CN111668131A - System and method for detecting position deviation of mechanical arm and wafer - Google Patents
System and method for detecting position deviation of mechanical arm and wafer Download PDFInfo
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- CN111668131A CN111668131A CN201910163818.8A CN201910163818A CN111668131A CN 111668131 A CN111668131 A CN 111668131A CN 201910163818 A CN201910163818 A CN 201910163818A CN 111668131 A CN111668131 A CN 111668131A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
A mechanical arm and a wafer position deviation detection system and a detection method are provided, wherein the mechanical arm comprises a base part, a first supporting arm and a second supporting arm which are connected with the base part, and the first supporting arm and the second supporting arm are oppositely arranged; a light source located on the first support arm and adapted to emit detection light in the direction of the second support arm; the light sensing unit is positioned on the second supporting arm and is suitable for receiving detection light; and the driving device is connected with the light source and is suitable for driving the light source to move or rotate. The robot arm can detect whether the position of the wafer transferred into the wafer storage device or on the wafer carrier is deviated or not.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a system and a method for detecting the position offset of a mechanical arm and a wafer.
Background
Semiconductor manufacturing processes are performed by semiconductor equipment, which typically includes various chambers, such as pre-load chambers, transfer chambers, process chambers, arranged in clusters, in-line, or a combination of clusters and in-line, to process a single wafer or a batch of wafers. During processing, wafers are transferred between chambers, such as by a robot transferring the wafers from a pre-load chamber to a process chamber for a process.
Wafer carriers are typically provided in the various chambers of the semiconductor equipment for holding and securing wafers, which are typically packaged in cassettes for processing. When a certain process is performed, a wafer cassette is usually placed on a wafer cassette carrying platform of a semiconductor device, then a robot arm is used for taking out a wafer from the wafer cassette and transferring the wafer to each chamber, and after the relevant process is completed, the robot arm is also used for transferring the processed wafer back to the wafer cassette.
When the robot arm transfers the wafer back to the wafer box or transfers the wafer to the wafer carrying platform in each chamber, the problem that the wafer position is deviated occurs, and no simple and effective means for detecting whether the wafer position is deviated exists currently.
Disclosure of Invention
The invention aims to solve the technical problem of how to simply and effectively detect whether the wafer position has deviation.
The invention provides a mechanical arm, comprising:
a base;
the first supporting arm and the second supporting arm are connected with the base and are arranged oppositely;
a light source on the first support arm adapted to emit detection light in the direction of the second support arm;
the light sensing unit is positioned on the second supporting arm and is suitable for receiving the detection light;
and the driving device is connected with the light source and is suitable for driving the light source to move or rotate.
Optionally, when no wafer exists in the wafer storage device or on the wafer carrying platform, the robot arm is configured to transfer the wafer into the wafer storage device or on the wafer carrying platform; when a wafer to be transferred exists in the wafer storage device or on the wafer carrying platform, the mechanical arm is used for detecting whether the position of the wafer placed in the wafer storage device or on the wafer carrying platform is deviated or not.
Optionally, the process of the robot arm detecting whether there is a deviation in the position of the wafer placed in the wafer storage device or on the wafer stage includes: moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light, and when the light sensing unit cannot receive the detection light, the wafer storage device or the wafer carrying platform is judged to have the wafer; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; and comparing the moving distance or the rotating angle of the light source with the corresponding standard value, and if the moving distance or the rotating angle is larger than or smaller than the corresponding standard value, the wafer has deviation in the wafer storage device or on the wafer carrying platform.
Optionally, the moving distance is a linear distance between the initial position and the stop position, and the standard value is a linear distance value.
Optionally, the rotation angle is an angle between an initial position and a stop position, and the standard value is an angle value.
Optionally, the light source on the first support arm and the light sensing unit on the second support arm are arranged in parallel or in a certain angle.
Optionally, the driving device includes a motor and an encoder, the motor provides moving or rotating power for the light source, and the encoder is used for obtaining a moving distance or a rotating angle of the light source.
Optionally, the method further includes: and the judging unit is suitable for comparing the moving distance or the rotating angle of the light source with the corresponding standard value, and if the moving distance or the rotating angle is larger or smaller than the corresponding standard value, judging that the wafer has deviation in the wafer storage device or on the wafer carrying platform.
Optionally, the robot arm is further configured to detect whether a wafer exists on the robot arm, and a process of the robot arm for detecting whether a wafer exists on the robot arm includes: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the wafer to be transmitted on the mechanical arm is judged.
Optionally, the robot arm is further configured to count the number of wafers in the wafer storage device or determine whether there is a bevel or a lamination in the wafer storage device, and the process of the robot arm being configured to count the number of wafers in the wafer storage device or determine whether there is a bevel or a lamination in the wafer storage device includes: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; counting the number of wafers in a wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
The invention also provides a method for detecting the wafer position offset by adopting the mechanical arm, which comprises the following steps:
moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; and comparing the moving distance or the rotating angle of the light source with a corresponding standard value, and if the moving distance or the rotating angle of the light source is larger than or smaller than the corresponding standard value, the wafer has deviation in a wafer storage device or on a wafer carrying platform.
Optionally, the moving distance is a linear distance between the initial position and the stop position, and the standard value is a linear distance value.
Optionally, the rotation angle is an angle between an initial position and a stop position, and the standard value is an angle value.
Optionally, the robot arm is further configured to detect whether a wafer exists on the robot arm, and a process of the robot arm for detecting whether a wafer exists on the robot arm includes: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the wafer to be transmitted on the mechanical arm is judged.
Optionally, the robot arm is further configured to count the number of wafers in the wafer storage device or determine whether there is a bevel or a lamination in the wafer storage device, and the process of the robot arm being configured to count the number of wafers in the wafer storage device or determine whether there is a bevel or a lamination in the wafer storage device includes: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; determining the number of wafers in the wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
The invention also provides a wafer position deviation detection system, comprising:
the wafer storage device or the wafer carrying platform is provided with a wafer;
the robot arm of any one of the preceding claims, wherein the robot arm is adapted to detect whether there is a deviation in the position of a wafer placed in the wafer storage device or on the wafer stage;
and the alarm unit gives alarm information when the wafer position deviates.
The invention also provides a method for detecting the wafer position offset by adopting the wafer position offset detection system, which comprises the following steps:
moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; comparing the moving distance or the rotating angle of the light source with corresponding standard values, and if the moving distance or the rotating angle is larger than or smaller than the corresponding standard values, the wafer has deviation in a wafer storage device or on a wafer carrying platform; and when the wafer position has deviation, giving alarm information.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the mechanical arm comprises a base part, a first supporting arm and a second supporting arm, wherein the first supporting arm and the second supporting arm are connected with the base part and are oppositely arranged; the light source is positioned on the first support arm and is suitable for emitting detection light to the direction of the second support arm; the light sensing unit is positioned on the second supporting arm and is suitable for receiving detection light; the driving device is connected with the light source and is suitable for driving the light source to move or rotate, when the wafer is transmitted to a wafer in the wafer storage device or on the wafer carrying platform, whether the position of the wafer placed in the wafer storage device or on the wafer carrying platform is deviated or not can be detected through the matching of all parts of the mechanical arm, and therefore the mechanical arm not only can be used for transmitting the wafer, but also can be used for simply and effectively detecting whether the position of the wafer placed in the wafer storage device is deviated or not, and can also be used for simply and effectively detecting whether the position of the wafer placed on the wafer carrying platform is deviated or not, and the functions of the mechanical arm are more comprehensive.
Further, the process of the robot arm for detecting whether there is a deviation in the position of the wafer placed in the wafer storage device or on the wafer stage includes: moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light, and when the light sensing unit cannot receive the detection light, the wafer storage device or the wafer carrying platform is judged to have the wafer; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; the moving distance or the rotating angle of the light source is compared with the corresponding standard value, if the moving distance or the rotating angle is larger than or smaller than the corresponding standard value, the wafer has deviation in the wafer storage device or on the wafer carrying platform, and whether the wafer transmitted to the wafer storage device or the wafer carrying platform has the deviation in position or not can be detected quickly and simply through the process. In addition, the wafer offset position can be detected in a mode of moving the light source or rotating the light source.
Further, the robot arm may be configured to detect whether there is a shift in the position of the transferred wafer, and the robot arm may be configured to detect whether there is a wafer on the robot arm, or detect the number of wafers in the wafer storage device and whether there is a bevel or a lamination in the wafer storage device, so that the robot arm has more comprehensive functions.
The method for detecting the wafer offset position can simply and effectively detect whether the wafer position in the wafer storage device or on the wafer carrying platform has offset or not.
The wafer offset position detection system can detect whether the position of the transmitted wafer has offset or not, can give alarm information, and can stop the semiconductor equipment for maintenance or repair when equipment personnel see the alarm information so as to find out the reason for bringing the wafer offset and recover the wafer offset.
The method for detecting the wafer offset position can simply and effectively detect whether the wafer position in the wafer storage device or on the wafer carrying platform has offset or not, and gives corresponding alarm information when the offset exists, so that equipment personnel can repair or maintain the mechanical arm or the wafer storage device, the wafer carrying platform and the like in time.
Drawings
FIG. 1 is a schematic view of a robot according to an embodiment of the present invention;
FIGS. 2-4 are schematic structural views illustrating a robot determining whether there is a deviation in the position of a wafer being transferred according to an embodiment of the present invention;
FIG. 5 is a schematic view of a robot according to another embodiment of the present invention;
FIG. 6 is a schematic view of a robot according to another embodiment of the present invention;
fig. 7 is a schematic structural diagram of a wafer offset position detection system according to an embodiment of the invention.
Detailed Description
As mentioned in the background, when the robot arm transfers the chips back to the wafer cassette or transfers the wafers to the wafer stage in each chamber, there is a problem that the wafer position is shifted, and there is no effective and simple means for detecting whether the wafer transfer is shifted.
Research finds that in the operation process of semiconductor equipment, due to factors such as aging of parts of a mechanical arm and a wafer carrier or loosening of parts and other influences on wafer transmission factors, when the mechanical arm transmits a wafer onto the wafer carrier or into a wafer box, the position of the wafer can deviate, and the wafer is easy to break and the process fails to cause wafer rejection due to the deviation of the wafer position. There is no effective and simple means for detecting whether the wafer is shifted after being transferred.
The invention provides a mechanical arm and a wafer offset position detection system, wherein the mechanical arm comprises a base part, a first supporting arm and a second supporting arm, wherein the first supporting arm and the second supporting arm are connected with the base part and are oppositely arranged; a light source located on the first support arm and adapted to emit detection light in the direction of the second support arm; the light sensing unit is positioned on the second supporting arm and is suitable for receiving detection light; and the driving device is connected with the light source and is suitable for driving the light source to move or rotate. When the wafer is transferred to the wafer in the wafer storage device or on the wafer carrying platform, whether the position of the wafer placed in the wafer storage device or on the wafer carrying platform is deviated or not can be detected through the matching of all the parts of the mechanical arm, so that one mechanical arm can be used for not only transferring the wafer, but also simply and effectively detecting whether the position of the wafer placed in the wafer storage device is deviated or not, and further simply and effectively detecting whether the position of the wafer placed on the wafer carrying platform is deviated or not, so that the functions of the mechanical arm are more comprehensive.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In describing the embodiments of the present invention in detail, the drawings are not to be considered as being enlarged partially in accordance with the general scale, and the drawings are only examples, which should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Fig. 1 is a schematic structural diagram of a robot according to an embodiment of the present invention.
Referring to fig. 1, the robot 220 of the present embodiment includes:
the base 200 is provided with a first supporting arm 201 and a second supporting arm 202 which are connected with the base 200, wherein the first supporting arm 201 and the second supporting arm 202 are oppositely arranged;
a light source 203 on the first support arm 201 adapted to emit detection light 211 in the direction of the second support arm 202;
a light sensing unit 204 positioned on the second support arm 202 and adapted to receive the detection light 211;
and the driving device 206 is connected with the light source 203 and is suitable for driving the light source 203 to move.
Specifically, the first support arm 201 and the second support arm 202 extend from two sides of the base 200 to form a "Y" shaped structure.
The first support arm 201, the second support arm 202, and the base 200 may be formed integrally with each other, or may be separate members, and the first support arm 201, the second support arm 202, and the base 200 may be fixed to each other by a conventional fixing method.
The first support arm 201, the second support arm 202 and the base 200 together form a structure suitable for supporting a wafer, in one embodiment, the wafer is disposed on the surfaces of the first support arm 201, the second support arm 202 and the base 200, and the first support arm 201, the second support arm 202 and the base 200 may be respectively provided with a chuck for sucking the wafer.
In other embodiments, the wafer is placed in the space surrounded by the first support arm 201, the second support arm 202 and the base 200, and the edges of the first support arm 201, the second support arm 202 and the base 200 are provided with a plurality of cards, and the cards are suitable for placing and supporting the wafer.
The space surrounded by the first support arm 201, the second support arm 202 and the base 200 also enables the wafer to be detected to be partially positioned in the accommodating cavity to block the detection light when the position detection of the wafer to be transmitted or the detection of the number of the wafers are carried out.
The light source 203 is located on the first support arm 201, the light source 203 is adapted to emit detection light 211 towards the second support arm 202, the light sensing unit 204 is located on the second support arm 202, the light sensing unit 204 is adapted to receive the detection light 211 and generate an electrical signal, and the light source 203 and the light sensing unit 204 are oppositely arranged on the first support arm 201 and the second support arm 202.
In this embodiment, the light source 203 on the first support arm 201 and the light sensing unit 204 on the second support arm 202 are disposed in parallel and opposite to each other. In another embodiment, referring to fig. 5, the light source 203 of the first support arm 201 and the light sensing unit 204 of the second support arm 202 are disposed at a certain angle.
Referring to fig. 1, in an embodiment, the detecting light 211 emitted by the light source 203 is a laser, and the light sensing unit 204 is a laser sensing unit.
The robotic arm further comprises: and the driving device 206 is connected with the light source 203 and is suitable for driving the light source 203 to move so as to detect whether the position of the conveyed wafer has deviation.
In this embodiment, the driving device 206 drives the light source 203 to move in a direction parallel to the photo sensing unit 201. In other embodiments, when the light source 203 of the first support arm 201 is disposed at an angle relative to the light sensing unit 204 of the second support arm 202, the driving unit 206 drives the light source 203 to move at an angle relative to the light sensing unit 201.
In one embodiment, the driving device 206 includes a motor connected to the light source 203, the motor providing power for the light source to move, and an encoder connected to the motor, the encoder being used for obtaining the moving distance of the light source 206.
The length of the photo sensing unit 204 may be greater than or equal to the moving distance of the light source 203 in the direction parallel to the photo sensing unit 204, so that when the light source 203 moves, the detection light emitted by the light source can be received by the photo sensing unit 204 when the light source is not blocked by the wafer during the detection of the wafer whether there is a position deviation.
In this embodiment, the robot arm 220 is configured to transfer the wafer into the wafer storage device or onto the wafer stage, and when the wafer is transferred into the wafer storage device or onto the wafer stage, the robot arm is configured to detect whether the position of the wafer placed in the wafer storage device or onto the wafer stage has a deviation, so that one robot arm 220 can be used to transfer the wafer, and can also be used to simply and effectively detect whether the position of the wafer placed in the wafer storage device has a deviation, and can also be used to simply and effectively detect whether the position of the wafer placed on the wafer stage has a deviation, so that the function of the robot arm is more comprehensive.
In one embodiment, the wafer storage device comprises a wafer box, and a plurality of wafers can be placed on the wafer box at intervals up and down. The wafer carrying platform comprises a wafer sucking disc, and the wafer sucking disc can fix and suck a wafer.
The process of detecting whether there is a deviation in the position of the wafer placed on the wafer stage or in the wafer storage device by the robot 220 includes, referring to fig. 2-4.
Referring to fig. 2, before performing the detection, the robot 220 does not have a wafer, the wafer 21 is on the wafer storage device or the wafer stage (not shown), the robot 220 is at the initial position, and the distance between the robot 200 and the wafer storage device or the wafer stage is fixed.
Referring to fig. 3, when the robot arm 220 moves a predetermined distance (the predetermined distance is a position to which the robot arm needs to move when the robot arm detects a positional deviation when there is no positional deviation of a wafer transferred into the wafer storage device or on the wafer stage and when there is no error in the transfer and movement positions of the wafer, the robot arm 220 is positioned at an initial position to emit the detection light 211, the wafer 21 placed in the wafer storage device or on the wafer stage blocks the detection light 211, and the light sensing unit 204 does not receive the detection light and determines that the wafer is present in the wafer storage device or on the wafer stage.
The photo sensing unit 204 generates an electrical signal with a level change from when the sensing light is received to when the sensing light is not received, and determines whether the wafer is sensed or not by the level change. In one embodiment, the electrical signal generated by the photo sensing unit 204 is a high level signal when receiving the detection light, and the electrical signal generated by the photo sensing unit 204 changes from a high level signal to a low level signal when not receiving the detection light.
Referring to fig. 4, the driving device 206 then drives the light source 203 to move away from the wafer 21 until the light sensing unit 204 receives the detection light 211, so as to obtain a stop position of the light source 203; obtaining the moving distance D of the light source 203 according to the initial position and the stop position; the moving distance D of the light source is compared with the standard value, and if the moving distance is greater than or less than the corresponding standard value, the wafer 21 is deviated in the wafer storage device or on the wafer stage.
The standard value is a moving distance of the light source 203 when the robot detects whether the wafer is shifted when the wafer is transferred to the wafer storage device or the wafer on the wafer stage without a positional shift and when the robot does not have a transfer and moving position error. Therefore, when the position of the wafer 21 is shifted, the moving distance D of the light source 203 is necessarily deviated from the standard value during the detection.
In one embodiment, the standard value may be a specific value or a range value having fluctuation.
In an embodiment, the robot arm may further include: and the judging unit is suitable for comparing the moving distance of the light source 203 with the standard value, and if the moving distance is greater than or less than the corresponding standard value, judging that the wafer has deviation in the wafer storage device or on the wafer carrying platform. The robot arm may further include a control unit to control whether the positions of the components of the robot arm on the wafer to be transferred are offset or not to perform corresponding actions, such as controlling the movement of the robot arm, the time when the light source emits the detection light, and the time when the driving device starts to drive the light source and stops driving.
In this embodiment, the robot 200 may be configured to detect whether there is a positional deviation of the transferred wafer, and the robot 200 may also be configured to detect whether there is a wafer on the robot, or detect the number of wafers in the wafer storage device and whether there is a bevel or a lamination in the wafer storage device, so that the robot functions more comprehensively.
In one embodiment, the process of the robot 220 for detecting whether a wafer is present on the robot includes: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the mechanical arm is judged and transmitted to the wafer.
In another embodiment, the process of the robot 220 counting the number of wafers in the wafer storage device or determining whether there is a bevel or a lamination in the wafer storage device includes: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; determining the number of wafers in the wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
When the light sensing unit receives corresponding detection light in the process that the mechanical arm moves along the direction vertical to the surface of the wafer, the wafer does not exist between the light source and the light sensing unit; when the photo-sensing unit does not receive the corresponding detection light, it indicates that a wafer exists between the light source and the photo-sensing unit. When the width of the wave trough in the wave of the electric signal is larger than a preset width threshold value when the electric signal is generated, the wafer storage device is judged to have the inclined sheet or the laminated sheet.
Fig. 6 is a schematic structural diagram of a robot according to yet another embodiment of the present invention. It should be noted that other definitions or descriptions of the same or similar structures in this embodiment as those in the foregoing embodiment are not repeated in this embodiment, and specific reference is made to the definitions or descriptions of corresponding parts in the foregoing embodiment.
Referring to fig. 6, the robot arm 220 includes:
the base 200 is provided with a first supporting arm 201 and a second supporting arm 202 which are connected with the base 200, wherein the first supporting arm 201 and the second supporting arm 202 are oppositely arranged;
a light source 203 on the first support arm 201 adapted to emit detection light 211 in the direction of the second support arm 202;
a light sensing unit 204 positioned on the second support arm 202 and adapted to receive the detection light 211;
and the driving device 206 is connected with the light source 203 and is suitable for driving the light source 203 to rotate.
Specifically, when the light source 203 on the first support arm 201 rotates, the detection light 211 emitted by the light source 203 also rotates correspondingly, and the light sensing unit 204 receives the corresponding detection light.
The process of detecting whether there is a deviation in the position of the wafer placed on the wafer stage or in the wafer storage device by the robot 220 includes: before the detection, the wafer does not exist on the robot 220, the wafer 21 is on the wafer storage device or the wafer stage (not shown in the figure), the robot 220 is located at the initial position, and the robot 200 has a fixed distance from the wafer storage device or the wafer stage; when the robot arm 220 moves a preset distance (the preset distance is a position to which the robot arm needs to move when the robot arm detects the position deviation) to the wafer storage device or the wafer stage, the wafer is not transferred to the wafer storage device or the wafer stage, and the transfer and movement position errors do not exist, the light source 203 is located at the initial position to emit the detection light 211, the wafer 21 placed on the wafer storage device or the wafer stage blocks the detection light 211, and the light sensing unit 204 cannot receive the detection light and judges that the wafer exists in the wafer storage device or the wafer stage.
The driving device 206 drives the light source 203 to rotate in a direction away from the wafer 21 until the light sensing unit 204 receives the detection light 211, and a stop position of the light source 203 is obtained; obtaining the rotation angle of the light source 203 according to the initial position and the stop position; the rotation angle of the light source 203 is compared with a standard value, and if the rotation angle is greater than or less than the corresponding standard value, the wafer 21 is deviated in the wafer storage device or on the wafer stage.
The standard value is an angle by which the light source 203 rotates when the robot detects whether the wafer is offset when the wafer is transferred to the wafer storage device or the wafer on the wafer stage without position offset and when the robot does not have errors in transfer and movement positions. Therefore, when the wafer 21 is shifted in position, the rotation angle of the light source 203 is necessarily deviated from the standard value during the detection.
In one embodiment, the standard value may be a specific value or a range value having fluctuation.
In one embodiment, the driving device 206 includes a motor connected to the light source 203, the motor providing power for the light source to rotate, and an encoder connected to the motor, the encoder being used for obtaining the rotation angle of the light source 206.
In an embodiment, the robot arm may further include: and the judging unit is suitable for comparing the rotation angle of the light source 203 with a standard value, and if the rotation angle is larger than or smaller than the corresponding standard value, judging that the wafer has deviation in the wafer storage device or on the wafer carrying platform. The robot arm may further include a control unit to control whether the positions of the components of the robot arm on the wafer to be transferred are offset or not to perform corresponding actions, such as controlling the movement of the robot arm, the time when the light source emits the detection light, and the time when the driving device starts to drive the light source and stops driving.
Another embodiment of the present invention further provides a method for detecting a wafer position offset by using the robot arm, including:
moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; and comparing the moving distance or the rotating angle of the light source with the corresponding standard value, and if the moving distance or the rotating angle of the light source is larger than or smaller than the corresponding standard value, the wafer has deviation in the wafer storage device or on the wafer carrying platform.
Specifically, the moving distance is a linear distance between an initial position and a stop position, and the standard value is a linear distance value. The rotation angle is an angle between an initial position and a stop position, and the standard value is an angle value.
In an embodiment, the robot arm is further configured to detect whether a wafer exists on the robot arm, and the process of the robot arm detecting whether a wafer exists on the robot arm includes: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the wafer to be transmitted on the mechanical arm is judged.
In another embodiment, the robot is further configured to count the number of wafers in the wafer storage device or determine whether there is a bevel or a lamination in the wafer storage device, and the process of counting the number of wafers in the wafer storage device or determining whether there is a bevel or a lamination in the wafer storage device by the robot includes: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; determining the number of wafers in the wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
Fig. 7 is a schematic structural diagram of a wafer offset position detection system according to an embodiment of the invention. It should be noted that, the definition or description of the same or similar structure in this embodiment as that in the foregoing embodiment is not repeated in this embodiment, and specific reference is made to the definition or description of the corresponding part in the foregoing embodiment.
Referring to fig. 7, the wafer offset position detection system includes:
a wafer storage device or a wafer stage 221, wherein a wafer is placed in the wafer storage device or on the wafer stage 221;
the robot 220 is adapted to detect whether there is a deviation in the position of a wafer placed on the wafer stage 221 or in the wafer storage device by the robot 220;
and an alarm unit 222 for giving alarm information when the wafer position has a deviation.
Through the wafer offset position detection system in the embodiment, whether the position of the transmitted wafer has offset or not can be detected, alarm information can be given, and equipment personnel can stop the semiconductor equipment to repair or maintain when seeing the alarm information so as to find out the reason for bringing the wafer offset and restore the wafer offset.
Another embodiment of the present invention further provides a method for detecting a wafer position offset by using the wafer position offset detection system, including: moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; comparing the moving distance or the rotating angle of the light source with corresponding standard values, and if the moving distance or the rotating angle is larger than or smaller than the corresponding standard values, the wafer has deviation in a wafer storage device or on a wafer carrying platform; and when the wafer position has deviation, giving alarm information.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (17)
1. A robot arm, comprising:
a base;
the first supporting arm and the second supporting arm are connected with the base and are arranged oppositely;
a light source on the first support arm adapted to emit detection light in the direction of the second support arm;
the light sensing unit is positioned on the second supporting arm and is suitable for receiving the detection light;
and the driving device is connected with the light source and is suitable for driving the light source to move or rotate.
2. The robot of claim 1, wherein the robot is configured to transfer the wafer into the wafer storage device or onto the wafer stage when the wafer is not present in the wafer storage device or on the wafer stage; when a wafer to be transferred exists in the wafer storage device or on the wafer carrying platform, the mechanical arm is used for detecting whether the position of the wafer placed in the wafer storage device or on the wafer carrying platform is deviated or not.
3. The robot of claim 2, wherein the process for detecting whether there is a deviation in the position of a wafer placed on the wafer stage or in the wafer storage device comprises: moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light, and when the light sensing unit cannot receive the detection light, the wafer storage device or the wafer carrying platform is judged to have the wafer; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source; obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; and comparing the moving distance or the rotating angle of the light source with the corresponding standard value, and if the moving distance or the rotating angle is larger than or smaller than the corresponding standard value, the wafer has deviation in the wafer storage device or on the wafer carrying platform.
4. The robot arm as set forth in claim 3, wherein said moving distance is a straight distance between an initial position and a stop position, and said standard value is a straight distance value.
5. A robot arm as claimed in claim 3, wherein said rotation angle is an angle between an initial position and a stop position, and said standard value is an angle value.
6. The robot arm of claim 1, wherein the light source of the first support arm is disposed parallel to or at an angle relative to the light sensing unit of the second support arm.
7. The robot arm as claimed in claim 3, wherein the driving means comprises a motor for providing power to move or rotate the light source and an encoder for obtaining a moving distance or a rotating angle of the light source.
8. The robotic arm of claim 3, further comprising: and the judging unit is suitable for comparing the moving distance or the rotating angle of the light source with the corresponding standard value, and if the moving distance or the rotating angle is larger or smaller than the corresponding standard value, judging that the wafer has deviation in the wafer storage device or on the wafer carrying platform.
9. The robot of claim 2, wherein the robot is further configured to detect the presence of a wafer on the robot, and wherein the process of the robot being configured to detect the presence of a wafer on the robot comprises: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the wafer to be transmitted on the mechanical arm is judged.
10. The robot arm of claim 2, wherein the robot arm is further configured to count the number of wafers in the wafer storage device or determine whether a bevel or a lamination exists in the wafer storage device, and wherein the process of counting the number of wafers in the wafer storage device or determining whether a bevel or a lamination exists in the wafer storage device comprises: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; counting the number of wafers in a wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
11. A method for detecting wafer position deviation by using the robot arm of any of claims 1-10, comprising:
moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source;
obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; and comparing the moving distance or the rotating angle of the light source with a corresponding standard value, and if the moving distance or the rotating angle of the light source is larger than or smaller than the corresponding standard value, the wafer has deviation in a wafer storage device or on a wafer carrying platform.
12. The wafer position deviation detecting method as claimed in claim 11, wherein the moving distance is a linear distance between the initial position and the stop position, and the standard value is a linear distance value.
13. The wafer position deviation detecting method as claimed in claim 11, wherein the rotation angle is an angle between an initial position and a stop position, and the standard value is an angle value.
14. The method as claimed in claim 11, wherein the robot is further configured to detect whether a wafer is present on the robot, and the process of the robot detecting whether a wafer is present on the robot comprises: the light source moves to a preset position to emit detection light, and when the light sensing unit does not receive corresponding detection light, the existence of the wafer to be transmitted on the mechanical arm is judged.
15. The method as claimed in claim 11, wherein the robot arm is further configured to count the number of wafers in the wafer storage device or determine whether there are slices or laminations in the wafer storage device, and the process of the robot arm being configured to count the number of wafers in the wafer storage device or determine whether there are slices or laminations in the wafer storage device comprises: moving the mechanical arm to the wafer storage device, so that the first supporting arm and the second supporting arm are positioned on two sides of the wafer in the wafer storage device; the light source moves to a preset position to emit detection light, and the mechanical arm moves along the direction vertical to the surface of the wafer; when the light sensing unit receives corresponding detection light, an electric signal is generated; acquiring an electric signal wave generated according to the electric signal; determining the number of wafers in the wafer storage device according to the number of wave crests or wave troughs in the electric signal waves; and judging whether the wafer storage device has inclined sheets or laminated sheets or not according to the width of the wave trough in the electric signal wave.
16. A wafer position displacement detection system, comprising:
the wafer storage device or the wafer carrying platform is provided with a wafer; the robot of any of claims 1-10, adapted to detect whether there is an offset in the position of a wafer placed in the wafer storage device or on the wafer stage;
and the alarm unit gives alarm information when the wafer position deviates.
17. A method for detecting wafer position deviation by using the wafer position deviation detecting system of claim 16, comprising:
moving the mechanical arm to a wafer storage device or a wafer carrying platform by a preset distance; the light source is positioned at an initial position to emit detection light; when the light sensing unit cannot receive the detection light, judging that the wafer exists in the wafer storage device or on the wafer carrying platform; the driving device drives the light source to move or rotate in a direction away from the wafer until the light sensing unit receives the detection light to obtain a stop position of the light source;
obtaining the moving distance or the rotating angle of the light source according to the initial position and the stop position; comparing the moving distance or the rotating angle of the light source with corresponding standard values, and if the moving distance or the rotating angle is larger than or smaller than the corresponding standard values, the wafer has deviation in a wafer storage device or on a wafer carrying platform; and when the wafer position has deviation, giving alarm information.
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| CN201910163818.8A CN111668131A (en) | 2019-03-05 | 2019-03-05 | System and method for detecting position deviation of mechanical arm and wafer |
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| CN201910163818.8A CN111668131A (en) | 2019-03-05 | 2019-03-05 | System and method for detecting position deviation of mechanical arm and wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114220748A (en) * | 2022-02-23 | 2022-03-22 | 杭州众硅电子科技有限公司 | Dynamic detection device and chemical mechanical planarization equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114220748A (en) * | 2022-02-23 | 2022-03-22 | 杭州众硅电子科技有限公司 | Dynamic detection device and chemical mechanical planarization equipment |
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