CN205069607U - Accuracy snatchs device of wafer - Google Patents
Accuracy snatchs device of wafer Download PDFInfo
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- CN205069607U CN205069607U CN201520861749.5U CN201520861749U CN205069607U CN 205069607 U CN205069607 U CN 205069607U CN 201520861749 U CN201520861749 U CN 201520861749U CN 205069607 U CN205069607 U CN 205069607U
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Abstract
The utility model relates to a semiconductor device manufacture field especially relates to an accuracy snatchs device of wafer. An accuracy snatchs device of wafer of this application design, mainly wait that it holds up the rotation to extract the wafer through the manipulator in with the wafer box, listen this offset deviation of waiting to extract center with the manipulator center of wafer with the high accuracy through mode laser sensors system that utilizes laser through mode sensor to constitute at this in -process, later wait to extract the wafer and carry out the offset deviation compensation foretell according to the offset deviation acquireed, and then make and to place treating in the wafer box and extract the center of wafer and align with the central of manipulator, the manipulator can quick accurate extraction go out the wafer, and the accuracy is raised, and production efficiency has been improved.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of device of accurate grasping silicon wafer.
Background technology
Along with the development of photoetching technique, requirements at the higher level are proposed to the precision of wafer alignment and exposure system.For shortening the time of the random search mark position of accurately aiming at and improving crystal round utilization ratio, the wafer transfer stage before accurately aiming at must increase prealignment operation, wafer is accurately aimed at by guarantee in the short period of time.
The prealignment of wafer current develops into optics prealignment from initial mechanical prealignment, and precision also brings up to 1 micron of even sub-micron from 200 microns, and requires very high productivity ratio.Therefore very high request is proposed to the detection of prealignment device, manufacture and installation accuracy.In mask aligner, the Main Function of wafer prealignment device is, before leveling, photo-mask process, prealignment (fine alignment is in leveling and pre-focusing subsystem) is carried out to wafer, reduces wafer as far as possible from wafer cassette, taken out the position repeatability error being put into fine alignment station again by manipulator.Wafer prealigning needs the deviation of adjustment to mainly contain the skew (may be defined as the degree of freedom in X, Y both direction) that two: is the centre of form in horizontal plane, and two is angular errors of wafer groove (breach).
The prealignment localization method of current employing all adopts linear CCD sensor to detect crystal round fringes, and this sensor sample frequency is less, thus limit the wafer sampling number of a week, and its space hold is larger, when whole prealignment device bulk limits, the bulk of ccd sensor often cannot meet the demands.
Utility model content
For above-mentioned Problems existing, the utility model discloses a kind of device of accurate grasping silicon wafer, its concrete technical scheme is:
A device for accurate grasping silicon wafer, is characterized in that, be applied to and extract wafer from wafer cassette, described device comprises:
Manipulator, is provided with rotating driving device, for holding up and driving the wafer to be extracted in described wafer cassette to rotate;
Wafer position sensor, closes on described rotating driving device and is arranged on described manipulator, for the displacement difference of wafer to be extracted in the described wafer cassette of detecting;
Vacuum absorption device, is arranged on described manipulator, for moving to predetermined position according to the described wafer to be extracted of described displacement difference absorption, aligns with the center of described manipulator to make the center of described wafer to be extracted;
Mechanical arm, extracts the wafer Centered to be extracted with described manipulator from described wafer cassette.
Above-mentioned device, is characterized in that, described vacuum absorption device is vacuum cup.
Above-mentioned device, is characterized in that, the material of described manipulator is Teflon.
Above-mentioned device, is characterized in that, described wafer position sensor comprises laser light formula transducer.
Above-mentioned device, is characterized in that, described manipulator holds up and the angle driving the wafer to be extracted in described wafer cassette to rotate is 0-360 °.
Above-mentioned device, is characterized in that, the quantity of described wafer position sensor is 3, and each described wafer position sensor is all positioned at and puts circumferentially centered by described vacuum absorption device.
Technique scheme tool has the following advantages or beneficial effect:
The device of a kind of accurate grasping silicon wafer of the application's design, adopt a kind of high accuracy permeability laser sensing system formed primarily of laser light formula transducer, it can be embedded on whole mechanical arm, do not take real space size, rotate freely wafer to be extracted under some circumstances, crystal round fringes to be extracted one week sampling number can be increased like this, improve accuracy.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, the utility model and feature, profile and advantage will become more apparent.Mark identical in whole accompanying drawing indicates identical part.Proportionally can not draw accompanying drawing, focus on purport of the present utility model is shown.
Fig. 1 a-1c is wafer location schematic diagram in the utility model;
The schematic diagram of the accurate grasping silicon wafer device of Fig. 2 the utility model.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the utility model is further described, but not as restriction of the present utility model.
Mechanical arm mainly vacuum suction and the gripping of wafer is picked and placeed in current semicon industry, they can only obtain wafer by fast fetching, then need by being put into the position of otch instrument being located wafer, and ensure that wafer is fixing relative to the position of mechanical arm, thus ensure in follow-up transport process, accurately can locate the position that wafer is placed.
Conventional semiconductor mechanical arm completes and single picks and places action, and position needs accurately location, and calibration procedures is very complicated and when there will be delivering position skew, gets the situation causing less than wafer shutting down; In addition in the type adopting clamping gripping wafer, may occur forming damage because clamping causes the particle of crystal round fringes to get wafer frontside.
As shown in Fig. 1 a, 1b, 1c and Fig. 2, the device of a kind of accurate grasping silicon wafer of the utility model design, this device includes the manipulator 1 made by Teflon material, this manipulator 1 is used for grasping silicon wafer, this manipulator is also provided with vacuum absorption device 3, and centered by this vacuum absorption device 3 initial point be circumferentially provided with some wafer position sensors 2, these wafer position sensors 2 are arranged on manipulator 1.Wafer Centered to be extracted with manipulator extracts by the mechanical arm be connected with manipulator from wafer cassette.
Wafer is transferred to wafer prealignment device by the manipulator in order to wafer transfer, wafer position sensor is by detecting the rate of change of receiving light power, judge whether wafer has been placed on vacuum absorption device, when detecting that wafer is placed, vacuum absorption device drives wafer to rotate, the angle of concrete rotation is determined on a case-by-case basis, preferably 0-360 °, laser light formula transducer in wafer position sensor detects the marginal position of wafer, crystal round fringes one weekly data that data acquisition unit synchronous acquisition laser light formula transducer obtains.
The motion control unit of manipulator utilizes the data obtained from wafer position sensor; Mathematical Modeling is detected by the wafer centre of form of structure; calculate the centre of form coordinate of wafer reality, radius, maximum transversal offset △ x; maximum radial offset △ y; the displacement difference of wafer to be extracted in such formation wafer cassette; vacuum absorption device moves to predetermined position according to displacement difference wafer to be extracted of blessing; this predeterminated position is adjustable, its objective is the position in order to protect wafer to place wafer under maximum space.
Motion control unit sends instruction makes manipulator complete laterally and radial side-play amount, and then completes the center locating of wafer, is alignd with the center of manipulator in the center of wafer to be extracted;
Then manipulator completes and finds absorption accurately to wafer.After being drawn to wafer, robot movement control unit resets, and resets to the position before finding accurately by whole manipulator, and then mechanical arm driving mechanical hand exits the wafer cassette of placing wafer, draws out accurately by needing the wafer captured.
In the utility model, the vacuum absorption device that manipulator is installed is vacuum cup, and also installs a rotating driving device and be connected with this vacuum cup, and this vacuum cup can be driven like this to rotate.And wafer position sensor is laser light formula transducer, the quantity of crystal round fringes chip is calculated in the process that these laser light formula transducers rotate at wafer, the side-play amount in the precalculated position of crystal round fringes and grabbing device can be drawn like this in follow-up calculating, then calculate the side-play amount of whole manipulator needs according to this side-play amount, can accurately find wafer accurately and capture like this.
In the utility model, the quantity of wafer position sensor is 3, like this when the vacuum cup on manipulator is according to when turning clockwise, the wafer position sensor in the lower left corner senses that luminous intensity changes, the angle rotated can be remembered, then calculate, draw the side-play amount of manipulator and accurately find absorption wafer accurately and take out.
In sum, the device of a kind of accurate grasping silicon wafer of the application's design, adopt a kind of high accuracy permeability laser sensing system formed primarily of laser light formula transducer, it can be embedded in the framework of whole manipulator, do not take real space size, crystal round fringes one week sampling number can be increased under some circumstances, improve accuracy, and adopt a kind of Novel wafer based on shape center algorithm and to shifting method, improve positioning precision.And simplify relative to action in the technology of existing gripping wafer, what improve wafer takes out sheet speed, and productivity ratio is improved.
Above preferred embodiment of the present utility model is described.It is to be appreciated that the utility model is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Any those of ordinary skill in the art, do not departing under technical solutions of the utility model ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solutions of the utility model, or being revised as the Equivalent embodiments of equivalent variations, this does not affect flesh and blood of the present utility model.Therefore, every content not departing from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solutions of the utility model protection.
Claims (6)
1. a device for accurate grasping silicon wafer, is characterized in that, be applied to and extract wafer from wafer cassette, described device comprises:
Manipulator, is provided with rotating driving device, for holding up and driving the wafer to be extracted in described wafer cassette to rotate;
Wafer position sensor, closes on described rotating driving device and is arranged on described manipulator, for the displacement difference of wafer to be extracted in the described wafer cassette of detecting;
Vacuum absorption device, is arranged on described manipulator, for moving to predetermined position according to the described wafer to be extracted of described displacement difference absorption, aligns with the center of described manipulator to make the center of described wafer to be extracted;
Mechanical arm, extracts the wafer Centered to be extracted with described manipulator from described wafer cassette.
2. device according to claim 1, is characterized in that, described vacuum absorption device is vacuum cup.
3. device according to claim 1, is characterized in that, the material of described manipulator is Teflon.
4. device according to claim 1, is characterized in that, described wafer position sensor comprises laser light formula transducer.
5. device according to claim 1, is characterized in that, described manipulator holds up and the angle driving the wafer to be extracted in described wafer cassette to rotate is 0-360 °.
6. device according to claim 1, is characterized in that, the quantity of described wafer position sensor is 3, and each described wafer position sensor is all positioned at and puts circumferentially centered by described vacuum absorption device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520861749.5U CN205069607U (en) | 2015-10-30 | 2015-10-30 | Accuracy snatchs device of wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520861749.5U CN205069607U (en) | 2015-10-30 | 2015-10-30 | Accuracy snatchs device of wafer |
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| Publication Number | Publication Date |
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| CN205069607U true CN205069607U (en) | 2016-03-02 |
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| CN201520861749.5U Active CN205069607U (en) | 2015-10-30 | 2015-10-30 | Accuracy snatchs device of wafer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490164A (en) * | 2020-11-26 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Vacuum manipulator |
| CN116344434A (en) * | 2023-05-11 | 2023-06-27 | 广东鸿浩半导体设备有限公司 | Rapid dust removal and transfer method after laser de-bonding and sheet taking manipulator |
| WO2024066425A1 (en) * | 2022-09-30 | 2024-04-04 | 上海微电子装备（集团）股份有限公司 | Wafer conveying system, wafer conveying method, and defect detection device |
-
2015
- 2015-10-30 CN CN201520861749.5U patent/CN205069607U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490164A (en) * | 2020-11-26 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Vacuum manipulator |
| WO2024066425A1 (en) * | 2022-09-30 | 2024-04-04 | 上海微电子装备（集团）股份有限公司 | Wafer conveying system, wafer conveying method, and defect detection device |
| CN116344434A (en) * | 2023-05-11 | 2023-06-27 | 广东鸿浩半导体设备有限公司 | Rapid dust removal and transfer method after laser de-bonding and sheet taking manipulator |
| CN116344434B (en) * | 2023-05-11 | 2023-08-25 | 广东鸿浩半导体设备有限公司 | Rapid dust removal and transfer method after laser de-bonding and sheet taking manipulator |
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