緣部232彼此加以連結之連結部。此外,圖24A及圖24B中,雖代表性顯示第五實施形態及第六實施形態之滾筒R22,R32及R36,但其他滾筒亦可為相同構成。又,即使是第四實施形態之滾筒亦可為相同構成。For example, as shown in FIG. 24A and FIG. 24B, the drum R22 which is a folded-back portion for folding the sheet-like substrate FB may be configured to include the disk drum 233 having the shaft portion 231 and the plurality of flange portions 232. In this case, the shaft portion 231 also serves as a connecting portion that connects the plurality of flange portions 232 to each other. In addition, in FIGS. 24A and 24B, the rollers R22, R32, and R36 of the fifth embodiment and the sixth embodiment are typically shown, but the other rollers may have the same configuration. Further, even the drum of the fourth embodiment can have the same configuration.
如圖24B所示,複數個凸緣部232係在Y方向相隔間隔並排配置。連結於軸部231之Y方向之中央部之凸緣部232彼此之間隔較連結於軸部231之Y方向之端部之凸緣部232彼此之間隔寬廣。又,連結於軸部231之Y方向之中央部之凸緣部232之Y方向之尺寸(厚度)大於連結於軸部231之Y方向之端部之凸緣部232之厚度。此構成僅為一例,例如凸緣部232彼此在Y方向以等間距配置亦可,凸緣部232之厚度形成為皆相同亦可。As shown in Fig. 24B, a plurality of flange portions 232 are arranged side by side at intervals in the Y direction. The flange portions 232 connected to the central portion of the shaft portion 231 in the Y direction are spaced apart from each other by a flange portion 232 that is connected to the end portion of the shaft portion 231 in the Y direction. Moreover, the dimension (thickness) of the flange portion 232 connected to the central portion of the shaft portion 231 in the Y direction is larger than the thickness of the flange portion 232 that is connected to the end portion of the shaft portion 231 in the Y direction. This configuration is only an example. For example, the flange portions 232 may be arranged at equal intervals in the Y direction, and the thickness of the flange portions 232 may be the same.
又,例如圖25及圖26所示,對折返部之徑變大之部位,將具有軸部231及複數個凸緣部232之2個圓盤滾筒233組合配置亦可。此構成中,如圖26所示,可為使2個圓盤滾筒233在Y方向錯開,使2個圓盤滾筒233之中一方具有之凸緣部232進入2個圓盤滾筒233之中另一方具有之凸緣部232之間之構成。此情形,藉由調整2個圓盤滾筒233之X方向之間隔,能將折返部之徑設定成所欲值。因此,可抑制Z方向之尺寸變大。Further, for example, as shown in FIG. 25 and FIG. 26, the two disc rollers 233 having the shaft portion 231 and the plurality of flange portions 232 may be arranged in combination in the portion where the diameter of the folded portion is increased. In this configuration, as shown in Fig. 26, the two disc cylinders 233 may be shifted in the Y direction, and the flange portion 232 of one of the two disc cylinders 233 may be inserted into the two disc cylinders 233. One of the flange portions 232 has a configuration. In this case, by adjusting the interval between the two disc rollers 233 in the X direction, the diameter of the folded portion can be set to a desired value. Therefore, it is possible to suppress the size of the Z direction from becoming large.
又,在片狀基板FB,可對具有不同徑之折返部之全部使用相同構成之圓盤滾筒233。再者,由於使軸部231彼此之間隔P較凸緣部232之徑狹窄亦可,因此設計之寬度變寬廣。Further, in the sheet substrate FB, the disc drum 233 having the same configuration can be used for all of the folded portions having different diameters. Further, since the distance P between the shaft portions 231 is narrower than the diameter of the flange portion 232, the width of the design is widened.
此外,圖25中,以圓盤滾筒233之組在Z方向相鄰3組之構成為例進行說明,但並不限於此,即使為例如圓盤滾筒233在Z方向相鄰2組之構成或相鄰4組以上之構成亦可進行相同之說明。此外,圖25所示之構成中,在Z方向相鄰之圓盤滾筒233之間隔雖相等,但為不同間隔亦可。In addition, in FIG. 25, the structure in which the group of the disk cylinders 233 is adjacent to the three groups in the Z direction is described as an example, but the present invention is not limited thereto, and for example, the disk drum 233 is formed in two groups adjacent to each other in the Z direction. The same description can be made for the configuration of four or more adjacent groups. Further, in the configuration shown in Fig. 25, the intervals of the disc cylinders 233 adjacent in the Z direction are equal, but may be different intervals.
此情形,凸緣部232之最小徑係設定在即使將片狀基板FB折返成U字狀亦不會塑性變形之範圍內。In this case, the minimum diameter of the flange portion 232 is set within a range that does not plastically deform even if the sheet substrate FB is folded back into a U shape.
此外,關於圖24A、圖24B、圖25及圖26所示之圓盤滾筒233,為軸部231與凸緣部232固定之構成亦可,為軸部231與凸緣部232可獨立旋轉之構成亦可。Further, the disc drum 233 shown in FIGS. 24A, 24B, 25, and 26 may be configured such that the shaft portion 231 and the flange portion 232 are fixed, and the shaft portion 231 and the flange portion 232 are independently rotatable. It can also be constructed.
又,如圖27及圖28所示,使用流體墊240作為空氣轉向輥之構成亦可。圖28係顯示圖27中沿著A-A剖面之構成的圖。圖27及圖28所示之構成中,在支承基板S之Y方向之兩端部之位置設有一對滾筒244。滾筒244具有形成為圓筒狀之外周面244a。一對滾筒244係透過軸242可旋轉地支承在側壁245。Further, as shown in FIGS. 27 and 28, the fluid pad 240 may be used as the air turning roller. Fig. 28 is a view showing the configuration of the cross section taken along line A-A in Fig. 27. In the configuration shown in Figs. 27 and 28, a pair of rollers 244 are provided at positions of both ends of the support substrate S in the Y direction. The drum 244 has a cylindrical outer surface 244a formed in a cylindrical shape. A pair of rollers 244 are rotatably supported by the side walls 245 through the transmission shaft 242.
在一對滾筒244之間設有複數個流體墊240。複數個流體墊240係例如在Y方向相隔間隔配置。流體墊240係透過軸承241支承在軸242。流體墊240具有形成為圓弧狀之墊面240a。墊面240a之徑係設定成與滾筒244之外周面244a之徑對應。墊面240a及外周面244a為位置關係固定之狀態。流體墊240係構成為藉由固定在側壁245之卡止銷246在軸242周圍幾乎不旋轉。A plurality of fluid pads 240 are disposed between the pair of rollers 244. The plurality of fluid pads 240 are disposed, for example, at intervals in the Y direction. The fluid pad 240 is supported by the shaft 242 through the bearing 241. The fluid pad 240 has a pad surface 240a formed in an arc shape. The diameter of the pad surface 240a is set to correspond to the diameter of the outer circumferential surface 244a of the drum 244. The pad surface 240a and the outer peripheral surface 244a are in a state in which the positional relationship is fixed. The fluid pad 240 is configured to hardly rotate around the shaft 242 by the locking pin 246 fixed to the side wall 245.
在流體墊240之墊面240a形成有槽部240b。槽部240b係透過設在流體墊240內部之流路247及連接於該流路247之管體249連接於氣體供應部248。氣體供應部248可供應壓榨氣體。來自氣體供應部248之氣體係經由流路247供應至槽部240b,往墊面240a上噴出。A groove portion 240b is formed in the pad surface 240a of the fluid pad 240. The groove portion 240b is connected to the gas supply portion 248 through a flow path 247 provided inside the fluid pad 240 and a pipe body 249 connected to the flow path 247. The gas supply portion 248 can supply a press gas. The gas system from the gas supply unit 248 is supplied to the groove portion 240b via the flow path 247, and is ejected onto the pad surface 240a.
圖27所示之構成中,基板S之Y方向之兩端部係摩擦接觸於滾筒244之外周面244a而支承。在此狀態下,若滾筒244旋轉,則滾筒244之旋轉透過外周面244a傳達至基板S,使基板S移動。若在基板S懸掛在滾筒244之狀態下從氣體供應部248供應氣體,則在基板S之被支承面與墊面240a之間形成流體層250。此外,規定上述流體墊240之墊面240a之徑與滾筒244之徑雖大致相同,但考慮流體層250之厚度(數μm~數十μm)使其稍微縮小亦可。In the configuration shown in Fig. 27, both end portions of the substrate S in the Y direction are frictionally contacted with the outer circumferential surface 244a of the drum 244 to be supported. In this state, when the drum 244 rotates, the rotation of the drum 244 is transmitted to the substrate S through the outer peripheral surface 244a, and the substrate S is moved. When the gas is supplied from the gas supply portion 248 while the substrate S is suspended from the drum 244, the fluid layer 250 is formed between the supported surface of the substrate S and the pad surface 240a. Further, although the diameter of the pad surface 240a of the fluid pad 240 is substantially the same as the diameter of the roller 244, the thickness of the fluid layer 250 (several μm to several tens of μm) may be slightly reduced.
藉由流體墊240形成之流體層250之周方向(軸242之旋轉方向)之長度係設定成與和基板S摩擦接觸之滾筒244之周方向之長度相同程度。圖27所示之例中,係設定成大致180度。The length of the circumferential direction of the fluid layer 250 (the direction of rotation of the shaft 242) formed by the fluid pad 240 is set to be the same as the length of the circumferential direction of the roller 244 that is in frictional contact with the substrate S. In the example shown in Fig. 27, it is set to be approximately 180 degrees.
此外,作為滾筒244,為在對基板S賦予所欲張力之狀態下使基板S移動時藉由與基板S之摩擦接觸而自由旋轉之從動滾筒之構成亦可,為在軸242連接有未圖示之馬達等驅動機構之驅動滾筒之構成亦可。In addition, the roller 244 may be configured to be freely rotatable by frictional contact with the substrate S when the substrate S is moved while applying the desired tension to the substrate S, and may be connected to the shaft 242. The drive roller of the drive mechanism such as the motor shown in the figure may be configured.
又,例如圖29所示,為在X方向配置複數個上述流體墊240及滾筒244之構成、調整片狀基板FB之折返部之徑之構成亦可。此種構成之情形,並非流體墊240之墊面240a之中周方向之全區域與基板S對向,而是如圖29所示在周方向僅特定四分之一之區域與基板S對向。因此,在墊面240a僅在該四分之一之區域預先形成槽部240b。藉此,可調整流體層250之周方向之範圍。Further, for example, as shown in FIG. 29, a configuration in which a plurality of the fluid pads 240 and the rollers 244 are disposed in the X direction and a diameter of the folded portion of the sheet substrate FB may be adjusted. In such a configuration, not the entire area in the circumferential direction of the pad surface 240a of the fluid pad 240 is opposed to the substrate S, but only a quarter of the area in the circumferential direction is opposite to the substrate S as shown in FIG. . Therefore, the groove portion 240b is formed in advance in the pad surface 240a only in the area of the quarter. Thereby, the range of the circumferential direction of the fluid layer 250 can be adjusted.
又,例如圖30所示,為使用空氣軸承機構260之構成亦可。此空氣軸承機構260具有一對導引構件261、保持該一對導引構件261之保持構件262、及對導引構件261供應空氣之空氣供應部263。Further, for example, as shown in FIG. 30, the air bearing mechanism 260 may be used. This air bearing mechanism 260 has a pair of guiding members 261, a holding member 262 that holds the pair of guiding members 261, and an air supply portion 263 that supplies air to the guiding members 261.
導引構件261係藉由例如陶瓷製之多孔質構件等形成。導引構件261之表面(導引面)261係形成為圓筒面之一部分(90°程度)。從導引面261a噴出例如來自空氣供應部263之空氣。保持構件262保持一對導引構件261。在保持構件262,導引面261a朝向+X側及-X側之一對導引構件261係以在X方向相隔間隔之狀態保持。The guiding member 261 is formed by, for example, a porous member made of ceramics or the like. The surface (guide surface) 261 of the guiding member 261 is formed as a part of the cylindrical surface (about 90 degrees). Air from the air supply portion 263 is ejected from the guide surface 261a, for example. The holding member 262 holds a pair of guiding members 261. In the holding member 262, the guiding surface 261a is held in a state in which the guiding members 261 are spaced apart from each other in the X direction toward the +X side and the -X side.
圖31係顯示在折返部使用上述空氣軸承機構260之構成。如圖31所示,雖在Z方向相鄰使用空氣軸承機構260,但就各折返部保持構件262之X方向之尺寸不同。具體而言,配置在最+Z側之空氣軸承機構260之保持構件262A之X方向之尺寸最大,相對於該保持構件262A,-Z側之保持構件262B、保持構件262C及保持構件262D依序在X方向之尺寸逐漸變小。Fig. 31 shows the configuration in which the air bearing mechanism 260 described above is used in the folded portion. As shown in FIG. 31, although the air bearing mechanism 260 is adjacently used in the Z direction, the size of each of the folded portion holding members 262 in the X direction is different. Specifically, the size of the holding member 262A of the air bearing mechanism 260 disposed on the most +Z side is the largest in the X direction, and the holding member 262B, the holding member 262C, and the holding member 262D are sequentially arranged with respect to the holding member 262A, the -Z side. The size in the X direction gradually becomes smaller.
如上述,藉由調整保持構件262之尺寸,能使折返部之徑變化。又,相較於使用滾筒之情形,由於Z方向之尺寸大致一半即足夠,因此可為小型之構成。因此,可在Z方向設置複數個折返部,亦可縮小容器之Z方向之尺寸。As described above, by adjusting the size of the holding member 262, the diameter of the folded portion can be changed. Further, compared with the case of using a roller, since the size of the Z direction is substantially half, it is sufficient, and therefore it can be a small structure. Therefore, a plurality of folded portions can be provided in the Z direction, and the size of the container in the Z direction can also be reduced.
又,上述實施形態中,作為折返部使用滾筒之情形,以在Y方向之滾筒之徑構成為一定之例進行說明,但並不限於此。例如圖32A所示,為徑隨著從外周部Rb之Y方向之端部到中央部變大之構成亦可。又,如圖32B所示,為徑隨著從外周部Rb之Y方向之端部到中央部變小之構成亦可。Further, in the above-described embodiment, the case where the roller is used as the folded portion is described as an example in which the diameter of the roller in the Y direction is constant, but the invention is not limited thereto. For example, as shown in FIG. 32A, the diameter may be increased from the end portion in the Y direction of the outer peripheral portion Rb to the central portion. Moreover, as shown in FIG. 32B, the diameter may be reduced from the end portion in the Y direction of the outer peripheral portion Rb to the central portion.
又,上述實施形態中,在作為折返部使用滾筒之構成,以收容室RM之中從Z方向之端部側之滾筒列朝向中央部側之滾筒列滾筒之徑階段性變小之構成為例進行說明,但並不限於此。例如圖33所示,為所有滾筒之徑相同之構成亦可。In the above-described embodiment, the configuration in which the roller is used as the folded-back portion is a configuration in which the diameter of the roller row roller on the end portion side in the Z direction toward the center portion side of the storage chamber RM is gradually reduced. The description is made, but it is not limited to this. For example, as shown in Fig. 33, the configuration may be the same for all the rollers.
此情形,使在Z方向相鄰之滾筒組彼此之X方向之間距L3大於上述實施形態之該間距即可。又,使在Z方向相鄰之滾筒組彼此在X方向相隔既定距離L4配置即可。如上述,即使為滾筒之徑皆相同之情形亦可適用本發明。In this case, the distance L3 between the X-directions of the adjacent roller groups in the Z direction may be larger than the pitch of the above embodiment. Further, the drum groups adjacent in the Z direction may be disposed at a predetermined distance L4 from each other in the X direction. As described above, the present invention can be applied even in the case where the diameters of the drums are the same.
CTR...基板匣CTR. . . Substrate
FB...片狀基板FB. . . Sheet substrate
SYS...基板處理系統SYS. . . Substrate processing system
PR...基板處理裝置PR. . . Substrate processing device
CONT...控制裝置CONT. . . Control device
CN...連接部CN. . . Connection
Fh...前端部Fh. . . Front end
1...收容部1. . . Containment department
2...搬入口2. . . Move in
3,3A,3B...搬出口3,3A,3B. . . Move out
4...導引部4. . . Guide
5...控制部5. . . Control department
S...基板S. . . Substrate
Sa...第一面Sa. . . First side
Sb...第二面Sb. . . Second side
S1,S21,T1,T21...第一部分S1, S21, T1, T21. . . first part
S2,S22,T2,T22...第二部分S2, S22, T2, T22. . . the second part
S3,S23,T3,T23...第三部分S3, S23, T3, T23. . . the third part
S4,S24,T4,T24...第四部分S4, S24, T4, T24. . . fourth part
CT...容器CT. . . container
CTa,CTb...壁面CTa, CTb. . . Wall
FL...地面FL. . . ground
RM...收容室RM. . . Containment room
EN...基板搬入口EN. . . Substrate transfer
EX...基板搬出口EX. . . Substrate outlet
Rn...搬入滾筒Rn. . . Moving into the drum
Rx...搬出滾筒Rx. . . Moving out of the drum
R1~R15,R21~R44,244...滾筒R1 ~ R15, R21 ~ R44, 244. . . roller
Ra...軸部Ra. . . Shaft
Rb...外周部Rb. . . Peripheral part
231...軸部231. . . Shaft
232...凸緣部232. . . Flange
233...圓盤滾筒233. . . Disc roller
240...流體墊240. . . Fluid pad
240a...墊面240a. . . Mat surface
240b...槽部240b. . . Groove
248...氣體供應部248. . . Gas supply department
250...流體層250. . . Fluid layer
260...空氣軸承機構260. . . Air bearing mechanism
261...導引構件261. . . Guide member
261a...導引面261a. . . Guide surface
262...保持構件262. . . Holding member
263...空氣供應部263. . . Air supply department
STR,STR2,STR3...基板保管裝置STR, STR2, STR3. . . Substrate storage device
圖1係顯示第一實施形態之基板匣之構成的圖。Fig. 1 is a view showing the configuration of a substrate 第一 of the first embodiment.
圖2係顯示本實施形態之基板匣之構成的圖。Fig. 2 is a view showing the configuration of the substrate 本 of the embodiment.
圖3係顯示本實施形態之基板匣之一部分之構成的圖。Fig. 3 is a view showing the configuration of a part of the substrate cassette of the embodiment.
圖4係顯示本實施形態之基板處理系統之構成的圖。Fig. 4 is a view showing the configuration of a substrate processing system of the embodiment.
圖5係顯示本實施形態之基板處理系統之一部分之動作的圖。Fig. 5 is a view showing the operation of a part of the substrate processing system of the embodiment.
圖6係顯示本實施形態之基板處理系統之一部分之動作的圖。Fig. 6 is a view showing the operation of a part of the substrate processing system of the embodiment.
圖7係顯示第二實施形態之基板匣之構成的圖。Fig. 7 is a view showing the configuration of a substrate 第二 of the second embodiment.
圖8係顯示本實施形態之基板匣之構成的圖。Fig. 8 is a view showing the configuration of the substrate 本 of the embodiment.
圖9A係顯示基板匣之另一構成的圖。Fig. 9A is a view showing another configuration of the substrate cassette.
圖9B係顯示基板匣之另一構成的圖。Fig. 9B is a view showing another configuration of the substrate cassette.
圖10係顯示基板匣之另一構成的圖。Fig. 10 is a view showing another configuration of the substrate cassette.
圖11A係顯示基板匣之另一構成的圖。Fig. 11A is a view showing another configuration of the substrate cassette.
圖11B係顯示基板匣之另一構成的圖。Fig. 11B is a view showing another configuration of the substrate cassette.
圖11C係顯示基板匣之另一構成的圖。Fig. 11C is a view showing another configuration of the substrate cassette.
圖11D係顯示基板匣之另一構成的圖。Fig. 11D is a view showing another configuration of the substrate cassette.
圖12A係顯示基板匣之另一構成的圖。Fig. 12A is a view showing another configuration of the substrate cassette.
圖12B係顯示基板匣之另一構成的圖。Fig. 12B is a view showing another configuration of the substrate cassette.
圖13A係顯示基板匣之另一構成的圖。Fig. 13A is a view showing another configuration of the substrate cassette.
圖13B係顯示基板匣之另一構成的圖。Fig. 13B is a view showing another configuration of the substrate cassette.
圖14係顯示基板匣之另一構成的圖。Fig. 14 is a view showing another configuration of the substrate cassette.
圖15係顯示基板處理系統之另一構成的圖。Fig. 15 is a view showing another configuration of the substrate processing system.
圖16係顯示基板匣之另一構成的圖。Fig. 16 is a view showing another configuration of the substrate cassette.
圖17係顯示第三實施形態之基板匣之一部分之構成的圖。Fig. 17 is a view showing the configuration of a part of the substrate cassette of the third embodiment.
圖18係顯示第四實施形態之基板保管裝置之構成的立體圖。Fig. 18 is a perspective view showing the configuration of a substrate storage device according to a fourth embodiment.
圖19係顯示第五實施形態之基板保管裝置之構成的剖面圖。Fig. 19 is a cross-sectional view showing the configuration of a substrate storage device according to a fifth embodiment.
圖20係顯示第六實施形態之基板保管裝置之構成的剖面圖。Fig. 20 is a cross-sectional view showing the configuration of a substrate storage device according to a sixth embodiment.
圖21係顯示基板保管裝置之另一構成的圖。Fig. 21 is a view showing another configuration of the substrate storage device.
圖22係顯示基板保管裝置之另一構成的圖。Fig. 22 is a view showing another configuration of the substrate storage device.
圖23係顯示基板保管裝置之另一構成的圖。Fig. 23 is a view showing another configuration of the substrate storage device.
圖24A係顯示基板保管裝置之另一構成的圖。Fig. 24A is a view showing another configuration of the substrate storage device.
圖24B係顯示基板保管裝置之另一構成的圖。Fig. 24B is a view showing another configuration of the substrate storage device.
圖25係顯示基板保管裝置之另一構成的圖。Fig. 25 is a view showing another configuration of the substrate storage device.
圖26係顯示基板保管裝置之另一構成的圖。Fig. 26 is a view showing another configuration of the substrate storage device.
圖27係顯示基板保管裝置之另一構成的圖。Fig. 27 is a view showing another configuration of the substrate storage device.
圖28係顯示基板保管裝置之另一構成的圖。Fig. 28 is a view showing another configuration of the substrate storage device.
圖29係顯示基板保管裝置之另一構成的圖。Fig. 29 is a view showing another configuration of the substrate storage device.
圖30係顯示基板保管裝置之另一構成的圖。Fig. 30 is a view showing another configuration of the substrate storage device.
圖31係顯示基板保管裝置之另一構成的圖。Fig. 31 is a view showing another configuration of the substrate storage device.
圖32A係顯示基板保管裝置之另一構成的圖。Fig. 32A is a view showing another configuration of the substrate storage device.
圖32B係顯示基板保管裝置之另一構成的圖。Fig. 32B is a view showing another configuration of the substrate storage device.
圖33係顯示基板保管裝置之另一構成的圖。Fig. 33 is a view showing another configuration of the substrate storage device.
CTR...基板匣CTR. . . Substrate
F...地面F. . . ground
1...收容部1. . . Containment department
2...搬入口2. . . Move in
3...搬出口3. . . Move out
4...導引部4. . . Guide
5...控制部5. . . Control department
6...被連接口6. . . Connected port
10...盒體10. . . Box
10a...壁面10a. . . Wall
11...凹部11. . . Concave
21,22...導引板21,22. . . Guide plate
23...搬入滾筒twenty three. . . Moving into the drum
31,32...導引板31,32. . . Guide plate
33...搬出滾筒33. . . Moving out of the drum
41...固定導引板41. . . Fixed guide
42...第一滾筒42. . . First roller
43...平行導引板43. . . Parallel guide
43a...內側導引板43a. . . Inner guide
43b...外側導引板43b. . . Outer guide
44...第二滾筒44. . . Second roller
45...可動導引板45. . . Movable guide
46...折返機構46. . . Reentry mechanism
47...第一移動滾筒47. . . First moving roller
48...第二移動滾筒48. . . Second moving roller
Claims (34)
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US32236010P | 2010-04-09 | 2010-04-09 | |
US42320710P | 2010-12-15 | 2010-12-15 |
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JP (1) | JP5838964B2 (en) |
KR (3) | KR101845682B1 (en) |
CN (1) | CN102834340B (en) |
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US9670720B2 (en) * | 2013-03-15 | 2017-06-06 | Comfortex Corporation | Method of transitioning preform stacks in a system for making window treatments |
JP6243526B2 (en) * | 2013-06-27 | 2017-12-06 | ピコサン オーワイPicosun Oy | Formation of substrate web tracks in atomic layer deposition reactors |
JP6409518B2 (en) * | 2014-11-14 | 2018-10-24 | 株式会社ニコン | Pattern forming device |
CN114721231B (en) * | 2022-04-17 | 2023-04-11 | 江苏晟驰微电子有限公司 | Tool clamp for cleaning photoetching plate |
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- 2011-04-11 KR KR1020177029222A patent/KR101845682B1/en active IP Right Grant
- 2011-04-11 KR KR1020127025862A patent/KR101788348B1/en active IP Right Grant
- 2011-04-11 JP JP2012509718A patent/JP5838964B2/en active Active
- 2011-04-11 TW TW100112411A patent/TWI574904B/en active
- 2011-04-11 CN CN201180018294.5A patent/CN102834340B/en active Active
- 2011-04-11 KR KR1020187008827A patent/KR101892424B1/en active IP Right Grant
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Also Published As
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CN102834340A (en) | 2012-12-19 |
KR101892424B1 (en) | 2018-08-27 |
KR20130037674A (en) | 2013-04-16 |
KR20180034708A (en) | 2018-04-04 |
CN102834340B (en) | 2015-09-16 |
KR101788348B1 (en) | 2017-10-19 |
JP5838964B2 (en) | 2016-01-06 |
HK1175154A1 (en) | 2013-06-28 |
WO2011126133A1 (en) | 2011-10-13 |
KR101845682B1 (en) | 2018-04-04 |
TW201210926A (en) | 2012-03-16 |
JPWO2011126133A1 (en) | 2013-07-11 |
KR20170118243A (en) | 2017-10-24 |
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