CN105097592A - Photoelectric scanning method and device for silicon wafer distribution state in semiconductor device bearing area - Google Patents
Photoelectric scanning method and device for silicon wafer distribution state in semiconductor device bearing area Download PDFInfo
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- CN105097592A CN105097592A CN201510337909.0A CN201510337909A CN105097592A CN 105097592 A CN105097592 A CN 105097592A CN 201510337909 A CN201510337909 A CN 201510337909A CN 105097592 A CN105097592 A CN 105097592A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Abstract
The invention discloses a photoelectric scanning method and device for a silicon wafer distribution state in a semiconductor device bearing area. Two photoelectric sensors respectively as a transmitting end and a receiving end are arranged at opposite positions of a U-shaped end part of a mechanical arm which is located at the side edge of the circumference of a silicon wafer bearing device; the mechanical arm provides horizontal and vertical and/or positioned movement for the photoelectric sensors; and the bearing device and the mechanical arm can do relative rotation and/or positioned movement. Through the strength or width change of feedback value receiving time of the two oppositely emitting type photoelectric sensors along with a shielding range, scanning detection is carried out for abnormal distribution states of the silicon wafers, e.g., the silicon wafers are protruded, the silicon wafers are laminated, the silicon wafers are oblique or no silicon wafer exists; furthermore, multiple scanning detection points are arranged around the bearing device, so that the detection precision is further improved. Therefore, according to the photoelectric scanning method and device, the silicon wafer distribution state in the silicon wafer semiconductor device bearing area can be detected exactly and rapidly, damage to the silicon wafers and the device caused by movement of the mechanical arm is well avoided, and the implementation is simple.
Description
Technical field
The present invention relates to semiconductor processing equipment technical field, particularly relate to a kind of silicon chip distribution scan method of semiconductor equipment bearing area, the invention still further relates to a kind of silicon chip distribution scanning means of semiconductor equipment bearing area.
Background technology
The secure access of silicon chip and to transport be the large production line of integrated circuit very important technical indicator, in process of production, usually require the silicon chip fragment rate caused due to conveying equipment self should be less than 100,000/.Further, as batch type wafer heat system, relative to one chip process system, the chip transmission needed for each production technology, silicon chip place and to get sheet number of times more, thus require higher to the safety and reliability that sheet was placed and got to chip transmission, silicon chip.
At present, manipulator is widely used in semiconductor integrated circuit manufacturing technology field, manipulator is the visual plant in silicon chip transmission system, for the silicon chip accessing and transport before PROCESS FOR TREATMENT and after PROCESS FOR TREATMENT, it can accept instruction, certain accurately navigating on three-dimensional or two-dimensional space a bit carries out picking and placeing silicon chip, both can pick and place operation to single piece of silicon chip, and also can pick and place operation to many pieces of silicon chips.
But, when manipulator is when picking and placeing operation to silicon chip, especially, when the situations such as the temperature distortion that silicon chip causes in transmitting procedure or heat treatment process can cause silicon chip on carrier, be in projected state or be in lamination, inclined tab or without sheet state time, often produce collision cause silicon chip or equipment impaired, cause irretrievable loss.
Refer to Fig. 1, Fig. 1 be in prior art manipulator chip transmission, silicon chip is placed and gets sheet time positional structure schematic diagram.As shown in the figure, when silicon chip 2 is in the abnormalities such as protrusion on carrier 3, manipulator 1 is in non-fully operating state in the motion of automatic access silicon chip 2, is very easy to the damage causing silicon chip 2 and equipment (comprising manipulator 1).
Therefore, after manipulator 1 completes silicon chip placement or before preparing to get sheet, the silicon chip distribution in silicon chip group 2 on carrier 3 need be identified accurately, provide accurate counter-measure to the various abnormalities identified simultaneously, pick and place sheet to realize safety.
At present, the identification of the silicon chip distribution of batch type wafer heat system is generally adopt simple photosignal moving sweep method to identify the distribution of silicon chip on carrier 3, this scan method is only in lamination to the silicon chip in silicon chip group 2, inclined tab or without abnormalities such as sheets time, there is certain Detection results, but when if silicon chip is in projected state on carrier 3, just can not detect well, that is, abnormal or normal result is simply drawn by prior art, in moving sweep process or easily produce collision cause silicon chip or equipment impaired, often produce simultaneously and fail to report, the situation of wrong report.
Along with the development of semiconductor integrated circuit manufacturing technology, the secure access of silicon chip is had higher requirement with transporting, namely also more and more higher to the accurate control overflow of manipulator.Therefore, how quick and precisely to detect the silicon chip distribution in silicon chip semiconductor equipment bearing area, avoid robot movement to cause silicon chip and equipment damage, become the technical barrier that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
First object of the present invention is to provide a kind of silicon chip distribution scan method of semiconductor equipment bearing area, quick and precisely can detect the silicon chip distribution in silicon chip semiconductor equipment bearing area, avoids robot movement to cause silicon chip and equipment damage.Second object of the present invention is to provide a kind of silicon chip distribution scanning means of semiconductor equipment bearing area.
In order to realize above-mentioned first object, the invention provides a kind of silicon chip distribution scan method of semiconductor equipment bearing area, on the manipulator being positioned at silicon wafer carrier circumference side, be provided with optoelectronic scanning unit, described optoelectronic scanning unit comprises the horizontal correlation photoelectric sensor of two transmitting terminal and receiving terminals each other; Described photoelectric sensor lays respectively at the U-shaped end relative position of described manipulator, said method comprising the steps of:
Step S1, setting robot movement scan initiation parameter and perform initialization; Wherein, described moving sweep initiation parameter comprises manipulator level and/or vertical scan motion speed, the horizontal step distance of the spacing distance of silicon chip, each time manipulator, horizontal initial point position and terminating point position initial point position vertical with up/down and terminating point position;
The abnormality scan round instruction of step S2, execution silicon chip lug; It specifically comprises:
Step S21: described manipulator location corresponds to described carrier first and places the vertical starting point of silicon chip and horizontal initial point position;
Step S22: according to mutually transmitting and receiving the value of feedback time of reception of light signal between two described photoelectric sensors with the change of blocking in scope generation intensity, judge whether corresponding silicon chip exists the abnormality of lug; If so, step 25 is performed; Otherwise, perform step S23;
Step S23: described manipulator sequentially declines or rise the spacing distance of a silicon chip, judges whether described position is the vertical terminating point position of up/down; If so, step S24 is performed; Otherwise, perform step S22;
Step S24: described manipulator to advance a default horizontal step distance along described supporting region center position, judges whether described position is horizontal end point position; If so, step S3 is performed; Otherwise, perform step S22;
Step S25: the abnormal alarm information sending lug, performs step S23;
Step S3: perform the abnormal scan instruction of silicon chip distribution, according to the distribution of value of feedback light signal strength in Scanning Detction region of transmitting and receiving mutually between two described photoelectric sensors, judge whether the abnormality that there is inclined tab, lamination and/or empty sheet.
Preferably, described carrier or described manipulator comprise rotating unit, described rotating unit makes described manipulator around the motion for the relative rotation of described carrier, and there is N number of rotation detection stop position on whole described carrier side week, perform once described step S2 in each detection position, obtain one group of corresponding testing result; Finally N group testing result is carried out and computing, obtains the lug abnormality distribution situation of final silicon chip, wherein, N be more than or equal to 2 positive integer.
Preferably, in described N number of location point, the anglec of rotation of adjacent two positions is identical, selects to be set as follows: A. is when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
If the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of the described carrier strong point, then need to reset starting point and rotation angle value.
Preferably, in described step S2, described manipulator in the horizontal direction each mobile and horizontal step distance is equal or reduce gradually; And described horizontal original position is relevant to the position that silicon chip is in when falling extreme position, described horizontal end point position is relevant to the parameters of braced structure of carrier.
Preferably, described step S3 comprises:
Step S31: according to the thickness of silicon chip, the spacing distance of adjacent silicon chip and the thickness of carrier, obtains the moving sweep region judging inclined tab, lamination and empty sheet respectively;
Step S32: described manipulator is positioned to obtain terminating point position vertical with up/down, horizontal movement terminating point position from described step S24;
Step S33: mutually transmit and receive the predetermined detection area of light signal and the light signal shelter width situation in this region according between two described photoelectric sensors, judge whether corresponding silicon chip placement location exists the abnormality of inclined tab, lamination and/or empty sheet successively; If so, step S35 is performed; Otherwise, directly perform step S34;
Step S34: described manipulator sequentially declines or rise the spacing distance of a silicon chip, judges whether described position is the vertical terminating point position of up/down; If so, terminate; Otherwise, perform step S33;
Step S35: send the abnormal state information that relevant position exists inclined tab, lamination and/or empty sheet, performs step S34.
Preferably, described carrier or described manipulator comprise rotating unit, described rotating unit makes described manipulator around the motion for the relative rotation of described carrier, and there is M rotation detection stop position on whole described carrier side week, perform once described step S3 in each detection position, obtain one group of corresponding testing result; Finally M group testing result is carried out and computing, obtain final silicon chip distribution abnormal conditions result; Wherein, M is for being more than or equal to 2 positive integers.
Preferably, in a described M location point, the anglec of rotation of adjacent two positions is identical, selects to be set as follows: A. is when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
If the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of the described carrier strong point, then need to reset starting point and rotation angle value.
In order to realize above-mentioned second object, the invention provides a kind of silicon chip distribution scanning means of semiconductor equipment bearing area, comprising optoelectronic scanning unit and control unit; Optoelectronic scanning unit is arranged on the manipulator of the circumference side of described carrier, and moves with described manipulator, carries out moving and scanning in level and/or vertical preset direction; Optoelectronic scanning unit comprises two photoelectric sensor of transmitting terminal and receiving terminal and rotating units each other; Described photoelectric sensor lays respectively at the U-shaped end relative position of manipulator; And rotating unit is done to do relative to described manipulator the motion rotating and/or locate for driving described carrier, or described manipulator is driven to do the motion rotating and/or locate relative to described carrier; Control unit is used for start detection and the photoelectricity intensity of process acquisition and distribution situation result, obtains the abnormality distribution situation of described silicon chip on carrier; Wherein, described abnormality comprises the state of silicon chip protrusion, inclined tab, lamination and/or empty sheet.
Preferably, described manipulator has many grippers, arranges one or more optoelectronic scanning unit at the relative position of the U-shaped tip inside of any one or more gripper.
Preferably, described control unit connects warning device, and described control unit controls the keying of described warning device according to abnormality distribution situation.
As can be seen from technique scheme, the silicon chip distribution scan method of semiconductor equipment bearing area provided by the invention and device, after two stages and silicon chip transmission sheet complete and before getting sheet, whether quick and precisely detect silicon chip region in carrier has the unusual distributions of silicon chip protrusion, inclined tab, lamination and/or empty sheet to diagnose, and around carrier the multiple Scanning Detction point of laying, further increasing accuracy of detection, avoid robot movement well and cause silicon chip and equipment damage.Experiment proves, technical scheme of the present invention realizes simple, respond well.
Accompanying drawing explanation
Fig. 1 be in prior art manipulator chip transmission, silicon chip is placed and gets sheet time position view
Fig. 2 is the photoelectric sensor of the silicon chip distribution scanning means of semiconductor equipment bearing area in the embodiment of the present invention, lays respectively at the structural representation of manipulator U-shaped end relative position
Fig. 3 is the testing process schematic diagram that in the embodiment of the present invention, silicon chip exists outstanding unusual distributions
Fig. 4 is the schematic flow sheet of silicon chip distribution scan method one preferred embodiment of semiconductor equipment bearing area of the present invention
Fig. 5 is that in the embodiment of the present invention, silicon chip is in positional structure schematic diagram when silicon chip falls extreme position
Fig. 6 is the Computing Principle schematic diagram in the embodiment of the present invention between manipulator distance silicon chip center during minimum safe distance
Fig. 7 is the overall control flow chart that the silicon chip distribution of semiconductor equipment bearing area in the embodiment of the present invention detects
Fig. 8 is that in the embodiment of the present invention, manipulator is detecting the motion track schematic diagram in the outstanding unusual distributions process of silicon chip existence
Fig. 9 is tab abnormality scan round instruction control flow journey schematic diagram in the embodiment of the present invention
Figure 10 is the flow chart that the inventive method performs the abnormal scan instruction of silicon chip distribution
The concrete control flow schematic diagram of a preferred embodiment of the abnormality that there is inclined tab, lamination and/or empty sheet is judged whether in Figure 11 embodiment of the present invention
Figure 12 is the position relationship parameter schematic diagram of silicon chip and carrier in the embodiment of the present invention
[in figure Reference numeral]:
Manipulator 1, silicon chip group 2, carrier 3, optoelectronic scanning unit 4
Embodiment
For making content of the present invention clearly understandable, below in conjunction with Figure of description, content of the present invention is described further.Certain the present invention is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection scope of the present invention.Secondly, the present invention's detailed statement that utilized schematic diagram to carry out, when describing example of the present invention in detail, for convenience of explanation, schematic diagram, should in this, as limitation of the invention not according to general ratio partial enlargement.
It should be noted that, the silicon chip distribution scan method of semiconductor equipment bearing area provided by the invention, be adopt to arrange optoelectronic scanning unit on the manipulator being positioned at silicon wafer carrier circumference side, this optoelectronic scanning unit comprises the horizontal correlation photoelectric sensor of two transmitting terminal and receiving terminals each other; Two photoelectric sensors lay respectively at the U-shaped end relative position of manipulator.
In semiconductor applications, manipulator generally has single gripper or many grippers, to adapt to the needs of mass production.In some enforcements of the present invention are grinned, manipulator can have many grippers, at the relative position of the U-shaped tip inside of any one or more gripper, one or more optoelectronic scanning unit is set, the following examples are only positioned on manipulator for an optoelectronic scanning unit, and on this manipulator, also only have a gripper, other embodiment principle is identical, does not repeat them here.
The scanning means adopted in the embodiment of the present invention comprises optoelectronic scanning unit 4 and control unit (not shown).Refer to Fig. 2, Fig. 2 is two correlation photoelectric sensor of the silicon chip distribution scanning means of semiconductor equipment bearing area in the embodiment of the present invention, lays respectively at the structural representation of manipulator U-shaped end relative position.As shown in Figure 2, optoelectronic scanning unit 4 is arranged on the manipulator 1 of the circumference side of carrier (bearing area), and in level and/or vertical preset direction, carries out running fix with manipulator 1 and realize Scanning Detction; That is, optoelectronic scanning unit 4 moves is that movement by manipulator 1 realizes.
Optoelectronic scanning unit 4 generally includes two photoelectric sensor of transmitting terminal and receiving terminal and rotating unit (not shown) each other, and two photoelectric sensors lay respectively at the U-shaped end relative position of manipulator 1; Further, two photoelectric sensor 4 set-points connect straight words, and this straight line is parallel relative to ground.Rotating unit does for driving carrier 3 relative mechanical hand 1 motion rotating and/or locate, or driving device hand 1 does the motion rotating and/or locate relative to carrier 3.In testing process, a photoelectric sensor in normal light electric scanning unit 4 is as receiving terminal, and another is then as transmitting terminal.
Control unit (not shown) is used for start detection and the photoelectricity intensity of process acquisition and distribution situation result, and obtains the abnormality distribution situation of silicon chip group 2 on carrier according to result; Wherein, abnormality comprises the state of silicon chip protrusion, inclined tab, lamination and/or empty sheet; Further, control unit also connects warning device, and this control unit can control the keying of warning device according to abnormality distribution situation.
As can be seen from foregoing description, whether be by calculate the photosignal feedback intensity that between the photoelectric sensor of two each other transmitting terminal and receiving terminals obtain and distribution situation realize, as shown in Figure 2 if having unusual distributions to carry out diagnosing for the silicon chip in silicon chip group 2 at carrier 3.If the distance of two photoelectric sensors 4 is X, so, the value of X need guarantee that manipulator 1 can be specified size dimension silicon chip and do not interfere phenomenon with silicon chip by normal scan in motion process.
In an embodiment of the present invention, before whether region has the unusual distributions of silicon chip inclined tab, lamination and/or empty sheet in carrier 3 in detection silicon chip group 2, first need whether have the unusual distributions of protrusion correctly to evaluate with regard to silicon chip group 2 region in carrier 3.
Refer to Fig. 3, Fig. 3 is the testing process schematic diagram that in the embodiment of the present invention, silicon chip exists outstanding unusual distributions.As shown in the figure, the value of feedback time of reception of two correlation photoelectric sensor that optoelectronic scanning unit 4 comprises can produce the change in intensity along with the scope of blocking.In the normal situation of detection, the scan-data of clear is had in order to obtain silicon chip some positions on carrier 3, this intensity variation having the judgement of clear to be received by photoelectric sensor judges, namely teaching central value is scanned for benchmark with silicon chip, if the luminous intensity return value of photoelectric sensor receiving terminal is less than assign thresholds α, then think and have object to block in respective regions, return state value is 1, and the silicon chip represented on this carrier 3 relevant position is in outstanding abnormality; If the luminous intensity return value of photoelectric sensor receiving terminal is more than or equal to assign thresholds α, then think that respective regions is interior without object, return state value is 0, and the silicon chip represented on this carrier 3 relevant position is in normal condition.
As shown in Figure 3, the detection time that abscissa occurs puts t1, t2, t3, t4 is relevant with the moving sweep speed of manipulator 1, therefore, can determine the state of silicon chip according to the starting point of time detecting results change and scope, its paranormal projecting degree can be calculated simultaneously, obtain the diagnostic result whether each silicon chip placement location can carry out safely technique or unloading.
The embodiment of scan method is the optoelectronic scanning unit 4 be arranged on the manipulator 1 in semiconductor heat treatment equipment is below example, is introduced design of the present invention.
Refer to Fig. 4, Fig. 4 is the schematic flow sheet of silicon chip distribution scan method one preferred embodiment of semiconductor equipment bearing area of the present invention.As shown in the figure, the silicon chip distribution scan method of semiconductor equipment bearing area can comprise the following steps:
Step S1, in testing process, first need set the Scanning Detction track of two correlation photoelectric sensor 4 (being alternatively setting manipulator 1), and moving sweep initiation parameter perform initialization; Wherein, moving sweep initiation parameter comprises manipulator level and/or vertical scan motion speed, the horizontal step distance of the spacing distance of silicon chip, each time manipulator, horizontal initial point position and terminating point position initial point position vertical with up/down.
Particularly, before testing process starts, can by the controling parameters of teaching manipulator 1 in advance, these controling parameters can control manipulator 1 in the direction of presetting and position, also the Scanning Detction track of two correlation photoelectric sensor 4 with regard to respective settings.
The original position of the Scanning Detction each time of manipulator 1 Scanning Detction track is determined by horizontal initial point position initial point position vertical with up/down, the vertical initial point position of up/down is two positions, the position that upper vertical initial point position is placed corresponding to the top layer silicon chip of silicon chip group 2, the position that lower vertical initial point position is placed corresponding to the base silicon wafer of silicon chip group 2.
In testing process, if from upper vertical initial point position, so next detection position is exactly the spacing distance of an adjacent silicon chip of sequentially declining, until lower vertical initial point position; In like manner, if from lower vertical initial point position, so next detection position is exactly the spacing distance of an adjacent silicon chip of sequentially rising, until upper vertical initial point position.
For the mobility detect region of horizontal detection scanning direction, determined by the dimensional parameters of the structural parameters of carrier and silicon chip, namely the position that is in when falling extreme position of horizontal original position and silicon chip is relevant, and horizontal end point position is relevant to the parameters of braced structure of carrier 3.Refer to Fig. 5 and Fig. 6, Fig. 5 is that in the embodiment of the present invention, silicon chip is in positional structure schematic diagram when falling extreme position; Fig. 6 is the Computing Principle schematic diagram in the embodiment of the present invention between manipulator distance silicon chip center during minimum safe distance.
As shown in Figure 5, when supposing that silicon chip center of gravity is positioned at the supporting construction edge of carrier 3 (departing from normal position Y to manipulator 1 direction) for silicon chip can not the maximum displacement position of landing supporting construction, the horizontal original position of this Scanning Detction to the distance at carrier 3 center should be more than or equal to silicon chip in silicon chip group 2 and fall the distance of extreme position to carrier 3 center.
As shown in the figure, setting this Scanning Detction original position distance carrier 3 centre distance is Z, the time variate simultaneously setting horizontal detection scanning is b (t), b (t) represents the real-time distance at distance between center line supporting construction center between two photoelectric sensors 4 on manipulator 1, so, original position is detected, b (0)=Z in horizontal sweep; In addition, for considering safe clearance, b (t)=Y+ δ is the distance of distance carrier 3 structure centre formally obtaining silicon chip distribution; Wherein:
X is the distance between the transmitting terminal of two photoelectric sensors on manipulator 1 and receiving terminal;
Y is carrier 3 radius, and namely the central point of carrier 3 is to the length at its edge;
R is the radius of silicon chip in silicon chip group 2, and namely silicon chip center is to the length at its edge;
S is the spacing distance between adjacent two panels silicon chip, and when namely silicon chip group 2 lies in a horizontal plane on carrier 3, two adjacent silicon chip centers are in the distance of vertical direction;
γ is the silicon chip inclination angle of setting relative to true horizontal position, it will be apparent to those skilled in the art that the thickness of common layer of silicon is generally 0.7mm, is 300mm or 200mm silicon chip relative to diameter, namely, when its radius is 150mm or 100mm, the ratio of silicon chip 2 thickness d/r is less than 1/100.Therefore, when calculating the angle of inclination of silicon chip, the thickness d of silicon chip can be approximately 0, at this moment, the relation at this inclination angle can be calculated as follows into:
tan(γ)＝s/Y,
γ (0)=arctan (s/Y), namely the value size of γ (0) is determined by structural design
Refer to Fig. 6, when silicon chip center of gravity is positioned at supporting construction edge, the projection of silicon chip in abswolute level plane that this extreme position tilts is then:
If Z is the scanning starting position of the limit, namely manipulator 1 center is in this positional distance carrier 3 centre distance, and namely detect original position in horizontal sweep, b (0)=Z, so considers safe clearance;
δ >0, for safe clearance set point, namely the safe distance that the motion that manipulator 1 now does vertical direction can not interfere with silicon chip, whether this value size also has an impact at same level line with the U-shaped port center of above-mentioned X, r and silicon chip center and manipulator 1, therefore, when detecting, need the center line of the photoelectric sensor 4 of the launch and accept each other on U-shaped port and silicon chip be located in one plane as far as possible.Further, the photoelectric sensor 4 in same plane on manipulator 1 and the distance between silicon chip 2 between center need to be greater than:
That is, when limit bit scan does not detect that silicon chip is abnormal, be namely equivalent under silicon chip inclination conditions, manipulator 1 moves following distance in the horizontal direction, and in the vertical direction motion still can not produce with the silicon chip tilted to be interfered;
After horizontal sweep starting point has set, also need setting for manipulator 1 at every turn to carrier 3 center position displacement be c (t), wherein, t=0,1,2,3 Manipulator 1 in the horizontal direction each mobile and horizontal step distance can be the same or different, and such as, can reduce gradually.
If a (t) is intermediate length variable, at every turn can the distance of safety moving for manipulator 1, a (0)=0; B (t) is intermediate length variable, i.e. the real-time distance at manipulator 1 centre-to-centre spacing silicon chip center, b (0)=Z; H (t) is intermediate length variable, for calculating the inclination angle that silicon chip tilts, h (0)=Y; So,
b(t)＝b(t-1)–a(t)
Refer to Fig. 7, Fig. 7 is the overall control flow chart that the silicon chip distribution of semiconductor equipment bearing area in the embodiment of the present invention detects.As shown in the figure, above-mentioned initiation parameter is determined also, just can wait for and receive silicon chip distribution scan instruction, carries out actual testing process after obtaining instruction with regard to directly starting.If initialization step failure, then quote out-of-the way position and result, wait for artificial disposal or dispose by regulation.
Consult Fig. 8 and Fig. 9 incorporated by reference to Fig. 3 and Fig. 7, Fig. 8 is that in the embodiment of the present invention, manipulator is detecting the motion track schematic diagram in the outstanding unusual distributions process of silicon chip existence.Fig. 9 is scan round instruction control flow journey schematic diagram in the embodiment of the present invention.
The abnormality scan round instruction of step S2, execution silicon chip lug;
It should be noted that, step S2 comprises limit prescan instruction in Fig. 7 and abnormality scan round instruction two step: photoelectric sensor 4 performs the first round from top to bottom, or scanning motion from top to bottom, correspond to the execution limit prescan instruction in Fig. 7, be in or without silicon chip the situation falling the limit for detecting, namely obtain the limit bit scan result of all silicon chip placement locations, the result of all positions asked and computing simultaneously, result has following two kinds:
A. normal, then carry out formal scanning motion, enter next step action as without exception, other wheel scan motion namely next performed is then perform scan round, for detecting the situation being in corresponding projecting degree with or without silicon chip;
B. abnormal, quote out-of-the way position and result, wait for artificial disposal or dispose by regulation.
After executing above-mentioned first round limit prescan instruction, in step S2, other wheel scan detects is exactly perform the abnormality scan round instruction of silicon chip lug.Two in step S2 can be summarized as follows by the statement in Fig. 4 step by step together:
Step S21: manipulator 1 locates the vertical starting point and horizontal initial point position that correspond to and carrier 3 is placed first silicon chip;
Step S22: according to mutually transmitting and receiving the value of feedback time of reception of light signal between two photoelectric sensors 4 with the change of blocking in scope generation intensity, judge whether the silicon chip of relevant position exists the abnormality of lug; If so, step S25 is performed; Otherwise, perform step S23;
Step S23: manipulator 1 sequentially declines or the spacing distance of the silicon chip that rises, and first judges whether this position is the vertical terminating point position of up/down; If so, step S24 is performed; Otherwise, perform step S22;
Step S24: manipulator 1 to advance a default horizontal step distance along carrier 3 center position, judges whether this position is horizontal end point position; If so, step S3 is performed; Otherwise, perform step S22; Step S3 is for performing the abnormal scan instruction of silicon chip distribution.
Step S25: send lug abnormal alarm information, continues to perform step S23.
In some embodiments of the invention, when manipulator 1 to move to silicon chip center move a step time, first need judge the situation of b (t):
If I. b (t) >=Y+ δ
c(t)＝a(t)
h(t)＝h(t-1)+a*cos(γ-1)
γ(t)＝arctan(s/(h(t)))
Namely along with the change of silicon chip center, tilt angle gamma (t) the meeting respective change of silicon chip, manipulator 1 is to structure centre direction displacement c (t) of carrier 3;
If II. b (t) <Y+ δ
c(t)＝b(t-1)–(Y+δ)
b(t)＝Y+δ
Namely manipulator 1 is to carrier 3 center position displacement c (t), namely stops at the position of distance carrier 3 centre distance obtaining silicon chip distribution.
After having obtained all silicon chip placement location scanning results, then providing the alarm of assigned address exception as found that there is out-of-the way position, having waited for artificial disposal or disposing by regulation.
Giving prominence to abnormal scanning single side due to execution silicon chip can not diagnose silicon chip to give prominence to abnormal distribution situation at supporting region completely, therefore, in some embodiments of the invention, can by arranging a rotating unit on carrier 3 or manipulator 1, this rotating unit makes to make manipulator 1 around carrier 3 motion for the relative rotation, and multiple rotation detection stop positions are set at the lateral periphery of whole described carrier 3, perform the operation of a step S2 in each detection position, obtain one group of corresponding testing result; Finally being undertaken organizing testing result and computing more, obtaining the abnormality distribution of final silicon chip lug, the distribution that namely can realize carrying out silicon chip multi-angle detects.
According to the supporting construction feature of carrier 3, multiple location point can be uniformly distributed, also can uneven distribution; Such as, for avoiding the support column of carrier 3, can in the detection that again sets up an office apart from the position of 10 °, the left and right of this support column or 20 °.
For the situation that the anglec of rotation of two positions adjacent in multiple location point is identical, select to be set as follows:
A. when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
Certainly, if the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of carrier 3 strong point, then need to reset starting point and rotation angle value.
Then, the circumferentially detection position that just can generate by conflict free starting point and the setting anglec of rotation, obtain the state of giving prominence to situation distribution in whole bearing area with or without silicon chip, each detection position obtains a component cloth state value, then ask and computing the state outcome of the distributing position of all detection positions, result has two kinds:
A. normal, then can carry out the sheet of getting after the operation after placing silicon chip or scanning and operate.
B. exception, quotes out-of-the way position and result is disposed for user, provides user operation option according to abnormal results simultaneously.
Next, consult Figure 10 incorporated by reference to Fig. 4, Figure 10 is the flow chart that the inventive method performs the abnormal scan instruction of silicon chip distribution.
Step S3: perform the abnormal scan instruction of silicon chip distribution, according to the distribution of value of feedback light signal strength in Scanning Detction region of transmitting and receiving mutually between two photoelectric sensors, judge whether the abnormality that there is inclined tab, lamination and/or empty sheet.
Refer to Figure 10, step S3 can specifically comprise the steps:
Step S31: according to the thickness of the thickness of silicon chip, the spacing distance of adjacent silicon chip and carrier 3, obtains the moving sweep region judging inclined tab, lamination and empty sheet;
Step S32: manipulator is positioned to obtain terminating point position vertical with up/down, horizontal movement terminating point position from step S24;
Step S33: mutually transmit and receive the predetermined detection area of light signal and the light signal shelter width situation in this region according between two photoelectric sensors, judge whether corresponding silicon chip placement location exists the abnormality of inclined tab, lamination and/or empty sheet successively; If so, step S35 is performed; Otherwise, directly perform step S34;
Step S34: manipulator 3 sequentially declines or the spacing distance of the silicon chip that rises, and judges whether this position is the vertical terminating point position of up/down; If so, terminate; Otherwise, perform step S33;
Step S35: send the abnormal state information that relevant position exists inclined tab, lamination and/or empty sheet, performs step S34.
Refer to Figure 11, in Figure 11 embodiment of the present invention, judge whether the concrete control flow schematic diagram of a preferred embodiment of the abnormality that there is inclined tab, lamination and/or empty sheet.In this embodiment, sequentially carry out during the abnormal state detection of inclined tab, lamination and/or empty sheet.
Particularly, refer to Figure 12, Figure 12 is the position relationship parameter schematic diagram of silicon chip and carrier in the embodiment of the present invention.If setting silicon wafer thickness value d, teaching reference position is d/2, and between adjacent silicon chip, spacing is s, the spacer thickness of carrier 2 is t, according in different scanning areas, the situation of the return value state 1/0 of photoelectric sensor receiving terminal, the distribution that can obtain silicon chip is as shown in table 1 below.
Table 1
As can be seen from above-mentioned table 1, can according in predetermined detection area and the light signal shelter width situation in this region, the return value namely detected judges whether occur inclined tab in respective regions, lamination or without sheet phenomenon.As for inclined tab situation, at moving sweep region [2* (d+d*1/3), S-d*1/3] in scope, if there is the width G reatT.GreaT.GT=d of shaded areas in testing result, so just can conclude and inclined tab phenomenon has appearred in this relevant position, if there is the width <0.1d of shaded areas in testing result, so just can conclude and inclined tab phenomenon does not appear in this relevant position, if there is the width of shaded areas in testing result not in above-mentioned two situation scopes, so control unit can send prompting message to alarm unit or send the information again performing detection, until obtain all silicon chip placement location scanning results, the alarm of assigned address exception is then provided if any out-of-the way position, wait for artificial disposal or dispose by regulation.
In addition, because the scanning single side performing silicon chip inclined tab, lamination and/or empty sheet exception can not diagnose silicon chip to give prominence to abnormal distribution situation at supporting region completely, therefore, identical with step S2, in some embodiments of the invention, can by arranging rotating unit at carrier 3 or manipulator 1, this rotating unit makes manipulator 1 around carrier 3 motion for the relative rotation, the lateral periphery that this rotary motion can be implemented in carrier 3 arranges multiple detection position, perform the operation of a step S3 in each detection position, obtain one group of corresponding testing result; Finally being undertaken organizing testing result and computing more, obtaining the abnormality distribution of final silicon chip inclined tab, lamination and/or empty sheet, namely can detect in more detail in distribution circumferentially silicon chip.
And according to the supporting construction feature of carrier 3, multiple location point can be uniformly distributed, also can uneven distribution; Such as, for avoiding the support column of carrier 3, can in the detection that again sets up an office apart from the position of 10 °, the left and right of this support column or 20 °.
For the situation that the anglec of rotation of two positions adjacent in multiple location point is identical, select to be set as follows:
A. when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
Certainly, if the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of carrier 3 strong point, then need to reset starting point and rotation angle value.
Then, the circumferentially detection position that just can generate by conflict free starting point and the setting anglec of rotation, obtain the situation that there is inclined tab, lamination and/or empty sheet in whole bearing area with or without silicon chip, each detection position obtains a component cloth state value, then ask and computing the state outcome of the distributing position of all detection positions, result has two kinds:
A. normal, then can carry out the sheet of getting after the operation after placing silicon chip or scanning and operate.
B. exception, quotes out-of-the way position and result is disposed for user, provides user operation option according to abnormal results simultaneously.
In addition, then refer to Fig. 7, after in the end whether being there is the detection scanning result of inclined tab, lamination and/or empty sheet, can carry out the determining step of technique, the idiographic flow step of this step presents in the figure 7, does not repeat them here.
Although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (10)
1. the silicon chip distribution optoelectronic scanning method of a semiconductor equipment bearing area, it is characterized in that, on the manipulator being positioned at silicon wafer carrier circumference side, be provided with optoelectronic scanning unit, described optoelectronic scanning unit comprises the horizontal correlation photoelectric sensor of two transmitting terminal and receiving terminals each other; Described photoelectric sensor lays respectively at the U-shaped end relative position of described manipulator, said method comprising the steps of:
Step S1, setting robot movement scan initiation parameter and perform initialization; Wherein, described moving sweep initiation parameter comprises manipulator level and/or vertical scan motion speed, the horizontal step distance of the spacing distance of silicon chip, each time manipulator, horizontal initial point position and terminating point position initial point position vertical with up/down and terminating point position;
The abnormality scan round instruction of step S2, execution silicon chip lug; It specifically comprises:
Step S21: described manipulator location corresponds to described carrier first and places the vertical starting point of silicon chip and horizontal initial point position;
Step S22: according to mutually transmitting and receiving the value of feedback time of reception of light signal between two described photoelectric sensors with the change of blocking in scope generation intensity, judge whether the silicon chip of relevant position exists the abnormality of lug; If so, step S25 is performed; Otherwise, perform step S23;
Step S23: described manipulator sequentially declines or rise the spacing distance of a silicon chip, first judges whether described position is the vertical terminating point position of up/down; If so, step S24 is performed; Otherwise, perform step S22;
Step S24: described manipulator to advance a default horizontal step distance along described supporting region center position, judges whether described position is horizontal end point position; If so, step S3 is performed; Otherwise, perform step S22;
Step S25: send lug abnormal alarm information, continues to perform step S23;
Step S3: perform the abnormal scan instruction of silicon chip distribution, according to the distribution of value of feedback light signal strength in Scanning Detction region of transmitting and receiving mutually between two described photoelectric sensors, judge whether the abnormality that there is inclined tab, lamination and/or empty sheet.
2. scan method according to claim 1, it is characterized in that, described carrier or described manipulator comprise rotating unit, described rotating unit makes described manipulator around the motion for the relative rotation of described carrier, and there is N number of rotation detection stop position on whole described carrier side week, perform once described step S2 in each detection position, obtain one group of corresponding testing result; Finally N group testing result is carried out and computing, obtain final silicon chip lug abnormality distribution, wherein, N be more than or equal to 2 positive integer.
3. scan method according to claim 2, is characterized in that, in described N number of position, the anglec of rotation of adjacent two positions is identical, selects to be set as follows:
A. when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
If the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of the described carrier strong point, then need to reset starting point and rotation angle value.
4. scan method according to claim 1, is characterized in that, in described step S2, described manipulator in the horizontal direction each mobile and horizontal step distance is equal or reduce gradually; And described horizontal original position is relevant to the position that silicon chip is in when falling extreme position, the parameters of braced structure of described horizontal end point position and carrier and relevant.
5., according to the scan method of claim 1,2,3 or 4 described in any one, it is characterized in that, described step S3 comprises:
Step S31: according to the thickness of silicon chip, the spacing distance of adjacent silicon chip and the thickness of carrier, obtains the moving sweep region judging inclined tab, lamination and empty sheet;
Step S32: described manipulator is positioned to obtain terminating point position vertical with up/down, horizontal movement terminating point position from described step S24;
Step S33: mutually transmit and receive the predetermined detection area of light signal and the light signal shelter width situation in this region according between two described photoelectric sensors, judge whether corresponding silicon chip placement location exists the abnormality of inclined tab, lamination and/or empty sheet successively; If so, step S35 is performed; Otherwise, directly perform step S34;
Step S34: described manipulator sequentially declines or rise the spacing distance of a silicon chip, judges whether described position is the vertical terminating point position of up/down; If so, terminate; Otherwise, perform step S33;
Step S35: send the abnormal state information that relevant position exists inclined tab, lamination and/or empty sheet, performs step S34.
6. scan method according to claim 5, it is characterized in that, described carrier or described manipulator comprise rotating unit, described rotating unit makes described manipulator around the motion for the relative rotation of described carrier, and there is M rotation detection stop position on whole described carrier side week, perform once described step S3 in each detection position, obtain one group of corresponding testing result; Finally M group testing result is carried out and computing, obtain final silicon chip distribution abnormal conditions result; Wherein, M is for being more than or equal to 2 positive integers.
7. scan method according to claim 6, is characterized in that, in a described M location point, the anglec of rotation of adjacent two positions is identical, selects to be set as follows:
A. when remainder=0 of (the 360 °/setting anglec of rotation):
Accumulative number=360, detection position °/setting anglec of rotation
The actual anglec of rotation=setting anglec of rotation
B. when remainder ≠ 0 of (the 360 °/setting anglec of rotation):
Accumulative detection position number=(the 360 °/setting anglec of rotation) rounds (after fractions omitted point)+1
The actual anglec of rotation=360 °/accumulative detection position number
If the detection position coordinate figure generated by revolution starting point and the setting anglec of rotation conflicts with the coordinate position of the described carrier strong point, then need to reset starting point and rotation angle value.
8. adopt a device for the silicon chip distribution optoelectronic scanning method of the arbitrary described semiconductor equipment bearing area of claim 1 ~ 7, it is characterized in that, comprising:
Optoelectronic scanning unit, is arranged on the manipulator of the circumference side of described carrier, and moves with described manipulator, carries out moving and performing Scanning Detction in level and/or vertical preset direction, and it comprises the photoelectric sensor of two transmitting terminal and receiving terminals each other; Described photoelectric sensor lays respectively at the U-shaped end relative position of manipulator;
Control unit, also processes the photoelectricity intensity and distribution situation result that obtain, obtains the abnormality distribution situation of described silicon chip on carrier for start detection; Wherein, described abnormality comprises the state of silicon chip protrusion, inclined tab, lamination and/or empty sheet; And
Warning device, is connected with described control unit, and described control unit controls the keying of described warning device according to abnormality distribution situation.
9. device according to claim 8, is characterized in that, described manipulator has many grippers, arranges one or more optoelectronic scanning unit at the relative position of the U-shaped tip inside of any one or more gripper.
10. scanning means according to claim 8, it is characterized in that, also comprising rotating unit, for driving described carrier to do the motion rotating and/or locate relative to described manipulator, or driving described manipulator to do the motion rotating and/or locate relative to described carrier.
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| CN201510337909.0A CN105097592B (en) | 2015-06-17 | 2015-06-17 | The silicon chip distribution optoelectronic scanning method and device of semiconductor equipment bearing area |
| PCT/CN2015/082297 WO2016201718A1 (en) | 2015-06-17 | 2015-06-25 | Detection method and device for distribution state of silicon wafer in semiconductor device loading region |
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| CN201510337909.0A CN105097592B (en) | 2015-06-17 | 2015-06-17 | The silicon chip distribution optoelectronic scanning method and device of semiconductor equipment bearing area |
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| WO2016201718A1 (en) | 2016-12-22 |
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