JP5454455B2 - Substrate transport apparatus, substrate transport method, and storage medium - Google Patents

Description

  The present invention relates to a technical field for transporting a substrate by vacuum suction.

  As one of methods for transporting a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display in the air, for example, as described in Patent Document 1, a holding arm (also called tweezers or the like) is generically named. There is a method in which the substrate is sucked and held in a vacuum suction hole (so-called vacuum chuck) provided in (). By holding the substrate on the transfer arm in this way, there is an advantage that the substrate is not displaced or dropped even if the acceleration / deceleration speed of the transfer arm is increased.

  A vacuum chuck type substrate transfer apparatus is configured by forming a suction path in a transfer arm provided on a transfer base so as to be movable back and forth, and connecting a vacuum pipe to the base end side of the suction path. The piping is routed to a substrate processing apparatus in which the substrate transfer apparatus is incorporated, for example, a vacuum pump disposed in a storage area of a power system of a coating and developing apparatus for forming a resist film.

  However, when the transport area that the substrate transport mechanism is responsible for increases, for example, when the dimensions of the straight transport path and the vertical transport path increase, the vacuum pipe becomes longer and the volume in the vacuum pipe increases, which is necessary for adsorbing the substrate. It took a long time to reach the pressure. For this reason, the time from when the transfer arm receives the substrate to when it starts moving forward and backward becomes longer, and although the acceleration of the transfer arm can be increased, the substrate transfer efficiency may not always be high. . In addition, for example, the coating and developing apparatus tends to have a large number of modules and downsizing the apparatus, and the structure is stood up and the space is narrow, and if a vacuum pipe is forcibly arranged, the structure becomes complicated. Because the load was applied to the piping, it was difficult to route the vacuum piping.

  Here, Patent Document 2 describes a portable and portable substrate carrying device that is equipped with a small pump and a small battery, but the holding member is not equipped with a pump or a battery. Flexible piping is routed around. In the substrate transfer device described in Patent Document 3, a vacuum pump or the like is provided outside the transfer hand, and piping is routed to the suction unit. Patent Document 4 describes a substrate transfer device equipped with an automatic transfer vehicle (AGV) equipped with a transfer arm that can adsorb a substrate in a vacuum and freely move back and forth. The piping must be routed up to. For this reason, none of Patent Document 2, Patent Document 3 and Patent Document 4 describes a solution to the problem of the present invention.

Japanese Patent No. 2673239 JP-A-5-337867 JP-A-9-275129 JP 2002-203889 A

  The present invention has been made under such a background. The purpose of the present invention is to quickly transport a substrate without drawing a vacuum pipe outside the holding member when transporting the substrate by vacuum suction to the holding member. It is to provide a technology that can do.

The substrate transfer apparatus of the present invention is
A transport base provided movably,
A holding member which is configured to hold the substrate by vacuum suction, and which is provided on the transport base so as to freely move between a forward position for transferring the substrate and a retracted position for holding the substrate and waiting. In the substrate transfer device
The transport base includes a guide wire that extends in the front-rear direction along the side surface and is energized,
The holding member is
A suction path having one end opened as a suction hole for adsorbing the substrate;
A vacuum pump provided on the other end of the suction path;
A battery for supplying power to the vacuum pump;
A moving frame facing the side surface of the transport substrate;
A coil that is provided in the moving frame in the vicinity of the guide wire to generate a current by electromagnetic induction when the holding member is advanced and retracted, and forms a power receiving unit for charging the battery ;
The signal for the adsorption or release of the substrate, characterized by comprising a communication unit for receiving from the control unit provided outside of the holding member.

Moreover, the substrate transport method of the present invention comprises:
A transport base provided movably, and a holding member provided on the transport base so as to be movable back and forth between a forward position for transferring the substrate and a retracted position for holding the substrate and waiting.
The holding member includes a suction path whose one end opens as a suction hole for adsorbing the substrate, a vacuum pump connected to the other end side of the suction path, and a moving frame facing the side surface of the transport base,
The transport substrate uses a substrate transport device provided with a guide wire that extends in the front-rear direction along the side surface and is energized.
Advancing the holding member without holding the substrate and activating the vacuum pump, the holding member receiving the substrate;
Next, the step of retracting the holding member while maintaining the suction state of the suction path;
Next, the holding member is moved forward while holding the substrate, and the pressure in the suction path is returned to atmospheric pressure;
Subsequently, a step of transferring the substrate from the holding member;
When the holding member advances and retracts, a current is generated by electromagnetic induction in a coil provided in the moving frame in the vicinity of the guide wire, and the battery is charged;
And supplying power to the vacuum pump from the battery.

The present invention provides a vacuum pump and a battery on the holding member when the substrate is vacuum-adsorbed to the holding member and transports the battery, charges the battery using a coil that forms a guide wire and a power receiving unit from the transport base, The vacuum pump is operated by the electric power. Therefore, it is not necessary to route a vacuum pipe (suction path) outside the holding member, so that the configuration is simplified, and the suction path is short, so that the substrate can be transported quickly.

It is a perspective view which shows the board | substrate conveyance apparatus which concerns on embodiment of this invention. It is a vertical side view which shows the said board | substrate conveyance apparatus. It is a top view which shows the said board | substrate conveyance apparatus. It is a block diagram which shows the connection of the electronic component of the said board | substrate conveyance apparatus. It is a vertical side view explaining the conveyance procedure of the wafer which concerns on embodiment of this invention. It is a flowchart explaining the conveyance procedure of the wafer which concerns on embodiment of this invention. It is a perspective view which shows the board | substrate conveyance apparatus based on other embodiment in this invention. It is a back sectional view showing a substrate transfer device concerning other embodiments in the present invention. It is a vertical side view which shows the power transmission part and power receiving part in the board | substrate conveyance apparatus which concerns on other embodiment in this invention. It is a perspective view which shows the power transmission part and power receiving part in the board | substrate conveyance apparatus which concern on other embodiment in this invention. It is a top view which shows the application | coating and image development apparatus provided with the board | substrate conveyance apparatus which concerns on embodiment of this invention. It is a perspective view which shows the said coating and developing apparatus. It is a vertical side view which shows the said coating and developing apparatus. It is a perspective view which shows the process block in the said coating and developing apparatus.

  As shown in FIGS. 1 to 3, an embodiment of the substrate transfer apparatus of the present invention is provided so as to be substantially rectangular parallelepiped-shaped transfer base 1, and can be moved forward and backward on this transfer base 1 so as to overlap each other. The first arm (upper arm) 2a and the second arm (lower arm) 2b are provided as holding members. As shown in FIG. 2, the transport substrate 1 is supported by a drive mechanism 12 via a drive shaft 11, and can be rotated around the vertical axis by the drive mechanism 12 and can be moved up and down. Yes. Further, when the forward direction of the arms 2a and 2b is the front, the transport base 1 is provided with a vertical portion 13 on the rear end side. The vertical portion 13 includes a first arm 2a and a second arm. Power transmission coils 14a and 14b, which are power transmission units for performing non-contact power feeding by electromagnetic induction to 2b, are provided at positions corresponding to the height positions of the arms 2a and 2b.

  Furthermore, the conveyance base | substrate 1 is provided with the transmission / reception part 17 for performing communication between each arm 2a, 2b, as shown in FIG. Further, the transfer substrate 1 is provided with a movement mechanism (not shown) for moving the arms 2a and 2b forward and backward, and further connected to a power cable (not shown) and an external control unit 6 drawn from the outside of the substrate transfer apparatus. A communication cable for communication between the two is connected.

  Next, although the structure of the 1st arm 2a and the 2nd arm 2b is explained in full detail, since both the arms 2a and 2b are the same structures, the 1st arm 2a is demonstrated as a representative. As shown in FIGS. 1 and 3, the first arm 2 a includes a holding portion 3 a for a wafer W formed in a horseshoe shape corresponding to the size of the wafer W, and a rear portion horizontally from an intermediate portion of the holding portion 3 a. And a handle portion 4a extending in the direction. The wafer holding portion 3a is provided with holding claws 31a protruding at three positions on the inner peripheral edge of the left and right positions and the rear position, and suction holes 32a for vacuum-sucking the wafer W are opened in each holding claw 31a. . The peripheral edge of the wafer W is held by these holding claws 31a and is vacuum-sucked.

  The rear end of the handle portion 4a is fixed to a substantially L-shaped moving frame 5a, and the vertical portion of the moving frame 5a is fixed to an advancing / retreating mechanism in the transport base 1, for example, a belt of a belt mechanism so as to advance and retreat. Has been. In addition, on the rear end side of the handle portion 4a, a power receiving coil 44a that is a power receiving portion is provided so as to face the power transmitting coil 14a provided on the vertical portion 13 of the transport base 1, and the first arm 2a. Is placed in a position (retracted position) that is retracted to the last part, power can be supplied from the power transmission coil 14a to the power reception coil 44a in a non-contact manner by electromagnetic induction.

  As shown in FIG. 3, the handle portion 4a is formed with a rectangular opening 40a at the center, and a battery 41a, a pressure detection unit 45a, and a transmission / reception unit 47a as a communication unit are provided in a portion surrounding the opening 40a. ing. A small vacuum pump 42a is attached in the opening 40a. A suction path 33a communicating with the suction hole 32a is formed inside the wafer holding portion 3a, and the proximal end side of the suction path 33a is connected to the vacuum pump 42a via an electromagnetic valve 43a. The pressure detector 45a is for detecting the pressure in the suction passage 33a. The battery 41a stores the electric charge supplied from the power receiving coil 44a, supplies power to electronic components such as the vacuum pump 42a, the pressure detection unit 45a, and the electromagnetic valve 43a, and transmits and receives data to and from the transfer substrate 1 described later. It has a role to supply power to necessary communication equipment.

  FIG. 4 is a block diagram showing power supply and electric signal paths for the components provided on the first arm 2a and the second arm 2b. In FIG. 4, converters 46a and 46b are for setting the voltages from the batteries 41a and 41b to a predetermined DC voltage and supplying them to the vacuum pumps 42a and 42b. The solenoids 431a and 431b are provided in the electromagnetic valves 43a and 43b shown in FIG. 3, and open and close the suction paths 33a and 33b by supplying power and stopping it. The I / F boards (interface boards) 48a and 48b convert the operation control signals (communication signals) sent from the transmission / reception unit 17 of the transport base 1 to the transmission / reception units 47a and 47b into signals of a format corresponding to each unit. Output to the solenoids 431a and 431b and the vacuum pumps 42a and 42b, and the pressure detection signals from the pressure detection units 45a and 45b are converted into communication signals so as to be conveyed through the transmission / reception units 47a and 47b. The transmitter / receiver 17 has a role to transmit.

As shown in FIG. 4, the transport base 1 is provided with an inverter 18, an I / O board (input / output board) 16, and a controller 15. The inverter 18 is for converting electric power supplied from the outside of the substrate transfer apparatus via a power source (not shown) into electric power of a predetermined level and frequency and sending the electric power to the power transmission coils 14a and 14b. The controller 15 has a power supply voltage based on the external power and has the following functions.
a) When the first arm 2a or the second arm 2b starts to advance toward the process module, a control signal sent from a control unit 6 provided outside the substrate transfer apparatus via a signal cable (not shown) The electromagnetic valves 43a and 43b are opened in the first arm 2a or the second arm 2b via the I / O board (input / output board) 16 and the transmission / reception unit 17 (the solenoids 431a and 431b are energized). And a command signal for driving the vacuum pumps 42a and 42b.
b) The pressure detection value sent from the first arm 2a or the second arm 2b side is compared with the set value for confirming the reduced pressure. The electromagnetic valves 43a and 43b are closed (the energization of the solenoids 431a and 431b is cut off) with respect to the first arm 2a or the second arm 2b to which it is determined that the pressure detection value has been sent, and the vacuum pump 42a , 42b is output, and the control unit 6 is notified of the determination result (comparison result).
c) When the control unit 6 is informed that the first arm 2a or the second arm 2b has advanced to the wafer W transfer position, the electromagnetic valve 43a is connected to the first arm 2a or the second arm 2b. A command signal for opening 43b is output, and the pressure detection value sent from the corresponding arm 2a, 2b is compared with a set value for confirming return to atmosphere. When the pressure detection value exceeds the set value, It is determined that the return is established, and the determination result is notified to the control unit 6.

  Further, the control unit 6 outside the substrate transfer apparatus is composed of, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program made of software, for example, in which instructions for controlling the function of the controller 15 and the operation of a substrate transfer apparatus described later are assembled. By reading this program to the control unit 6, the control unit 6 controls the operation of the substrate transfer apparatus. This program is stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card, and installed from the storage medium into a program storage unit that is a memory in the computer.

  Next, the effect | action in the above-mentioned embodiment is demonstrated, referring FIG.5 and FIG.6. Now, as shown in FIG. 5, the first arm 2a of the substrate transfer apparatus does not hold the wafer W, the second arm 2b holds the wafer W2, and both the arms 2a and 2b stand by. It is assumed that the transfer substrate 1 is moved in front of the process module in the state of being retracted to the position (FIG. 5A). In the flowchart of FIG. 6, this state is defined as step S1. At this time, the power receiving coils 44a and 44b of the arms 2a and 2b receive power from the power transmitting coils 14a and 14b of the transport base 1 by electromagnetic induction, and the batteries 41a and 41b are charged by the received power.

  Next, in accordance with a control signal from the control unit 6 outside the substrate transfer apparatus, the advance / retreat mechanism of the transfer substrate 1 is driven to advance the first arm 2a. For example, immediately before the first arm 2a moves forward or while the first arm 2a moves forward, from the controller 6, the controller 15 of the transport base 1, the transmitter / receiver 17 and the transmitter / receiver 47a of the first arm 2a. An operation signal is sent to the vacuum pump 42a, whereby the vacuum pump 42a is operated by electric power from the battery 41a (step S2). When the forward movement of the first arm 2a is completed, the transport base 1 is slightly lifted by the drive mechanism 12 to slightly lift the first arm 2a and is pushed up by the lifting pins in the module. The processed wafer W1 is received on the holding claws 31a of the wafer holding portion 3a of the first arm 2a and sucked by suction of the suction holes 32a (FIG. 5B and step S3). When the wafer W1 is delivered to the first arm 2a, the pressure detection value in the suction path 33a of the first arm 2a is transmitted to the controller 15 of the transport base 1 from the pressure detection unit 45a that operates by power feeding from the battery 41a. Then, it is determined whether or not the detected pressure value is equal to or less than a predetermined value (threshold for confirming the reduced pressure) (step S4). When the detected pressure value exceeds the predetermined value, the elapsed time since the vacuum pump 42a is operated is confirmed (step S5). When the state where the detected pressure value exceeds the depressurization confirmation threshold value continues for a preset time, an alarm signal is transmitted to the control unit 6 via the controller 15 of the transport substrate 1. As a result, an alarm is issued (step S6). When the pressure detection value becomes equal to or less than the predetermined value before the set time elapses, the controller 15 determines that the vacuum suction of the wafer W1 onto the first arm 2a has been established, and the command signal from the controller 15 1 is sent to the first arm 2a, the solenoid 431a is operated, the electromagnetic valve 43a of the first arm 2a is closed, and the vacuum pump 42a is stopped (step S7).

  Further, the controller 15 transmits a vacuum suction establishment determination signal to the control unit 6 outside the substrate transfer apparatus, whereby the control unit 6 outputs a control signal to the advancing / retreating mechanism of the transfer substrate 1 and the first arm. 2a is retracted and the second arm 2b is advanced (FIGS. 5C and 5D), and the wafer W2 is loaded into the process module (step S8). Thereafter, the suction of the wafer W2 onto the second arm 2b is canceled by opening the electromagnetic valve 43b of the second arm 2b (turning off the solenoid 431b) in response to a command signal from the controller 15 of the transfer substrate 1. (Step S9).

  The pressure detection value of the pressure detection unit 45b of the second arm 2b is constantly sent to the controller 15, and the controller 15 returns to the atmospheric pressure whether or not the pressure detection value is equal to or higher than the threshold value for returning to the atmosphere. It is determined whether or not it has been done (step S10). If the atmospheric pressure has not been reached, it is determined whether or not an elapsed time since the opening of the electromagnetic valve 43b has passed a preset time (step S11). The controller 15 transmits an alarm signal to the control unit 6 (step S12).

  When the detected pressure value has returned to the atmospheric pressure, the controller 15 sends a message to that effect to the control unit 6 and slightly lowers the second arm 2b by lowering the transport base 1 slightly by the drive mechanism 12. The wafer W2 is transferred from the second arm 2b to the lift pins in the process module (step S13). Thereafter, the second arm 2b is retracted by a command signal from the control unit 6 (step S14), and thus the exchange operation of the processed wafer W1 and the unprocessed wafer W2 for the process module is completed. In each of the arms 2a and 2b, the batteries 41a and 41b are charged as needed through the power transmission coils 14a and 14b and the power reception coils 44a and 44b in the retracted state.

  According to the above-described embodiment, when the wafer W is transferred to the arms 2a and 2b by vacuum suction, the arms 2a and 2b are provided with the vacuum pumps 42a and 42b and the batteries 41a and 41b. 14b and the power receiving coils 44a and 44b, the batteries 41a and 41b are charged, and the vacuum pumps 42a and 42b are operated by the electric power from the batteries 41a and 41b. Accordingly, there is no need to route the suction paths 33a and 33b outside the arms 2a and 2b, and the suction paths 33a and 33b can be shortened, so that the time required for evacuation is shortened. Therefore, the wafer W is transferred quickly. And high transport efficiency can be obtained.

  Further, since it is not necessary to route the suction passages 33a and 33b, it is not necessary to employ a complicated piping structure for suppressing piping resistance, and in particular, when the space between structures including the transfer area is narrow, The inside is simplified and very effective. Then, pressure detection units 45a and 45b are provided in the arms 2a and 2b, and the pressure detection values are sent to the controller 15 on the conveying base 1 side, and the controller 15 determines the magnitude of the pressure detection values. Based on the determination result, the arm 2a The operation command signals of the vacuum pumps 42a and 42b and the electromagnetic valves 43a and 43b are transmitted to the 2b side, and the determination result is transmitted to the control unit 6 outside the substrate transfer apparatus. Therefore, in the arms 2a and 2b, since the signal processing load is small, the power consumption can be reduced accordingly, which can contribute to the miniaturization of the batteries 41a and 41b.

  Further, after the pressure in the suction passages 33a and 33b is reduced to a predetermined pressure, the electromagnetic valves 43a and 43b are closed and the vacuum pumps 42a and 42b are stopped. The power consumption is small, and from this point, the batteries 41a and 41b can be downsized. By reducing the size of the batteries 41a and 41b, it is possible to reduce the weight of the arms 2a and 2b as a whole and to reduce the amount of power transmitted from the transport base 1 to the arms 2a and 2b. Since it is not necessary to secure a special stop time for power transmission, it does not hinder the speeding up of conveyance.

  Next, another embodiment of the present invention will be described with reference to FIGS. Since both arms 2a and 2b have the same structure, only the first arm 2a will be described as a representative. The main difference between this embodiment and the previous embodiment is that the moving frame is integrated on both the left and right sides of the handle portion of the arm 2a, and the power transmission from the power transmission section of the transport base 1 to the power reception section of the arm 2a is the arm. This is because it can be performed during the forward and backward movement of 2a, and the layout of the vacuum pump 42a and the pressure detector 45a is different. Specifically, as illustrated in FIG. 7, horizontally long rectangular openings 80 a and 81 a are formed side by side in the left-right direction in the handle portion 4 a, and in the opening 80 a on the front side, A vacuum pump 42a is provided, and a battery 41a is provided in the opening 81a on the rear side. Moreover, the pressure detection part 45a is provided in the site | part which remove | deviated from opening part 80a, 81a in the handle | pattern part 4a.

  Next, the power transmission unit and the power reception unit will be described. As shown in FIG. 8, a core portion 71a, which is an iron core, is provided on the side surface of the transport base 1 so as to extend along the movement path of the movement frame 75a. The moving frame 75a refers to a portion bent at one edge of the handle portion 4a. As shown in FIG. 9, the core portion 71a is provided with two ridges 76a so as to be lined up and down, and the ridges 76a and 76a are respectively provided with protrusions 76a and 76a. Guide lines 72a and 72a are arranged along the moving path of the moving frame 75a. As shown in FIG. 10, the guide wires 72 a and 72 a are connected to each other on the front end side (the holding portion 3 a side in FIG. 7), and the base end side is connected to the inverter 18 of the transport base 1. In other words, it can be said that one guide wire 72a is folded back on the front end side, arranged on the two ridges 76a and 76a, and connected to the inverter 18 of the transport base 1. That is, in this example, the induction wire 72a forms a single coil, and the core portion 71a and the induction wire 72a constitute a power transmission unit.

  As shown in FIGS. 8 and 9, the moving frame 75 a is provided with an E-shaped core portion 74 a that is an iron core, and the upper and lower concave portions 78 a and 78 a of the E-shaped portion have a core on the side of the conveying base 1. The protrusions 76a and 76a of the portion 71a are in a state of entering. Further, a pickup coil 73a is wound around the central protrusion 77a of the E-shaped portion, and this pickup coil 73a is connected to the battery 41a. For this reason, even when the arm 2a moves back and forth, by supplying a direct current to the induction wire 72a, a current is generated in the pickup coil 73a by electromagnetic induction. In this example, an E-type core portion 74a and a pickup coil 73a constitute a power reception unit.

  Also in such an embodiment, the operation is the same as the series of operations shown in FIG. 6 except that the transmission method to the battery 41a is different. According to such an embodiment, in addition to the effects of the previous embodiment, the battery 41a can be always charged without depending on the advance / retreat position of the arm 2a with respect to the transport base 1, thereby reducing the risk of insufficient electricity in the battery 41a. There is an advantage that can be.

  In the above-described embodiment, signals are transmitted and received in real time between the arms 2a and 2b and the transport base 1 by wireless communication. In this case, even if the arms 2a and 2b are stopped in the middle of operation due to some abnormality, a control signal is always sent to the arms 2a and 2b by wireless communication, so that the pressure detectors 45a and 45b, solenoids 431a and 431b, and The vacuum pumps 42a and 42b can be controlled. On the other hand, the timing that requires communication is limited to when the arms 2a and 2b are stopped at the forward position and the backward position. For this reason, infrared ports may be provided at the forward and backward positions of the arms 2a and 2b, and signals may be transmitted and received by infrared communication.

  Further, in the first arm 2a or the second arm 2b, the pressure is detected and the pressure detection value is sent to the controller 15 of the transport base 1, and the controller 15 detects the pressure detection value and the set value for confirming the decompression or returns to the atmosphere. The control command signal is transmitted to the first arm 2a or the second arm 2b or the control unit 6 outside the substrate transfer device based on the comparison result. By configuring in this way, power consumption in the first arm 2a or the second arm 2b is suppressed and it contributes to downsizing of the batteries 41a and 41b. However, the first arm 2a or the second arm 2b The arm 2b may perform processing for creating a control command by comparing the pressure detection value with the set value. In this case, for example, a small controller is mounted on the arms 2a and 2b. Including such a case, in the present invention, a detection signal (a signal corresponding to the pressure detection value or the comparison result in the above embodiment) corresponding to the detection value detected by the pressure detection units 45a and 45b from the arms 2a and 2b is used. It can be said that it is transmitting to the controller 15.

  In the above-described embodiment, for convenience of explanation, terms are used properly as control function units such as the controller 15 provided on the transfer substrate 1 and the control unit 6 provided outside the substrate transfer apparatus. 15 and the control unit 6 correspond to control units in a broad concept. In other words, in the above-described embodiment, the control unit as a broad concept is dispersed in the controller 15 provided on the transport substrate 1 and the control unit 6 outside the substrate transport apparatus. The controller 6 may be integrated outside the substrate transfer apparatus without providing the controller 15 in the substrate 1.

Next, an example of an embodiment in which the substrate transport apparatus of the present invention is provided in the coating and developing apparatus 8 will be described. FIG. 11 is a plan view of a resist pattern forming system in which an exposure apparatus C4 is connected to the coating and developing apparatus 8. FIG. 12 is a perspective view of the system. FIG. 13 is a longitudinal side view of the system.
The coating and developing device 8 is provided with a carrier block C1. In this carrier block C1, the transfer arm 84 takes out the wafer W from the sealed carrier 83 placed on the mounting table 82 and transfers it to the processing block C2, and the transfer arm 84 transfers the processed wafer W from the processing block C2. It is configured to receive and return to the carrier 83.

  As shown in FIG. 13, the processing block C2 includes a first block (DEV layer) B1 for performing development processing and a second processing for forming an antireflection film formed under the resist film. Block (BCT layer) B2, third block (COT layer) B3 for applying a resist film, and fourth block (ITC layer) for forming a protective film formed on the upper layer side of the resist film B4 is laminated in order from the bottom. In addition, the processing block C2 includes a shelf unit U5 for mediating delivery of the wafer W between the blocks B1 to B4 in the carrier block C1 and the processing block C2, and a shelf of the wafer W in the shelf unit U5. There is provided a delivery arm D1 for moving between, and a shelf unit U6 for mediating delivery of the wafer W between the blocks B1 to B4 and the interface block C3.

  Since the layers of the processing block C2 have the same planar layout, the third block (COT layer) B3 will be described as an example. The COT layer B3 includes a resist film forming module 89 for forming a resist film as a coating film, and a heating / cooling system processing module for performing pre-processing and post-processing of processing performed in the resist film forming module 89. A transfer arm A3 which is provided between the shelf units U1 to U4 constituting the group, the resist film forming module 89, and the processing module groups U1 to U4 of the heating / cooling system and delivering the wafer W between them. , Is configured. The shelf units U1 to U4 are arranged along a transport region R1 in which the transport arm A3 moves, and are configured by stacking a heating module and a cooling module, respectively.

  For the second block (BCT layer) B2 and the fourth block (ITC layer) B4, an antireflection film forming module and a protective film forming module corresponding to the resist film forming module 89 in the COT layer B3 described above are provided, respectively. In these modules, the configuration is the same as that of the COT layer B3 except that a chemical solution for forming an antireflection film and a chemical solution for forming a protective film are supplied to the wafer W as coating solutions instead of the resist.

  For the first block (DEV layer) B1, development modules corresponding to the resist film forming module 89 are stacked in two stages in one DEV layer B1, and the pre-processing and post-processing of this development module are performed. A shelf unit that constitutes a processing module group of the heating / cooling system is provided. In the DEV layer B1, a transfer arm A1 for transferring the wafer W is provided in the two-stage development module and the heating / cooling processing module. That is, the transport arm A1 is shared by the two-stage development module.

  Further, as shown in FIGS. 11 and 13, the processing block C2 is provided with a shelf unit U5, and the wafer W from the carrier block C1 is transferred to one delivery unit of the shelf unit U5, for example, a second block (BCT). Layer) is sequentially conveyed to the delivery unit CPL2 corresponding to B2. The transfer arm A2 in the second block (BCT layer) B2 receives the wafer W from the transfer unit CPL2 and transfers it to each unit (antireflection film forming module and heating / cooling processing unit group). Thus, an antireflection film is formed on the wafer W.

  Thereafter, the wafer W is sequentially transferred to the transfer unit BF2 of the shelf unit U5, the transfer arm D1, and the transfer unit CPL3 of the shelf unit U5, where the temperature is adjusted to 23 ° C., for example, and then the third block is transferred via the transfer arm A3. (COT layer) It is carried into B 3 and a resist film is formed by the resist film forming module 89. Further, the wafer W is transferred to the transfer unit BF3 of the shelf unit U5 by the transfer arm A3. Note that a protective film may be further formed on the wafer W on which the resist film is formed in the fourth block (ITC layer) B4. In this case, the wafer W is transferred from the transfer unit BF3 to the transfer arm A4 via the transfer arm D1 and the transfer unit CPL4. After the protective film is formed, the wafer W is transferred to the transfer unit TRS4.

  On the other hand, on the upper part in the DEV layer B1, a shuttle arm 85 which is a dedicated transfer means for directly transferring the wafer W from the transfer unit CPL11 provided in the shelf unit U5 to the transfer unit CPL12 provided in the shelf unit U6. Is provided. The wafer W on which the resist film and further protective film are formed is transferred from the transfer unit BF3 or TRS4 to the transfer unit CPL11 via the transfer arm D1, and is directly transferred from here to the transfer unit CPL12 of the shelf unit U6 by the shuttle arm 85. Then, the data is taken into the interface block C3 from the interface arm 86 provided in the interface block C3. In FIG. 13, the delivery unit attached with CPL also serves as a cooling unit for temperature control, and the delivery unit attached with BF also serves as a buffer unit on which a plurality of wafers W can be placed. .

  Next, the wafer W is transferred by the interface arm 86 to the exposure apparatus C4, where a predetermined exposure process is performed. Thereafter, the wafer W is placed on the transfer unit TRS6 of the shelf unit U6 via the interface arm 86 and returned to the processing block C2. The returned wafer W is subjected to development processing in the first block (DEV layer) B1, and transferred to the transfer unit TRS1 of the shelf unit U5 by the transfer arm A1. Thereafter, it is returned to the carrier 83 via the delivery arm 84. The substrate transfer device of the present invention is applied to transfer arms A1 to A4 in the coating and developing device 8.

  Here, for example, the transfer arm A3 of the COT layer B3 in which the substrate transfer apparatus of the present invention is provided will be described with reference to FIG. 14 on behalf of the transfer arms A1 to A4. The transfer arm A3 includes a horizontal moving portion 87 that moves along the transfer region R1 and a lifting base 88 that moves the horizontal moving portion 87 up and down. The transfer base 88 rotates about the vertical axis. It is provided freely.

  The coating / developing apparatus 8 includes the above-described control unit 6 made of, for example, a computer, and the program storage unit of the control unit 6 stores a program in which instructions for performing coating and developing processes are set. . Control signals are output from the control unit 6 and the controller 15 in accordance with the program, and the transfer of the wafer W and the operation of each module are controlled. The program is also stored in the program storage unit while being stored in the storage medium described above.

  In the embodiment of the coating and developing apparatus 8 as well, the substrate transfer apparatus of the present invention is similar to the series of operations shown in FIGS. An unprocessed wafer W is exchanged.

W Wafer 1 Transport base 14a, 14b Power transmission coil 15 Controller 17 Transport base transceiver unit 2a First arm (upper arm)
2b Second arm (lower arm)
3a, 3b Wafer holding portions 31a, 31b Holding claws 32a, 32b Suction holes 33a, 33b Suction passages 4a, 4b Handle portions 41a, 41b Batteries 42a, 42b Vacuum pumps 43a, 43b Electromagnetic valves 44a, 44b Power receiving coils 45a, 45b Pressure detection Sections 47a, 47b Arm transmission / reception sections 5a, 5b Moving frame 6 Control sections 72a, 72b guide wires 73a, 73b outside the transport base Pickup coil 8 Coating / developing device 82 Mounting table 83 Carrier 84 Delivery arm 85 Shuttle arm 86 Interface Arm 87 Horizontal moving part 88 Elevating base 89 Resist film forming modules A1 to A4 Transfer arm D1 delivery arm in processing block

Claims (11)

A transport base provided movably,
A holding member which is configured to hold the substrate by vacuum suction, and which is provided on the transport base so as to freely move between a forward position for transferring the substrate and a retracted position for holding the substrate and waiting. In the substrate transfer device
The transport base includes a guide wire that extends in the front-rear direction along the side surface and is energized,
The holding member is
A suction path having one end opened as a suction hole for adsorbing the substrate;
A vacuum pump provided on the other end of the suction path;
A battery for supplying power to the vacuum pump;
A moving frame facing the side surface of the transport substrate;
A coil that is provided in the moving frame in the vicinity of the guide wire to generate a current by electromagnetic induction when the holding member is advanced and retracted, and forms a power receiving unit for charging the battery;
And a communication unit for receiving a signal for adsorbing or releasing the substrate from a control unit provided outside the holding member.   The structure according to claim 1, wherein the transport base is provided with a first holding member and a second holding member, which are arranged as spaced apart from each other as the holding member. The substrate transfer apparatus according to claim 1, further comprising: The holding member includes a pressure detection unit that detects a pressure in the suction path,
The said communication part is provided with the function which transmits the detection signal according to the detected value detected by the said pressure detection part to the control part provided outside the said holding member. Substrate transfer device. The suction path is provided with a solenoid valve,
4. The substrate transfer device according to claim 1, wherein after the substrate is adsorbed, the electromagnetic valve is closed and the vacuum pump is stopped. 5. The transport base includes a communication unit for communicating with the communication unit provided on the holding member, and a controller.
The controller is configured to transmit a vacuum pump stop command to the holding member side via the communication unit when the pressure detection value sent from the pressure detection unit becomes equal to or lower than a threshold value for confirming the pressure reduction. The substrate transfer apparatus according to claim 3, wherein the substrate transfer apparatus is configured. A transport base provided movably, and a holding member provided on the transport base so as to be movable back and forth between a forward position for transferring the substrate and a retracted position for holding the substrate and waiting.
The holding member includes a suction path whose one end opens as a suction hole for adsorbing the substrate, a vacuum pump connected to the other end side of the suction path, and a moving frame facing the side surface of the transport base,
The transport substrate uses a substrate transport device provided with a guide wire that extends in the front-rear direction along the side surface and is energized.
Advancing the holding member without holding the substrate and activating the vacuum pump, the holding member receiving the substrate;
Next, the step of retracting the holding member while maintaining the suction state of the suction path;
Next, the holding member is moved forward while holding the substrate, and the pressure in the suction path is returned to atmospheric pressure;
Subsequently, a step of transferring the substrate from the holding member;
When the holding member advances and retracts, a current is generated by electromagnetic induction in a coil provided in the moving frame in the vicinity of the guide wire, and the battery is charged;
And feeding the vacuum pump from the battery.   The transport substrate is provided with a first holding member and a second holding member, which are disposed as a holding member at a distance from each other in the vertical direction, and each of the holding members is configured as described in claim 6. The substrate transport method according to claim 6, further comprising: The step of retracting the holding member is performed after the pressure in the suction path is detected by a pressure detection unit provided in the holding member and the pressure detection value is confirmed to be equal to or lower than a threshold value for confirming the pressure reduction. Done,
The step of transferring the substrate from the holding member is performed after the pressure in the suction path is detected by the pressure detection unit and it is confirmed that the detected pressure value has returned to atmospheric pressure. The substrate carrying method according to claim 6 or 7.   9. The method according to claim 6, wherein after the adsorption of the substrate is performed, a step of closing a solenoid valve provided in the suction path and stopping the vacuum pump is performed. Substrate transport method. The transport base includes a communication unit for communicating with a communication unit provided on the holding member, and a controller.
A step of transmitting a vacuum pump stop command to the holding member side via the communication unit when the detected pressure value sent from the pressure detection unit is equal to or lower than a threshold for depressurization confirmation; The substrate carrying method according to claim 8, wherein the substrate carrying method is performed. A storage medium storing a computer program used in a substrate transfer device for transferring a substrate by vacuum suction,
A storage medium characterized in that the computer program is for carrying out the substrate carrying method according to any one of claims 6 to 10.

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