CN104916560B - Chip detection system, reaction chamber and chip detection method - Google Patents
Chip detection system, reaction chamber and chip detection method Download PDFInfo
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- CN104916560B CN104916560B CN201410088774.4A CN201410088774A CN104916560B CN 104916560 B CN104916560 B CN 104916560B CN 201410088774 A CN201410088774 A CN 201410088774A CN 104916560 B CN104916560 B CN 104916560B
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Abstract
The present invention, which provides a kind of chip detection system, reaction chamber and chip detection method, this method, to be included：S1, range sensor are moved horizontally from directly over film trap, and signal is sent to pallet during its movement；S2, control unit receives the reflected signal that from pallet or chip reflects in film trap, and judges whether reflective distance is equal to gauged distance according to the reflected signal that chip reflects, if being equal to, into S3；If being not equal to, into S5；S3, control unit driving range sensor movement preset length, and judge whether current reflective distance is equal with gauged distance during movement, if being equal to, into S4；If being not equal to, into S5；It is accurate to determine that the chip in film trap is placed by S4；S5 determines that the chip in film trap is not placed accurately.The present invention provides chip detection method, the uniformity of technique and the accuracy of chip and manipulator positioning can be improved, so as to improve the efficiency that manipulator picks and places piece.
Description
Technical field
The invention belongs to semiconductor equipment processing technique fields, and in particular to a kind of chip detection system, reaction chamber and
Chip detection method.
Background technology
In the manufacturing process of semiconductor devices, to improve the efficiency of transferring wafer and reducing cost of labor, generally use
Robotic transfer chip still, manipulator and chip is often required that during using manipulator loading or unloading wafer
Accurate positioning, to ensure the accuracy of robotic transfer chip.
For this purpose, disclose a kind of wafer orientation method in the patent document of Application No. 02826636.6, it is used to implement pair
Chip is positioned.Specifically, by the movement of chip seat and rotation of chip seat driving device driving bearing wafer, straight line sensing
Device detection obtains chip neighboring on chip seat, and computing device drives the rotation of chip seat rotation according to the chip seat driving device
Gyration and rectilinear transducer detection chip seat on chip neighboring testing result calculate current wafer center and
Cut out portion direction, and calculate brilliant when the center of chip is located at given position and cut out portion direction in assigned direction
The rotary shaft position and rotation angle of tablet seat by the movement of chip seat driving device driving chip seat, rotation and stop, to realize
It is accurate so as to fulfill manipulator and wafer orientation to wafer orientation.
Above-mentioned wafer orientation method is under the premise of the chip carried on chip seat is placed accurately, to be driven by chip seat
Device driving chip seat is mobile so that the position of chip relative mechanical hand is accurate, is positioned so as to fulfill to chip.But
In practical application, since manipulator shifts on horizontal or vertical direction, it can cause manipulator cannot be accurate in film releasing
Ground places the wafer at film trap（That is, the chip seat in the above method）In, therefore, in this case, even if using above-mentioned crystalline substance
Sheet positioning method can not realize the accurate positionin of chip and manipulator, thus in subsequent technique the technique of chip can be caused equal
Even property is poor, so as to cause processing quality poor；Moreover, influencing manipulator subsequently takes piece, so as to influence the efficiency of transferring wafer, and
It repeatedly attempts to take piece, the surface of chip can be caused to damage.
The content of the invention
Present invention seek to address that technical problem in the prior art, provides a kind of chip detection system, reaction chamber
Room and chip detection method can not only improve the uniformity of technique, and can improve chip positioned with manipulator it is accurate
Property, so as to improve the efficiency that manipulator picks and places piece, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing piece
Wafer surface is caused to damage.
The present invention provides a kind of chip detection system, including pallet, is provided with to carry on the upper surface of the pallet
The film trap of the chip, and the reflectivity of the pallet is different from the reflectivity of the chip, the system also includes：Distance passes
Sensor and control unit, wherein：The range sensor is arranged on the surface of the film trap, and can be in the film trap just
Upper horizontal moves；The range sensor corresponds to the piece groove location to be detected and is sent in moving process to the pallet
Signal, and the reflected signal of the chip reflection from the pallet or in the film trap is received, and by the reflected signal
It is sent to described control unit；Described control unit judges whether reflective distance is equal to according to the reflected signal that the chip reflects
Gauged distance, if being not equal to, it is determined that the chip in the film trap is not placed accurately；If being equal to, the distance is driven
Sensor moves preset length, and judges whether current reflective distance is equal with the gauged distance during movement, if
It is equal to, it is determined that it is accurate that the chip in the film trap is placed；If being not equal to, determine that the chip in the film trap is not put
It is accurate to put；The gauged distance is defined as the chip and is accurately placed at the range sensor and the chip during film trap
Vertical range between upper surface.
Wherein, the preset length is the motion track that moves of radial level in the range sensor along the film trap
On from the boundary position of the chip to the length of next boundary position.
Preferably, the preset length is the diameter length of the chip.
Wherein, the chip detection system, further includes rotating driving device, and the rotating driving device is described for driving
Pallet is along its axial-rotation, so that each film trap is sequentially located at the underface of the range sensor.
Wherein, the quantity of the range sensor and position are corresponded with the quantity of the film trap and position is set.
Preferably, radial direction of the range sensor from the surface of any position at the edge of the film trap along the film trap
It moves horizontally.
The present invention also provides a kind of reaction chambers, and including chip detection system, the chip detection system is using the present invention
Whether the above-mentioned chip detection system provided is placed accurately for detecting the chip in the film trap for carrying the chip.
Wherein, the range sensor is mounted on the guide rail above the upper cover of the reaction chamber.
The present invention also provides a kind of chip detection methods, the described method comprises the following steps：Step S1, range sensor is certainly
It is moved horizontally directly over the film trap, signal is sent to the pallet during its movement；Step S2, control unit connect
Receive the reflected signal from the pallet or positioned at the reflection of chip described in the film trap, and the reflection reflected according to the chip
Signal judges whether reflective distance is equal to gauged distance, if being equal to, enters step S3；If being not equal to, S5 is entered step；Step
Rapid S3, described control unit drives the range sensor movement preset length, and current reflective is judged during movement
Whether distance is equal with gauged distance, if being equal to, enters step S4；If being not equal to, S5 is entered step；Step S4 determines institute
The chip stated in film trap is placed accurately；Step S5 determines that the chip in the film trap is not placed accurately.
Wherein, further included before the step S1：Step S0 drives the pallet to rotate, so as to need the institute detected
State the underface that film trap is located at the range sensor.
The present invention has following advantageous effects：
Chip detection system provided by the invention is moved horizontally by range sensor along directly over film trap, at it
Signal is sent to pallet and receive the reflected signal of the chip reflection from pallet or in film trap, control in mobile process
Unit judges whether reflective distance is equal to gauged distance according to the reflected signal that chip reflects, if being not equal to, it is determined that in film trap
Chip do not place accurately；If being equal to, range sensor is driven to move preset length, and judgement is current anti-in moving process
It is whether equal with gauged distance to penetrate distance, if being equal to, it is determined that it is accurate that the chip in film trap is placed；If being not equal to, film trap is determined
In chip do not place accurately.From the foregoing, it will be observed that it can realize after manipulator places the wafer at film trap to the crystalline substance in film trap
Whether piece, which is placed, is accurately detected, and lower step work is carried out if placing accurately, if placing inaccuracy, wafer position is carried out
Adjustment is until chip is placed accurately, thus can not only improve the uniformity of technique, but also can be improved chip and be determined with manipulator
The accuracy of position so as to improve the efficiency that manipulator picks and places piece, and then can improve the efficiency of transferring wafer and avoid more
The secondary piece that picks and places causes to damage to wafer surface.
Reaction chamber provided by the invention uses chip detection system provided by the invention, can not only improve technique
Uniformity, and the accuracy of chip and manipulator positioning can be improved, so as to improve the efficiency that manipulator picks and places piece,
And then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing piece, wafer surface is caused to damage.
Chip detection method provided by the invention is moved by range sensor along the radial level of the film trap, at it
Signal is sent to pallet in mobile process, the reflection letter that control unit is received from pallet or chip reflects in film trap
Number, and judge whether reflective distance is equal to gauged distance according to the reflected signal that chip reflects, if being not equal to, it is determined that in film trap
Chip do not place accurately；If being equal to, control unit driving range sensor movement preset length, and sentence during movement
Whether disconnected current reflective distance is equal with gauged distance, if being equal to, it is determined that it is accurate that the chip in film trap is placed；If being not equal to,
Then determine that the chip in film trap is not placed accurately.From the foregoing, it will be observed that can realize it is right after manipulator places the wafer at film trap
Whether the chip in film trap, which is placed, is accurately detected, and lower step work is carried out if placing accurately, if inaccuracy is placed, to crystalline substance
Piece position is adjusted until chip is placed accurately, thus can not only improve the uniformity of technique, but also can improve chip
With the accuracy of manipulator positioning, so as to improve the efficiency that manipulator picks and places piece, and then the effect of transferring wafer can be improved
It rate and avoids repeatedly picking and placeing piece wafer surface is caused to damage.
Description of the drawings
Fig. 1 is the structure diagram of chip detection system provided in an embodiment of the present invention；
Fig. 2 is that the chip in film trap places accurate structure diagram；
Fig. 3 is that the chip in film trap does not place accurate structure diagram；
Fig. 4 be when in film trap chip place it is accurate when using chip detection system provided in an embodiment of the present invention structure
Schematic diagram；
Fig. 5 is the top view of structure shown in Fig. 4；
Fig. 6 is using the of chip detection system provided in an embodiment of the present invention when the chip in film trap does not place accurate
A kind of structure diagram；
Fig. 7 is the top view of the structure shown in Fig. 6；
Fig. 8 is using the of chip detection system provided in an embodiment of the present invention when the chip in film trap does not place accurate
Two kinds of structure diagrams；
Fig. 9 is the top view of structure shown in Fig. 8；
Figure 10 is using chip detection system provided in an embodiment of the present invention when the chip in film trap does not place accurate
The third structure diagram；
Figure 11 is the top view of structure shown in Fig. 10；
Figure 12 is the structure diagram of reaction chamber provided in an embodiment of the present invention；And
Figure 13 is the work flow diagram of chip detection method provided in an embodiment of the present invention.
Specific embodiment
For those skilled in the art is made to more fully understand technical scheme, the present invention is carried below in conjunction with the accompanying drawings
Chip detection system, reaction chamber and the chip detection method of confession are described in detail.
Fig. 1 is the structure diagram of chip detection system provided in an embodiment of the present invention.Referring to Fig. 1, the present invention is implemented
The chip detection system that example provides, including range sensor 23 and control unit 24.It is set on the upper surface of pallet 20 useful
In the film trap 21 of bearing wafer 10, wherein, the diameter dimension of film trap 21 is slightly larger than the diameter dimension of chip 10, the reflection of pallet 20
Rate is different from the reflectivity of chip 10；Range sensor 23 is arranged on the surface of film trap 21, and can film trap 21 just on
Side moves horizontally, and sends signal to pallet during its movement, and receives the chip from pallet or in film trap 21
The reflected signals of 10 reflections, and send it to control unit 24, due to pallet 20 reflectivity and chip 10 reflectivity not
Together, this so that range sensor 23 is different with the reflected signal that is reflected on chip 10 in pallet to the signal that pallet is sent, therefore,
Control unit 24 can judge that range sensor 23 is located at the surface of pallet 20 or chip 10 according to the difference of reflected signal.
In addition, range sensor 23 includes laser displacement sensor.
Control unit 24 judges whether reflective distance is equal to gauged distance H according to the reflected signal that chip reflects, if differing
In, it is determined that the chip 10 in film trap 21 is not placed accurately；If being equal to, range sensor 23 is driven to move preset length,
It judges whether reflective distance is equal with gauged distance H during moving, if being equal to, it is determined that the chip 10 in film trap 21 is put
It is accurate to put, and lower step work can be directly carried out, for example, carrying out technical process or taking piece process；If it is not equal to, it is determined that film trap 21
In chip 10 do not place accurate, it is necessary to be adjusted until place accurate, carry out lower step work again afterwards.Wherein, normal pitch
Vertical range when chip 10 is accurately placed at film trap 21 between 10 upper surface of range sensor 23 and chip is defined as from H；Instead
It is the range sensor and the vertical range of 10 upper surface of chip that the reflected signal reflected according to chip obtains to penetrate distance.
In the present embodiment, chip 10 is placed in film trap 21 accurately refers to that the lower surface of chip 10 is stacked in film trap completely
On 21 bottom surface, as shown in Figure 2；Chip 10 is not placed in film trap 21 accurately refers to that the lower surface of chip 10 is not stacked in completely
On the bottom surface of film trap 21, for example, as shown in Figure 3.
In this embodiment, it is preferred that range sensor 23 is from the surface edge of any position at the edge of film trap 21 22
The radial level movement of the film trap 21（Such as mobile route S in Fig. 1）, due to radial water translation of the range sensor 23 along film trap 21
It is dynamic, in such a case, it is possible to accurately detect center of projection of 10 lower surface of chip on 21 bottom surface of film trap by film trap 21
The a variety of of point do not place accurate situation, so as to improve the reliability of the chip detection system.Specifically, control unit 24
During being moved from left to right along mobile route S, judge whether range sensor 23 reaches the side of chip 10 according to reflected signal
The surface of boundary position 101 if reaching, carries out judging whether chip is placed accurately；If not reaching, continue to be believed according to reflection
Number judge range sensor 23 whether up to chip 10 boundary position 101 surface.In practical applications, range sensor 23
It can also be moved horizontally in any position directly over film trap 21 along any direction, as long as realizing that range sensor 23 can reach
Directly over chip 10.
It is readily appreciated that, preset length is specifically set according to actual conditions, as long as meeting when chip 10 does not place accurate time control
Unit 24 processed can go out that it is equal with gauged distance H according to the current reflective Distance Judgment detected in the preset length,
And control unit 24 can be sentenced according to the current reflective distance detected in the preset length when chip 10 places accurate
Breaking, it is equal with gauged distance H it.
In the present embodiment, the preset length is preset to be moved in range sensor 23 along what 21 radial level of film trap moved
From the boundary position 101 of chip 10 to the length of next boundary position 102 on the S of track.In this case, in Distance-sensing
The process that device 23 moves sends reflected signal to control unit 24；Control unit 24 judges whether to reach brilliant according to the reflected signal
The surface of next boundary position 102 of piece, if reaching, range sensor 23 stops movement；If not reaching, distance passes
Sensor 23 continues to move to.It is readily appreciated that, when chip 10 places the accurate and center of chip 10 and the center of film trap 21
During coincidence, preset length is maximum and is the diameter length of chip 10；When chip 10 does not place accurate, range sensor 23
Mobile preset length is less than the diameter length of chip 10, and therefore, in practical applications, preset length can also be preset as chip
10 diameter length（That is, the maximum of preset length）, thus can not only meet the needs of a variety of actual conditions, but also be not required to
Control unit 24 is wanted to judge whether to reach next boundary position 102 of chip 10, so as to simplify the course of work.
It is specifically described with reference to Fig. 4 and Fig. 5 and applies the embodiment of the present invention when the chip 10 in film trap 21 places accurate
The course of work of 10 detecting system of chip of offer：Specifically, the signal that range sensor 23 is sent to pallet 20 is defined holding in the palm
The reflected signal reflected on disk 20 is the first reflected signal, defines signal that range sensor 23 is sent to pallet 20 in chip 10
The reflected signal of upper reflection is the second reflected signal, and the first reflected signal and the second reflected signal can be respectively specifically high level
One in " 1 " and low level " 0 ", comprise the following steps：
Step S100, range sensor 23 is moved from position A along the radial level of the film trap 21, during its movement
Signal is sent to pallet 20, and receives the first reflected signal reflected from pallet 20, alternatively, the chip 10 in film trap 21
Second reflected signal of reflection, and the first reflected signal or the second reflected signal are sent to control unit 24, specifically, away from
The first reflected signal of the reflection of pallet 20 is received from position A to position B from sensor 23；Crystalline substance is received from position B to position D
The second reflected signal that piece 10 reflects；
Step S101, during range sensor 23 is from position A to position B, control unit 24 receives Distance-sensing
The first reflected signal that device 23 is sent, it is not identical with the second reflected signal that chip 10 reflects according to first reflected signal, sentence
Disconnected range sensor 23 does not reach the surface of the boundary position 101 of chip 10；When range sensor 23 is moved to position B, control
Unit 24 processed receives the second reflected signal that range sensor 23 is sent, the reflected according to second reflected signal and chip 10
Two reflected signals are identical, judge that range sensor 23 reaches the surface of the boundary position 101 of chip 10, enter step S102；
Step S102, range sensor 23 continue to move up to position D from position B to position C, and in the process of its movement
In detect its vertical range h between 10 upper surface of chip in real time（That is, reflective distance）, and vertical range h is sent to
Control unit 24, and continue during range sensor 23 continues to move to the transmission reflected signal of control unit 24；
Step S103, control unit 24 are equal to the first reflected signal according to the reflected signal, determine to reach under chip 10
The surface of one boundary position 102, range sensor 23 stop movement.
In step s 102, control unit 24 judges current reflective distance always during range sensor 23 moves
Equal to gauged distance H, specifically, the vertical range h at position B, position C and position D is equal to gauged distance H, therefore, then
Determine that the chip 10 in film trap 21 is placed accurately.
Specifically described with reference to Fig. 6 and Fig. 7 applies the present invention to implement when the chip 10 in film trap 21 does not place accurate
The course of work for 10 detecting system of chip that example provides：Specifically, the signal that range sensor 23 is sent to pallet 20 is defined to exist
The reflected signal reflected on pallet 20 is the first reflected signal, defines signal that range sensor 23 is sent to pallet 20 in chip
The reflected signal reflected on 10 is the second reflected signal, and the first reflected signal and the second reflected signal can be respectively specifically high electricity
One in flat " 1 " and low level " 0 ", comprise the following steps：
Step S200, range sensor 23 is moved from position A along the radial level of the film trap 21, during its movement
Signal is sent to pallet 20, and receives the first reflected signal reflected from pallet 20, alternatively, anti-positioned at chip 10 in film trap 21
The second reflected signal penetrated, and the first reflected signal or the second reflected signal are sent to control unit 24, specifically, distance
Sensor 23 receives the first reflected signal of pallet reflection from position A to position B；Chip 10 is received from position B to position D
Second reflected signal of reflection；
Step S201, during range sensor 23 is from position A to position B, control unit 24 receives Distance-sensing
The first reflected signal that device 23 is sent, it is not identical with the second reflected signal that chip 10 reflects according to first reflected signal, sentence
Disconnected range sensor 23 does not reach the surface of the boundary position 101 of chip 10；When range sensor 23 is moved to position B, control
Unit 24 processed receives the second reflected signal that range sensor 23 is sent, the reflected according to second reflected signal and chip 10
Two reflected signals are identical, judge that range sensor 23 reaches the surface of the boundary position 101 of chip 10, enter step S202；
Step S202, range sensor 23 continue to move up to position D from position B to position C, and in the process of its movement
In detect its vertical range between 10 upper surface of chip in real time（That is, reflective distance）, and vertical range h is sent to control
Unit 24 processed, and continue during range sensor 23 continues to move to the transmission reflected signal of control unit 24；
Step S203, control unit 24 are equal to the first reflected signal according to the reflected signal, determine to reach under chip 10
The surface of one boundary position 102, range sensor 23 stop movement.
In step S202, control unit 23 judges current reflective distance always during range sensor 23 moves
Less than gauged distance H, specifically, judge that vertical range h1 is equal to gauged distance H at the B of position, the C of position at judgement vertically away from
It is less than gauged distance H from h2, judges that vertical range h3 is less than gauged distance H at the D of position, therefore, it is determined that in film trap 21
Chip 10 is not placed accurately.
In above-mentioned steps S100~S103 and step S200~S203, preset length is along film trap in range sensor 23
From the boundary position 101 of chip 10 to the length of next boundary position 102 on the motion track of 21 radial levels movement.But
It is, in practical applications, preset length or other length, for example, preset length is the one of the diameter length of chip 10
Half, in this case, due to being equal to the half of diameter length between position B and position C along the length of film trap 21 radially, because
This, in step S102 and step S202, range sensor 23 continues to be moved to position C from position B, also, accordingly, in step
In rapid S103, the vertical range that any position of position B and position C are detected on the mobile route of range sensor 23 is equal to
Gauged distance H, control unit 24 judge that current reflective distance is equal to gauged distance H, it is determined that the chip 10 in film trap 21 is placed
Accurately；In step S203, for example, when the vertical range h detected at the C of position is less than gauged distance H, control unit 24 judges
Reflective distance is not equal to gauged distance H, it is determined that the chip 10 in film trap 21 is not placed accurately.
In this embodiment, it is preferred that control unit 24 is used to judge whether current reflective distance is equal to gauged distance H,
If it is equal to, it is determined that the chip 10 in film trap 21 is placed accurately；If being not equal to, judge between reflective distance and gauged distance H
Whether deviation is in secure threshold, if in secure threshold, it is determined that the chip 10 in film trap 21 is placed accurately；If not in safety
In threshold value, it is determined that the chip 10 in film trap 21 is not placed accurately.So-called secure threshold is the current reflective of maximum allowable detection
Error distance between distance and gauged distance H；Also, the factors phases such as secure threshold and the measurement error of range sensor 23
It closes, this can be avoided causing chip in detection film trap 21 due to factors such as the measurement errors of range sensor 23 to a certain extent
Whether 10 place accurate testing result mistake, so as to improve the practicability and reliability of 10 detecting system of chip.
In the present embodiment, multiple film traps 21 have been provided at circumferentially spaced along it on the upper surface of pallet 20, in this feelings
Under condition, range sensor 23 is arranged on the surface of one of film trap 21 of multiple film traps 21, and chip detection system further includes
Rotating driving device, rotating driving device is for driving pallet along its axial-rotation, so that each film trap 21 is sequentially located at distance
The underface of sensor 23, in other words, can make range sensor 23 respectively be located at each film trap 21 surface, thus by
The range sensor 23 that rotating driving device and a corresponding film trap 21 are set, can realize the chip detected in multiple film traps 21
10 whether place it is accurate, this and set range sensor 23 quantity and position and the quantity of multiple film traps 21 and position one it is a pair of
It should compare, the setting quantity of range sensor 23 can be reduced, so as to reduce production cost.
It but in practical applications, can also the quantity of range sensor 23 and the quantity and position of position and film trap 21
It corresponds and sets, correspond and set by range sensor 23 and multiple film traps 21, can realize while detect multiple
Whether the chip 10 in slot 21 is placed accurately, so as to improve detection efficiency.
It should be noted that in practical applications, range sensor 23 can be from any position edge at the edge of film trap 21 22
The radial level movement of film trap 21, for example, shown in Fig. 8 and Fig. 9, for another example, and shown in Figure 10 and Figure 11, specific work process and above-mentioned
The course of work is similar, and details are not described herein.
In conclusion chip detection system provided in this embodiment, by range sensor 23 along film trap 21 just on
Side moves horizontally, and sends signal to pallet during its movement and receives the chip 10 from pallet or in film trap 21
The reflected signal of reflection, control unit 24 judge whether reflective distance is equal to gauged distance H according to the reflected signal that chip reflects,
If it is not equal to, it is determined that the chip 10 in film trap 21 is not placed accurately；If being equal to, the default length of the movement of range sensor 23 is driven
Degree, and judge whether current reflective distance is equal with gauged distance H in moving process, if being equal to, it is determined that in film trap 21
Chip 10 is placed accurately；If being not equal to, determine that the chip 10 in film trap 21 is not placed accurately.From the foregoing, it will be observed that it can realize in machine
Chip 10 is placed on after film trap 21 and is accurately detected to whether the chip 10 in film trap 21 is placed by tool hand, if placing accurately
Lower step work is then carried out, if placing inaccuracy, 10 position of chip is adjusted until chip 10 is placed accurately, thus not only
The uniformity of technique can be improved, and chip 10 and the accuracy of manipulator positioning can be improved, so as to improve machinery
Hand picks and places the efficiency of piece, and then can improve the efficiency of transferring wafer 10 and avoid repeatedly picking and placeing piece and 10 surface of chip is caused to damage
Wound.
Figure 12 is the structure diagram of reaction chamber provided in an embodiment of the present invention.2 are please referred to Fig.1, the embodiment of the present invention
The reaction chamber 30 of offer includes pallet and chip detection system.Wherein, pallet 20 is arranged in reaction chamber 30, and in pallet
Upper surface on be provided with film trap for bearing wafer；Chip detection system uses the wafer inspection system that above-described embodiment provides
System, for detecting whether the chip in film trap is placed accurately.Specifically, the range sensor 23 of chip detection system is arranged on instead
The outside of chamber 30 is answered, and on roof, is provided on the roof of reaction chamber 30 along the mobile route of range sensor
Guide rail, so that range sensor 23 is moved along the guide rail.To realize range sensor 23 to positioned at 30 Neto of reaction chamber
Signal is sent on disk, receives chip reflects in pallet or film trap reflected signal and detect it between upper wafer surface
Vertical range, the roof of reaction chamber 30 are made of transparent material.Preferably, guide rail is line slideway.
In the present embodiment, reaction chamber 30 is the processing chamber of chemical vapor depsotition equipment, on a left side for reaction chamber 30
Air inlet 31 is set on side wall and at the position of its upper surface, it is defeated into reaction chamber 30 for being connected with technique source of the gas
Process gas is sent, exhaust outlet 32 is provided on the right side wall of reaction chamber 30 and at the position of its lower surface, for inciting somebody to action
The process gas that technique is not completed in reaction chamber 30 and the exhaust gas discharge for having completed technique.
Reaction chamber provided in this embodiment, the chip detection system that the above embodiment of the present invention is used to provide, not only
The uniformity of technique can be improved, and chip and the accuracy of manipulator positioning can be improved, so as to improve manipulator
The efficiency of piece is picked and placeed, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing piece, wafer surface is caused to damage.
As another technical solution, the present invention also provides a kind of chip detection method, Figure 13 is the embodiment of the present invention
The work flow diagram of the chip detection method of offer.3 are please referred to Fig.1, chip detection method provided in this embodiment is using above-mentioned
The chip detection system that embodiment provides, the chip detection method comprise the following steps：
Step S1, range sensor are moved horizontally from directly over film trap, are sent and are believed to pallet during its movement
Number；
Step S2, control unit receive the reflected signal that from pallet or chip reflects in film trap, and according to chip
The reflected signal of reflection judges whether reflective distance is equal to gauged distance, if being equal to, enters step S3；If being not equal to, into
Enter step S5；
Step S3, control unit driving range sensor movement preset length, and judgement is current anti-during movement
It is whether equal with gauged distance to penetrate distance, if being equal to, enters step S4；If being not equal to, S5 is entered step；
It is accurate to determine that the chip in film trap is placed by step S4；
Step S5 determines that the chip in film trap is not placed accurately.
Preferably, in step sl, range sensor is from the surface of any position at the edge of film trap along the film trap
Radial level moves, this can accurately detect central point of projection of 10 lower surface of chip on 21 bottom surface of film trap by film trap 21
It is a variety of do not place accurate situation, so as to improve the reliability of the chip detection system.
It is readily appreciated that, preset length is specifically set according to actual conditions, is controlled as long as meeting when chip does not place accurate
Unit can be gone out according to the current reflective Distance Judgment detected in the preset length its it is inequal with gauged distance H and
When chip place it is accurate when control unit can its etc. be gone out according to the current reflective Distance Judgment detected in the preset length
In gauged distance H.
In the present embodiment, it is the shifting moved of radial level in the range sensor along film trap to preset the preset length
From the boundary position of chip to the length of next boundary position on dynamic rail mark；In this case, further include in step s3：Step
Rapid S31 receives reflected signal during range sensor moves；Step S32 judges whether to reach brilliant according to reflected signal
The surface of next boundary position of piece, if reaching, range sensor stops movement；If not reaching, range sensor
It continues to move to.It is readily appreciated that, when chip places the center coincidence of accurate and chip center and film trap, presets length
It spends for maximum and is the diameter length of chip；When chip does not place accurate, the preset length that range sensor 23 moves is small
In the diameter length of chip, therefore, in practical applications, preset length can also be preset as the diameter length of chip（That is, it is default
The maximum of length）, thus can not only meet the needs of a variety of actual conditions, but also need not judge whether to reach chip
Next boundary position, so as to simplify the course of work.
In the present embodiment, when being provided at circumferentially spaced multiple film traps, and Distance-sensing along it on the upper surface in pallet
When device is arranged on the surface of one of film trap of multiple film traps, before step S1, step S0, driving pallet rotation are further included
Turn, so as to which the film trap detected is needed to be located at the underface of range sensor, in other words, need to detect so that range sensor is located at
Film trap surface, with realize detect the needs detection film trap in chip whether place accurately.
It should be noted that the chip detection system that chip detection method provided in this embodiment is provided with above-described embodiment
Specific work process it is similar, and the specific work process of above-mentioned chip detection system has been described in detail, and details are not described herein.
Chip detection method provided in this embodiment is moved horizontally by range sensor along directly over the film trap,
Signal is sent to pallet during its movement, control unit receives the reflection that from pallet or chip reflects in film trap
Signal, the reflected signal reflected according to chip judge whether reflective distance is equal to gauged distance, if being not equal to, it is determined that in film trap
Chip do not place accurately；If being equal to, control unit driving range sensor movement preset length, and sentence during movement
Whether disconnected current reflective distance is equal with gauged distance, if being equal to, it is determined that it is accurate that the chip in film trap is placed；If being not equal to,
Then determine that the chip in film trap is not placed accurately.From the foregoing, it will be observed that can realize it is right after manipulator places the wafer at film trap
Whether the chip in film trap, which is placed, is accurately detected, and lower step work is carried out if placing accurately, if inaccuracy is placed, to crystalline substance
Piece position is adjusted until chip is placed accurately, thus can not only improve the uniformity of technique, but also can improve chip
With the accuracy of manipulator positioning, so as to improve the efficiency that manipulator picks and places piece, and then the effect of transferring wafer can be improved
It rate and avoids repeatedly picking and placeing piece wafer surface is caused to damage.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, the original of the present invention is not being departed from
In the case of reason and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of chip detection system including pallet, is provided with to carry the piece of the chip on the upper surface of the pallet
Slot, and the reflectivity of the pallet is different from the reflectivity of the chip, which is characterized in that the system also includes：Distance passes
Sensor and control unit, wherein：
The range sensor is arranged on the surface of the film trap, and can be moved horizontally directly over the film trap；
The range sensor corresponds to piece groove location to be detected and sends signal to the pallet in moving process, and receives and
The reflected signal of chip reflection from the pallet or in the film trap, and the reflected signal is sent to the control
Unit；
Described control unit judges whether reflective distance is equal to gauged distance according to the reflected signal that the chip reflects, if differing
In, it is determined that the chip in the film trap is not placed accurately；If being equal to, the default length of range sensor movement is driven
Degree, and judge whether current reflective distance is equal with the gauged distance during movement, if being equal to, it is determined that described
It is accurate that the chip in slot is placed；If being not equal to, determine that the chip in the film trap is not placed accurately；
The gauged distance is defined as the chip and is accurately placed at during the film trap on the range sensor and the chip
Vertical range between surface.
2. chip detection system according to claim 1, which is characterized in that the preset length is in the Distance-sensing
From the boundary position of the chip to the length of next boundary position on the motion track that device is moved along the film trap radial level
Degree.
3. chip detection system according to claim 1, which is characterized in that the preset length is the diameter of the chip
Length.
4. chip detection system according to claim 1, which is characterized in that the chip detection system further includes rotation
Driving device,
The rotating driving device is for driving the pallet along its axial-rotation, so that described in each the film trap is sequentially located at
The underface of range sensor.
5. chip detection system according to claim 1, which is characterized in that the quantity of the range sensor and position with
The quantity of the film trap and position, which correspond, to be set.
6. chip detection system according to claim 1, which is characterized in that the range sensor is from the side of the film trap
It is moved along the radial level of the film trap surface of any position on edge.
7. a kind of reaction chamber, which is characterized in that including chip detection system, the chip detection system uses claim 1-
Chip detection system described in 6 any one, for detecting whether the chip is placed in the film trap for carrying the chip
Accurately.
8. reaction chamber according to claim 7, which is characterized in that the range sensor is mounted on the reaction
On guide rail above the upper cover of chamber.
9. a kind of chip detection method, which is characterized in that the described method comprises the following steps：
Step S1, range sensor are moved horizontally from directly over film trap, and signal is sent to pallet during its movement；
Step S2, control unit receive the reflected signal from the pallet or positioned at the reflection of chip described in the film trap, and
The reflected signal reflected according to the chip judges whether reflective distance is equal to gauged distance, if being equal to, enters step S3；If
It is not equal to, then enters step S5；
Step S3, described control unit drives the range sensor movement preset length, and judges to work as during movement
Whether front-reflection distance is equal with gauged distance, if being equal to, enters step S4；If being not equal to, S5 is entered step；
It is accurate to determine that the chip in the film trap is placed by step S4；
Step S5 determines that the chip in the film trap is not placed accurately.
10. chip detection method according to claim 9, which is characterized in that further included before the step S1：
Step S0 drives the pallet to rotate, so that the film trap that needs detect is located at the underface of the range sensor.
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| US10186438B2 (en) * | 2015-11-05 | 2019-01-22 | Infineon Technologies Ag | Method and apparatus for use in wafer processing |
| CN107664476B (en) * | 2016-07-28 | 2020-06-05 | 中微半导体设备(上海)股份有限公司 | Optical detection device and detection method for semiconductor equipment |
| CN106814087B (en) * | 2016-12-26 | 2019-07-19 | 华中科技大学 | A kind of flexible display screen multistation single vision AOI detection platform and its detection method |
| CN110797277B (en) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Silicon wafer position detection method and device and semiconductor processing equipment |
| CN109671637B (en) * | 2018-11-08 | 2021-05-07 | 北京北方华创微电子装备有限公司 | Wafer detection device and method |
| CN111452056A (en) * | 2019-01-22 | 2020-07-28 | 北京北方华创微电子装备有限公司 | Robot, semiconductor device, and robot operating state detection method |
| CN110379735B (en) * | 2019-06-28 | 2021-10-26 | 福建省福联集成电路有限公司 | Wafer oblique insertion detection device |
| CN110411378B (en) | 2019-08-06 | 2021-02-09 | 杭州众硅电子科技有限公司 | Wafer detection device and detection method thereof |
| CN111288889B (en) * | 2020-01-17 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Position detection device and position detection method of chamber process assembly |
| CN111613552B (en) * | 2020-05-08 | 2023-04-14 | 北京北方华创微电子装备有限公司 | Tray state adjusting method and semiconductor processing equipment |
| CN111640685A (en) * | 2020-06-04 | 2020-09-08 | 北京北方华创微电子装备有限公司 | Semiconductor device and workpiece state detection method |
| CN114000192B (en) * | 2021-10-29 | 2023-10-13 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and method for monitoring wafer position state |
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| CN101013138A (en) * | 2006-01-31 | 2007-08-08 | 台湾积体电路制造股份有限公司 | System and method for detecting wafer |
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| KR20070053540A (en) * | 2005-11-21 | 2007-05-25 | 삼성전자주식회사 | Bake apparatus |
| DE102009010555A1 (en) * | 2009-02-25 | 2010-09-02 | Siltronic Ag | Method for detecting a misalignment of a semiconductor wafer during a thermal treatment |
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