JP6390771B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus.
This application claims priority based on US Provisional Application No. 61 / 446,197 filed on Feb. 24, 2011, the contents of which are incorporated herein by reference.

  As display elements that constitute display devices such as display devices, for example, liquid crystal display elements and organic electroluminescence (organic EL) elements are known. Currently, in these display elements, active elements (active devices) that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.

  In recent years, a technique for forming a display element on a sheet-like substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1). In the roll method, one sheet-like substrate (for example, a belt-like film member) wound around a substrate supply side supply roller is sent out, and the fed substrate is wound around the substrate collection side recovery roller, The substrate is subjected to desired processing by a processing apparatus installed between the supply roller and the collection roller.

  Then, during the period from when the substrate is sent out to when it is wound up, for example, the substrate is transported using a plurality of transport rollers, etc., and the gate electrode and gate insulating film constituting the TFT using a plurality of processing devices (units) Then, a semiconductor film, source / drain electrodes, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.

Japan International Publication No. 2006/100868

  However, in the above-described configuration, since the dimension of the substrate to be stretched from when it is sent out until it is wound up becomes long, it may be difficult to manage the substrate.

  The aspect which concerns on this invention aims at providing the substrate processing apparatus which can reduce the management burden of the board | substrate at the time of conveyance.

  According to the aspect of the present invention, a long sheet-like substrate having flexibility is transported in the longitudinal direction into a chamber apparatus that accommodates a processing apparatus that operates in a reduced pressure environment, and the substrate is processed. A substrate processing apparatus, wherein the chamber apparatus is disposed on one surface side of the substrate and is disposed on the other surface side of the substrate and a first portion forming a decompressed first storage chamber. Forming a decompressed second storage chamber and connecting the first part with the second part separable in a direction perpendicular to the surface of the substrate with respect to the first part; A mechanism for relatively moving the first part and the second part in a direction perpendicular to the surface of the substrate so as to switch between the separated state and the state separated by a predetermined gap; and When the second portion is separated, the first storage chamber and the And a storage chamber opening / closing mechanism movably provided on the substrate side of each of the first portion and the second portion so that the two storage chambers are sealed in a decompressed state. Provided.

  According to the aspect of the present invention, it is possible to reduce the management burden of the substrate during transport.

The figure which shows the structure of the substrate processing apparatus which concerns on 1st embodiment of this invention. The figure which shows the structure of a part of substrate processing apparatus which concerns on this embodiment. The figure which shows the structure of a part of substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the structure of the substrate processing apparatus which concerns on 2nd embodiment of this invention. The figure which shows the structure of a part of substrate processing apparatus which concerns on this embodiment. Sectional drawing which shows the structure of the substrate processing apparatus which concerns on 3rd embodiment of this invention. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the mode of operation | movement of the substrate processing apparatus which concerns on this embodiment. The figure which shows the structure of the substrate processing apparatus which concerns on 4th embodiment of this invention. The figure which shows the structure of the substrate processing apparatus which concerns on 4th embodiment of this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention. The figure which shows the other structure of the substrate processing apparatus which concerns on this invention.

[First embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing the overall configuration of the substrate processing apparatus FPA according to the present embodiment. 2 and 3 are perspective views showing a state of a part of the configuration of the substrate processing apparatus FPA when viewed from a different viewpoint from FIG.
As shown in FIGS. 1 to 3, the substrate processing apparatus FPA includes a transport unit 1 that transports a flexible substrate S formed in a strip shape, a processing unit 2 that performs a predetermined process on the substrate S, And a control unit CONT that controls the transport unit 1 and the processing unit 2 in an integrated manner. The substrate processing apparatus FPA is provided, for example, on a base (pedestal) ST placed on the floor surface FL of the manufacturing factory.

  The substrate processing apparatus FPA is an apparatus of a roll-to-roll system (hereinafter simply referred to as “roll system”) that performs various processes on the surface of a flexible substrate S formed in a strip shape. The substrate processing apparatus FPA is used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate S. Of course, the substrate processing apparatus FPA may be used in a system for forming elements other than these elements (for example, solar cells, color filters, touch panels, etc.).

  Hereinafter, in describing the configuration of the substrate processing apparatus FPA according to the present embodiment, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following drawings, a plane parallel to the floor surface FL in the XYZ orthogonal coordinate system is an XY plane. In the XY plane, the direction in which the substrate S moves is the Y direction, and the direction orthogonal to the Y direction is the X direction. A direction perpendicular to the floor surface FL (XY plane) is taken as a Z-axis direction.

  As the substrate S to be processed in the substrate processing apparatus FPA, for example, a foil (foil) such as a resin film or stainless steel can be used. For example, the resin film is polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene Materials such as naphthalate and stainless steel foil can be used.

  The dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long direction (size for one roll) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the short direction of the substrate S may be 1 m or less, 50 cm or less, or 2 m or more. Moreover, the dimension of the elongate direction of the board | substrate S may be 10 m or less.

  The substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. The flexibility varies depending on the material, size, thickness, or environment such as temperature and humidity of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.

  The substrate S preferably has a relatively small coefficient of thermal expansion so that its dimensions do not substantially change even when it receives heat at a relatively high temperature (for example, about 200 ° C.) (thermal deformation is small). For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

  The base ST has a base part STa, a leg part STb, and a support base STc. Base portion STa is placed on floor surface FL. A plurality of leg portions STb are provided on the base portion STa and support the support base STc. The support base STc is formed in a rectangular shape, for example, and is provided with an opening to which the processing unit 2 is attached and two openings STd provided so as to sandwich the opening in the X direction. That is, the support STc is provided with three openings STd along the X direction. Guide rails 7r extending in parallel to the Y-axis direction are provided in the three openings STd. Two guide rails 7r are provided in parallel in the X direction for each opening STd.

  The transport unit 1 includes a first rail 3, a second rail 4, a substrate feed mechanism 5, a substrate take-up mechanism 6, a rail drive mechanism (rail drive unit) 7, and a roller drive unit 8.

  The first rail 3 is disposed along the + Y side of the support base STc. The first rail 3 is divided into three unit rails 3A to 3C. Each unit rail 3A-3C is arrange | positioned in the position corresponding to each of three opening part STd of the support stand STc. The dimension in the X direction of the unit rails 3A to 3C is a value corresponding to the dimension in the X direction of each opening STd.

  The second rail 4 is disposed along the −Y side of the support base STc. The second rail 4 is divided into three unit rails 4A to 4C. Each unit rail 4A-4C is arrange | positioned in the position corresponding to each of three opening part STd of support stand STc similarly to said unit rail 3A-3C. The dimensions in the X direction of the unit rails 4A to 4C are values corresponding to the dimensions in the X direction of the openings STd, and are the same as the dimensions in the X direction of the unit rails 3A to 3C. .

  The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are respectively supported by guide rails 7r provided in the respective openings STd and extending in the Y direction. In the configuration shown in FIG. 1, the unit rails 3A to 3C are supported on the + Y side end of the guide rail 7r, and the unit rails 4A to 4C are supported on the −Y side end of the guide rail 7r.

  The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are respectively arranged in parallel to the X direction. Further, since the guide rail 7r extends parallel to the Y-axis direction, the unit rails 3A to 3C and the unit rails 4A to 4C can move on the guide rail 7r in the Y direction while maintaining a parallel state to each other. Is provided. As described above, the first rail 3 and the second rail 4 are configured to be linearly movable on a plane parallel to the XY plane by the guide rail 7r.

  The substrate delivery mechanism 5 is disposed on the first rail 3. The substrate delivery mechanism 5 has a roller support portion 5a and a supply roller 5b. The roller support portion 5 a is connected on the first rail 3 and is provided so as to be movable in the X direction along the first rail 3. The roller support portion 5a is movable over the unit rails 3A to 3C constituting the first rail 3.

  The supply roller 5b is rotatably supported by the roller support part 5a. The supply roller 5b is supported so that the direction of the rotation axis coincides with a direction parallel to the X direction. The substrate S is wound around the supply roller 5b in a roll shape. By rotating the supply roller 5b, the substrate S wound around the supply roller 5b is sent out in the -Y direction. The supply roller 5b can be rotated by a motor or the like.

  The substrate winding mechanism 6 is disposed on the second rail 4. The substrate winding mechanism 6 includes a roller support portion 6a and a recovery roller 6b. The roller support portion 6 a is connected on the second rail 4 and is provided so as to be movable in the X direction along the second rail 4. The roller support portion 6 a is movable over the unit rails 4 </ b> A to 4 </ b> C constituting the second rail 4 in the roller driving portion 8.

  The collection roller 6b is rotatably supported by the roller support portion 6a. The collection roller 6b is supported so that the direction of the rotation axis coincides with a direction parallel to the X direction. The substrate S is wound around the collection roller 6b in a roll shape. When the collection roller 6b rotates, the substrate S is wound around the collection roller 6b. The collection roller 6b can be rotated by a motor or the like.

  The rail drive mechanism 7 moves the first rail 3 and the second rail 4 in the Y direction along the guide rail 7r. The rail drive mechanism 7 can drive the first rail 3 for each of the unit rails 3A and 3C, and can drive the second rail 4 for each of the unit rails 4A and 4C. The control unit CONT can control the drive amount, drive speed, drive timing, and the like by the rail drive mechanism 7. The rail drive mechanism 7 can move the unit rail 3A and the unit rail 4A closer to each other or away from each other along the guide rail 7r. The rail drive mechanism 7 can move the unit rail 3C and the unit rail 4C closer to each other or away from each other along the guide rail 7r.

  The roller drive unit 8 includes a first drive unit 83 and a second drive unit 84. The first drive unit 83 moves the roller support unit 5a in the X direction along the first rail 3, and rotates the supply roller 5b. The second drive unit 84 moves the roller support 6a along the second rail 4 in the X direction and rotates the collection roller 6b. The control unit CONT can control the first drive unit 83 and the second drive unit 84 individually or in synchronization. Further, the control unit CONT can control the drive amount, drive speed, drive timing, and the like in the first drive unit 83 and the second drive unit 84.

  As shown in FIG. 3, the processing unit 2 has a processing surface (first surface) Sa of the substrate S on the movement path of the substrate S supplied from the substrate delivery mechanism 5 and conveyed to the substrate winding mechanism 6. Process. The processing unit 2 includes a chamber device (chamber) CB, a chamber driving device 25, a processing device 10, a guide device 30, and an alignment measuring device 50. In the present embodiment, a printing machine is shown as the processing apparatus 10.

  The chamber device CB is disposed between the first rail 3 and the second rail 4 (between the unit rail 3B and the unit rail 4B in the present embodiment). The chamber apparatus CB is a housing that surrounds a portion of the substrate S that is disposed between the supply roller 5b and the collection roller 6b. The chamber apparatus CB has a first part CB1 provided on the surface Sa (surface to be processed) on the −Z side of the substrate S and a second part CB2 provided on the surface Sb on the + Z side of the substrate S. . In the chamber device CB, the first portion CB1 and the second portion CB2 are connected so as to be relatively separable in the Z direction.

  The chamber device CB has passage portions 26 and 27 through which the substrate S passes. The passage part (first passage part) 26 is an opening formed in the + Y side wall of the chamber apparatus CB. The passage part 26 includes a concave part 26a formed in the first part CB1 and a concave part 26b formed in the second part CB2. The passage part (second passage part) 27 is an opening formed in the −Y side wall part of the chamber apparatus CB. The passage part 27 includes a recess 27a formed in the first part CB1 and a recess 27b formed in the second part CB2. In a state where the first part CB1 and the second part CB2 are connected, the passage portions 26 and 27 are opened to the chamber device CB. The substrate S sent out from the supply roller 5b is carried into the chamber device CB via the passage portion 26 and is carried out from the chamber device CB via the passage portion 27.

  The chamber drive device 25 includes support columns (support portions) 25a and 25b, bridging members 25c and 25d, and elevating mechanisms 25e and 25f. The support pillar 25a is fixed to the + Y side of the support ST (stage) STc of the base ST with respect to the first rail 3. The support column 25b is fixed to the −Y side of the second rail 4 in the support base (stage) STc of the base ST.

  The bridging member 25c is supported by the support column 25a. The bridging member 25c is fixed to the outer wall on the + Y side of the first portion CB1 of the chamber device CB. The bridging member 25d is supported by the support pillar 25b. The bridging member 25d is fixed to the outer wall on the −Y side of the first portion CB1 of the chamber device CB.

  The lifting mechanism 25e is provided on the support column 25a and is connected to the bridging member 25c. The elevating mechanism 25e has an actuator (not shown) that moves the bridging member 25c in the Z direction along the support column 25a. The elevating mechanism 25f is provided on the support column 25b and is connected to the bridging member 25d. The elevating mechanism 25f has an actuator (not shown) that moves the bridging member 25d in the Z direction along the support column 25b. Examples of the actuator include a motor mechanism and an air cylinder mechanism.

  As described above, the first portion CB <b> 1 is configured to be supported from the outer side in the Y direction than the first rail 3 and the second rail 4. The first portion CB1 is configured to move integrally with the bridging members 25c and 25d in the Z direction along the support columns 25a and 25b by the lifting mechanisms 25e and 25f.

  The processing apparatus 10 is accommodated in, for example, the second part CB2 of the chamber apparatus CB. The processing apparatus 10 has various apparatuses for forming, for example, organic EL elements on the surface Sa to be processed of the substrate S. Examples of such an apparatus include a partition forming apparatus for forming a partition on the surface Sa, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer. More specifically, a droplet coating apparatus (for example, an ink jet type coating apparatus), a film forming apparatus (for example, a vapor deposition apparatus, a sputtering apparatus), an exposure apparatus, a developing apparatus, a surface modification apparatus, a cleaning apparatus, a drying apparatus, etc. It is done. Each of these apparatuses is appropriately provided along the transport path of the substrate S. In the present embodiment, the processing apparatus 10 includes a transfer apparatus (for example, a gravure printing machine, a flexographic printing machine, etc.) 11 that transfers and forms a coating film on the surface Sa.

  The transfer device 11 includes a transfer roller 11a, a coating liquid storage unit 11b, and a film thickness adjustment unit 11c. A part of the transfer roller 11a is attached to the coating liquid 11d stored in the coating liquid storage section 11b. The transfer roller 11a is rotatably provided in this state. The transfer device 11 has a rotation drive mechanism (not shown) (for example, a motor mechanism) that rotates the transfer roller 11a clockwise. The transfer device 11 is disposed, for example, on the + Y side of the center in the Y direction in the space in the chamber device CB. Also, a lid 11e is provided on the + X side wall of the transfer roller 11a in the first portion CB1 of the chamber device CB. The lid portion 11e is formed to have a size larger than that of the transfer roller 11a when viewed in the X direction. For this reason, in a state where the lid portion 11e is opened, the transfer roller 11a can be taken in and out of the first portion CB1 in the X direction.

  The guide device 30 has a plurality of guide rollers GR and a plurality of guide pads GP for guiding the substrate S in the processing unit 2. The plurality of guide rollers GR are provided along the transport path of the substrate S. Three guide rollers GR1 among the plurality of guide rollers GR function as pressing rollers that press the surface Sa to be processed of the substrate S against the transfer roller 11a. The three guide rollers GR1 are movable so that the positional relationship is not changed by a guide member (not shown).

  Moreover, three guide rollers GR2 among the plurality of guide rollers GR guide the back surface Sb of the substrate S after the coating liquid is transferred. In addition, a plurality (three in this case) of guide pads GP guide the surface Sa to be processed of the substrate S after the coating liquid is transferred. Each of the plurality of guide pads GP includes a plurality of unillustrated jet outlets for ejecting gas from the cylindrical guide surface GPa, and can form a gas layer on the guide surface GPa. . By this gas layer, the guide surface GPa can be guided in a non-contact manner with respect to the processing surface Sa of the substrate S. The guide roller GR2 and the guide pad GP are alternately arranged in the Y direction.

  Further, the guide rollers GR3 and GR4 are provided at fixed positions in the second portion CB2. The guide roller GR5 is disposed on the + Y side of the second portion CB2, and is provided so as to be movable in the Z direction. The guide roller GR5 is configured to sandwich the substrate S with the guide roller GR3 by moving to the −Z side.

  The alignment measuring device 50 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S based on the measurement result. The alignment measurement apparatus 50 includes an alignment camera that detects an edge portion of the substrate S or an alignment mark, an adjustment device that adjusts at least one of the position and orientation of the substrate S based on the detection result of the alignment camera, and the like. Yes. As the position measurement and speed measurement of the substrate S, a method of projecting a laser beam on the substrate S by a method like an optical mouse and photoelectrically detecting a change in a speckle pattern generated on the substrate S can be used.

Next, the operation of the substrate processing apparatus FPA configured as described above will be described. 4-14 is a figure which shows operation | movement of the substrate processing apparatus FPA.
First, the case where the operation | movement which spans the board | substrate S between the supply roller 5b and the collection | recovery roller 6b among the conveyance parts 1 is performed is demonstrated.

  As shown in FIG. 4, the control unit CONT arranges the substrate feed mechanism 5 on the unit rail 3 </ b> A of the first rail 3 and arranges the substrate take-up mechanism 6 on the unit rail 4 </ b> A of the second rail 4. By this operation, the supply roller 5b and the collection roller 6b are arranged in parallel so as to face each other in the Y direction.

  Next, the substrate S wound in a roll shape is attached to the supply roller 5b. For example, in the configuration shown in FIG. 4, the reader Lf is attached to the tip Sf of the substrate S. However, the reader Lf may be omitted. After attaching the roll-shaped substrate S to the supply roller 5b, the control unit CONT moves the unit rail 4A of the second rail 4 in the + Y direction. By this operation, the supply roller 5b and the collection roller 6b come closer.

  When the distance between the supply roller 5b and the collection roller 6b becomes the first distance D1, the control unit CONT rotates the supply roller 5b by the first drive unit 83. By this operation, the tip Sf of the substrate S is sent out to the collection roller 6b side, and the tip Sf of the substrate S reaches the collection roller 6b and is wound around the collection roller 6b. The operation of winding the tip Sf of the substrate S around the collection roller 6b may be automated, but the tip Sf may be manually attached to the collection roller 6b by using a fixing tape or the like.

  The controller CONT rotates the supply roller 5b after the tip Sf of the substrate S is hung on the collection roller 6b, and moves the unit rail 4A in the −Y direction until the substrate take-up mechanism 6 reaches the original position. Move. By this operation, the front end Sf of the substrate S is pulled out in the −Y direction in a state where it is hung on the collection roller 6b.

  After the substrate winding mechanism 6 reaches the original position, the control unit CONT stops the movement of the substrate winding mechanism 6. Thereafter, as shown in FIG. 5, the control unit CONT moves the second part CB2 of the chamber apparatus CB in the + Z direction to form a gap through which the substrate S can pass between the first part CB1 and the second part CB2. To do. At this time, an appropriate tension is applied to the substrate S spanned between the supply roller 5b and the collection roller 6b in the Y direction, and the substrate S forms a gap between the first portion CB1 and the second portion CB2. To be able to pass. The tension of the substrate S can be adjusted by controlling the substrate winding mechanism 6.

  In this state, as shown in FIG. 6, the control unit CONT synchronizes the substrate feed mechanism 5 and the substrate take-up mechanism 6 with the first drive units 83 and 84, and onto the unit rail 3 </ b> B and the unit rail 4 </ b> B, respectively. Move. In this state, the substrate S is disposed at a position sandwiched between the concave portions 26a and 27a of the first portion CB1 and the concave portions 26b and 27b of the second portion CB2 in the Z direction.

  The controller CONT moves the second part CB2 in the −Z direction as shown in FIG. 7 after disposing the substrate delivery mechanism 5 and the substrate take-up mechanism 6 on the unit rails 3B and 4B, respectively. CB1 and the second part CB2 are connected. In this state, the first part CB1 and the second part CB2 come into contact with each other, and the gap between the first part CB1 and the second part CB2 is closed. The substrate S enters the inside of the chamber device CB at the passage portion 26 and comes out of the chamber device CB at the passage portion 27.

  After connecting the first part CB1 and the second part CB2, the control unit CONT puts the guide device 30 in the chamber device CB on standby. Specifically, first, as shown in FIG. 8, the guide rollers GR1 and GR2 are arranged on the + Z side of the substrate S, and the guide pad GP is arranged on the −Z side of the substrate S. As shown in FIG. 3, each of the substrate delivery mechanism 5 and the substrate take-up mechanism 6 is provided with elevators 5d and 6d for adjusting the heights of the supply roller 5b and the recovery roller 6b. The height is adjusted so that the substrate S across the take-up mechanism 6 is substantially horizontal.

  From this state, as shown in FIG. 9, the guide roller GR1 is moved in the -Z direction to press the substrate S toward the -Z side, and the surface Sa to be processed is brought into contact with the transfer roller 11a. Further, the guide roller GR2 is moved in the −Z direction, and the guide pad GP is moved to the + Z side. By this operation, on the −Y side from the central portion of the chamber apparatus CB, the substrate S is guided by being bent back many times in the Z direction in the chamber apparatus CB. For this reason, it is conveyed in the state which the board | substrate S overlapped seeing in the Y direction.

  The control unit CONT rotates the supply roller 5b and the collection roller 6b in accordance with the processing timing of the transfer device 11, and rotates the transfer roller 11a. By this operation, the substrate S is sent out from the supply roller 5b and the substrate S is wound up by the recovery roller 6b. In this state, the transfer process of the coating film by the transfer device 11 is performed on the surface Sa to be processed of the substrate S. Will be done.

  As shown in FIG. 9, the target surface Sa of the substrate S is supported by the guide surface GPa of the guide pad GP, so that the substrate S can be conveyed in a non-contact state with respect to the coating film. Note that a portion of the substrate S guided by the guide roller GR2 and the guide pad GP may be dried using, for example, a drying device such as a heating device.

  The controller CONT adjusts the moving speed of the substrate S moving from the supply roller 5b to the collection roller 6b according to the processing speed of the transfer device 11. As shown in FIG. 10, according to the winding diameter R1 of the substrate S wound around the supply roller 5b and the winding diameter R2 of the substrate S wound around the recovery roller 6b, the first drive unit 83 and the second drive The drive speed in the unit 84 is adjusted. By this operation, the substrate S is transported while the transport speed is constant. The speed of the substrate S is also monitored based on the timing (time) at which the alignment measuring device 50 in FIG. 3 measures the alignment mark provided on the substrate S. Further, the elevators 5d and 6d may be adjusted by changing the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.

  The controller CONT may adjust the distance between the supply roller 5b and the collection roller 6b in accordance with the processing position and size of the transfer device 11. In this case, the control unit CONT causes the rail drive mechanism 7 to move, for example, the unit rail 3B or the unit rail 4B in the Y direction, respectively. A part of the constituent elements of the display element is sequentially formed on the substrate S by the transfer device 11.

  FIG. 11 shows a state of the chamber apparatus CB in a state where the processing for the substrate S is completed. From this state, as shown in FIG. 12, the control unit CONT moves the second part CB2 of the chamber apparatus CB to the + Z side, and a gap through which the substrate S can pass between the first part CB1 and the second part CB2. Form.

  In this state, as shown in FIG. 13, the control unit CONT synchronizes the substrate feed mechanism 5 and the substrate take-up mechanism 6 by the synchronous control of the first drive units 83 and 84, and the unit rail 3C and the unit rail are respectively synchronized. Move up 4C. By this operation, the substrate S is retracted from the position sandwiched between the first portion CB1 and the second portion CB2 to the + X side. After the substrate feed mechanism 5 and the substrate take-up mechanism 6 are arranged on the unit rail 3C and the unit rail 4C, the movement of the substrate feed mechanism 5 and the substrate take-up mechanism 6 is stopped.

  The control unit CONT stops the movement of the substrate delivery mechanism 5 and the substrate take-up mechanism 6, and then moves the unit rail 4C in the + Y direction while rotating the collection roller 6b. By this operation, the supply roller 5b and the recovery roller 6b come close again while the recovery roller 6b winds up the substrate S.

  After the distance between the supply roller 5b and the collection roller 6b reaches the second distance D2, the control unit CONT rotates the supply roller 5b with the second drive unit 84 as shown in FIG. In this case, about the 2nd distance D2, it can be set as the distance equal to said 1st distance D1, for example. By this operation, the rear end Se of the substrate S is sent out to the collection roller 6b side, and the rear end Se of the substrate S reaches the collection roller 6b and is wound around the collection roller 6b. For example, in the configuration shown in FIG. 5, the reader Le is attached to the rear end Se of the substrate S. However, the reader Le may be omitted.

  The controller CONT moves the unit rail 4C in the −Y direction until the substrate winding mechanism 6 moves to the original position after the rear end Se of the substrate S is hung on the collection roller 6b. After the substrate winding mechanism 6 returns to the original position, the roll-shaped substrate S wound around the collection roller 6b is moved to the next processing apparatus. Or when all the processes are performed with respect to the board | substrate S, it removes from this collection roller 6b, and is collect | recovered.

  As described above, according to the present embodiment, the substrate S is carried into and out of the chamber apparatus CB in a direction intersecting the moving direction of the substrate S from the supply roller 5b toward the collection roller 6b. Since the supply roller 5b, the recovery roller 6b, the chamber device CB, and the transfer device 11 are relatively moved, the substrate S is kept in a constant size while being fed and wound up. The substrate can be carried into the processing apparatus 10 and the substrate S can be processed. Thereby, since it can suppress that the dimension of the board | substrate S spanned from sending out to winding up can be suppressed, the management burden of the board | substrate S at the time of conveyance can be reduced.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 15 is a cross-sectional view showing the configuration of the substrate processing apparatus FPA2 according to this embodiment.
As shown in FIG. 15, in this embodiment, a pressure adjusting device (pressure adjusting unit) 60 such as a pump is connected to the chamber device CB, and the pressure inside the chamber device CB is adjusted (for example, pressurization, decompression). It has a possible configuration. In the chamber apparatus CB, as the processing apparatus 10, for example, a plasma apparatus 12 that performs processing in a reduced pressure environment is provided. Differential exhaust chambers 61 and 62 are provided on the + Y side of the chamber apparatus CB, and differential exhaust chambers 63 and 64 are provided on the −Y side of the chamber apparatus CB. A pump is also connected to each differential exhaust chamber 61-64.

  The differential exhaust chambers 61 to 64 have first portions 61 a to 64 a disposed on the −Z side of the substrate S and second portions 61 b to 64 b disposed on the + Z side of the substrate S, respectively. The first portions 61a to 64a of the differential exhaust chambers 61 to 64 are provided integrally with the first portion CB1 of the chamber device CB (third portion CB3). The second portions 61b to 64b of the differential exhaust chambers 61 to 64 are provided integrally with the second portion CB2 of the chamber device CB (fourth portion CB4). The third part CB3 and the fourth part CB4 are provided so as to be separable in the Z direction.

  A seal mechanism 65 is provided between the third portion CB3 and the fourth portion CB4. The seal mechanism 65 can seal the inside of each differential exhaust chamber 61 to 64, the inside of the chamber device CB, and the substrate S in a state where the third portion CB3 and the fourth portion CB4 are connected. It has a configuration (air tight state).

FIG. 16 is a diagram illustrating a configuration of the seal mechanism 65.
As shown in FIG. 16, the seal mechanism 65 includes a first air pad mechanism 65A and a second air pad mechanism 65B that sandwich the substrate S in the Z direction, and a pressing mechanism 70 that presses the first air pad mechanism 65A toward the second air pad mechanism 65B. And have.

  The first air pad mechanism 65A is connected to a pad 66 provided with an air jet port 66a and an air suction port 66b on a surface directed to the −Z side, and an air supply unit (not shown) that supplies air such as nitrogen gas. And a suction side connection portion 68 connected to a suction pump (not shown). The air ejection port 66 a is connected to the supply side connection portion 67 through a flow path in the pad 66. The air suction port 66 b is connected to the suction side connection portion 68 through a flow path in the pad 66.

  The second air pad mechanism 65B is connected to a pad 166 provided with an air ejection port 166a and an air suction port 166b on the surface directed toward the + Z side, and an air supply unit (not shown) that supplies air such as nitrogen gas. Supply side connection portion 167 and a suction side connection portion 168 connected to a suction pump (not shown). The air ejection port 166 a is connected to the supply side connection portion 167 via a flow path in the pad 166. The air suction port 166 b is connected to the suction side connection portion 168 via a flow path in the pad 166.

  In the present embodiment, with such a configuration, when the pressure inside the chamber apparatus CB is adjusted, the differential exhaust chamber is provided, so that the pressure inside the chamber apparatus CB can be stabilized. Further, since the space between the third portion CB3, the fourth portion CB4 and the substrate S can be closed with a high degree of sealing, it is possible to prevent foreign matter from entering the chamber device CB and the differential exhaust chambers 61 to 64. it can.

[Third embodiment]
Next, a third embodiment of the present invention will be described.
FIG. 17 is a cross-sectional view showing the configuration of the substrate processing apparatus FPA3 according to this embodiment.
As shown in FIG. 17, each of the first portion CB1 and the second portion CB2 of the chamber device CB is provided with a storage chamber opening / closing mechanism SL. The storage chamber opening / closing mechanism SL has a slide mechanism (opening / closing part) SL1 attached to the first part CB1 and a sliding mechanism (opening / closing part) SL2 attached to the second part CB2.

  The slide mechanism SL1 has a pair of slide members 71a and 71b. The slide members 71a and 71b are provided so as to be movable in the X direction. The slide members 71a and 71b are provided so that the accommodation chamber RM1 of the first part CB1 can be opened and closed. In a state where the slide members 71a and 71b are opened, the accommodation chamber RM1 is opened to the atmosphere. In a state where the slide members 71a and 71b are closed, the storage chamber RM1 is sealed.

  In a state where the slide members 71a and 71b are opened, the slide member 71a is accommodated in a slide accommodating portion (accommodating portion) 73a provided in the flange portion 73 of the first portion CB1, and the slide member 71b is accommodated in the flange portion 74 of the first portion CB1. It is accommodated in the provided slide accommodating portion (accommodating portion) 74a. Thus, the first portion CB1 has a configuration in which the flange portions 73 and 74 used for connection with the second portion CB2 also serve as the accommodating portions of the slide members 71a and 71b.

  The slide mechanism SL2 has a pair of slide members 72a and 72b. The slide members 71a and 71b are provided so as to be movable in the X direction. The slide members 72a and 72b are provided so that the accommodation chamber RM2 of the second part CB2 can be opened and closed. In the state where the slide members 72a and 72b are opened, the accommodation chamber RM2 is opened to the atmosphere, but the slide members 72a and 72b function to maintain the decompressed state of the accommodation chamber RM2. In a state where the slide members 72a and 72b are closed, the storage chamber RM2 is sealed.

  In a state where the slide members 72a and 72b are opened, the slide member 72a is accommodated in a slide accommodating portion (accommodating portion) 75a provided in the flange portion 75 of the second portion CB2, and the slide member 72b is accommodated in the flange portion of the second portion CB2. It is accommodated in a slide accommodating portion (accommodating portion) 76 a provided in 76. Thus, the second portion CB2 has a configuration in which the flange portions 75 and 76 used for connection to the first portion CB1 also serve as the accommodating portions of the slide members 72a and 72b.

  A connection mechanism 77 is provided in the first part CB1. The connection mechanism 77 has a vacuum packing 77a and an air seal mechanism 77b. A connection mechanism 78 is provided in the second portion CB2. The connection mechanism 78 has a vacuum packing 78a and an air seal mechanism 78b. The first part CB1 and the second part CB2 are connected in a sealed state by the connection mechanisms 77 and 78.

  Further, an elevating mechanism 79 is connected to the first part CB1, and an elevating mechanism 80 is connected to the second part CB2. With this configuration, the first part CB1 and the second part CB2 can be moved up and down individually in the Z direction. Although not shown in FIG. 17, differential exhaust chambers 85 and 86 (see FIG. 18 and the like) are integrally attached to the + Y side and the −Y side of the chamber device CB, respectively.

  Further, the substrate processing apparatus FPA3 includes, as the processing apparatus 10, a first processing apparatus 13 accommodated in the first part CB1 and a second processing apparatus 14 accommodated in the second part CB2. Note that a configuration in which one of the first processing device 13 and the second processing device 14 is omitted may be employed. Pressure adjusting devices 81 and 82 such as vacuum pumps are connected to the first part CB1 and the second part CB2, respectively. As the 1st processing apparatus 13 and the 2nd processing apparatus 14, the plasma apparatus etc. which process in a pressure-reduced environment are provided, for example.

  Next, the operation of the substrate processing apparatus FPA3 configured as described above will be described. In the present embodiment, the operation when replacing the substrate S from the state where the processing for the substrate S is completed will be described as an example.

  FIG. 18 shows a state of the chamber apparatus CB in a state where the processing for the substrate S is completed. In the state where the processing on the substrate S is completed, the inside of the chamber apparatus CB is in a reduced pressure state. When the first part CB1 and the second part CB2 are separated in this state, it is necessary to return the interior of the chamber device CB to atmospheric pressure. When processing the next substrate S, it is necessary to reduce the pressure in the chamber apparatus CB again, which takes time.

  Therefore, in the present embodiment, as shown in FIG. 19, the control unit CONT first closes the slide members 72a and 72b provided in the second portion CB2. By this operation, the accommodation room RM2 (see FIG. 17) of the second part CB2 is sealed, and the decompression state of the accommodation room RM2 is maintained.

  After closing the slide members 72a and 72b or simultaneously with the closing operation of the slide members 72a and 72b, the control unit CONT closes the slide members 71a and 71b provided in the first portion CB1, as shown in FIG. And By this operation, the accommodation chamber RM1 (see FIG. 17) of the first portion CB1 is also sealed, and the decompression state of the accommodation chamber RM1 is maintained. At this time, since the space between the slide members 71a and 71b and the slide members 72a and 72b is in a reduced pressure state, the pneumatic system is operated to return only this space to atmospheric pressure.

  In this state, the control part CONT returns the pressure of the differential exhaust chambers 85 and 86 to atmospheric pressure, and then moves the first part CB1 to the −Z side as shown in FIG. The two parts CB2 are separated. By this operation, the space between the slide members 71a and 71b and the slide members 72a and 72b is released to the atmosphere, and the accommodation chamber RM1 of the first part CB1 and the accommodation room RM2 of the second part CB2 are not released to the atmosphere.

  After separating the first part CB1 and the second part CB2, as shown in FIG. 22, the control unit CONT moves the substrate delivery mechanism 5 and the substrate take-up mechanism 6 waiting on the −X side of the chamber device CB in the + X direction. To move the new substrate S between the first part CB1 and the second part CB2. Thereafter, the control unit CONT moves the first part CB1 to the + Z side to connect the first part CB1 and the second part CB2.

After connecting the first part CB1 and the second part CB2, the control unit CONT is a pneumatic system for exhausting the air remaining in the narrow space sandwiched between the slide members 71a and 71b and the slide members 72a and 72b. When the narrow space becomes almost the same decompressed state as in the storage chamber RM1 of the first part CB1 or the storage chamber RM2 of the second part CB2, the slide members 71a and 71b are opened and the slide The members 72a and 72b are opened.
18 to 22, the substrate S is pulled out from the lower side of the roll, and the surface opposite to the processing surface of the substrate S in FIG. 17 is processed.
In the present embodiment, the separation and connection between the first part CB1 and the second part CB2 are performed by the movement of only the first part CB1, but the movement of only the second part CB2 or the first part CB1 and the second part CB2. It may be done by movement.

  As described above, according to the present embodiment, it is possible to carry in a new substrate S while maintaining the decompressed state of the storage chambers RM1 and RM2, and to start processing on the substrate S. Thereby, the substrate processing apparatus FPA3 having a high throughput is obtained.

[Fourth embodiment]
Next, a fourth embodiment of the present invention will be described.
FIG. 23A is a diagram showing a configuration of a differential exhaust device (differential exhaust chamber) 100 according to the present embodiment.
As shown in FIG. 23A, in the present embodiment, the differential exhaust device 100 is arranged alone, but this differential exhaust device 100 can also be incorporated as the differential exhaust chambers 85 and 86 shown in FIGS. Is. The differential exhaust device 100 is configured to be separable into a first portion 101 and a second portion 102. The differential exhaust device 100 is formed to be long in the Z direction.

  The first portion 101 is provided with a partition portion 101C that partitions the inside of the first portion 101 into two storage chambers 101A and 101B. The first portion 101 is provided with opening and closing members 105 and 106 for individually opening and closing the storage chamber 101A and the storage chamber 101B. In a state where the opening and closing members 105 and 106 are closed, the storage chambers 101A and 101B are in a sealed state.

  The second portion 102 is provided with a partition portion 102C that partitions the inside of the second portion 102 into two storage chambers 102A and 102B. The second portion 102 is provided with opening / closing members 107 and 108 for individually opening and closing the storage chamber 102A and the storage chamber 102B. When the opening and closing members 107 and 108 are closed, the storage chambers 102A and 102B are in a sealed state. The second portion 102 is formed so that the dimension in the Z direction is larger than that of the first portion 101.

  In the differential exhaust device 100, the volumes of the storage chambers 102A and 102B are larger than the volumes of the storage chambers 101A and 101B. For example, an air blowing port for drying the substrate S may be arranged in the storage chambers 102A and 102B. Further, a configuration in which a pressure adjustment mechanism that adjusts the pressure in the storage chambers 102A and 102B, an atmosphere adjustment mechanism that adjusts the atmosphere in the storage chambers 102A and 102B, and the like may be provided.

  Rollers (or guide pads GP as shown in FIG. 3) 103 and 104 for guiding the substrate S are provided in the storage chambers 101A and 101B, respectively. The rollers 103 and 104 are provided so as to be movable in the Z direction so as to straddle between the accommodation chambers 102A and 102B of the second portion 102.

  A seal mechanism 109 is provided between the first part 101 and the second part 102. As in the configuration shown in FIG. 16, the sealing mechanism 109 includes a first pad 109 a provided on the −Z side end face of the first portion 101 and a second pad provided on the + Z side end face of the second portion 102. 109b. The first pad 109a and the second pad 109b are provided at positions where the substrate S is sandwiched. The first pad 109a and the second pad 109b have a gas layer forming portion (not shown) that forms a gas layer on the surface, as in FIG.

  When the differential exhaust device 100 configured as described above is used, as shown in FIG. 23B, the first portion 101 and the second portion 102 are connected so as to sandwich the substrate S, and the slide member 71a shown in FIG. , 71b, 72a, 72b, and open / close members 105 to 108 that function in the same manner. Thereafter, the rollers 103 and 104 are moved to the −Z side. By this operation, the substrate S is sandwiched between the gas layer of the first pad 109a and the gas layer of the second pad 109b and is held in a non-contact state.

  Thus, according to this embodiment, the installation area of the differential exhaust device 100 can be reduced by forming the differential exhaust device 100 longitudinally in the Z direction. In this case, the differential exhaust device 100 can be separated into the first portion 101 and the second portion 102 while maintaining the pressure and atmosphere of the storage chambers 102A and 102B having a large volume. The resetting of the pressure and atmosphere in the exhaust device 100 can be omitted or the time required for resetting can be reduced. For this reason, efficient processing can be performed on the substrate S.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the first embodiment shown in FIG. 8 and FIG. 9, the configuration in which the guide rollers GR1, GR2, GR5 and the guide pad GP move along the Z direction has been described as an example. There is no change, and a modification as shown in FIG. 24 is possible.

  As shown in FIG. 24, the guide rollers GR1, GR2, GR5 and the guide pad GP are moved to a position inclined in the θX direction. When these guide rollers GR1, GR2, GR5 and the guide pad GP move, as shown in FIG. 25, it is possible to save space in the Z direction as compared with the configuration in the first embodiment.

  In addition, the positional relationship of the three guide rollers GR1 that press the substrate S against the transfer roller 11a is the same as the positional relationship of the guide rollers GR1 in the first embodiment. For this reason, the conditions when the coating film is transferred to the substrate S by the transfer roller 11a are the same as the conditions in the first embodiment.

  Further, as shown in FIG. 26, the bearings of the three guide rollers GR1 may be fixed by a fixing member 200. In this case, as shown in FIG. 27, the substrate S can be brought into contact with an arbitrary position of the transfer roller 11a by adjusting the angular position of the fixing member 200 around the rotation axis of the transfer roller 11a. For this reason, the board | substrate S can be made to contact the position closer to the film thickness adjustment part 11c, for example according to the kind of coating liquid. Thereby, it can transfer to the board | substrate S, while the coating liquid adhering to the transfer roller 11a is not dried.

  For example, as shown in FIG. 28, a configuration may be adopted in which an optical sensor 300 that detects the substrate S is disposed in at least one of the passage part 26 and the passage part 27 of the chamber apparatus CB.

  Further, for example, as shown in FIG. 28, a drying unit 305 having an injection unit 303 for injecting dry gas in the X direction may be provided in the chamber apparatus CB. In this case, the drying unit 305 may be provided with an airflow adjustment plate (airflow adjustment unit) 301 that regulates the flow of the dry gas from the ejection unit 303 to the transfer roller 11a side.

  Further, a bellows portion 302 that expands and contracts according to the movement of the guide roller GR2 may be provided between the guide roller GR2 and the wall portion (ceiling portion) on the + Z side of the second portion CB2. The bellows portion 302 may also be provided between the guide pad GP and the wall portion (bottom portion) on the −Z side of the first portion CB1. With such a configuration, in the state where the substrate S is hung on the guide roller GR2 and the guide pad GP, the extended bellows is disposed at a position along the path of the substrate S. For this reason, the airflow in the Y direction is restricted by the bellows portion 302. Thus, by arranging the airflow adjusting plate 301 and the bellows portion 302, the flow path and airflow of the dry gas can be adjusted.

  In addition, as shown in FIG. 29, a sub-chamber device (preliminary processing unit) SCB may be arranged on the side of the movement direction (Y direction) of the substrate S with respect to the chamber device CB. The sub-chamber device SCB has the same configuration as the chamber device CB. Further, the sub chamber apparatus SCB accommodates the same constituent elements as the constituent elements (including the processing apparatus 10) accommodated in the chamber apparatus CB. For this reason, even when the chamber apparatus CB is stopped, the same process as the process in the chamber apparatus CB can be performed in the sub-chamber apparatus SCB. In this case, the substrate S which is usually processed by the chamber apparatus CB and passes through the sub-chamber apparatus SCB and exits in the + X direction. However, when the chamber apparatus CB is stopped and ink filling is performed, the substrate S is processed. Are switched so that they pass through the chamber device CB and are processed by the sub-chamber device SCB.

  FPA ... Substrate processing apparatus, S ... Substrate, CONT ... Control part, CB ... Chamber apparatus, GR ... Guide roller, GP ... Guide pad, 1 ... Transfer part, 2 ... Processing part, 5b ... Supply roller, 6b ... Recovery roller, 10 ... Processing device 25 ... Chamber driving device

Claims (6)

A substrate processing apparatus for transporting a flexible long sheet-like substrate in a longitudinal direction and processing the substrate in a chamber apparatus that accommodates a processing apparatus that operates under a reduced pressure environment,
The chamber apparatus is
A first portion disposed on one surface side of the substrate and forming a decompressed first storage chamber;
A second portion disposed on the other surface side of the substrate and forming a decompressed second storage chamber and separable in a direction perpendicular to the surface of the substrate with respect to the first portion;
A direction perpendicular to the surface of the substrate so that the first portion and the second portion are switched to a state in which the first portion and the second portion are connected and a state in which the first portion and the second portion are separated by a predetermined gap. A mechanism for relative movement,
When the first part and the second part are separated from each other, the first part and the second part are sealed so that the first storage room and the second storage room are sealed in a reduced pressure state. A storage chamber opening and closing mechanism provided movably on the substrate side of each part;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The chamber apparatus is
A first sealing mechanism by an air pad disposed so as to sandwich the substrate in a portion where the substrate is carried in and out in the longitudinal direction and the first portion and the second portion are connected to each other; And more,
Substrate processing equipment. The substrate processing apparatus according to claim 2,
A first differential exhaust chamber provided outside the portion of the chamber apparatus carrying the substrate; and a second differential exhaust chamber provided outside the portion of the chamber apparatus carrying the substrate. And more,
Substrate processing equipment. The substrate processing apparatus according to claim 3, wherein
Each of the first differential exhaust chamber and the second differential exhaust chamber includes a first portion provided integrally with the first portion of the chamber device, and the second portion of the chamber device. A substrate processing apparatus comprising: a second portion provided integrally. The substrate processing apparatus according to claim 4,
The first differential exhaust chamber is
A portion that carries the substrate in the longitudinal direction and that is formed by an air pad disposed so as to sandwich the substrate in a portion where the first portion and the second portion of the first differential exhaust chamber are connected. 2 sealing mechanisms,
The second differential exhaust chamber is
A portion for carrying out the substrate in the longitudinal direction, and a first air pad disposed so as to sandwich the substrate in a portion where the first portion and the second portion of the second differential exhaust chamber are connected. With 3 sealing mechanisms,
Substrate processing equipment. A substrate processing apparatus according to any one of claims 1 to 5,
The storage chamber opening / closing mechanism has a slide member that is movable in parallel with the surface of the substrate.
Substrate processing equipment.

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