KR101053770B1 - PCB Wound Device - Google Patents

PCB Wound Device Download PDF

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Publication number
KR101053770B1
KR101053770B1 KR1020047020899A KR20047020899A KR101053770B1 KR 101053770 B1 KR101053770 B1 KR 101053770B1 KR 1020047020899 A KR1020047020899 A KR 1020047020899A KR 20047020899 A KR20047020899 A KR 20047020899A KR 101053770 B1 KR101053770 B1 KR 101053770B1
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KR
South Korea
Prior art keywords
glass substrate
substrate
floating
contact
contact member
Prior art date
Application number
KR1020047020899A
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Korean (ko)
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KR20060015414A (en
Inventor
히로유끼 오까히라
Original Assignee
올림푸스 가부시키가이샤
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Priority to JP2003125701 priority Critical
Priority to JPJP-P-2003-00125701 priority
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Priority to PCT/JP2004/006000 priority patent/WO2004096679A1/en
Publication of KR20060015414A publication Critical patent/KR20060015414A/en
Application granted granted Critical
Publication of KR101053770B1 publication Critical patent/KR101053770B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

In the state in which the substrate 2 is raised, the contact member 13 provided at the tip of the support member 10 is lifted by the lifting mechanism 6 to contact the contact member 13 with the rear surface of the substrate 2. In this way, the movement of the floating substrate 2 is regulated.
Lifting mechanism, support member, contact member, glass substrate, substrate injury

Description

Board Floating Device {DEVICE OF SUBSTRATE TO BE FLOAT}

TECHNICAL FIELD This invention relates to the substrate floating apparatus which floats the glass substrate used for flat panel displays (FPD), such as a liquid crystal display (LCD), for example.

For example, when inspecting the glass substrate of LCD, it is necessary to align a glass substrate to a reference position. For example, Japanese Patent Laid-Open No. 8-313815 discloses a positioning device for a glass substrate. This positioning apparatus mounts the protection holding stage which adsorbs-protects and holds a glass substrate on a XY stage via a ball caster, moves this protection holding stage by the pushing force of a pressurized cylinder, and a glass substrate Press the side edge of the pin directly to each reference pin to align it.

As the glass substrate is enlarged, the protection holding stage and the XY stage which adsorb and protect the glass substrate are also enlarged. In particular, since the XY stage moves the glass substrate in the XY direction and observes the entire surface of the glass substrate under a microscope, four times the installation space of the glass substrate is required, and the entire apparatus is enlarged. In addition, as the protective holding stage is enlarged, the weight becomes heavy, and the protective holding stage is moved to directly press the side edges of the glass substrate with the respective pins, which may damage the glass substrate by the impact.

In addition, Japanese Patent Laid-Open No. 2000-9661 discloses a technique for aligning a glass substrate by pressing a positioning pin by operation of a cylinder while the glass substrate is placed on a plurality of objects to be rolled in the roller conveyance unit. In such an alignment, as the glass substrate is enlarged, the frictional resistance between the glass substrate and the plurality of rollers becomes large, and it becomes difficult to press the glass substrate with the positioning pin using a cylinder. Moreover, when a glass substrate is pushed in the direction orthogonal to the rotation direction of many rolls, a glass substrate will slide and move on many rolls. For this reason, there exists a possibility that the friction mark of a rolling stand may generate | occur | produce on the back surface of a glass substrate.

In order to solve such a problem, it is thought to float a glass substrate by air blowing, and to position a glass substrate. Since the glass substrate moves only when an extremely fine external force is applied and collides with the reference pin to bounce off, the alignment stability is insufficient in that it cannot stop immediately. In addition, since the frictional force between the air floating stage surface and the glass substrate surface is extremely small, the weight of the glass substrate itself due to the enlargement of the glass substrate becomes heavier, so that the impact force that collides with the reference pin increases, which may damage the glass substrate. There is. In addition, by floating the glass substrate by air, electrostatic or the like, the friction force between the floating stage surface and the glass substrate surface becomes extremely small, so that the external force of the glass substrate is small when the alignment or the glass substrate is passed. And the problem of moving by its own inertia.

According to the main aspect of this invention, the floating means which raises a board | substrate, the contact member which can contact the back surface of a board | substrate, the support member which provided the contact member in the front-end | tip, and the board | substrate which raises a support member and floats by the floating means There is provided a substrate floating apparatus having a lifting mechanism which contacts a contact member to a rear surface of the substrate to regulate movement of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows 1st Embodiment of the 1st board | substrate flotation apparatus which concerns on this invention.

2 is a configuration diagram of a second substrate floating apparatus according to the present invention.

3 is a block diagram showing a substrate floating apparatus of an LCD manufacturing line to which the apparatus is applied.

4 is a configuration diagram of each conveyance unit in the LCD production line.

The figure which shows the state which regulates the movement of a glass substrate with the said apparatus.

6 is an external view of a floating stage used in a substrate inspection device to which the device is applied.

It is a block diagram which shows 2nd Embodiment of the board | substrate floating apparatus which concerns on this invention.

8 is a diagram showing another protective holding mechanism of the contact film in the apparatus.

 EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described with reference to drawings.

1 is an overall configuration diagram of a first substrate floating apparatus. The surface 1a of the floating stage 1 is regularly provided with a plurality of air blowing holes 1h for blowing air at a constant air pressure, for example. This floating stage 1 mounts the glass substrate 2 on the surface 1a, and blows air from each air blowing hole lh, and the surface 1a of the floating stage 1 and the glass substrate An air layer is formed between (2) and the glass substrate 2 is floated on the surface 1a of the floating stage 1. In addition, the floating stage 1 is not limited to air floating, but may float the glass substrate 2 such as electrostatic floating or ultrasonic floating from the stage surface.

3 A of 1st board | substrate protection holding mechanisms are provided in the floating stage 1. This 1st board | substrate protection holding mechanism 3A is provided in the cylindrical hole 4 which penetrates the floating stage 1 to an up-down direction. The U-shaped support member 5 arranges the U-shaped bottom plate 5a downward on the lower surface 1b of the floating stage 1 in which the hole 4 is formed. The lower surface of the U-shaped bottom plate 5a of the U-shaped support member 5 is provided with, for example, an pneumatic cylinder 6 which is an actuator.

The expansion rod 7 of this pneumatic cylinder 6 protrudes upward of the U-shaped bottom plate 5a through the hole provided in the U-shaped bottom plate 5a. The board | substrate protection holding member 100 is connected to the front-end | tip of the expansion rod 7 of this pneumatic cylinder 6 via the connection part which consists of a screw part 8 and the nut 9. This board | substrate protection holding member 10 is provided by providing the support stand 11 and the support rod 12 on the same axis as the elastic rod 7. The support 11 is formed circumferentially, and is connected to the front-end | tip of the elastic rod 7 via the screw part 8 and the nut 9. The support rod 12 is provided on the support 11, and is formed in the column shape which has an outer diameter smaller than the outer diameter of the support 11. As shown in FIG.

A cylindrical contact member 13 formed of a wear resistant resin is attached to the tip end of the support rod 12. The contact member 13 is provided with a hole 13a which is slightly larger than the outer diameter of the supporting rod 12 in the lower surface 15. The supporting rod 12 is inserted into the hollow part of this contact member 13 through the hole 13a.

The support member 12 is rotatably provided in the arrow A direction via the cylindrical ball support 16 and the ball bearing 17.

For example, a coil spring 18 is provided on the outer circumference of the support bar 12 between the lower face 15 of the contact member 13 and the upper face 11a of the support 11 as an elastic member. The contact member 13 is pushed upwards. The pushing force (elastic force) of this coil spring 18 is an optimal value of the pressing force of the contact member 13 with respect to the back surface of the floating glass substrate 2, ie, the pressing pin which the floating glass substrate 2 mentions later. With a small frictional force that does not move by external force or inertia due to its own weight less than the contact pressure with respect to the glass substrate 2 at the time of the pressurization of 43 or the non-adsorption of each conveyance part 32-35, and also a glass It is set so that the contact member 13 may contact the back surface of the glass substrate 2 by the very small pressing force which does not affect the board | substrate 2, such as a friction trace and deformation | transformation. This contact member 13 is supported by the front-end | tip part of the support rod 12 via the coiled spring 18, and moves up and down in the arrow B direction.                 

The stretching stroke of the expansion rod 7 by the pneumatic cylinder 6 causes the glass substrate 2 to float on the floating stage 1 from the upper surface 14 of the contact member 13 when the expansion rod 7 is retracted. A small distance such that the contact member 13 is brought into contact with the lower surface of the glass substrate 2 on which the contact member 13 is floated to cause contact resistance such that the glass substrate 2 is not moved. It is preset to the sum of lengths.

2 is an overall configuration diagram of a second substrate floating apparatus. In addition, the same code | symbol is attached | subjected to the same part as FIG. 1, and the detailed description is abbreviate | omitted. In the floating stage 1, a second substrate protection holding mechanism 3B is provided. The support case 20 is connected to the front-end | tip part of the telescopic rod 7 of the pneumatic cylinder 6 of this 2nd board | substrate protection holding mechanism 3B via the screw part 8 and the nut 9. This support case 20 is formed in a cylindrical shape, for example, and a suction pad mounting hole 21 is provided therein. In this suction pad mounting hole 21, an annular horizontal groove 23 is provided to restrict the vertical movement of the suction pad 22. This horizontal groove portion 23 has an inner diameter larger than the inner diameter of the suction pad mounting hole 21.

An adsorption pad 22 is provided on the bottom of the adsorption pad mounting hole 21 via a bellows 25 which is an adsorption pad support member made of elastic members such as rubber, resin, and metal that stretch in the vertical direction.

The adsorption pad 22 also serves as a contact member in which friction-resistant resin is formed in a disc shape, for example. The suction pad 22 has, for example, a circular pad groove 26 formed at an upper portion thereof, and a locking ring 27 for restricting vertical movement at the lower portion thereof. This locking ring 27 is mounted in the horizontal groove portion 23.

Each air flow path 28a-28c communicates between the suction pad 22, the bellows 25, and the support case 20. As shown in FIG. The air flow path 28c is bent in the support case 20 to reach the outer wall surface of the support case 20, and the air suction port 29 is formed in this outer wall surface. A suction pump is connected to the air suction port 29 via a suction tube 24 or the like.

The back surface of the glass substrate 2 is adsorbed and fixed to the suction pad 22 by sucking air by the suction pump through each air flow passage 28a to 28c. The suction pressure by the suction pump is such that the frictional force between the suction pad 22 (contact member) with respect to the back surface of the glass substrate 2 which is floating does not move due to the small external force or the inertia of its own weight to the glass substrate 2. It is also possible to set the suction pressure to a degree that is not enough.

The pushing force (elastic force) of the bellows 25 is an optimal value of the pressing force of the suction pad 22 against the back surface of the glass substrate 2 that is floating, that is, the pressing pin 43 described later by the glass substrate 2 that is floating. ), The glass substrate ( It is set so that the adsorption pad 22 may contact the back surface of the glass substrate 2 by the minute press force which does not affect friction traces, deformation | transformation, etc. in 2).

The expansion and contraction stroke of the expansion rod 7 by the pneumatic cylinder 6 of the glass substrate 2 floating on the floating stage 1 from the upper surface of the suction pad 22 when the expansion rod 7 is retracted. The distance to the lower surface is the sum of the minute distances that are in contact with the lower surface of the glass substrate 2 on which the adsorption pad 22 is floated to generate contact resistance such that the glass substrate 2 is not moved. It is set in advance.

Next, the case where the operation | movement of each board | substrate protection holding mechanism comprised as mentioned above is applied to the board | substrate inspection process of an LCD manufacturing line is demonstrated.

3 is a configuration diagram showing a substrate floating apparatus of an LCD manufacturing line to which the first and second substrate protection holding mechanisms 3A and 3B are applied. On the surface la of the floating stage 1 for conveyance, the some air blowing hole lh is regularly provided in the vertical and horizontal direction.

On both sides of the floating stage 1, linear guide rails 30 and 31 are respectively provided. In each of these guide rails 30 and 31, two conveying sections 32, 33, 34, and 35 each of which is driven by a linear motor are provided to be movable. Each conveyance part 32 and 33 of one pair reciprocates on each guide rail 30 and 31 in the arrow C direction in synchronization with each other, and each conveyance part 34 and 35 of the other pair also synchronizes with each other Phases (30, 31) are reciprocated in the direction of the arrow D.

4 is a configuration diagram of each transfer unit 32 to 35. Since these conveyance parts 32-35 have the same structure, a structure is demonstrated only about the conveyance part 32. As shown in FIG. On the conveyance part 32, the adsorption mounting base 38 is provided through each lifting support members 36 and 37. As shown in FIG. Each lifting support member 36, 37 raises and lowers the adsorption support base 38 in an up-down direction (Z direction). Plural, for example, five substrate adsorption apparatuses 39 are provided on the adsorption mounting base 38 in the same direction as the conveyance direction E of the glass substrate 2. In addition, the number of mounting | substrate of the board | substrate adsorption apparatus 39 is not limited to five, You may install in arbitrary numbers. Each board | substrate adsorption apparatus 39 carries out adsorption protection of the back surface of the glass substrate 2 by suction of air.

Receiving the glass substrate 2 conveyed from the upstream side to the floating stage 1 of the LCD manufacturing line to the downstream inspection unit S 2 . Substrate could portion (受渡(give feedback)部; S 1) has a checking unit (S 2) provided on the downstream side of the board unit may (S 1).

The floating stage 1 in the board | substrate water supply part S1 is provided with the some cylindrical hole 4, The 1st board | substrate protection holding shown in FIG. 1 as a board | substrate protection holding mechanism respectively in these holes 4 is provided. The mechanism 3A is provided. These 1st board | substrate protection holding mechanisms 3A are provided in four places corresponding to each corner position of the rectangle which has a long direction in the LCD manufacturing line direction, for example. 3 A of 1st board | substrate protection holding mechanisms can float the glass substrate 2 substantially horizontally by air on the floating stage 1, For example, it corresponds to the substantially center position of the glass substrate 2, for example. It can also be provided in one place.

The inspection part S 2 is provided with each pressing pin 43 which is fixed and movable in the direction (arrow G direction) for pressing the corners of the glass substrate 2. The door arm 44 is provided in this inspection part S 2 over the floating stage 1. This door-shaped arm 44 is movable in the same direction (arrow F direction) as the conveyance direction E of the glass substrate 2. The microscope arm 45 is provided in this door-shaped arm 44 so that a movement to a perpendicular direction (arrow J direction) with respect to the conveyance direction E is possible. The door-shaped arm 44 may be fixedly installed as long as the glass substrate 2 is moved on the floating stage 1 by the transfer units 34 and 35 at a predetermined pitch in the arrow E direction. .

In the floating stage 1 in the inspection part S 2 , each hole 4 is provided in four places corresponding to each corner position of the rectangle which has a long direction in the LCD manufacturing line direction, respectively, and these holes 4 ), A second substrate protection holding mechanism 3B shown in FIG. 2 is provided as a substrate protection holding mechanism, respectively.

Next, operation | movement of the water supply (exchange) of the glass substrate 2 and board | substrate inspection in the said LCD manufacturing line is demonstrated.

When the floating stage 1 blows air at a uniform air pressure from the plurality of air blowing holes 1h, an air layer is formed between the surface 1a of the floating stage 1 and the glass substrate 2, and the glass The substrate 2 floats on the surface 1a of the floating stage 1.

Each board | substrate adsorption apparatus 39 of each conveyance part 32 and 33 adsorbs-protects and hold | maintains the both edges of the head side of the conveyance direction E in the glass substrate 2 which floats air. These conveyance parts 32 and 33 move on each guide rail 30 and 31 in synchronization with the conveyance direction E of an LCD manufacturing line, respectively, in the state which carried out the adsorptive protection of the glass substrate 2, respectively. Thereby, the glass substrate 2 which floated by air is pulled by the movement of each conveyance part 32, 33, and is conveyed by the conveyance direction E at high speed.

When the glass substrate 2 to reach the substrate could portion (S 1), each conveying section (32, 33) stops the movement. In the state in which the glass substrate 2 is made air-floating, each 1st board | substrate protection holding mechanism 3A extends each expansion rod 7 of each pneumatic cylinder 6 upward by a predetermined expansion stroke in synchronization with each other. . Each contact member 13 rises with each support rod 12 with the extension of these expansion rods 7. When the raising height by extension of each expansion rod 7 reaches a preset height, each pneumatic cylinder 6 stops the expansion of each expansion rod 7 respectively.

As a result, the upper surface 14 of each contact member 13 of each pneumatic cylinder 6 contacts the rear surface of the airborne glass substrate 2 as shown in FIG. At this time, the contact of the upper surface 14 of each contact member 13 to the back surface of the glass substrate 2 is caused by the pushing force of the coil springs 18, so that the airborne glass substrate 2 Friction marks on the glass substrate 2 with a small frictional force that does not move by external force or inertia due to its own weight less than the contact pressure with respect to the glass substrate 2 at the time of non-adsorption of each conveyance part 32 and 33, Contact with a very small pressing force that does not affect deformation or deformation.

Each contact member 13 is formed of resin, and is rotatable with respect to each of the supporting rods 12 via a ball bearing 17, and is movable in a vertical direction by the pushing force of each coil spring 18. Since it is provided, it rotates or moves up and down according to the posture, such as the inclination of the glass substrate 2 and each contact member 13, when contacting the back surface of the glass substrate 2, and is located in the back surface of the glass substrate 2 Contact.

Thus, since each contact member 13 is made to contact the back surface of the glass substrate 2 in the air floating state of the glass substrate 2, the weight added to each contact member 13 becomes small. Thereby, the frictional resistance between the glass substrate 2 and the upper surface part 14 of each contact member 13 becomes small so that the glass substrate 2 may not be moved unless an external force is applied. In addition, each contact member 13 stops at the same height position by the extension of each expansion rod 7 to the preset height of each pneumatic cylinder 6. Thereby, the glass substrate 2 is hold | maintained without moving in a horizontal state.

Thereafter, each conveyance part 32 and 33 stops adsorption protection holding | maintenance with respect to the glass substrate 2, and returns to the carrying-in side (upstream side) of the glass substrate 2. As shown in FIG.

Move as the respective transport section (32, 33) returning toward the imported at the same time, toward the beginning of the conveying direction E of the glass substrate (2) in each conveying section (34, 35) of the substrate also section (S 1), and these Each board | substrate adsorption apparatus 39 in the conveyance parts 34 and 35 starts a suction operation. When each conveyance part 32 and 33 completes adsorption with respect to the glass substrate 2, each 1st board | substrate protection holding mechanism 3A synchronizes each expansion rod 7 of each pneumatic cylinder 6 in synchronization with each other. Contraction. Each 1st board | substrate protection holding mechanism 3A falls from the back surface of the glass substrate 2, and the glass substrate 2 floats on the floating stage 1. As shown in FIG.

These conveyers 34 and 35 move on the respective guide rails 30 and 31 in synchronization with the downstream side of the LCD manufacturing line in a state in which the glass substrate 2 is adsorbed and protected, and the glass substrate 2 To the inspection unit S 2 at high speed.

When the glass substrate 2 to reach the inspection section (S 2), each conveying section (34, 35) stops the movement. In a state where the glass substrate 2, the air portion, checking (S 2) each new load of each of the substrate protection of the second holding mechanism (3B) are each pneumatic cylinder (6) in synchronization with each other as shown in Fig. 2 at ( 7) is extended upward by a predetermined stretching stroke. As the extension rod 7 extends, the suction pad 22 provided on the support case 20 rises. When the expansion of the expansion rod 7 reaches the preset expansion stroke, the pneumatic cylinder 6 stops the expansion of the expansion rod 7. Thereby, each adsorption pad 22 contacts the back surface of the glass substrate 2 which floats air. At this time, the contact pressure between the suction pads 22 and the glass substrate 2 is such that the glass substrate 2, which is air-floating due to the pushing force of the bellows 25, is pressed by the pressing pin 43 or its own weight. By contacting the back surface of the glass substrate 2 with a small friction force so that it does not move, it regulates the movement of the glass substrate 2 which floats air. That is, each suction pad 22 has a frictional force that acts on the back surface of the glass substrate 2 so that the frictional force that the glass substrate 2 can move by following the movement of each pressing pin 43 is applied to the glass substrate 2. Temporarily fix

In this state, when each pressing pin 43 is pressed to the edge of the glass substrate 2, the glass substrate 2 follows each pressing pin 43 (the glass substrate 2 from each pressing pin 43). It does not fall, and it moves, and the two adjacent sides of the glass substrate 2 contact each reference pin 42, and are aligned to a reference position. Before the start of each of the alignment transfer section 34, 35 are moved toward and stopping the absorption protection for holding the glass substrate 2, the substrate could portion (S 1).

Next, air suction is performed by the suction pump via the air suction port 29 and the suction tube of the air flow passages 28a to 28c. Thereby, air is sucked in from each suction pad 22, and this air passes through the inside of the air flow paths 28a to 28c communicating between the bellows 25, the support member 24, and the support case 20. Is sucked through. When the air suction blocks the space between the respective suction pads 22 and the back surface of the glass substrate 2, the bellows 25, the support member 24, and the support case from the pad grooves 26 of the suction pads 22. The air flow paths 28a to 28c communicating between the parts 20 become negative pressure, and the bellows 25 is crushed, so that the respective adsorption pads 22 adsorb to the rear surface of the glass substrate 2. Thereby, the glass substrate 2 is fixed-protected and hold | maintained.

The suction pad 22 descends. As for the suction pad 22, the engaging ring 27 of the suction pad 22 abuts on the lower end in the annular horizontal groove part 23, and descending is regulated.

Thus, in the state where the glass substrate 2 was fixed-protected and hold | maintained on the floating stage 1 by each adsorption pad 22, the door-shaped arm 44 was made the same direction as the conveyance direction E of the glass substrate 2 (arrow The glass substrate 2 is inspected by moving the microscope head 45 on the door-shaped arm 44 in the vertical direction (arrow J direction) while moving in the F direction. .

If the tests of the glass substrate 2 is completed, move to another each carry section inspection (S 2) from the downstream side, and to keep the head side of the glass substrate 2 is conveyed to the downstream side adsorption protection.

Thus, the glass substrate 2, the air may transport substrate of LCD production line for part holding substrate protection of the first to (S 1) provided a mechanism (3A) and the inspection section (S 2) for holding a substrate protected by a second mechanism (3B) was prepared. Substrate could portion (S 1) in the temporarily by a glass substrate 2, even if the stop adsorption protective maintenance of the transport portion (32, 33) on the glass substrate 2 is held the substrate protected by the first mechanism (3A) It is protected and can stop without moving. If it is a free state only by air floating, the glass substrate 2 will move by external force, such as a very fine inclination or downflow, for example, but it will be with the 1st board | substrate protection holding mechanism 3A, the glass substrate 2, and the like. The movement of the glass substrate 2 can be regulated by the frictional force of.

Substrate could portion (S 1) in the air portion and the glass substrate 2 to the substrate protective maintained in a regulating movement by a frictional resistance caused by the contact of the device (3A) conditions, the transport of the downstream side of the first in The glass substrate 2 can be stably exchanged to the parts 34 and 35.

In the substrate water supply part S 1 , even when the first substrate protection holding mechanism 3A contacts the rear surface of the air floating glass substrate 2, the pushing force of the coil spring 18 is set to an optimum value. Since the glass substrate 2 slides on the first substrate protection holding mechanism 3A, the rear surface of the glass substrate 2 is not affected.

In the inspection part S 2 , the floating glass substrate 2 is placed on each suction pad 22, and the glass substrate 2 is temporarily fixed by the frictional force with the second substrate protection holding mechanism 3B. In this state, the glass substrate 2 can be brought into close contact with each of the reference pins 42 by pressing the pressing pins 43, so that the glass substrate 2 can be stably aligned at the reference position. In addition, since the glass substrate 2 can be adsorbed and fixed by each adsorption pad 22 after alignment, the glass substrate 2 can be test | inspected without causing position shift to the glass substrate 2.

3 A of 1st board | substrate protection holding mechanisms are the structures which raise and lower the board | substrate protection holding member 10 which supports the contact member 13 with the pneumatic cylinder 6, and the 2nd board | substrate protection holding mechanism 3B Since the configuration of raised and lowered by the adsorption pad 22 to the pneumatic cylinder 6, the first and second substrates protection holding mechanism (3A, 3B) both miniaturization is possible, and each LCD may substrate of the production line section (S 1 ), It is easy to apply to the inspection unit (S 2 ).

Glass substrate 2 to which the air conveyed to the LCD production line is carried out also in between the substrate could portion (S 1), the glass substrate 2, the air of each conveying section (32, 33 and 34, 35) in the portion in which the state in Therefore, air conveyance can be carried out at high speed, the time required for the inspection process of the glass substrate 2 can be shortened, and inspection tact time can be shortened.

Next, the case where the board | substrate protection holding mechanism is applied to the floating stage used for a board | substrate inspection apparatus is demonstrated.

6 is an external view of a floating stage used in a substrate inspection apparatus. 3 A of each 1st board | substrate protection holding mechanisms shown in FIG. 1 are provided in four places on the spherical floating stage 100, for example. The location where these 1st board | substrate protection holding mechanisms 3A are provided is the location which can support the floating glass substrate 2 from a back surface, for example, is provided in four places corresponding to each rectangular corner position.                 

Each reference pin 50 constituting the positioning mechanism is fixedly provided on each side of XY on the outer circumferential portion of the floating stage 1, and the pressing pins 51 are movable on the side opposite to these sides. It is prepared.

In the state where the glass substrate 2 is air-floated on the floating stage 1, when the stretching rod 7 of each of the first substrate protection holding mechanisms 3A is extended upward by a predetermined stretching stroke, it is shown in FIG. As described above, the upper surface 14 of each contact member 13 of each pneumatic cylinder 6 contacts the rear surface of the glass substrate 2. By the pushing force of each coil spring 18, the contact member 13 does not move by the external force smaller than the pressurization of the press pin 51 by the glass substrate 2 which air floats, and also the glass substrate 2 The back surface of the airborne glass substrate 2 is contacted with a small pressing force that does not affect the back surface of the substrate) to protect and keep the airborne glass substrate 2 from moving in a horizontal state.

In this state, when the glass substrate 2 is in close contact with each of the reference pins 50 by pressing the pressing pins 51, the glass substrate 2 is stably aligned at the reference position.

When the alignment of the glass substrate 2 is completed, each pneumatic cylinder 6 contracts the expansion rod 14. When the retractable rod 14 contracts, the glass substrate 2 remains aligned and air floats on the floating stage 100.

In this state, for example, the door-shaped arm 44 on which the microscope head 45 or the like shown in FIG. 3 is mounted moves in the X direction, and the microscope head 45 moves in the Y direction so that the glass substrate ( 2) is inspected.                 

Thus, even if it applies to the floating stage 100 of a board | substrate test | inspection apparatus, the movement of the glass substrate 2 which floats air is regulated by the frictional resistance by the contact of each contact member 13, and each press pin 51 ) Can be adhered to each reference pin 50, so that the glass substrate 2 can be stably positioned at the reference position, thereby producing the same effects as those applied to the substrate inspection process of the LCD manufacturing line. have.

Next, a second embodiment of the present invention will be described. In addition, the same code | symbol is attached | subjected to the same part as FIG. 1, and the detailed description is abbreviate | omitted.

It is a block diagram of a board | substrate protection holding mechanism. A ring-shaped support member 60 is provided in the opening of the cylindrical hole 4 provided in the floating stage 1. This ring-shaped support member 60 has a pair of ring-shaped pinching pieces 60a and 60b in an up-down direction. The ring-shaped support member 60 is sandwiched with the contact films 61 extended by the sandwiching pieces 60a and 60b. This contact film 61 is formed with a uniform film thickness by wear-resistant resin, and is stretchable. In addition, as shown in FIG. 8, the contact film 61 by the ring-shaped support member 60 arrange | positions two ring clamping pieces 60a, 60b of different outer diameters in the horizontal direction and doubled inside and outside. You may also do it.

The piping 63 is provided in the lower part of the hole 4 via the connection member 62. As shown in FIG. The compressed air supply part 64 is connected to the other end of this piping 63. The compressed air supply part 64 supplies the compressed air into the hole 4 through the pipe 63.

Moreover, the air pressure regulating valve 65 is provided in the piping 63. The air pressure regulating valve 65 adjusts the flow rate of the air supplied into the hole 4 by adjusting the opening degree, or turns on / off the air supply by the opening operation and the closing operation. The air pressure regulating valve 65 is a contact amount when the supply amount of compressed air into the hole 4 increases in the pressure in the hole 4 by supplying the compressed air, and the contact membrane 61 swells upward. The amount of air supply that friction resistance between the film 61 and the back surface of the floating glass substrate 2 regulates the movement of the glass substrate 2 and does not affect the back surface of the glass substrate 2 such as damage. Adjust with

Next, the movement regulation operation | movement of the glass substrate 2 by the board | substrate protection holding mechanism comprised as mentioned above is demonstrated.

In a state where the glass substrate 2 is air floating on the floating stage 1, the compressed air is supplied into the hole 4 through the pipe 33. At this time, the air pressure regulating valve 65 opens the valve, and the pressure in the hole 4 increases the flow rate of the air supplied into the hole 4 by adjusting the opening degree of the valve. When 61 swells upward, the frictional resistance between the contact film 61 and the back surface of the floating glass substrate 2 regulates the movement of the glass substrate 2 and damages the back surface of the glass substrate 2. Adjust the air supply without affecting

When compressed air is supplied into the hole 4, the inside of the hole 4 is hermetically sealed, so that the pressure inside the hole 4 gradually increases, and accordingly, the pressure applied to the contact film 61 also gradually increases. Thereby, the contact film 61 swells upwards as shown by the dotted line of FIG. This expansion is because the contact film 61 is formed to have a uniform film thickness, so that the rising height of the central portion of the contact film 61 is the highest, and gradually decreases as it moves away from the central portion.

When the center part contacts the back surface of the glass substrate 2 by the expansion of this contact film 61, the glass substrate 2 does not move with the small frictional resistance between the glass substrate 2 and the contact film 61. It is kept protected on the contact film 61. At this time, since the contact film 61 expands with elasticity by supplying compressed air, the contact film 61 is brought into contact with the glass substrate 2 flexibly and does not affect the back surface of the glass substrate 2 such as damage.

Such a substrate protection holding mechanism is, for example, the first substrate protection holding mechanism 3A provided in the substrate water supply part S 1 in the floating stage 1 of the LCD manufacturing line shown in FIG. 3, or in FIG. 6. By replacing and providing the 1st board | substrate protection holding mechanism 3A provided in the floating stage 100 of the board | substrate inspection apparatus shown in figure, the effect similar to the said 1st Embodiment can be produced, respectively. According to this substrate protection holding mechanism, the effect similar to the said 1st Embodiment can be produced with the simple structure which only needs to expand the contact film 61. FIG.

This invention is not limited to the said, 1st-3rd embodiment, You may change variously. For example, in each said embodiment, although it demonstrated about the case where it applied to the floating stage 1 of an LCD manufacturing line, or the floating stage 100 of a board | substrate inspection apparatus, it is not limited to this, The board | substrate inspection apparatus and various board | substrate manufacture You may apply to each floating stage 100 of the carry-in / out side in an apparatus.

For example, the case where the 1st board | substrate protection holding mechanism 3A with a lift function is provided on the floating stage 1 at the carry-in side in an LCD manufacturing line is demonstrated. A carry-in robot is provided on the carry-in side of the floating stage 1. Each 1st board | substrate protection holding mechanism 3A raises each contact member 13 to the height which receives the glass substrate 2 from the suction hand of the carry-in side robot by the drive of the pneumatic cylinder 6. In this state, the robot for carrying in lowers a suction hand, and mounts the glass substrate 2 on each contact member 13 of each 1st board | substrate protection holding mechanism 3A on the floating stage 1.

Next, the floating stage 1 blows air from the plurality of air blowing holes 1h. In this state, the pneumatic cylinder 6 lowers each 1st board | substrate protection holding mechanism 3A, and stops at the position slightly higher than the position where the glass substrate 2 floats with air. At this time, since the glass substrate 2 is mounted on each contact member 13 in the air floating state, it does not move even in the air floating state. Thereafter, as shown in FIG. 3, alignment is performed by an alignment mechanism composed of the reference pin 42 and the pressing pin 43.

Can each installation of claim 1, the holding substrate protection of the second mechanism (3A, 3B) in the substrate also part of the LCD manufacturing line (S 1) or a checking unit (S 2) are each not limited to the four positions, for example, For example, three places which become each vertex of a triangle, or multiple places where the glass substrate 2 is stably protected and hold | maintained, and the frictional resistance between the glass substrate 2 and each contact member 13 does not increase may be sufficient.

The elastic support of the contact member 13 is not limited to the coil spring 18, but a rubber formed in a cylindrical shape may be used.

The contact member 13 and the adsorption pad 22 may change the magnitude | size of the contact area with respect to the back surface of the glass substrate 2, and may adjust the magnitude | size of the frictional resistance which generate | occur | produces with the glass substrate 2. Thereby, even if the air blowing force of air is the same, when the size of the glass substrate 2 changes, since the self-weight of the glass substrate 2 changes with size, correspondence according to the self-weight of this glass substrate 2 It is possible.

The floating of the glass substrate 3 is not limited to air floating, but can also be applied to the case of regulating the movement of the floating glass substrate caused by electrostatic injury or ultrasonic injury.

Although this invention demonstrated the case where it applied to the conveyance of the large glass substrate 1 of a liquid crystal display, for example, it can apply also to the conveyance of a semiconductor wafer and various members.

Claims (13)

  1. In the substrate floating apparatus which floats the glass substrate by forming an air layer between the glass substrate and the floating stage,
    A substrate protection holding mechanism for bringing a contact member into contact with a back surface of the glass substrate floating on the floating stage to regulate movement of the glass substrate by frictional force between the glass substrate and the contact member,
    The substrate protection holding mechanism further has an elastic member for applying a force in the direction of pushing the contact member to the rear surface of the glass substrate, and by pushing the contact member to the rear surface of the glass substrate by the elastic force of the elastic member, A substrate floating apparatus comprising a frictional force applied to a rear surface of the glass substrate floating on a stage to regulate movement.
  2. The method of claim 1,
    The contact member is a substrate floating apparatus, characterized in that installed to be movable in the vertical direction via the elastic member at the front end of the support bar.
  3. The method of claim 1,
    The contact member is made of a suction pad in contact with the back surface of the glass substrate, the suction pad is a substrate floating apparatus, characterized in that supported by the elastic member stretched in the vertical direction.
  4. The method according to any one of claims 1 to 3,
    And the elastic member is set to an elastic force for contacting the contact member with the back surface of the glass substrate with a small frictional force such that the glass substrate floating on the floating stage is not moved unless an external force is applied. Device.
  5. The method according to any one of claims 1 to 3,
    The contact member is mounted to an elastic rod moving up and down by an actuator, and the stretching stroke of the elastic rod is set to an elevated height contacting the back surface of the glass substrate on which the contact member floats on the floating stage. Substrate flotation device characterized in that.
  6. The method of claim 3, wherein
    The suction pad is supported by the suction pad support member made of the elastic member which is stretched in the vertical direction in the support case, and a substrate hook is formed on the lower portion of the suction pad to restrict the vertical movement. Device.
  7. The method of claim 6,
    The elastic member is provided with an air flow passage communicating with the suction pad, the suction pump is connected to the air flow passage via a suction tube, and the glass substrate on which the suction pressure of the suction pump rises onto the floating stage. A substrate floating apparatus, characterized in that the suction pressure is set so that it does not move due to its own weight.
  8. The method of claim 1,
    The contact member is formed of a contact film made of an elastic member that is inflated by supply of compressed air, and the contact film is installed in an open state in an opening formed in the surface of the floating stage, and is compressed air connected to the opening via a pipe. A substrate floating apparatus, which is pushed up to the rear surface of the glass substrate by inflating the connecting film by allowing air to be supplied by a supply unit.
  9. The method according to any one of claims 1, 2, 3, 8,
    The floating stage has a plurality of reference pins for positioning the glass substrate at a reference position, and a plurality of pressing pins for pushing the glass substrate toward the reference pin, and at the time of alignment of the glass substrate floating on the floating stage. And aligning the glass substrate by pushing the glass substrate toward the plurality of reference pins by the plurality of pressure pins while the contact member is in contact with the rear surface of the glass substrate.
  10. The method according to any one of claims 1, 2, 3, 8,
    The floating stage is provided with a plurality of substrate transfer units that are capable of adsorbing, protecting, holding and transporting the floating glass substrates independently of each other, and the glass substrate transferred by one substrate transfer unit may be transferred from the other substrate transfer unit. : At the other substrate transfer part in a state in which the contact member is brought into contact with the rear surface of the glass substrate to stop the movement of the glass substrate in a water supply part of the glass substrate. Substrate flotation device, characterized in that.
  11. delete
  12. delete
  13. delete
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WO2004096679A1 (en) 2004-11-11
TWI368757B (en) 2012-07-21
CN1697768A (en) 2005-11-16
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CN1697768B (en) 2011-03-30
JP4418428B2 (en) 2010-02-17
CN102152966A (en) 2011-08-17
CN102152966B (en) 2013-03-27
JPWO2004096679A1 (en) 2006-07-13

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