TW200500635A - Device for floating a substrate - Google Patents
Device for floating a substrateInfo
- Publication number
- TW200500635A TW200500635A TW093111647A TW93111647A TW200500635A TW 200500635 A TW200500635 A TW 200500635A TW 093111647 A TW093111647 A TW 093111647A TW 93111647 A TW93111647 A TW 93111647A TW 200500635 A TW200500635 A TW 200500635A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- floating
- levitated
- contact
- contact member
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
A contact member (13) provided on the top of a support member (10) is lifted by a lifting mechanism (6) with a substrate (2) levitated. This causes the contact member (13) to be in contact with the back face of the substrate (2), thereby limiting the movement of the substrate (2) being levitated.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003125701 | 2003-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200500635A true TW200500635A (en) | 2005-01-01 |
TWI368757B TWI368757B (en) | 2012-07-21 |
Family
ID=33410239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093111647A TWI368757B (en) | 2003-04-30 | 2004-04-26 | Device for floating a substrate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4418428B2 (en) |
KR (1) | KR101053770B1 (en) |
CN (2) | CN102152966B (en) |
TW (1) | TWI368757B (en) |
WO (1) | WO2004096679A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4268447B2 (en) * | 2003-05-14 | 2009-05-27 | Hoya株式会社 | Substrate holder, substrate processing apparatus, substrate inspection apparatus, and methods of use thereof |
JP4754885B2 (en) * | 2004-11-30 | 2011-08-24 | 株式会社ダイヘン | Substrate transfer device |
JP4809612B2 (en) * | 2005-02-10 | 2011-11-09 | パナソニック株式会社 | Substrate transfer method |
JP4895518B2 (en) * | 2005-03-22 | 2012-03-14 | オリンパス株式会社 | Substrate holding device and substrate holding method |
JP4690414B2 (en) | 2005-09-02 | 2011-06-01 | 平田機工株式会社 | Work loading / unloading system and transfer device |
WO2007037005A1 (en) * | 2005-09-29 | 2007-04-05 | Hirata Corporation | Work receiving device |
JP2007250871A (en) * | 2006-03-16 | 2007-09-27 | Olympus Corp | Substrate transport apparatus |
JP2007281285A (en) * | 2006-04-10 | 2007-10-25 | Olympus Corp | Substrate transport apparatus |
JP5084356B2 (en) * | 2007-06-11 | 2012-11-28 | Nskテクノロジー株式会社 | Substrate transport mechanism for exposure apparatus and substrate position adjusting method using the same |
US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
CN102148176B (en) * | 2010-02-09 | 2013-02-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting device and semiconductor device processing equipment with same |
JP2010251769A (en) * | 2010-05-24 | 2010-11-04 | Olympus Corp | Substrate holding device and method of holding substrate |
CN103182695B (en) * | 2011-12-29 | 2015-07-01 | 财团法人金属工业研究发展中心 | Assembling device of reconfigurable toolroom machine |
KR101809001B1 (en) * | 2012-04-03 | 2017-12-13 | 가부시키가이샤 니콘 | Transfer apparatus, and electronic device forming method |
CN102717314A (en) * | 2012-06-29 | 2012-10-10 | 苏州晟成新能源科技有限公司 | Trimmer |
KR101613121B1 (en) | 2014-03-18 | 2016-04-18 | 주식회사 에스에프에이 | Pattern printer |
JP6032234B2 (en) * | 2014-03-19 | 2016-11-24 | 信越半導体株式会社 | Work holding device |
US10381256B2 (en) * | 2015-03-12 | 2019-08-13 | Kla-Tencor Corporation | Apparatus and method for chucking warped wafers |
CN106960810A (en) * | 2016-01-11 | 2017-07-18 | 锡宬国际有限公司 | Wafer bearing device |
KR101717680B1 (en) * | 2016-07-19 | 2017-03-20 | 디앤에이 주식회사 | Transfer lifter module |
KR101865274B1 (en) * | 2016-08-31 | 2018-06-07 | 씨디에스(주) | Device for floating substrate using sloped structure |
JP6842948B2 (en) * | 2017-02-24 | 2021-03-17 | リンテック株式会社 | Positioning device and positioning method |
JP7134039B2 (en) * | 2018-09-14 | 2022-09-09 | 東京エレクトロン株式会社 | Substrate mounting mechanism, deposition apparatus, and deposition method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0514034U (en) * | 1991-08-05 | 1993-02-23 | 横河電機株式会社 | Wafer transfer device |
TW559855B (en) * | 2000-09-06 | 2003-11-01 | Olympus Optical Co | Wafer transfer apparatus |
JP2002181714A (en) * | 2000-12-19 | 2002-06-26 | Ishikawajima Harima Heavy Ind Co Ltd | Thin plate inspection device |
JP2003040422A (en) * | 2001-07-27 | 2003-02-13 | Toyota Industries Corp | Object levitation conveyer |
JP2003063643A (en) * | 2001-08-30 | 2003-03-05 | Nippon Sekkei Kogyo:Kk | Thin plate conveying system and apparatus |
-
2004
- 2004-04-26 CN CN2011100336593A patent/CN102152966B/en not_active Expired - Fee Related
- 2004-04-26 WO PCT/JP2004/006000 patent/WO2004096679A1/en active Application Filing
- 2004-04-26 CN CN2004800004365A patent/CN1697768B/en not_active Expired - Fee Related
- 2004-04-26 KR KR1020047020899A patent/KR101053770B1/en not_active IP Right Cessation
- 2004-04-26 TW TW093111647A patent/TWI368757B/en not_active IP Right Cessation
- 2004-04-26 JP JP2005504478A patent/JP4418428B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102152966B (en) | 2013-03-27 |
WO2004096679A1 (en) | 2004-11-11 |
JP4418428B2 (en) | 2010-02-17 |
KR101053770B1 (en) | 2011-08-02 |
TWI368757B (en) | 2012-07-21 |
CN1697768B (en) | 2011-03-30 |
JPWO2004096679A1 (en) | 2006-07-13 |
CN1697768A (en) | 2005-11-16 |
KR20060015414A (en) | 2006-02-17 |
CN102152966A (en) | 2011-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |