TWI576301B - Substrate processing apparatus - Google Patents

Description

Substrate processing device

The present invention relates to a substrate processing apparatus.

Priority is claimed on U.S. Provisional Application No. 61/446,197, filed on Feb. 24, 2011, which is hereby incorporated by reference.

Examples of the display element constituting the display device such as a display device include a liquid crystal display element, an organic electroluminescence (organic EL) element, and the like. At present, these display elements are becoming mainstream with the formation of an active device called a Thin Film Transistor (TFT) on the surface of the substrate corresponding to each pixel.

In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a method called a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, one sheet-like substrate (for example, a strip-shaped film member) wound around a supply roller on the substrate supply side is fed, and the substrate to be fed is taken up by the recovery roller on the substrate recovery side. The substrate is applied to the substrate by a processing device disposed between the supply roller and the recovery roller.

In addition, during the transfer of the substrate to the winding, the gate electrode, the gate insulating film, the semiconductor film, and the gate electrode constituting the TFT are formed by using a plurality of processing devices (units), for example, by using a plurality of transfer rollers or the like. Source-drain electrodes, etc., sequentially form display elements on the processed surface of the substrate The constituent elements of the piece. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.

Patent Document 1: International Publication No. 2006/100868

However, in the above configuration, since the size of the substrate that is traversed from the time of delivery to the winding is long, the management of the substrate is difficult.

An aspect of the present invention is to provide a substrate processing apparatus capable of reducing the management load of a substrate during transportation.

According to an aspect of the present invention, a substrate processing apparatus includes: a supply roller that feeds a substrate formed in a strip shape and has flexibility; a recovery roller that winds a substrate that is fed from a supply roller; and a chamber that surrounds the slave a portion of the substrate between the supply roller and the take-up roller; the processing portion processes a portion of the substrate received in the chamber and surrounded by the chamber; and a driving portion that supplies the supply roller and the recovery roller and the chamber The processing unit relatively moves to carry one of the substrates into and out of the chamber in a direction intersecting the transport direction of the substrate from the supply roller to the recovery roller.

According to the aspect of the invention, the management load of the substrate during transportation can be reduced.

[First Embodiment]

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

1 is a view showing the overall structure of a substrate processing apparatus FPA of the present embodiment. A stereogram. 2 and 3 are perspective views showing a state in which a part of the substrate processing apparatus FPA is viewed from a different viewpoint from that of Fig. 1.

As shown in FIG. 1 to FIG. 3, the substrate processing apparatus FPA includes a transport unit 1 that transports a flexible substrate S, a processing unit 2 that performs predetermined processing on the substrate S, and an integrated control transport unit 1 And a control unit CONT of the processing unit 2. The substrate processing apparatus FPA is provided, for example, on a base (base) ST placed on the floor FL of the manufacturing plant.

The substrate processing apparatus FPA is a reel-to-reel method (hereinafter, abbreviated as "reel method") for performing various processes on the surface of the substrate S having a strip shape and having flexibility. The substrate processing apparatus FPA can be used to form a display element (electronic element) such as an organic EL element or a liquid crystal display element on the substrate S. Of course, the substrate processing apparatus FPA may be used in the case of forming components other than the components (for example, a solar cell, a color filter, a touch panel, etc.).

Hereinafter, in describing the configuration of the substrate processing apparatus FPA of the present embodiment, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figure, the plane parallel to the ground FL in the XYZ orthogonal coordinate system is assumed to be the XY plane. It is assumed that the direction in which the substrate S moves in the XY plane is the Y direction, and the direction orthogonal to the Y direction is the X direction. Further, it is assumed that the direction perpendicular to the floor surface FL (XY plane) is the Z-axis direction.

As the substrate S to be processed by the substrate processing apparatus FPA, for example, a resin film or a foil such as stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose can be used. Resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene dicarboxylate, stainless foil, etc. .

The dimension of the short side direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the longitudinal direction (the size of one roll) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the dimension of the short side direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. Further, the dimension of the substrate S in the longitudinal direction may be 10 m or less.

The substrate S is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a predetermined force to at least its own weight. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, the substrate S may be a strip-shaped substrate, or a plurality of unit substrates may be connected to form a strip.

It is preferable that the substrate S is subjected to a relatively high temperature (for example, about 200 ° C), and the size thereof is substantially unchanged (the thermal deformation is small), and the coefficient of thermal expansion is small. For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

The base ST has a base portion STa, a leg portion STb, and a support base STc. The base portion STa is placed on the floor surface FL. The leg portion STb is provided in plurality on the base portion STa, and supports the support base STc. The support base STc is formed, for example, in a rectangular shape, and has an opening portion in which the processing unit 2 is mounted in the X direction and a second portion that is provided to sandwich the opening portion. One opening STd. In other words, three opening portions STd are provided in the X direction on the support base STc. A guide rail 7r extending in parallel with the Y-axis direction is provided in the three opening portions STd. The guide rails 7r are provided in parallel with each other in the X direction in the respective opening portions STd.

The transport unit 1 includes a first rail 3, a second rail 4, a substrate feeding mechanism 5, a substrate winding mechanism 6, a rail drive mechanism (rail drive unit) 7, and a drum drive unit 8.

The first rail 3 is disposed along the side of the +Y side of the support table STc. The first rail 3 is divided into three unit rails 3A to 3C. Each of the unit rails 3A to 3C is disposed at a position corresponding to each of the three opening portions STd of the support table STc. The X-direction dimension of the unit rails 3A to 3C is a value corresponding to the X-direction dimension of each of the opening portions STd.

The second rail 4 is disposed along the side of the -Y side of the support table STc. The second track 4 is divided into three unit rails 4A to 4C. Each of the unit rails 4A to 4C is disposed at a position corresponding to each of the three opening portions STd of the support table STc in the same manner as the unit rails 3A to 3C described above. The X-direction dimension of the unit rails 4A to 4C is a value corresponding to the X-direction dimension of each of the opening portions STd, and is the same size as the X-direction dimension of the unit rails 3A to 3C.

The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are provided in the respective opening portions STd, and are supported by the guide rails 7r extending in the Y direction. In the configuration shown in Fig. 1, the unit rails 3A to 3C are supported by the +Y side end portions of the guide rails 7r, and the unit rails 4A to 4C are supported by the -Y side end portions of the guide rails 7r.

The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are arranged in parallel with the X direction, respectively. Also, due to the guide rail 7r and the Y-axis Since the unit rails 3A to 3C and the unit rails 4A to 4C are arranged to be parallel to each other while moving in the Y direction on the guide rail 7r while being parallel to each other. Thus, the first rail 3 and the second rail 4 are configured to be linearly movable by a guide rail 7r on a plane parallel to the XY plane.

The substrate feeding mechanism 5 is disposed on the first rail 3. The substrate delivery mechanism 5 has a roller support portion 5a and a supply roller 5b. The drum support portion 5a is connected to the first rail 3 so as to be movable in the X direction along the first rail 3. The drum support portion 5a is movable to the unit rails 3A to 3C constituting the first rail 3.

The supply roller 5b is rotatably supported by the roller support portion 5a. The supply roller 5b is supported such that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the supply roller 5b in a reel shape. By the rotation of the supply roller 5b, the substrate S wound around the supply roller 5b is sent out in the -Y direction. The supply roller 5b can be rotated by a motor or the like.

The substrate take-up mechanism 6 is disposed on the second rail 4. The substrate take-up mechanism 6 has a roller support portion 6a and a recovery roller 6b. The drum support portion 6a is connected to the second rail 4 so as to be movable in the X direction along the second rail 4. The drum support portion 6a can be moved to the unit rails 4A to 4C constituting the second rail 4 in the drum drive unit 8.

The recovery drum 6b is rotatably supported by the drum support portion 6a. The recovery drum 6b is supported such that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the recovery drum 6b in a reel shape. The substrate S is wound around the recovery drum 6b by the rotation of the recovery drum 6b. The recovery drum 6b can be rotated by a motor or the like.

The rail drive mechanism 7 moves the first rail 3 and the second rail 4 along the guide rail 7r Move in the Y direction. The rail drive mechanism 7 can drive the first rail 3 by the unit rails 3A, 3C, and drive the second rail 4 by the unit rails 4A, 4C. The control unit CONT can control the driving amount of the rail drive mechanism 7, the driving speed, the timing of driving, and the like. The rail drive mechanism 7 can bring the unit rail 3A and the unit rail 4A close to each other or separated from each other along the guide rail 7r. Further, the rail drive mechanism 7 can bring the unit rail 3C and the unit rail 4C close to each other or separated from each other along the guide rail 7r.

The drum drive unit 8 has a first drive unit 83 and a second drive unit 84. The first drive unit 83 moves the drum support portion 5a along the first rail 3 in the X direction and rotates the supply drum 5b. The second drive unit 84 moves the drum support portion 6a along the second rail 4 in the X direction and rotates the recovery drum 6b. The control unit CONT can individually or synchronously control the first drive unit 83 and the second drive unit 84. Moreover, the control unit CONT can control the driving amount of the first driving unit 83 and the second driving unit 84, the driving speed, the timing of driving, and the like.

As shown in FIG. 3, the processing unit 2 processes the processed surface (first surface) Sa of the substrate S on the moving path of the substrate S supplied from the substrate feeding mechanism 5 to the substrate winding mechanism 6. The processing unit 2 has a chamber device (chamber) CB, a chamber driving device 25, a processing device 10, a guiding device 30, and an alignment measuring device 50. Further, in the present embodiment, a printing machine is displayed as the processing device 10.

The chamber device CB is disposed between the first rail 3 and the second rail 4 (in the present embodiment, between the unit rail 3B and the unit rail 4B). The chamber device CB surrounds a casing of the substrate S disposed between the supply drum 5b and the recovery drum 6b. The chamber device CB has a first portion CB1 of a surface Sa (processed surface) provided on the -Z side of the substrate S and a second surface Sb provided on the +Z side of the substrate S. Part CB2. The chamber device CB connects the first portion CB1 and the second portion CB2 so as to be relatively separated in the Z direction.

The chamber device CB has passage portions 26 and 27 through which the substrate S passes. The passage portion 26 is formed in the opening portion of the +Y side wall portion of the chamber device CB. The passage portion 26 is constituted by a concave portion 26a formed in the first portion CB1 and a concave portion 26b formed in the second portion CB2. The passage portion 27 is formed in the opening portion of the -Y side wall portion of the chamber device CB. The passing portion 27 is constituted by a concave portion 27a formed in the first portion CB1 and a concave portion 27b formed in the second portion CB2. In a state where the first portion CB1 and the second portion CB2 are coupled, the state of the chamber device CB is opened by the passage portions 26 and 27 for this purpose. The substrate S sent from the supply roller 5b is carried into the chamber device CB via the passage portion 26, and is carried out from the chamber device CB via the passage portion 27.

The chamber driving device 25 has support columns (support portions) 25a and 25b, bridging members 25c and 25d, and elevating mechanisms 25e and 25f. The support post 25a is fixed to the support table (stage) STc of the base ST on the +Y side of the first rail 3. The support post 25b is fixed to the support table (stage) STc of the base ST to be closer to the -Y side than the second rail 4.

The bridging member 25c is supported by the support post 25a. The bridging member 25c is fixed to the +Y side outer wall of the first portion CB1 of the chamber device CB. The bridging member 25d is supported by the support post 25b. The bridging member 25d is fixed to the Y-side outer wall of the first portion CB1 of the chamber device CB.

The elevating mechanism 25e is provided on the support post 25a and is connected to the bridging member 25c. The elevating mechanism 25e has an actuator (not shown) that moves the bridging member 25c in the Z direction along the support post 25a. The lifting mechanism 25f is disposed on the support column 25b, and is connected Connected to the bridging member 25d. The elevating mechanism 25f has an actuator (not shown) that moves the bridging member 25d in the Z direction along the support post 25b. Examples of the actuator include a motor mechanism, a cylinder mechanism, and the like.

As described above, the first portion CB1 is configured to be supported from the outer side of the first rail 3 and the second rail 4 in the Y direction. Further, the first portion CB1 is configured to move integrally with the bridging members 25c and 25d in the Z direction by the elevating mechanisms 25e and 25f along the support columns 25a and 25b.

The processing device 10 is housed in, for example, the second portion CB2 in the chamber device CB. The processing apparatus 10 has various means for forming, for example, an organic EL element on the processed surface Sa of the substrate S. As such a device, for example, a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, a light-emitting layer forming device for forming a light-emitting layer, and the like can be given. More specifically, for example, a droplet applying device (for example, an inkjet coating device), a film forming device (for example, a vapor deposition device, a sputtering device, etc.), an exposure device, a developing device, a surface modifying device, and a washing machine are mentioned. Net device, etc. These devices are appropriately disposed along the transport path of the substrate S. In the present embodiment, the processing apparatus 10 has a transfer device (for example, a gravure printing machine, a flexographic printing machine, or the like) 11 formed by transferring a coating film onto the surface to be processed Sa.

The transfer device 11 includes a transfer roller 11a, a coating liquid storage portion 11b, and a film thickness adjusting portion 11c. The transfer roller 11a is in a state of being partially contaminated with the coating liquid 11d stored in the coating liquid storage portion 11b. The transfer roller 11a is set to be rotatable in this state. The transfer device 11 has a rotation drive mechanism (for example, a motor mechanism or the like) (not shown) that rotates the transfer roller 11a clockwise. The transfer device 11 is disposed in the space in the chamber device CB, for example, +Y in the center of the Y direction. side. Further, a cover portion 11e is provided in the +X side wall portion of the transfer roller 11a in the first portion CB1 of the chamber device CB. This cover portion 11e is formed to be larger in size than the transfer roller 11a when viewed from the X direction. Therefore, in a state where the lid portion 11e is opened, the transfer roller 11a can be made to enter the first portion CB1 in the X direction.

The guiding device 30 has a plurality of guiding rollers GR and a plurality of guiding pads GP for guiding the substrate S in the processing unit 2. A plurality of guide rollers GR are disposed along the transport path of the substrate S. The three guide rollers GR1 of the plurality of guide rollers GR function to press the processed surface Sa of the substrate S against the pressing roller of the transfer roller 11a. The three guide rollers GR1 can be moved in such a manner that the positional relationship does not change by a guide member (not shown).

Further, the three guide rollers GR2 of the plurality of guide rollers GR guide the back surface Sb of the substrate S to which the coating liquid has been transferred. Further, a plurality of (here, three) guide pads GP guide the processed surface Sa of the substrate S to which the coating liquid has been transferred. Each of the plurality of guiding pads GP has a plurality of unillustrated ejection ports for ejecting gas from the cylindrical guiding surface GPa, and is configured to form a gas layer on the guiding surface GPa. By this gas layer, the processed surface Sa of the substrate S can be guided in a non-contact manner on the guiding surface GPa. The guiding roller GR2 and the guiding pad GP are alternately arranged in the Y direction.

Further, the guide rollers GR3 and GR4 are provided at fixed positions in the second portion CB2. The guide roller GR5 is disposed on the +Y side of the second portion CB2 so as to be movable in the Z direction. The guide roller GR5 is configured to sandwich the substrate S between the guide roller GR3 and the guide roller GR3.

The alignment measuring device 50 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S based on the measurement result. The alignment measuring device 50 has an alignment camera that detects an edge portion or an alignment mark of the substrate S, or an adjustment device that adjusts at least one of the position and posture of the substrate S based on the detection result of the alignment camera. The position measurement and the speed measurement of the substrate S can also be performed by projecting laser light onto the substrate S by means of an optical mouse, and photoelectrically detecting the change of the speckle pattern generated on the substrate S.

Next, the operation of the substrate processing apparatus FPA configured as described above will be described. 4 to 14 are views showing the operation of the substrate processing apparatus FPA.

First, the operation of traversing the substrate S between the supply roller 5b and the recovery roller 6b in the transport unit 1 will be described.

As shown in FIG. 4, the control unit CONT arranges the substrate feeding mechanism 5 on the unit rail 3A of the first rail 3, and arranges the substrate winding mechanism 6 on the unit rail 4A of the second rail 4. By this operation, the supply roller 5b and the recovery roller 6b are arranged to face each other in the Y direction.

Next, the substrate S wound in a roll shape is mounted on the supply roller 5b. For example, the lead Lf having the configuration shown in FIG. 4 is attached to the front end Sf of the substrate S, but the configuration of the lead Lf may be omitted. After the reel-shaped substrate S is mounted on the supply roller 5b, the control unit CONT moves the unit rail 4A of the second rail 4 in the +Y direction. By this action, the supply roller 5b and the recovery roller 6b are close to each other.

The control unit CONT rotates the supply roller 5b by the first drive unit 83 when the distance between the supply roller 5b and the recovery roller 6b becomes the first distance D1. By this operation, the front end Sf of the substrate S is sent to the side of the recovery drum 6b, and the front end Sf of the substrate S reaches the recovery drum 6b and is wound around the recovery drum 6b. In addition, the front end Sf of the substrate S is wound around the recovery roller 6b. Although it is also possible to automate, the front end Sf may be attached to the recovery drum 6b by hand using a fixing belt or the like.

After the control unit CONT is hung on the recovery roller 6b at the front end Sf of the substrate S, the supply roller 5b is rotated, and the unit rail 4A is moved in the -Y direction until the substrate take-up mechanism 6 reaches the original position. By this action, the front end Sf of the substrate S is pulled out in the -Y direction while being hung on the recovery roller 6b.

After the substrate take-up mechanism 6 reaches the original position, the control unit CONT stops the movement of the substrate take-up mechanism 6. Thereafter, as shown in FIG. 5, the control unit CONT moves the second portion CB2 of the chamber device CB in the +Z direction, and forms a gap between the first portion CB1 and the second portion CB2 through which the substrate S can pass. At this time, the substrate S traversed between the supply roller 5b and the recovery roller 6b is given a moderate tension in the Y direction, so that the substrate S can pass through the gap between the first portion CB1 and the second portion CB2. The tension of the substrate S can be adjusted by controlling the substrate take-up mechanism 6.

In this state, as shown in FIG. 6, the control unit CONT moves the substrate feeding mechanism 5 and the substrate winding mechanism 6 to the unit rail 3B and the unit rail 4B in synchronization with each other by the first driving units 83 and 84. In this state, the substrate S is disposed at a position sandwiched by the concave portions 26a and 27a of the first portion CB1 and the concave portions 26b and 27b of the second portion CB2 in the Z direction.

After the substrate feeding mechanism 5 and the substrate winding mechanism 6 are placed on the unit rails 3B and 4B, respectively, as shown in FIG. 7, the control unit CONT moves the second portion CB2 in the -Z direction to make the first portion CB1 and the first portion Two parts of the CB2 link. In this state, the first portion CB1 is in contact with the second portion CB2, and the gap between the first portion CB1 and the second portion CB2 is plugged. Substrate S, that is, in the passing portion 26 enters the interior of the chamber device CB and exits the chamber device CB at the passage portion 27.

After the first portion CB1 is coupled to the second portion CB2, the control unit CONT prepares the guiding device 30 in the chamber device CB. Specifically, first, as shown in FIG. 8 , the guide rollers GR1 and GR2 are placed on the +Z side of the substrate S, and the guide pad GP is placed on the -Z side of the substrate S. As shown in FIG. 3, the substrate feeding mechanism 5 and the substrate winding mechanism 6 are respectively provided with lifts 5d and 6d for adjusting the heights of the supply roller 5b and the recovery roller 6b, and the height is adjusted to extend from the substrate feeding mechanism 5 to the substrate winding mechanism. The substrate S of 6 becomes substantially horizontal.

From this state, as shown in FIG. 9, the guide roller GR1 is moved in the -Z direction, and the substrate S is pressed toward the -Z side, and the processed surface Sa is brought into contact with the transfer roller 11a. Further, the guide roller GR2 is moved in the -Z direction and the guide pad GP is moved to the +Z side. By this action, the substrate S is guided more than once in the chamber device CB in the Z direction at the -Y side of the central portion of the chamber device CB. Therefore, when viewed from the Y direction, the substrate S is conveyed in an overlapped state.

The control unit CONT rotates the supply roller 5b and the recovery roller 6b at the processing timing of the transfer device 11, and rotates the transfer roller 11a. By this operation, the substrate S is fed from the supply roller 5b and the substrate S is taken up by the recovery roller 6b. In this state, the coating film of the transfer device 11 is transferred to the processed surface Sa of the substrate S. .

As shown in FIG. 9, since the surface to be processed Sa of the support substrate S is the guide surface GPa of the guide pad GP, the substrate S can be conveyed in a non-contact state with respect to the coating film. Further, a portion of the substrate S guided by the guide roller GR2 and the guide pad GP may be dried using a drying device such as a heating device.

The control unit CONT adjusts the moving speed of the substrate S moving from the supply roller 5b to the recovery roller 6b in accordance with the processing speed of the transfer device 11. As shown in FIG. 10, the driving speeds of the first driving portion 83 and the second driving portion 84 are adjusted in accordance with the winding diameter R1 of the substrate S wound on the supply roller 5b and the winding diameter R2 of the substrate S wound around the recovery roller 6b. By this operation, the substrate S is transported while the transport speed is constant. The speed monitoring of the substrate S is also performed by measuring the timing (time) of the alignment marks provided on the substrate S by the alignment measuring device 50 of FIG. Further, the lifts 5d and 6d may be adjusted in accordance with the change in the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.

The control unit CONT can also adjust the distance between the supply roller 5b and the recovery roller 6b in accordance with the processing position or size of the transfer device 11. In this case, the control unit CONT moves the unit rail 3B or the unit rail 4B to the Y direction by the rail drive mechanism 7, for example. A part of constituent elements of the display element is sequentially formed on the substrate S by the transfer device 11.

Fig. 11 is a view showing a state of the chamber device CB in a state in which the processing of the substrate S is completed. From this state, as shown in Fig. 12, the control unit CONT moves the second portion CB2 of the chamber device CB toward the +Z side, and a gap through which the substrate S can pass is formed between the first portion CB1 and the second portion CB2.

In this state, the control unit CONT synchronizes the substrate feeding mechanism 5 and the substrate winding mechanism 6 by the synchronous control of the first driving units 83 and 84 as shown in FIG. 13, and moves to the unit rail 3C and the unit rail 4C, respectively. . By this operation, the substrate S is in a state of being retracted from the position sandwiched by the first portion CB1 and the second portion CB2 toward the +X side. After the substrate feeding mechanism 5 and the substrate winding mechanism 6 are disposed on the unit rail 3C and the unit rail 4C, the substrate feeding mechanism 5 and the substrate are placed. The movement of the take-up mechanism 6 is stopped.

After the movement of the substrate feeding mechanism 5 and the substrate winding mechanism 6 is stopped, the control unit CONT moves the unit rail 4C in the +Y direction while rotating the recovery drum 6b. By this action, the recovery roller 6b winds up the substrate S, and the supply roller 5b and the recovery roller 6b come close again.

The control unit CONT rotates the supply roller 5b by the second drive unit 84 after the distance between the supply roller 5b and the recovery roller 6b becomes the second distance D2. In this case, the second distance D2 can be made equal to, for example, the first distance D1 described above. By this operation, the rear end Se of the substrate S is sent to the side of the recovery drum 6b, and the rear end Se of the substrate S reaches the recovery drum 6b and is wound around the recovery drum 6b. Further, at the rear end Se of the substrate S, the lead Le is attached to the configuration shown in Fig. 5, but the configuration of the lead Le may be omitted.

After the control unit CONT is hung on the recovery roller 6b at the rear end Se of the substrate S, the unit rail 4C is moved in the -Y direction until the substrate take-up mechanism 6 reaches the original position. After the substrate take-up mechanism 6 reaches the original position, the reel-shaped substrate S wound on the recovery roller 6b moves to the next processing device. Alternatively, when all the processing has been performed on the substrate S, it can be removed and recovered from the recovery drum 6b.

As described above, according to the present embodiment, the supply roller 5b and the recovery roller 6b are moved relative to the chamber device CB and the transfer device 11, so that the substrate S is relatively opposed to the substrate S of the recovery roller 6b from the supply roller 5b. Since the moving direction is carried in and out of the chamber device CB, the size of the substrate S that is traversed until being taken up is kept constant, and the substrate S is carried into the processing apparatus 10, and the substrate S is processed. . Thereby, since the size of the substrate S that is traversed until being taken up can be suppressed from becoming long, Therefore, the management load of the substrate S at the time of conveyance can be reduced.

[Second embodiment]

Next, a second embodiment of the present invention will be described.

Fig. 15 is a cross-sectional view showing the configuration of a substrate processing apparatus FPA2 of the present embodiment.

As shown in Fig. 15, in the present embodiment, a pressure adjusting device (pressure adjusting portion) 60 such as a pump is connected to the chamber device CB, and the pressure inside the chamber device CB can be adjusted (for example, pressurized or decompressed). . The chamber device CB is provided with a plasma device 12 as a processing device 10, for example, which is processed under a reduced pressure environment. Differential exhaust chambers 61 and 62 are provided on the +Y side of the chamber device CB, and differential exhaust chambers 63 and 64 are provided on the -Y side of the chamber device CB. A pump is also connected to each of the differential exhaust chambers 61 to 64.

The differential exhaust chambers 61 to 64 have first portions 61a to 64a disposed on the -Z side of the substrate S, and second portions 61b to 64b disposed on the +Z side of the substrate S, respectively. The first portions 61a to 64a of the differential exhaust chambers 61 to 64 are integrated with the first portion CB1 of the chamber device CB (third portion CB3). The second portions 61b to 64b of the differential exhaust chambers 61 to 64 are integrated with the second portion CB2 of the chamber device CB (fourth portion CB4). The third portion CB3 and the fourth portion CB4 are arranged to be separable in the Z direction.

A sealing mechanism 65 is provided between the third portion CB3 and the fourth portion CB4. The sealing mechanism 65 is configured to seal the inside of each of the differential exhaust chambers 61 to 64, the inside of the chamber device CB, and the substrate S in a state where the third portion CB3 is connected to the fourth portion CB4 (airtight state). ).

Fig. 16 is a view showing the configuration of the sealing mechanism 65.

As shown in FIG. 16, the sealing mechanism 65 has a first air cushion mechanism 65A and a second air cushion mechanism 65B that sandwich the substrate S in the Z direction, and a pressing mechanism 70 that presses the first air cushion mechanism 65A toward the second air cushion mechanism 65B side.

The first air cushion mechanism 65A has a pad 66 provided with an air ejection port 66a and an air suction port 66b on the surface facing the -Z side, and a supply side connecting portion 67 connected to an unillustrated air supply portion that supplies air such as nitrogen gas, and It is connected to the suction side connection portion 68 of a suction pump or the like (not shown). The air ejection port 66a is connected to the supply side connecting portion 67 via a flow path in the pad 66. The air suction port 66b is connected to the suction side connecting portion 68 via a flow path in the pad 66.

The second air cushion mechanism 65B includes a pad 166 having an air ejection port 166a and an air suction port 166b on a surface facing the +Z side, a supply side connecting portion 167 connected to an unillustrated air supply portion that supplies air such as nitrogen gas, and It is connected to the suction side connection portion 168 of a suction pump or the like (not shown). The air ejection port 166a is connected to the supply side connecting portion 167 via a flow path in the pad 166. The air suction port 166b is connected to the suction side connecting portion 168 via a flow path in the pad 166.

In the present embodiment, with such a configuration, since the differential exhaust chamber is provided while adjusting the pressure inside the chamber device CB, the pressure inside the chamber device CB can be stabilized. Moreover, since the third portion CB3, the fourth portion CB4, and the substrate S can be closed with a high degree of sealing, it is possible to prevent foreign matter from entering the chamber device CB or the differential exhaust chambers 61 to 64.

[Third embodiment]

Next, a third embodiment of the present invention will be described.

Fig. 17 is a cross-sectional view showing the configuration of a substrate processing apparatus FPA3 of the present embodiment.

As shown in Fig. 17, in the present embodiment, the storage chamber opening and closing mechanism SL is provided in each of the first portion CB1 and the second portion CB2 of the chamber device CB. The accommodating chamber opening and closing mechanism SL has a sliding mechanism (opening and closing portion) SL1 attached to the first portion CB1 and a sliding mechanism (opening and closing portion) SL2 attached to the second portion CB2.

The slide mechanism SL1 has a pair of slide members 71a and 71b. The sliding members 71a and 71b are provided to be movable in the X direction. The sliding members 71a and 71b are provided to open and close the storage chamber RM1 of the first portion CB1. In a state where the sliding members 71a and 71b are opened, the storage chamber RM1 is open to the atmosphere. The storage chamber RM1 is sealed in a state where the sliding members 71a and 71b are closed.

In a state where the sliding members 71a and 71b are opened, the sliding member 71a is housed in a sliding housing portion (accommodating portion) 73a provided in the flange portion 73 of the first portion CB1, and the sliding member 71b is housed in the flange portion provided in the first portion CB1. A sliding accommodating portion (accommodating portion) 74a of 74. As described above, the first portion CB1 has a configuration in which the flange portions 73 and 74 for connecting the second portion CB2 serve as the accommodating portions of the sliding members 71a and 71b.

The slide mechanism SL2 has a pair of slide members 72a and 72b. The sliding members 72a and 72b are provided to be movable in the X direction. The sliding members 72a and 72b are provided to open and close the storage chamber RM2 of the second portion CB2. When the sliding members 72a and 72b are opened, the storage chamber RM2 is open to the atmosphere, but the sliding members 72a and 72b function to maintain the reduced pressure state of the storage chamber RM2. The storage chamber RM2 is sealed in a state where the sliding members 72a and 72b are closed.

In a state where the sliding members 72a and 72b are opened, the sliding member 72a is housed in a sliding housing portion (accommodating portion) 75a provided in the flange portion 75 of the second portion CB2, and the sliding member 72b is housed in the second portion CB2. Edge 76 The sliding storage portion (accommodating portion) 76a is slid. Thus, the second portion CB2 has a configuration in which the flange portions 75 and 76 for connection to the first portion CB1 serve as the accommodating portions of the sliding members 72a and 72b.

A connecting mechanism 77 is provided in the first portion CB1. The connection mechanism 77 has a vacuum gasket 77a and a gas seal mechanism 77b. A connection mechanism 78 is provided in the second portion CB2. The connecting mechanism 78 has a vacuum gasket 78a and a gas seal mechanism 78b. The first portion CB1 and the second portion CB2 are connected in a state in which the connection mechanisms 77 and 78 are sealed.

Further, a lifting mechanism 79 is connected to the first portion CB1, and a lifting mechanism 80 is connected to the second portion CB2. With this configuration, the first portion CB1 and the second portion CB2 can be lifted and lowered individually in the Z direction. In addition, although not shown in FIG. 17, the differential exhaust chambers 85 and 86 are integrally attached to the +Y side and the -Y side of the chamber apparatus CB (refer FIG. 18, etc.).

Further, the substrate processing apparatus FPA3 has the first processing unit 13 housed in the first portion CB1 as the processing device 10 and the second processing device 14 housed in the second portion CB2. Further, the configuration of either of the first processing device 13 and the second processing device 14 may be omitted. Pressure adjusting devices 81 and 82 such as a vacuum pump are connected to the first portion CB1 and the second portion CB2, respectively. As the first processing device 13 and the second processing device 14, a plasma device or the like that performs processing in a reduced pressure environment is provided.

Next, the operation of the substrate processing apparatus FPA3 configured as described above will be described. In the present embodiment, an operation when the substrate S is exchanged from the state in which the processing of the substrate S is completed will be described as an example.

Figure 18 is a view showing a chamber device in a state in which the processing of the substrate S has ended. The look of CB. In a state where the processing of the substrate S has been completed, the inside of the chamber device CB is in a decompressed state. When the first portion CB1 is separated from the second portion CB2 in this state, it is necessary to return the inside of the chamber device CB to atmospheric pressure. When the next substrate S is processed, it is necessary to again reduce the inside of the chamber device CB to a reduced pressure state, so that it takes time relatively.

Therefore, in the present embodiment, as shown in Fig. 19, the control unit CONT first turns the slide members 72a and 72b provided in the second portion CB2 to the closed state. By this operation, the storage chamber RM2 (see FIG. 17) of the second portion CB2 is sealed, and the decompressed state of the storage chamber RM2 is maintained.

After closing the sliding members 72a and 72b or simultaneously with the closing operation of the sliding members 72a and 72b, the control unit CONT closes the sliding members 71a and 71b provided in the first portion CB1 as shown in Fig. 20 . By this operation, the storage chamber RM1 (see FIG. 17) of the first portion CB1 is also sealed, and the decompressed state of the storage chamber RM1 is maintained. At this time, since the space sandwiched by the sliding members 71a and 71b and the sliding members 72a and 72b is in a decompressed state, the air pressure system that restores only the space to the atmospheric pressure is operated.

In this state, after the control unit CONT restores the pressures of the differential exhaust chambers 85 and 86 to atmospheric pressure, as shown in Fig. 21, the first portion CB1 is moved to the -Z side, and the first portion CB1 is separated from the second portion CB2. . By this operation, the space in which the sliding members 71a and 71b and the sliding members 72a and 72b are separated is opened, and the storage chamber RM1 of the first portion CB1 or the storage chamber RM2 of the second portion CB2 is not open to the atmosphere.

After the first portion CB1 is separated from the second portion CB2, the control unit CONT sends out the substrate waiting on the -X side of the chamber device CB as shown in FIG. The mechanism 5 and the substrate take-up mechanism 6 are moved in the +X direction, so that a new substrate S is disposed between the first portion CB1 and the second portion CB2. Thereafter, the first portion CB1 is moved to the +Z side to connect the first portion CB1 with the second portion CB2.

When the first portion CB1 is connected to the second portion CB2, the control unit CONT activates the air pressure system to discharge the atmosphere remaining in the narrow space sandwiched by the sliding members 71a and 71b and the sliding members 72a and 72b, and the narrow space becomes The sliding members 71a and 71b are opened, and the sliding members 72a and 72b are opened, in a state of being reduced in the same manner as in the storage chamber RM1 of the first portion CB1 or the storage chamber RM2 of the second portion CB2.

Further, in the substrate feeding mechanism 5 of Figs. 18 to 22, the substrate S is pulled out from the lower side of the reel, and the surface opposite to the processing surface of the substrate S of Fig. 17 is processed.

In the present embodiment, the separation and connection of the first portion CB1 and the second portion CB2 are performed only by the movement of the first portion CB1, but only the movement of the second portion CB2 or the first portion CB1 and the second portion CB2 may be used. Move to proceed.

As described above, according to the present embodiment, it is possible to carry in a new substrate S while maintaining the pressure-reduced state of the storage chambers RM1 and RM2, and start processing on the substrate S. Thereby, the substrate processing apparatus FPA3 with high productivity can be obtained.

[Fourth embodiment]

Next, a fourth embodiment of the present invention will be described.

Fig. 23A is a view showing the configuration of a differential exhaust device (differential exhaust chamber 1) 100 of the present embodiment.

As shown in Fig. 23A, in the present embodiment, the differential exhaust device 100 is separately disposed, but the differential exhaust device 100 is also shown in Figs. The differential exhaust chambers 85 and 86 are assembled. The differential exhaust device 100 is configured to be separated into the first portion 101 and the second portion 102. The differential exhaust device 100 is formed to have a long side in the Z direction.

The first portion 101 is provided with a partition portion 101C that partitions the inside of the first portion 101 into two storage chambers 101A and 101B. Further, in the first portion 101, opening and closing members 105 and 106 for individually opening and closing the storage chambers 101A and 101B are provided. In a state in which the opening and closing members 105 and 106 are closed, the storage chambers 101A and 101B are in a sealed state.

The second portion 102 is provided with a partition portion 102C that partitions the inside of the second portion 102 into two storage chambers 102A and 102B. Further, in the second portion 102, opening and closing members 107 and 108 for individually opening and closing the storage chambers 102A and 102B are provided. When the opening and closing members 107 and 108 are closed, the storage chambers 102A and 102B are sealed. The second portion 102 is formed to have a larger dimension in the Z direction than the first portion 101.

In the differential exhaust device 100, the volumes of the storage chambers 102A and 102B are larger than the volumes of the storage chambers 101A and 101B. For example, the blowing port of the air which dries the substrate S may be disposed in the storage chambers 102A and 102B. Further, a pressure adjusting mechanism for adjusting the pressure of the storage chambers 102A and 102B or an environmental gas adjusting mechanism for adjusting the environmental gases of the storage chambers 102A and 102B may be provided.

Guide rollers (or guide pads GP) 103 and 104 for guiding the substrate S are respectively disposed in the housing chambers 101A and 101B. The guide rollers 103 and 104 are arranged to be movable in the Z direction so as to straddle between the housing chambers 102A and 102B of the second portion 102.

A sealing mechanism 109 is disposed between the first portion 101 and the second portion 102. Similarly to the configuration shown in FIG. 16, the sealing mechanism 109 has a first pad 109a provided on the -Z side end surface of the first portion 101 and a second pad 109b provided on the +Z side end surface of the second portion 102. The first pad 109a and the second pad 109b are provided at positions sandwiching the substrate S. Similarly to the previous FIG. 16, the first pad 109a and the second pad 109b have a gas layer forming portion (not shown) in which a gas layer is formed on the surface.

When the differential exhaust device 100 configured as described above is used, as shown in Fig. 23B, the first portion 101 and the second portion 102 are connected so as to sandwich the substrate S so as to function as the sliding members 71a, 71b shown in Fig. 17. The opening and closing members 105 to 108 having the same functions as those of 72a and 72b are turned on. Thereafter, the rollers 103 and 104 are moved to the -Z side. By this action, the substrate S is sandwiched by the gas layer of the first pad 109a and the gas layer of the second pad 109b, and is held in a non-contact state.

As described above, according to the present embodiment, the differential exhaust device 100 is formed to have a long side in the Z direction, whereby the installation area of the differential exhaust device 100 can be reduced. In this case, the differential exhaust device 100 can be separated into the first portion 101 and the second portion 102 while maintaining the pressure or the ambient gas of the storage chambers 102A and 102B having a large volume, and the difference in the loading of the substrate S can be omitted. The time taken to reset or reduce the pressure or ambient gas in the exhaust device 100 is reset. Therefore, the substrate S can be efficiently processed.

The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

For example, in the first embodiment shown in FIGS. 8 and 9, the guide roll is used. The configuration in which the cylinders GR1, GR2, GR5 and the guide pad GP are moved in the Z direction is described as an example, but it is not limited thereto, and can be modified as shown in FIG.

As shown in Fig. 24, the guide rollers GR1, GR2, GR5 and the guide pad GP are moved to a position inclined in the θ X direction. When the guide rollers GR1, GR2, GR5 and the guide pad GP are moved, as shown in Fig. 25, compared with the configuration of the first embodiment, space can be saved in the Z direction.

Further, the positional relationship between the three guide rollers GR1 that press the substrate S against the transfer roller 11a is the same as the positional relationship of the guide roller GR1 of the first embodiment. Therefore, the conditions for transferring the coating film on the substrate S by the transfer roller 11a are the same as those of the first embodiment.

Moreover, as shown in FIG. 26, each of the bearings of the three guide rollers GR1 may be fixed to each other by the fixing member 200. In this case, as shown in Fig. 27, by adjusting the angular position of the fixing member 200 around the rotation axis of the transfer cylinder 11a, the substrate S can be brought into contact with any position of the transfer roller 11a. Therefore, for example, the substrate S can be brought into close contact with the film thickness adjusting portion 11c in accordance with the type of the coating liquid. Thereby, the substrate S can be transferred to the substrate S while the coating liquid adhering to the transfer roller 11a is not dried.

Further, for example, as shown in FIG. 28, the configuration of the photo sensor 300 for detecting the substrate S may be disposed in at least one of the passing portion 26 and the passing portion 27 of the chamber device CB.

Further, for example, as shown in FIG. 28, a configuration may be employed in the chamber apparatus CB in which the drying unit 305 has an injection unit 303 that ejects a dry gas in the X direction. In this case, the airflow adjusting plate that restricts the flow of the drying gas from the ejection portion 303 to the transfer roller 11a side may be provided in the drying portion 305. (Airflow adjustment unit) 301.

Further, between the guide roller GR2 and the +Z side wall portion (top portion) of the second portion CB2, a snake belly 302 that expands and contracts in accordance with the movement of the guide roller GR2 may be provided. The snake abdomen 302 may also be disposed between the guide pad GP and the -Z side wall portion (bottom portion) of the first portion CB1. According to this configuration, in the state in which the substrate S is hung on the guide roller GR2 and the guide pad GP, the elongated bellows is disposed at a position along the path of the substrate S. Therefore, the airflow in the Y direction is restricted by the snake belly 302. In this manner, the flow path or the air flow of the drying gas can be adjusted by arranging the air flow adjusting plate 301 or the snake belly 302.

Further, as shown in FIG. 29, a configuration of a sub-chamber device (preparation processing unit) SCB may be disposed on the side of the substrate S in the moving direction (Y direction) with respect to the chamber device CB. The sub chamber device SCB has the same configuration as the chamber device CB. Further, the sub-chamber device SCB houses the same constituent elements as the components (including the processing device 10) housed in the chamber device CB. Therefore, even in the case where the chamber device CB is stopped, the same processing as that of the chamber device CB can be performed in the sub chamber device SCB. In this case, although the processing by the chamber device CB is normally performed, the substrate S that has been processed passes through the sub-chamber device SCB and goes out in the +X direction, but when the chamber device CB is stopped and the ink is filled, it is switched to The substrate S passes through the chamber device CB and is processed by the sub-chamber device SCB.

1‧‧‧Transportation Department

2‧‧‧Processing Department

5b‧‧‧Supply roller

6b‧‧‧Recycling roller

10‧‧‧Processing device

25‧‧‧Cell drive

FPA‧‧‧ substrate processing device

S‧‧‧Substrate

CONT‧‧‧Control Department

CB‧‧‧ chamber device

GR‧‧‧ Guide roller

GP‧‧‧Guide Pad

Fig. 1 is a view showing the configuration of a substrate processing apparatus according to a first embodiment of the present invention.

Figure 2 is a view showing a part of the substrate processing apparatus of the embodiment. Figure.

Fig. 3 is a view showing a configuration of a part of a substrate processing apparatus of the embodiment.

Fig. 4 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 5 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 6 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 7 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 8 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 9 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 10 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 11 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 12 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 13 is a view showing the operation of the substrate processing apparatus of the embodiment.

Figure 14 is a view showing the operation of the substrate processing apparatus of the embodiment. Figure.

Fig. 15 is a view showing the configuration of a substrate processing apparatus according to a second embodiment of the present invention.

Fig. 16 is a view showing a configuration of a part of the substrate processing apparatus of the embodiment.

Figure 17 is a cross-sectional view showing the configuration of a substrate processing apparatus according to a third embodiment of the present invention.

Fig. 18 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 19 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 20 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 21 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 22 is a view showing the operation of the substrate processing apparatus of the embodiment.

Fig. 23A is a view showing the configuration of a substrate processing apparatus according to a fourth embodiment of the present invention.

Fig. 23B is a view showing the configuration of a substrate processing apparatus according to a fourth embodiment of the present invention.

Fig. 24 is a view showing another configuration of the substrate processing apparatus of the present invention.

Fig. 25 is a view showing another configuration of the substrate processing apparatus of the present invention.

Fig. 26 is a view showing another configuration of the substrate processing apparatus of the present invention.

Fig. 27 is a view showing another configuration of the substrate processing apparatus of the present invention.

Fig. 28 is a view showing another configuration of the substrate processing apparatus of the present invention.

Fig. 29 is a view showing another configuration of the substrate processing apparatus of the present invention.

1‧‧‧Transportation Department

2‧‧‧Processing Department

3‧‧‧First track

3A~3C‧‧‧unit rail

4‧‧‧second track

4A~4C‧‧‧unit rail

5‧‧‧Substrate delivery mechanism

6‧‧‧Substrate take-up mechanism

7‧‧‧ rail drive mechanism

7r‧‧‧ Guide rail

8‧‧‧Drum drive department

26,27‧‧

26a, 26b, 27a, 27b‧‧‧ recess

83‧‧‧First Drive Department

84‧‧‧Second drive department

CB‧‧‧ chamber device

CB1‧‧‧Part I

CB2‧‧‧ Part II

CONT‧‧‧Control Department

FL‧‧‧ Ground

FPA‧‧‧ substrate processing device

S‧‧‧Substrate

ST‧‧‧Abutment

STa‧‧‧Base Department

STb‧‧‧foot

STc‧‧‧support table

STd‧‧‧ openings

Claims (26)

A substrate processing apparatus comprising: a supply roller, wherein a flexible strip-shaped substrate is wound in a longitudinal direction and fed in the longitudinal direction; and a recovery roller is disposed apart from the longitudinal direction of the supply roller, and is taken up from the supply roller The substrate is supplied from the supply roller; the chamber has a movement path of the substrate between the supply roller and the recovery roller, and is configured to be separable into a first portion disposed on the first surface side of the substrate and disposed on the substrate a second portion of the second surface side of the substrate surrounds one of the substrates; and the processing portion performs a predetermined process on a portion of the substrate that is housed in the chamber and surrounded by the chamber; and a driving portion that causes the supply roller And the recovery drum moves relative to the chamber and the processing unit, and carries one of the substrates into and out of the chamber in a direction intersecting the moving direction of the substrate in the moving path. The substrate processing apparatus according to claim 1, further comprising a stage for supporting the supply roller and the recovery roller; wherein the first portion is supported by the stage. The substrate processing apparatus according to claim 2, wherein the stage has a support portion for supporting the first portion, and the support portion is provided with a pair of positions between the supply roller and the recovery roller in a moving direction of the substrate . The substrate processing package of any one of claims 1 to 3 Further, the moving mechanism further includes the moving mechanism that separates the first portion from the second portion in a direction orthogonal to the first surface or the second surface of the substrate The method moves relatively; the moving mechanism performs relative movement between the first portion and the second portion in synchronization with loading or unloading of the substrate. The substrate processing apparatus according to claim 4, wherein at least one of the first portion and the second portion has an opening and closing portion that opens and closes the internal space. The substrate processing apparatus according to claim 5, further comprising a pressure adjusting unit capable of individually adjusting a pressure of the internal space of the first portion and a pressure of the internal space of the second portion. The substrate processing apparatus according to claim 5, wherein the opening and closing portion is formed by a movable sliding member, and the first portion and the second portion respectively have a flange portion for accommodating the sliding member. The substrate processing apparatus according to any one of claims 1 to 3, wherein the chamber has a passage portion through which the substrate passes through a wall portion at both ends in the moving direction of the substrate. The substrate processing apparatus according to claim 8, further comprising a photosensor provided in the passing portion and detecting the substrate. The substrate processing apparatus according to claim 4, wherein the processing unit has a transfer roller that transfers a coating liquid to the substrate. A substrate processing apparatus according to claim 10, wherein the front The processing unit has three pressing rollers that press the substrate toward the transfer roller. The substrate processing apparatus of claim 11, wherein the three pressing rollers are fixed in position to each other. The substrate processing apparatus of claim 12, wherein the three pressing cylinders are provided to be movable to press the substrate at different positions in the transfer cylinder. The substrate processing apparatus according to claim 10, further comprising a drying unit that dries the coating liquid transferred to the substrate. The substrate processing apparatus according to claim 14, wherein the drying unit has an ejection unit that ejects a dry gas from the substrate in a direction intersecting the moving direction of the substrate. The substrate processing apparatus according to claim 15, wherein the drying unit has an air flow adjusting unit that adjusts a flow of the drying gas between the injection unit and the transfer roller. The substrate processing apparatus according to claim 16, further comprising: a plurality of guide rollers disposed on the first surface side and the second surface side of the substrate, and the substrate is wound; the airflow adjusting unit has a plurality of The aforementioned guiding roller is provided with a snake belly. The substrate processing apparatus according to any one of claims 1 to 3, further comprising a plurality of guide rollers that are disposed on the first surface side and the second surface side of the substrate and that wind the substrate. For example, the substrate processing apparatus of claim 18, wherein The plurality of guide rollers are alternately disposed on the first surface side of the substrate and the second surface side of the substrate in a moving direction of the substrate. The substrate processing apparatus according to any one of claims 1 to 3, wherein a wall portion disposed on a side of the substrate in a moving direction of the substrate is provided with a lid portion for allowing the processing portion to enter and exit. The substrate processing apparatus according to any one of claims 1 to 3, further comprising a preliminary processing unit that performs a process similar to the processing unit on the substrate while the chamber is disposed on a side of the substrate in a moving direction . The substrate processing apparatus according to claim 21, wherein the driving unit is capable of moving the supply roller and the recovery roller between the processing unit and the preliminary processing unit. The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a first rail supporting the supply roller so that the supply roller can move in a direction intersecting a moving direction of the substrate; The rail supports the recovery roller such that the recovery roller can move in a direction intersecting the moving direction of the substrate, and the rail drive unit drives at least one of the first rail and the second rail. The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a pressure adjusting unit that adjusts a pressure inside the chamber; and a differential exhaust chamber that is disposed on the substrate with respect to the chamber Mobile party At least one of the upstream side and the downstream side. The substrate processing apparatus of claim 24, wherein the chamber and the differential exhaust chamber are separated into a third portion disposed on a first surface side of the substrate and disposed on the substrate a fourth portion of the two sides; the third portion and the fourth portion are respectively integrally formed; and further comprising a sealing mechanism for blocking the third portion and the fourth portion between the third portion and the fourth portion a gas layer with a gap between the parts. A substrate processing apparatus according to claim 24, further comprising a guide roller.