TWI627120B - Component manufacturing device - Google Patents

Component manufacturing device Download PDF

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Publication number
TWI627120B
TWI627120B TW106118850A TW106118850A TWI627120B TW I627120 B TWI627120 B TW I627120B TW 106118850 A TW106118850 A TW 106118850A TW 106118850 A TW106118850 A TW 106118850A TW I627120 B TWI627120 B TW I627120B
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TW
Taiwan
Prior art keywords
sheet substrate
guide roller
substrate
guide
central axis
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Application number
TW106118850A
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Chinese (zh)
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TW201733890A (en
Inventor
Tomonari Suzuki
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Nikon Corp
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Publication of TWI627120B publication Critical patent/TWI627120B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/04Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/32Arrangements for turning or reversing webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/02Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/0204Sensing transverse register of web
    • B65H23/0216Sensing transverse register of web with an element utilising photoelectric effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/02Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/032Controlling transverse register of web
    • B65H23/038Controlling transverse register of web by rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/30Orientation, displacement, position of the handled material
    • B65H2301/31Features of transport path
    • B65H2301/311Features of transport path for transport path in plane of handled material, e.g. geometry
    • B65H2301/31122Omega-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2553/00Sensing or detecting means
    • B65H2553/40Sensing or detecting means using optical, e.g. photographic, elements
    • B65H2553/42Cameras

Abstract

本發明之搬送裝置,具備:使之斜向彎折、以將片材基板之搬送方向從第一方向變換為與該第一方向不同之第二方向之第一導件,將從第二方向搬送而來之片材基板加以斜向彎折以將片材基板之搬送方向從第二方向換為與第二方向不同之第三方向之第二導件,以及設在第一導件及第二導件中之至少一方以調整第一導件之位置及第二導件之位置之至少一方、據以調整在與第二方向交叉之方向之片材基板之位置的調整機構。 The conveying device of the present invention includes: a first guide that bends obliquely to change a conveying direction of the sheet substrate from a first direction to a second direction different from the first direction, and is to be a second direction The conveyed sheet substrate is obliquely bent to change the conveying direction of the sheet substrate from the second direction to the second direction in the third direction different from the second direction, and is provided in the first guide and the first guide At least one of the two guides adjusts at least one of a position of the first guide and a position of the second guide, and an adjustment mechanism for adjusting a position of the sheet substrate in a direction intersecting the second direction.

Description

元件製造裝置 Component manufacturing device

本發明係關於搬送裝置及基板處理裝置。 The present invention relates to a transfer device and a substrate processing device.

作為構成顯示器裝置等顯示裝置之顯示元件,例如有液晶顯示元件、有機電機發光(有機EL)元件、用於電子紙之電泳元件等。目前,此等顯示元件係以在基板表面形成被稱為薄膜電晶體之開關元件(Thin Film Transistor:TFT)後,於其上形成各自之顯示元件的主動元件(Active device)漸為主流。 Examples of display elements constituting display devices such as display devices include liquid crystal display elements, organic motor light-emitting (organic EL) elements, and electrophoretic elements for electronic paper. At present, such display elements are gradually becoming mainstream after forming a switching element (Thin Film Transistor: TFT) called a thin film transistor on the surface of a substrate, and an active device on which respective display elements are formed.

近年來,提出了一種在片狀基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術,例如有一種被稱為捲對捲(roll to roll)方式(以下,簡記為「捲繞方式」)者廣為人知(例如,參照專利文獻1)。捲繞方式,係將捲繞在基板供應側之供應用捲筒之一片片狀基板(例如,帶狀之薄膜構件)送出、並一邊將送出之基板以基板回收側之回收用捲筒加以捲繞來搬送基板。 In recent years, a technique of forming a display element on a sheet substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a roll to roll method (hereinafter, simply referred to as "winding method") is widely known (for example, refer to Patent Document 1). In the winding method, a sheet-like substrate (for example, a strip-shaped film member) wound around a substrate supply side is fed, and the supplied substrate is wound on a recovery side of the substrate recovery side. Wrap the substrate.

在基板送出至被捲繞為止之期間,例如一邊使用複數個搬送滾筒等搬送基板、一邊使用複數個處理裝置來形成構成TFT之閘極、閘氧化膜、半導體膜、源-汲極等,在基板之被處理面上依序形成顯示元件之構成要件。例如,在形成有機EL元件之情形時,係於基板上依序形成發發光層、陽極、陰極、電機電路等。 While the substrate is being conveyed to the time of being wound, for example, a plurality of processing apparatuses are used to form a gate, a gate oxide film, a semiconductor film, a source-drain, etc. of the TFT, using a plurality of processing apparatuses. The constituent elements of the display element are sequentially formed on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a motor circuit, and the like are sequentially formed on a substrate.

於顯示元件之形成時,為了例如將構成要件高精度的配置於基板上,須進行處理裝置與基板間之位置對準。因此,發展出一種在與基板搬送方 向正交之方向的端部分別配置位置調整用滾筒,藉調整此位置調整用滾筒之旋轉速度,以調整基板之位置的技術。 At the time of formation of the display element, in order to arrange the constituent elements on the substrate with high precision, for example, the positional alignment between the processing apparatus and the substrate is required. Therefore, the development of a substrate and the substrate A technique of adjusting the rotational speed of the position adjusting roller to adjust the position of the substrate by arranging the position adjusting rollers at the ends in the orthogonal direction.

[先行技術文獻] [Advanced technical literature]

[專利文獻1]國際公開第2006/100868號 [Patent Document 1] International Publication No. 2006/100868

然而,上述位置調整有可能因位置調整用滾筒間之旋轉速度之差異,而將與搬送方向不同方向之力作用於基板,使基板產生例如皺摺等。 However, the position adjustment may cause a force in a direction different from the conveying direction to act on the substrate due to a difference in the rotational speed between the rollers for position adjustment, and the substrate may be wrinkled or the like, for example.

此外,於基板搬送時被處理面接觸於例如搬送滾筒,而有可能對被處理面之處理狀態產生影響。因此,被要求能有一種在對基板之被處理面實施各種處理之前後,極力減少對基板被處理面之接觸的構成。 Further, the surface to be treated is in contact with, for example, the transport roller during the substrate conveyance, and may affect the processing state of the surface to be processed. Therefore, it is required to have a configuration in which contact with the processed surface of the substrate is minimized after performing various processes on the processed surface of the substrate.

本發明之各態樣,其目的在提供一種能提升基板定位精度之搬送裝置及基板處理裝置。本發明各態樣之另一目的,在提供一種能一邊抑制對基板被處理面之接觸、一邊搬送基板之搬送裝置及基板處理裝置。 It is an object of the present invention to provide a conveying apparatus and a substrate processing apparatus capable of improving the positioning accuracy of a substrate. Another object of the present invention is to provide a transfer apparatus and a substrate processing apparatus capable of transporting a substrate while suppressing contact with a substrate to be processed.

本發明第1態樣之搬送裝置,係用以搬送帶狀之片材基板,具備:第一導件,將從第一方向搬送而來(或往第一方向)之該片材基板加以斜向彎折後,將該片材基板之搬送方向從該第一方向變換成與該第一方向不同之第二方向;第二導件,將從第二方向搬送而來(或往第二方向)之該片材基板加以斜向彎折後,將該片材基板之搬送方向從該第二方向變換成與該第二方向不同之第三方向;以及調整機構,係設在該第一導件及該第二導件之至少一方,用以調整該第一導件之位置及該第二導件之位置之至少一方,以調整在與該第二方向交叉之方向之該片材基板的位置。 A conveying apparatus according to a first aspect of the present invention is for conveying a belt-shaped sheet substrate, and includes: a first guide, the sheet substrate conveyed from the first direction (or in the first direction) is inclined After bending, the conveying direction of the sheet substrate is changed from the first direction to a second direction different from the first direction; and the second guide is conveyed from the second direction (or to the second direction) After the sheet substrate is bent obliquely, the conveying direction of the sheet substrate is changed from the second direction to a third direction different from the second direction; and an adjustment mechanism is provided in the first guide At least one of the member and the second guide member for adjusting at least one of a position of the first guide member and a position of the second guide member to adjust the sheet substrate in a direction crossing the second direction position.

本發明第2態樣之基板處理裝置,具備:搬送帶狀之片材基板之搬送裝置;以及對該片材基板進行既定處理之處理裝置;該搬送裝置係使用上述態樣之搬送裝置。 A substrate processing apparatus according to a second aspect of the present invention includes: a conveying device that conveys a belt-shaped sheet substrate; and a processing device that performs predetermined processing on the sheet substrate; and the conveying device uses the conveying device of the above aspect.

本發明第3態樣之搬送裝置,係搬送帶狀之片材基板,其具備:第一導件,係支承該片材基板之背面,將從第一方向搬送而來(或往第一方向)之該片材基板加以斜向彎折、以將該片材基板之搬送方向從該第一方向變換為與該第一方向不同之第二方向;第二導件,係支承該片材基板之背面,使從該第二方向搬送而來(或往第二方向)之該片材基板斜向彎折、以將該片材基板之搬送方向從該第二方向轉換為與該第二方向不同之第三方向;以及該第三導件,係支承該片材基板之背面,使從該第三方向搬送而來(或往第三方向)之該片材基板斜向彎折、以將該片材基板之搬送方向從該第三方向轉換為與該第三方向不同之第四方向。 A conveying apparatus according to a third aspect of the present invention is a belt-shaped sheet substrate, comprising: a first guide that supports the back surface of the sheet substrate and is conveyed from the first direction (or to the first direction) The sheet substrate is obliquely bent to change the conveying direction of the sheet substrate from the first direction to a second direction different from the first direction; the second guide supports the sheet substrate a back surface of the back substrate, wherein the sheet substrate conveyed from the second direction (or in a second direction) is obliquely bent to change a conveying direction of the sheet substrate from the second direction to the second direction a third direction different from the third direction; and the third guide member supports the back surface of the sheet substrate, and the sheet substrate conveyed from the third direction (or in the third direction) is obliquely bent to The conveyance direction of the sheet substrate is converted from the third direction to a fourth direction different from the third direction.

本發明第4態樣之基板處理裝置,具備:搬送帶狀之片材基板之搬送裝置、與對該片材基板進行既定處理之處理裝置;該搬送裝置係使用上述態樣之搬送裝置。 A substrate processing apparatus according to a fourth aspect of the present invention includes: a conveying device that conveys a belt-shaped sheet substrate; and a processing device that performs predetermined processing on the sheet substrate; and the conveying device uses the conveying device of the above aspect.

本發明第5態樣之基板處理裝置,係對帶狀之片材基板表面實施既定處理,其具備:第一導件,係支承該片材基板之背面,使從第一方向搬送而來(或往第一方向)之該片材基板斜向彎折,以使該片材基板之搬送方向從該第一方向變換為與該第一方向不同之第二方向;第二導件,係支承該片材基板之背面,將從該第二方向搬送而來(或往第二方向)之該片材基板加以斜向彎折,以將該片材基板之搬送方向從該第二方向變換為與該第二方向不同之第三方向;第三導件,係支承該片材基板之背面,將從該第三方向搬送而來(或往第三方向)之該片材基板加以斜向彎折,以將該片材基板之搬送方向從該第三方向變換為與該第三方向不同之第四方向;第四導件,係支承該片材基板之背面,將從該第四方向搬送而來(或往第四方向)之該片材 基板加以斜向彎折,以將該片材基板之搬送方向從該第四方向變換為與該第四方向不同之第五方向;以及第一處理部,係在該第一導件與該第二導件之間,對該片材基板之表面進行既定處理。 A substrate processing apparatus according to a fifth aspect of the present invention is characterized in that the surface of the strip-shaped sheet substrate is subjected to a predetermined process, and the first guide member supports the back surface of the sheet substrate and is transported from the first direction ( Or the sheet substrate in the first direction is obliquely bent so that the conveying direction of the sheet substrate is changed from the first direction to a second direction different from the first direction; the second guide member is supported The back surface of the sheet substrate is bent obliquely from the second direction (or in the second direction) to change the conveying direction of the sheet substrate from the second direction to a third direction different from the second direction; the third guiding member supports the back surface of the sheet substrate, and the sheet substrate conveyed from the third direction (or in the third direction) is obliquely bent And folding, the conveying direction of the sheet substrate is changed from the third direction to a fourth direction different from the third direction; and the fourth guide supports the back surface of the sheet substrate and is transported from the fourth direction And (or in the fourth direction) the sheet The substrate is bent obliquely to change the transport direction of the sheet substrate from the fourth direction to a fifth direction different from the fourth direction; and the first processing unit is in the first guide and the first The surface of the sheet substrate is subjected to a predetermined process between the two guide members.

根據本發明之上述態樣,與先前相較,能以高定位精度調整基板之位置。此外,根據本發明之上述態樣,能一邊抑制對基板被處理面之接觸、一邊搬送基板。 According to the above aspect of the invention, the position of the substrate can be adjusted with high positioning accuracy as compared with the prior art. Further, according to the aspect of the invention, it is possible to convey the substrate while suppressing contact with the processed surface of the substrate.

10‧‧‧處理裝置 10‧‧‧Processing device

11、12‧‧‧驅動機構 11, 12‧‧‧ drive mechanism

30‧‧‧搬送裝置 30‧‧‧Transporting device

40‧‧‧吸附部 40‧‧‧Adsorption Department

50‧‧‧對準裝置 50‧‧‧Alignment device

51‧‧‧對準攝影機 51‧‧‧Aligned camera

52、53‧‧‧調整機構 52, 53‧‧ ‧ adjustment agencies

60、62‧‧‧軸承構件 60, 62‧ ‧ bearing components

61、63‧‧‧驅動機構 61, 63‧‧‧ drive mechanism

64‧‧‧載台驅動機構 64‧‧‧stage drive mechanism

80、80a、80b‧‧‧底面 80, 80a, 80b‧‧‧ bottom

81、81a、81b‧‧‧頂點 81, 81a, 81b‧‧‧ apex

AM‧‧‧對準標記 AM‧‧ Alignment mark

CA‧‧‧檢測區域 CA‧‧‧Detection area

CL‧‧‧基板回收部 CL‧‧‧Substrate Recycling Department

CONT‧‧‧控制部 CONT‧‧‧Control Department

C1~C8‧‧‧中心軸 C1~C8‧‧‧ central axis

FB‧‧‧片材基板 FB‧‧‧Sheet substrate

FPA‧‧‧基板處理裝置 FPA‧‧‧ substrate processing device

Fp‧‧‧處理面 Fp‧‧‧ processing surface

F1~F5‧‧‧第一~第五部分 F1~F5‧‧‧First~Part 5

G‧‧‧導引滾筒 G‧‧‧Guide roller

G1、G21‧‧‧第一導引滾筒 G1, G21‧‧‧ first guide roller

G2、G2‧‧‧第二導引滾筒 G2, G2‧‧‧ second guide roller

G3’‧‧‧第三導引滾筒 G3’‧‧‧3rd guide roller

G3、G25‧‧‧第一錘狀構件 G3, G25‧‧‧ first hammer-like members

G4、G26‧‧‧第二錘狀構件 G4, G26‧‧‧ second hammer member

G23‧‧‧第三導引滾筒 G23‧‧‧3rd guide roller

G24‧‧‧第四導引滾筒 G24‧‧‧fourth guide roller

G27‧‧‧第三錘狀構件 G27‧‧‧ third hammer member

G28‧‧‧第四錘狀構件 G28‧‧‧fourth hammer member

G1a、G2a、G21a-G24a‧‧‧滾筒表面 G1a, G2a, G21a-G24a‧‧‧ roller surface

G3a、G4a、G21a~G24a‧‧‧滾筒表面 G3a, G4a, G21a~G24a‧‧‧ roller surface

G25a~G28a‧‧‧側面 G25a~G28a‧‧‧ side

PR‧‧‧基板處理部 PR‧‧‧Substrate Processing Department

R‧‧‧滾筒裝置 R‧‧‧Roller

Sa‧‧‧支承面 Sa‧‧‧ bearing surface

ST‧‧‧載台裝置 ST‧‧‧ stage device

SU‧‧‧基板供應部 SU‧‧‧Substrate Supply Department

圖1係顯示一實施形態之基板處理裝置之概略構成的全體圖。 Fig. 1 is a general view showing a schematic configuration of a substrate processing apparatus according to an embodiment.

圖2係顯示本實施形態之搬送裝置之部分構成的側視剖面圖。 Fig. 2 is a side sectional view showing a part of the configuration of the conveying apparatus of the embodiment.

圖3係顯示本實施形態之搬送裝置之部分構成的俯視圖。 Fig. 3 is a plan view showing a part of the configuration of the conveying device of the embodiment.

圖4係顯示本實施形態之基板處理裝置之搬送動作的圖。 Fig. 4 is a view showing the conveyance operation of the substrate processing apparatus of the embodiment.

圖5係顯示第二實施形態之基板處理裝置之搬送動作的圖。 Fig. 5 is a view showing a conveying operation of the substrate processing apparatus of the second embodiment.

圖6係顯示第三實施形態之基板處理裝置之搬送裝置之部分構成的圖。 Fig. 6 is a view showing a partial configuration of a conveying device of a substrate processing apparatus according to a third embodiment.

圖7係顯示本實施形態之搬送裝置之部分構成的立體圖。 Fig. 7 is a perspective view showing a part of the configuration of the conveying device of the embodiment.

圖8係顯示本實施形態之搬送裝置之其他構成的圖。 Fig. 8 is a view showing another configuration of the conveying device of the embodiment.

圖9係顯示第四實施形態之基板處理裝置之概略構成的全體圖。 Fig. 9 is a general view showing a schematic configuration of a substrate processing apparatus according to a fourth embodiment.

圖10係顯示本實施形態之搬送裝置之部分構成的俯視圖。 Fig. 10 is a plan view showing a part of the configuration of the conveying device of the embodiment.

圖11係顯示第五實施形態之搬送裝置之部分構成的圖。 Fig. 11 is a view showing a partial configuration of a conveying apparatus of a fifth embodiment.

圖12係顯示第六實施形態之搬送裝置之部分構成的圖。 Fig. 12 is a view showing a partial configuration of a conveying device of a sixth embodiment.

圖13係顯示本實施形態之搬送裝置之其他構成的圖。 Fig. 13 is a view showing another configuration of the conveying device of the embodiment.

<第一實施形態> <First Embodiment>

圖1係顯示第一實施形態之基板處理裝置FPA之構成的圖。 Fig. 1 is a view showing the configuration of a substrate processing apparatus FPA of the first embodiment.

如圖1所示,基板處理裝置FPA具有供應片材基板(例如帶狀之薄膜構件)FB之基板供應部SU、對片材基板FB之表面(被處理面)進行處理之基板處理部PR、回收片材基板FB之基板回收部CL、以及控制此等各部之控制部CONT。基板處理裝置FPA例如係設置在工場等。 As shown in FIG. 1, the substrate processing apparatus FPA has a substrate supply unit SU that supplies a sheet substrate (for example, a strip-shaped film member) FB, and a substrate processing unit PR that processes the surface (processed surface) of the sheet substrate FB, The substrate recovery unit CL of the sheet substrate FB is recovered, and the control unit CONT that controls the respective units. The substrate processing apparatus FPA is provided, for example, at a factory or the like.

基板處理裝置FPA,係在從基板供應部SU送出片材基板FB後、至以基板回收部CL回收片材基板FB為止之期間,對片材基板FB之表面施以各種處理之捲對捲方式(以下,簡記為「捲繞方式」)之裝置。基板處理裝置FPA可在片材基板FB上形成例如有機EL元件、液晶顯示元件等顯示元件(電子元件)之場合使用。當然,處理裝置FPA亦能在形成此等元件以外之元件之場合使用。 The substrate processing apparatus FPA is a roll-to-roll method in which various processes are applied to the surface of the sheet substrate FB after the sheet substrate FB is fed from the substrate supply unit SU to the time when the sheet substrate FB is collected by the substrate collection unit CL. (Hereinafter, abbreviated as "winding method"). The substrate processing apparatus FPA can be used to form a display element (electronic element) such as an organic EL element or a liquid crystal display element on the sheet substrate FB. Of course, the processing device FPA can also be used in the case of forming components other than these components.

在基板處理裝置FPA作為處理對象之片材基板FB,可使用例如樹脂薄膜及不鏽鋼等之箔(膜)。樹脂薄膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、聚乙烯乙酯樹脂等材料。 For the sheet substrate FB to be processed by the substrate processing apparatus FPA, for example, a foil (film) such as a resin film or stainless steel can be used. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate can be used. Materials such as ester resin, polystyrene resin, and polyvinyl ethyl ester resin.

片材基板FB之Y方向(短邊方向)尺寸係形成為例如1m~2m程度、X方向(長邊方向)尺寸則形成為例如10m以上。當然,此尺寸僅為一例,並不限於此例。例如片材基板FB之Y方向尺寸為1m以下或50cm以下、亦可為2m以上。又,片材基板FB之X方向尺寸亦可在10m以下。 The dimension of the sheet substrate FB in the Y direction (short side direction) is, for example, about 1 m to 2 m, and the dimension in the X direction (longitudinal direction) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the Y-direction dimension of the sheet substrate FB is 1 m or less or 50 cm or less, and may be 2 m or more. Moreover, the dimension of the sheet substrate FB in the X direction may be 10 m or less.

片材基板FB係形成為例如具有可撓性。此處,所謂可撓性,係指例如對基板施以至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外,例如因上述既定力而彎折之性質亦包含於所指之可撓性。又,上述可撓性會隨著該基板材質、大小、厚度、以及温度等之環境等而改變。再者,片材基板FB可使用一片帶狀之基板、亦可使用將複數個單位之基板加以連接而形成為帶狀之構成。 The sheet substrate FB is formed to have flexibility, for example. Here, the term "flexibility" refers to a property in which the substrate can be bent without being broken or broken by applying a predetermined force to at least its own weight. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility indicated. Further, the flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate. Further, the sheet substrate FB may be formed by using a strip-shaped substrate or a substrate in which a plurality of units are connected to each other to form a strip shape.

片材基板FB,以承受較高温(例如200℃程度)之熱其尺寸亦實質上無變化(熱變形小)之熱膨漲係數較小者較佳。例如可將無機填料混於樹脂薄膜以降低熱膨漲係數。作為無機填料,例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。 The sheet substrate FB is preferably one which is subjected to a relatively high temperature (for example, about 200 ° C) and whose heat is not substantially changed in size (small thermal deformation). For example, an inorganic filler may be mixed in the resin film to lower the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

基板供應部SU係將例如捲成輥狀之片材基板FB送出供應至基板處理部PR。於基板供應部SU,設有用以例如捲繞片材基板FB之軸部及使該軸部旋轉之旋轉驅動源等。當然,亦可以取代及/或追加方式,於基板供應部SU設置例如用以覆蓋捲成輥狀狀態之片材基板FB的覆蓋部等。 The substrate supply unit SU supplies and supplies the sheet substrate FB wound in a roll shape to the substrate processing unit PR, for example. The substrate supply unit SU is provided with, for example, a shaft portion for winding the sheet substrate FB, a rotary drive source for rotating the shaft portion, and the like. As a matter of course, it is also possible to provide, for example, a cover portion for covering the sheet substrate FB wound in a roll state, and the like, in place of the substrate supply portion SU.

基板回收部CL係將來自基板處理部PR之片材基板FB例如捲繞成輥狀加以回收。於基板回收部CL,與基板供應部SU同樣的,設有用以捲繞片材基板FB之軸部及使該軸部旋轉之旋轉驅動源、以及覆蓋回收之片材基板FB的覆蓋部等。亦可取代及/或追加方式,在基板處理部PR將片材基板FB例如切成平板(panel)狀之場合等時,基板回收部CL亦可構成為例如將片材基板FB回收成重疊狀態等與捲繞成輥狀之狀態不同之狀態回收片材基板FB之構成。 The substrate collecting portion CL is obtained by winding the sheet substrate FB from the substrate processing portion PR, for example, in a roll shape. Similarly to the substrate supply unit SU, the substrate collection unit CL is provided with a shaft portion for winding the sheet substrate FB, a rotation drive source for rotating the shaft portion, and a cover portion for covering the recovered sheet substrate FB. In the case where the substrate processing unit PR cuts the sheet substrate FB into a flat shape, for example, the substrate collecting portion CL may be configured to collect the sheet substrate FB in a stacked state, for example. The composition of the sheet substrate FB is recovered in a state different from the state of being wound into a roll.

基板處理部PR,將從基板供應部SU供應之片材基板FB搬送至基板回收部CL、並在搬送過程對片材基板FB之被處理面Fp進行處理。基板處理部PR具有例如處理裝置10、搬送裝置30及對準裝置50等。 The substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate collection unit CL, and processes the processed surface Fp of the sheet substrate FB during the transfer process. The substrate processing unit PR includes, for example, the processing device 10, the transfer device 30, the alignment device 50, and the like.

處理裝置10具有用以對片材基板FB之被處理面Fp形成例如有機EL元件之各種裝置。作為此種裝置,例如有用以在被處理面Fp上形成間隔壁之間隔壁形成裝置、用以形成用來驅動有機EL元件之電極的電極形成裝置、以及用以形成發光層之發光層形成裝置等。具體而言,有液滴塗布裝置(例如噴墨型塗布裝置、旋轉塗布型塗布裝置等)、蒸鍍裝置、濺鍍裝置等之成膜裝置、及曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等。此等之各裝置,係適當的設在例如片材基板FB之搬送路徑上。 The processing apparatus 10 has various means for forming, for example, an organic EL element on the processed surface Fp of the sheet substrate FB. As such a device, for example, a partition wall forming device for forming a partition wall on the surface Fp to be processed, an electrode forming device for forming an electrode for driving the organic EL element, and a light-emitting layer forming device for forming a light-emitting layer Wait. Specifically, there are a film forming device such as a droplet applying device (for example, an inkjet coating device or a spin coating coating device), a vapor deposition device, and a sputtering device, and an exposure device, a developing device, and a surface modifying device. Washing device, etc. Each of these devices is suitably provided, for example, on a transport path of the sheet substrate FB.

例如可將二個以上之處理裝置沿搬送方向配置。 For example, two or more processing devices can be arranged along the transport direction.

搬送裝置30,具有在基板處理部PR內例如將片材基板FB朝基板回收部CL搬送之滾筒裝置R、與夾著處理裝置10配置在該處理裝置10之上流側及下流側之導引滾筒G。滾筒裝置R沿著片材基板FB之搬送路徑例如設有複數個。於複數個滾筒裝置R中之至少一部分之滾筒裝置R安裝有驅動機構(未圖示)。藉由此種滾筒裝置R之旋轉,片材基板FB即被往X軸方向搬送。亦可構成為將複數個滾筒裝置R中之例如一部分滾筒裝置R設置成能在與搬送方向正交之方向移動。 The conveyance device 30 has a roller device R that conveys the sheet substrate FB to the substrate collection portion CL in the substrate processing portion PR, and a guide roller that is disposed on the flow side and the downstream side of the processing device 10 with the processing device 10 interposed therebetween. G. A plurality of transport paths of the drum device R along the sheet substrate FB are provided, for example. A drive mechanism (not shown) is attached to the roller device R of at least a part of the plurality of roller devices R. By the rotation of the roller device R, the sheet substrate FB is conveyed in the X-axis direction. Further, for example, a part of the plurality of roller devices R may be arranged to be movable in a direction orthogonal to the conveying direction.

又,本實施形態中之搬送裝置30,於片材基板FB之搬送方向,在導引滾筒G之上流側及下流側,為避免張力施加於片材基板FB,於片材基板FB設有鬆弛部(未圖示)。 Further, in the conveying device 30 of the present embodiment, in the conveying direction of the sheet substrate FB, on the flow side and the downstream side of the guide roller G, in order to prevent the tension from being applied to the sheet substrate FB, the sheet substrate FB is slackened. Department (not shown).

圖2及圖3係顯示處理裝置10及導引滾筒G之構成的概略圖。圖2顯示了從側方(+X方向)觀察基板處理裝置FPA時之構成。圖3則顯示了從上方(+Z方向)觀察基板處理裝置FPA時之構成。 2 and 3 are schematic views showing the configuration of the processing device 10 and the guide roller G. Fig. 2 shows the configuration when the substrate processing apparatus FPA is viewed from the side (+X direction). Fig. 3 shows the configuration when the substrate processing apparatus FPA is viewed from above (+Z direction).

如圖2及圖3所示,導引滾筒G具有第一導引滾筒G1及第二導引滾筒G2。第一導引滾筒G1係形成為例如圓柱狀或圓筒狀等,相對處理裝置10配置在片材基板FB之搬送方向上流側。第二導引滾筒G2形成為例如圓柱狀或圓筒狀等,相對處理裝置10配置在片材基板FB之搬送方向下流側。 As shown in FIGS. 2 and 3, the guide roller G has a first guide roller G1 and a second guide roller G2. The first guide roller G1 is formed, for example, in a columnar shape or a cylindrical shape, and is disposed on the upstream side in the transport direction of the sheet substrate FB with respect to the processing apparatus 10. The second guide roller G2 is formed, for example, in a columnar shape or a cylindrical shape, and is disposed on the downstream side in the conveying direction of the sheet substrate FB with respect to the processing apparatus 10.

第一導引滾筒G1係相對從該第一導引滾筒G1之上流側往第一方向(+X方向)搬送而來之片材基板FB之第一部分(被第一導引滾筒G1導引前之部分,亦即相對第一導引滾筒G1、片材基板FB之上流側部分)F1之短邊方向(寬度方向:此處為Y方向),配置成其中心軸C1傾向斜方向。第一導引滾筒G1,於滾筒表面(導引面)G1a導引片材基板FB之背面。 The first guide roller G1 is a first portion of the sheet substrate FB that is conveyed from the upstream side of the first guide roller G1 in the first direction (+X direction) (before being guided by the first guide roller G1) The portion of the first guide roller G1 and the upper side of the sheet substrate FB) F1 (the width direction: here, the Y direction) is disposed such that the central axis C1 is inclined. The first guide roller G1 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G1a.

又,從第一導引滾筒G1之上流側搬送而來之片材基板FB,於圖2中,係片材基板FB之背面Fq朝向上方之狀態。 Moreover, the sheet substrate FB conveyed from the upstream side of the first guide roller G1 is in a state in which the back surface Fq of the sheet substrate FB faces upward.

第一導引滾筒G1將片材基板FB相對該片材基板FB之短邊方向彎向斜方向並沿著第一導引滾筒G1之滾筒表面折返片材基板FB,據以將片材基板FB之搬送方向從上述第一方向變換為第二方向(-Y方向)。本實施形態中,第一導引滾筒G1可將片材基板FB實質的加以斜向彎折。片材基板FB可藉由第一導引滾筒G1在扭轉(twist)之同時彎折。於片材基板FB,可在被第一導引滾筒G1導引之部分,形成相對搬送方向(第一方向)傾斜之部分周面。具有第一方向(+X方向)之行進方向之片材基板FB進入第一導引滾筒G1。具有第二方向(-Y方向)之行進方向之片材基板FB從第一導引滾筒G1出來。本實施形態中,該第二方向例如係與第一方向正交之方向。例如被第一導引滾筒G1折返之片材基板FB於第二方向、其被處理面Fp朝向上方(處理裝置10側)。又,片材基板FB被支承於第一導引滾筒G1之滾筒表面G1a,直到在第一導引滾筒G1之前後,第一部分F1與第二部分(被導引至第二導引滾筒G2前之部分,亦即相對第二導引滾筒G2、片材基板FB之上流側部分)F2彼此平行為止。 The first guide roller G1 bends the sheet substrate FB in the oblique direction with respect to the short side direction of the sheet substrate FB and folds back the sheet substrate FB along the drum surface of the first guide roller G1, whereby the sheet substrate FB is pressed. The conveyance direction is changed from the first direction to the second direction (-Y direction). In the present embodiment, the first guide roller G1 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB can be bent while being twisted by the first guide roller G1. In the sheet substrate FB, a portion of the peripheral surface inclined with respect to the transport direction (first direction) can be formed in a portion guided by the first guide roller G1. The sheet substrate FB having the traveling direction of the first direction (+X direction) enters the first guide roller G1. The sheet substrate FB having the traveling direction in the second direction (-Y direction) comes out of the first guide roller G1. In the present embodiment, the second direction is, for example, a direction orthogonal to the first direction. For example, the sheet substrate FB folded back by the first guide roller G1 is oriented in the second direction, and the processed surface Fp thereof is directed upward (on the side of the processing apparatus 10). Further, the sheet substrate FB is supported by the drum surface G1a of the first guide roller G1 until the first portion F1 and the second portion (before being guided to the second guide roller G2) before the first guide roller G1 The portions, that is, the second guide roller G2 and the upper flow side portion F2 of the sheet substrate FB are parallel to each other.

第二導引滾筒G2係配置成相對從該第二導引滾筒G2上流側往第二方向搬送而來之片材基板FB之第二部分F2,其中心軸C2往斜方向傾斜。第二導引滾筒G2於滾筒表面(導引面)G2a,導引片材基板FB之背面。 The second guide roller G2 is disposed so as to be inclined in the oblique direction with respect to the second portion F2 of the sheet substrate FB conveyed from the upstream side of the second guide roller G2 in the second direction. The second guide roller G2 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G2a.

又,從第二導引滾筒G2上流側搬送而來之片材基板FB,於圖2中,如前所述,係片材基板FB之被處理面Fp朝向上方之狀態。 Moreover, in the sheet substrate FB conveyed from the upstream side of the second guide roller G2, as shown in Fig. 2, the processed surface Fp of the sheet substrate FB is directed upward.

第二導引滾筒G2將片材基板FB之第二部分F2相對該片材基板FB之短邊方向彎折向斜方向、並沿第二導引滾筒G2之滾筒表面將片材基板FB加以折返,據以將片材基板FB之搬送方向從上述第二方向變換向第三方向(+X方向)。本實施形態中,第二導引滾筒G2可將片材基板FB實質的加以斜向彎折。片材基板FB可藉由第二導引滾筒G2在扭轉(twist)之同時彎折。於片材基板FB,在被第二導引滾筒G2導引之部分,可形成相對搬送方向(第 二方向)傾斜之部分周面。具有第二方向(-Y方向)之行進方向之片材基板FB進入第二導引滾筒G2。具有第三方向(+X方向)之行進方向之片材基板FB從第二導引滾筒G2出來。本實施形態中,該第三方向係例如與第一方向平行之方向。藉由第二導引滾筒G2折返之片材基板FB,於第三方向成為例如背面Fq朝向上方、而被處理面Fp朝向下方。又,片材基板FB被支承於第二導引滾筒G2之滾筒表面G2a,直到第二部分F2與第三部分(被第三導引滾筒G3’導引前之部分,亦即相對第三導引滾筒G3’、片材基板FB之上流側部分)F3彼此平行為止。 The second guiding roller G2 bends the second portion F2 of the sheet substrate FB in the oblique direction with respect to the short side direction of the sheet substrate FB, and folds the sheet substrate FB along the surface of the roller of the second guiding roller G2. Then, the conveyance direction of the sheet substrate FB is changed from the second direction to the third direction (+X direction). In the present embodiment, the second guide roller G2 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB can be bent while being twisted by the second guide roller G2. In the portion of the sheet substrate FB that is guided by the second guide roller G2, a relative transport direction can be formed (the Two directions) a part of the inclined surface. The sheet substrate FB having the traveling direction in the second direction (-Y direction) enters the second guide roller G2. The sheet substrate FB having the traveling direction of the third direction (+X direction) comes out of the second guide roller G2. In the present embodiment, the third direction is, for example, a direction parallel to the first direction. In the third direction, for example, the back surface Fq faces upward, and the processed surface Fp faces downward, in the sheet direction FB folded back by the second guide roller G2. Further, the sheet substrate FB is supported by the drum surface G2a of the second guide roller G2 until the second portion F2 and the third portion (the portion before being guided by the third guide roller G3', that is, the third guide The leader roller G3' and the upper flow side portion F3 of the sheet substrate FB are parallel to each other.

片材基板FB之搬送方向,在該片材基板FB中之較第一導引滾筒G1靠搬送方向之上流側部分(第一部分F1)為+X方向(第一方向)、在第一導引滾筒G1與第二導引滾筒G2之間之部分(第二部分F2)為-Y方向(第二方向)、在較第二導引滾筒G2之搬送方向下流側之部分(第三部分F3)則再次成為+X方向(第三方向)。如此,片材基板FB即被以第一導引滾筒G1及第二導引滾筒G2為彎折角之曲柄狀路徑搬送。 In the transport direction of the sheet substrate FB, the flow side portion (first portion F1) in the transport direction of the first guide roller G1 in the sheet substrate FB is in the +X direction (first direction), in the first guide A portion (second portion F2) between the drum G1 and the second guide roller G2 is a portion in the -Y direction (second direction) on the downstream side in the conveying direction of the second guide roller G2 (third portion F3) Then it becomes the +X direction (the third direction) again. In this manner, the sheet substrate FB is conveyed by a crank-shaped path in which the first guide roller G1 and the second guide roller G2 are bent.

第一導引滾筒G1係以例如軸承構件60加以支承。於軸承構件60設有驅動第一導引滾筒G1之驅動機構61。驅動機構61使第一導引滾筒G1旋轉於中心軸方向。 The first guide roller G1 is supported by, for example, a bearing member 60. The bearing member 60 is provided with a drive mechanism 61 that drives the first guide roller G1. The drive mechanism 61 rotates the first guide roller G1 in the central axis direction.

第二導引滾筒G2與第一導引滾筒G1同樣的,係被例如軸承構件62所支承。於軸承構件62設有驅動第二導引滾筒G2之驅動機構63。驅動機構63使第二導引滾筒G2旋轉於中心軸方向。 The second guide roller G2 is supported by, for example, the bearing member 62 similarly to the first guide roller G1. The bearing member 62 is provided with a drive mechanism 63 that drives the second guide roller G2. The drive mechanism 63 rotates the second guide roller G2 in the central axis direction.

又,例如於第一導引滾筒G1及第二導引滾筒G2,設有分別檢測旋轉量、旋轉速度等之編碼器等未圖示之檢測裝置。使用該檢測裝置之檢測結果被送至例如控制部CONT。 Further, for example, the first guide roller G1 and the second guide roller G2 are provided with detection devices (not shown) such as an encoder that detects a rotation amount, a rotation speed, and the like. The detection result using the detection device is sent to, for example, the control unit CONT.

在第一導引滾筒G1與第二導引滾筒G2之間,配置有支承片材基板FB之載台裝置ST。載台裝置ST相對片材基板FB之第二部分F2配置在背面 側(-Z側),具有支承片材基板FB之第二部分F2的支承面Sa。支承面Sa係以例如平坦之面、或具有曲率之面形成。 A stage device ST that supports the sheet substrate FB is disposed between the first guide roller G1 and the second guide roller G2. The stage device ST is disposed on the back side with respect to the second portion F2 of the sheet substrate FB The side (-Z side) has a support surface Sa that supports the second portion F2 of the sheet substrate FB. The support surface Sa is formed, for example, as a flat surface or a surface having a curvature.

載台裝置ST,若支承面Sa例如為平坦面的話,則係配置成支承面Sa與XY平面平行。於載台裝置ST設有載台驅動機構64。藉由載台驅動機構64,將載台裝置ST設置成例如能於X方向、Y方向及Z方向移動。 When the support surface Sa is, for example, a flat surface, the stage device ST is disposed such that the support surface Sa is parallel to the XY plane. A stage driving mechanism 64 is provided in the stage device ST. The stage driving mechanism ST is provided to be movable in the X direction, the Y direction, and the Z direction by, for example, the stage driving mechanism 64.

載台裝置ST,於支承面Sa具有吸附部40(參照圖2)。吸附部40在支承面Sa例如配置於一處或複數處。於吸附部40連接例如吸引泵等之吸引機構41。因此,載台裝置ST可在將片材基板FB之第二部分F2吸附於支承面Sa之同時、加以支承。 The stage device ST has an adsorption unit 40 (see FIG. 2) on the support surface Sa. The adsorption portion 40 is disposed, for example, at one or a plurality of locations on the support surface Sa. A suction mechanism 41 such as a suction pump is connected to the adsorption unit 40. Therefore, the stage device ST can support the second portion F2 of the sheet substrate FB while being adsorbed on the support surface Sa.

回到圖1,對準裝置50係對片材基板FB進行對準動作。對準裝置50,具有檢測片材基板FB之位置狀態的對準攝影機51、與根據該對準攝影機51之檢測結果將片材基板FB於X方向、Y方向、Z方向、θ X方向、θ Y方向、θ Z方向進行微調整之第一調整機構(第一調整部)52及第二調整機構(第二調整部)53。 Returning to Fig. 1, the alignment device 50 performs an alignment operation on the sheet substrate FB. The alignment device 50 has an alignment camera 51 that detects the positional state of the sheet substrate FB, and the sheet substrate FB in the X direction, the Y direction, the Z direction, the θ X direction, and the θ according to the detection result of the alignment camera 51. A first adjustment mechanism (first adjustment unit) 52 and a second adjustment mechanism (second adjustment unit) 53 that are finely adjusted in the Y direction and the θ Z direction.

如圖3所示,於片材基板FB表面(被處理面Fp側之面)形成有對準標記AM。對準標記AM,係在片材基板FB表面中、分別形成在例如片材基板FB之短邊方向兩端部。圖3中,僅顯示了一對對準標記AM,但實際上沿著片材基板FB之各端部例如配置有複數個。 As shown in FIG. 3, an alignment mark AM is formed on the surface of the sheet substrate FB (the surface on the surface to be processed Fp). The alignment marks AM are formed on the surface of the sheet substrate FB, for example, at both end portions in the short side direction of the sheet substrate FB. In Fig. 3, only a pair of alignment marks AM are shown, but actually, a plurality of ends are arranged along the respective ends of the sheet substrate FB.

此外,本實施形態中之對準攝影機51係與片材基板FB之短邊方向端部分別對向配置。本實施形態中,對準攝影機51係分別檢測片材基板FB兩端部之對準標記AM。各對準攝影機51之檢測區域CA,係設定為例如包含對準標記AM之區域。 Further, the alignment camera 51 in the present embodiment is disposed to face the end portions in the short-side direction of the sheet substrate FB, respectively. In the present embodiment, the alignment camera 51 detects the alignment marks AM at both end portions of the sheet substrate FB. The detection area CA of each of the alignment cameras 51 is set to, for example, an area including the alignment mark AM.

第一調整機構52係支承例如第一導引滾筒G1之兩端部。第一調整機構52係使第一導引滾筒G1移動於與第一導引滾筒G1之中心軸平行之方向、例如使第一導引滾筒G1在XY平面內、與XY平面正交或交叉之面內 移動。進一步的,第一調整機構52使第一導引滾筒G1繞θX方向、θY方向、θZ方向旋轉。又,第一調整機構52可將各旋轉方向之旋轉中心設定於第一導引滾筒G1兩端部中之一方之端部、或設定於第一導引滾筒G1之中心軸方向的中央部分。 The first adjustment mechanism 52 supports, for example, both end portions of the first guide roller G1. The first adjustment mechanism 52 moves the first guide roller G1 in a direction parallel to the central axis of the first guide roller G1, for example, the first guide roller G1 is orthogonal or intersects with the XY plane in the XY plane. In-plane mobile. Further, the first adjustment mechanism 52 rotates the first guide roller G1 about the θX direction, the θY direction, and the θZ direction. Further, the first adjustment mechanism 52 can set the rotation center of each rotation direction to one end portion of both end portions of the first guide roller G1 or to a central portion of the first guide roller G1 in the central axis direction.

第二調整機構53係支承例如第二導引滾筒G2之兩端部。第二調整機構53使第二導引滾筒G2移動於與第二導引滾筒G2之中心軸平行之方向、例如使第二導引滾筒G2在XY平面內、與XY平面正交或交叉之面內移動。進一步的,第二調整機構53使第二導引滾筒G2繞θX方向、θY方向、θZ方向旋轉。又,第二調整機構53可將各旋轉方向之旋轉中心設定於例如第二導引滾筒G2兩端部中之一方之端部、或設定於第二導引滾筒G2之中心軸方向的中央部分。 The second adjustment mechanism 53 supports, for example, both end portions of the second guide roller G2. The second adjustment mechanism 53 moves the second guide roller G2 in a direction parallel to the central axis of the second guide roller G2, for example, the second guide roller G2 is orthogonal or intersecting with the XY plane in the XY plane. Move inside. Further, the second adjustment mechanism 53 rotates the second guide roller G2 in the θX direction, the θY direction, and the θZ direction. Further, the second adjustment mechanism 53 can set the rotation center of each rotation direction to, for example, one end portion of both end portions of the second guide roller G2 or a central portion set in the central axis direction of the second guide roller G2. .

對準攝影機51檢測該對準標記AM並將檢測結果送至控制部CONT。控制部CONT將用以根據該檢測結果調整第一導引滾筒G1之位置之調整信號送至調整機構52,並將用以調整第二導引滾筒G2之位置之調整信號送至調整機構53。調整機構52根據來自該控制部CONT之調整信號調整第一導引滾筒G1之位置。調整機構53根據來自該控制部CONT之調整信號調整第二導引滾筒G2之位置。又,控制部CONT亦可不使用對準攝影機51之檢測結果而生成調整信號,並將該生成之調整信號送至調整機構52及53。 The alignment camera 51 detects the alignment mark AM and sends the detection result to the control unit CONT. The control unit CONT sends an adjustment signal for adjusting the position of the first guide roller G1 based on the detection result to the adjustment mechanism 52, and sends an adjustment signal for adjusting the position of the second guide roller G2 to the adjustment mechanism 53. The adjustment mechanism 52 adjusts the position of the first guide roller G1 in accordance with an adjustment signal from the control unit CONT. The adjustment mechanism 53 adjusts the position of the second guide roller G2 based on the adjustment signal from the control unit CONT. Further, the control unit CONT may generate an adjustment signal without using the detection result of the alignment camera 51, and may send the generated adjustment signal to the adjustment mechanisms 52 and 53.

以上述方式構成之基板處理裝置FPA,藉由控制部CONT之控制,以捲繞方式製造有機EL元件、液晶顯示元件等之顯示元件(電子元件)。以下,說明使用上述構成之基板處理裝置FPA製造顯示元件之製程。 In the substrate processing apparatus FPA configured as described above, a display element (electronic element) such as an organic EL element or a liquid crystal display element is manufactured by a control of the control unit CONT. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described.

首先,將捲繞於捲筒之帶狀片材基板FB安裝於基板供應部SU。控制部CONT使捲筒旋轉,以從此狀態從基板供應部SU送出該片材基板FB。並將通過基板處理部PR之該片材基板FB捲繞於基板回收部CL之捲筒。藉由控制此基板供應部SU及基板回收部CL,可對基板處理部PR連續的搬 送片材基板FB之被處理面Fp。 First, the strip-shaped sheet substrate FB wound around the reel is attached to the substrate supply portion SU. The control unit CONT rotates the reel to feed the sheet substrate FB from the substrate supply unit SU from this state. The sheet substrate FB passing through the substrate processing portion PR is wound around the reel of the substrate collecting portion CL. By controlling the substrate supply unit SU and the substrate collection unit CL, the substrate processing unit PR can be continuously moved. The processed surface Fp of the sheet substrate FB is sent.

控制部CONT在片材基板FB從基板供應部SU被送出至以基板回收部CL加以捲繞之期間,以基板處理部PR之搬送裝置30將片材基板FB在該基板處理部PR內適當的加以搬送、一邊藉由處理裝置10將顯示元件之構成要件依序形成在片材基板FB上。 When the sheet substrate FB is fed from the substrate supply unit SU to the substrate recovery unit CL, the control unit CONT applies the sheet substrate FB to the substrate processing unit PR in the substrate processing unit PR. The constituent elements of the display elements are sequentially formed on the sheet substrate FB by the processing device 10 while being transported.

在使處理裝置10進行處理時,控制部CONT使用對準裝置50進行片材基板FB之位置對準。例如以對準攝影機51檢測片材基板FB之對準標記AM並根據檢測結果調整例如搬送裝置30之滾筒裝置R之驅動量、以及導引滾筒G(第一導引滾筒G1及第二導引滾筒G2)之位置及姿勢、旋轉量、旋轉速度等。 When the processing device 10 is processed, the control unit CONT performs alignment of the sheet substrate FB using the alignment device 50. For example, the alignment camera AM detects the alignment mark AM of the sheet substrate FB and adjusts the driving amount of the roller device R of the conveying device 30, for example, and the guide roller G (the first guide roller G1 and the second guide) according to the detection result. The position and posture of the roller G2), the amount of rotation, the rotation speed, and the like.

其次,說明調整導引滾筒G(第一導引滾筒G1及第二導引滾筒G2)之位置及姿勢之情形。 Next, the case where the position and posture of the guide roller G (the first guide roller G1 and the second guide roller G2) are adjusted will be described.

圖4顯示了從圖3所示狀態使第一導引滾筒G1及第二導引滾筒G2對各自之中心軸於平行之方向(圖4中為-X方向)每次以相等移動量移動之狀態。此場合,片材基板FB係藉由第一導引滾筒G1及第二導引滾筒G2以被折返之狀態施加張力。因此,在以上述方式使第一導引滾筒G1及第二導引滾筒G2移動之情形時,各自之折返位置即於-X方向每次移動相等距離,隨此,片材基板FB之第二部分F2即往-X方向移動。 4 shows that the first guide roller G1 and the second guide roller G2 are moved in the parallel direction (the -X direction in FIG. 4) by the equal movement amount each time from the state shown in FIG. status. In this case, the sheet substrate FB is tensioned by the first guide roller G1 and the second guide roller G2 in a state of being folded back. Therefore, when the first guide roller G1 and the second guide roller G2 are moved in the above manner, the respective folding positions are moved by the same distance in the -X direction, and accordingly, the second sheet substrate FB Part F2 moves in the -X direction.

如此,由於即使使第一導引滾筒G1及第二導引滾筒G2移動,對片材基板FB作用之力之方向亦不會變化,因此可抑制或消除作用於與片材基板FB之搬送方向不同方向之力。因此,即能對例如片材基板FB在不產生皺摺等之情形下,使片材基板FB之第二部分F2移動於與搬送方向正交之方向。導引滾筒G之移動後,控制部CONT即配合例如片材基板FB之第二部分F2之位置使載台裝置ST移動於X方向及Y方向。 In this manner, even if the first guide roller G1 and the second guide roller G2 are moved, the direction of the force acting on the sheet substrate FB does not change, so that the movement direction acting on the sheet substrate FB can be suppressed or eliminated. The power in different directions. Therefore, for example, in the case where the sheet substrate FB does not wrinkle or the like, the second portion F2 of the sheet substrate FB can be moved in a direction orthogonal to the conveyance direction. After the movement of the guide roller G, the control unit CONT moves the stage device ST in the X direction and the Y direction in cooperation with, for example, the position of the second portion F2 of the sheet substrate FB.

又,於片材基板FB之搬送方向,在第一導引滾筒G1之上流側及第二 導引滾筒G2之下流側設有片材基板FB之鬆弛部,因此即使調整第一導引滾筒G1之位置及第二導引滾筒G2之位置,亦能抑制或消除作用於片材基板FB之力。 Moreover, in the conveying direction of the sheet substrate FB, on the flow side and the second side of the first guide roller G1 The slack portion of the sheet substrate FB is provided on the lower flow side of the guide roller G2, so that even if the position of the first guide roller G1 and the position of the second guide roller G2 are adjusted, the action on the sheet substrate FB can be suppressed or eliminated. force.

在調整載台裝置ST之X方向及Y方向位置後,控制部CONT使載台裝置ST往+Z方向移動,將片材基板FB之背面抵接於支承面Sa。藉由此動作,片材基板FB之面即被支承於載台裝置ST之支承面Sa。此時,控制部CONT亦可例如使片材基板FB吸附於載台裝置ST之吸附部40。此外,亦可在使片材基板FB之背面抵接於載台裝置ST之支承面Sa之前,使第一導引滾筒G1與第二導引滾筒G2彼此接近(縮小間隔)以使片材基板FB鬆弛。藉由使片材基板FB鬆弛,即能在使片材基板FB無張力之狀態下抵接及吸附於載台裝置ST之支承面Sa。又,控制部CONT藉由在支承片材基板FB之狀態下使載台裝置ST往例如+Z側移動,據以調整片材基板FB之Z方向位置。此場合,控制部CONT係視載台裝置ST往Z方向之移動量使第一導引滾筒G1及第二導引滾筒G2往Z方向移動。 After adjusting the X-direction and the Y-direction position of the stage device ST, the control unit CONT moves the stage device ST in the +Z direction, and abuts the back surface of the sheet substrate FB against the support surface Sa. By this operation, the surface of the sheet substrate FB is supported by the support surface Sa of the stage device ST. At this time, the control unit CONT can also adsorb the sheet substrate FB to the adsorption unit 40 of the stage device ST, for example. Further, before the back surface of the sheet substrate FB is brought into contact with the support surface Sa of the stage device ST, the first guide roller G1 and the second guide roller G2 may be brought close to each other (reduced interval) to make the sheet substrate FB is slack. By loosening the sheet substrate FB, the sheet substrate FB can be brought into contact with and adsorbed on the support surface Sa of the stage device ST without tension. Moreover, the control unit CONT moves the stage device ST to the +Z side, for example, while supporting the sheet substrate FB, thereby adjusting the Z-direction position of the sheet substrate FB. In this case, the control unit CONT moves the first guide roller G1 and the second guide roller G2 in the Z direction depending on the amount of movement of the stage device ST in the Z direction.

在片材基板FB之Z方向位置對準進行後,控制部CONT使用處理裝置10對片材基板FB中之第二部分F2之被處理面Fp進行既定處理。在一邊搬送該片材基板FB之第二部分F2、一邊進行處理之情形時,控制部CONT係一邊調整處理裝置10之處理時序與片材基板FB之搬送時序、一邊進行上述處理。在片材基板FB被吸附於載台裝置ST之情形時,控制部CONT係例如配合片材基板FB之移動使載台裝置ST移動於基板之搬送方向(例如-Y方向)。 After the alignment of the sheet substrate FB in the Z direction is performed, the control unit CONT performs predetermined processing on the processed surface Fp of the second portion F2 of the sheet substrate FB by the processing device 10. When the processing is performed while the second portion F2 of the sheet substrate FB is being conveyed, the control unit CONT performs the above-described processing while adjusting the processing timing of the processing apparatus 10 and the conveyance timing of the sheet substrate FB. When the sheet substrate FB is adsorbed to the stage device ST, the control unit CONT moves the stage device ST in the conveyance direction (for example, the -Y direction) of the substrate, for example, in accordance with the movement of the sheet substrate FB.

藉由對片材基板FB重複進行上述一連串之處理,於片材基板FB之被處理面Fp形成顯示元件之構成要件。 By repeating the above-described series of processes on the sheet substrate FB, the constituent elements of the display elements are formed on the processed surface Fp of the sheet substrate FB.

如以上所述,根據本實施形態,由於具備:將從第一方向(+X方向)搬送而來之片材基板FB相對該片材基板FB之寬度方向(Y方向)斜向彎折、 以將片材基板FB之搬送方向從第一方向變換為與該第一方向不同之第二方向(-Y方向)的第一導引滾筒G1,將從第二方向搬送而來之片材基板(往第二方向搬送之片材基板)FB相對該片材基板FB之寬度方向(X方向)斜向彎折、以將片材基板FB之搬送方向從第二方向變換為與該第二方向不同之第三方向(+X方向)的第二導引滾筒G2,以及設在第一導引滾筒G1及第二導引滾筒G2用以分別調整第一導引滾筒G1之位置及第二導引滾筒G2之位置、以調整在與第二方向交叉之方向之片材基板FB之位置的調整機構,因此可抑制與搬送方向不同方向之力作用於片材基板FB。如此,即能在抑制於片材基板FB形成皺摺等缺陷之同時、以高搬送精度搬送該片材基板FB。 As described above, according to the present embodiment, the sheet substrate FB conveyed from the first direction (+X direction) is obliquely bent in the width direction (Y direction) of the sheet substrate FB, The first guide roller G1 that converts the conveyance direction of the sheet substrate FB from the first direction to the second direction (−Y direction) different from the first direction, and the sheet substrate conveyed from the second direction (the sheet substrate conveyed in the second direction) FB is obliquely bent in the width direction (X direction) of the sheet substrate FB, and the conveyance direction of the sheet substrate FB is changed from the second direction to the second direction. a second guiding roller G2 having a different third direction (+X direction), and a first guiding roller G1 and a second guiding roller G2 for respectively adjusting the position of the first guiding roller G1 and the second guiding Since the position of the guide roller G2 and the adjustment mechanism for adjusting the position of the sheet substrate FB in the direction intersecting the second direction are suppressed, the force in the direction different from the conveyance direction acts on the sheet substrate FB. In this way, the sheet substrate FB can be conveyed with high conveyance precision while suppressing defects such as wrinkles on the sheet substrate FB.

又,根據本實施形態,由於係對片材基板FB中、位於第一導引滾筒G1與第二導引滾筒G2之間之第二部分F2進行處理,因此能使片材基板FB中進行該處理之部分有效率的移動。 Further, according to the present embodiment, since the second portion F2 located between the first guide roller G1 and the second guide roller G2 is processed in the sheet substrate FB, the sheet substrate FB can be made in the sheet substrate FB. Part of the processing is efficient.

<第二實施形態> <Second embodiment>

接著,說明本發明之第二實施形態。本實施形態,使用與第一實施形態之基板處理裝置FPA相同構成之基板處理裝置進行說明。以下,在記載基板處理裝置之各構成要件之情形時,係使用與在第一實施形態所使用之符號相同之符號。 Next, a second embodiment of the present invention will be described. In the present embodiment, a substrate processing apparatus having the same configuration as that of the substrate processing apparatus FPA of the first embodiment will be described. Hereinafter, in the case where each component of the substrate processing apparatus is described, the same reference numerals as those used in the first embodiment are used.

本實施形態,係說明例如藉由使第一導引滾筒G1及第二導引滾筒G2旋轉於θZ方向、以使片材基板FB相對搬送方向傾斜之動作。 In the present embodiment, an operation of tilting the first guide roller G1 and the second guide roller G2 in the θZ direction to incline the sheet substrate FB with respect to the conveyance direction will be described.

圖5係顯示使第一導引滾筒G1及第二導引滾筒G2旋轉於θZ方向之情形時,片材基板FB之搬送狀態的圖。圖5中,顯示了片材基板FB之第一部分F1及第三部分F3係分別維持搬送方向、同時在維持片材基板FB之第二部分之張力的狀態下,使第一導引滾筒G1旋轉之狀態。 FIG. 5 is a view showing a state in which the sheet substrate FB is conveyed when the first guide roller G1 and the second guide roller G2 are rotated in the θZ direction. In FIG. 5, the first guide roller G1 is rotated while the first portion F1 and the third portion F3 of the sheet substrate FB are respectively maintained in the conveyance direction while maintaining the tension of the second portion of the sheet substrate FB. State.

例如,在維持第一部分F1之搬送方向的狀態下僅使第一導引滾筒G1 旋轉之情形時,為避免第三部分F3之搬送方向變化,控制部CONT係使第一導引滾筒G1與第二導引滾筒G2同步繞θZ方向旋轉、並使第二導引滾筒G2往-X方向移動。此時,第二導引滾筒G2之旋轉中心相對第一導引滾筒G1之旋轉中心可有偏移。 For example, only the first guide roller G1 is maintained while maintaining the conveying direction of the first portion F1. In the case of rotation, in order to avoid a change in the conveying direction of the third portion F3, the control portion CONT rotates the first guide roller G1 and the second guide roller G2 in the θZ direction in synchronization, and causes the second guide roller G2 to move toward - Move in the X direction. At this time, the center of rotation of the second guide roller G2 may be offset from the center of rotation of the first guide roller G1.

此時,控制部CONT為了使第一導引滾筒G1與第二導引滾筒G2之間、旋轉開始之時序、旋轉方向、旋轉角度及旋轉速度一致,而使該第一導引滾筒G1及第二導引滾筒G2旋轉。又,控制部CONT根據片材基板FB因第一導引滾筒G1之旋轉而偏移之量,使第二導引滾筒G2往-X方向移動。 At this time, the control unit CONT makes the first guide roller G1 and the first guide roller in order to match the timing, the rotation direction, the rotation angle, and the rotation speed between the first guide roller G1 and the second guide roller G2. The two guide rollers G2 rotate. Moreover, the control unit CONT moves the second guide roller G2 in the -X direction in accordance with the amount by which the sheet substrate FB is displaced by the rotation of the first guide roller G1.

根據本實施形態,可藉由使第一導引滾筒G1及第二導引滾筒G2旋轉於θZ方向,以使片材基板FB之第二部分F2相對該第二部分F2之搬送方向(-Y方向)傾斜(tilt)。而且,亦可防止與各自之搬送方向不同方向之力作用於片材基板FB之第一部分F1~第三部分F3,而能防止於片材基板FB產生皺摺等之缺陷。如此,即能在保持片材基板FB之搬送狀態之同時、進行更高精度之搬送。 According to this embodiment, the first guide roller G1 and the second guide roller G2 can be rotated in the θZ direction so that the second portion F2 of the sheet substrate FB is transported in the opposite direction to the second portion F2 (-Y Direction) tilt (tilt). Further, it is possible to prevent the force in the direction different from the respective conveyance directions from acting on the first portion F1 to the third portion F3 of the sheet substrate FB, and it is possible to prevent defects such as wrinkles from occurring in the sheet substrate FB. In this way, it is possible to carry out conveyance with higher precision while maintaining the conveyance state of the sheet substrate FB.

此外,本實施形態,雖係以不使第一導引滾筒G1之X方向位置變化、而使第二導引滾筒G2之X方向位置移動之情形為例作了說明,但不限於此。例如亦可使第一導引滾筒G1及第二導引滾筒G2之兩方移動於X方向。此外,第一導引滾筒G1及第二導引滾筒G2之旋轉方向並不限於圖5所示方向,例如亦可作成旋轉於與圖5所示方向相反之方向。 Further, in the present embodiment, the case where the position of the second guide roller G2 in the X direction is not changed without changing the position of the first guide roller G1 in the X direction has been described as an example, but the present invention is not limited thereto. For example, both the first guide roller G1 and the second guide roller G2 may be moved in the X direction. Further, the rotation directions of the first guide roller G1 and the second guide roller G2 are not limited to the directions shown in FIG. 5, and may be rotated, for example, in a direction opposite to the direction shown in FIG.

<第三實施形態> <Third embodiment>

其次,說明本發明之第三實施形態。 Next, a third embodiment of the present invention will be described.

本實施形態,係說明設於基板處理裝置之第一導件及第二導件,係使用例如錘狀構件之構成。本實施形態之基板處理裝置,由於第一導件及第二導件以外之構成要件與上述各實施形態為相同構成,因此係賦予相同符號來說明。 In the present embodiment, the first guide and the second guide provided in the substrate processing apparatus are described, and for example, a hammer-shaped member is used. In the substrate processing apparatus of the present embodiment, the components other than the first guide and the second guide are the same as those of the above-described respective embodiments, and therefore, the same reference numerals will be given.

圖6係顯示從上方(+Z方向)觀察基板處理裝置FPA時之構成。 Fig. 6 shows the configuration when the substrate processing apparatus FPA is viewed from above (+Z direction).

如圖6所示,搬送裝置30,第一導件係使用第一錘狀構件G3、第二導件則使使用第二錘狀構件G4。當然,亦可以是僅於第一導件及第二導件中之一方適用第一錘狀構件G3或第二錘狀構件G4之構成。 As shown in Fig. 6, in the conveying device 30, the first weight member G3 and the second guide member use the second hammer member G4. Of course, the first hammer member G3 or the second hammer member G4 may be applied only to one of the first guide and the second guide.

第一錘狀構件G3及第二錘狀構件G4形成為例如圓錐形。具體而言,第一錘狀構件G3及第二錘狀構件G4分別具有圓形底面(一端部)80a及80b、且具有從該底面80a及80b往頂點(另一端部)81a及81b其外徑尺寸漸漸變小之側面(導引面)。 The first hammer member G3 and the second hammer member G4 are formed, for example, in a conical shape. Specifically, the first hammer-shaped member G3 and the second hammer-shaped member G4 each have a circular bottom surface (one end portion) 80a and 80b, and have a vertex (the other end portion) 81a and 81b from the bottom surface 80a and 80b. The side of the diameter that gradually becomes smaller (guide surface).

第一錘狀構件G3具有通過底面80a之中心點與頂點81a之中心軸C3。第一錘狀構件G3被配置其中心軸C3相對片材基板FB之第一部分F1之寬度方向(Y方向)平行。於第一錘狀構件G3設有使該錘狀構件G3以中心軸C3為中心旋轉之驅動機構61。此驅動機構61亦將第一錘狀構件G3驅動於X方向、Y方向及θZ方向。第一錘狀構件G3於側面(導引面)G3a導引片材基板。片材基板FB被支承於第一錘狀構件G3之側面G3a,直到在第一部分F1與第二部分F2,被處理面Fp為平行為止。 The first hammer member G3 has a central axis C3 passing through the center point of the bottom surface 80a and the apex 81a. The first hammer-shaped member G3 is disposed such that its central axis C3 is parallel to the width direction (Y direction) of the first portion F1 of the sheet substrate FB. The first hammer-shaped member G3 is provided with a drive mechanism 61 that rotates the hammer-shaped member G3 around the central axis C3. The drive mechanism 61 also drives the first hammer member G3 in the X direction, the Y direction, and the θZ direction. The first hammer member G3 guides the sheet substrate on the side surface (guide surface) G3a. The sheet substrate FB is supported by the side surface G3a of the first hammer-shaped member G3 until the processed surface Fp is parallel between the first portion F1 and the second portion F2.

第二錘狀構件G4具有通過底面80b之中心點與頂點81b之中心軸C4。第二錘狀構件G4被配置成中心軸C4相對片材基板FB之第二部分F2之寬度方向(X方向)平行。於第二錘狀構件G4設有使該錘狀構件G4以中心軸C4為中心旋轉之驅動機構63。此驅動機構61亦將第二錘狀構件G4驅動於X方向、Y方向及θZ方向。第二錘狀構件G4於側面(導引面)G4a導引片材基板。片材基板FB被支承於第二錘狀構件G4之側面G4a,直到在第二部分F2與第三部分F3,被處理面Fp為平行為止。 The second hammer member G4 has a central axis C4 passing through the center point of the bottom surface 80b and the apex 81b. The second hammer-shaped member G4 is disposed such that the central axis C4 is parallel to the width direction (X direction) of the second portion F2 of the sheet substrate FB. The second hammer-shaped member G4 is provided with a drive mechanism 63 that rotates the hammer-shaped member G4 around the central axis C4. The drive mechanism 61 also drives the second hammer member G4 in the X direction, the Y direction, and the θZ direction. The second hammer-shaped member G4 guides the sheet substrate on the side surface (guide surface) G4a. The sheet substrate FB is supported by the side surface G4a of the second hammer-shaped member G4 until the processed surface Fp is parallel between the second portion F2 and the third portion F3.

以此方式構成之基板處理裝置FPA,在使片材基板FB之例如第二部分F2往-X方向移動之情形時,控制部CONT可使第一錘狀構件G3及第二錘狀構件G4往-X方向例如翡次移動相等移動量。藉由第一錘狀構件G3及 第二錘狀構件G4之移動使片材基板FB捲繞之位置分別往-X方向移動,隨此,片材基板FB之第二部分F2往-X方向移動。 In the substrate processing apparatus FPA configured in this manner, when the second portion F2 of the sheet substrate FB is moved in the -X direction, the control portion CONT can cause the first hammer member G3 and the second hammer member G4 to The -X direction moves the equal amount of movement, for example. By the first hammer member G3 and The movement of the second hammer-shaped member G4 moves the position at which the sheet substrate FB is wound in the -X direction, and accordingly, the second portion F2 of the sheet substrate FB moves in the -X direction.

如以上所述,根據本實施形態,由於即使使第一錘狀構件G3及第二錘狀構件G4移動,亦能抑制與搬送方向不同方向之力作用於片材基板FB,因此能在例如片材基板FB不致產生皺摺等之情形,使片材基板FB之第二部分F2移動。 As described above, according to the present embodiment, even if the first weight member G3 and the second hammer member G4 are moved, the force in the direction different from the conveyance direction can be suppressed from acting on the sheet substrate FB. The material substrate FB does not cause wrinkles or the like, and the second portion F2 of the sheet substrate FB is moved.

又,使用第一錘狀構件G3及第二錘狀構件G4之情況時,如圖8所示,亦可將第二錘狀構件G4配置成第二錘狀構件G4之中心軸C4與第一錘狀構件G3之中心軸C4平行之構成。此場合下,亦能發揮與圖6所示構成相同之效果。而且,與圖6所示構成相較,由於可使載台裝置ST之移動可能範圍較廣,可說明是一種較佳構成。此外,圖8所示構成,雖係配置成中心軸C3及中心軸C4於Y方向平行之構成,但不限於此。亦可配置成例如中心軸C3及中心軸C4於X方向平行之構成。 Further, when the first hammer member G3 and the second hammer member G4 are used, as shown in FIG. 8, the second hammer member G4 may be disposed as the central axis C4 of the second hammer member G4 and the first The central axis C4 of the hammer member G3 is formed in parallel. Also in this case, the same effects as those shown in Fig. 6 can be exhibited. Further, as compared with the configuration shown in Fig. 6, since the movement of the stage device ST can be made wider, it can be explained that it is a preferable configuration. Further, the configuration shown in FIG. 8 is configured such that the central axis C3 and the central axis C4 are parallel in the Y direction, but the configuration is not limited thereto. It is also possible to arrange, for example, a configuration in which the central axis C3 and the central axis C4 are parallel in the X direction.

又,第一錘狀構件G3及第二錘狀構件G4之形狀,不限於例如從圖6至圖8所示之形成為圓錐狀之構成。例如,亦可適用形成為其他錘狀(楕圓錐狀、多角錘狀)之構成。此外,亦可適用例如於圓柱狀構件之一部分形成錐形部,使用該錐形部來彎折片材基板FB之構成。 Further, the shape of the first hammer-shaped member G3 and the second hammer-shaped member G4 is not limited to, for example, a configuration in which a conical shape is formed as shown in FIGS. 6 to 8 . For example, it is also possible to adopt a configuration in which another hammer shape (a conical shape or a polygonal hammer shape) is formed. Further, for example, a tapered portion may be formed in one of the cylindrical members, and the tapered portion may be used to bend the sheet substrate FB.

上述各實施形態雖係以使第一導件及第二導件旋轉之構成為例作了說明,但不限於此。例如,亦可使用固定在基板處理裝置FPA內之圓柱狀構件及圓筒狀構件、錘狀構件。使用此種圓柱狀構件及圓筒狀構件、錘狀構件之情形時,除了沒有導引滾筒G般之旋轉動作之點以外,可以和導引滾筒G相同之動作進行片材基板FB之位置調整。 In each of the above embodiments, the configuration in which the first guide and the second guide are rotated is described as an example, but the present invention is not limited thereto. For example, a cylindrical member fixed to the substrate processing apparatus FPA, a cylindrical member, or a hammer-shaped member may be used. When such a cylindrical member, a cylindrical member, or a hammer-shaped member is used, the position adjustment of the sheet substrate FB can be performed in the same operation as the guide roller G except that the rotation of the roller G is not performed. .

又,使用此種固定之圓柱狀構件、圓筒狀構件及錘狀構件之情形時,可僅保留支承片材基板FB背面之導引面,而去除導引面以外之部分。 Further, in the case of using such a fixed cylindrical member, a cylindrical member, and a hammer-shaped member, only the guide surface on the back surface of the support sheet substrate FB can be retained, and portions other than the guide surface can be removed.

又,上述各實施形態中,使用圓柱狀構件、圓筒狀構件、錘狀構件作 為第一導件及第二導件之情形時,雖係以將片材基板FB接觸於此等第一導件及第二導件之構成為例作了說明,但不限於此。例如,亦可作成片材基板FB與導件為非接觸狀態之構成。作為此種構成,例如有在第一導件及第二導件表面形成氣體層,透過該氣體層保持片材基板FB之構成等。 Further, in each of the above embodiments, a cylindrical member, a cylindrical member, and a hammer member are used. In the case of the first guide member and the second guide member, the configuration in which the first guide member and the second guide member are brought into contact with the sheet substrate FB is described as an example, but the invention is not limited thereto. For example, it is also possible to form a configuration in which the sheet substrate FB and the guide are in a non-contact state. As such a configuration, for example, a gas layer is formed on the surfaces of the first guide and the second guide, and the configuration of the sheet substrate FB is maintained through the gas layer.

此外,上述實施形態,雖係以在片材基板FB中、第一導引滾筒G1與第二導引滾筒G2之間之部分配置對準攝影機51,使用對準攝影機51之檢測結果來驅動第一導引滾筒G1及第二導引滾筒G2之構成為例作了說明。除此之外,亦可作成在例如較第一導引滾筒G1更靠搬送方向上流側及較第二導引滾筒G2更靠搬送方向下流側中之至少一方,配給其他對準攝影機之構成。此場合,可另行設置根據另外配置之對準攝影機之檢測結果來調整片材基板FB之位置的調整機構。又,作為此種調整機構,可使用例如滾筒裝置R、或其他構成。 Further, in the above-described embodiment, the alignment camera 51 is disposed in the portion between the first guide roller G1 and the second guide roller G2 in the sheet substrate FB, and the detection result of the alignment camera 51 is used to drive the first. The configuration of a guide roller G1 and a second guide roller G2 is described as an example. In addition, for example, at least one of the upstream side in the transport direction from the first guide roller G1 and the downstream side in the transport direction from the second guide roller G2 may be disposed, and other alignment cameras may be provided. In this case, an adjustment mechanism for adjusting the position of the sheet substrate FB according to the detection result of the separately arranged alignment camera may be separately provided. Further, as such an adjustment mechanism, for example, a roller device R or other configuration can be used.

又,上述實施形態雖係以使用形成在片材基板FB之對準標記AM進行片材基板FB之位置對準之構成為例作了說明,但不限於此。例如,即便是未於片材基板FB形成對準標記之情形時,亦可以是藉由對準攝影機51檢測片材基板FB中與搬送方向平行之兩邊,並使用該檢測結果進行片材基板FB之位置對準之構成。 Further, in the above-described embodiment, the configuration in which the alignment of the sheet substrate FB is performed using the alignment mark AM formed on the sheet substrate FB has been described as an example, but the present invention is not limited thereto. For example, even when the alignment mark is not formed on the sheet substrate FB, the alignment camera 51 may detect both sides parallel to the conveyance direction of the sheet substrate FB, and use the detection result to perform the sheet substrate FB. The composition of the position alignment.

又,上述實施形態雖係以載台裝置ST中、支承片材基板FB之支承面Sa形成為平坦面之情形為例作了說明,但不限於此。無論例如支承面Sa係形成為凹狀或凸狀之曲面,皆可有本發明之適用。此外,於載台裝置ST配置滾筒並使用該滾筒表面之一部分作為支承面Sa亦可。 In the above-described embodiment, the case where the support surface Sa of the support sheet substrate FB is formed into a flat surface in the stage device ST has been described as an example, but the present invention is not limited thereto. The application of the present invention can be applied regardless of, for example, that the support surface Sa is formed into a concave or convex curved surface. Further, it is also possible to arrange the drum on the stage device ST and use one of the surface of the drum as the support surface Sa.

又,上述實施形態雖係以在片材基板FB之位置對準後將該片材基板FB吸附於載台裝置ST之情形為例作了說明,但不限於此。例如亦可在片材基板FB之位置對準前,例如將片材基板FB吸附於載台裝置ST之吸附部40。此場合,於進行片材基板FB之位置對準時,例如使載台裝置ST之 驅動與第一導引滾筒G1及第二導引滾筒G2之驅動同步,一邊維持作用於片材基板FB之力之方向、一邊調整該片材基板FB之位置。 In the above embodiment, the case where the sheet substrate FB is adsorbed to the stage device ST after the alignment of the sheet substrate FB is described as an example, but the present invention is not limited thereto. For example, the sheet substrate FB may be adsorbed to the adsorption unit 40 of the stage device ST before the position of the sheet substrate FB is aligned. In this case, when the positional alignment of the sheet substrate FB is performed, for example, the stage device ST is The drive is synchronized with the driving of the first guide roller G1 and the second guide roller G2, and the position of the sheet substrate FB is adjusted while maintaining the direction of the force acting on the sheet substrate FB.

上述實施形態所記載之第一導件及第二導件,並不限於配置在例如夾著處理裝置10之位置,而可適當配置在基板處理裝置FPA中之片材基板FB之搬送路徑。又,上述實施形態中,配置在第一導件與第二導件之間之處理裝置10可以是單數、亦可以是複數。 The first guide and the second guide described in the above embodiment are not limited to being disposed at a position where the processing device 10 is interposed, and can be appropriately disposed in the transport path of the sheet substrate FB in the substrate processing apparatus FPA. Further, in the above embodiment, the processing device 10 disposed between the first guide and the second guide may be singular or plural.

又,亦可在第一導引滾筒G1與第一導引滾筒G1上流側之滾筒裝置R之間作出未圖示之鬆弛部、在第二導引滾筒G2與第二導引滾筒G2下流側之滾筒裝置R之間作出鬆弛部。進一步的,亦可以是將上流側之滾筒裝置R及下流側之滾筒裝置R接觸於片材基板FB之表面及背面,並挾持片材基板FB之構成。 Further, a slack portion (not shown) may be formed between the first guide roller G1 and the roller device R on the upstream side of the first guide roller G1, and the downstream side of the second guide roller G2 and the second guide roller G2 may be formed. A slack is formed between the roller devices R. Further, the roller device R on the upstream side and the roller device R on the downstream side may be in contact with the front and back surfaces of the sheet substrate FB, and the sheet substrate FB may be sandwiched.

<第四實施形態> <Fourth embodiment>

接著,說明本發明之第四實施形態。圖9係顯示本發明第四實施形態之基板處理裝置FPA之構成的圖。以下之說明中,對與上述實施形態相同或同等之構成部分係賦予相同符號並簡化或省略其說明。 Next, a fourth embodiment of the present invention will be described. Fig. 9 is a view showing the configuration of a substrate processing apparatus FPA according to a fourth embodiment of the present invention. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

本實施形態中,如圖9所示,基板處理部PR將從基板供應部SU供應之片材基板FB搬送往基板回收部CL、並在搬送過程中對片材基板FB之被處理面Fp進行處理。基板處理部PR具有例如處理裝置10、搬送裝置30及對準裝置(未圖示)等。 In the present embodiment, as shown in FIG. 9, the substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate collection unit CL, and performs the processed surface Fp of the sheet substrate FB during the transfer. deal with. The substrate processing unit PR includes, for example, a processing device 10, a transfer device 30, an alignment device (not shown), and the like.

處理裝置10,具有用以對片材基板FB之被處理面Fp形成例如有機EL元件之各種處理部(例如處理部10A及處理部10B等)。作為此種處理部,設有例如用以於被處理面Fp上形成間隔壁之間隔壁形成裝置、用以形成用來驅動有機EL元件之電極之電極形成裝置、以及用以形成發光層之發光層形成裝置等。具體而言,有液滴塗布裝置(例如噴墨型塗布裝置、旋轉塗布型塗布裝置等)、蒸鍍裝置、濺鍍裝置等之成膜裝置、及曝光裝置、顯影裝置、 表面改質裝置、洗淨裝置等。此等各裝置係適當的例如設在片材基板FB之搬送路徑上。 The processing device 10 includes various processing units (for example, the processing unit 10A and the processing unit 10B) for forming, for example, an organic EL element on the processed surface Fp of the sheet substrate FB. As such a processing portion, for example, a partition wall forming device for forming a partition wall on the surface Fp to be processed, an electrode forming device for forming an electrode for driving the organic EL element, and a light emitting layer for forming the light emitting layer are provided. Layer forming device or the like. Specifically, there are a film forming device such as a droplet applying device (for example, an inkjet coating device or a spin coating coating device), a vapor deposition device, and a sputtering device, and an exposure device and a developing device. Surface modification device, cleaning device, and the like. These devices are suitably provided, for example, on the transport path of the sheet substrate FB.

搬送裝置30,具有在基板處理部PR內例如將片材基板FB往基板回收部CL側搬送之滾筒裝置R、與以夾著處理裝置10之方式配置在該處理裝置10之上流側及下流側之導引滾筒G。滾筒裝置R沿著片材基板FB之搬送路徑設置有例如複數個。於複數個滾筒裝置R中之至少一部分之滾筒裝置R安裝有驅動機構(未圖示)。藉由此種滾筒裝置R之旋轉,將片材基板FB搬送於X軸方向。又,亦可以是複數個滾筒裝置R中之例如部分滾筒裝置R設置成能於與搬送方向正交之方向移動之構成。於基板處理部PR全體,片材基板FB係被搬送於+X方向。 The conveyance device 30 has a roller device R that conveys the sheet substrate FB toward the substrate collection portion CL side in the substrate processing portion PR, and is disposed on the flow side and the downstream side of the processing device 10 so as to sandwich the processing device 10 Guide roller G. The roller device R is provided, for example, in plural along the transport path of the sheet substrate FB. A drive mechanism (not shown) is attached to the roller device R of at least a part of the plurality of roller devices R. The sheet substrate FB is conveyed in the X-axis direction by the rotation of the roller device R. Further, for example, a part of the plurality of roller devices R may be configured to be movable in a direction orthogonal to the conveying direction. In the entire substrate processing unit PR, the sheet substrate FB is transported in the +X direction.

圖10係顯示處理裝置10及導引滾筒G之構成的概略圖。又,圖10顯示了從上方(+Z方向)觀察基板處理裝置FPA時之構成。 FIG. 10 is a schematic view showing the configuration of the processing device 10 and the guide roller G. Moreover, FIG. 10 shows the configuration when the substrate processing apparatus FPA is viewed from above (+Z direction).

如圖10所示,導引滾筒G具有第一導引滾筒G21、第二導引滾筒G22、第三導引滾筒G23及第四導引滾筒G24。第一導引滾筒G21~第四導引滾筒G24係從片材基板FB之搬送路徑上流側往下流側依序配置。第一導引滾筒G21~第四導引滾筒G24分形成為例如圓柱狀或圓筒狀等。 As shown in FIG. 10, the guide roller G has a first guide roller G21, a second guide roller G22, a third guide roller G23, and a fourth guide roller G24. The first guide roller G21 to the fourth guide roller G24 are arranged in order from the upstream side to the downstream side of the transport path of the sheet substrate FB. The first guide roller G21 to the fourth guide roller G24 are formed, for example, in a cylindrical shape or a cylindrical shape.

第一導引滾筒G21被配置成相對從該第一導引滾筒G21上流側往第一方向(+X方向)搬送而來之片材基板FB之第一部分(被第一導引滾筒G21導引前之部分,亦即相對第一導引滾筒G21、片材基板FB之上流側部分)F1之短邊方向(寬度方向:此處為Y方向),其中心軸C1傾斜於斜方向。第一導引滾筒G21於滾筒表面(導引面)G21a導引片材基板FB之背面。又,從第一導引滾筒G21上流側搬送而來之片材基板FB,於圖10中,係片材基板FB之背面Fq朝向上方之狀態。 The first guide roller G21 is disposed to be guided by the first guide roller G21 with respect to the first portion of the sheet substrate FB conveyed from the upstream side of the first guide roller G21 in the first direction (+X direction) The front portion, that is, the short side direction (width direction: here, Y direction) with respect to the first guide roller G21 and the upper side portion F1 of the sheet substrate FB, the central axis C1 is inclined in the oblique direction. The first guide roller G21 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G21a. Moreover, the sheet substrate FB conveyed from the upstream side of the first guide roller G21 is in a state in which the back surface Fq of the sheet substrate FB faces upward.

第一導引滾筒G21將片材基板FB之第一部分F1相對該片材基板FB之短邊方向彎向斜方向、並沿著第一導引滾筒G21之滾筒表面折返片材基 板FB,據以將片材基板FB之搬送方向從上述第一方向變換為第二方向(-Y方向)。本實施形態中,第一導引滾筒G21可將片材基板FB實質的加以斜向彎折。片材基板FB可透過第一導引滾筒G21在扭轉(twist)之同時彎折。於片材基板FB,在被第一導引滾筒G21導引之部分,可形成有相對搬送方向(第一方向)傾斜之部分的周面。具有第一方向(+X方向)之行進方向之片材基板FB進入第一導引滾筒G21。具有第二方向(-Y方向)之行進方向之片材基板FB從第一導引滾筒G21出來。本實施形態中,該第二方向係例如與第一方向正交之方向。第一導引滾筒G21一邊支承片材基板FB之背面Fq、一邊將該片材基板FB折返。例如,被第一導引滾筒G21折返之片材基板FB,於第二方向,被處理面Fp朝向上方(處理裝置10側)。又,片材基板FB係支承於該第一導引滾筒G21之滾筒表面G21a,直到在第一導引滾筒G21之前後,第一部分F1與後述第二部分F2彼此平行為止。 The first guide roller G21 bends the first portion F1 of the sheet substrate FB obliquely with respect to the short side direction of the sheet substrate FB, and folds back the sheet base along the drum surface of the first guide roller G21. The plate FB converts the conveyance direction of the sheet substrate FB from the first direction to the second direction (-Y direction). In the present embodiment, the first guide roller G21 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB can be bent while being twisted by the first guide roller G21. In the portion of the sheet substrate FB that is guided by the first guide roller G21, a peripheral surface that is inclined with respect to the transport direction (first direction) can be formed. The sheet substrate FB having the traveling direction of the first direction (+X direction) enters the first guide roller G21. The sheet substrate FB having the traveling direction of the second direction (-Y direction) comes out of the first guide roller G21. In the present embodiment, the second direction is, for example, a direction orthogonal to the first direction. The first guide roller G21 folds back the sheet substrate FB while supporting the back surface Fq of the sheet substrate FB. For example, the sheet substrate FB folded back by the first guide roller G21 faces the processed surface Fp in the second direction (on the side of the processing apparatus 10). Further, the sheet substrate FB is supported by the drum surface G21a of the first guide roller G21 until the first portion F1 and the second portion F2 described later are parallel to each other after the first guide roller G21.

第二導引滾筒G22被配置成相對從該第二導引滾筒G22上流側往第二方向搬送而來之片材基板FB之第二部分(被第二導引滾筒G22導引前之部分,亦即相對第二導引滾筒G22、片材基板FB之上流側部分)F2,其中心軸C2傾斜於斜方向。第二導引滾筒G22於滾筒表面(導引面)G22a導引片材基板FB之背面。又,從第二導引滾筒G22上流側搬送而來之片材基板FB,於圖10中,如前所述,係片材基板FB之被處理面Fp朝向上方之狀態。 The second guide roller G22 is disposed so as to be opposite to the second portion of the sheet substrate FB (the portion guided by the second guide roller G22) from the upstream side of the second guide roller G22 to the second direction, That is, the center axis C2 is inclined to the oblique direction with respect to the second guide roller G22 and the upper flow side portion F2 of the sheet substrate FB. The second guide roller G22 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G22a. Moreover, in the sheet substrate FB conveyed from the upstream side of the second guide roller G22, as shown in FIG. 10, the processed surface Fp of the sheet substrate FB is directed upward.

第二導引滾筒G22將片材基板FB之第二部分F2相對該片材基板FB之短邊方向彎向斜方向、並沿著第二導引滾筒G22之滾筒表面折返片材基板FB,據以將片材基板FB之搬送方向從上述第二方向變換為第三方向(+X方向)。本實施形態中,第二導引滾筒G22可將片材基板FB實質的加以斜向彎折。片材基板FB可透過第二導引滾筒G22在扭轉(twist)之同時彎折。於片材基板FB,可在被第二導引滾筒G22導引之部分,形成相對搬送方向(第二方向)傾斜之部分周面。具有第二方向(-Y方向)之行進方向之片材基 板FB進入第二導引滾筒G22。具有第三方向(+X方向)之行進方向之片材基板FB從第二導引滾筒G22出來。本實施形態中,該第三方向係例如與第一方向平行之方向。第二導引滾筒G22一邊支承片材基板FB之背面Fq、一邊折返該片材基板FB。例如,被第二導引滾筒G22折返之片材基板FB,於第三方向,成為背面Fq朝向上方、被處理面Fp朝向下方之狀態。又,片材基板FB被該第二導引滾筒G22之滾筒表面G22a支承,直到在第二導引滾筒G22之前後,第二部分F2與後述第三部分F3彼此平行為止。 The second guiding roller G22 bends the second portion F2 of the sheet substrate FB in an oblique direction with respect to the short side direction of the sheet substrate FB, and folds back the sheet substrate FB along the surface of the roller of the second guiding roller G22. The conveyance direction of the sheet substrate FB is changed from the second direction to the third direction (+X direction). In the present embodiment, the second guide roller G22 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB can be bent while twisting through the second guide roller G22. In the sheet substrate FB, a portion of the peripheral surface inclined with respect to the transport direction (second direction) can be formed in a portion guided by the second guide roller G22. Sheet base having a traveling direction in the second direction (-Y direction) The plate FB enters the second guide roller G22. The sheet substrate FB having the traveling direction of the third direction (+X direction) comes out of the second guide roller G22. In the present embodiment, the third direction is, for example, a direction parallel to the first direction. The second guide roller G22 folds back the sheet substrate FB while supporting the back surface Fq of the sheet substrate FB. For example, in the third direction, the sheet substrate FB folded back by the second guide roller G22 is in a state in which the back surface Fq faces upward and the processed surface Fp faces downward. Further, the sheet substrate FB is supported by the drum surface G22a of the second guide roller G22 until the second portion F2 and the third portion F3 described later are parallel to each other after the second guide roller G22.

第三導引滾筒G23被配置成相對從該第三導引滾筒G23上流側往第三方向(+X方向)搬送而來之片材基板FB之第三部分(被第三導引滾筒G23導引前之部分,亦即相對第三導引滾筒G23、片材基板FB之上流側部分)F3之短邊方向(寬度方向:此處為Y方向),其中心軸C3傾斜向斜方向。第三導引滾筒G23於滾筒表面(導引面)G23a導引片材基板FB之背面。又,從第三導引滾筒G23之上流側搬送而來之片材基板FB,於圖10中,係如前述般片材基板FB之背面Fq朝向上方之狀態。 The third guide roller G23 is disposed to be guided by the third guide roller G23 with respect to the third portion of the sheet substrate FB conveyed from the upstream side of the third guide roller G23 in the third direction (+X direction). The front portion, that is, the short side direction (width direction: here, Y direction) with respect to the third guide roller G23 and the upper side portion F3 of the sheet substrate FB, the central axis C3 is inclined obliquely. The third guide roller G23 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G23a. In addition, in the sheet substrate FB which is conveyed from the upstream side of the third guide roller G23, the back surface Fq of the sheet substrate FB is oriented upward as shown in FIG.

第三導引滾筒G23將片材基板FB之第三部分F3相對該片材基板FB之短邊方向彎向斜方向、並沿著第三導引滾筒G23之滾筒表面折返片材基板FB,據以將片材基板FB之搬送方向從上述第三方向變換為第四方向(+Y方向)。本實施形態中,第三導引滾筒G23可將片材基板FB實質的加以斜向彎折。片材基板FB可透過第三導引滾筒G23在在扭轉(twist)之同時彎折。於片材基板FB,可在被第三導引滾筒G23導引之部分,形成相對搬送方向(第三方向)傾斜之部分周面。具有第三方向(+X方向)之行進方向之片材基板FB進入第三導引滾筒G23。具有第四方向(+Y方向)之行進方向之片材基板FB從第三導引滾筒G23出來。本實施形態中,該第四方向係例如與第一方向及第三方向正交之方向、與第二方向相反之方向。第三導引滾筒G23一邊支承片材基板FB之背面Fq、一邊折返該片材基板FB。例如, 被第三導引滾筒G23折返之片材基板FB,於第四方向,成為被處理面Fp朝向上方而能被處理裝置10進行被處理面之處理。又,片材基板FB被支承於該第三導引滾筒G23之滾筒表面G23a,直到在第三導引滾筒G23之前後,第三部分與後述第四部分彼此平行為止。 The third guiding roller G23 bends the third portion F3 of the sheet substrate FB in an oblique direction with respect to the short side direction of the sheet substrate FB, and folds back the sheet substrate FB along the drum surface of the third guiding roller G23. The conveyance direction of the sheet substrate FB is changed from the third direction to the fourth direction (+Y direction). In the present embodiment, the third guide roller G23 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB can be bent while being twisted through the third guide roller G23. In the sheet substrate FB, a portion of the peripheral surface inclined with respect to the transport direction (third direction) can be formed in a portion guided by the third guide roller G23. The sheet substrate FB having the traveling direction in the third direction (+X direction) enters the third guide roller G23. The sheet substrate FB having the traveling direction of the fourth direction (+Y direction) comes out of the third guide roller G23. In the present embodiment, the fourth direction is, for example, a direction orthogonal to the first direction and the third direction and a direction opposite to the second direction. The third guide roller G23 folds back the sheet substrate FB while supporting the back surface Fq of the sheet substrate FB. E.g, The sheet substrate FB folded back by the third guide roller G23 is processed in the fourth direction so that the processed surface Fp faces upward and can be processed by the processing apparatus 10. Further, the sheet substrate FB is supported by the drum surface G23a of the third guide roller G23 until the third portion and the fourth portion to be described later are parallel to each other before the third guide roller G23.

第四導引滾筒G24被配置成相對從該第四導引滾筒G24之上流側往第四方向(+Y方向)搬送而來之片材基板FB之第四部分(被第四導引滾筒G24導引前之部分,亦即相對第四導引滾筒G24、片材基板FB之上流側部分)F4,其中心軸C4傾斜於斜方向。第四導引滾筒G24於滾筒表面(導引面)G24a導引片材基板FB之背面。又,從第四導引滾筒G24上流側搬送而來之片材基板FB,於圖10中,如前所述,成為片材基板FB之被處理面Fp朝向上方之狀態。 The fourth guide roller G24 is disposed to be the fourth portion of the sheet substrate FB (the fourth guide roller G24) that is transported from the upper flow side of the fourth guide roller G24 to the fourth direction (+Y direction). The portion before the guiding, that is, the fourth guiding roller G24 and the upper side portion F4 of the sheet substrate FB, the central axis C4 thereof is inclined in the oblique direction. The fourth guide roller G24 guides the back surface of the sheet substrate FB on the drum surface (guide surface) G24a. In addition, as shown in FIG. 10, the sheet substrate FB conveyed from the upstream side of the fourth guide roller G24 is in a state in which the processed surface Fp of the sheet substrate FB is directed upward.

第四導引滾筒G24將片材基板FB之第四部分F4相對該片材基板FB之短邊方向彎向斜方向、並沿第四導引滾筒G24之滾筒表面折返片材基板FB,據以將片材基板FB之搬送方向從上述第四方向變換為第五方向(+X方向)。本實施形態中,第四導引滾筒G24可將片材基板FB實質的加以斜向彎折。片材基板FB透過第四導引滾筒G24在扭轉(twist)之同時彎折。於片材基板FB,在被第四導引滾筒G24導引之部分,可形成相對搬送方向(第四方向)傾斜之部分周面。具有第四方向(+Y方向)之行進方向之片材基板FB進入第四導引滾筒G24。具有第五方向(+X方向)之行進方向之片材基板FB從第四導引滾筒G24出來。本實施形態中,該第五方向係與例如第一方向及第三方向平行之方向。第四導引滾筒G24一邊支承片材基板FB之背面Fq、一邊折返該片材基板FB。例如被第四導引滾筒G24折返之片材基板FB,於第五方向,成為背面Fq朝向上方、被處理面Fp朝向下方之狀態。又,片材基板FB被支承於該第四導引滾筒G24之滾筒表面G24a,直到在第四導引滾筒G24之前後,第四部分F4與第五部分F5(被第四導引滾筒G24 導引後之部分,亦即相對第四導引滾筒G24、片材基板FB之下流側部分)彼此平行為止。 The fourth guiding roller G24 bends the fourth portion F4 of the sheet substrate FB in an oblique direction with respect to the short side direction of the sheet substrate FB, and folds back the sheet substrate FB along the drum surface of the fourth guiding roller G24. The conveyance direction of the sheet substrate FB is changed from the fourth direction to the fifth direction (+X direction). In the present embodiment, the fourth guide roller G24 can substantially bend the sheet substrate FB obliquely. The sheet substrate FB is bent while being twisted by the fourth guide roller G24. In the portion of the sheet substrate FB guided by the fourth guide roller G24, a partial peripheral surface inclined with respect to the transport direction (fourth direction) can be formed. The sheet substrate FB having the traveling direction of the fourth direction (+Y direction) enters the fourth guide roller G24. The sheet substrate FB having the traveling direction of the fifth direction (+X direction) comes out of the fourth guide roller G24. In the present embodiment, the fifth direction is parallel to, for example, the first direction and the third direction. The fourth guide roller G24 folds back the sheet substrate FB while supporting the back surface Fq of the sheet substrate FB. For example, in the fifth direction, the sheet substrate FB folded back by the fourth guide roller G24 is in a state in which the back surface Fq faces upward and the processed surface Fp faces downward. Further, the sheet substrate FB is supported by the drum surface G24a of the fourth guide roller G24 until after the fourth guide roller G24, the fourth portion F4 and the fifth portion F5 (by the fourth guide roller G24) The guided portion, that is, the fourth guide roller G24 and the lower flow side portion of the sheet substrate FB are parallel to each other.

被上述四個導引滾筒G21~G24搬送之片材基板FB之搬送方向,於第一部分F1為+X方向(第一方向)、於第二部分F2為-Y方向(第二方向)、於第三部分F3再次為+X方向(第三方向)、於第四部分F4為+Y方向(第四方向)、於第五部分F5則為+X方向(第五方向)。 The conveyance direction of the sheet substrate FB conveyed by the four guide rollers G21 to G24 is the +X direction (first direction) in the first portion F1 and the -Y direction (second direction) in the second portion F2. The third portion F3 is again in the +X direction (third direction), the fourth portion F4 is in the +Y direction (fourth direction), and the fifth portion F5 is in the +X direction (the fifth direction).

此時,片材基板FB於第一方向、第三方向及第五方向係片材基板FB之背面Fq朝向上方、於第二方向及第三方向則係片材基板FB之被處理面Fp朝向上方。 At this time, the sheet substrate FB faces the front surface Fq of the first direction, the third direction, and the fifth direction sheet substrate FB, and the processed surface Fp of the sheet substrate FB in the second direction and the third direction. Above.

承上所述,由於在以處理裝置10(處理部10A、處理部10B)對片材基板FB之被處理面Fp進行處理之前,被處理面Fp係朝向下,因此能降低塵屑等對被處理面Fp之附著。 As described above, the processed surface Fp is directed downward before the processing surface 10 of the sheet substrate FB is processed by the processing apparatus 10 (the processing unit 10A and the processing unit 10B), so that the dust and the like can be reduced. The attachment of the surface Fp is processed.

如前所述,片材基板FB係以第一導引滾筒G21、第二導引滾筒G22、第三導引滾筒G23及第四導引滾筒G24分別為彎角之曲柄狀路徑被搬送。又,被第四導引滾筒G24彎折之片材基板FB,則往第五方向、亦即作為基板處理部PR整體之片材基板FB之搬送方向搬送。 As described above, the sheet substrate FB is conveyed by a crank-shaped path in which the first guide roller G21, the second guide roller G22, the third guide roller G23, and the fourth guide roller G24 are each an angled corner. In addition, the sheet substrate FB which is bent by the fourth guide roller G24 is conveyed in the fifth direction, that is, in the conveyance direction of the sheet substrate FB which is the entire substrate processing portion PR.

此外,如圖10所示,處理裝置10具有處理部10A及處理部10B。處理部10A係例如於Y方向設在第一導引滾筒G21與第二導引滾筒G22之間之位置,配置成對向於片材基板FB之第二部分F2之被處理面Fp。處理部10B則係例如於Y方向設在第三導引滾筒G23與第四導引滾筒G24之間之位置,配置成對向於片材基板FB之第四部分F4之被處理面Fp。本實施形態中,處理部10A及處理部10B係進行例如互異之處理。 Moreover, as shown in FIG. 10, the processing apparatus 10 has the processing part 10A and the processing part 10B. The processing unit 10A is disposed at a position between the first guide roller G21 and the second guide roller G22 in the Y direction, for example, and is disposed to face the processed surface Fp of the second portion F2 of the sheet substrate FB. The processing unit 10B is disposed at a position between the third guide roller G23 and the fourth guide roller G24 in the Y direction, for example, and is disposed to face the processed surface Fp of the fourth portion F4 of the sheet substrate FB. In the present embodiment, the processing unit 10A and the processing unit 10B perform processing such as mutual exclusion.

處理部10A,例如係連接於驅動機構11、設置成可移動於例如X方向及Y方向。例如,處理部10A可在第二部分F2上之第一位置A1與第四部分F4上之第二位置A2之間移動(X方向移動)。又,處理部10A可在第二部 分F2上及第四部分F4上移動(Y方向移動)。 The processing unit 10A is connected to, for example, the drive mechanism 11 and is provided to be movable in, for example, the X direction and the Y direction. For example, the processing unit 10A is movable between the first position A1 on the second portion F2 and the second position A2 on the fourth portion F4 (moving in the X direction). Moreover, the processing unit 10A can be in the second part Move on the F2 and the fourth part F4 (moving in the Y direction).

處理部10B係例如連接於驅動機構12、設置成例如能於X方向及Y方向移動。例如,處理部10B能在第四部分F4上之第一位置B1與第二部分F2上之第二位置B2之間移動(X方向移動)。又,處理部10B可在第二部分F2上及第四部分F4上移動(Y方向移動)。 The processing unit 10B is connected to, for example, the drive mechanism 12 and is provided to be movable in the X direction and the Y direction, for example. For example, the processing unit 10B can move between the first position B1 on the fourth portion F4 and the second position B2 on the second portion F2 (moving in the X direction). Further, the processing unit 10B is movable on the second portion F2 and the fourth portion F4 (moving in the Y direction).

第一導引滾筒G21~第四導引滾筒G24,係被例如未圖示之軸承構件等支承。於各軸承構件設有使第一導引滾筒G21~第四導引滾筒G24旋轉之驅動機構(未圖示)。驅動機構使第一導引滾筒G21~第四導引滾筒G24分別以中心軸C1~C4為中心旋轉。 The first guide roller G21 to the fourth guide roller G24 are supported by, for example, a bearing member (not shown). A drive mechanism (not shown) that rotates the first guide roller G21 to the fourth guide roller G24 is provided in each of the bearing members. The drive mechanism rotates the first guide roller G21 to the fourth guide roller G24 around the central axes C1 to C4, respectively.

又,亦可作成在片材基板FB中之第二部分F2及第四部分F4之-Z側配置載台裝置之構成。該載台裝置支承被處理部10A及處理部10B處理之部分。載台裝置中之支承第二部分F2及第四部分F4之支承面,可以是平坦面、亦可以是曲面。 Further, a configuration in which the stage device is disposed on the -Z side of the second portion F2 and the fourth portion F4 of the sheet substrate FB may be employed. The stage device supports a portion to be processed by the processing unit 10A and the processing unit 10B. The support surface of the stage device supporting the second portion F2 and the fourth portion F4 may be a flat surface or a curved surface.

未圖示之對準裝置,對片材基板FB進行對準動作。此對準裝置,具有檢測片材基板FB之位置狀態的對準攝影機(未圖示)、與根據該對準攝影機之檢測結果於X方向、Y方向、Z方向、θX方向、θY方向、θZ方向進行片材基板FB之微調整的調整機構(未圖示)。又,於片材基板FB之被處理面Fp形成有例如未圖示之對準標記。對準標記形成在被處理面Fp中、例如片材基板FB之短邊方向兩端部。 An alignment device (not shown) performs an alignment operation on the sheet substrate FB. The alignment device has an alignment camera (not shown) that detects the positional state of the sheet substrate FB, and an X-direction, a Y-direction, a Z-direction, a θX direction, a θY direction, and a θZ according to the detection result of the alignment camera. An adjustment mechanism (not shown) for finely adjusting the sheet substrate FB in the direction. Further, an alignment mark (not shown) is formed on the processed surface Fp of the sheet substrate FB. The alignment marks are formed on both ends of the processed surface Fp, for example, the short side direction of the sheet substrate FB.

以上述方式構成之基板處理裝置FPA,藉由控制部CONT之控制,以捲繞方式製造有機EL元件、液晶顯示元件等之顯示元件(電子元件)。以下,說使用上述構成之基板處理裝置FPA製造顯示元件之製程。 In the substrate processing apparatus FPA configured as described above, a display element (electronic element) such as an organic EL element or a liquid crystal display element is manufactured by a control of the control unit CONT. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described.

首先,捲繞在捲筒之帶狀片材基板FB安裝於基板供應部SU。控制部CONT使捲筒旋轉,以從此狀態從基板供應部SU送出該片材基板FB。並將通過基板處理部PR之該片材基板FB以基板回收部CL之捲筒加以捲繞。 藉由控制此基板供應部SU及基板回收部CL,即能相對基板處理部PR連續搬送片材基板FB之被處理面Fp。 First, the strip-shaped sheet substrate FB wound around the reel is attached to the substrate supply portion SU. The control unit CONT rotates the reel to feed the sheet substrate FB from the substrate supply unit SU from this state. The sheet substrate FB passing through the substrate processing unit PR is wound by a roll of the substrate collecting portion CL. By controlling the substrate supply unit SU and the substrate collection unit CL, the processed surface Fp of the sheet substrate FB can be continuously conveyed to the substrate processing unit PR.

控制部CONT在片材基板FB從基板供應部SU送出至以基板回收部CL加以捲繞之期間,一邊以基板處理部PR之搬送裝置30將片材基板FB在該基板處理部PR內適當的加以搬送、一邊藉由處理裝置10(包含處理部10A及處理部10B之各處理部)將顯示元件之構成要件依序形成在片材基板FB上。 The control unit CONT applies the sheet substrate FB to the substrate processing unit PR while the sheet substrate FB is being ejected from the substrate supply unit SU to the substrate collection unit CL. The components of the display elements are sequentially formed on the sheet substrate FB by the processing device 10 (including the processing units of the processing unit 10A and the processing unit 10B).

此場合,如圖10所示,片材基板FB係以第一導引滾筒G21、第二導引滾筒G22、第三導引滾筒G23及第四導引滾筒G24支承背面Fq之狀態被折返。因此,在處理部10A及處理部10B之前後,片材基板FB係其被處理面Fp在不與上述四個導引滾筒G21~G24接觸之情形下搬送。 In this case, as shown in FIG. 10, the sheet substrate FB is folded back in a state where the first guide roller G21, the second guide roller G22, the third guide roller G23, and the fourth guide roller G24 support the back surface Fq. Therefore, after the processing unit 10A and the processing unit 10B, the sheet substrate FB is conveyed without being in contact with the four guide rollers G21 to G24.

又,片材基板FB係以其與處理部10A及處理部10B對應之第二部分F2及第四部分F4之各自之被處理面Fp,朝向該處理部10A及處理部10B側之方式被搬送。此場合,係例如第二部分F2與第四部分F4於X方向排列之狀態。因此,處理第二部分F2之被處理面Fp的處理部10A可處理第四部分F4之被處理面Fp,相反的,處理第四部分F4之被處理面Fp的處理部10B亦可處理第二部分F2之被處理面Fp。 Further, the sheet substrate FB is transported so as to face the processing unit 10A and the processing unit 10B by the processed surface Fp of each of the second portion F2 and the fourth portion F4 corresponding to the processing unit 10A and the processing unit 10B. . In this case, for example, the second portion F2 and the fourth portion F4 are aligned in the X direction. Therefore, the processing unit 10A that processes the processed surface Fp of the second portion F2 can process the processed surface Fp of the fourth portion F4, and conversely, the processing portion 10B that processes the processed surface Fp of the fourth portion F4 can also process the second The processed surface Fp of the portion F2.

又,根據本實施形態,由於係作成基板處理裝置FPA具有上述第一導引滾筒G21~第四導引滾筒G24,因此可規定該片材基板FB之搬送方向,使片材基板FB被搬送於該基板處理裝置FPA整體之搬送方向(例如+X方向)。 Further, according to the present embodiment, the substrate processing apparatus FPA includes the first guide roller G21 to the fourth guide roller G24. Therefore, the sheet substrate FB can be transported in the direction in which the sheet substrate FB is transported. The transport direction (for example, the +X direction) of the entire substrate processing apparatus FPA.

又,由於片材基板FB中之第二部分F2與第四部分F4係將被處理面Fp朝向處理部10A及10B之方向排列之狀態,因此處理部10A及10B易於在第二部分F2與第四部分F4之間移動。如此,可進行多樣化之處理動作。 Further, since the second portion F2 and the fourth portion F4 of the sheet substrate FB are in a state in which the processed surface Fp is aligned in the direction of the processing portions 10A and 10B, the processing portions 10A and 10B are easily in the second portion F2 and Move between the four parts F4. In this way, a variety of processing operations can be performed.

又,本實施形態雖係針對處理部10A處理第二部分F2之被處理面Fp、 處理部10B處理第四部分F4之被處理面Fp之構成作了說明,但並不限於此構成。例如,在省略處理部10B之情形時,可省略第四導引滾筒G24,而以第一導引滾筒G21、第二導引滾筒G22、第三導引滾筒G23搬送片材基板FB。 Further, in the present embodiment, the processed surface Fp of the second portion F2 is processed by the processing unit 10A, The processing unit 10B has described the configuration of the processed surface Fp of the fourth portion F4, but the configuration is not limited thereto. For example, when the processing unit 10B is omitted, the fourth guide roller G24 may be omitted, and the sheet substrate FB may be conveyed by the first guide roller G21, the second guide roller G22, and the third guide roller G23.

如以上所述,根據本實施形態,由於係作成搬送裝置30具備上述第一導引滾筒G21、第二導引滾筒G22、第三導引滾筒G23之至少三個,因此能在僅支承片材基板FB之背面Fq之同時、搬送片材基板FB。據此,即能在防止來自外部對片材基板FB之被處理面Fp之接觸之同時、搬送該片材基板FB。 As described above, according to the present embodiment, since the transfer device 30 is provided with at least three of the first guide roller G21, the second guide roller G22, and the third guide roller G23, it is possible to support only the sheet. The sheet substrate FB is conveyed while the back surface Fq of the substrate FB is being conveyed. According to this, it is possible to convey the sheet substrate FB while preventing contact with the processed surface Fp of the sheet substrate FB from the outside.

<第五實施形態> <Fifth Embodiment>

其次,說明本發明之第五實施形態。 Next, a fifth embodiment of the present invention will be described.

本實施形態,係說明作為設於基板處理裝置之第一導件~第四導件,例如使用錘狀構件之構成。以下之說明中,對與上述實施形態相同或同等之構成部分係賦予相同符號並簡化或省略其說明。 In the present embodiment, as the first to fourth guides provided in the substrate processing apparatus, for example, a hammer-shaped member is used. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

圖11中顯示了從上方(+Z方向)觀察基板處理裝置FPA時之構成。 The configuration of the substrate processing apparatus FPA as viewed from above (+Z direction) is shown in FIG.

如圖11所示,搬送裝置30使用第一錘狀構件G25作為第一導件、使用第二錘狀構件G26作為第二導件。並使用第三錘狀構件G27作為第三導件、使用第四錘狀構件G28作為第四導件。當然,亦可作成僅第一導件~第四導件中之一部分使用錘狀構件之構成。 As shown in FIG. 11, the conveying device 30 uses the first hammer-shaped member G25 as a first guide and the second hammer-shaped member G26 as a second guide. The third hammer member G27 is used as the third guide, and the fourth hammer member G28 is used as the fourth guide. Of course, it is also possible to form a hammer-shaped member using only one of the first to fourth guides.

圖12係顯示以第一錘狀構件G25之構成為例的圖。如圖11及圖12所示,第一錘狀構件G25~第四錘狀構件G28分別形成為圓錐形。具體而言,第一錘狀構件G25~第四錘狀構件G28分別具有圓形底面(一端部)80及頂點(另一端部)81、且具有形成為從該底面80往頂點81其外徑尺寸漸小之側面(導引面)。第一錘狀構件G25~第四錘狀構件G28分別具有通過底面80之中心點與頂點81之中心軸C5~C8。 Fig. 12 is a view showing the configuration of the first hammer-shaped member G25 as an example. As shown in FIGS. 11 and 12, the first hammer-shaped member G25 to the fourth hammer-shaped member G28 are each formed in a conical shape. Specifically, the first hammer-shaped member G25 to the fourth hammer-shaped member G28 each have a circular bottom surface (one end portion) 80 and an apex (the other end portion) 81, and have an outer diameter formed from the bottom surface 80 toward the apex 81. The side of the smaller size (guide surface). The first hammer-shaped member G25 to the fourth hammer-shaped member G28 have central axes C5 to C8 passing through the center point of the bottom surface 80 and the apex 81, respectively.

第一錘狀構件G25配置成中心軸C5對片材基板FB之第一部分F1之寬度方向(Y方向)平行。於第一錘狀構件G25設有使該第一錘狀構件G25以中心軸C5為中心旋轉之驅動機構(未圖示)。第一錘狀構件G25於側面(導引面)G25a導引片材基板。片材基板FB被支承於第一錘狀構件G25之側面G25a,直到被處理面Fp在第一部分F1與第二部分F2成平行為止。 The first hammer-shaped member G25 is disposed such that the central axis C5 is parallel to the width direction (Y direction) of the first portion F1 of the sheet substrate FB. The first hammer-shaped member G25 is provided with a drive mechanism (not shown) that rotates the first hammer-shaped member G25 around the central axis C5. The first hammer-shaped member G25 guides the sheet substrate on the side surface (guide surface) G25a. The sheet substrate FB is supported by the side surface G25a of the first hammer-shaped member G25 until the processed surface Fp is parallel to the second portion F2 at the first portion F1.

第二錘狀構件G26配置成中心軸C6對片材基板FB之第二部分F2之寬度方向(X方向)平行。於第二錘狀構件G26設有使該第二錘狀構件G26以中心軸C6為中心旋轉之驅動機構(未圖示)。第二錘狀構件G26於側面(導引面)G26a導引片材基板。片材基板FB被支承於第二錘狀構件G26之側面G26a,直到被處理面Fp在第二部分F2與第三部分F3成平行為止。 The second hammer-shaped member G26 is disposed such that the central axis C6 is parallel to the width direction (X direction) of the second portion F2 of the sheet substrate FB. The second hammer-shaped member G26 is provided with a drive mechanism (not shown) that rotates the second hammer-shaped member G26 around the central axis C6. The second hammer-shaped member G26 guides the sheet substrate on the side surface (guide surface) G26a. The sheet substrate FB is supported by the side surface G26a of the second hammer-shaped member G26 until the processed surface Fp is parallel to the third portion F3 at the second portion F2.

第三錘狀構件G27配置成中心軸C7對片材基板FB之第三部分F3之寬度方向(Y方向)平行。於第三錘狀構件G27設有使該第三錘狀構件G27以中心軸C7為中心旋轉之驅動機構(未圖示)。第三錘狀構件G27於側面(導引面)G27a導引片材基板。片材基板FB被支承於第三錘狀構件G27之側面G27a,直到被處理面Fp在第三部分F3與第四部分F4成平行為止。 The third hammer-shaped member G27 is disposed such that the central axis C7 is parallel to the width direction (Y direction) of the third portion F3 of the sheet substrate FB. The third hammer-shaped member G27 is provided with a drive mechanism (not shown) that rotates the third hammer-shaped member G27 about the central axis C7. The third hammer-shaped member G27 guides the sheet substrate on the side surface (guide surface) G27a. The sheet substrate FB is supported by the side surface G27a of the third hammer-shaped member G27 until the processed surface Fp is parallel to the fourth portion F4 at the third portion F3.

第四錘狀構件G28配置成中心軸C8對片材基板FB之第四部分F4之寬度方向(X方向)平行。於第四錘狀構件G28設有使該第四錘狀構件G28以中心軸C8為中心旋轉之驅動機構(未圖示)。第四錘狀構件G28於側面(導引面)G28a導引片材基板。片材基板FB被支承於第四錘狀構件G28之側面G28a,直到被處理面Fp在第四部分F4與第五部分F5成平行為止。 The fourth hammer-shaped member G28 is disposed such that the central axis C8 is parallel to the width direction (X direction) of the fourth portion F4 of the sheet substrate FB. The fourth hammer-shaped member G28 is provided with a drive mechanism (not shown) that rotates the fourth hammer-shaped member G28 around the central axis C8. The fourth hammer member G28 guides the sheet substrate on the side surface (guide surface) G28a. The sheet substrate FB is supported on the side surface G28a of the fourth hammer-shaped member G28 until the processed surface Fp is parallel to the fifth portion F5 at the fourth portion F4.

如以上所述,根據本實施形態,由於係作成藉以第一錘狀構件G25~第四錘狀構件G28折返片材基板FB,因在此場合下,亦能支承片材基板FB之背面Fq來搬送片材基板FB。據此,即能在防止來自外部對片材基板FB之被處理面Fp之接觸之同時、搬送該片材基板FB。 As described above, according to the present embodiment, the first hammer-shaped member G25 to the fourth hammer-shaped member G28 are folded back to the sheet substrate FB, and in this case, the back surface Fq of the sheet substrate FB can be supported. The sheet substrate FB is conveyed. According to this, it is possible to convey the sheet substrate FB while preventing contact with the processed surface Fp of the sheet substrate FB from the outside.

又,使用第一錘狀構件G25~第四錘狀構件G28之情形時,例如圖13 所示,亦可作成以第一錘狀構件G25之中心軸C5與第四錘狀構件G28之中心軸C8平行、且第二錘狀構件G26之中心軸C6與第三錘狀構件G27之中心軸C7平行之方式,配置第一錘狀構件G25~第四錘狀構件G28之構成。 Moreover, when the first hammer-shaped member G25 to the fourth hammer-shaped member G28 are used, for example, FIG. As shown, the center axis C5 of the first hammer member G25 may be parallel to the central axis C8 of the fourth hammer member G28, and the center axis C6 of the second hammer member G26 and the center of the third hammer member G27 may be formed. The first hammer-shaped member G25 to the fourth hammer-shaped member G28 are disposed in such a manner that the shaft C7 is parallel.

此構成下,可發揮與圖11所示構成相同之效果。而且,與圖11所示構成相較,片材基板FB之第二部分F2與第四部分F4間之距離變近。因此,處理部10A及10B在該第二部分F2與第四部分F4之間易於移動,是一較佳構成。 With this configuration, the same effects as those shown in Fig. 11 can be exhibited. Further, the distance between the second portion F2 of the sheet substrate FB and the fourth portion F4 becomes closer than that of the configuration shown in FIG. Therefore, the processing portions 10A and 10B are easily moved between the second portion F2 and the fourth portion F4, which is a preferable configuration.

又,第一錘狀構件G25~第四錘狀構件G28之形狀,雖如圖11~圖13所示之形成為圓錐狀之構成較佳,但亦可是形成為其他錘狀(惰圓錐狀、多角錘狀)之構成。此外,亦可以是例如於圓柱狀構件之一部分形成錐形部,使用該錐形部來彎折片材基板FB之構成。 Further, the shapes of the first hammer-shaped member G25 to the fourth hammer-shaped member G28 are preferably formed into a conical shape as shown in FIGS. 11 to 13 , but may be formed into other hammer shapes (inert cone shape, The composition of a polygonal hammer. Further, for example, a tapered portion may be formed in one of the cylindrical members, and the tapered portion may be used to bend the sheet substrate FB.

又,上述各實施形態雖係以使第一導件~第四導件旋轉之構成為例作了說明,但不限於此。例如,亦可使用固定在基板處理裝置FPA內之圓柱狀構件及圓筒狀構件、錘狀構件。使用此種圓柱狀構件及圓筒狀構件、錘狀構件之情形時,除了沒有導引滾筒G般之旋轉動作之點以外,可以和導引滾筒G相同之動作進行片材基板FB之位置調整。 Further, in each of the above embodiments, the configuration in which the first to fourth guides are rotated is described as an example, but the present invention is not limited thereto. For example, a cylindrical member fixed to the substrate processing apparatus FPA, a cylindrical member, or a hammer-shaped member may be used. When such a cylindrical member, a cylindrical member, or a hammer-shaped member is used, the position adjustment of the sheet substrate FB can be performed in the same operation as the guide roller G except that the rotation of the roller G is not performed. .

又,使用此種固定之圓柱狀構件、圓筒狀構件及錘狀構件之情形時,可僅保留支承片材基板FB背面之導引面,而去除導引面以外之部分。 Further, in the case of using such a fixed cylindrical member, a cylindrical member, and a hammer-shaped member, only the guide surface on the back surface of the support sheet substrate FB can be retained, and portions other than the guide surface can be removed.

又,上述各實施形態中,使用導引滾筒G及圓柱狀構件、圓筒狀構件、錘狀構件作為第一導件~第四導件之情形時,雖係以將片材基板FB接觸於此等第一導件~第四導件之構成為例作了說明,但不限於此。例如,亦可作成片材基板FB與各導件之間為非接觸狀態之構成。作為此種構成,例如有在第一導件~第四導件表面形成氣體層,透過該氣體層保持片材基板FB之構成等。 Further, in the above embodiments, when the guide roller G, the columnar member, the cylindrical member, and the hammer member are used as the first to fourth guides, the sheet substrate FB is brought into contact with The configuration of the first to fourth guides is described as an example, but is not limited thereto. For example, it is also possible to form a configuration in which the sheet substrate FB and each of the guide members are in a non-contact state. In such a configuration, for example, a gas layer is formed on the surfaces of the first to fourth guides, and the configuration of the sheet substrate FB is maintained through the gas layer.

上述實施形態中記載之第一導件~第四導件,並不限於例如在片材基 板FB之搬送路徑配置在處理裝置10之近旁位置,亦可適當的配置在其他位置。此外,亦可將上述實施形態之第一導件~第四導件止之構成,作成於例如X方向反複設置之構成。 The first to fourth guides described in the above embodiments are not limited to, for example, a sheet base. The transport path of the board FB is disposed in the vicinity of the processing device 10, and may be appropriately disposed at another position. Further, the configuration of the first to fourth guides of the above-described embodiment may be configured to be repeated, for example, in the X direction.

又,上述實施形態雖係以處理部10A與處理部10B之間係進行不同處理之情形為例作了說明,但不限於此。例如在處理部10A與處理部10B之間係進行相同處理之情形時,本發明之適用亦是可能的。 Further, in the above embodiment, the case where the processing unit 10A and the processing unit 10B are differently processed is described as an example, but the present invention is not limited thereto. For example, when the same processing is performed between the processing unit 10A and the processing unit 10B, the application of the present invention is also possible.

又,上述實施形態(例如,參照圖11),雖係作成以第三導件將片材基板FB折返於+Y方向,以使片材基板FB之第二部分F2與第四部分F4於X方向相鄰排列之構成,但並不限於此,亦可例如以第三導件將片材基板FB折返於與第二部分F2相反方向(例如,圖10中為-Y方向)之構成。 Further, in the above embodiment (see, for example, FIG. 11), the sheet substrate FB is folded back in the +Y direction by the third guide so that the second portion F2 and the fourth portion F4 of the sheet substrate FB are in the X The configuration in which the directions are arranged adjacent to each other is not limited thereto, and the sheet substrate FB may be folded back in the opposite direction to the second portion F2 (for example, the -Y direction in FIG. 10) by the third guide.

又,上述實施形態中,雖係以第一導件折返至第一部分F1與第二部分F2彼此平行為止,但亦可折返成第二部分F2相對第一部分F1偏於上方或下方。第二部分F2與第三部分F3、第三部分F3與第四部分F4、第四部分F4與第五部分F5間之關係亦不限於為平行。 Further, in the above embodiment, the first guide member is folded back until the first portion F1 and the second portion F2 are parallel to each other, but the second portion F2 may be folded back above or below the first portion F1. The relationship between the second portion F2 and the third portion F3, the third portion F3 and the fourth portion F4, and the fourth portion F4 and the fifth portion F5 are also not limited to being parallel.

又,上述實施形態雖係說了第一方向與第三方向、及第二方向與第四方向之關係彼此平行,但並不限於平行,亦可以是平行以外之方向。 Further, in the above embodiment, the first direction and the third direction, and the relationship between the second direction and the fourth direction are parallel to each other. However, the present invention is not limited to being parallel, and may be a direction other than parallel.

又,第一導引滾筒G21上流側之滾筒裝置R,由於其功能係作為對片材基板FB之被處理面實施處理前之搬送滾筒,因此可使此滾筒裝置R接觸於片材基板FB之表面及背面、並夾著片材基板FB。此外,在對片材基板FB之被處理面實施所有處理後,可在第四導引滾筒G24之下流側,以接觸於片材基板FB之背面及表面、並夾著片材基板FB之方式配置滾筒裝置R。 Further, since the roller device R on the upstream side of the first guide roller G21 functions as a transport roller before the surface to be processed of the sheet substrate FB, the roller device R can be brought into contact with the sheet substrate FB. The sheet substrate FB is sandwiched between the front surface and the back surface. Further, after performing all the processes on the processed surface of the sheet substrate FB, the flow side of the fourth guide roller G24 may be contacted to contact the back surface and the surface of the sheet substrate FB and sandwich the sheet substrate FB. The roller device R is configured.

本發明之技術範圍不限定於上述實施形態,可在不脫離本發明趣旨之範圍內適當的加以變更。 The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the scope of the invention.

Claims (11)

一種元件製造裝置,係對用以形成電子元件之處理裝置,一邊將具有可撓性之長條之片材基板搬送於長邊方向,一邊在該片材基板上製造該電子元件,具備:第一圓柱狀構件,將沿第一方向搬送之該片材基板,在與該片材基板表面平行之面內加以斜向彎折後,將該片材基板之搬送方向變換成與該第一方向不同且通過該處理裝置之第二方向;第二圓柱狀構件,將沿第二方向搬送且被該處理裝置處理後之該片材基板,在與該片材基板表面平行之面內加以斜向彎折後,將該片材基板之搬送方向變換成與該第二方向不同之第三方向;標記檢測部,將分別配置於與該片材基板之長邊方向交叉之短邊方向之兩端部之一對標記,在該片材基板往該第二方向之搬送路徑中進行檢測;以及調整機構,根據該標記檢測部之檢測結果,調整在與該片材基板表面平行之面內之該第一圓柱狀構件或該第二圓柱狀構件的位置或角度。 A device manufacturing apparatus for manufacturing an electronic component by transporting a sheet substrate having a flexible strip in a longitudinal direction while manufacturing the electronic component on the sheet substrate a cylindrical member that bends the sheet substrate conveyed in the first direction obliquely in a plane parallel to the surface of the sheet substrate, and then converts the conveying direction of the sheet substrate into the first direction Differently passing through the second direction of the processing device; the second cylindrical member obliquely aligns the sheet substrate conveyed in the second direction and processed by the processing device in a plane parallel to the surface of the sheet substrate After the bending, the conveying direction of the sheet substrate is converted into a third direction different from the second direction; and the mark detecting portions are respectively disposed at both ends of the short side direction intersecting with the longitudinal direction of the sheet substrate. a pair of marks is detected in the transport path of the sheet substrate in the second direction; and an adjustment mechanism is adjusted in a plane parallel to the surface of the sheet substrate according to the detection result of the mark detecting portion Position or angle of the first cylindrical member or the second cylindrical member. 如申請專利範圍第1項之元件製造裝置,其中,該第一圓柱狀構件或該第二圓柱狀構件,具備相對該片材基板之短邊方向斜向延伸之中心軸,藉由驅動機構繞該中心軸被旋轉驅動。 The component manufacturing apparatus of claim 1, wherein the first cylindrical member or the second cylindrical member has a central axis extending obliquely with respect to a short side direction of the sheet substrate, and is driven by a driving mechanism The center shaft is rotationally driven. 如申請專利範圍第2項之元件製造裝置,其中,藉由將該第一圓柱狀構件與該第二圓柱狀構件之各該中心軸,配置成在與往該第二方向之搬送路徑之該片材基板表面平行之面內大致平行之關係或大致正交之關係,以將該第一方向與該第三方向設成大致平行之狀態。 The component manufacturing apparatus of claim 2, wherein the central axis of the first cylindrical member and the second cylindrical member are disposed in a transport path to the second direction The relationship in which the surface of the sheet substrate is parallel is substantially parallel or substantially orthogonal, and the first direction and the third direction are substantially parallel. 如申請專利範圍第3項之元件製造裝置,其中,該調整機構具有:第一調整部,調整在與往該第二方向之搬送路徑之該片材基板表面平行之面內之該第一圓柱狀構件之位置或角度;以及 第二調整部,調整在與往該第二方向之搬送路徑之該片材基板表面平行之面內之該第二圓柱狀構件之位置或角度。 The component manufacturing apparatus of claim 3, wherein the adjustment mechanism has: a first adjustment portion that adjusts the first cylinder in a plane parallel to a surface of the sheet substrate in a transport path in the second direction The position or angle of the member; The second adjustment unit adjusts a position or an angle of the second cylindrical member in a plane parallel to the surface of the sheet substrate in the transport path in the second direction. 如申請專利範圍第4項之元件製造裝置,其中,該調整機構具備:控制部,以使通過往該第二方向之搬送路徑之該片材基板,在與該片材基板表面平行之面內傾斜之方式,根據該標記檢測部之檢測結果控制該第一調整部及該第二調整部。 The component manufacturing apparatus of claim 4, wherein the adjustment mechanism includes a control unit that allows the sheet substrate passing through the transport path in the second direction to be in a plane parallel to the surface of the sheet substrate In the tilting mode, the first adjustment unit and the second adjustment unit are controlled based on the detection result of the mark detecting unit. 如申請專利範圍第5項之元件製造裝置,其中,該處理裝置包含:載台裝置,配置於往該第二方向之搬送路徑中,且具備將該片材基板背面作為具有平坦之面或曲率之面加以支承之支承面。 The component manufacturing apparatus according to claim 5, wherein the processing apparatus includes: a stage device disposed in the transport path in the second direction, and having the back surface of the sheet substrate as having a flat surface or curvature The support surface on which the surface is supported. 如申請專利範圍第6項之元件製造裝置,其中,該載台裝置,具有用以將該支承面移動於與該片材基板表面之正交之方向之載台驅動機構。 The device manufacturing apparatus according to claim 6, wherein the stage device has a stage driving mechanism for moving the supporting surface in a direction orthogonal to a surface of the sheet substrate. 如申請專利範圍第7項之元件製造裝置,其中,該載台裝置之該支承面,具有用以吸附該片材基板背面之吸附部。 The component manufacturing apparatus of claim 7, wherein the support surface of the stage device has an adsorption portion for adsorbing the back surface of the sheet substrate. 一種元件製造裝置,係對用以形成電子元件之處理裝置,一邊將具有可撓性之長條之片材基板搬送於長邊方向,一邊在該片材基板上製造該電子元件,具備:錐狀之第一導件,具有在第一中心軸上設定中心點之圓形之第一底面,及以從設定於該第一中心軸上之頂點越往該第一底面而外徑尺寸逐漸擴大之方式形成且支承該片材基板的一部分之第一側面,能繞該第一中心軸旋轉;錐狀之第二導件,具有在以與該第一中心軸平行之關係或正交之關係而配置之第二中心軸上設定中心點之圓形之第二底面,及以從設定於該第二中心軸上之頂點越往該第二底面而外徑尺寸逐漸擴大之方式形成且支承該片材基板的一部分之第二側面,能繞該第二中心軸旋轉;以及驅動機構,以在被該第一導件之該第一側面支承後變換搬送方向之該 片材基板以該第二導件之該第二側面支承後變換搬送方向然後搬送於長邊方向之方式,使該第一導件與該第二導件旋轉;在該第一導件與該第二導件間之搬送路徑中,藉由該處理裝置處理該片材基板。 A component manufacturing apparatus for manufacturing an electronic component by transporting a flexible sheet substrate to a longitudinal direction while manufacturing the electronic component on the sheet substrate a first guide having a first bottom surface that defines a center point on the first central axis, and an outer diameter gradually increases from a vertex set on the first central axis toward the first bottom surface Forming and supporting a first side of a portion of the sheet substrate rotatable about the first central axis; the tapered second guide having a relationship parallel or orthogonal to the first central axis And forming a second bottom surface of the circular center point on the second central axis of the arrangement, and forming and supporting the outer diameter from the apex set on the second central axis toward the second bottom surface a second side of a portion of the sheet substrate rotatable about the second central axis; and a drive mechanism for shifting the transport direction after being supported by the first side of the first guide The first substrate and the second guide are rotated by the first substrate supporting the second side surface of the second guide member and then transferring the transport direction to the longitudinal direction; and the first guide member and the first guide member The sheet substrate is processed by the processing device in the transport path between the second guides. 如申請專利範圍第9項之元件製造裝置,其進一步具備:第一調整機構,調整該第一導件之該第一中心軸之位置或角度;以及第二調整機構,調整該第二導件之該第二中心軸之位置或角度。 The component manufacturing apparatus of claim 9, further comprising: a first adjusting mechanism that adjusts a position or an angle of the first central axis of the first guiding member; and a second adjusting mechanism that adjusts the second guiding member The position or angle of the second central axis. 如申請專利範圍第10項之元件製造裝置,其進一步具備:控制部,以使從該第一導件搬送至該第二導件之該片材基板,傾斜於與該長邊方向交叉之短邊方向之方式,控制該第一調整機構與該第二調整機構。 The component manufacturing apparatus according to claim 10, further comprising: a control unit that inclines the sheet substrate conveyed from the first guide to the second guide by a short crossing with the longitudinal direction The first adjustment mechanism and the second adjustment mechanism are controlled in a side direction manner.
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