JP5689096B2 - Substrate transfer apparatus, substrate transfer method, and substrate transfer storage medium - Google Patents

Description

  The present invention relates to a substrate transfer apparatus, a substrate transfer method, and a substrate transfer storage medium for transferring a substrate from one processing module to another processing module.

  In the manufacturing process of semiconductor devices and LCD substrates, a plurality of modules for processing the substrate are provided in the apparatus, and the substrate is sequentially transported to these modules by the substrate transport device, resist film formation, exposure, and developer supply Etc. are performed. Here, in the substrate transfer apparatus, a transfer arm that holds a substrate is provided so as to be movable forward and backward along the base, and the base is provided so as to be movable in the vertical direction.

  The substrate transfer step includes a step of receiving a substrate from one processing module and a step of transferring the substrate to another processing module. Here, in the step of receiving the substrate from one processing module, by raising the transfer arm from below the substrate placed on the push-up pin provided in the one processing module to the upper side of the push-up pin, The substrate is held on the transfer arm. At this time, the position of the transport arm with respect to the push-up pin is adjusted so that the substrate is held at the center of the fork provided at the tip of the transport arm and horizontally with respect to the fork.

  If the substrate is not held at the center of the fork or is transported in a state where the substrate is not level with respect to the fork, the substrate may be damaged, dropped, or defective due to scratches. In order to prevent such defects, the relative position between the transfer arm and the substrate is monitored in transferring the substrate.

  As a method of monitoring the relative position between the transfer arm and the substrate, a method of detecting the number of pulses of a motor signal for driving the drive unit of the transfer arm in the vertical direction is known. As for the number of pulses of the motor signal, the same number of pulses is detected when the driving unit of the transport arm is normally driven. Therefore, when the number of pulses of the motor signal is different, the timing and height when holding the substrate with the transfer arm is considered to be different from the normal time, the substrate is not held at the center of the fork, or It can be determined that the posture of the wafer when holding the so-called substrate which is not held horizontally with respect to the fork is not stable.

  Even if the number of pulses of the motor signal is normal, the posture of the wafer held by the fork is not stable when the fork is inclined with respect to the vertical direction or when the fork is bent. As a substrate transfer device for detecting such substrate placement deviation, a strain sensor detects the amount of strain of each holding claw when a load is applied to a plurality of holding claws, thereby removing the substrate from the substrate placement unit. There is known a substrate transfer device that detects whether or not the posture of the substrate is abnormal when it is received (see, for example, Patent Document 1). According to this substrate transport apparatus, whether or not the posture of the substrate is abnormal is determined based on whether or not the strain amount of the strain sensor provided on each holding claw exceeds a certain threshold value.

  If the strain amount of any one of the strain sensors does not exceed a certain threshold value, it is determined that the substrate posture is abnormal because the substrate is not evenly placed on all the holding claws. At this time, the operator can correct the positional deviation of the substrate by selecting the correction mode. The correction of the positional deviation of the substrate is performed by moving the fork a small number of times in the forward / backward direction.

JP2011-161521 (Claims, paragraph numbers 0075 and 0076, FIG. 6).

  However, in the substrate transfer apparatus described in Patent Document 1, when the substrate posture is abnormal, the fork is prohibited from moving, and thereafter, a correction mode for correcting the displacement of the substrate is executed according to the operator's judgment. Therefore, productivity is reduced as compared with the transfer substrate apparatus that automatically corrects the positional deviation of the substrate under self-diagnosis.

  The present invention has been made in view of the above circumstances. When the positional deviation of the substrate is large, the conveyance is stopped to prevent the generation of defective products. When the positional deviation of the substrate is not so large, It is an object of the present invention to provide a substrate transport apparatus, a substrate transport method, and a storage medium that improve productivity by automatically correcting a positional deviation of the substrate under diagnosis.

In order to solve the above-mentioned problem, a substrate transfer apparatus according to claim 1 is a substrate transfer apparatus that is driven to move vertically and horizontally by a drive unit, and transfers a substrate from one processing module to another processing module. A suction hole for projecting inwardly from the inner edge of the holding frame provided so as to surround the periphery of the substrate, and spaced from each other along the inner edge, for sucking and holding the substrate A transport arm having a plurality of holding units, a vacuum sensor for detecting the timing of suction to the suction hole, and a position detection means for detecting the position of the transport arm based on a position signal from the drive unit, When the amount of displacement of the position of the transfer arm exceeds a first allowable range set in advance to stop the driving of the drive unit, the transfer of the substrate is stopped. Stop determination means for determining that the substrate should be transported when the amount of deviation in the suction timing exceeds a second allowable range set in advance as the drive of the drive unit should be stopped. When the deviation amount of the suction timing is within the second allowable range but exceeds the third allowable range set in advance as the position of the transfer arm should be corrected. Determines that the position of the substrate should be corrected, and if the amount of deviation in the suction timing is within the third allowable range, the substrate is transported without correcting the position of the substrate. A suction judgment unit for judging that the driving unit should be stopped, and a stop for transmitting a signal for stopping the driving of the driving unit to the driving unit when the stop judgment unit or the suction judgment unit judges that the conveyance of the substrate should be stopped. With signal transmission means If it is determined that should correct the position of the substrate by the suction determining means, a signal for homing of the drive unit and a return signal transmitting means for transmitting to the drive unit, homing of the drive unit Is characterized in that the holding unit is moved to a temporary placement module for temporarily placing a substrate received from the one processing module.

The substrate transport method according to claim 2 , wherein the substrate is protruded inward from the inner edge of the holding frame provided so as to surround the periphery of the substrate, and is provided at intervals from each other along the inner edge so as to adsorb the substrate. A transport arm having a plurality of holding portions having suction holes for holding; and a vacuum sensor for detecting the timing of suction of the substrate to the suction holes, and is movable in the vertical and horizontal directions by the drive portion. A substrate transport method for transporting a substrate from one processing module to another processing module using a driven substrate transport device, wherein the position detection detects the position of the transport arm based on a position signal from the drive unit. And when the displacement amount of the position of the transfer arm exceeds a first allowable range set in advance as the drive of the drive unit should be stopped, A stop determination step for determining that the feeding should be stopped; and if the amount of deviation in the suction timing exceeds a second allowable range set in advance to stop the drive of the drive unit, the substrate The amount of deviation in the suction timing is within the second allowable range, but the third allowable range set in advance as the position of the transfer arm should be corrected is determined. If it exceeds, it is determined that the position of the substrate should be corrected, and if the amount of deviation in the suction timing is within the third allowable range, the substrate position is not corrected and the substrate is not corrected. A suction determination step for determining that the transfer of the substrate should be performed, and a signal for stopping the driving of the drive unit when it is determined that the transport of the substrate should be stopped in the stop determination step or the suction determination step. Stop signal to send to And signal process, if it is determined that should correct the position of the substrate in the suction determining step, and a return signal transmitting step of transmitting a signal for homing of the drive unit to the drive unit, the return The signal transmission step is performed by moving the holding unit to a temporary placement module for temporarily placing the substrate received from the one module.

The storage medium according to claim 3 is a computer-readable storage medium in which software for causing a computer to execute a control program is stored, and the control program includes a transfer arm having a suction hole for sucking and holding a substrate. A position detecting step for detecting the position of the transfer arm based on a position signal from a drive unit that drives the transfer arm to move in the vertical and horizontal directions, and a vacuum sensor for detecting the timing of suction of the substrate to the suction hole When the amount of displacement of the position of the transfer arm determined based on the signal exceeds a first allowable range set in advance as the drive of the drive unit should be stopped, the transfer of the substrate is stopped. A stop determination step for determining that the drive is to be performed, and a deviation amount of the suction timing is set in advance to stop the drive of the drive unit. If the second permissible range is exceeded, it is determined that the transport of the substrate should be stopped, and the amount of deviation in the suction timing is within the second permissible range. When the third allowable range set in advance as to be corrected is exceeded, it is determined that the position of the substrate should be corrected, and the amount of deviation in the suction timing is within the third allowable range. In the case where it is determined that the conveyance of the substrate should be stopped without correcting the position of the substrate, and the conveyance of the substrate should be stopped in the stop determination step or the adsorption determination step In addition, when it is determined that the position of the substrate should be corrected in the stop signal transmitting step for transmitting a signal for stopping the driving of the driving unit to the driving unit and the suction determining step, the return of the origin of the driving unit is performed. Send the signal to be performed to the drive unit As the return signal transmission step is performed that the computer is designed to control the substrate transfer apparatus, the return signal transmission step performed by the control program temporary substrate received from the first module It is the process performed by moving the said holding | maintenance part to the temporary placement module for this.

  Since the present invention is configured as described above, the conveyance of the substrate is stopped when the shift amount of the position of the holding frame exceeds the first allowable range. In addition, when the displacement amount of the holding frame position does not exceed the first allowable range, the amount of displacement of the suction timing is within the second allowable range and exceeds the third allowable range. Even if it exists, conveyance of a board | substrate is attained by correcting the position of a board | substrate. Further, when the deviation amount of the suction timing is within the third allowable range, the substrate can be transported without correcting the position of the substrate. Therefore, if the substrate misalignment is large, the conveyance is stopped to prevent generation of defective products. If the substrate misalignment is not so large, the substrate misalignment is automatically corrected under the self-diagnosis. Productivity can be improved.

1 is a schematic plan view showing an example of a resist coating / development processing system to which a substrate cleaning apparatus according to the present invention is applied. It is a schematic perspective view of the said resist application | coating / development processing system. It is a schematic longitudinal cross-sectional view of the said resist application | coating / development processing system. It is a schematic perspective view of the process part provided in the said resist application | coating / development processing system. It is a perspective view of the conveyance arm in this invention. It is a top view of the said conveyance arm. It is the top view to which the principal part of the said conveyance arm was expanded. It is an AA arrow directional view of FIG. It is a block diagram which shows the control part in this invention. It is a schematic sectional drawing of the conveyance arm which shows the state just before mounting a wafer with the delivery unit in this invention. It is a schematic sectional drawing of the conveyance arm which shows the state which mounted the wafer in the delivery unit in this invention. It is a schematic side view explaining the operation | movement at the time of the normal of the conveyance arm which mounts a wafer. It is a schematic side view explaining the operation | movement at the time of abnormality of the conveyance arm which mounts a wafer. It is a time chart which shows the adsorption | suction timing at the time of mounting a wafer on a conveyance arm, a Z-axis speed, and a Z-axis position. It is a schematic perspective view of the temporary placement module in this invention. It is a flowchart which shows the position adjustment process of a conveyance arm. It is a flowchart which shows the first half of the process processing process of a conveyance arm. It is a flowchart which shows the second half of the process processing process of a conveyance arm. It is a flowchart which shows the self-diagnosis mode of a conveyance arm.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated in detail based on an accompanying drawing. The resist coating / development processing system shown in FIGS. 1 to 3 is provided with a carrier block S1, and a transfer arm C is mounted on a substrate (wafer W) from a hermetic carrier 100 mounted on the mounting table 101. Is transferred to the processing block S2, and the transfer arm C receives the processed wafer W from the processing block S2 and returns it to the carrier 100.

  As shown in FIG. 2, the processing block S <b> 2 is a first block (DEV layer) B <b> 1 for performing development processing in this example, and a processing for forming an antireflection film formed on the lower layer side of the resist film. The second block (BCT layer) B2, the third block (COT layer) B3 for applying the resist film, and the fourth block for forming the antireflection film formed on the upper layer side of the resist film (TCT layer) B4 is laminated in order from the bottom.

  The second block (BCT layer) B2 and the fourth block (TCT layer) B4 are each a coating unit that applies a chemical solution for forming an antireflection film by spin coating, and a process performed in this coating unit. A heating / cooling system processing unit group for performing the pre-processing and post-processing, and transfer arms A2 and A4 that are provided between the coating unit and the processing unit group and transfer the wafer W between them. , Is composed of. The third block (COT layer) B3 has the same configuration except that the processing solution is a resist solution.

  On the other hand, with respect to the first block (DEV layer) B1, as shown in FIG. 3, the developing units 110 are stacked in two stages in one DEV layer B1. In the DEV layer B1, a transfer arm A1 for transferring the wafer W to the two-stage development unit 110 is provided. That is, the transport arm A1 is made common to the two-stage development unit.

  Further, as shown in FIGS. 1 and 3, the processing block S2 is provided with a shelf unit U5, and the wafer W from the carrier block S1 is one transfer unit of the shelf unit U5, for example, a second block (BCT layer). ) It is sequentially transported to the delivery unit CPL2 corresponding to B2 by the raising and lowering delivery arm D1 provided in the vicinity of the shelf unit U5. Next, the wafer W is transferred from the transfer unit CPL2 to each unit (antireflection film unit and heating / cooling processing unit group) by the transfer arm A2 in the second block (BCT layer) B2, and is transferred to these units. Thus, an antireflection film is formed.

  Thereafter, the wafer W is transferred to the third block (COT layer) via the transfer unit BF2 of the shelf unit U5, the transfer arm D1 that can be raised and lowered provided in the vicinity of the shelf unit U5, the transfer unit CPL3 of the shelf unit U5, and the transfer arm A3. ) Into B3, a resist film is formed. Further, the wafer W is transferred from the transfer arm A3 to the transfer unit BF3 of the shelf unit U5. The wafer W on which the resist film is formed may further have an antireflection film formed in the fourth block (TCT layer) B4. In this case, the wafer W is transferred to the transfer arm A4 via the transfer unit CPL4. After the antireflection film is formed, the wafer W is transferred to the transfer unit TRS4 by the transfer arm A4.

  On the other hand, in the upper part of the DEV layer B1, a shuttle arm E which is a dedicated transfer means for directly transferring the wafer W from the transfer unit CPL11 provided in the shelf unit U5 to the transfer unit CPL12 provided in the shelf unit U6. Is provided. The wafer W on which the resist film and further the antireflection film are formed is transferred from the transfer units BF3 and TRS4 to the transfer unit CPL11 via the transfer arm D1, and from there to the transfer unit CPL12 of the shelf unit U6 by the shuttle arm E. Directly conveyed. Here, as shown in FIG. 1, the transfer arm D2 installed between the shelf unit U6 and the cleaning device 102 is configured to be rotatable, advanced, retracted, and lifted, and specially transports the wafer W before and after cleaning, for example. Two arms are provided. The wafer W is taken out from the delivery unit CPL12 by a dedicated arm before cleaning of the delivery arm D2, and is carried into the cleaning device 102 and subjected to back surface cleaning. After the cleaning, the wafer W is mounted on the transfer unit TRS13 by a dedicated arm after the transfer arm D2 is cleaned, and then taken into the interface block S3. Note that the delivery unit with CPL in FIG. 3 also serves as a cooling unit for temperature control, and the delivery unit with BF also serves as a buffer unit on which a plurality of wafers W can be placed. .

  Next, after being transported to the exposure apparatus S4 by the interface arm B and performing a predetermined exposure process here, it is placed on the delivery unit TRS6 of the shelf unit U6 and returned to the processing block S2. Next, the wafer W is subjected to development processing in the first block (DEV layer) B1, and transferred to the transfer unit TRS1 of the shelf unit U5 by the transfer arm A1. Thereafter, the transfer arm D1 transports the transfer unit C to the transfer unit within the access range of the transfer arm C in the shelf unit U5, and returns the carrier to the carrier via the transfer arm C. In FIG. 1, U <b> 1 to U <b> 4 are thermal system unit groups in which a heating unit and a cooling unit are stacked.

<Transfer arm>
Next, based on FIGS. 4-9, the board | substrate conveyance apparatus 1 of this invention is demonstrated. The substrate transfer apparatus 1 includes transfer arms A1 to A4 that transfer a wafer W from one processing module to another processing module and suck and hold the wafer W, and a vacuum sensor 43 that detects the timing of sucking and holding the wafer W. .

  Next, the transfer arms A1 to A4 will be described. The transfer arms A1 to A4 are provided in the first block (DEV layer) B1, the second block (BCT layer) B2, the third block (COT layer) B3, and the fourth block (TCT layer layer) B4, respectively. However, hereinafter, the transfer arm A3 provided in the third block (COT layer) B3 will be described.

  In the transfer arm A3, two forks 3 (3A, 3B) forming a holding frame provided so as to surround the periphery of the wafer W can move forward and backward along the base 31 (in the X direction in FIGS. 4 to 6). The base 31 is configured to be rotatable about the vertical axis by the rotation mechanism 32.

  The transfer arm A3 is disposed between the coating module 23 and the shelf units U1 to U4. The coating module 23 and the shelf units U1 to U4 are provided so as to face each other, and a transfer port 24 for delivering the wafer W is provided on the facing surface of the coating module 23 and the shelf units U1 to U4. The shelf unit U3 is provided with temporary placement units PT1 to PT4 that are units for correcting the holding position when the wafer W is held by the transfer arm A3.

  The forks 3A, 3B are supported at their proximal ends by advance / retreat mechanisms 33A, 33B, respectively, and these advance / retreat mechanisms 33A, 33B move along the base 31 using a timing belt provided inside the base 31. It is configured. In this way, the forks 3A, 3B have the wafer W transfer position where the advance / retreat mechanisms 33A, 33B are advanced to the distal end side of the base 31 and the positions where the advance / retreat mechanisms 33A, 33B are retracted toward the proximal end side of the base 31. It is configured to be able to move forward and backward with respect to the standby position.

  A lifting platform 34 is provided below the rotation mechanism 32. The lifting platform 34 is a Z-axis guide rail (not shown) that extends linearly in the vertical direction (the Z-axis direction in FIGS. 4, 5, and 7). )), And can be moved up and down by the rotation of the motor M forming the drive unit.

  The Z-axis guide rail is covered with a cover body 35. Further, as shown in FIG. 4, the cover body 35 is configured to slide and move along a Y-axis guide rail 36 that extends linearly in the Y-axis direction.

  In FIG. 9, for convenience of illustration, the lifting platform 34 is omitted, and a lifting mechanism 37 is drawn below the base 31. The elevating mechanism 37 of this example is configured to elevate the base body 31 along the Z-axis guide rail by rotating an elevating shaft (not shown) provided inside the Z-axis guide rail from the motor M. The motor M is connected to the encoder 38. The number of pulses of the encoder 38 is counted by the counter 39, and the counted number of pulses is transmitted to the control computer 5. The encoder 38, the counter 39 and the control computer 5 correspond to the position detecting means of the present invention.

  As shown in FIGS. 5 to 7, holding claws 30 </ b> A to 30 </ b> D that form holding portions are provided on the inner edges of the forks 3 </ b> A and 3 </ b> B formed in an arc shape. The holding claws 30A to 30D are provided at intervals from each other along the inner edges of the forks 3A and 3B.

  As shown in FIGS. 7 and 8, suction holes 41 </ b> A to 41 </ b> D are provided in the holding claws 30 </ b> A to 30 </ b> D. The suction holes 41A to 41D are connected to the vacuum pump P via vacuum pipes 42A and 42B formed inside the forks 3A and 3B. The vacuum pipes 42 </ b> A and 42 </ b> B are provided with a vacuum sensor 43, and the degree of vacuum of the vacuum pipes 42 </ b> A and 42 </ b> B detected by the vacuum sensor 43 is transmitted to the control unit 51.

  As shown in FIGS. 7 and 9, the delivery unit CPL <b> 3 is provided with a disk-shaped cooling plate 46. The diameter of the cooling plate 46 is slightly smaller than the inner diameter of the forks 3A and 3B. The cooling plate 46 is provided with notches 47A to 47D that oppose the holding claws 30A to 30D. Further, three support pins 45 are attached to the cooling plate 46 in the upward direction, and the wafer W can be placed on the support pins 45.

<Control part>
Based on FIG. 9, the control part 51 which controls the conveyance board | substrate apparatus 1 is demonstrated. The control unit 51 is built in the control computer 5. In addition to the control unit 51, the control computer 5 includes a control program storage unit 52 for controlling the transfer of the wafer W, signals from the encoder 38, and vacuum sensors. A reading unit 53 that reads a signal from 43, a data storage unit 54 that stores data read by the reading unit 53, and an alarm generation unit 55 that generates an alarm when the transfer of the wafer W is stopped are incorporated. . The control computer 5 is provided with a computer-readable storage medium 56 that is inserted into the reading unit 53 and stores software that causes the control computer 5 to execute a control program. A control signal is output to each unit. Examples of the storage medium 56 include a hard disk, a compact disk, a flash memory, a flexible disk, and a memory card.

  The control program storage unit 52 transfers the wafer W from the carrier 100 to the processing block S2, transfers the processed wafer W from the processing block S2 to the carrier 100, and wafers held by the transfer arms A1 to A4. The self-diagnosis program 52b that checks the holding position of W and adjusts the holding position of the wafer W based on the check result, and if it is determined that the wafer W should not be transferred as a result of the check, Whether to execute the conveyance pro program 52a or the self-diagnosis program 52b from the conveyance stop program 52c for stopping conveyance, the signal read by the reading unit 53, and the data stored in the data storage unit 54, A determination program 52d for determining whether to execute the conveyance stop program 52c is stored. To have.

<Wafer holding>
The operation of placing the wafer W on the transfer arms A1 to A4 will be described with reference to FIGS.

  FIG. 10A shows a state where the transfer arm A3 is inserted into the delivery unit CPL3. The delivery unit CPL3 is provided with a cooling plate 46 having support pins 45, and a wafer W is placed on the support pins 45. Further, the advancing and retracting mechanisms 33A and 33B of the transfer arm A3 are inserted below the cooling plate 46. Then, a signal from the encoder 38 of the motor M that drives the lifting platform 34 in the vertical direction in a state where the advance / retreat mechanism 33A is inserted below the cooling plate 46 is stored in the data storage unit 54.

  Next, as shown in FIG. 10B, the lift 34 moves upward by driving the motor M, so that the transfer arm A3 moves upward, and the wafer W held on the support pins 45 is transferred to the transfer arm. Placed on A3. At this time, the inner circumferences of the forks 3A and 3B are slightly larger than the diameter of the cooling plate 46, and are provided in the notches 47A to 47D corresponding to the holding claws 30A to 30D on the cooling plate 46. There is no interference with the cooling plate 46. The wafer W is sucked and held by driving a vacuum pump P provided in the vacuum pipes 42A and 42B.

  Next, the timing of evacuation by the motor M and the vacuum pump P when the wafer W is placed on the transfer arm A3 will be described with reference to FIG. In FIG. 12, the solid line indicating the Z-axis speed indicates the Z-axis speed of the transfer arm A3 when the motor M is operating normally. The Z-axis position can be obtained by integrating the Z-axis speed waveform.

  The transfer arm A3 moves while accelerating upward from the state inserted in the delivery unit CPL3 (time t0) to the speed V2. At time t1 when the speed of the transfer arm A3 becomes V2, the distance between the transfer arm A3 and the wafer W held on the support pins 45 approaches, so that the transfer arm A3 moves upward at time t1 based on the transfer program 52a. Control to decelerate the transport arm A3 is executed.

  Next, at a time t2 when the speed of the transfer arm A3 is decelerated to a speed V1 at which the wafer W can be stably placed on the transfer arm A3, a constant velocity motion in which the speed of the transfer arm A3 is V1 and Control is executed. Thereafter, at time t3 when the transfer arm A3 is moving at a constant velocity of V1, the wafer W is placed on the transfer arm A3, and the wafer W is sucked and held by the suction holes 41A to 41D.

  After the wafer W is sucked and held by the suction holes 41A to 41D at time t3, the transfer arm A3 starts accelerating at time t4, accelerates to a speed V3 at time t5, and then moves up at time t6. The

  Whether or not the suction and holding of the wafer W by the suction holes 41A to 41D is normally performed is determined by the time between the times t2 and t3. The suction holding of the wafer W is normally performed when time tc has elapsed since the start of constant speed movement with the speed of the transfer arm A3 set to V1 at time t2. In other words, at the start of the constant velocity motion in which the speed of the transfer arm A3 is V1, the transfer arm A3 is located below the wafer W and at a distance Z1.

  On the other hand, as shown in FIG. 11B, at the start of constant speed movement with the speed of the transfer arm A3 set to V1, the transfer arm A3 is located below the wafer W and at a distance Z2 closer to the distance Z1. In this case, the vacuum sensor 43 is turned on at a time closer to the time t2 as compared with the normal time, as in the vacuum sensor timing indicated by the dotted line in FIG. At this time, since the time tc from the start of the constant-velocity movement with the speed of the transfer arm A3 set to V1 to the adsorption holding of the wafer W is shortened, the time difference between the time t2 and the time t3 and the time tc are shifted ( Deviation amount r) occurs.

  Further, when the transfer arm A3 is located at a position below the wafer W and at a distance Z3 farther than the distance Z1 at the start of the constant velocity motion with the speed of the transfer arm A3 set to V1, one point in FIG. Like the vacuum sensor timing indicated by the chain line, the vacuum sensor 43 is turned on at a time far from the time t2 compared to the normal time. At this time, since the time tc from the start of the constant-velocity movement with the speed of the transfer arm A3 set to V1 to the suction holding of the wafer W becomes longer, the time difference between the time t2 and the time t3 and the time tc are shifted ( Deviation amount r) occurs.

  When the deviation amount γ exceeds the second allowable range σ2 set in advance so that the driving of the motor M should be stopped, the deviation relating to the suction holding timing of the wafer W is large. It is determined that W is not evenly held by the holding claws 30 </ b> A to 30 </ b> D and the transfer of the wafer W should be stopped. Further, when the deviation between the deviation amount γ and the time tc is within the allowable range σ2 of 2, but exceeds the third allowable range σ3 set in advance so that the positions of the forks 3A and 3B should be corrected. Since the deviation of the timing of evacuation is to some extent, the control unit 51 adjusts the mounting position of the wafer W although the wafer W is not mounted evenly on the holding claws 30A to 30D. It is determined that scratching of the wafer W can be prevented.

  Here, the second allowable range σ2 and the third allowable range σ3 are arbitrarily determined by converting the positional deviation allowable values of the transfer arms A1 to A4 and the shuttle arm E and the respective modules into the timing deviation of the vacuuming. Can do. As an example, the second allowable range σ2 is set to 25% of the time (t4-t2) during which the Z-axis speed is V1 and constant velocity motion is performed, and the third allowable range σ3 is set to the time (t4-t2). It can be set to 12%.

<Temporary placement module>
The temporary placement unit PT3 will be described with reference to FIG. The temporary placement unit PT3 includes a stage portion 73 on which the wafer W is placed on the support portion 72. The stage unit 73 is formed, for example, in a plate-like body having a tip formed in an arc shape. When the wafer W is transferred between the stage unit 73 and the fork 3A, the fork 3A moves the stage unit 73 over a predetermined space. The shape and size are determined so as to surround the space.

<Substrate transport method>
Based on FIGS. 14-16, the board | substrate conveyance method of this invention is demonstrated. The transfer of the wafer W is performed by the transfer arms A1 to A4 and the shuttle arm E. Since the operations of the transfer arms A1 to A4 and the shuttle arm E are the same, the transfer operation of the transfer arm A3 will be described below.

  In the transfer of the wafer W by the substrate transfer apparatus 1, first, the position of the transfer arm A3 shown in FIG. 14 is adjusted. In the position adjustment of the transfer arm A3, first, initialization (initialization) of the X axis, the Y axis, and the Z axis (all axes) is performed (step S1). In the initialization of the X axis, a signal for initializing the X axis is transmitted from the control unit 51 to the motor M that drives the X axis, and the X axis is initialized based on this signal. Also, the Y axis and the Z axis are initialized based on the signal from the control unit 51 as in the case of the X axis.

  Next, based on a signal from the control unit 51, the transfer arm A3 moves to a position for receiving the wafer W placed on the CPL3, and the position data P1 and the wafer W of the transfer arm A3 before receiving the wafer W are obtained. The received position data P2 of the transport arm A3 is read by the reading unit 53 and stored in the data storage unit 54 (step S2). In step S2, the transfer arm A3 is moved to the temporary placement unit PT3, and the position data P3 of the transfer arm A3 before the wafer W is mounted on the stage unit 73 and the wafer W mounted on the stage unit 73. The position data P4 of the transfer arm A3 is read by the reading unit 53 and stored in the data storage unit 54.

  Further, based on the transfer program 52a, the transfer arm A3 holding the wafer W moves to a position above the spin chuck (not shown) in the COT layer B3 (position to send the wafer W), and the wafer W is received by the spin chuck (not shown). The position data P5 of the transfer arm A3 before transfer and the position data P6 of the transfer arm A3 in a state after the wafer W is transferred to a spin chuck (not shown) are read by the reading unit 53 and stored in the data storage unit 54 (step). S3).

  Next, vacuum timing when the wafer W placed on the CPL3 is attracted and held by the transfer arm A3, the degree of vacuum of the vacuum pipes 42A and 42B, and a wafer held by a spin chuck (not shown) in the COT layer B3. Vacuum timing for suctioning and holding W and the vacuum degree of the vacuum pipes 42A and 42B, and vacuum timing for sucking and holding the wafer W placed on the stage 73 and vacuum degree of the vacuum pipes 42A and 42B Is detected by the vacuum sensor 43. These data (VAC data) related to vacuuming are read by the reading unit 53 and stored in the data storage unit 54 (step S4).

  By executing the above steps S1 to S4, the position where the substrate is received, the position where the substrate is sent, and the VAC data are stored in the data storage unit with all axes of the transfer arm A3 initialized. These data are reference data as to whether or not the posture of the wafer W in the transfer arm A3 is normal when the substrate transfer apparatus 1 transfers the module to each module.

  Next, an example of a process of transporting the wafer W from one processing module to another processing module will be described with reference to FIGS. 15A and 15B. First, before transferring the wafer W from one processing module to another processing module, all-axis initialization similar to step S1 shown in FIG. 15A is performed (step S11). Next, the transfer arm A3 is stopped in a state where it is moved to CPL3 which is one processing module (step S12), and the stop position data of the transfer arm A3 is transmitted to the reading unit 53, so that the position data of the transfer arm A3 is obtained. It is stored in the data storage unit 54 (step S13).

  Next, the shift of the stop position of the transfer arm A3 is determined based on the difference (position shift amount δ1) between the position data P1 of the transfer arm A3 acquired in step S2 and the stop position data of the transfer arm A3 acquired in step S13. It is determined whether or not the allowable range σ1 of 1 is exceeded (step S14). When the positional deviation amount δ1 exceeds the first allowable range σ1, the stop position of the transfer arm A3 moved to the CLP 3 is greatly displaced, so that the control unit 51 holds the wafer W when the wafer W is held. It is determined that the holding claws 30A to 30D are not placed evenly. For this reason, the controller 51 determines that there is a possibility that the wafer W may be dropped or damaged, and stops driving the transfer arm A3 based on the transfer stop program 52c (step S115).

  Accordingly, step S14 corresponds to the stop determination step of the present invention, and the control unit 51 that determines whether or not the positional deviation amount δ1 exceeds the first allowable range δ1 in step S14 corresponds to the stop determination means of the present invention. To do. Step S115 is a stop signal transmission step of the present invention, and the control unit 51 in step S115 corresponds to the stop signal transmission means of the present invention.

  Further, when the positional deviation amount δ1 is within the first allowable range σ1, the positional deviation of the stop position of the transfer arm A3 that has moved to the CLP3 is small, so that the control unit 51 holds the wafer W when holding the wafer W. Is determined to be placed evenly on the holding claws 30A to 30D. Therefore, the control unit 51 determines that there is no possibility that the wafer W will be dropped or damaged, and continues to drive the transfer arm A3. Here, the first allowable range σ1 is a positional deviation amount determined that there is a possibility that the wafer W may be damaged or dropped when the transfer is continued.

  When the positional deviation amount δ1 is within the first allowable range σ1, the transfer arm A3 receives the wafer W by being attracted and held by the holding claws 30A to 30D of the transfer arm A3 (step S15), The position data and VAC data of the transfer arm A3 when the wafer W is attracted and held by the transfer arm A3 are read by the reading unit 53 and stored in the data storage unit 54. (Step S16).

  Next, whether or not the difference (position deviation amount δ2) between the position data P2 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S16 exceeds the first allowable range σ1. Determination is made (step S17). When the positional deviation amount δ2 exceeds the first allowable range σ1, since the positional deviation of the wafer receiving position of the transfer arm A3 in the CLP 3 is large, the control unit 51 equally distributes the wafer W to the holding claws 30A to 30D. Judge that it is not placed. For this reason, the control unit 51 determines that there is a possibility of the wafer W being dropped or damaged, generates an alarm, and then stops driving the transfer arm A3 based on the transfer stop program 52c (step S115). When the positional deviation amount δ2 is within the first allowable range σ1, since the positional deviation of the wafer receiving position of the transfer arm A3 in the CLP 3 is small, the control unit 51 causes the wafer W to be evenly placed on the holding claws 30A to 30D. It is judged that it is mounted on. Therefore, the control unit 51 determines that there is no possibility that the wafer W will be dropped or damaged, and continues to drive the transfer arm A3.

  If the positional deviation amount δ2 is within the first allowable range σ1, it is next determined whether or not the timing of evacuation for sucking and holding the wafer W is deviated (step S18). If the difference (deviation amount γ1) between the vacuuming timing detected in step S4 and the vacuuming timing detected in step S16 exceeds the second allowable range σ2, the vacuuming timing shift Therefore, the control unit 51 determines that the wafer W is not evenly placed on the holding claws 30A to 30D. Therefore, the control unit 51 determines that there is a possibility that the wafer W may be scratched, generates an alarm, and then stops driving the transfer arm A3 based on the transfer stop program 52c. (Step S115). Here, the second allowable range σ2 is a positional deviation amount determined that there is a possibility that the wafer W may be scratched when the transfer is continued.

  When the deviation amount γ1 is within the second allowable range σ2, it is determined whether or not the deviation amount γ1 exceeds the third allowable range σ3 (step S19). Here, the third allowable range σ3 is a positional deviation amount that is determined as a range in which scratching of the wafer W does not occur even if the transfer is continued, and is a value smaller than the second allowable range σ2.

  When the shift amount γ1 exceeds the third allowable range σ3, the control unit 51 places the wafer W evenly on the holding claws 30A to 30D because the shift of the vacuuming timing is large to some extent. Although not done, it is determined that the occurrence of scratches on the wafer W can be prevented by adjusting the mounting position of the wafer W. At this time, a self-diagnosis mode for self-diagnosis and repair of the positional deviation of the wafer W held on the transfer arm A3 is executed (step S110). Details of the self-diagnosis mode will be described later. When the deviation amount γ1 is within the third allowable range σ3, the wafer W is placed evenly on the holding claws 30A to 30D, or the placement displacement is small, so that the wafer W is scratched. It is determined that no transfer occurs, and the transfer arm A3 that holds the wafer W is moved to the COT layer B3 (step S112). Then, with the transfer arm A3 moving above a spin chuck (not shown) in the COT layer B3 and stopped, the stop position data of the transfer arm A3 is read by the reading unit 53 and stored in the data storage unit 54 (step S113). ). Therefore, steps S18 and S19 correspond to the adsorption determination process of the present invention, and a control unit that determines whether or not the deviation amount γ1 exceeds the second allowable range δ2 and the third allowable range δ3 in steps S18 and S19. 51 corresponds to the adsorption determination means of the present invention.

  Next, the stop position of the transfer arm A3 is shifted based on the difference (position shift amount δ3) between the position data P5 of the transfer arm A3 acquired in step S3 and the stop position data of the transfer arm A3 acquired in step S113. It is judged whether it is (step S114). When the positional deviation amount δ3 exceeds the first allowable range σ1, since the stop position of the transfer arm A3 that has moved onto the spin chuck (not shown) is greatly shifted, the control unit 51 spins the wafer W (not shown). It is determined that it cannot be placed evenly on the chuck. For this reason, the control unit 51 determines that there is a possibility of the wafer W being dropped or damaged, generates an alarm, and then stops driving the transfer arm A3 based on the transfer stop program 52c (step S115). If the positional deviation amount δ3 is within the first allowable range σ1, the wafer W is placed on a spin chuck (not shown), the stop position data of the transfer arm A3 is read by the reading unit 53, and the data storage unit 54 is read. (Step S116).

  Next, the stop position of the transfer arm A3 is shifted based on the difference (position shift amount δ4) between the position data P6 of the transfer arm A3 acquired in step S3 and the stop position data of the transfer arm A3 acquired in step S116. It is determined whether or not (step S117). When the positional deviation amount δ4 exceeds the first allowable range, the stop position of the transfer arm A3 in a state where the wafer W is placed on the spin chuck (not shown) is greatly deviated. It is determined that the wafer W placed on the chuck is not placed evenly on the holding claws 30A to 30D. Therefore, the control unit 51 determines that there is a possibility that the wafer W may be dropped or damaged, generates an alarm, and then stops driving the transfer arm based on the transfer program 52c (step S115). When the positional deviation amount δ4 is within the first allowable range σ1, the control unit 51 normally transfers the wafer W from the delivery unit CPL3, which is one module, to the COT layer B3, which is another module. It is determined that the wafer W has been transferred, and the transfer of the wafer W from the delivery unit CPL3 to the COT layer B3 is completed.

  Details of the self-diagnosis mode in step S110 will be described with reference to FIG. In the self-diagnosis mode, the transfer arm A3 holding the wafer W is moved to the temporary placement unit PT3 (Step S21), and the position data of the transfer arm A3 is read by the reading unit 53 and stored in the data storage unit 54 (Step S21). S22).

  Next, the difference (position shift amount δ5) between the position data P3 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S22 is compared, and the stop position of the transfer arm A3 is shifted. It is judged whether it is (step S23). When the positional deviation amount δ5 exceeds the first allowable range σ1, the stop position of the transfer arm A3 moved to the temporary placement unit PT3 is greatly deviated, so that the control unit 51 causes the wafer W to drop or break. It is determined that there is a possibility of occurrence, and the process returns to the transfer process shown in FIGS. 15A and 15B, generates an alarm, and then stops driving the transfer arm A3 based on the transfer stop program 52c (step S115).

  If the positional deviation amount δ5 is within the first allowable range σ1, the wafer W is placed on the stage unit 73 of the temporary placement unit PT3 (step S24). Then, the position data of the transfer arm A3 on which the wafer W is placed on the stage unit 73 is read by the reading unit 53 and stored in the data storage unit 54 (step S25).

  Next, is the stop position of the transfer arm A3 shifted based on the difference (position shift amount δ6) between the position data P4 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S25? It is determined whether or not (step S26). When the positional deviation amount δ6 exceeds the first allowable range σ1, the stop position of the transfer arm A3 on which the wafer W is placed on the stage unit 73 is greatly shifted, so the wafer W is held by the transfer arm A3. In such a case, it is determined that the wafer W may be dropped or damaged, the process returns to the transfer process shown in FIGS. 15A and 15B, an alarm is generated, and the transfer arm A3 is based on the transfer stop program 52c. Is stopped (step S115).

  If the positional deviation amount δ6 is within the first allowable range σ1, the wafer W placed on the stage unit 73 is attracted and held by the transfer arm A3 (step S27), and the position data of the transfer arm A3. And the VAC data are read by the reading unit 53 and stored in the data storage unit 54 (step S28).

  Next, the difference (position shift amount δ7) between the position data P3 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S28 is compared, and the stop position of the transfer arm A3 is shifted. It is determined whether or not (step S29). When the positional deviation amount δ7 exceeds the first allowable range σ1, the stop position of the transfer arm A3 that holds the wafer W placed on the stage unit 73 is greatly shifted, so the wafer W is transferred to the transfer arm. If it is held at A3, it is determined that the wafer W may be dropped or damaged, the process returns to the transfer process shown in FIGS. 15A and 15B, an alarm is generated, and based on the transfer stop program 52c. The driving of the transfer arm A3 is stopped (step S115).

  In step S29, when the positional deviation amount δ7 is within the first allowable range σ1, it is determined whether or not the holding position of the wafer W attracted and held by the holding claws 30A to 30D is shifted in the next step. (Step S210). When the difference (deviation amount γ2) between the evacuation timing detected in step S4 and the evacuation timing detected in step S28 exceeds the second allowable range σ2, the holding claws 30A to 30D are moved. Since the holding position of the wafer W held by suction is shifted, it is determined that the wafer W may be scratched, and the process returns to the transfer process shown in FIGS. 15A and 15B, and the drive of the transfer arm A3 is stopped. (Step S115).

  If the deviation amount γ2 is within the second allowable range σ2, it is determined whether or not the deviation amount γ2 exceeds the third allowable range σ3 (step S211). When the deviation amount γ2 exceeds the third allowable range σ3, the control unit 51 may cause a scratch on the wafer W when the transfer of the wafer W is continued. It is determined that there is no risk of damage, the transfer arm A3 is moved from the temporary placement unit PT3, and all axes initialization for correcting the holding position of the wafer W is performed (step S212). When the deviation amount γ2 is within the third allowable range σ3, the positional deviation amount of the wafer W held by the transfer arm A3 is small, and the wafer W may drop or break, and the wafer W may be scratched. It is judged that there is no possibility of generating. Accordingly, the self-diagnosis mode shown in FIG. 16 is terminated, and the process returns to the step of placing the wafer W on the spin chuck (not shown) of the COT layer B3 shown in FIG. 15A (step S112).

  In step S212, after all axes of the transport arm A3 are initialized, the transport arm A3 is moved to the temporary placement unit PT3 (step S213), and the transport arm A3 is inserted with the forks 3A and 3B inserted into the transport port 24. Are read by the reading unit 53 and stored in the data storage unit 54 (step S214).

  Next, the stop position of the transfer arm A3 is shifted based on the difference (position shift amount δ8) between the position data P3 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S214. It is determined whether or not there is (step S215). When the positional deviation amount δ8 exceeds the first allowable range σ1, the stop position of the transfer arm A3 moved to the temporary placement unit PT3 is greatly shifted, and thus when the wafer W is held by the transfer arm A3. 15A and 15B returns to the transfer process shown in FIGS. 15A and 15B, and stops driving the transfer arm A3 based on the transfer stop program 52c (step S115).

  If the positional deviation amount δ8 is within the first allowable range σ1, the wafer W is sent out from the transfer arm A3 by placing the wafer W on the stage unit 73 of the temporary placement unit PT3 (step S216). ), The position data of the transfer arm A3 is read by the reading unit 53 and stored in the data storage unit 54 (step S217).

  Next, the difference (position deviation amount δ9) between the position data P4 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S217 is compared, and the stop position of the transfer arm A3 is shifted. It is determined whether or not (step S218). When the positional deviation amount δ9 exceeds the first allowable range σ1, the stop position of the transfer arm A3 on which the wafer W is placed on the stage unit 73 is greatly shifted, so the wafer W is held by the transfer arm A3. In such a case, it is determined that the wafer W may be dropped or damaged, the process returns to the transfer process shown in FIGS. 15A and 15B, an alarm is generated, and the transfer arm A3 is based on the transfer stop program 52c. Is stopped (step S115).

  When the positional deviation amount δ9 is within the first allowable range σ1, the wafer W placed on the stage unit 73 is held by the transfer arm A3 (step S219), and the position data of the transfer arm A3 and The VAC data is read by the reading unit 53 and stored in the data storage unit 54 (step S220).

  Next, is the stop position of the transfer arm A3 shifted based on the difference (position shift amount δ10) between the position data P3 of the transfer arm A3 acquired in step S2 and the position data of the transfer arm A3 acquired in step S220? It is determined whether or not (step S221). When the positional deviation amount δ10 exceeds the first allowable range σ1, the stop position of the transfer arm A3 that holds the wafer W is greatly shifted. Therefore, when the transfer arm A3 is moved, the wafer W is moved. It is determined that there is a risk of dropping or breakage, the process returns to the transfer process shown in FIG. 12, an alarm is generated, and the drive of the transfer arm A3 is stopped based on the transfer stop program 52c (step S115).

  In step S221, if the positional deviation amount δ10 is within the first allowable range σ1, whether or not the suction timing when the wafer W is sucked and held by the holding claws 30A to 30D is shifted in the next step. Is determined (step S222). If the difference (deviation amount γ3) between the evacuation timing detected in step S4 and the evacuation timing detected in step S220 exceeds the second allowable range σ3, the holding position of the wafer W is Since it is deviated, it is determined that there is a possibility that the wafer W may be scratched, the process returns to the transfer process shown in FIGS. 15A and 15B, an alarm is generated, and the transfer arm A3 is set based on the transfer stop program 52c. The driving is stopped (step S115).

  Further, when the deviation amount γ3 is within the second allowable range σ3, the deviation of the holding position of the wafer W is in a range where no scratch is generated, so that the transfer of the wafer W can be continued and the self-diagnosis mode is assumed. And the process proceeds to step S111 shown in FIG. 15A.

  As described above, the substrate transfer apparatus, the substrate transfer method, and the substrate transfer storage medium according to the present invention have the displacement amount of the forks 3A and 3B exceeding the first allowable range σ1 or the suction timing. When the amount of deviation exceeds the second allowable range σ2, the transfer of the wafer W is stopped. Further, when the displacement amount of the positions of the forks 3A and 3B does not exceed the first allowable range σ1, the displacement amount of the suction timing is within the second allowable range σ2 and the third allowable range σ3 is set. Even if it exceeds, the substrate can be transferred by correcting the position of the wafer W. In addition, when the deviation amount of the suction timing is within the third allowable range σ3, the wafer W can be transferred without correcting the position of the wafer W. For this reason, when the wafer W has a large positional deviation, the transfer is stopped to prevent generation of defective products. When the wafer W has a very large positional deviation, the wafer W is automatically misaligned under self-diagnosis. Productivity can be improved by correcting with.

  Further, when the displacement amount of the forks 3A and 3B is within the first allowable range σ1, and the displacement amount of the suction timing is within the second allowable range σ2 and exceeds the third allowable range σ3. The self-repair mode is executed. Therefore, when the self-repair mode is executed, the wafer W is attracted and held out of alignment, and support for specifying the cause of the displacement occurring in the transfer process can be achieved.

  The substrate transport apparatus, the substrate transport method, and the substrate transport storage medium of the present invention have been described above. However, the form for carrying out the present invention is not limited to this. As a form for carrying out the present invention, one processing module has been described as the delivery unit CPL3, and the other processing module has been described as the third block (COT layer) B3. However, the one processing module has the delivery units CPL1, CPL2, The other processing module may be the first block (DEV layer) B1, the second block (BCT layer) B2, and the fourth block (TCT layer layer) B4.

  In the embodiment for carrying out the present invention, the self-diagnosis of the wafer W is performed by the temporary placement unit PT3. However, the wafer W is interposed between the transfer unit CPL1 and the processing module of the first block (DEV layer) B1. In the case of transferring the wafer W, self-diagnosis of the wafer W is performed by the temporary placement unit PT1. Further, when the wafer W is transferred between the transfer unit CPL2 and the processing module of the second block (BCT layer) B2, the wafer W is transferred between the transfer unit CPL4 and the processing module of the fourth block (TCT layer) B4. In the case of transferring the wafer W, self-diagnosis of the wafer W is performed by the temporary placement units PT2 and PT4.

  Further, the self-diagnosis of the wafer W may be performed not by the temporary placement module PT3 but by the delivery units CPL2, CPL3, CPL11, and CPL12 in the processing block S2.

1 Substrate transport device 3A, 3B Fork (holding frame)
30A-30D Holding claw (holding part)
41A to 41D Suction hole 43 Vacuum sensor 51 Control units A1 to A4 Transfer arms PT1 to PT4 Temporary placement unit W Wafer

Claims (3)

A substrate transfer device that is movably driven in a vertical and horizontal direction by a drive unit and transfers a substrate from one processing module to another processing module,
A plurality of suction holes projecting inward from the inner edge of the holding frame provided so as to surround the periphery of the substrate, and spaced apart from each other along the inner edge, and having suction holes for sucking and holding the substrate A transfer arm having a holding portion of
A vacuum sensor for detecting the timing of suction to the suction hole;
Position detecting means for detecting the position of the transfer arm based on a position signal from the drive unit;
Stop determination means for determining that the transfer of the substrate should be stopped when the shift amount of the position of the transfer arm exceeds a first allowable range set in advance as the drive of the drive unit should be stopped. When,
If the amount of deviation in the suction timing exceeds a second allowable range set in advance as the drive of the drive unit should be stopped, it is determined that the transport of the substrate should be stopped, and the suction When the amount of timing deviation is within the second allowable range, but exceeds the third allowable range set in advance as the position of the transfer arm should be corrected, the position of the substrate is corrected. A suction determination means for determining that the substrate should be transported without correcting the position of the substrate when the amount of shift in the suction timing is within the third allowable range;
A stop signal transmitting means for transmitting a signal for stopping the driving of the driving unit to the driving unit when the stop determining unit or the suction determining unit determines that the conveyance of the substrate should be stopped;
A return signal transmitting means for transmitting a signal for returning the origin of the drive unit to the drive unit when it is determined that the position of the substrate should be corrected by the suction determination unit ;
The origin return of the drive unit is performed by moving the holding unit to a temporary placement module for temporarily placing a substrate received from the one processing module . A plurality of holding holes projecting inward from the inner edge of the holding frame provided so as to surround the periphery of the substrate, and spaced apart from each other along the inner edge, and having suction holes for sucking and holding the substrate A transfer arm having a holding part;
A vacuum sensor that detects the timing of adsorption of the substrate to the suction hole, and
A substrate transport method for transporting a substrate from one processing module to another processing module using a substrate transport device that is movably driven vertically and horizontally by a drive unit,
A position detection step of detecting the position of the transfer arm based on a position signal from the drive unit;
Stop determination step of determining that the substrate transport should be stopped when the amount of displacement of the position of the transport arm exceeds a first allowable range that is set in advance to stop the driving of the drive unit. When,
If the amount of deviation in the suction timing exceeds a second allowable range set in advance as the drive of the drive unit should be stopped, it is determined that the transport of the substrate should be stopped, and the suction When the amount of timing deviation is within the second allowable range, but exceeds the third allowable range set in advance as the position of the transfer arm should be corrected, the position of the substrate is corrected. A suction determination step of determining that the substrate should be transported without correcting the position of the substrate when the amount of shift in the suction timing is within the third allowable range;
A stop signal transmission step of transmitting a signal for stopping the drive of the drive unit to the drive unit when it is determined that the conveyance of the substrate should be stopped in the stop determination step or the suction determination step;
A return signal transmission step of transmitting a signal for returning the origin of the drive unit to the drive unit when it is determined that the position of the substrate should be corrected in the adsorption determination step ;
The return signal transmission step is performed by moving the holding unit to a temporary placement module for temporarily placing a substrate received from the one module . A computer-readable storage medium storing software for causing a computer to execute a control program,
The control program includes a position detection step of detecting the position of a transfer arm having a suction hole for holding the substrate by suction based on a position signal from a drive unit that drives the transfer arm to move vertically and horizontally. ,
A deviation amount of the position of the transfer arm, which is determined based on a signal from a vacuum sensor that detects the timing of suction of the substrate to the suction hole, is set in advance to stop driving of the driving unit. A stop determination step of determining that the transport of the substrate should be stopped when the allowable range of 1 is exceeded;
If the amount of deviation in the suction timing exceeds a second allowable range set in advance as the drive of the drive unit should be stopped, it is determined that the transport of the substrate should be stopped, and the suction When the amount of timing deviation is within the second allowable range, but exceeds the third allowable range set in advance as the position of the transfer arm should be corrected, the position of the substrate is corrected. A suction determination step of determining that the substrate should be transported without correcting the position of the substrate when the amount of shift in the suction timing is within the third allowable range;
A stop signal transmission step of transmitting a signal for stopping the drive of the drive unit to the drive unit when it is determined that the conveyance of the substrate should be stopped in the stop determination step or the suction determination step;
When it is determined in the suction determination step that the position of the substrate should be corrected, the computer carries the substrate so that a return signal transmission step is executed for transmitting a signal for returning the origin of the drive unit to the drive unit. all SANYO to control the apparatus,
The return signal transmission step executed by the control program is a step performed by moving the holding unit to a temporary placement module for temporarily placing a substrate received from the one module. Storage media.

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