CN115332136A - Transmission device for wafer and tray combination and control method - Google Patents
Transmission device for wafer and tray combination and control method Download PDFInfo
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- CN115332136A CN115332136A CN202211248935.2A CN202211248935A CN115332136A CN 115332136 A CN115332136 A CN 115332136A CN 202211248935 A CN202211248935 A CN 202211248935A CN 115332136 A CN115332136 A CN 115332136A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
The application discloses a transmission device and a control method for wafer and tray combination. The transmission device is used for combining the wafer and the tray in the loading part, the using state of the tray is detected before combination, whether the tray needs to be replaced or not is judged, whether the wafer is stably placed on the tray or not is detected after combination, whether the edge cutting of the wafer and the edge cutting of the tray are accurately overlapped or not is detected, therefore, the wafer is correctly placed in the tray and is reliably combined with the tray, the normal operation of the next procedure can be ensured, the flying disc is avoided, the using efficiency of equipment is improved, and the service life of parts is prolonged.
Description
Technical Field
The application relates to the field of semiconductor equipment, in particular to a transmission device and a control method for wafer and tray combination.
Background
The preparation stage of epitaxial growth needs to put the wafer into the containing part of the tray and then transfer the wafer into the reaction chamber for epitaxial growth of the wafer. Currently, the wafer is taken by a robot, moved to a predetermined position (which is usually in a closed environment), and then placed on a tray, and the combined tray assembly is transferred to the next process. In this way, the wafer and the tray are not positioned accurately and cannot be confirmed manually, and if the wafer is not placed in the accommodating portion of the tray, the wafer is likely to fly out of the tray (also called a flyer) in the subsequent epitaxial growth process. When the situation occurs, the reaction chamber needs to be opened for cleaning, reaction gas needs to be introduced into the reaction chamber due to the fact that the temperature needed in the epitaxial growth process is higher (more than 1500 ℃), the reaction chamber needs to be cooled and the reaction gas in the reaction chamber needs to be cleaned before the reaction chamber is opened, then wafers and the like are cleaned, the reaction chamber needs to be heated again after the treatment is completed, impurities in the reaction chamber are cleaned, and the whole process is very complicated, time-consuming and needs a professional to operate.
Disclosure of Invention
To solve the above existing disadvantages, the present application aims to: a transmission device and a control method for wafer and tray combination are provided. The transmission device improves the combination precision of the wafer and the tray and improves the utilization rate of the CVD equipment.
In order to achieve the purpose, the following technical scheme is adopted in the application:
a transfer device for a wafer and tray combination, comprising:
a loading component and a carrying component, wherein the loading component and the carrying component are arranged on the base plate,
the carrying assembly comprises a first manipulator and a second manipulator,
the loading part includes:
a shell, wherein a clamping component and a supporting component are arranged in the shell,
the clamping assembly is used for clamping the wafer transmitted by the first mechanical arm,
the supporting component set up in the bottom of cavity in the casing, and be located press from both sides the below side of getting the subassembly, the supporting component includes: the cylindrical support part is used for receiving the tray transmitted by the second manipulator, a channel penetrating along the axial direction of the cylindrical support part is arranged in the cylindrical support part and used for accommodating the telescopic part, and a connecting part is arranged on the outer circumference of the cylindrical support part and connected to the driving assembly and enables the cylindrical support part to rotate based on the driving of the driving assembly;
the top of casing is provided with camera device, first range finding sensor and second range finding sensor, camera device is used for obtaining the image information after wafer and tray combination, first range finding sensor and second range finding sensor are used for obtaining the surface information of wafer respectively and transmit to control module respectively. Through the design, the wafer is placed in the front of the tray, the second ranging sensor is used for detecting the surface information of the tray to judge the use condition of the tray, the wafer is placed in the rear of the tray, the first ranging sensor is used for detecting whether the wafer is obliquely placed on the tray, the camera device is used for detecting the position relation between the trimming edge of the wafer and the trimming edge of the tray, and therefore the wafer is ensured to be correctly placed in the tray, and the flying piece or flying disc condition is avoided.
In one embodiment, one side of the cylindrical supporting part is provided with a bearing part which is used for bearing the tray,
the side, far away from the bearing part, of the cylindrical supporting part is fixed at the bottom of the inner cavity of the shell through a bearing assembly.
In an embodiment, the transmission device for the combination of the wafer and the tray further comprises a jacking component, wherein the jacking component is positioned on the lower side of the cylindrical supporting part, and the telescopic part of the jacking component extends into the channel.
In an embodiment, the transmission device for the combination of the wafer and the tray further includes a support, the support is disposed on the top of the housing, a lifting motor is disposed on the support, an output end of the lifting motor is connected to the image pickup device, and the lifting motor is controlled to adjust a focal length of the image pickup device.
In an embodiment, the transmission device for wafer and tray combination further includes a third distance measuring sensor disposed at the bottom of the housing, the third distance measuring sensor is electrically connected to the control module, and the third distance measuring sensor is used for detecting the edge of the tray.
In one embodiment, the grasping assembly includes: a bottom plate, a first clamping jaw, a second clamping jaw and a guide rail,
the guide rail is arranged on one side of the bottom plate, the first clamping jaw and the second clamping jaw are fixed on the guide rail in a sliding mode through connecting pieces respectively, the first clamping jaw and the second clamping jaw are provided with recesses respectively, and the two recesses are combined to clamp a wafer.
The embodiment of the application provides a control method for a transmission device for combining a wafer and a tray, which comprises the following steps:
s1: transferring the wafer to a predetermined position in the loading part based on the first manipulator;
s2: clamping the wafer based on the clamping assembly;
s3: placing the tray on the cylindrical support part based on the second manipulator;
s4: tray detection, namely, the cylindrical supporting part is rotated based on the driving of the driving component,
detecting the positioning hole at the bottom of the tray by using a third distance measuring sensor to detect the position of the trimming edge of the tray, an
Measuring information on the surface of the tray by using a second ranging sensor and feeding the measured information back to the control module, wherein the control module judges the current state information of the tray based on the received information;
s5: the wafer and the tray are combined, namely the wafer is jacked up from the clamping component by utilizing the telescopic part to move up to a specified position, the first clamping jaw and the second clamping jaw of the clamping component move oppositely, and the telescopic part slowly moves down to place the wafer on the tray;
s6: the cylindrical supporting part is driven to rotate based on the driving assembly, meanwhile, the first distance measuring sensor is used for detecting the information of the wafer and feeding the information back to the control module, and the control module judges whether the wafer is placed correctly or not;
s7: based on the shooting device, the combined tray assembly is shot and the shot image information is fed back to the control module, the control module judges whether the wafer is correctly placed in the tray or not based on the received image information,
if yes, taking out the tray assembly from the supporting part based on a second mechanical arm and moving the tray assembly to a first preset position,
and if not, taking out the tray assembly from the supporting part based on the second manipulator, moving the tray assembly to a second preset position, and sending prompt information. The control method ensures the reliable combination of the wafer and the tray, improves the use efficiency of the CVD equipment and ensures the yield of the grown epitaxial wafer.
In one embodiment, the step S4 includes:
the control module compares the information fed back by the second distance measuring sensor with a preset value,
and if the tray needs to be replaced, sending out prompt information.
In one embodiment, the step S6 includes:
when the control module judges that the wafer is not placed correctly based on the information fed back by the first distance measuring sensor, the tray assembly is taken out from the supporting part in a rotating mode and moved to a second preset position based on the second mechanical arm, and prompt information is sent out.
In one embodiment, the step S7 includes:
the control module respectively obtains and judges the tangent line of the wafer and the tangent line of the tray through data processing based on the received image information,
if the two tangent lines are parallel or the included angle between the two tangent lines is within the specified angle, the judgment is normal, otherwise, the judgment is abnormal, and prompt information is sent.
Advantageous effects
According to the transmission device, the detection of the tray and the wafer is realized through the configured camera device and the first/second distance measuring sensor; the wafer is placed in the tray, the second ranging sensor is used for detecting the surface information of the tray, the thickness information of the tray is obtained to judge the use condition of the tray, the abnormal tray is replaced in time, the first ranging sensor is used for detecting whether the wafer is placed on the tray in an inclined mode after the wafer is placed on the tray, the camera device is used for detecting the position relation between the trimming edge of the wafer and the trimming edge of the tray, the wafer is placed in the tray correctly, the flying wafer or flying disc situation is avoided, damage to CVD equipment caused by the flying wafer or flying disc is avoided, the use efficiency of the CVD equipment is greatly improved, and the yield of grown epitaxial wafers is guaranteed.
Drawings
The accompanying drawings are included to provide an understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure. The shapes and sizes of the various elements in the drawings are not to be considered as true proportions, but rather are merely intended to illustrate the context of the application.
Fig. 1 is a schematic half-sectional view of a conveying device for wafer and tray combination according to an embodiment of the present disclosure.
Fig. 2 is a schematic perspective view illustrating a transfer device for wafer and tray assembly according to an embodiment of the present disclosure.
Fig. 3 is a schematic isometric view of a half-section structure of a transfer device for wafer and tray assembly according to an embodiment of the present application.
Fig. 4 is a schematic perspective view illustrating a hidden housing of a transmission device for wafer and tray combination according to an embodiment of the present disclosure.
Fig. 5 is a schematic diagram of a thickness detection of a tray according to an embodiment of the present application.
Fig. 6 is a schematic view illustrating the detection of the wafer after the wafer is placed on the tray according to the embodiment of the present disclosure.
Fig. 7 is a schematic view illustrating the detection of the image capturing device after the wafer and the tray are combined according to the embodiment of the present application.
Fig. 8 is a schematic structural diagram of a system of a transport device for wafer and tray assembly according to an embodiment of the present invention.
Fig. 9 is a schematic view of the position of the damper of the transport apparatus according to the embodiment of the present application.
Fig. 10 is a flowchart illustrating a method for controlling a transfer device for wafer and tray assembly according to an embodiment of the present disclosure.
Reference numerals: 1-a wafer; 10-a loading member; 11-a housing; 12 a-a first access; 12 b-a second access; 20-a first manipulator; 30-a second manipulator; 40-a tray; 50-a support member; 60-jacking components; 70-a drive assembly; 71-a synchronizing wheel; 72-a synchronous belt; 80-a grasping assembly; 90-a visual photographing component; 91-a support; 92-an auxiliary light source; 93-window gland; 101-a first ranging sensor; 102-a second ranging sensor; 103-a third ranging sensor; 110-a wafer cassette; 120-an intermediate chamber; 130-a process chamber; 141-a first air lock; 142-a second air lock; 150-edge finder.
Detailed Description
The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions employed in the examples may be further adjusted as determined by the particular manufacturer, and the conditions not specified are generally those used in routine experimentation.
The application discloses a transmission device and a control method for wafer and tray combination. The wafer is placed on the containing part of the tray (also called combination of the wafer and the tray) in the loading part through the control method, the using state of the tray is detected before combination, whether the tray needs to be replaced is judged, whether the wafer is stably placed on the tray after combination is detected, whether the trimming edge of the wafer is superposed with the trimming edge of the tray is detected (or the included angle of the tangent line corresponding to the trimming edge is within a preset range), and therefore the wafer is reliably placed on the tray, the reliable combination of the wafer and the tray is realized, the normal operation of the next process is ensured, the utilization rate of equipment is improved, and the using efficiency of CVD equipment and the service life of parts are improved.
The transfer device for wafer and tray combination (hereinafter referred to as transfer device) proposed in the present application will be described with reference to fig. 1 to 9.
The transmission device includes: a loading member 10 and a handling assembly,
the handling assembly comprises a first robot 20 and a second robot 30,
the loading member 10 has a tetragonal shape, and has a housing 11, and the housing 11 has a cavity 11a. Preferably, the housing 11 has a main body and a cover plate covering an opening at one side of the main body (the cover plate is located at the top of the housing).
A first inlet/outlet 12a is provided at one side of the housing 11, a second inlet/outlet 12b is provided at an adjacent side of the first inlet/outlet 12a, the first inlet/outlet 12a and the second inlet/outlet 12b are respectively communicated with the chamber 11a in the housing 11, a first damper 141 is provided at the first inlet/outlet 12a of the housing 11, and a second damper 142 is provided at the second inlet/outlet 12b (see fig. 8 and 9). The first damper 141 side is in the atmosphere, and the second damper 142 is connected to the middle chamber 120. The intermediate chamber 120 is typically a vacuum environment. The first robot 20 is disposed on the first port 12a side of the loading part 10 to pick up a wafer, and the second robot 30 is disposed on the second port 12b side and is located in the middle chamber 120.
The housing 11 has a gripper assembly 80, a support member 50 and a driving assembly 70,
the clamping assembly 80 is located at the middle upper portion of the chamber, and is used for clamping the wafer 1 transferred by the first robot 20,
the support member 50 is disposed at the bottom of the chamber,
the supporting member includes a cylindrical supporting portion 51, one side of the cylindrical supporting portion 51 is provided with a bearing portion 51a, the bearing portion 51a is used for bearing the tray 40 transmitted by the second manipulator 30, the side, far away from the bearing portion 51a, of the cylindrical supporting portion 51 is fixed on the bottom of the cavity through a bearing assembly 53, the cylindrical supporting portion 51 is arranged in a hollow mode and is provided with a channel 51b penetrating along the axial direction of the cylindrical supporting portion, the channel 51b is communicated with a through hole in the bottom of the cavity, and a connecting portion 52 is arranged on the outer circumference of the cylindrical supporting portion 51. The lower side of the supporting member 50 is provided with a jacking member 60, the jacking member 60 is fixed on the housing 11, the jacking member 60 has a telescopic part 61, and the telescopic part 61 penetrates through the through hole part and extends into the channel 51 b. The cylindrical support portion is also referred to as a support portion.
The driving assembly 70 includes a driving portion 70a, an output end of the driving portion 70a is connected to a timing wheel 71, an output end 71a of the timing wheel 71 is connected to a connecting portion 52 in a circumferential direction of the cylindrical supporting portion 51 via a timing belt 72,
the timing wheel 71 is rotated by the driving of the driving portion 70a, and the output end 71a of the timing wheel 71 is rotated by the rotation of the timing wheel 71, and the cylindrical support portion 51 is rotated by the timing belt 72.
The bottom of the housing is provided with a third mounting portion for mounting a third distance measuring sensor 103. The third distance measuring sensor 103 is used to detect a predetermined position of the tray 40 (e.g., a tray positioning hole through which position information of a tray trim is obtained).
The top of casing 11 is provided with the vision subassembly 90 of shooing, and this vision subassembly 90 of shooing includes:
and the camera device (such as a camera) is fixed on the bracket 91, the bracket 91 is fixed on the top of the shell 11, the camera part of the camera device is opposite to the shell 11 and is provided with a transparent window 11b, and the transparent window 11b isolates the cavity of the loading part 10 from the outside through a window gland 93 and a sealing rubber ring. The bracket 91 has a lifting motor (not shown), and the output end of the lifting motor is connected to the camera device, so that the focus of the camera device can be adjusted based on the lifting motor. Preferably, the vision photographing assembly 90 further has an auxiliary light source 92 disposed around the camera device. Preferably, the secondary light source 92 is annular. The shell on the same side of the camera device is provided with a first installation part and a second installation part, wherein the first installation part is used for installing a first distance measuring sensor 101, and the second installation part is used for installing a second distance measuring sensor 102.
In one embodiment, the chuck assembly 80 includes a base 81, a rail 84 disposed on one side of the base 81, and two jaws (82a, 82b) slidably mounted on the rail 84 by a connector 83, each having a recess (e.g., recess 82a1 in jaw 82 a), the jaws moving toward each other, the combination of the recesses gripping the wafer 1 (see fig. 4). In this embodiment, the jaws (82a, 82b) are each pneumatically driven to slide along the rails 84.
When the wafer is placed on the tray (also called wafer and tray combination),
the first robot 20 takes out the wafers from the wafer cassette 110 (the wafers are sequentially discharged in the wafer cassette 110), and the wafers are detected by the edge finder 150 and then enter the loading unit 10 through the first inlet/outlet 12 a. In this process, the second damper 142 is closed (to close the second port 12 b), the first damper 141 is opened, the first robot 20 enters the chamber 11a through the first port 12a, after the wafer is transferred to the clamping assembly, the first robot 20 moves out of the loading part 10, and the first damper 141 is closed.
The second robot arm 30 transfers the empty tray 40 into the loading part 10. In this process, the second damper 142 is opened to open the second inlet/outlet 12b, and the first damper 141 is closed to close the first inlet/outlet 12a, while the interior of the housing 11 is in a vacuum environment, so as to prevent dust from falling on the wafer or the tray.
The wafers transferred by the first robot are combined with the trays transferred by the second robot in the loading part, and the combined tray assembly is transferred to a process chamber 130 (also referred to as a reaction chamber) by the second robot 30 and is epitaxially grown in the process chamber 130.
A control method using the above-described transmission apparatus is described next with reference to fig. 1 to 9 in conjunction with fig. 10. The method comprises the following steps:
s1: and transferring the wafer to a preset position in the loading part based on the first mechanical arm.
In this step, the control module (also called the upper computer) transmits a signal to the first robot 20 (also called the wafer robot), and the first robot 20 receives and moves to the pod 110 in response to the signal, and takes 1 wafer from the pod 110 and transfers the wafer to a predetermined position of the loading part through the first inlet/outlet. The wafer 1 is edge-searched by the edge finder 150 before entering the loading unit. The edge finder is used to position the wafer to a specified angle (find the cut edge of the wafer). In one embodiment, after the wafer is placed in the wafer box 110, the upper computer sends a signal to the wafer robot 20 to perform a wafer sweeping operation, and the wafer robot 20 moves up/down and checks the positions and the number of the wafers in the wafer box 110 based on its own sensor, and uploads the check data to the upper computer.
S2: the wafer is clamped based on the clamping assembly.
The method comprises the following steps: the control module (such as an upper computer) sends an instruction to enable the clamping assembly to be opened, then the telescopic portion 61 of the jacking component is controlled to move upwards to jack the wafer to the specified position of the top, the first mechanical arm withdraws from the loading component, the control module controls the clamping jaws of the clamping assembly to move oppositely to the preset position, and then the telescopic portion is controlled to descend to the specified position to clamp/hold the wafer. In this embodiment, the jaws may be pneumatically driven on the guide rails. The telescopic part can move based on the driving of the air cylinder.
S3: the tray is placed on the cylindrical support portion based on the second robot.
In this step, the control module (e.g., upper computer) sends an instruction to make the second manipulator 30 transfer the tray to a preset position in the chamber of the loading part through the second entrance and exit, and then descends to a specified position to place the tray on the cylindrical support part, and the second manipulator exits;
s4: the tray is detected by the tray detecting device,
in the step, a control module (such as an upper computer) controls a driving assembly to enable a cylindrical supporting part to rotate for one circle (or multiple circles), a third distance measuring sensor at the bottom is used for detecting a positioning hole at the bottom of the tray so as to detect the position of the edge cutting of the tray,
the tray positioning hole position control module based on the detection of the upper computer controls the driving assembly to enable the cylindrical supporting part to rotate to a specified angle (the combination of a follow-up tray and a wafer is convenient), the second distance measuring sensor is used for measuring the information on the surface of the tray while the cylindrical supporting part rotates, the measured information is fed back to the control module, the control module judges the current state of the tray based on the received information, and if the tray needs to be replaced, a replacement prompt is sent. Preferably, the control module compares the received information with a preset value to judge whether the tray is used and needs to be replaced, the use thickness delta H is preset on the assumption that the initial height H1 between the tray 40 and the second ranging sensor 102 is equal to or larger than H1-H2, the actually measured maximum thickness is H2, the tray is judged to be normal when the delta H is larger than or equal to H1-H2, and the tray needs to be replaced when the delta H is smaller than H1-H2.
S5: the wafer is combined with the tray.
In the step, a control module (such as an upper computer) controls an expansion part of a jacking component to move up to a specified position so as to jack the wafer from a clamping jaw, a top clamping jaw is opened, and the expansion part slowly moves downwards;
s6: the control module controls the driving assembly to rotate the cylindrical supporting part for one circle (or multiple circles), and simultaneously, the first distance measuring sensor 101 is used for detecting the information of the wafer and feeding the information back to the control module, and the control module judges whether the wafer is correctly placed (whether the wafer is obliquely placed). In the mechanism of the present embodiment (see fig. 6), it is assumed that the initial height between the wafer and the first distance measuring sensor is H4, the actually measured maximum height is H3, and the offset gap Δ H2 is preset, and when Δ H2 > H4-H3, it is determined that the wafer is correctly placed; otherwise, the placement is judged to be incorrect.
S7: the control module respectively obtains a tangent line of the wafer and a tangent line of the tray through data processing based on the received image information, compares the positions of the two tangent lines to judge whether the wafer is correctly placed in the tray,
if the tray assembly is correctly placed in the tray, the tray assembly is taken out from the cylindrical supporting part and moved to a first preset position (such as a process chamber) based on the second mechanical arm,
and if the tray assembly is not correctly placed in the tray, taking out the tray assembly from the supporting part based on the second mechanical arm, moving the tray assembly to a station to be confirmed (not shown), and sending prompt information.
In this step, the wafer and the tray are photographed based on a camera device (e.g., a camera), the control module processes the image information to obtain a first tangent line 1a for trimming the wafer and a second tangent line 41 for trimming the tray (see fig. 7), and if the first tangent line 1a is parallel to the second tangent line 41 or the included angle is within a specified angle, the wafer and the tray are determined to be normal, otherwise the wafer and the tray are determined to be abnormal. In an ideal state, a first tangent line 1a corresponding to the edge cutting of the wafer is parallel to a second tangent line 41 corresponding to the edge cutting of the tray, and if the detected maximum angle alpha 2 is smaller than a preset angle, the judgment is normal; otherwise, judging the operation is abnormal. In this embodiment, the camera device shoots through the visual observation window and fixes a position, shoots the side cut of wafer and tray subassembly. By the control method, the combination of the wafer and the tray is carried out in the loading part, and the state detection of the tray is carried out before the combination, so that the tray is replaced in time when the abnormity is detected, and the yield of the grown epitaxial wafer is improved. After combination, whether the wafer is correctly placed on the tray is detected, so that the normal operation of the next process can be ensured, the occurrence of flying discs is avoided, and the utilization rate of the CVD equipment is improved.
The above embodiments are merely illustrative of the technical concepts and features of the present application, and the purpose of the embodiments is to enable those skilled in the art to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made according to the spirit of the present application are intended to be covered by the scope of the present application.
Claims (10)
1. A transport apparatus for a wafer and tray combination, comprising:
a loading component and a carrying component, wherein the loading component and the carrying component are arranged on the base plate,
the carrying assembly comprises a first manipulator and a second manipulator,
the loading part includes:
a shell, wherein a clamping component and a supporting component are arranged in the shell,
the clamping assembly is used for clamping the wafer transmitted by the first mechanical arm,
the supporting component set up in the bottom of cavity in the casing, and be located press from both sides the below side of getting the subassembly, the supporting component includes: the cylindrical support part is used for receiving the tray transmitted by the second manipulator, a channel penetrating along the axial direction of the cylindrical support part is arranged in the cylindrical support part and used for accommodating the telescopic part, and a connecting part is arranged on the outer circumference of the cylindrical support part and connected to the driving assembly and enables the cylindrical support part to rotate based on the driving of the driving assembly;
the top of casing is provided with camera device, first range finding sensor and second range finding sensor, camera device is used for obtaining the image information after wafer and tray combination, first range finding sensor and second range finding sensor are used for obtaining the surface information of wafer and transmit to control module respectively.
2. The transfer device for wafer and tray combinations as claimed in claim 1,
one side of the cylindrical supporting part is provided with a bearing part which is used for bearing the tray,
the side, far away from the bearing part, of the cylindrical supporting part is fixed at the bottom of the inner cavity of the shell through a bearing assembly.
3. The transport device of claim 2, further comprising a lift member located below the cylindrical support portion, wherein a telescoping portion of the lift member extends into the channel.
4. A transfer device for wafer and tray combinations as claimed in claim 1, further comprising a support disposed on top of the housing, wherein a lift motor is disposed on the support, an output of the lift motor is connected to the camera device, and the lift motor is controlled to adjust a focal length of the camera device.
5. The apparatus as claimed in claim 1, further comprising a third distance measuring sensor disposed at the bottom of the housing, the third distance measuring sensor being electrically connected to the control module, the third distance measuring sensor being configured to detect a trimming of the tray.
6. The transfer device for wafer and tray combinations as claimed in claim 1,
the clamping assembly comprises: a bottom plate, a first clamping jaw, a second clamping jaw and a guide rail,
the guide rail is arranged on one side of the bottom plate, the first clamping jaw and the second clamping jaw are fixed on the guide rail in a sliding mode through connecting pieces respectively, the first clamping jaw and the second clamping jaw are provided with recesses respectively, and the two recesses are combined to clamp a wafer.
7. A method for controlling a wafer and tray combination transfer device, the method comprising the steps of:
s1: transferring the wafer to a predetermined position in the loading part based on the first manipulator;
s2: clamping the wafer based on the clamping assembly;
s3: placing the tray on the cylindrical support part based on the second manipulator;
s4: the tray detection is that the cylindrical supporting part is rotated based on the driving of the driving assembly, the third ranging sensor is used for detecting the positioning hole at the bottom of the tray so as to detect the position of the trimming of the tray, the second ranging sensor is used for measuring the information on the surface of the tray and feeding the measured information back to the control module, and the control module is used for judging the current state information of the tray based on the received information;
s5: the wafer and the tray are combined, namely the wafer is jacked up from the clamping component by utilizing the telescopic part to move up to a specified position, the first clamping jaw and the second clamping jaw of the clamping component move oppositely, and the telescopic part slowly moves down to place the wafer on the tray;
s6: the cylindrical supporting part is driven to rotate based on the driving assembly, meanwhile, the first distance measuring sensor is used for detecting the information of the wafer and feeding the information back to the control module, and the control module judges whether the wafer is placed correctly or not;
s7: based on the shooting device, the combined tray assembly is shot and the shot image information is fed back to the control module, the control module judges whether the wafer is correctly placed in the tray or not based on the received image information,
if yes, taking out the tray assembly from the supporting part based on a second mechanical arm and moving the tray assembly to a first preset position,
and if not, taking out the tray assembly from the supporting part based on the second manipulator, moving the tray assembly to a second preset position, and sending prompt information.
8. The control method according to claim 7,
the step S4 comprises the following steps:
the control module compares the information fed back by the second distance measuring sensor with a preset value,
and if the tray needs to be replaced, sending out prompt information.
9. The control method according to claim 7,
the step S6 includes:
when the control module judges that the wafer is not placed correctly based on the information fed back by the first ranging sensor, the tray assembly is taken out from the supporting part in a rotating mode and moved to a second preset position based on the second mechanical arm, and prompt information is sent out.
10. The control method according to claim 7,
the step S7 comprises the following steps:
the control module respectively obtains and judges the tangent line of the wafer and the tangent line of the tray through data processing based on the received image information,
if the two tangent lines are parallel or the included angle between the two tangent lines is within the specified angle, the judgment is normal, otherwise, the judgment is abnormal, and prompt information is sent.
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| CN115719722A (en) * | 2022-12-07 | 2023-02-28 | 深圳市纳设智能装备有限公司 | Positioning device, semiconductor equipment and positioning method of tray and wafer |
| CN117721429A (en) * | 2024-02-08 | 2024-03-19 | 成都国泰真空设备有限公司 | Magnetron sputtering coating equipment |
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| CN117721429B (en) * | 2024-02-08 | 2024-04-23 | 成都国泰真空设备有限公司 | Magnetron sputtering coating equipment |
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| CN115332136B (en) | 2022-12-27 |
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