CN103246166B - Silicon wafer prealignment measuring apparatus - Google Patents
Silicon wafer prealignment measuring apparatus Download PDFInfo
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- CN103246166B CN103246166B CN201210022850.2A CN201210022850A CN103246166B CN 103246166 B CN103246166 B CN 103246166B CN 201210022850 A CN201210022850 A CN 201210022850A CN 103246166 B CN103246166 B CN 103246166B
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Abstract
A silicon wafer prealignment measuring apparatus comprises three visual photoetching machines and a shell and is used for prealigning a detected silicon wafer disposed on a workbench, the shell is used for fixing the three visual photoetching machines, each of the three visual photoetching machines comprises imaging CCD, an imaging optical path, an illuminating optical path and a reflector, and light from the tested silicon wafer undergoes angle change through the reflector and enters the imaging CCD through the imaging optical path; the imaging optical paths of the three visual photoetching machines are in a same plane paralleling to the plane in which the detected silicon wafer is positioned; and the three visual photoetching machines respectively acquire three-segment edge information of the detected silicon wafer, and calculate according to the acquired silicon wafer edge information to obtain the residual eccentric error and the residual deflection error. The silicon wafer prealignment measuring apparatus has the advantages of prealignment precision increase, strong structural independence, compact structure, no restriction on the space of a projection object lens, strong offline adjusting flexibility, and reduced influences on the temperature of the surrounding microenvironment.
Description
Technical field
The present invention relates to prealignment measurement mechanism, particularly a kind of silicon chip edge information measurement apparatus.
Background technology
Lithographic equipment be a kind of by mask pattern exposure image to the equipment on silicon chip.Lithographic equipment is supermatic, it has full automatic silicon chip servo-drive system, be referred to as wafer handling, lithographic equipment is not only to the productivity requirements that wafer handling is necessary, to meet the production efficiency of whole equipment, and there is strict requirement to the precision that silicon chip is transferred on worktable.Because silicon chip possesses circular and these two kinds of geometric properties of breach, from geometry calculates, as long as obtain the unique point that silicon chip is circumferentially enough, just can obtain home position and the breach direction of a silicon chip, and then silicon chip is transmitted to worktable with higher centering and orientation repeatability.In traditional wafer handling designs, generally all prealignment device can be added, to solve the centering that silicon chip transmits to worktable, directed repeated problem, but because prealignment device is mounted on transmission system framework, when to litho machine internal transmission, due to the stability problem between framework, namely the reposition error introduced in transmitting procedure after prealignment, the silicon chip repeatability be transferred on worktable is caused to be a greater impact, therefore, when proposing requirements at the higher level to transmission system silicon chip servo accuracy, be obviously implacable.If add again measurement mechanism and precision adjustment motion in transmission system inside, obviously greatly increase the design complexities of transmission, increase cost, reduce reliability.Consider that worktable and transmission system have handing-over position when collaborative work, can the residual deviation that vision measurement device measures silicon chip when joining be set in handing-over position, when worktable obtains silicon chip, compensates this deviation, just reach the object of raising upper slice precision further.
Shown in Figure 1, US Patent No. 5648854 have employed this kind of Design Conception, but when being applied particularly to product design, there is following problem:
1, the image processing module 261,262,263 of three vision systems is near projection objective and main substrate, and its thermal source affects their thermal stability; 2, vision system vertical arrangement, affects the design of camera lens radial dimension, and requires that main substrate wants perforate, affect main substrate structural stability; 3, due to the vertical arrangement of vision system, cause three groups of visions can not quadrature arrangement, quadrature arrangement improves the most favourable for secondary prealignment measuring accuracy; 4, the cabling wiring of vision system unavoidably enters overall design inside and improves design complexity, and be unfavorable for the modularization of these parts, independent, integrated debugging is inconvenient.Because structural arrangement is loose, these parts are difficult to off-line and debug test, and manufacture has a big risk.
Summary of the invention
The technical problem to be solved in the present invention is the restriction that vision system layout is subject to photoetching machine lens.In order to solve the problems of the technologies described above, the invention discloses a kind of wafer pre-alignment measurement mechanism, comprise three groups of vision ray machines and housing, prealignment operation is carried out to the tested silicon chip that worktable is placed, described housing is in order to fixing described three groups of vision ray machines, described vision ray machine comprises imaging CCD, imaging optical path and illumination path
Described vision ray machine also comprises a catoptron, and the light from described tested silicon chip enters described imaging CCD by after described catoptron change angle through described imaging optical path;
The imaging optical path of described three groups of vision ray machines is in the same plane being parallel to described tested silicon chip;
Described three groups of vision ray machines obtain three sections of marginal informations of described tested silicon chip respectively, according to the silicon chip edge information obtained, calculate the bias deflection residual error obtaining described silicon chip.
Further, the capture point of described three groups of vision ray machines is distributed on a semi arch, and the central angle of the capture point of two adjacent groups vision ray machine becomes 90 degree.
Further, the illumination path of described vision ray machine, is positioned at the plane at described three groups of vision ray machine imaging optical path places.
Further, described imaging optical path and described illumination path coaxial.
Further, also comprise heat sink, described heat sink fits in described imaging CCD.
Further, described heat sink fits in described imaging CCD by heat conductive silica gel.
Further, described heat sink also comprises cooling-cycle device, realizes heat interchange by projection objective camera lens chilled water.
Further, also comprise three catoptrons, be positioned on described worktable, described three catoptrons are corresponding with described three groups of vision light machine position, in order to reflect the illumination light that described vision ray machine sends, for described vision ray machine provides backlight.
Further, described prealignment measurement mechanism is positioned at below litho machine main substrate, projection lens of lithography machine side, and above described worktable, described housing is connected with described litho machine main substrate.
Further, described housing is made up of upper interface board, lower interface plate and web member, described prealignment measurement mechanism is connected with described litho machine main substrate by described upper interface board, lower interface plate is in order to carry described three groups of vision ray machines, and web member is in order to connect described upper interface board and described lower interface plate.
Further, also comprise three blocks of ray machine adjustment plates, vision ray machine described in each is connected with lower interface plate respectively by ray machine adjustment plate described in, and described ray machine adjustment plate carries out 6DOF adjustment to described vision ray machine.
Further, the described web member between described upper interface board and described lower interface plate is three groups of difference adjusters, in order to adjust described prealignment measurement mechanism integral level degree.
Further, described upper interface board interface is provided with RZ to adjusting mechanism.
The advantage of wafer pre-alignment measurement mechanism of the present invention is that raising prealignment precision, independence of structure are strong, compact conformation, and do not limit the space of projection objective, off-line adjustment dirigibility is strong, on the temperature impact reduction of surrounding microenvironment.
Accompanying drawing explanation
Fig. 1 is the schematic layout pattern of photo-etching machine silicon chip vision system in prior art;
Fig. 2 is schematic layout pattern when optical vision system is applied to 300mm silicon chip in wafer pre-alignment measurement mechanism of the present invention;
Fig. 3 a, 3b are structure and the light path schematic diagram of a vision ray machine in Fig. 2 optical vision system, and 3a is front view, and 3b is vertical view;
Fig. 4 is the schematic layout pattern of wafer pre-alignment measurement mechanism of the present invention in litho machine complete machine;
Fig. 5 is the structural representation that Fig. 2 arranges on the table;
Fig. 6 is the structural representation of wafer pre-alignment measurement mechanism of the present invention when being applied to 300mm silicon chip;
Fig. 7 is schematic layout pattern when optical vision system is applied to 200mm silicon chip in wafer pre-alignment measurement mechanism of the present invention
Fig. 8 is the structural representation of wafer pre-alignment measurement mechanism of the present invention when being applied to 200mm silicon chip.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
Wafer handling transmits silicon chip eccentric acquisition with deflection after prealignment and tentatively compensates, thereafter, silicon chip continues to litho machine delivered inside by transmission manipulator, now because the repeatability of mechanical arm itself affects, and due to the relative drift of litho machine inside and outside framework, silicon chip Wafer handling being sent to worktable delivery position can produce very large position disturbance, and for making up these losses and further raising upper slice precision, silicon chip also will carry out secondary prealignment at delivery position.By secondary prealignment, namely measured by the prealignment measurement mechanism in the present invention, obtain the remaining eccentric and deflection of silicon chip, by worktable, residual error is compensated.Described worktable is in order to place tested silicon chip.
The schematic layout pattern of optical vision system when Figure 2 shows that prealignment measurement mechanism of the present invention applies to 300mm silicon chip, three groups of vision ray machines 201 are arranged at grade, and be level trend, the capture point of three groups of vision ray machines 201 is arranged on orthogonal position, namely the capture point of three groups of vision ray machines 201 is arranged on a semi arch of same level, and becomes 90 degree of anglecs of rotation (central angle is 90 degree) relative to the center of circle of circular arc between adjacent two capture points.Here corresponding 300mm silicon chip 203 center of circle, the center of circle, corresponding silicon chip 203 edge of circular arc.The structure of vision ray machine 201 and light path schematic diagram are see shown in Fig. 3 a, 3b, for realizing level trend, often organize vision ray machine and comprise imaging CCD101, imaging optical path 102 and illumination path 103, three arranges at grade, namely in three groups of vision ray machine place planes, and compress camera lens thickness as far as possible; The imaging optical path of three groups of vision ray machines is in the same plane being parallel to tested silicon chip, and illumination path is also positioned at the plane at three groups of vision ray machine imaging optical path places.Also comprise a catoptron 104 in vision ray machine, after changing angle from the light L of tested silicon chip by described catoptron 104, enter described imaging CCD101 through described imaging optical path 102.Due to thickness as far as possible compression and ray machine device wants compact same layer to arrange, imaging optical path 102 and illumination path 103 are in coaxial state, namely illumination path overlaps with imaging optical path, first light source is the illumination of capture district by coaxial-illuminating light path 103, and imaging optical path 102 obtains image and sends it to imaging CCD photosensitive imaging.Three groups of vision ray machines 201 obtain silicon chip three sections of profiles respectively, according to the three sections of profiles obtained, calculate home position and the breach direction of silicon chip, thus judge the bias deflection residual error of silicon chip when being transferred to worktable.
As shown in Figure 4, in prealignment measurement mechanism, three groups of vision ray machines are combined into parts by the fixing entirety that formed of a housing, prealignment measurement mechanism is under main substrate 302 in complete machine, projection objective 301 side, this layout depends on noted earlier, the landscape layout of vision ray machine, by the visual component of ray machine, light source assembly lateral arrangement, optical vision system 303 is made to become thin module, level is to layout, lens design is not had an impact, main substrate perforate need not hold vision system, the structural stability of main substrate is unaffected, three vision system quadrature arrangement, secondary prealignment precision can be improved to greatest extent.
Image-forming principle of the present invention and Cleaning Principle, shown in Fig. 3 a, 3b, illumination path 103 forms parallel beam and is illuminated in capture region and true field, and imaging optical path 102 and illumination path 103 are in coaxial state, from the true field capture illuminated, in order to make silicon chip edge image more clear, edge collecting is more accurate, shown in Figure 5, at worktable 401 just to the position in secondary prealignment capture face, be provided with 3 orthogonal catoptrons 402, in order to reflect the illumination light that described vision ray machine sends, for silicon chip 203 edge capture provides backlight, make silicon chip ragged edge accurately image, last three compositions are as the picture with wafer sections marginal information CCD 101 being formed light and shade change, one of them picture is with silicon chip breach information and part silicon chip circular-arc information, another two pictures are with part silicon chip edge information, the image collected is obtained by image pick-up card and form silicon chip topographical information after edge detection algorithm process, the center of circle and breach direction is obtained through software process, and then calculate eccentric deflection residual error, and send work system to and perform compensation.
Wafer pre-alignment measurement mechanism of the present invention is applied to structural representation during 300mm silicon chip, shown in Figure 6, in wafer pre-alignment measurement mechanism of the present invention, three groups of vision ray machines 201 are fixed with lower interface plate 502 by respective ray machine adjustment plate 503, and ray machine adjustment plate 503 has 6DOF adjust structure, each vision ray machine 201 can be made to reach optimum posture relative to 300mm silicon chip 203, namely optimum visual field and image quality is realized, 3 bulb closely-pitched adjustment screws are provided with bottom ray machine adjustment plate 503, bulb holds out against lower interface plate 502, RX is carried out by rotating screw thread, RY, the adjustment of RZ, two groups are had to regulate X in the side of ray machine adjustment plate 503, Y, the passing screw of RZ, can adjust based on plate 503 by ray machine and pass ray machine adjustment plate 503, but the present invention does not impose any restrictions this.
The imaging CCD101 of each vision ray machine 201 is all thermals source of about 5W, because the high-accuracy device around this prealignment measurement mechanism is to responsive to temperature, therefore be provided with heat sink 505 to be fitted in each imaging CCD101 side by heat conductive silica gel and to carry out temperature control, and adopt active heat removal, realize high efficient heat exchanging by camera lens chilled water.
After off-line has debug each vision ray machine 201, this prealignment measurement mechanism has also needed high-precision levelness to regulate, integrated with litho machine main substrate by upper interface board 501.In order to adjust integral level degree, 3 groups of difference adjusters 504 are devised between upper interface board 501 and lower interface plate 502, can 0.25mm be reached by screw thread differential principle individual pen adjustment spacing, realize the overall fine adjustment of attitude of prealignment measurement mechanism, adjust described prealignment measurement mechanism integral level degree.Described upper interface board, described lower interface plate and web member composition housing, described housing is in order to fixing described three groups of vision ray machines, web member is in order to connect described upper interface board and described lower interface plate, described web member can be specially 3 groups of difference adjusters 504 in the present embodiment, but the present invention does not impose any restrictions this.In addition, the interface that upper interface board 501 is integrated with main substrate devises RZ to adjust structure, to correct the angle of prealignment measurement mechanism and main substrate.
Shown in Fig. 7, Fig. 8, for the present invention is applied to another embodiment of 200mm wafer pre-alignment measurement, optical system continues to use the design of aforementioned 300mm wafer pre-alignment measuring system, the layout of different just three groups of vision ray machines 201, and the form of upper interface board 501 and lower interface plate 502.
The prealignment measurement that the present invention simultaneously proposes is configurable, and vision ray machine is dismountable relative to housing, and three groups of vision ray machines are equipped with the housing of different size shape, just can adapt to the prealignment demand of different size silicon chip.Or the design only changing several machined piece just can realize exchanging, and specifically upgrades the screw hole location upper and lower interface board being installed ray machine, just can realize the compatible exchange of 300/200, illustrate that this kind of framework configurability is stronger.
Vision system level of the present invention, to layout, does not have an impact to lens design, and main substrate perforate need not hold vision system, and the structural stability of main substrate is unaffected; Vision system quadrature arrangement, can improve secondary prealignment precision to greatest extent; Vision system arranges three groups, forms individual components, and cabling wiring all completes in components interior, unified switching, and independence is stronger, is beneficial to modular design; Compact conformation, can adjust to optimum efficiency by off-line, be demarcated in advance by the position relationship of three groups of vision systems, integrated regulation time integrated before integrated.The present invention adds vision system active cooling circulating device further, and the heat radiation power reducing vision system, to minimum, reduces on the impact of surrounding microenvironment; There is provided unified interface to often organizing vision system, adjustment six degree of freedom, realizes the optimal imaging effect often organized; Entirety provides the interface integrated with litho machine, and can realize overall accurate leveling, adjusts RZ, corrects the RZ error with complete machine coordinate system, avoids affecting alignment system.Due to each vision separated layout, the configurable secondary prealignment to 200mm, 300mm can be realized, the process of these two kinds of specification silicon chips compatible; Worktable side provides silicon chip backlight eyeglass, improves secondary prealignment vision system further to the recognition capability of silicon chip edge.
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (12)
1. a wafer pre-alignment measurement mechanism, comprise three groups of vision ray machines and housing, prealignment operation is carried out to the tested silicon chip that worktable is placed, described housing is in order to fixing described three groups of vision ray machines, described vision ray machine comprises imaging CCD, imaging optical path and illumination path, described vision ray machine also comprises a catoptron, and the light from described tested silicon chip enters described imaging CCD by after described catoptron change angle through described imaging optical path;
The imaging optical path of described three groups of vision ray machines is in the same plane being parallel to described tested silicon chip;
Described three groups of vision ray machines obtain three sections of marginal informations of described tested silicon chip respectively, according to the silicon chip edge information obtained, calculate the bias deflection residual error obtaining described silicon chip, it is characterized in that, also comprise three catoptrons, be positioned on described worktable, described three catoptrons are corresponding with described three groups of vision light machine position, in order to reflect the illumination light that described vision ray machine sends, for described vision ray machine provides backlight.
2. prealignment measurement mechanism according to claim 1, is characterized in that, the capture point of described three groups of vision ray machines is distributed on a semi arch, and the central angle of the capture point of two adjacent groups vision ray machine becomes 90 degree.
3. prealignment measurement mechanism according to claim 1, is characterized in that, the illumination path of described vision ray machine, is positioned at the plane at described three groups of vision ray machine imaging optical path places.
4. prealignment measurement mechanism according to claim 3, is characterized in that, described imaging optical path and described illumination path coaxial.
5. prealignment measurement mechanism according to claim 1, is characterized in that, also comprise heat sink, and described heat sink fits in described imaging CCD.
6. prealignment measurement mechanism according to claim 5, is characterized in that, described heat sink fits in described imaging CCD by heat conductive silica gel.
7. prealignment measurement mechanism according to claim 6, is characterized in that, described heat sink also comprises cooling-cycle device, realizes heat interchange by projection objective camera lens chilled water.
8. prealignment measurement mechanism according to claim 1, is characterized in that, described prealignment measurement mechanism is positioned at below litho machine main substrate, projection lens of lithography machine side, and above described worktable, described housing is connected with described litho machine main substrate.
9. according to the arbitrary described prealignment measurement mechanism of claim 1 to 8, it is characterized in that, described housing is made up of upper interface board, lower interface plate and web member, described prealignment measurement mechanism is connected with described litho machine main substrate by described upper interface board, described lower interface plate is in order to carry described three groups of vision ray machines, and web member is in order to connect described upper interface board and described lower interface plate.
10. prealignment measurement mechanism according to claim 9, it is characterized in that, also comprise three blocks of ray machine adjustment plates, vision ray machine described in each is connected with lower interface plate respectively by ray machine adjustment plate described in, and described ray machine adjustment plate carries out 6DOF adjustment to described vision ray machine.
11. prealignment measurement mechanisms according to claim 9, is characterized in that, the described web member between described upper interface board and described lower interface plate, are three groups of difference adjusters, in order to adjust described prealignment measurement mechanism integral level degree.
12. prealignment measurement mechanisms according to claim 9, is characterized in that, described upper interface board interface is provided with RZ to adjusting mechanism.
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| US5648854A (en) * | 1995-04-19 | 1997-07-15 | Nikon Corporation | Alignment system with large area search for wafer edge and global marks |
| JPH09252043A (en) * | 1996-03-14 | 1997-09-22 | Nikon Corp | Positioning method |
| JP2002184665A (en) * | 2000-12-13 | 2002-06-28 | Nikon Corp | Device and method for alignment, and aligner |
| CN101300662A (en) * | 2005-12-28 | 2008-11-05 | 株式会社尼康 | Pattern forming method, pattern forming apparatus, and device manufacturing method |
| CN102012640A (en) * | 2009-09-04 | 2011-04-13 | 上海微电子装备有限公司 | Pre-alignment method and device for being compatible with broken silicon wafers |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385838A (en) * | 1980-01-19 | 1983-05-31 | Nippon Kogaku K. K. | Alignment device |
| JPS59158522A (en) * | 1983-02-28 | 1984-09-08 | Canon Inc | Position detecting mechanism for semiconductor printing device |
| US5648854A (en) * | 1995-04-19 | 1997-07-15 | Nikon Corporation | Alignment system with large area search for wafer edge and global marks |
| JPH09252043A (en) * | 1996-03-14 | 1997-09-22 | Nikon Corp | Positioning method |
| JP2002184665A (en) * | 2000-12-13 | 2002-06-28 | Nikon Corp | Device and method for alignment, and aligner |
| CN101300662A (en) * | 2005-12-28 | 2008-11-05 | 株式会社尼康 | Pattern forming method, pattern forming apparatus, and device manufacturing method |
| CN102012640A (en) * | 2009-09-04 | 2011-04-13 | 上海微电子装备有限公司 | Pre-alignment method and device for being compatible with broken silicon wafers |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee after: Shanghai Micro Electronics Equipment Co., Ltd. Patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. Patentee before: Shanghai Nanpre Mechanics Technology Co., Ltd. |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |