CN105762093A - Technological cavity and method for judging whether position of wafer on tray is abnormal or not - Google Patents
Technological cavity and method for judging whether position of wafer on tray is abnormal or not Download PDFInfo
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- CN105762093A CN105762093A CN201410787483.4A CN201410787483A CN105762093A CN 105762093 A CN105762093 A CN 105762093A CN 201410787483 A CN201410787483 A CN 201410787483A CN 105762093 A CN105762093 A CN 105762093A
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Abstract
The invention provides a technological cavity and a method for judging whether the position of a wafer on a tray is abnormal or not. The technological cavity comprises the tray, a drive unit, and a detection unit, wherein the drive unit is used for driving the tray to rotate. The detection unit is disposed to be at a first preset detection point above the tray, and is used for detecting the vertical distances from the first detection point to all intersection points on the surface of the tray when the wafer carried by the tray rotates through rotating angles corresponding to all intersection points. Whether the vertical distance corresponding to each intersection point exceeds a preset distance threshold value or not is judged. A part, located at a side of the intersection point, of the wafer placed in an installation groove corresponding to the intersection extends out from the edge of the installation groove in an inclined manner if the vertical distance corresponding to the intersection point exceeds the preset distance threshold value. The technological cavity provided by the invention not only can directly judge which edge of the wafer placed in the installation groove is overlapped and which installation groove the edge-overlapped wafer is located in, but also can judge whether an overlapping phenomenon happens in a process that a mechanical arm places the wafer or not.
Description
Technical field
The present invention relates to semiconductor processing technology field, in particular it relates to a kind of processing chamber and judge the method that the wafer position on pallet is whether abnormal.
Background technology
In the manufacture process of semiconductor device, it is usually and places the wafer in the container or film magazine sealing cleaning, and utilize mechanical hand automatically to carry out picking and placeing sheet operation between this container or film magazine and processing chamber, to prevent the foreign particle pollution to wafer.Such as, chemical vapour deposition (CVD) (ChemicalVaporDeposition, CVD) equipment, it commonly uses pallet in processing chamber and carrys out bearing wafer, this pallet generally is circular, and is provided with the multiple mounting grooves along the uniformly arrangement of its circumference on pallet, in order to limit the position of wafer.Additionally, pallet is connected with electric rotating machine, and rotate under the driving of this electric rotating machine.When carrying out mechanical hand and carrying out picking and placeing sheet operation, first under the driving of motor, pallet rotates a certain angle so that one of them mounting groove be positioned at specify pick and place sheet position；Mechanical hand moves to the surface of this mounting groove, to carry out taking the operation of sheet or film releasing.
But, in the process that electric rotating machine drives pallet to rotate, often occur making pallet not problem synchronous operated with electric rotating machine because the connector between pallet and electric rotating machine occurs to skid.Such as, electric rotating machine has operated 2000 pulses, but due to above-mentioned skidding reason, causing that pallet has only operated 1950 pulses, this makes pallet cannot rotate to corresponding target location, thus placing in the process of wafer at mechanical hand, may occur that " scrap (bridge) " phenomenon occurs in deviation because of wafer relative to the position of mounting groove, this " scrap (bridge) " phenomenon specifically refers to: as it is shown in figure 1, be provided with mounting groove 2 on pallet 1, wafer 4 is positioned at this mounting groove 2 under normal circumstances；Further, on pallet 1, and the part being positioned at mounting groove 2 periphery has a step 3 lower than pallet 1 upper surface at thickness direction, in order to prevent the wafer being placed in mounting groove 2 from departing from mounting groove 2.On the basis of this structure, often there is following two abnormal condition in the process placing wafer in mechanical hand: the first abnormal condition is as shown in Figure 2, the center of wafer 4 offsets relative to the center of mounting groove 2, and the right part of wafer 4 rides on step 3；The second abnormal condition is as it is shown on figure 3, the center of wafer 4 offsets relative to the center of mounting groove 2, and its side-play amount is bigger relative to the first abnormal condition, so that the right part of wafer 4 rides on the upper surface of pallet 1.When there is above two abnormal condition, the wafer after scrap (bridge) is easy to white residue occur after technique, causes that resistivity and thickness evenness are deteriorated, can increase mechanical hand simultaneously and take the difficulty of sheet, it is easy to cause impression on silicon chip, directly affect the yield of equipment.
Whether current semiconductor processing equipment occurs skidding indirectly to judge whether wafer above-mentioned " scrap (bridge) " phenomenon occurs only by between detection electric rotating machine and pallet.But, the method does not simply fail to determine in pallet to be wafer generation scrap (bridge) in which mounting groove, and cannot be informed in mechanical hand and place the process of wafer and above-mentioned " scrap (bridge) " phenomenon whether occur.
Summary of the invention
It is contemplated that at least solve one of technical problem of existence in prior art, propose a kind of processing chamber and the whether abnormal method of the wafer position that judges on pallet, it is possible not only to directly judge that " scrap (bridge) " phenomenon occurs in which side of the wafer in which mounting groove, and whether the process that can be informed in mechanical hand placement wafer " scrap (bridge) " phenomenon occurs.
A kind of processing chamber is provided for realizing the purpose of the present invention, including pallet, described pallet is provided with multiple mounting groove for placing wafer, and be uniformly distributed along its circumference, also including driver element and detection unit, wherein, described driver element is used for driving described pallet to rotate；Described detection unit is arranged in the first test point place preset above described pallet, and described first test point is when pallet described in described drive unit drives rotates, and corresponding circular trace on described tray surface is crossed to form two intersection points with each mounting groove；Described detection unit is for when described pallet bearing wafer rotates the anglec of rotation corresponding with each intersection point, detecting the vertical interval between described first test point and each point of intersection of described tray surface；Judge that the vertical dimension corresponding to each intersection point is whether beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
Preferably, described distance threshold is range higher limit or the Lower Range value of described detection unit；When described pallet zero load rotates, the vertical interval between described first test point and each point of intersection of described tray surface is arranged in the intermediate range of the range of described detection unit.
Preferably, described processing chamber also includes control unit, described control unit is for receiving the vertical dimension corresponding to each intersection point sent and come by described detection unit, and judge that whether this vertical dimension is beyond the distance threshold preset, if, then determining the wafer in the mounting groove corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
Preferably, on described tray upper surface, and the arranged outside being positioned at described mounting groove has initial point mark part, and described initial point mark part is corresponding with the origin position of described pallet；Further, being provided above guide rail at described pallet, described guide rail radially extends along described pallet；Described detection unit is arranged on described guide rail, and can move to described first test point or the second test point along described guide rail；Described second test point is arranged on above described pallet, and is positioned at the position corresponding with described initial point mark part place circumference；Described detection unit is when being positioned at described second test point, for when described pallet rotates a circle from its origin position, detecting the vertical interval between described second test point and described tray surface；Judge that whether this vertical interval is equal to described second test point and described tray surface vertical interval between described initial point mark part, if, it is determined that described pallet does not skid；If not, it is determined that described pallet skids.
Preferably, on described tray upper surface, and the arranged outside being positioned at described mounting groove has initial point mark part, and described initial point mark part is corresponding with the origin position of described pallet；Further, described processing chamber also includes initial point detection unit, and it is arranged on the second test point place preset above described pallet, and described second test point is positioned at the position corresponding with described initial point mark part place circumference；Described initial point detection unit is for when described pallet rotates a circle from its origin position, detecting the vertical interval between described second test point and described tray surface；Judge that whether this vertical interval is equal to described second test point and described tray surface vertical interval between described initial point mark part, if, it is determined that described pallet does not skid；If not, it is determined that described pallet skids.
Preferably, described initial point mark part is from the recessed breach of described tray surface, or for running through the through hole of its thickness.
Preferably, described detection unit is laser distance sensor.
Preferably, described driver element includes motor, and described motor rotates predetermined angle for driving described pallet under the control of pulse signal；Number of pulses according to described pulse signal judges whether described pallet rotates to the anglec of rotation corresponding with each intersection point.
As another technical scheme, the present invention also provides for a kind of method whether wafer position judged on pallet is abnormal, is provided with multiple mounting groove for placing wafer, and is uniformly distributed along its circumference on described pallet, described mounting groove is used for placing wafer, and it comprises the following steps:
Presetting the first test point above described pallet, described first test point is when pallet described in described drive unit drives rotates, and corresponding circular trace on described tray surface is crossed to form two intersection points with each mounting groove；
The pallet carrying wafer is driven to rotate；
When described pallet rotates the anglec of rotation corresponding with each intersection point, detect the vertical interval between described first test point and each point of intersection of described tray surface；
Judge that the vertical dimension corresponding to each intersection point is whether beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
Preferably, described distance threshold is range higher limit or the Lower Range value of described detection unit；When described pallet zero load rotates, the vertical interval between described first test point and each point of intersection of described tray surface is arranged in the intermediate range of the range of described detection unit.
The method have the advantages that
Processing chamber provided by the invention, it presets the first test point above pallet, and this first test point is when utilizing drive unit drives pallet to rotate, and corresponding circular trace on tray surface is crossed to form two intersection points with each mounting groove；By utilizing detection unit when pallet bearing wafer rotates extremely corresponding with each intersection point anglec of rotation, detect the vertical interval between this first test point and each point of intersection of tray surface, and send it to control unit；Whether the vertical dimension corresponding to each intersection point that control unit is come for judging to be sent by detection unit is beyond the distance threshold preset, if, then determining the wafer in the mounting groove corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.Thus, it is possible not only to directly judge that " scrap (bridge) " phenomenon occurs in which side of the wafer in which mounting groove, and whether the process that can be informed in mechanical hand placement wafer " scrap (bridge) " phenomenon occurs.
The method whether wafer position judged on pallet provided by the invention is abnormal, it is possible not only to directly judge that " scrap (bridge) " phenomenon occurs in which side of the wafer in which mounting groove, and whether the process that can be informed in mechanical hand placement wafer " scrap (bridge) " phenomenon occurs.
Accompanying drawing explanation
The top view of a kind of processing chamber that Fig. 1 provides for the embodiment of the present invention；
The top view of the pallet of the processing chamber that Fig. 2 A provides for the embodiment of the present invention；
The partial sectional view of the pallet of the processing chamber that Fig. 2 B provides for the embodiment of the present invention；
The top view of the another kind of processing chamber that Fig. 3 provides for the embodiment of the present invention；And
The method whether wafer position judging on pallet that Fig. 4 provides for the embodiment of the present invention is abnormal.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, to processing chamber provided by the invention and judge whether abnormal method is described in detail the wafer position on pallet below in conjunction with accompanying drawing.
The top view of a kind of processing chamber that Fig. 1 provides for the embodiment of the present invention.The top view of the pallet of the processing chamber that Fig. 2 A provides for the embodiment of the present invention.Seeing also Fig. 1 and Fig. 2 A, processing chamber 10 includes pallet 21, driver element and detection unit 12.Wherein, pallet 21 is arranged in processing chamber 10, and is provided with multiple mounting groove 22 for placing wafer on pallet 21, and uniformly arranges along the circumferential of this pallet 21.Driver element (not shown) is used for driving pallet 21 to rotate, by making this pallet 21 rotate, can make what each mounting groove 22 was positioned at mechanical hand one by one to pick and place sheet position, in order to utilize mechanical hand by wafer transmission to mounting groove 22, or take out wafer from this mounting groove 22.
Preferably, the partial sectional view of the pallet of the processing chamber that Fig. 2 B provides for the embodiment of the present invention, as shown in Figure 2 B, pallet 21 is positioned at the part of mounting groove 22 periphery and has a step 23 lower than pallet 21 upper surface at thickness direction, in order to prevent the wafer 24 being placed in mounting groove 22 from departing from mounting groove 21, thus being conducive to improving production efficiency and technology stability.
Detection unit 12 is arranged on above pallet 21, as shown in Figure 1, in the present embodiment, chamber roof at processing chamber 10 is provided with the medium window 11 that can have an X-rayed, detection unit 12 is arranged on above medium window 11, and it is positioned at the first default test point place, this first test point is when drive unit drives pallet 21 rotates, circular trace 121 is formed accordingly on tray surface, as shown in Figure 2 A, this circular trace 121 is crossed to form two intersection points with each mounting groove 22, the present embodiment rotates to be example counterclockwise with pallet 21, in two intersection points, will be located in the intersection point in front and be called the first intersection point 221；Will be located in the intersection point at rear and be called the second intersection point 222.
Detection unit 12 is for when pallet 21 bearing wafer rotates the anglec of rotation corresponding with each intersection point, detecting the vertical interval between the first test point and each point of intersection of tray surface.The so-called anglec of rotation corresponding with each intersection point, refers to that pallet is positioned at the lower section of the first test point from the rotation of its origin position to one of them intersection point, i.e. when the line between this intersection point and the first test point is perpendicular to tray surface, the anglec of rotation of pallet 21.The anglec of rotation of pallet 21 can obtain in the following ways, it may be assumed that driver element includes motor, and this motor rotates predetermined angle for driving pallet under the control of pulse signal；Further, judge whether pallet 21 rotates to the anglec of rotation corresponding with each intersection point according to the number of pulses of this pulse signal, say, that the corresponding different number of pulses of each intersection point, this number of pulses can obtain by debugging in advance.Certainly, in actual applications, it would however also be possible to employ other modes obtain the anglec of rotation corresponding with each intersection point of pallet.Detection unit 12 can be laser distance sensor, in order to launch optical signal through medium window 11 vertically towards pallet from the first test point, and receive the reflected signal from tray surface, according to this reflected signal, it is possible to obtain the vertical interval between the first test point and each point of intersection of tray surface.
Preferably, above-mentioned default distance threshold can be range higher limit or the Lower Range value of detection unit 12；Meanwhile, when the unloaded rotation of pallet 21, the vertical interval between the first test point and each point of intersection of tray surface is arranged in the intermediate range of the range of detection unit 12.Furtherly, when a part for wafer tilts to stretch out the edge of mounting groove 22, it can cover the intersection point at this place, edge, and the optical signal that now detection unit 12 is launched is radiated on wafer；When wafer does not extend out the edge of this mounting groove 22, the optical signal that now detection unit 12 is launched is radiated at the edge of mounting groove 22.Owing to the reflectance of wafer surface is more than the reflectance of tray surface, therefore, by selecting the detection unit 12 of suitable range, it is possible to when a part for wafer tilts to stretch out the edge of mounting groove 22, make the reading of detection unit 12 reach higher limit or the lower limit of its range；Meanwhile, when wafer does not extend out the edge of this mounting groove 22, the reading of detection unit 12 is made to fluctuate at some intermediate value, such that it is able to realize distinguishing above-mentioned two situations.Such as, if the range of detection unit 12 is 90mm～120mm；When a part for wafer tilts to stretch out the edge of mounting groove 22, the reading of detection unit 12 is 90mm or 120mm；When wafer does not extend out the edge of this mounting groove 22, the reading of detection unit 12 changes within the normal range of upper and lower about the 5mm of 109mm.It should be noted that, in actual applications, when the optical signal that detection unit is launched is radiated on wafer, because the reflectance of wafer surface is bigger, now the actual vertical interval between the first test point and intersection point is often beyond the range of detection unit 12, and not equal to the higher limit of this range or lower limit, in this case, the reading of detection unit 12 can not be equal to actual vertical interval between the first test point and intersection point, but this has no effect on and judges wafer whether scrap (bridge).
Pallet 21 in Fig. 2 A, it rotates counterclockwise, and for being positioned at a mounting groove 22 of pallet 21 rightmost side, pallet 21 rotates counterclockwise, in two intersection points, will be located in the intersection point in front and is called the first intersection point 221；Will be located in the intersection point at rear and be called the second intersection point 222.
When wafer normally puts into above-mentioned mounting groove 22, first test point vertical interval respectively and between the first intersection point 221 and the second intersection point 222 is all recorded as L；When wafer stretches out the edge of mounting groove 22 at the portions incline of the first intersection point 221 side, i.e. when wafer rides over forward on step 23 or tray upper surface, the vertical interval between the first test point and the first intersection point 221 is recorded as H；When wafer stretches out the edge of mounting groove 22 at the portions incline of the second intersection point 222 side, i.e. when wafer rides on step 23 or tray upper surface backward, the vertical interval between the first test point and the second intersection point 222 is recorded as H.Table 1 lists vertical dimension and the wafer corresponding relation with or without scrap (bridge).
Table 1
After utilizing detection unit to detect the vertical interval between the first test point and each point of intersection of tray surface, the range of this vertical interval with detection unit is compared, and inquire about above-mentioned table 1 according to comparative result, to determine wafer in each mounting groove 22 whether scrap (bridge), and can be determined which side scrap (bridge) of wafer in which mounting groove 22.Complete in all mounting grooves 22 after the scrap (bridge) inspection of wafer, it is possible to the scrap (bridge) situation according to each wafer, carry out the examination and maintenance operation in later stage.Such as, if all there is the situation of scrap (bridge) in the wafer in all mounting grooves 22, and scrap (bridge) situation be all rule as one man before take or after take, then need to check the situation whether connector between driver element and pallet exists infringement, and need to reexamine the flatness of pallet.If simply there is the situation of scrap (bridge) in the wafer in indivedual mounting grooves 22, then need to check that number of pulses that the wafer in corresponding mounting groove 22 configures is the need of adjustment, the number of pulses that the mounting groove 22 taken before existing is configured increases, and the number of pulses that the mounting groove 22 taken after existing is configured reduces.The increment of concrete number of pulses or decrement can determine according to practical situation.
It should be noted that in actual applications, after utilizing detection unit to detect the vertical interval between the first test point and each point of intersection of tray surface, it is also possible to utilize the whether scrap (bridge) of the wafer in each mounting groove 22 of control unit automatic decision.Specifically, processing chamber also includes control unit, detection unit is after the vertical interval detected between the first test point and each point of intersection of tray surface, this vertical interval is sent to control unit, this control unit is for judging that whether this vertical dimension is beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of mounting groove at the portions incline of this intersection point side.
In the present embodiment, on the upper surface of pallet 21, and the arranged outside being positioned at mounting groove 22 has initial point mark part 31, as shown in Figure 2 A, this initial point mark part 31 is corresponding with the origin position of pallet 22, and it can be from the recessed breach of tray surface, or for running through the through hole of its thickness.And, above medium window 11, and be positioned at the second default test point place be provided with initial point detection unit 14, this second test point is positioned at the position corresponding with initial point mark part 31 place circumference so that initial point mark part 31 can when pallet rotates through initial point detect unit 14 lower section；Initial point detection unit 14 is for when pallet 32 rotates a circle from its origin position, detect the vertical interval between this second test point and tray surface, that is, the vertical interval of detection initial point mark part 31 institute circumferentially each position, it can be laser distance sensor that initial point detects unit 14.Owing to initial point mark part 31 is from the recessed breach of tray surface, or for running through the through hole of its thickness, this makes the vertical interval between initial point mark part 31 from the second test point different relative to other positions of tray surface, thus, when pallet rotates to the lower section making this initial point mark part 31 be positioned at initial point detection unit 14, initial point detection unit 14 can recognize that this initial point mark part 31, such that it is able to know whether pallet 21 arrives origin position.Concrete recognition method is: detect the second test point and the tray surface vertical interval between initial point mark part in advance；Then make pallet 32 stop after its origin position rotates a circle, again detect the vertical interval between the second test point and tray surface, and whether compare this vertical interval equal to the vertical interval detecting acquisition in advance, if, it is determined that pallet does not skid；If not, it is determined that pallet skids.
Preferably, above-mentioned detection unit 12 is used as to identify the range sensor of this initial point mark part 31, to reduce equipment cost.Specific implementation is: the top view of the another kind of processing chamber that Fig. 3 provides for the embodiment of the present invention.As it is shown on figure 3, be provided above guide rail 13 at pallet 21, this guide rail 13 extends along the radial direction (X-direction as shown in Figure 3) of pallet 21；Detection unit 12 is arranged on guide rail 13, and can move to above-mentioned first test point or the second test point along guide rail 13.
When detecting unit 12 and being positioned at above-mentioned first test point, it can detect the vertical interval between the first test point and each point of intersection of tray surface, to judge wafer in each each mounting groove 22 whether scrap (bridge).When detecting unit 12 and being positioned at above-mentioned second test point, it can work as pallet 21 when its origin position rotates a circle, detects the vertical interval between the second test point and tray surface, to judge to determine whether pallet skids.
In actual applications, processing chamber provided by the invention can also be informed in mechanical hand place wafer process whether " scrap (bridge) " phenomenon occurs.That is, at mechanical hand to after mounting groove film releasing, or before mounting groove takes sheet; all the wafer in each mounting groove can be carried out a scrap (bridge) inspection; to guarantee that mechanical hand can be normally carried out picking and placeing sheet operation, such that it is able to improve the success rate picking and placeing sheet, and then yields can be improved.
In sum, processing chamber provided by the invention, it is possible not only to directly judge that " scrap (bridge) " phenomenon occurs in which side of the wafer in which mounting groove, and whether the process that can be informed in mechanical hand placement wafer " scrap (bridge) " phenomenon occurs.
As another technical scheme, the embodiment of the present invention also provides for a kind of method whether wafer position judged on pallet is abnormal, and it can be applied in the above-mentioned processing chamber that the embodiment of the present invention provides, and comprises the following steps:
First, presetting the first test point above pallet, this first test point is when drive unit drives pallet rotates, and corresponding circular trace on tray surface is crossed to form two intersection points with each mounting groove.
Driving pallet rotates；
When pallet rotates extremely corresponding with each intersection point anglec of rotation, detect the vertical interval between this first test point and each point of intersection of tray surface；
Judge that the vertical dimension corresponding to each intersection point is whether beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
Below a specific embodiment of said method is described in detail.Specifically, the method whether wafer position judging on pallet that Fig. 4 provides for the embodiment of the present invention is abnormal.Refer to Fig. 4, it is judged that the method whether wafer position on pallet is abnormal, comprise the following steps:
S1, current pocketID (sequence number of mounting groove) initial value is set to 1, namely, select one of them mounting groove, set its sequence number as 1, and towards the direction of rotation of pallet, successively the sequence number of each mounting groove on pallet being set as the sum that 2～n, n are mounting groove, the present embodiment adds up to 5 for mounting groove.Easy to understand, often complete the inspection of a mounting groove, then proceed by the inspection of next mounting groove, i.e. pocketID adds 1.
S2, it is judged that whether pocketID is less than or equal to 5, and if so, then flow process enters step S3；If it is not, then flow process terminates, i.e. the equal inspected of all of mounting groove is complete.
S3, the anglec of rotation corresponding with first intersection point of pocketID is rotated at pallet, when now the first intersection point (being positioned at the intersection point on front side of mounting groove in the direction of rotation of pallet) is positioned at the lower section of the first test point, detect and record the vertical interval between this first test point and tray surface the first point of intersection；
S4, the anglec of rotation corresponding with second intersection point of pocketID is rotated at pallet, when now the second intersection point (being positioned at the intersection point on rear side of mounting groove in the direction of rotation of pallet) is positioned at the lower section of the first test point, detect and record the vertical interval between this first test point and tray surface the second point of intersection；
S5, judges that whether two vertical intervals obtained in step S3 and step S4 are beyond the secure threshold preset respectively, and if so, then flow process enters step S6；If it is not, then flow process enters step S7.
S6, it is judged that in step S5, whether the vertical interval beyond secure threshold is the vertical dimension between the first test point and the first intersection point, if it is not, then flow process enters step S7；If so, then flow process enters step S8.
S7, it is determined that wafer stretches out the edge of mounting groove at the portions incline of the first intersection point side, i.e. wafer rides over forward on step or tray upper surface, and sends alarm signal；Then flow process returns step S2.
S8, it is determined that wafer stretches out the edge of mounting groove at the portions incline of the second intersection point side, i.e. wafer rides on step or tray upper surface backward, and sends alarm signal；Then flow process returns step S2.
Preferably, above-mentioned default distance threshold can be range higher limit or the Lower Range value of detection unit；Meanwhile, when pallet zero load rotates, the vertical interval between the first test point and each point of intersection of tray surface is arranged in the intermediate range of the range of detection unit 12, as such, it is possible to the number of degrees of Autonomous test unit directly judge that wafer is with or without scrap (bridge).Such as, if the range of detection unit 12 is 90mm～120mm；When a part for wafer tilts to stretch out the edge of mounting groove 22, the reading of detection unit 12 be 90mm or 120mm when wafer does not extend out the edge of this mounting groove 22, the reading of detection unit 12 changes within the normal range of upper and lower about the 5mm of 109mm.
In sum, the method whether above-mentioned wafer position judged on pallet that the embodiment of the present invention provides is abnormal, it is possible not only to directly judge that " scrap (bridge) " phenomenon occurs in which side of the wafer in which mounting groove, and whether the process that can be informed in mechanical hand placement wafer " scrap (bridge) " phenomenon occurs.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and the illustrative embodiments that adopts, but the invention is not limited in this.For those skilled in the art, without departing from the spirit and substance in the present invention, it is possible to make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a processing chamber, including pallet, is provided with multiple mounting groove for placing wafer on described pallet, and is uniformly distributed along its circumference, it is characterised in that also include driver element and detection unit, wherein,
Described driver element is used for driving described pallet to rotate；
Described detection unit is arranged in the first test point place preset above described pallet, and described first test point is when pallet described in described drive unit drives rotates, and corresponding circular trace on described tray surface is crossed to form two intersection points with each mounting groove；Described detection unit is for when described pallet bearing wafer rotates the anglec of rotation corresponding with each intersection point, detecting the vertical interval between described first test point and each point of intersection of described tray surface；
Judge that the vertical dimension corresponding to each intersection point is whether beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
2. processing chamber according to claim 1, it is characterised in that described distance threshold is range higher limit or the Lower Range value of described detection unit；
When described pallet zero load rotates, the vertical interval between described first test point and each point of intersection of described tray surface is arranged in the intermediate range of the range of described detection unit.
3. processing chamber according to claim 1, it is characterised in that described processing chamber also includes control unit,
Described control unit is for receiving the vertical dimension corresponding to each intersection point sent and come by described detection unit, and judge that whether this vertical dimension is beyond the distance threshold preset, if, then determining the wafer in the mounting groove corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
4. the processing chamber according to Claims 2 or 3, it is characterised in that on described tray upper surface, and the arranged outside being positioned at described mounting groove has initial point mark part, described initial point mark part is corresponding with the origin position of described pallet；Further, being provided above guide rail at described pallet, described guide rail radially extends along described pallet；
Described detection unit is arranged on described guide rail, and can move to described first test point or the second test point along described guide rail；Described second test point is arranged on above described pallet, and is positioned at the position corresponding with described initial point mark part place circumference；Described detection unit is when being positioned at described second test point, for when described pallet rotates a circle from its origin position, detecting the vertical interval between described second test point and described tray surface；
Judge that whether this vertical interval is equal to described second test point and described tray surface vertical interval between described initial point mark part, if, it is determined that described pallet does not skid；If not, it is determined that described pallet skids.
5. the processing chamber according to Claims 2 or 3, it is characterised in that on described tray upper surface, and the arranged outside being positioned at described mounting groove has initial point mark part, described initial point mark part is corresponding with the origin position of described pallet；Further, described processing chamber also includes initial point detection unit, and it is arranged on the second test point place preset above described pallet, and described second test point is positioned at the position corresponding with described initial point mark part place circumference；
Described initial point detection unit is for when described pallet rotates a circle from its origin position, detecting the vertical interval between described second test point and described tray surface；
Judge that whether this vertical interval is equal to described second test point and described tray surface vertical interval between described initial point mark part, if, it is determined that described pallet does not skid；If not, it is determined that described pallet skids.
6. the processing chamber according to Claims 2 or 3, it is characterised in that described initial point mark part is from the recessed breach of described tray surface, or for running through the through hole of its thickness.
7. the processing chamber according to Claims 2 or 3, it is characterised in that described detection unit is laser distance sensor.
8. processing chamber according to claim 1, it is characterised in that described driver element includes motor, described motor rotates predetermined angle for driving described pallet under the control of pulse signal；
Number of pulses according to described pulse signal judges whether described pallet rotates to the anglec of rotation corresponding with each intersection point.
9. judging the method whether wafer position on pallet is abnormal, be provided with multiple mounting groove for placing wafer, and be uniformly distributed along its circumference on described pallet, described mounting groove is used for placing wafer, it is characterised in that comprise the following steps:
Presetting the first test point above described pallet, described first test point is when pallet described in described drive unit drives rotates, and corresponding circular trace on described tray surface is crossed to form two intersection points with each mounting groove；
The pallet carrying wafer is driven to rotate；
When described pallet rotates the anglec of rotation corresponding with each intersection point, detect the vertical interval between described first test point and each point of intersection of described tray surface；
Judge that the vertical dimension corresponding to each intersection point is whether beyond the distance threshold preset, if, it is determined that wafer mounting groove in corresponding with this intersection point, it stretches out the edge of described mounting groove at the portions incline of this intersection point side.
10. the method that whether wafer position judged on pallet according to claim 9 is abnormal, it is characterised in that described distance threshold is range higher limit or the Lower Range value of described detection unit；
When described pallet zero load rotates, the vertical interval between described first test point and each point of intersection of described tray surface is arranged in the intermediate range of the range of described detection unit.
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| CN115332136A (en) * | 2022-10-12 | 2022-11-11 | 芯三代半导体科技(苏州)有限公司 | Transmission device for wafer and tray combination and control method |
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