KR20140007382A - Substrate processing apparatus - Google Patents

Abstract

The substrate processing apparatus FPA has a supply roller 5b, a chamber CB, and a recovery roller 6b. The flexible board | substrate S which consists of a resin film and stainless steel foil is sent out from the supply roller 5b, passes through the chamber CB, and is wound up by the collection roller 6b. In the chamber CB, the liquid is applied to the substrate S by the transfer device 11. The feed roller 5b moves along the first rail 3 extending in the direction X orthogonal to the transfer direction Y of the substrate S. As shown in FIG. The recovery roller 6b moves along the second rail 4 in synchronism with the supply roller 5b. In response to these movements, the substrate S enters and exits the chamber CB. In the chamber CB of the other device FPA2, the substrate S is processed by the plasma device 12.

Description

Substrate Processing Equipment {SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a substrate processing apparatus.

This application claims priority based on US Provisional Application No. 61 / 446,197, filed February 24, 2011, the content of which is incorporated herein by reference.

As a display element constituting a display device such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. Currently, in these display elements, active elements (active devices) for forming thin film transistors (TFTs) on the substrate surface corresponding to each pixel are becoming mainstream.

In recent years, the technique of forming a display element on a sheet-like board | substrate (for example, a film member etc.) is proposed. As such a technique, for example, a method called a roll-to-roll system (hereinafter simply referred to as a "roll system") is known (for example, refer to Patent Document 1). In the roll method, a sheet-like substrate (for example, a strip-shaped film member) wound around the supply roller on the substrate supply side is fed out, and the transferred substrate is collected on the substrate recovery side. While winding in a furnace, the substrate is subjected to desired processing by a processing apparatus provided between the supplying roller and the collecting roller.

Then, the substrate is conveyed using a plurality of conveying rollers or the like, for example, from the time of sending out the substrate to the winding, and the gate electrode, the gate insulating film, which constitutes the TFT using the plurality of processing apparatuses (units), A semiconductor film, a source / drain electrode, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate. For example, when forming an organic EL element, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.

Patent Document 1: International Publication No. 2006/100868

However, in the above structure, since the dimension of the board | substrate which hangs from being sent out until it winds up becomes long, management of a board | substrate may become difficult.

The aspect which concerns on this invention aims at providing the substrate processing apparatus which can reduce the management burden of the board | substrate at the time of conveyance.

According to the aspect which concerns on this invention, the supply roller which sends out the board | substrate formed in strip shape and a flexible, the collection roller which winds up the board | substrate sent out from this supply roller, and it is sent out from a supply roller, and is wound up by the collection roller A chamber surrounding a portion of a substrate, a processing unit for processing a portion of the substrate contained in the chamber, and a substrate intersecting the feed roller from the supply roller to the recovery roller. There is provided a substrate processing apparatus having a supply roller and a recovery roller, and a driving unit for relatively moving the chamber and the processing unit so that a part of the substrate is carried in and out of the chamber in the direction.

According to the aspect which concerns on this invention, the management burden of the board | substrate at the time of conveyance can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the structure of the substrate processing apparatus which concerns on 1st Embodiment of this invention.
FIG. 2 is a diagram showing a configuration of a part of the substrate processing apparatus according to the present embodiment. FIG.
3 is a diagram illustrating a configuration of a part of the substrate processing apparatus according to the present embodiment.
4 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
5 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
6 is a view showing a state of operation of the substrate processing apparatus according to the present embodiment.
7 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
8 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
9 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
10 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
11 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
12 is a diagram showing an operation of the substrate processing apparatus according to the present embodiment.
13 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
14 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
Fig. 15 is a diagram showing the structure of a substrate processing apparatus according to a second embodiment of the present invention.
FIG. 16 is a diagram illustrating a configuration of a part of the substrate processing apparatus according to the present embodiment. FIG.
17 is a cross-sectional view showing a structure of a substrate processing apparatus according to a third embodiment of the present invention.
18 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
19 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
20 is a diagram showing an operation of the substrate processing apparatus according to the present embodiment.
21 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
22 is a diagram showing a state of operation of the substrate processing apparatus according to the present embodiment.
Fig. 23A is a diagram showing the structure of a substrate processing apparatus according to a fourth embodiment of the present invention.
Fig. 23B is a diagram showing the structure of a substrate processing apparatus according to a fourth embodiment of the present invention.
24 is a diagram showing another configuration of the substrate processing apparatus according to the present invention.
25 is a diagram showing another configuration of the substrate treating apparatus according to the present invention.
Fig. 26 is a diagram showing another configuration of the substrate processing apparatus according to the present invention.
27 is a diagram showing another configuration of the substrate treating apparatus according to the present invention.
28 is a diagram showing another configuration of the substrate treating apparatus according to the present invention.
29 is a diagram showing another configuration of the substrate treating apparatus according to the present invention.

[First Embodiment]

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described with reference to drawings.

1: is a perspective view which shows the whole structure of the substrate processing apparatus FPA which concerns on this embodiment. FIG.2 and FIG.3 is a perspective view which shows the state when it sees from the viewpoint different from FIG. 1 about the structure of one part of substrate processing apparatus FPA.

As shown in FIG. 1 to FIG. 3, the substrate processing apparatus FPA is formed in a band shape and carries a predetermined process with respect to the conveying unit 1 for conveying the substrate S having flexibility. It has the processing part 2 to perform, and the control part CONT which controls the conveyance part 1 and the processing part 2 collectively. The substrate processing apparatus FPA is provided on the base (pedestal) ST mounted on the bottom surface FL of a manufacturing plant, for example.

The substrate processing apparatus FPA is an apparatus of the roll-to-roll system (henceforth simply "roll system") which performs various processes on the surface of the board | substrate S which is formed in strip shape and is flexible. Substrate processing apparatus FPA is used when forming display elements (electronic devices), such as an organic EL element and a liquid crystal display element, on the board | substrate S, for example. Of course, you may use substrate processing apparatus FPA in the system which forms elements other than these elements (for example, a solar cell, a color filter, a touch panel, etc.).

Hereinafter, in describing the structure of the substrate processing apparatus FPA according to the present embodiment, the positional relationship of each member will be described while setting the XYZ rectangular coordinate system and referring to the XYZ rectangular coordinate system. In the following figures, the plane parallel to the floor surface FL is made into XY plane among XYZ rectangular coordinate systems. In the XY plane, the direction in which the substrate S moves is in the Y direction, and the direction orthogonal to the Y direction is in the X direction. Moreover, the direction perpendicular | vertical to the floor surface FL (XY plane) is made into the Z-axis direction.

As the substrate S to be processed in the substrate processing apparatus FPA, for example, foil (foil) such as a resin film or stainless steel can be used. For example, the resin film may be polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin. And materials such as polyethylene terephthalate, polyethylene naphtharate and stainless steel foil can be used.

The dimension of the short direction of the board | substrate S is formed about 50 cm-2 m, for example, and the dimension of the long direction (size of one roll) is 10 m or more, for example. Formed. Of course, this dimension is only an example and is not limited to this. For example, the dimension of the short direction of the board | substrate S may be 1 m or less or 50 cm or less, and may be 2 m or more. Moreover, the dimension of the elongate direction of the board | substrate S may be 10 m or less.

The board | substrate S has a thickness of 1 mm or less, for example, and is formed so that it may have flexibility. Here, flexible means the property which can bend this board | substrate without shearing or breaking even if it applies the predetermined force of about at least self-weight, for example. Also, for example, the property of bending by the predetermined force is included in the flexibility. The flexibility also varies depending on the material, size, thickness or environment of the substrate, humidity, and the like. In addition, as a board | substrate S, although you may use one strip | belt-shaped board | substrate, you may set it as the structure formed by connecting several unit board | substrates in strip shape.

It is preferable that the substrate S has a relatively small coefficient of thermal expansion such that its dimensions do not substantially change (so that the thermal deformation is small) even when the substrate S receives heat at a relatively high temperature (for example, about 200 ° C). For example, an inorganic filler can be mixed with a resin film and a thermal expansion coefficient can be made small. As an example of an inorganic filler, titanium oxide, zinc oxide, alumina, silicon oxide, etc. are mentioned.

The base ST has the base part STa, the leg part STb, and the support stand STc. The base part STa is mounted on the bottom surface FL. The leg part STb is provided in multiple numbers on the base part STa, and supports the support stand STc. The support stand STc is formed in rectangular shape, for example, and the opening part in which the process part 2 is mounted in the X direction, and the opening part STd of 2 provided so that the opening part may be provided are provided. That is, three opening parts STd are provided in the support stand STc along the X direction. In the three opening parts STd, guide rails 7r extending in parallel in the Y-axis direction are provided. The guide rails 7r are provided in parallel with each other in the X direction with respect to each opening part STd.

The conveying section 1 includes a first rail 3, a second rail 4, a substrate feeding mechanism 5, a substrate winding mechanism 6, a rail driving mechanism (rail driving portion) 7 and a roller driving portion 8. Have

The 1st rail 3 is arrange | positioned along the side of the + Y side of support stand STc. The first rail 3 is divided into three unit rails 3A to 3C. Each unit rail 3A-3C is arrange | positioned in the position corresponding to each of the three opening parts STd of the support stand STc. The dimension in the X direction of the unit rails 3A to 3C is a value corresponding to the dimension in the X direction of each opening STd.

The 2nd rail 4 is arrange | positioned along the side of the side of -Y of the support stand STc. The second rail 4 is divided into three unit rails 4A to 4C. Each unit rail 4A-4C is arrange | positioned in the position corresponding to each of the three opening parts STd of the support stand STc similarly to said unit rails 3A-3C. The dimension in the X direction of the unit rails 4A to 4C is a value corresponding to the dimension in the X direction of each opening STd, and is the same as the dimension in the X direction of the unit rails 3A to 3C. have.

The unit rails 3A-3C of the 1st rail 3 and the unit rails 4A-4C of the 2nd rail 4 are provided in each opening STd, and the guide rail 7r extended in the Y direction Each is supported by. In the structure shown in FIG. 1, unit rails 3A-3C are supported by the + Y side edge part of the guide rail 7r, and unit rails 4A-4C are supported by the -Y side edge part of the guide rail 7r. It is.

The unit rails 3A-3C of the 1st rail 3 and the unit rails 4A-4C of the 2nd rail 4 are each arrange | positioned in parallel to an X direction. In addition, since the guide rails 7r extend in parallel in the Y-axis direction, the unit rails 3A to 3C and the unit rails 4A to 4C are placed on the guide rails 7r while being in parallel with each other. It is provided so that the movement to a direction is possible. Thus, the 1st rail 3 and the 2nd rail 4 are comprised by the guide rail 7r so that the plane shape parallel to XY plane can be moved to linear form.

The substrate feeding mechanism 5 is disposed on the first rail 3. The board | substrate sending mechanism 5 has the roller support part 5a and the supply roller 5b. The roller support part 5a is connected on the 1st rail 3, and is provided so that the movement to a X direction along the 1st rail 3 is possible. The roller support part 5a is movable over the unit rails 3A-3C which comprise the 1st rail 3.

The feed roller 5b is rotatably supported by the roller support part 5a. The feed roller 5b is supported so that the direction of a rotating shaft may coincide in the direction parallel to a X direction. The board | substrate S is wound by the feed roller 5b in roll shape. As the feed roller 5b rotates, the substrate S wound around the feed roller 5b is sent out in the -Y direction. The feed roller 5b can be rotated by a motor or the like.

The substrate winding mechanism 6 is disposed on the second rail 4. The substrate winding mechanism 6 has a roller support portion 6a and a recovery roller 6b. The roller support part 6a is connected on the 2nd rail 4, and is provided so that the movement to a X direction along the 2nd rail 4 is possible. The roller support part 6a is movable over the unit rails 4A-4C which comprise the 2nd rail 4 among the roller drive parts 8.

The recovery roller 6b is rotatably supported by the roller support part 6a. The recovery roller 6b is supported so that the direction of the rotating shaft coincides in the direction parallel to the X direction. The board | substrate S is wound by roll collection roller 6b. As the collection roller 6b is rotated, the substrate S is wound around the collection roller 6b. The recovery roller 6b can be rotated by a motor or the like.

The rail drive mechanism 7 moves the first rail 3 and the second rail 4 in the Y direction along the guide rail 7r. The rail drive mechanism 7 can drive the first rail 3 for each of the unit rails 3A, 3C, and can drive the second rail 4 for each of the unit rails 4A, 4C. The control unit CONT can control the driving amount, the driving speed, the driving timing, and the like, by the rail driving mechanism 7. The rail drive mechanism 7 can approach the unit rails 3A and the unit rails 4A or separate from each other along the guide rails 7r. In addition, the rail drive mechanism 7 can access the unit rail 3C and the unit rail 4C from each other or separate from each other along the guide rail 7r.

The roller drive part 8 has the 1st drive part 83 and the 2nd drive part 84. As shown in FIG. The 1st drive part 83 moves the roller support part 5a to the X direction along the 1st rail 3, and rotates the feed roller 5b. The 2nd drive part 84 moves the roller support part 6a to the X direction along the 2nd rail 4, and rotates the collection roller 6b. The control part CONT can control the 1st drive part 83 and the 2nd drive part 84 individually or in synchronization. In addition, the controller CONT may control the driving amount, the driving speed, the driving timing, and the like in the first driving unit 83 and the second driving unit 84.

As shown in FIG. 3, the processing part 2 is to be processed from the substrate S on the movement path of the substrate S supplied from the substrate delivery mechanism 5 and conveyed to the substrate winding mechanism 6 (first 1 side) Sa is processed. The processing unit 2 has a chamber device (chamber) CB, a chamber driving device 25, a processing device 10, a guide device 30, and an alignment measuring device 50. In addition, in this embodiment, the printing apparatus is shown as the processing apparatus 10. As shown in FIG.

The chamber device CB is disposed between the first rail 3 and the second rail 4 (in this embodiment, between the unit rail 3B and the unit rail 4B). The chamber apparatus CB is a case which surrounds the part arrange | positioned between the feed roller 5b and the collection roller 6b among the board | substrates S. As shown in FIG. The chamber device CB includes a first portion CB1 provided on the surface Sa (to-be-processed surface) on the −Z side of the substrate S and a second surface Sb provided on the + Z side of the substrate S. It has a part CB2. In the chamber device CB, the first portion CB1 and the second portion CB2 are relatively detachably connected in the Z direction.

The chamber apparatus CB has passage parts 26 and 27 which let the board | substrate S pass. The passage part 26 is an opening part formed in the wall part at the side of + Y of the chamber apparatus CB. The passage part 26 is comprised from the recessed part 26a formed in the 1st part CB1, and the recessed part 26b formed in the 2nd part CB2. The passage part 27 is an opening part formed in the wall part at the side of -Y of the chamber apparatus CB. The passage part 27 is comprised from the recessed part 27a formed in the 1st part CB1, and the recessed part 27b formed in the 2nd part CB2. In a state where the first portion CB1 and the second portion CB2 are connected, the passages 26 and 27 are in an open state with respect to the chamber device CB. The board | substrate S sent out from the supply roller 5b is carried in to the chamber apparatus CB through the passage part 26, and is carried out from the chamber apparatus CB through the passage part 27. As shown in FIG.

The chamber drive device 25 has support columns (support portions) 25a and 25b, crosslinking members 25c and 25d, and elevating mechanisms 25e and 25f. The support column 25a is being fixed to the + Y side rather than the 1st rail 3 among the support stand (stage) STc of base ST. The support column 25b is being fixed to the -Y side rather than the 2nd rail 4 among the support stand (stage) STc of base ST.

The bridge member 25c is supported by the support column 25a. The crosslinking member 25c is fixed to the outer wall on the + Y side of the first portion CB1 of the chamber apparatus CB. 25d of bridge | crosslinking members are supported by the support column 25b. 25 d of bridge | crosslinking members are being fixed to the outer wall at the side of -Y of 1st part CB1 of chamber apparatus CB.

The lifting mechanism 25e is provided on the support column 25a and is connected to the bridge member 25c. The lifting mechanism 25e has an actuator (not shown) which moves the crosslinking member 25c in the Z direction along the support column 25a. The lifting mechanism 25f is provided on the support column 25b and connected to the crosslinking member 25d. The lifting mechanism 25f has an actuator (not shown) which moves the crosslinking member 25d in the Z direction along the supporting column 25b. As said actuator, a motor mechanism, an air cylinder mechanism, etc. are mentioned, for example.

In this way, the first portion CB1 is configured to be supported from the outside in the Y direction than the first rail 3 and the second rail 4. Moreover, the 1st part CB1 is comprised so that the lifting mechanism 25e and 25f may move together with the bridge | crosslinking members 25c and 25d along the support pillar 25a and 25b in the Z direction.

The processing apparatus 10 is accommodated in the 2nd part CB2, for example among chamber apparatuses CB. The processing apparatus 10 has various apparatuses for forming an organic EL element, for example with respect to the to-be-processed surface Sa of the board | substrate S. As shown in FIG. As such an apparatus, the partition forming apparatus for forming a partition on the to-be-processed surface Sa, the electrode forming apparatus for forming an electrode, the light emitting layer forming apparatus for forming a light emitting layer, etc. are mentioned, for example. More specifically, droplet applying apparatus (e.g. inkjet coating apparatus, etc.), film forming apparatus (e.g. evaporation apparatus, sputtering apparatus), exposure apparatus, developing apparatus, surface modification An apparatus, a washing | cleaning apparatus, a drying apparatus, etc. are mentioned. Each of these devices is suitably provided along the conveyance path | route of the board | substrate S. As shown in FIG. In this embodiment, the processing apparatus 10 is a transfer apparatus (for example, a gravure printing machine, a flexo printing machine, etc.) which transfers and forms a coating film on the to-be-processed surface Sa ( 11) have

The transfer apparatus 11 has a transfer roller 11a, the coating liquid storage part 11b, and the film thickness adjustment part 11c. A part of the transfer roller 11a is in a state where it is attached to the coating liquid 11d stored in the coating liquid storage part 11b. The transfer roller 11a is rotatably provided in this state. The transfer apparatus 11 has a rotation drive mechanism (for example, a motor mechanism) which is not shown in which the transfer roller 11a is rotated clockwise. The transfer device 11 is disposed on the + Y side of the space in the chamber device CB, for example, rather than the center in the Y direction. Moreover, the cover part 11e is provided in the wall part at the + X side of the transfer roller 11a among the 1st part CB1 of the chamber apparatus CB. This cover part 11e is formed in the dimension larger than the transfer roller 11a when seen from the X direction. For this reason, in the state which opened the cover part 11e, the transfer roller 11a can be made to go in and out to a 1st part CB1.

The guide apparatus 30 has the some guide roller GR which guides the board | substrate S in the process part 2, and the some guide pad GP. The some guide roller GR is provided along the conveyance path | route of the board | substrate S. As shown in FIG. Three guide rollers GR1 of the plurality of guide rollers GR function as pressure rollers for pushing the surface to be processed Sa of the substrate S to the transfer roller 11a. These three guide rollers GR1 are movable so that the positional relationship does not change by the guide member which is not shown in figure.

Moreover, three guide rollers GR2 of the some guide rollers GR guide the back surface Sb of the board | substrate S after the coating liquid was transferred. The plurality of guide pads GP (here, three) guide the target surface Sa of the substrate S after the coating liquid is transferred. Each of the plurality of guide pads GP has a plurality of ejection openings (not shown) for ejecting gas from the cylindrical guide surface GPa, and are configured to form a layer of gas on the guide surface GPa. . By this layer of gas, the guide surface GPa can be guided in a non-contact manner to the surface to be processed Sa of the substrate S. The guide roller GR2 and the guide pad GP are alternately arranged in the Y direction.

In addition, the guide rollers GR3 and GR4 are provided in the fixed position in the 2nd part CB2. Guide roller GR5 is arrange | positioned at the + Y side of 2nd part CB2, and is provided so that a movement to a Z direction is possible. Guide roller GR5 is comprised so that the board | substrate S may be pinched | interposed with guide roller GR3 by moving to -Z side.

The alignment measuring apparatus 50 measures the alignment mark provided in the edge part of the board | substrate S or the board | substrate S, and performs the alignment operation | movement with respect to the board | substrate S based on the measurement result. The alignment measuring device 50 is an alignment camera that detects an edge portion or an alignment mark of the substrate S, or an adjusting device that adjusts at least one of the position and attitude of the substrate S based on the detection result of the alignment camera. Have The position measurement and the speed measurement of the substrate S are performed in the same manner as the optical mouse, and the laser light is projected onto the substrate S, and the change of the speckle pattern generated on the substrate S is photoelectric. Detection can also be used.

Next, operation | movement of the substrate processing apparatus FPA comprised as mentioned above is demonstrated. 4-14 is a figure which shows operation | movement of the substrate processing apparatus FPA.

First, the case where the operation | movement which hangs the board | substrate S is performed between the supply roller 5b and the collection roller 6b among the conveyance parts 1 is demonstrated.

As shown in FIG. 4, the control part CONT arrange | positions the board | substrate sending mechanism 5 on the unit rail 3A of the 1st rail 3, and arrange | positions the board | substrate winding mechanism 6 to the 2nd rail 4 ) On the unit rail 4A. By this operation, the supply roller 5b and the recovery roller 6b are arranged in parallel so as to face each other in the Y direction.

Next, the board | substrate S wound by roll shape is attached to the supply roller 5b. Although the leader Lf is attached to the front-end | tip Sf of the board | substrate S, for example in the structure shown in FIG. 4, the structure which omitted this reader Lf may be sufficient. After attaching the roll-shaped board | substrate S to the supply roller 5b, the control part CONT moves the unit rail 4A of the 2nd rail 4 to + Y direction. By this operation, the supply roller 5b and the recovery roller 6b come close to each other.

The control part CONT rotates the supply roller 5b by the 1st drive part 83, when the distance of the supply roller 5b and the collection roller 6b becomes the 1st distance D1. By this operation, the front end Sf of the substrate S is sent out to the recovery roller 6b side, and the front end Sf of the substrate S reaches the recovery roller 6b and is wound around the recovery roller 6b. Lose. The operation of winding the tip Sf of the substrate S to the recovery roller 6b may be automated. However, the tip Sf is attached to the recovery roller 6b with a fixing tape or the like by a human hand. You may also

The control part CONT rotates the supply roller 5b after the front end Sf of the board | substrate S is caught by the collection | recovery roller 6b, and until the board | substrate winding mechanism 6 reaches the original position. Then, the unit rail 4A is moved in the -Y direction. By this operation, the tip Sf of the substrate S is pulled out in the -Y direction while being caught by the recovery roller 6b.

After the board | substrate winding mechanism 6 reaches the original position, the control part CONT stops the movement of this board | substrate winding mechanism 6. As shown in FIG. Subsequently, as shown in FIG. 5, the controller CONT moves the second portion CB2 of the chamber apparatus CB in the + Z direction, and the first portion CB1 and the second portion CB2 and the second portion CB2. The clearance gap through which the board | substrate S can pass is formed between. At this time, a moderate tension in the Y direction is given to the interposed substrate S between the supply roller 5b and the recovery roller 6b, and the substrate S is provided with the first portion CB1 and the second portion CB2. Allow to pass through the gap between. The tension of the substrate S can be adjusted by controlling the substrate winding mechanism 6.

In this state, the control part CONT synchronizes the board | substrate sending mechanism 5 and the board | substrate winding mechanism 6 with the 1st drive part 83 and 84, respectively, as shown in FIG. It moves to the phase and unit rail 4B. In this state, the board | substrate S is arrange | positioned in the position between the recessed part 26a and 27a of the 1st part CB1, and the recessed part 26b and 27b of the 2nd part CB2.

The control part CONT arrange | positions the board | substrate sending mechanism 5 and the board | substrate winding mechanism 6 on the unit rails 3B and 4B, respectively, and as shown in FIG. 7, the 2nd part CB2 is moved to -Z direction. Move to and connect the first portion CB1 and the second portion CB2. In this state, the first portion CB1 and the second portion CB2 are in contact with each other, and the gap between the first portion CB1 and the second portion CB2 is closed. The substrate S enters the inside of the chamber apparatus CB at the passage 26 and exits from the chamber apparatus CB at the passage 27.

After connecting the first portion CB1 and the second portion CB2, the controller CONT standbys the guide device 30 in the chamber device CB. Specifically, first, as shown in FIG. 8, the guide rollers GR1 and GR2 are disposed on the + Z side of the substrate S, and the guide pad GP is disposed on the −Z side of the substrate S. As shown in FIG. Shall be. As shown in FIG. 3, each of the board | substrate sending mechanism 5 and the board | substrate winding mechanism 6 is provided with elevator 5d, 6d which adjusts the height of the supply roller 5b and the collection roller 6b, and a board | substrate. The height is adjusted so that the board | substrate S which spreads from the sending mechanism 5 to the board | substrate winding mechanism 6 becomes substantially horizontal.

From this state, as shown in FIG. 9, guide roller GR1 is moved to -Z direction, the board | substrate S is pressed to the -Z side, and the to-be-processed surface Sa is made to contact the transfer roller 11a. The guide roller GR2 is moved in the -Z direction and the guide pad GP is moved in the + Z side. By this operation, the substrate S is folded and guided many times in the chamber apparatus CB in the Z direction on the -Y side than the central portion of the chamber apparatus CB. For this reason, it is conveyed in the state in which the board | substrate S overlapped in the Y direction.

The control unit CONT rotates the supply roller 5b and the recovery roller 6b in accordance with the timing of the processing of the transfer apparatus 11, and also rotates the transfer roller 11a. By this operation | movement, the board | substrate S is sent out from the supply roller 5b, and the board | substrate S is wound up by the collection | recovery roller 6b, and transfer of the coating film by the transfer apparatus 11 in this state. The treatment is performed on the target surface Sa of the substrate S. FIG.

As shown in FIG. 9, since supporting the to-be-processed surface Sa of the board | substrate S is the guide surface GPa of the guide pad GP, the board | substrate S can be conveyed in a non-contact state with respect to a coating film. . In addition, you may make it dry about the part guided by guide roller GR2 and guide pad GP among the board | substrates S, for example using a drying apparatus, such as a heating apparatus.

The control part CONT adjusts the moving speed of the board | substrate S moving from the supply roller 5b to the collection roller 6b according to the processing speed of the transfer apparatus 11. As shown in FIG. 10, 1st according to the winding diameter R1 of the board | substrate S wound around the feed roller 5b, and the winding diameter R2 of the board | substrate S wound around the collection roller 6b. The driving speeds of the driving unit 83 and the second driving unit 84 are adjusted. By this operation | movement, the board | substrate S with a constant conveyance speed is conveyed. The monitoring of the speed of the board | substrate S is also performed by the timing (time) which the alignment measuring apparatus 50 of FIG. 3 measures the alignment mark provided in the board | substrate S. FIG. Moreover, you may adjust elevator 5d, 6d by the change of the winding diameter R1 of the board | substrate S, and the winding diameter R2 of the board | substrate S. FIG.

The control part CONT may adjust the distance of the supply roller 5b and the collection roller 6b according to the processing position, the dimension, etc. of the transfer apparatus 11. In this case, the control unit CONT causes the rail driving mechanism 7 to move, for example, the unit rail 3B or the unit rail 4B in the Y direction. By the transfer apparatus 11, a part of the component of a display element is formed in order on the board | substrate S in order.

11 shows a state of the chamber apparatus CB in which the processing for the substrate S is completed. From this state, as shown in FIG. 12, the control part CONT moves the 2nd part CB2 of the chamber apparatus CB to the + Z side, and has the 1st part CB1 and the 2nd part CB2. The clearance gap through which the board | substrate S can pass is formed between them.

In this state, the control part CONT synchronizes the board | substrate sending mechanism 5 and the board | substrate winding mechanism 6 by the synchronous control of the 1st drive parts 83 and 84, respectively, as shown in FIG. Move onto (3C) and the unit rail (4C). By this operation, the substrate S is retracted from the position between the first portion CB1 and the second portion CB2 to the + X side. After the substrate feeding mechanism 5 and the substrate winding mechanism 6 are disposed on the unit rail 3C and the unit rail 4C, the movement of the substrate feeding mechanism 5 and the substrate winding mechanism 6 is stopped. .

After stopping the movement of the board | substrate sending mechanism 5 and the board | substrate winding mechanism 6, the control part CONT moves the unit rail 4C to + Y direction, rotating the collection | recovery roller 6b. By this operation, while the collection roller 6b winds up the board | substrate S, the supply roller 5b and the collection roller 6b come closer together.

After the distance between the supply roller 5b and the collection | recovery roller 6b becomes the 2nd distance D2, the control part CONT controls the supply roller 5b by the 2nd drive part 84, as shown in FIG. Rotate In this case, the second distance D2 can be, for example, the same distance as the first distance D1 described above. By this operation, the rear end Se of the board | substrate S is sent to the collection roller 6b side, and the rear end Se of the board | substrate S reaches the collection roller 6b, and is wound up by this collection roller 6b. Lose. In addition, although the reader Le is attached to the rear end Se of the board | substrate S, for example in the structure shown in FIG. 5, you may be the structure in which this reader Le was abbreviate | omitted.

The controller CONT moves the unit rail 4C in the -Y direction until the substrate winding mechanism 6 moves to the original position after the rear end Se of the substrate S is caught by the recovery roller 6b. Let's do it. After the board | substrate winding mechanism 6 returns to an original position, the roll-shaped board | substrate S wound around the collection roller 6b is moved to the next processing apparatus. Or when all the process is performed with respect to the board | substrate S, it removes and collect | recovers from this collection roller 6b.

As mentioned above, according to this embodiment, the board | substrate S is carried in the chamber apparatus CB in the direction which cross | intersects the moving direction of the board | substrate S toward the collection roller 6b from the supply roller 5b. And the feeding roller 5b, the collecting roller 6b, the chamber apparatus CB, and the transfer apparatus 11 are relatively moved so as to be carried out. The substrate S can be carried into the processing apparatus 10 while the dimensions are fixed, and the substrate S can be processed. Thereby, since it can suppress that the dimension of the board | substrate S which hangs until it is wound up after sending out becomes long, the management burden of the board | substrate S at the time of conveyance can be reduced.

[Second Embodiment]

Next, a second embodiment of the present invention will be described.

15 is a cross-sectional view showing the structure of a substrate processing apparatus FPA2 according to the present embodiment.

As shown in FIG. 15, in this embodiment, the pressure regulator (pressure adjustment part) 60, such as a pump, is connected to the chamber apparatus CB, and the pressure inside the chamber apparatus CB is adjusted (example For example, pressurized or depressurized). The chamber apparatus CB is provided with the plasma apparatus 12 which performs a process in pressure reduction environment, for example as a processing apparatus 10. Differential exhaust chambers 61 and 62 are provided on the + Y side of the chamber apparatus CB, and differential exhaust chambers 63 and 64 are provided on the -Y side of the chamber apparatus CB. Pumps are also connected to each of the differential exhaust chambers 61 to 64.

The differential exhaust chambers 61 to 64 are respectively provided with first portions 61a to 64a disposed on the -Z side of the substrate S and second portions 61b to 64b disposed on the + Z side of the substrate S, respectively. Have The first portions 61a to 64a of the differential exhaust chambers 61 to 64 are provided integrally with the first portion CB1 of the chamber apparatus CB (third portion CB3). The second portions 61b to 64b of the differential exhaust chambers 61 to 64 are provided integrally with the second portion CB2 of the chamber apparatus CB (fourth portion CB4). The third part CB3 and the fourth part CB4 are provided so as to be separated in the Z direction.

The sealing mechanism 65 is provided between the 3rd part CB3 and the 4th part CB4. The seal mechanism 65 is formed inside the differential exhaust chambers 61 to 64, inside the chamber apparatus CB, and the substrate S while the third portion CB3 and the fourth portion CB4 are connected to each other. It is a structure (air tight state) which can seal between them.

FIG. 16: is a figure which shows the structure of the sealing mechanism 65. FIG.

As shown in FIG. 16, the seal mechanism 65 is the 1st air pad mechanism 65A and the 2nd air pad mechanism 65B which hold | maintain the board | substrate S in the Z direction, and the 1st air pad mechanism 65A. ) Has a pressurizing mechanism 70 for pressurizing the side toward the second air pad mechanism 65B.

The first air pad mechanism 65A shows a pad 66 provided with an air jet port 66a and an air suction port 66b on a surface facing the -Z side, for example, for supplying air such as nitrogen gas. It has a supply side connection part 67 connected to the air supply part which is not shown, and the suction side connection part 68 connected to the suction pump etc. which are not shown in figure. The air blower outlet 66a is connected to the supply side connection part 67 via the flow path in the pad 66. The air suction port 66b is connected to the suction side connecting portion 68 through a flow path in the pad 66.

The second air pad mechanism 65B is not shown for supplying air such as nitrogen gas, for example, a pad 166 provided with an air jet port 166a and an air suction port 166b on a surface facing the + Z side. It has a supply side connection part 167 connected to the air supply part which is not shown, and the suction side connection part 168 connected to the suction pump etc. which are not shown in figure. The air blower outlet 166a is connected to the supply side connection part 167 through the flow path in the pad 166. The air suction port 166b is connected to the suction side connecting portion 168 via a flow path in the pad 166.

In this embodiment, when the pressure inside the chamber apparatus CB is adjusted by such a structure, since the differential exhaust chamber is provided, the pressure inside the chamber apparatus CB can be stabilized. In addition, since high sealing can be closed between the third portion CB3, the fourth portion CB4, and the substrate S, foreign matter is deposited in the chamber apparatus CB and the differential exhaust chambers 61 to 64. Entry can be prevented.

[Third embodiment]

Next, a third embodiment of the present invention will be described.

17 is a cross-sectional view showing the configuration of the substrate processing apparatus FPA3 according to the present embodiment.

As shown in FIG. 17, the storage chamber opening / closing mechanism SL is provided in each of the 1st part CB1 and the 2nd part CB2 of the chamber apparatus CB. The storage chamber opening / closing mechanism SL has a slide mechanism (opening and closing part) SL1 attached to the first part CB1 and a slide mechanism (opening and closing part) SL2 attached to the second part CB2.

The slide mechanism SL1 has a pair of slide members 71a and 71b. The slide members 71a and 71b are provided so that the movement to a X direction is possible. The slide members 71a and 71b are provided so that opening and closing of the storage chamber RM1 of the 1st part CB1 is possible. In the state where the slide members 71a and 71b are open, the storage chamber RM1 is open | released to the atmosphere. In the state where the slide members 71a and 71b are closed, the storage chamber RM1 is sealed.

In the state where the slide members 71a and 71b are open, the slide member 71a is accommodated in the slide receiving part (receiving part) 73a provided in the flange part 73 of the 1st part CB1, and the slide member 71b. ) Is accommodated in the slide receiving portion (accommodating portion) 74a provided in the flange portion 74 of the first portion CB1. Thus, the 1st part CB1 has the structure which the flange parts 73 and 74 used for connection with the 2nd part CB2 served as the accommodating part of the slide members 71a and 71b.

The slide mechanism SL2 has a pair of slide members 72a and 72b. The slide members 71a and 71b are provided so that the movement to a X direction is possible. The slide members 72a and 72b are provided so that opening and closing of the storage chamber RM2 of 2nd part CB2 is possible. In the state in which the slide members 72a and 72b are open, the storage chamber RM2 is open | released to the atmosphere, but the slide members 72a and 72b function in order to maintain the decompression state of the storage chamber RM2. In the state where the slide members 72a and 72b are closed, the storage chamber RM2 is sealed.

In the state where the slide members 72a and 72b are open, the slide member 72a is accommodated in the slide accommodation part (receiving part) 75a provided in the flange part 75 of the 2nd part CB2, and the slide member 72b ) Is accommodated in the slide receiving portion (accommodating portion) 76a provided in the flange portion 76 of the second portion CB2. As described above, the second portion CB2 is configured such that the flange portions 75 and 76 used for the connection with the first portion CB1 serve as the accommodation portions of the slide members 72a and 72b.

The connection mechanism 77 is provided in the 1st part CB1. The connection mechanism 77 has a vacuum packing 77a and an air seal mechanism 77b. The connection mechanism 78 is provided in 2nd-part CB2. The connection mechanism 78 has a vacuum packing 78a and an air seal mechanism 78b. The first portion CB1 and the second portion CB2 are configured to be connected in a sealed state by the connecting mechanisms 77 and 78.

In addition, the lifting mechanism 79 is connected to the first portion CB1, and the lifting mechanism 80 is connected to the second portion CB2. By this structure, the 1st part CB1 and the 2nd part CB2 can be lifted up and down individually in a Z direction. Although not shown in FIG. 17, differential exhaust chambers 85 and 86 (see FIG. 18 and the like) are integrally mounted on the + Y side and the -Y side of the chamber device CB, respectively.

In addition, the substrate processing apparatus FPA3 is a processing apparatus 10 that uses the first processing apparatus 13 accommodated in the first portion CB1 and the second processing apparatus 14 accommodated in the second portion CB2. Have. In addition, the structure which omitted one of the 1st processing apparatus 13 and the 2nd processing apparatus 14 may be sufficient. Pressure regulators 81 and 82, such as a vacuum pump, are respectively connected to the 1st part CB1 and the 2nd part CB2. As the 1st processing apparatus 13 and the 2nd processing apparatus 14, the plasma apparatus etc. which process in a reduced pressure environment, etc. are provided, for example.

Next, operation | movement of the substrate processing apparatus FPA3 comprised as mentioned above is demonstrated. In this embodiment, the operation | movement at the time of replacing | exchanging the board | substrate S from the state which the process completed with respect to the board | substrate S is demonstrated as an example.

18 shows a state of the chamber apparatus CB in which the processing for the substrate S is completed. In the state where the process with respect to the board | substrate S is completed, the inside of chamber apparatus CB is a pressure reduction state. In the case where the first portion CB1 and the second portion CB2 are separated in this state, it is necessary to return the inside of the chamber device CB to atmospheric pressure. When the process is performed on the next substrate S, it is necessary to bring the inside of the chamber apparatus CB to a reduced pressure again, so that it takes time.

Therefore, in this embodiment, as shown in FIG. 19, the control part CONT first makes the slide member 72a and 72b provided in the 2nd part CB2 closed. By this operation, the storage chamber RM2 (see FIG. 17) of the second part CB2 is sealed, and the decompression state of the storage chamber RM2 is maintained.

After closing the slide members 72a and 72b or at the same time as the closing operation of the slide members 72a and 72b, the control part CONT, as shown in FIG. 20, the slide member 71a provided in the 1st part CB1. And 71b) in a closed state. By this operation, the storage chamber RM1 (see FIG. 17) of the first portion CB1 is also sealed, and the decompression state of the storage chamber RM1 is maintained. At this point in time, the space between the slide members 71a and 71b and the slide members 72a and 72b is in a reduced pressure state, so that the air pressure gauge that returns only this space to atmospheric pressure is operated.

In this state, the control part CONT returns the pressure of the differential exhaust chambers 85 and 86 to atmospheric pressure, and then moves the 1st part CB1 to -Z side as shown in FIG. 21, and this 1st part (CB1) and the second part (CB2) are separated. By this operation, the space between the slide members 71a and 71b and the slide members 72a and 72b is opened to the air, and the storage chamber RM1 of the first part CB1 or the storage chamber of the second part CB2 is opened. RM2 is not open to the atmosphere.

After separating 1st-part CB1 and 2nd-part CB2, as shown in FIG. 22, the control part CONT is a board | substrate delivery mechanism which waits in the -X side of chamber apparatus CB. (5) and the board | substrate winding mechanism 6 are moved to + X direction, and the new board | substrate S is arrange | positioned between 1st-part CB1 and 2nd-part CB2. Thereafter, the control unit CONT moves the first portion CB1 to the + Z side to connect the first portion CB1 and the second portion CB2.

After connecting the first portion CB1 and the second portion CB2, the controller CONT exhausts the remaining air in a narrow space between the slide members 71a and 71b and the slide members 72a and 72b. When the air pressure gauge is activated and the narrow space is in the same decompression state as in the storage chamber RM1 of the first portion CB1 or in the storage chamber RM2 of the second portion CB2, the slide members 71a and 71b. ) And the slide members 72a and 72b are opened.

In the substrate feeding mechanism 5 of FIGS. 18 to 22, the substrate S is taken out from the lower side of the roll, and the surface opposite to the processing surface of the substrate S in FIG. 17 is processed.

In this embodiment, although the separation | separation and connection of 1st part CB1 and 2nd part CB2 are performed by the movement of only 1st part CB1, only by the movement of only 2nd part CB2, or 1st You may perform by the movement of the part CB1 and the 2nd part CB2.

As mentioned above, according to this embodiment, a new board | substrate S can be carried in, maintaining the reduced pressure state of storage chamber RM1 and RM2, and a process can be started with respect to this board | substrate S. FIG. As a result, a substrate processing apparatus FPA3 having a high throughput can be obtained.

[Fourth Embodiment]

Next, a fourth embodiment of the present invention will be described.

FIG. 23: A is a figure which shows the structure of the differential exhaust apparatus (differential exhaust chamber) 100 which concerns on this embodiment.

As shown in Fig. 23A, in the present embodiment, the differential exhaust device 100 is arranged alone, but the differential exhaust device 100 is assembled as the differential exhaust chambers 85 and 86 shown in Figs. It can be. This differential exhaust device 100 is configured to be separated into a first portion 101 and a second portion 102. The differential exhaust device 100 is formed to be rectangular in the Z direction.

The first portion 101 is provided with a partition portion 101C that divides the interior of the first portion 101 into two storage chambers 101A and 101B. The first portion 101 is provided with opening and closing members 105 and 106 for individually opening and closing the storage chamber 101A and the storage chamber 101B, respectively. In the state where the opening / closing members 105 and 106 are closed, the storage chambers 101A and 101B are in a closed state.

The 2nd part 102 is provided with the partition part 102C which divides the inside of this 2nd part 102 into two storage chambers 102A and 102B. Moreover, the opening-closing members 107 and 108 which respectively open and close the storage chamber 102A and the storage chamber 102B are provided in the 2nd part 102, respectively. In the state where the opening-closing members 107 and 108 are closed, the storage chambers 102A and 102B will be in the closed state. The second portion 102 is formed to have a larger dimension in the Z direction than the first portion 101.

In the differential exhaust device 100, the volumes of the storage chambers 102A and 102B are larger than the volumes of the storage chambers 101A and 101B. For example, it is good also as a structure which arrange | positions the injection port of the air which dries the board | substrate S in the storage chambers 102A and 102B. Moreover, the structure provided with the pressure adjusting mechanism which adjusts the pressure of the storage chambers 102A and 102B, the atmosphere adjusting mechanism which adjusts the atmosphere of the storage chambers 102A and 102B, etc. may be provided.

In the storage chambers 101A and 101B, rollers (or guide pads GP as shown in FIG. 3) that guide the substrate S, respectively, are provided with 103 and 104. The rollers 103 and 104 are provided to be movable in the Z direction so as to span between the storage chambers 102A and 102B of the second portion 102.

A sealing mechanism 109 is provided between the first portion 101 and the second portion 102. Similar to the structure shown in FIG. 16 above, the seal mechanism 109 is provided on the first pad 109a provided at the −Z side cross section of the first portion 101 and the + Z side cross section of the second portion 102. It has the 2nd pad 109b provided. The first pad 109a and the second pad 109b are provided at positions sandwiching the substrate S. As shown in FIG. Like the previous FIG. 16, the 1st pad 109a and the 2nd pad 109b have the gas layer forming part which is not shown in which the layer of gas is formed in the surface.

In the case of using the differential exhaust device 100 configured as described above, as shown in FIG. 23B, the first portion 101 and the second portion 102 are connected to each other with the substrate S interposed therebetween, as shown in FIG. 17. The opening / closing members 105 to 108 which function in the same manner as the slide members 71a, 71b, 72a and 72b are opened. Thereafter, the rollers 103 and 104 are moved to the -Z side. By this operation, the substrate S is sandwiched between the base layer of the first pad 109a and the base layer of the second pad 109b, and is kept in a non-contact state.

Thus, according to this embodiment, the installation area of the differential exhaust apparatus 100 can be made small by forming the differential exhaust apparatus 100 in a rectangle in a Z direction. In this case, the differential exhaust device 100 can be separated into the first portion 101 and the second portion 102 while maintaining the pressure or atmosphere of the large storage chambers 102A and 102B having a large volume, and the substrate S The time taken to omit or reset the pressure and the atmosphere in the differential exhaust device 100 at the time of carrying in) can be reduced. For this reason, the board | substrate S can be processed efficiently.

The technical scope of this invention is not limited to the said embodiment, A change can be suitably added in the range which does not deviate from the meaning of this invention.

For example, in the 1st Embodiment shown to FIG. 8, FIG. 9, although the structure which the guide rollers GR1, GR2, GR5, and the guide pad GP move along Z direction was demonstrated as an example, it limited to this. Instead, modifications as shown in FIG. 24 are possible.

As shown in FIG. 24, it is set as the structure which moves the guide rollers GR1, GR2, GR5, and the guide pad GP to the inclination position in (theta) X direction. When these guide rollers GR1, GR2 and GR5 and the guide pad GP are moved, as shown in FIG. 25, the space can be saved in the Z direction as compared with the configuration in the first embodiment.

In addition, the positional relationship of the three guide rollers GR1 which presses the board | substrate S to the transfer roller 11a is made the same as the positional relationship of the guide roller GR1 in 1st Embodiment. For this reason, the conditions at the time of transferring a coating film to the board | substrate S by the transfer roller 11a become the same as the conditions in 1st Embodiment.

Moreover, as shown in FIG. 26, the structure which each bearing of three guide rollers GR1 fixed by the fixing member 200 may be sufficient. In this case, as shown in FIG. 27, the substrate S is brought into contact with an arbitrary position of the transfer roller 11a by adjusting the angular position of the fixing member 200 to the rotational axis rotation of the transfer roller 11a. Can be. For this reason, the board | substrate S can be contacted in the near position by the film thickness adjustment part 11c according to the kind of coating liquid, for example. Thereby, it can transfer to the board | substrate S, while the coating liquid adhering to the transfer roller 11a does not dry.

For example, as shown in FIG. 28, in the structure which arrange | positions the optical sensor 300 which detects the board | substrate S in at least one of the passage part 26 and the passage part 27 of the chamber apparatus CB. It does not matter.

For example, as shown in FIG. 28, the structure provided with the drying part 305 which has the injection part 303 which injects dry gas to a X direction in chamber apparatus CB may be provided. In this case, you may provide the drying part 305 with the airflow adjustment plate (airflow adjustment part) 301 which regulates the flow of the drying gas from the injection part 303 to the transfer roller 11a side.

Moreover, you may provide the wrinkle part 302 which expands and contracts with the movement of guide roller GR2 between guide roller GR2 and the wall part (ceiling part) of the + Z side of 2nd part CB2. This wrinkle part 302 may also be provided between the guide pad GP and the wall part (bottom part) of the -Z side of the 1st part CB1. With such a structure, in the state where the board | substrate S was caught by the guide roller GR2 and the guide pad GP, the wrinkle extended by the position along the path | route of the board | substrate S is arrange | positioned. For this reason, the airflow in a Y direction is regulated by this wrinkle part 302. FIG. In this way, by arranging the airflow adjusting plate 301 and the pleats 302, the flow path and the airflow of the drying gas can be adjusted.

Moreover, as shown in FIG. 29, the structure in which the subchamber apparatus (preliminary process part) SCB is arrange | positioned with respect to the chamber apparatus CB to the side of the movement direction (Y direction) of the board | substrate S may be sufficient. The subchamber apparatus SCB has the same structure as the chamber apparatus CB. Moreover, the same component as the component (including the processing apparatus 10) accommodated in the chamber apparatus CB is accommodated in the subchamber apparatus SCB. For this reason, even when the chamber apparatus CB is stopped, the same processing as that in the chamber apparatus CB can be performed with respect to the subchamber apparatus SCB. In this case, in general, the substrate S processed by the chamber apparatus CB, and the substrate S which has been processed, exits the sub-chamber apparatus SCB and exits in the + X direction, but the chamber apparatus CB is stopped and ink filling is performed. At that time, the substrate S exits the chamber apparatus CB and is replaced to be processed in the subchamber apparatus SCB.

FPA… Substrate processing apparatus S... Board
CONT ... Control unit CB. Chamber device
GR… Guide roller GP… Guide pad
One … Conveying section 2. Processing
5b... Feed roller 6b. Recovery Roller
10 ... Processor 25. Chamber Drive

Claims (27)

A feed roller for feeding a substrate having a belt shape and flexibility,
A recovery roller for winding the substrate sent out from the supply roller;
A chamber which is sent out from the supply roller and surrounds a part of the substrate while being wound in the recovery roller;
A processing unit accommodated in the chamber and performing processing on a part of the substrate surrounded by the chamber;
The feed roller, the recovery roller, the chamber, and the processing unit may be disposed so that a part of the substrate is carried in and out of the chamber in a direction crossing the feed direction of the substrate from the supply roller toward the recovery roller. Substrate processing apparatus having a drive unit for moving to. The method according to claim 1,
And the chamber is detachably provided into a first portion disposed on the first surface side of the substrate and a second portion disposed on the second surface side of the substrate. The method according to claim 2,
Further provided with a stage for supporting the feed roller and the recovery roller,
And the first portion is supported by the stage. The method according to claim 3,
The stage has a support for supporting the first portion,
The support part is provided with a pair of said support part in the position which sandwiches the said supply roller and the said collection roller in the moving direction of the said board | substrate. The method according to any one of claims 2 to 4,
And a second driving part which relatively moves the first part and the second part in a direction in which the first part and the second part are separated from each other,
And the second driving portion makes relative movement between the first portion and the second portion synchronized with the carrying in or taking out of the substrate. 6. The method according to any one of claims 2 to 5,
At least one of the said 1st part and the said 2nd part has an opening-and-closing part which opens and closes an internal space. The method of claim 6,
And a pressure adjusting unit for individually adjusting the pressure of the inner space of the first portion and the pressure of the inner space of the second portion. The method according to claim 6 or 7,
The first portion and the second portion each have a flange portion mountable to each other,
The opening and closing portion has a movable slide member,
And the flange portion has a receiving portion for receiving the slide member. The method according to any one of claims 1 to 8,
And the chamber has a passage portion through which the substrate passes through wall portions at both ends in a moving direction of the substrate. The method of claim 9,
The substrate processing apparatus provided in the said passage part and further equipped with the optical sensor which detects the said board | substrate. The method according to any one of claims 1 to 10,
And said processing portion has a transfer roller for transferring a coating liquid to said substrate. The method of claim 11,
The processing unit has three pressure rollers for pressing the substrate onto the transfer roller. The method of claim 12,
The three press rollers are substrate processing apparatus is fixed to each other position. 14. The method according to claim 12 or 13,
And the three pressing rollers are movable to press the substrate at another position among the transfer rollers. The method according to any one of claims 11 to 14,
And a drying unit for drying the coating liquid transferred to the substrate. 16. The method of claim 15,
And the drying unit has a spraying unit for spraying dry gas onto the substrate from a direction crossing the moving direction of the substrate. 18. The method of claim 16,
And the drying unit has an airflow adjusting unit for adjusting the air flow of the drying gas between the injection unit and the transfer roller. 18. The method of claim 17,
It is further provided with a plurality of guide rollers disposed on the first surface side and the second surface side of the substrate, the substrate is caught,
And the airflow adjusting portion has a corrugation portion provided over a plurality of the guide rollers. The method according to any one of claims 1 to 18,
And a plurality of guide rollers disposed on the first and second surface sides of the substrate, respectively, to hold the substrate. The method of claim 19,
A plurality of the guide rollers are arranged alternately on the first surface side of the substrate and the second surface side of the substrate with respect to the moving direction of the substrate. The method according to any one of claims 1 to 20,
And a lid portion for entering and exiting the processing portion is provided in a wall portion of the chamber disposed on a side of the substrate in a moving direction. The method according to any one of claims 1 to 21,
And a preliminary processing section disposed on the side of the chamber in a moving direction of the substrate, and configured to perform the same processing on the substrate as the processing section. 23. The method of claim 22,
And the driving part can move the supply roller and the recovery roller between the processing part and the preliminary processing part. The method according to any one of claims 1 to 23,
A first rail supporting the feed roller so that the feed roller is movable in a direction crossing the moving direction of the substrate;
A second rail supporting the recovery roller such that the recovery roller is movable in a direction crossing the moving direction of the substrate;
And a rail driver configured to drive at least one of the first rail and the second rail. The method according to any one of claims 1 to 24,
A pressure adjusting unit for adjusting a pressure inside the chamber;
And a differential exhaust chamber disposed on at least one of an upstream side and a downstream side of the moving direction of the substrate with respect to the chamber. 26. The method of claim 25,
The chamber and the differential exhaust chamber are detachably provided in a third portion disposed on the first surface side of the substrate and a fourth portion disposed on the second surface side of the substrate,
The third portion and the fourth portion are each provided integrally,
And a seal mechanism for forming a layer of gas between the third portion and the fourth portion, which closes the gap between the third portion and the fourth portion. 26. The method of claim 25,
Substrate processing apparatus further comprising a guide roller.

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