CN104916560A - Wafer detection system, reaction chamber and wafer detection method - Google Patents
Wafer detection system, reaction chamber and wafer detection method Download PDFInfo
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- CN104916560A CN104916560A CN201410088774.4A CN201410088774A CN104916560A CN 104916560 A CN104916560 A CN 104916560A CN 201410088774 A CN201410088774 A CN 201410088774A CN 104916560 A CN104916560 A CN 104916560A
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Abstract
The invention provides a wafer detection system, a reaction chamber and a wafer detection method. The method includes the following steps that: S1, a range sensor moves horizontally above a wafer tank, and the range sensor transmits signals to a tray in the moving process of the range sensor; S2, a control unit receives reflection signals from the tray or reflected by a wafer in the wafer bank, and judges whether a reflection distance is equal to a standard distance according to the reflection signals reflected by the wafer, if the reflection distance is equal to the standard distance, the method enters S3, otherwise, the method enters S5; S3, the control unit drives the range sensor to move by a preset length, and judges whether a current refection distance is equal to the standard distance in the movement process of the range sensor, if the current refection distance is equal to the standard distance, the method enters S4, otherwise, the method enters S5; S4, accurate arrangement of the wafer in the wafer tank is determined; and S5, inaccurate arrangement of the wafer in the wafer tank is determined. With the wafer detection method provided by the invention adopted, the uniformity of technique process and the accuracy of the alignment of the wafer and a manipulator can be improved, and therefore, the efficiency of wafer taking and arranging of the manipulator can be improved.
Description
Technical field
The invention belongs to semiconductor equipment processing technique field, be specifically related to a kind of chip detection system, reaction chamber and chip detection method.
Background technology
In the manufacture process of semiconductor device, for improving the efficiency of transferring wafer and reducing cost of labor, usual employing robotic transfer wafer, but, the accurate positioning of manipulator and wafer is often required, to ensure the accuracy of robotic transfer wafer in the process adopting manipulator loading or unloading wafer.
For this reason, application number is disclose a kind of wafer orientation method in the patent document of 02826636.6, positions wafer for realizing.Particularly, the wafer holder of bearing wafer is driven to move and rotate by wafer holder drive unit, rectilinear transducer detects and obtains wafer neighboring in wafer holder, calculation element calculates center and the cut out portion direction of current wafer according to the testing result that this wafer holder drive unit drives the anglec of rotation of wafer holder rotation and rectilinear transducer to detect wafer neighboring in wafer holder, and calculate rotary shaft position and the anglec of rotation of wafer holder when to be positioned at given position and cut out portion direction in the center of wafer at assigned direction, wafer holder is driven to move by wafer holder drive unit, rotate and stop, to realize wafer orientation, thus realize manipulator and wafer orientation is accurate.
Above-mentioned wafer orientation method is that the wafer carried in wafer holder is placed accurately under prerequisite, drives wafer holder to move to make the position of wafer relative mechanical hand accurate, thus realize positioning wafer by wafer holder drive unit.But, in actual applications, because manipulator offsets on horizontal or vertical direction, manipulator can be caused can not to be placed on by wafer exactly in film trap (that is, the wafer holder in said method) when film releasing, therefore, in this case, even if adopt above-mentioned wafer orientation method can not realize the accurate location of wafer and manipulator, the process uniformity of wafer thus can be caused in subsequent technique poor, thus cause processing quality poor; And, affect that manipulator is follow-up gets sheet, thus affect the efficiency of transferring wafer, and repeatedly attempt getting sheet, damage can be caused to the surface of wafer.
Summary of the invention
The present invention is intended to solve the technical problem existed in prior art, provide a kind of chip detection system, reaction chamber and chip detection method, not only can improve the uniformity of technique, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
The invention provides a kind of chip detection system, comprise pallet, the upper surface of described pallet is provided with the film trap for carrying described wafer, and the reflectivity of described pallet is different from the reflectivity of described wafer, described system also comprises: range sensor and control unit, wherein: described range sensor is arranged on directly over described film trap, and can move horizontally directly over described film trap; The corresponding described film trap position to be detected of described range sensor sends signal to described pallet in moving process, and receive from described pallet or the reflected signal of wafer reflection being arranged in described film trap, and described reflected signal is sent to described control unit; According to the reflected signal that described wafer reflects, described control unit judges whether reflective distance equals gauged distance, if be not equal to, then determine that the described wafer in described film trap is not placed accurately; If equal, then drive described range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with described gauged distance, if equal, then determine that the described wafer in described film trap is placed accurately; If be not equal to, determine that the described wafer in described film trap is not placed accurately; Described gauged distance is defined as vertical range when described wafer is accurately placed on described film trap between described range sensor and described upper wafer surface.
Wherein, described preset length be on the motion track of described range sensor along the radial level movement of described film trap from the boundary position of described wafer to the length of next boundary position.
Preferably, described preset length is the diameter length of described wafer.
Wherein, described chip detection system, also comprises rotating driving device, and described rotating driving device, for driving described pallet along its axial-rotation, is positioned at immediately below described range sensor successively to make each described film trap.
Wherein, the quantity of described range sensor and the quantity of position and described film trap and position one_to_one corresponding are arranged.
Preferably, described range sensor moves along the radial level of this film trap directly over the optional position at the edge of described film trap.
The present invention also provides a kind of reaction chamber, comprises chip detection system, and whether described chip detection system adopts above-mentioned chip detection system provided by the invention, place accurately for detecting described wafer in the film trap for carrying this wafer.
Wherein, described range sensor is arranged on the guide rail above the upper cover being positioned at described reaction chamber.
The present invention also provides a kind of chip detection method, said method comprising the steps of: step S1, and range sensor moves horizontally directly over described film trap, in the process of its movement, send signal to described pallet; Step S2, control unit receives from described pallet or the reflected signal being positioned at the reflection of wafer described in described film trap, and judges whether reflective distance equals gauged distance according to the reflected signal that described wafer reflects, if equal, then enters step S3; If be not equal to, then enter step S5; Step S3, described control unit drives described range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with gauged distance, if equal, then enters step S4; If be not equal to, enter step S5; Step S4, determines that the described wafer in described film trap is placed accurately; Step S5, determines that the described wafer in described film trap is not placed accurately.
Wherein, also comprise: step S0 before described step S1, drive described pallet to rotate, the described film trap detected to make needs is positioned at immediately below described range sensor.
The present invention has following beneficial effect:
Chip detection system provided by the invention, it moves horizontally directly over film trap by range sensor, in the process of its movement to pallet send signal and receive from pallet or be arranged in film trap wafer reflection reflected signal, according to the reflected signal that wafer reflects, control unit judges whether reflective distance equals gauged distance, if be not equal to, then determine that the wafer in film trap is not placed accurately; If equal, then drive range sensor to move preset length, and in moving process, judge that whether current reflective distance is equal with gauged distance, if equal, then determine that the wafer in film trap is placed accurately; If be not equal to, determine that the wafer in film trap is not placed accurately.As from the foregoing, can be implemented in whether to place the wafer in film trap after wafer is placed on film trap by manipulator and accurately detect, if place accurately, carry out lower step work, if place inaccurate, then wafer position is adjusted until wafer is placed accurately, thus the uniformity of technique can not only be improved, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
Reaction chamber provided by the invention, it adopts chip detection system provided by the invention, not only can improve the uniformity of technique, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
Chip detection method provided by the invention, it moves by the radial level of range sensor along this film trap, signal is sent to pallet in the process of its movement, control unit receives from pallet or the reflected signal being arranged in the reflection of film trap wafer, and judge whether reflective distance equals gauged distance according to the reflected signal of wafer reflection, if be not equal to, then determine that the wafer in film trap is not placed accurately; If equal, control unit drives range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with gauged distance, if equal, then determines that the wafer in film trap is placed accurately; If be not equal to, then determine that the wafer in film trap is not placed accurately.As from the foregoing, can be implemented in whether to place the wafer in film trap after wafer is placed on film trap by manipulator and accurately detect, if place accurately, carry out lower step work, if place inaccurate, then wafer position is adjusted until wafer is placed accurately, thus the uniformity of technique can not only be improved, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
Accompanying drawing explanation
The structural representation of the chip detection system that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is that the wafer in film trap places structural representation accurately;
Fig. 3 is that the wafer in film trap does not place structural representation accurately;
The structural representation of the chip detection system that Fig. 4 provides for the application embodiment of the present invention when the wafer in film trap is placed accurate;
Fig. 5 is the vertical view of the structure shown in Fig. 4;
Fig. 6 is for applying the first structural representation of the chip detection system that the embodiment of the present invention provides when the wafer in film trap is not placed accurate;
Fig. 7 is the vertical view of the structure shown in Fig. 6;
Fig. 8 is for applying the second structural representation of the chip detection system that the embodiment of the present invention provides when the wafer in film trap is not placed accurate;
Fig. 9 is the vertical view of the structure shown in Fig. 8;
Figure 10 is for applying the third structural representation of the chip detection system that the embodiment of the present invention provides when the wafer in film trap is not placed accurate;
Figure 11 is the vertical view of the structure shown in Figure 10;
The structural representation of the reaction chamber that Figure 12 provides for the embodiment of the present invention; And
The workflow diagram of the chip detection method that Figure 13 provides for the embodiment of the present invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, chip detection system provided by the invention, reaction chamber and chip detection method are described in detail.
The structural representation of the chip detection system that Fig. 1 provides for the embodiment of the present invention.Refer to Fig. 1, the chip detection system that the embodiment of the present invention provides, comprise range sensor 23 and control unit 24.The upper surface of pallet 20 is provided with the film trap 21 for bearing wafer 10, and wherein, the diameter dimension of film trap 21 is slightly larger than the diameter dimension of wafer 10, and the reflectivity of pallet 20 is different from the reflectivity of wafer 10, range sensor 23 is arranged on directly over film trap 21, and can move horizontally directly over film trap 21, signal is sent to pallet in the process of its movement, and receive from pallet or be arranged in film trap 21 wafer 10 reflect reflected signal, and send it to control unit 24, because the reflectivity of pallet 20 is different from the reflectivity of wafer 10, this reflected signal that range sensor 23 is reflected on pallet with wafer 10 to the signal that pallet sends is different, therefore, control unit 24 can be positioned at directly over pallet 20 or wafer 10 according to the different judging distance transducers 23 of reflected signal.In addition, range sensor 23 comprises laser displacement sensor.
According to the reflected signal that wafer reflects, control unit 24 judges whether reflective distance equals gauged distance H, if be not equal to, then determine that the wafer 10 in film trap 21 is not placed accurately; If equal, then drive range sensor 23 to move preset length, in the process of its movement, judge that whether reflective distance is equal with gauged distance H, if equal, then determine that the wafer 10 in film trap 21 is placed accurately, directly can carry out lower step work, such as, carry out technical process or get sheet process; If be not equal to, then determine that the wafer 10 in film trap 21 is not placed accurately, need to carry out adjusting until place accurately, carry out lower step work more afterwards.Wherein, gauged distance H is defined as vertical range when wafer 10 is accurately placed on film trap 21 between range sensor 23 and wafer 10 upper surface; Reflective distance is the vertical range of the range sensor that obtains of reflected signal according to wafer reflection and wafer 10 upper surface.
In the present embodiment, wafer 10 is placed the lower surface accurately referring to wafer 10 and is stacked on the bottom surface of film trap 21 completely in film trap 21, as shown in Figure 2; Wafer 10 is not placed the lower surface accurately referring to wafer 10 and is not stacked in completely on the bottom surface of film trap 21 in film trap 21, such as, as shown in Figure 3.
In the present embodiment, preferably, range sensor 23 moves (as mobile route S in Fig. 1) along the radial level of this film trap 21 directly over the optional position at the edge 22 of film trap 21, because the radial level of range sensor 23 along film trap 21 moves, in this case, accurately can detect the projection of wafer 10 lower surface on film trap 21 bottom surface and not place situation accurately through the multiple of central point of film trap 21, thus the reliability of this chip detection system can be improved.Particularly, control unit 24, along in the process of mobile route S movement from left to right, directly over the boundary position 101 whether reaching wafer 10, if arrive, then carries out judging whether wafer is placed accurately according to reflected signal judging distance transducer 23; If do not arrive, then continue whether to reach directly over the boundary position 101 of wafer 10 according to reflected signal judging distance transducer 23.In actual applications, range sensor 23 also can move horizontally along any direction the optional position directly over film trap 21, can arrive directly over wafer 10 as long as realize range sensor 23.
Easy understand, preset length is specifically arranged according to actual conditions, as long as meet the control unit 24 when wafer 10 is not placed accurate can go out according to the current reflective Distance Judgment detected in this preset length that it is not equal with gauged distance H, and control unit 24 can go out according to the current reflective Distance Judgment detected in this preset length that it is equal with gauged distance H when wafer 10 is placed accurate.
In the present embodiment, preset this preset length be on the motion track S of range sensor 23 along the movement of film trap 21 radial level from the boundary position 101 of wafer 10 to the length of next boundary position 102.In this case, reflected signal is sent in the process of range sensor 23 movement to control unit 24; Control unit 24 judges whether directly over the next boundary position 102 of arrival wafer according to this reflected signal, if arrive, then range sensor 23 stops mobile; If do not arrive, then range sensor 23 continues mobile.Easy understand, when wafer 10 is placed accurately and the center of the center of wafer 10 and film trap 21 overlaps, preset length is maximum and is the diameter length of wafer 10; When wafer 10 is not placed accurate, the preset length of range sensor 23 movement is less than the diameter length of wafer 10, therefore, in actual applications, preset length can also be preset as the diameter length (that is, the maximum of preset length) of wafer 10, thus not only can meet the needs of multiple actual conditions, and do not need control unit 24 to judge whether to arrive the next boundary position 102 of wafer 10, thus the course of work can be simplified.
The course of work applying wafer 10 detection system that the embodiment of the present invention provides when the wafer 10 in film trap 21 is placed accurate is specifically described: particularly below in conjunction with Fig. 4 and Fig. 5, the reflected signal that definition range sensor 23 reflects on pallet 20 to the signal that pallet 20 sends is the first reflected signal, definition range sensor 23 is the second reflected signal to the reflected signal that the signal that pallet 20 sends reflects on the wafer 10, first reflected signal and the second reflected signal specifically can be respectively one in high level " 1 " and low level " 0 ", comprise the following steps:
Step S100, range sensor 23 moves along the radial level of this film trap 21 from position A, signal is sent to pallet 20 in the process of its movement, and receive the first reflected signal reflected from pallet 20, or, the second reflected signal that the wafer 10 being arranged in film trap 21 reflects, and the first reflected signal or the second reflected signal are sent to control unit 24, particularly, range sensor 23 receives the first reflected signal of pallet 20 reflection from position A to position B; The second reflected signal of wafer 10 reflection is received from position B to position D;
Step S101, at range sensor 23 from position A to the process of position B in, the first reflected signal that control unit 24 receiving range transducer 23 sends, not identical with the second reflected signal that wafer 10 reflects according to this first reflected signal, judging distance transducer 23 does not arrive directly over the boundary position 101 of wafer 10; When range sensor 23 moves to position B, the second reflected signal that control unit 24 receiving range transducer 23 sends, identical with the second reflected signal that wafer 10 reflects according to this second reflected signal, judging distance transducer 23 arrives directly over the boundary position 101 of wafer 10, enters step S102;
Step S102, range sensor 23 continues to move until position D from position B to position C, and the vertical range h(detected in real time between itself and wafer 10 upper surface is in the process of its movement, reflective distance), and this vertical range h is sent to control unit 24, and continue at range sensor 23 to continue to send reflected signal to control unit 24 in the process of movement;
Step S103, control unit 24 equals the first reflected signal according to this reflected signal, and directly over the next boundary position 102 determining to arrive wafer 10, range sensor 23 stops mobile.
In step s 102, control unit 24 judges that in the process of range sensor 23 movement current reflective distance equals gauged distance H all the time, particularly, is equal to gauged distance H at the vertical range h at position B, position C and D place, position, therefore, then determine that the wafer 10 in film trap 21 is placed accurately.
The course of work applying wafer 10 detection system that the embodiment of the present invention provides when the wafer 10 in film trap 21 is not placed accurate is specifically described: particularly below in conjunction with Fig. 6 and Fig. 7, the reflected signal that definition range sensor 23 reflects on pallet 20 to the signal that pallet 20 sends is the first reflected signal, definition range sensor 23 is the second reflected signal to the reflected signal that the signal that pallet 20 sends reflects on the wafer 10, first reflected signal and the second reflected signal specifically can be respectively one in high level " 1 " and low level " 0 ", comprise the following steps:
Step S200, range sensor 23 moves along the radial level of this film trap 21 from position A, signal is sent to pallet 20 in the process of its movement, and receive the first reflected signal reflected from pallet 20, or, be arranged in the second reflected signal of film trap 21 wafer 10 reflection, and the first reflected signal or the second reflected signal sent to control unit 24, particularly, range sensor 23 receives the first reflected signal of pallet reflection from position A to position B; The second reflected signal of wafer 10 reflection is received from position B to position D;
Step S201, at range sensor 23 from position A to the process of position B in, the first reflected signal that control unit 24 receiving range transducer 23 sends, not identical with the second reflected signal that wafer 10 reflects according to this first reflected signal, judging distance transducer 23 does not arrive directly over the boundary position 101 of wafer 10; When range sensor 23 moves to position B, the second reflected signal that control unit 24 receiving range transducer 23 sends, identical with the second reflected signal that wafer 10 reflects according to this second reflected signal, judging distance transducer 23 arrives directly over the boundary position 101 of wafer 10, enters step S202;
Step S202, range sensor 23 continues to move until position D from position B to position C, and in the process of its movement, detect in real time vertical range between itself and wafer 10 upper surface (namely, reflective distance), and this vertical range h is sent to control unit 24, and continue at range sensor 23 to continue to send reflected signal to control unit 24 in the process of movement;
Step S203, control unit 24 equals the first reflected signal according to this reflected signal, and directly over the next boundary position 102 determining to arrive wafer 10, range sensor 23 stops mobile.
In step S202, control unit 23 judges that in the process of range sensor 23 movement current reflective distance is less than gauged distance H all the time, particularly, judge that vertical range h1 equals gauged distance H at B place, position, judge that vertical range h2 is less than gauged distance H at C place, position, judge that vertical range h3 is less than gauged distance H at D place, position, therefore, then determine that the wafer 10 in film trap 21 is not placed accurately.
In above-mentioned steps S100 ~ S103 and step S200 ~ S203, preset length be on the motion track of range sensor 23 along the movement of film trap 21 radial level from the boundary position 101 of wafer 10 to the length of next boundary position 102.But, in actual applications, preset length also can be other length, such as, preset length is the half of the diameter length of wafer 10, in this case, owing to equaling the half of diameter length between position B and position C along the length in film trap 21 radial direction, therefore, in step S102 and step S202, range sensor 23 continues to move to position C from position B, and, accordingly, in step s 103, the vertical range that any position of position B and position C is detected on the mobile route of range sensor 23 equals gauged distance H, control unit 24 judges that current reflective distance equals gauged distance H, then determine that the wafer 10 in film trap 21 is placed accurately, in step S203, such as, when the vertical range h detected at C place, position is less than gauged distance H, control unit 24 judges that reflective distance is not equal to gauged distance H, then determine that the wafer 10 in film trap 21 is not placed accurately.
In the present embodiment, preferably, control unit 24 is for judging whether current reflective distance equals gauged distance H, if equal, then determines that the wafer 10 in film trap 21 is placed accurately; If be not equal to, judge deviation between reflective distance and gauged distance H whether in secure threshold, if in secure threshold, then determine that the wafer 10 in film trap 21 is placed accurately; If not in secure threshold, then determine that the wafer 10 in film trap 21 is not placed accurately.So-called secure threshold is the maximum error distance allowed between the current reflective distance of detection and gauged distance H; And, the factors such as the measure error of secure threshold and range sensor 23 are relevant, this can be avoided the factor such as measure error due to range sensor 23 to cause detecting wafer 10 in film trap 21 whether placing testing result mistake accurately to a certain extent, thus can improve practicality and the reliability of this wafer 10 detection system.
In the present embodiment, the upper surface of pallet 20 is arranged at intervals with multiple film trap 21 along its circumference, in this case, range sensor 23 is arranged on directly over one of them film trap 21 of multiple film trap 21, chip detection system also comprises rotating driving device, rotating driving device is used for driving tray along its axial-rotation, be positioned at immediately below range sensor 23 successively to make each film trap 21, in other words, range sensor 23 can be made to lay respectively at directly over each film trap 21, thus by the range sensor 23 that rotating driving device and a corresponding film trap 21 are arranged, whether can realize the wafer 10 detected in multiple film trap 21 places accurately, this compares with position one_to_one corresponding with the quantity of position with multiple film trap 21 with the quantity arranging range sensor 23, the magnitude setting of range sensor 23 can be reduced, thus Productive statistics cost can be reduced.
But, in actual applications, also can the quantity of range sensor 23 and the quantity of position and film trap 21 and position one_to_one corresponding arrange, arrange by range sensor 23 and multiple film trap 21 one_to_one corresponding, the wafer 10 simultaneously detected in multiple film trap 21 can be realized whether place accurately, thus can detection efficiency be improved.
It should be noted that, in actual applications, range sensor 23 can move along the radial level of film trap 21 from the optional position at the edge 22 of film trap 21, such as, shown in Fig. 8 and Fig. 9, and for example, shown in Figure 10 and Figure 11, specific works process and the above-mentioned course of work similar, do not repeat them here.
In sum, the chip detection system that the present embodiment provides, it moves horizontally directly over film trap 21 by range sensor 23, in the process of its movement to pallet send signal and receive from pallet or be arranged in film trap 21 wafer 10 reflect reflected signal, according to the reflected signal that wafer reflects, control unit 24 judges whether reflective distance equals gauged distance H, if be not equal to, then determine that the wafer 10 in film trap 21 is not placed accurately; If equal, then drive range sensor 23 to move preset length, and in moving process, judge that whether current reflective distance is equal with gauged distance H, if equal, then determine that the wafer 10 in film trap 21 is placed accurately; If be not equal to, determine that the wafer 10 in film trap 21 is not placed accurately.As from the foregoing, can be implemented in manipulator wafer 10 to be placed on whether to place the wafer 10 in film trap 21 after film trap 21 and accurately to detect, if place accurately, carry out lower step work, if place inaccurate, then wafer 10 position is adjusted until wafer 10 is placed accurately, thus the uniformity of technique can not only be improved, and the accuracy that wafer 10 locates with manipulator can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer 10 can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer 10 surface.
The structural representation of the reaction chamber that Figure 12 provides for the embodiment of the present invention.Refer to Figure 12, the reaction chamber 30 that the embodiment of the present invention provides comprises pallet and chip detection system.Wherein, pallet 20 is arranged in reaction chamber 30, and is provided with the film trap for bearing wafer on the upper surface of pallet; Whether the chip detection system that chip detection system adopts above-described embodiment to provide, place accurately for the wafer detected in film trap.Particularly, the range sensor 23 of chip detection system is arranged on the outside of reaction chamber 30, and is positioned on roof, and the roof of reaction chamber 30 is provided with guide rail along the mobile route of range sensor, moves along this guide rail to make range sensor 23.For realizing range sensor 23 to the reflected signal sending signal on reaction chamber 30 inner pallet, receive wafer reflection in pallet or film trap and the vertical range detected between itself and upper wafer surface, the roof of reaction chamber 30 adopts transparent material to make.Preferably, guide rail is line slideway.
In the present embodiment, reaction chamber 30 is the processing chamber of chemical vapor depsotition equipment, on the left side wall of reaction chamber 30 and near the position of its upper surface, air inlet 31 is set, for the delivery technology gas in reaction chamber 30 that is connected with technique source of the gas, exhaust outlet 32 is provided with, for will the process gas of technique do not completed in reaction chamber 30 and complete the waste gas discharge of technique on the right side wall of reaction chamber 30 and near the position of its lower surface.
The reaction chamber that the present embodiment provides, its chip detection system adopting the above embodiment of the present invention to provide, not only can improve the uniformity of technique, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
As another one technical scheme, the present invention also provides a kind of chip detection method, the workflow diagram of the chip detection method that Figure 13 provides for the embodiment of the present invention.Refer to Figure 13, the chip detection system that the chip detection method that the present embodiment provides adopts above-described embodiment to provide, this chip detection method comprises the following steps:
Step S1, range sensor moves horizontally directly over film trap, in the process of its movement, send signal to pallet;
Step S2, control unit receives from pallet or the reflected signal being arranged in the reflection of film trap wafer, and judges whether reflective distance equals gauged distance according to the reflected signal of wafer reflection, if equal, then enters step S3; If be not equal to, then enter step S5;
Step S3, control unit drives range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with gauged distance, if equal, then enters step S4; If be not equal to, enter step S5;
Step S4, determines that the wafer in film trap is placed accurately;
Step S5, determines that the wafer in film trap is not placed accurately.
Preferably, in step sl, range sensor moves along the radial level of this film trap directly over the optional position at the edge of film trap, this accurately can detect the projection of wafer 10 lower surface on film trap 21 bottom surface and not place situation accurately through the multiple of central point of film trap 21, thus can improve the reliability of this chip detection system.
Easy understand, preset length is specifically arranged according to actual conditions, as long as meet the control unit when wafer is not placed accurate can go out according to the current reflective Distance Judgment detected in this preset length that it is not equal with gauged distance H, and control unit can go out it and equals gauged distance H according to the current reflective Distance Judgment detected in this preset length when wafer placement is accurate.
In the present embodiment, preset this preset length be on the motion track of described range sensor along the radial level movement of film trap from the boundary position of wafer to the length of next boundary position; In this case, also comprise in step s3: step S31, in the process of range sensor movement, receive reflected signal; Step S32, directly over the next boundary position judging whether to arrive wafer according to reflected signal, if arrive, then range sensor stops mobile; If do not arrive, then range sensor continues mobile.Easy understand, when wafer is placed accurately and the center of the center of wafer and film trap overlaps, preset length is maximum and is the diameter length of wafer; When wafer is not placed accurate, the preset length of range sensor 23 movement is less than the diameter length of wafer, therefore, in actual applications, preset length can also be preset as the diameter length (that is, the maximum of preset length) of wafer, thus not only can meet the needs of multiple actual conditions, and do not need the next boundary position judging whether arrival wafer, thus the course of work can be simplified.
In the present embodiment, when being arranged at intervals with multiple film trap along its circumference on the upper surface of pallet, and range sensor is when being arranged on directly over one of them film trap of multiple film trap, before step S1, also comprise step S0, driving tray rotates, the film trap detected to make needs is positioned at immediately below range sensor, in other words, be positioned to make range sensor directly over the film trap needing to detect, whether place accurately to realize the wafer detected in the film trap of these needs detection.
It should be noted that, the specific works process of the chip detection method that the present embodiment provides and the chip detection system that above-described embodiment provides is similar, and the specific works process of above-mentioned chip detection system is described in detail, does not repeat them here.
The chip detection method that the present embodiment provides, it moves horizontally directly over this film trap by range sensor, signal is sent to pallet in the process of its movement, control unit receives from pallet or the reflected signal being arranged in the reflection of film trap wafer, reflected signal according to wafer reflection judges whether reflective distance equals gauged distance, if be not equal to, then determine that the wafer in film trap is not placed accurately; If equal, control unit drives range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with gauged distance, if equal, then determines that the wafer in film trap is placed accurately; If be not equal to, then determine that the wafer in film trap is not placed accurately.As from the foregoing, can be implemented in whether to place the wafer in film trap after wafer is placed on film trap by manipulator and accurately detect, if place accurately, carry out lower step work, if place inaccurate, then wafer position is adjusted until wafer is placed accurately, thus the uniformity of technique can not only be improved, and the accuracy that wafer and manipulator locate can be improved, thus the efficiency that manipulator picks and places sheet can be improved, and then the efficiency of transferring wafer can be improved and avoid repeatedly picking and placeing sheet damage is caused to wafer surface.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, when not departing from principle of the present invention and essence, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a chip detection system, comprises pallet, the upper surface of described pallet is provided with the film trap for carrying described wafer, and the reflectivity of described pallet is different from the reflectivity of described wafer, it is characterized in that, described system also comprises: range sensor and control unit, wherein:
Described range sensor is arranged on directly over described film trap, and can move horizontally directly over described film trap;
The corresponding described film trap position to be detected of described range sensor sends signal to described pallet in moving process, and receive from described pallet or the reflected signal of wafer reflection being arranged in described film trap, and described reflected signal is sent to described control unit;
According to the reflected signal that described wafer reflects, described control unit judges whether reflective distance equals gauged distance, if be not equal to, then determine that the described wafer in described film trap is not placed accurately; If equal, then drive described range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with described gauged distance, if equal, then determine that the described wafer in described film trap is placed accurately; If be not equal to, determine that the described wafer in described film trap is not placed accurately;
Described gauged distance is defined as vertical range when described wafer is accurately placed on described film trap between described range sensor and described upper wafer surface.
2. chip detection system according to claim 1, is characterized in that, described preset length be on the motion track of described range sensor along the movement of described film trap radial level from the boundary position of described wafer to the length of next boundary position.
3. chip detection system according to claim 1, is characterized in that, described preset length is the diameter length of described wafer.
4. chip detection system according to claim 1, is characterized in that, described chip detection system, also comprises rotating driving device,
Described rotating driving device, for driving described pallet along its axial-rotation, is positioned at immediately below described range sensor successively to make each described film trap.
5. chip detection system according to claim 1, is characterized in that, quantity and the position one_to_one corresponding of the quantity of described range sensor and position and described film trap are arranged.
6. chip detection system according to claim 1, is characterized in that, described range sensor moves along the radial level of this film trap directly over the optional position at the edge of described film trap.
7. a reaction chamber, is characterized in that, comprises chip detection system, and whether described chip detection system adopts the chip detection system described in claim 1-6 any one, place accurately for detecting described wafer in the film trap for carrying this wafer.
8. reaction chamber according to claim 7, is characterized in that, described range sensor is arranged on the guide rail above the upper cover being positioned at described reaction chamber.
9. a chip detection method, is characterized in that, said method comprising the steps of:
Step S1, range sensor moves horizontally directly over described film trap, in the process of its movement, send signal to described pallet;
Step S2, control unit receives from described pallet or the reflected signal being positioned at the reflection of wafer described in described film trap, and judges whether reflective distance equals gauged distance according to the reflected signal that described wafer reflects, if equal, then enters step S3; If be not equal to, then enter step S5;
Step S3, described control unit drives described range sensor to move preset length, and in the process of movement, judge that whether current reflective distance is equal with gauged distance, if equal, then enters step S4; If be not equal to, enter step S5;
Step S4, determines that the described wafer in described film trap is placed accurately;
Step S5, determines that the described wafer in described film trap is not placed accurately.
10. chip detection method according to claim 9, is characterized in that, also comprises before described step S1:
Step S0, drives described pallet to rotate, and the described film trap detected to make needs is positioned at immediately below described range sensor.
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