CN111288889B - Position detection device and position detection method of chamber process assembly - Google Patents
Position detection device and position detection method of chamber process assembly Download PDFInfo
- Publication number
- CN111288889B CN111288889B CN202010053365.6A CN202010053365A CN111288889B CN 111288889 B CN111288889 B CN 111288889B CN 202010053365 A CN202010053365 A CN 202010053365A CN 111288889 B CN111288889 B CN 111288889B
- Authority
- CN
- China
- Prior art keywords
- tray
- preheating ring
- distance sensor
- distance
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a position detection device of a chamber process assembly in semiconductor equipment, wherein the chamber process assembly comprises a tray and a preheating ring, the position detection device comprises a bearing assembly, a moving assembly and a distance sensor, the bearing assembly is used for bearing the moving assembly, the distance sensor is arranged on the moving assembly, the moving assembly is used for driving the distance sensor to rotate around the axis of the tray, and the distance sensor is used for measuring the distance between the top surface of the tray and the top surface of the preheating ring and/or the distance between the side wall of the tray and the inner side wall of the preheating ring. In the invention, the distance sensor can be driven by the moving assembly to rotate, and the relative position relation between the tray and the preheating ring is measured, so that the precision and the efficiency of auxiliary position detection when the position of the process assembly is adjusted are improved, and the repeatability of the relative position between the tray and the preheating ring is further improved. The invention also provides a position detection method of the cavity process assembly in the semiconductor equipment.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a position detection device and a position detection method for a cavity process assembly in semiconductor equipment.
Background
In a semiconductor apparatus, such as an epitaxial apparatus, in order to ensure uniformity of a semiconductor process performed on a wafer on a tray, a preheating ring is generally disposed around the outside of the tray to improve the uniformity of the temperature of the tray. In the batch production of wafers, the deposition thickness of a plurality of wafers successively carried on the tray needs to be ensured to be consistent, so that the repeatability of the relative position between the tray and the preheating ring is particularly important.
In the current operation scheme, the positions of the tray and the preheating ring need to be adjusted between processes, and the relative position between the tray and the preheating ring needs to be manually measured by a tool such as a vernier caliper, so that the operation steps are complicated, the efficiency is low, and the precision is low.
Therefore, how to provide an accurate and efficient relative position detection device becomes a technical problem to be solved in the field.
Disclosure of Invention
The invention provides a position detection device and a position detection method, which can accurately and efficiently detect the relative position between a tray and a preheating ring.
To achieve the above objects, as a first aspect of the present invention, there is provided a position detecting apparatus of a chamber process module in a semiconductor device, the chamber process module including a preheating ring and a tray, the preheating ring being disposed around the tray, the position detecting apparatus for detecting a relative positional relationship between the preheating ring and the tray, the position detecting apparatus including a carrier assembly, a moving assembly, and a distance sensor, wherein,
the moving assembly is arranged on the bearing assembly, and the bearing assembly is used for bearing the moving assembly;
the distance sensor is arranged on the moving assembly, and the moving assembly is used for driving the distance sensor to rotate around the axis of the tray;
the distance sensor is used for measuring the distance between the top surface of the tray and the top surface of the preheating ring and/or the distance between the side wall of the tray and the inner side wall of the preheating ring.
Optionally, the moving assembly includes a slider and a guide rail, the distance sensor is fixedly connected to the slider, the guide rail is disposed around an axis of the tray, and the slider is disposed on the guide rail and can move along the guide rail.
Optionally, the position detecting apparatus further includes a positioning element, a plurality of guide rail positioning holes are formed in the guide rail, a slider positioning hole is formed in the slider, and the positioning element can be inserted into the slider positioning hole and the guide rail positioning hole, so that the slider is positioned on the guide rail.
Optionally, the carrier assembly includes a positioning plate, the shape of positioning plate with the upper flange adaptation of semiconductor equipment's process chamber, the guide rail sets up on the positioning plate, be formed with a plurality of detection holes on the positioning plate, it is a plurality of detection hole and a plurality of the guide rail locating hole corresponds the setting, works as the slider passes through the setting element location is in when on the guide rail, the distance inductor can pass through detection hole detects the top surface of tray with preheat the distance between the top surface of ring and/or the lateral wall of tray with preheat the distance between the inside wall of ring.
Optionally, the guide rail positioning holes are uniformly distributed along the circumferential direction of the guide rail.
Optionally, the position detecting device further includes an analyzing unit connected to the distance sensor, and configured to determine whether a difference in distances between top surfaces of the trays and a top surface of the preheating ring detected by the distance sensor through the detection holes is greater than a first preset threshold, and/or whether a difference in distances between side walls of the trays and an inner side wall of the preheating ring is greater than a second preset threshold.
Optionally, the position detecting device further includes a display unit for displaying a distance between the top surfaces of the trays and the top surface of the preheating ring and/or a distance between the side walls of the trays and the inner side wall of the preheating ring, which is detected by the distance sensor through the detection holes, and/or a judgment result of the analyzing unit.
Optionally, the distance sensor comprises a laser ranging sensor.
Optionally, the position detecting device further includes a holding portion disposed on the positioning plate.
As a second aspect of the present invention, there is provided a position detecting method of a chamber process kit part in a semiconductor apparatus, using the aforementioned position detecting apparatus, the method comprising:
measuring the distance between the top surface of the tray and the top surface of the preheating ring and/or the distance between the side wall of the tray and the inner side wall of the preheating ring by using the distance sensor;
moving the position of the moving component and repeating the measuring step;
when the number of times of moving the moving assembly exceeds a preset value, whether the difference of the distances between the top surfaces of the trays and the top surface of the preheating ring detected by the distance sensor is greater than a first preset threshold value and/or whether the difference of the distances between the side walls of the trays and the inner side wall of the preheating ring is greater than a second preset threshold value is judged.
In the position detection device and the position detection method provided by the invention, the distance sensor can be driven by the moving assembly to rotate, and the distance between the top surface of the tray and the top surface of the preheating ring and/or the distance between the side wall of the tray and the inner side wall of the preheating ring are/is measured, so that the relative position relation between the tray and the preheating ring is obtained, the precision and the efficiency of auxiliary position detection when the relative position between the tray and the preheating ring is adjusted are improved, and the repeatability of the relative position between the tray and the preheating ring in a plurality of semiconductor processes is further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a position detection apparatus according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a connection relationship between a position detection apparatus and a process chamber according to an embodiment of the present invention.
Description of the reference numerals
10: distance sensor 20: moving assembly
21: the slide block 22: guide rail
221: guide rail positioning hole 30: positioning plate
31: detection hole 40: analysis unit
41: transmission cable 50: gripping part
60: the process chamber 61: upper flange
70: preheating ring 80: tray
Detailed Description
The following describes in detail embodiments of the present invention with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As an aspect of the present invention, there is provided a position detecting apparatus of a chamber process module in a semiconductor device, as shown in fig. 1 and 2, the chamber process module including a preheating ring 70 and a tray 80, the preheating ring 70 being disposed around the tray 80, the position detecting apparatus for detecting a positional relationship between the preheating ring 70 and the tray 80, the position detecting apparatus including a carrying assembly, a moving assembly 20, and a distance sensor 10, wherein:
the moving assembly 20 is arranged on a bearing assembly, and the bearing assembly is used for bearing the moving assembly 20;
the distance sensor 10 is arranged on the moving assembly 20, and the moving assembly 20 is used for driving the distance sensor 10 to rotate around the axis of the tray 80;
the distance sensor 10 is used to measure the distance between the top surface of the tray 80 and the top surface of the preheating ring 70 and/or the distance between the side wall of the tray 80 and the inner side wall of the preheating ring 70.
The present invention is not limited to the type of the distance sensor 10, for example, the distance sensor 10 may be a laser distance measuring sensor, as shown in fig. 2, in an operating state, the detection area of the distance sensor 10 can simultaneously cover the edge of the tray 80 and the inner side edge of the preheating ring 70, and emit laser to the test points on the edge of the tray 80 and the inner side edge of the preheating ring 70 along the vertical direction (i.e. up and down direction in the figure), and receive the reflected laser returned from the test points, and according to the laser emission and reception corresponding to each test point, various parameters such as time difference, the horizontal position of the test point on the edge of the tray 80 and the distance between the test point and the distance sensor 10, and the horizontal position of the test point on the inner side edge of the preheating ring 70 and the distance between the test point and the distance sensor 10 can be obtained, and further obtaining the distance between the side wall of the tray 80 and the inner side wall of the preheating ring 70 according to the horizontal distance between the test point on the tray 80 and the test point on the preheating ring 70, obtaining the distance between the top surface of the tray 80 and the top surface of the preheating ring 70 according to the height difference between the test point on the tray 80 and the test point on the preheating ring 70 (i.e. the difference between the distances between different test points and the distance sensor 10), and further determining the position relationship between the edge of the tray 80 and the inner side edge of the preheating ring 70.
In the position detecting apparatus provided in the embodiment of the present invention, the distance sensor 10 can rotate around the axis of the tray 80 under the driving of the moving assembly 20, and measure the position relationship between the top surfaces of the edges of the tray 80 and the top surfaces of the inner edges of the preheating ring 70, and/or the position relationship between the side walls of the edges of the tray 80 and the inner side walls of the inner edges of the preheating ring 70, so as to obtain the relative position relationship between the tray 80 and the preheating ring 70, improve the precision and efficiency of auxiliary position detection when the relative positions of the tray 80 and the preheating ring 70 are adjusted, and further improve the repeatability of the relative positions between the tray 80 and the preheating ring 70 in a plurality of semiconductor processes.
The present invention is not particularly limited in the structure of the moving assembly 20, for example, the moving assembly 20 may include a disk body or a swing arm for rotating around the axis of the tray 80, and the distance sensor 10 is disposed on the disk body or at one end of the swing arm to realize the rotating motion of the distance sensor 10; alternatively, the moving assembly 20 may include a moving member capable of moving automatically, on which the distance sensor 10 is disposed, and the moving member is bound to the axis of the tray 80 by a rope, thereby restricting the moving member from moving only in a circumferential direction, and thus rotating the distance sensor 10, and so on.
In order to accurately and stably control the rotation of the distance sensor 10 around the axis of the tray 80, it is preferable that, as shown in fig. 1 and 2, the moving assembly 20 includes a slider 21 and a guide rail 22, the distance sensor 10 is fixedly connected to the slider 21, the guide rail 22 is disposed around the axis of the tray 80, the slider 21 is disposed on the guide rail 22 and can move along the guide rail 22, so that the detection area of the distance sensor 10 can cover the edge of the tray 80 and the inner edge of the preheating ring 70 simultaneously during the rotation.
Preferably, the guide rail 22 is circular, and the slider 21 can drive the distance sensor 10 to continuously rotate on the guide rail 22 in the same direction, in the embodiment of the present invention, the slider 21 can drive the distance sensor 10 to move smoothly along the guide rail 22, so as to reduce the jitter and angular swing of the distance sensor 10, improve the smoothness of the movement of the distance sensor 10, and enable the detection area of the distance sensor 10 (i.e. the area facing the laser emitting and receiving surface of the distance sensor 10) to stably cover the edge of the tray 80 and the inner edge of the preheating ring 70.
The invention is not limited to how to drive the slide block 21 to move on the guide rail 22, for example, the slide block 21 may be automatically moved on the guide rail 22 by a belt driving structure, or the slide block 21 may be manually pushed to move on the guide rail 22.
The invention is not limited to how to adjust the positions of the preheating ring 70 and the tray 80, for example, in the process chamber 60 (as shown in fig. 2), a linkage structure may be provided below the preheating ring 70 and the tray 80 (i.e., below in fig. 2), and the positions of the preheating ring 70 and the tray 80 may be adjusted by adjusting the linkage structure. After the positions of the preheating ring 70 and the tray 80 are adjusted each time, the driving slider 21 moves along the guide rail 22 and measures the relative positions between the edges of the preheating ring 70 and the tray 80 at a plurality of positions, and further measures the relative positions of the preheating ring 70 and the tray 80 after the positions of the preheating ring 70 and the tray 80 are adjusted each time, and determines the adjustment amount for adjusting the positions of the preheating ring 70 and the tray 80 next time according to the relative positions.
To further improve the accuracy of the measurement result, the cross-sectional shape of the guide rail 22 is preferably rectangular. When the distance sensor 10 moves on the guide rail 22, the guide rail 22 with the rectangular cross section can prevent the distance sensor 10 from rotating around the guide rail 22 and inclining, so that the detection signal sent by the distance sensor 10 is always transmitted to the surface of the tray 80 and the preheating ring 70 along the vertical direction, the measurement precision is improved, and the accuracy of the measurement result is ensured.
In order to further improve the accuracy of position detection by the position detection device and the repeatability of the relative position between the tray 80 and the preheating ring 70, it is preferable that, as shown in fig. 1, the position detection device further includes a positioning member (not shown), a plurality of guide positioning holes 221 are formed on the guide rail 22, a slider positioning hole is formed on the slider 21, and the positioning member is inserted into the slider positioning hole and the guide positioning hole 221 so that the slider 21 is positioned on the guide rail 22.
The present invention is not particularly limited to the kind of the positioning member, and for example, in order to improve the efficiency of fixing and releasing the slider 21 on the guide rail 22, the positioning member may preferably be a pin. In the embodiment of the present invention, a plurality of guide positioning holes 221 with fixed positions are formed on the guide 22, and the slide block 21 can be positioned at the positions of the guide positioning holes 221 by positioning elements, so that the stability of the slide block 21 is improved when the distance sensor 10 performs distance measurement, and the accuracy of the distance measurement result is improved.
Further, the guide positioning holes 221 are fixed in position on the guide 22, so that after the positions of the tray 80 and the preheating ring 70 are adjusted each time, the positions where the slider 21 and the distance sensor 10 stay at the time of distance measurement are the same, thereby increasing the degree of repetition of the relative positions between the tray 80 and the preheating ring 70.
As shown in fig. 2, to achieve a sealed interface with the upper components of the process chamber 60, the process chamber 60 generally includes an upper flange 61, and the upper flange 61 is disposed above the tray 80, so that after the upper components of the process chamber 60 are connected to the upper flange 61, various semiconductor processes such as light irradiation, electric field application, process material spraying, etc. can be performed on the substrate carried on the tray 80.
The present invention is not particularly limited as to how the position detecting device contacts and is positioned in the process chamber 60, for example, as shown in fig. 1 and 2, the carrying assembly includes a positioning plate 30, the positioning plate 30 is shaped to fit the upper flange 61 of the process chamber of the semiconductor device, the guide rail 22 is disposed on the positioning plate 30, the positioning plate 30 is formed with a plurality of detecting holes 31, the plurality of detecting holes 31 are disposed to correspond to the plurality of guide rail positioning holes 221, and when the slider 21 is positioned on the guide rail 22 by the positioning member, the distance sensor 10 can detect the distance between the top surface of the tray 80 and the top surface of the preheating ring 70 and/or the distance between the side wall of the tray 80 and the inner side wall of the preheating ring 70 through the detecting holes 31. Alternatively, as shown in fig. 1, the cross-sectional shape of the detection hole 31 is rectangular.
In the embodiment of the present invention, the guide rail 22 is disposed at a side of the positioning plate 30 facing away from the process chamber 60, and the distance sensor 10 detects a relative positional relationship between the tray 80 and the preheating ring 70 and the distance sensor 10 through the detection hole 31, thereby facilitating a moving operation of the slider 21 and the distance sensor 10 outside the process chamber 60, and further improving a position detection efficiency of the chamber process assembly.
The present invention is not limited to how the guide rail 22 is fixedly connected to the positioning plate 30, and for example, a plurality of connecting portions are optionally formed on a surface of the guide rail 22 facing the positioning plate 30, and the guide rail 22 is fixedly connected to the positioning plate 30 through the plurality of connecting portions. To improve the stability of the guide rail 22, it is preferable that the number of the connection portions is not less than 3.
In order to achieve positioning of the position detecting device in the horizontal direction (i.e., the front-back and left-right directions in fig. 2) and the height direction (i.e., the up-down direction in fig. 2) to ensure accuracy of distance measurement and repeatability of the relative positions of the tray 80 and the preheating ring 70, it is preferable that the positioning plate 30 has a first positioning surface formed on a side surface thereof facing away from the guide rail 22, as shown in fig. 1 and 2. The upper flange 61 of the process chamber 60 is formed with a positioning groove, a second positioning surface is provided on the surface of one side of the positioning groove departing from the tray 80, the positioning groove is matched with the positioning plate 30 in shape, and when the positioning plate 30 is placed in the positioning groove, the first positioning surface of the positioning plate 30 is attached to the second positioning surface of the positioning groove.
As shown in fig. 2, in order to achieve the sealing connection, the upper flange 61 of the process chamber 60 is often provided with a groove structure (i.e., a positioning groove) as shown in fig. 2, in an embodiment of the present invention, the positioning plate 30 is shaped to match the positioning groove, so that when the positioning plate 30 is placed in the positioning groove, the edge of the positioning plate 30 can be aligned with the edge of the positioning groove to achieve the positioning of the position detecting device in the horizontal direction, and the first positioning surface of the positioning plate 30 is attached to the second positioning surface of the positioning groove to achieve the positioning of the position detecting device in the height direction.
The number of positions where the distance sensor 10 stays on the guide rail 22 and performs detection is not particularly limited, for example, to improve detection and adjustment efficiency, as a preferred embodiment of the present invention, as shown in fig. 1, a plurality of guide rail positioning holes 221 are uniformly distributed along the circumferential direction of the guide rail 22, and included angles between the guide rail positioning holes 221 are equal, so that when an excessive offset between the tray 80 and the preheating ring 70 at a certain guide rail positioning hole 221 is detected, a region closest to the guide rail positioning hole 221 can be quickly determined as a region to be adjusted, so as to efficiently adjust the relative position between the tray 80 and the preheating ring 70.
In order to improve the stability of the slider 21 fixed on the guide rail 22, preferably, as shown in fig. 1, a plurality of sets of guide rail positioning holes 221 are formed on the positioning plate 30, each set of guide rail positioning holes 221 includes two guide rail positioning holes 221, two slider positioning holes are formed on the slider 21, the position detection device includes at least two positioning elements, and when the slider 21 is fixed on the guide rail 22, the two positioning elements sequentially penetrate through the two slider positioning holes on the slider 21 and the set of guide rail positioning holes 221 on the guide rail 22 in a one-to-one correspondence manner, so that the swing amplitude of the slider 21 on the guide rail 22 is reduced, and the stability of fixing the slider 21 on the guide rail 22 is improved.
As a preferred embodiment for simplifying the structure of the apparatus, as shown in fig. 1, 3 sets of guide positioning holes 221 are formed on the positioning plate 30, and the 3 sets of guide positioning holes 221 are distributed at intervals of 120 ° along the circumferential direction of the guide 22.
In order to improve the efficiency of adjusting the positions of the trays 80 and the preheating ring 70 after measuring the positional relationship between the trays 80 and the preheating ring 70, it is preferable that, as shown in fig. 1, the position detecting apparatus further includes an analyzing unit 40, and the analyzing unit 40 is connected to the distance sensor 10 and determines whether a difference in distances between top surfaces of the trays 80 and top surfaces of the preheating ring 70, which are detected by the distance sensor 10 through the detection holes 31, is greater than a first preset threshold and/or a difference in distances between side walls of the trays 80 and inner side walls of the preheating ring 70 is greater than a second preset threshold.
When the relative position relationship between the tray 80 and the preheating ring 70 does not reach the expected state, the analysis unit 40 determines that a distance difference between the top surface of the tray 80 and the top surface of the preheating ring 70 at a certain position is greater than a first preset threshold, or a distance difference between the side wall of the tray 80 and the inner side wall of the preheating ring 70 at a certain position is greater than a second preset threshold, and at this time, an operator or an automated apparatus may perform height adjustment or horizontal adjustment on the side edge of the tray 80 or the preheating ring 70 at the certain position according to the determination result of the analysis unit 40, so that a difference value between the distance between the tray 80 and the preheating ring 70 at the certain position falls within a preset threshold range.
The present invention is not particularly limited as to how the analysis unit 40 is connected to the distance sensor 10, and for example, as shown in fig. 1, the analysis unit 40 may be connected to the distance sensor 10 through a transmission cable 41.
In order to further improve the efficiency of adjusting the positions of the trays 80 and the preheating ring 70, it is preferable that the position detecting apparatus further includes a display unit for displaying the distance between the top surfaces of the trays 80 and the top surface of the preheating ring 70 and/or the distance between the side walls of the trays 80 and the inner side wall of the preheating ring 70, which are detected by the distance sensor 10 through the detection holes 31, and/or the judgment result of the analyzing unit 40, so that the operator can timely know the relative positional relationship between the trays 80 and the preheating ring 70.
In order to improve the convenience of placing and removing the position detecting device on and from the process chamber 60, it is preferable that the position detecting device further includes a holding portion 50, as shown in fig. 1 and 2, the holding portion 50 is disposed on the positioning plate 30, so that an operator can conveniently lift or lower the positioning plate 30 by hand, or a corresponding mechanical device is connected to the holding portion 50 and performs a lifting operation.
As a second aspect of the present invention, there is also provided a position detecting method of a chamber process module in a semiconductor apparatus, using the position detecting apparatus described in the previous embodiment, the method comprising:
measuring the distance between the top surface of the tray 80 and the top surface of the preheating ring 70 and/or the distance between the side wall of the tray 80 and the inner side wall of the preheating ring 70 by using the distance sensor 10;
moving the position of the moving assembly 20 and repeating the measuring steps;
when the number of times the moving assembly 20 is moved exceeds a preset value, it is determined whether a difference in distance between the top surfaces of the trays 80 and the preheating ring 70, which is detected by the distance sensor 10, is greater than a first preset threshold value and/or a difference in distance between the side walls of the trays 80 and the inner side wall of the preheating ring 70 is greater than a second preset threshold value.
It should be noted that the preset value is related to the number of the stop positions of the distance sensor 10 on the guide rail 22, for example, when the distance sensor 10 is positioned by using the above-mentioned 3 sets of guide rail positioning holes 221 distributed at 120 ° intervals in the circumferential direction, the preset value may be 2, that is, after the distance sensor 10 moves twice (i.e., after three measurements) during each distance measurement, the analysis unit 40 starts to determine the position relationship between the preheating ring 70 and the tray 80 according to the results measured by the current wheel.
In the position detection method provided by the embodiment of the present invention, the distance sensor 10 can rotate around the axis of the tray 80 under the driving of the moving assembly 20, and measure the position relationship between the edges of the tray 80 and the inner side edges of the preheating ring 70, so as to obtain the relative position relationship between the tray 80 and the preheating ring 70, thereby improving the precision and efficiency of auxiliary position detection when adjusting the relative position between the tray 80 and the preheating ring 70, and further improving the repeatability of measuring the relative position between the tray 80 and the preheating ring 70 in multiple semiconductor processes.
It should be noted that the position detection method provided in the embodiment of the present invention is repeatedly performed in the process of adjusting the positions of the tray 80 and the preheating ring 70, that is, the above steps are sequentially performed once after the positions of the tray 80 and the preheating ring 70 are adjusted each time, until the positional relationship between the preheating ring 70 and the tray 80 meets the preset requirement (i.e., the height difference falls within the first preset threshold and/or the horizontal distance falls within the second preset threshold).
The predetermined requirement of the relative position between the preheating ring 70 and the trays 80 can be determined according to the sizes of the preheating ring 70 and the trays 80. The present invention does not specifically limit this preset requirement, for example, this preset requirement may be: the horizontal offset (i.e., the shortest distance in the horizontal direction) between the side wall of the preheating ring 70 and the inner side wall of the tray 80 is not more than 0.1mm, and the vertical offset (i.e., the height difference) between the top surface of the edge of the preheating ring 70 and the top surface of the edge of the corresponding position of the tray 80 is not more than 0.2 mm.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A position detecting device of a chamber process assembly in a semiconductor apparatus, the chamber process assembly including a preheating ring and a tray, the preheating ring being disposed around the tray, the position detecting device being for detecting a relative positional relationship between the preheating ring and the tray, the position detecting device including a bearing assembly, a moving assembly, and a distance sensor, wherein,
the moving assembly is arranged on the bearing assembly, and the bearing assembly is used for bearing the moving assembly;
the distance sensor is arranged on the moving assembly, and the moving assembly is used for driving the distance sensor to rotate around the axis of the tray;
the distance sensor is used for measuring the distance between the top surface of the tray and the top surface of the preheating ring and the distance between the side wall of the tray and the inner side wall of the preheating ring;
under the condition that the distance sensor is in a working state, the distance sensor respectively detects vertical distances between a detection point on the edge of the tray and a detection point on the inner edge of the preheating ring and the distance sensor, and the distance between the top surface of the tray and the top surface of the preheating ring is obtained according to the height difference between the two detection points; the distance sensor respectively detects horizontal positions of detection points on the edge of the tray and detection points on the inner side edge of the preheating ring, and the distance between the side wall of the tray and the inner side wall of the preheating ring is obtained according to the horizontal distance between the two detection points.
2. The position sensing device of claim 1, wherein the moving assembly includes a slider and a guide rail, the distance sensor is fixedly connected to the slider, the guide rail is disposed around an axis of the tray, and the slider is disposed on the guide rail and is capable of moving along the guide rail.
3. The position detecting apparatus according to claim 2, further comprising a positioning member, wherein a plurality of rail positioning holes are formed in the rail, and a slider positioning hole is formed in the slider, and the positioning member is insertable into the slider positioning hole and the rail positioning hole to position the slider on the rail.
4. The apparatus of claim 3, wherein the carrier assembly comprises a positioning plate, the positioning plate has a shape adapted to an upper flange of a process chamber of the semiconductor device, the guide rail is disposed on the positioning plate, the positioning plate has a plurality of detecting holes formed thereon, the plurality of detecting holes are disposed corresponding to the plurality of guide rail positioning holes, and when the slider is positioned on the guide rail by the positioning member, the distance sensor can detect a distance between a top surface of the tray and a top surface of the preheating ring and/or a distance between a side wall of the tray and an inner side wall of the preheating ring through the detecting holes.
5. The position detecting device according to claim 3, wherein a plurality of the rail positioning holes are evenly distributed along a circumferential direction of the rail.
6. The position detecting apparatus according to claim 4, further comprising an analyzing unit connected to the distance sensor for determining whether a difference in distances between top surfaces of the trays and the top surface of the preheating ring detected by the distance sensor through the detection holes is greater than a first preset threshold and/or a difference in distances between side walls of the trays and an inner side wall of the preheating ring is greater than a second preset threshold.
7. The position detecting apparatus according to claim 6, further comprising a display unit for displaying a distance between the top surfaces of the plurality of trays and the top surface of the preheating ring and/or a distance between the side walls of the plurality of trays and the inner side wall of the preheating ring, which is detected by the distance sensor through the plurality of detection holes, and/or a judgment result of the analyzing unit.
8. The position detecting device according to any one of claims 1 to 7, wherein the distance sensor includes a laser ranging sensor.
9. The position detecting device according to claim 4, characterized in that the position detecting device further comprises a grip portion provided on the positioning plate.
10. A position detecting method of a chamber process kit part in a semiconductor apparatus, characterized in that the position detecting apparatus of any one of claims 1 to 9 is used, the method comprising:
measuring the distance between the top surface of the tray and the top surface of the preheating ring and/or the distance between the side wall of the tray and the inner side wall of the preheating ring by using the distance sensor;
moving the position of the moving component and repeating the measuring step;
when the number of times of moving the moving assembly exceeds a preset value, whether the difference of the distances between the top surfaces of the trays and the top surface of the preheating ring detected by the distance sensor is greater than a first preset threshold value and/or whether the difference of the distances between the side walls of the trays and the inner side wall of the preheating ring is greater than a second preset threshold value is judged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010053365.6A CN111288889B (en) | 2020-01-17 | 2020-01-17 | Position detection device and position detection method of chamber process assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010053365.6A CN111288889B (en) | 2020-01-17 | 2020-01-17 | Position detection device and position detection method of chamber process assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111288889A CN111288889A (en) | 2020-06-16 |
| CN111288889B true CN111288889B (en) | 2022-08-16 |
Family
ID=71018866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010053365.6A Active CN111288889B (en) | 2020-01-17 | 2020-01-17 | Position detection device and position detection method of chamber process assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111288889B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113091707A (en) * | 2021-03-24 | 2021-07-09 | 北京北方华创微电子装备有限公司 | Levelness measuring device and levelness adjusting method |
| CN114655685A (en) * | 2022-02-10 | 2022-06-24 | 天津开发区精诺瀚海数据科技有限公司 | Special-shaped workpiece intelligent transfer box for black lamp factory |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142411A (en) * | 2001-10-31 | 2003-05-16 | Applied Materials Inc | Semiconductor manufacturing device |
| CN201063334Y (en) * | 2007-07-11 | 2008-05-21 | 上海华虹Nec电子有限公司 | Tool for revising extension base position |
| CN103217101A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Non-contact laser detection equipment |
| CN104916560B (en) * | 2014-03-11 | 2018-05-25 | 北京北方华创微电子装备有限公司 | Chip detection system, reaction chamber and chip detection method |
| KR20170054447A (en) * | 2014-09-05 | 2017-05-17 | 어플라이드 머티어리얼스, 인코포레이티드 | Susceptor and pre-heat ring for thermal processing of substrates |
| CN105762093B (en) * | 2014-12-16 | 2019-02-19 | 北京北方华创微电子装备有限公司 | Processing chamber and judge wafer position on pallet whether Yi Chang method |
| JP6330941B1 (en) * | 2017-03-07 | 2018-05-30 | 株式会社Sumco | Epitaxial growth apparatus, preheat ring, and epitaxial wafer manufacturing method using them |
| CN109671637B (en) * | 2018-11-08 | 2021-05-07 | 北京北方华创微电子装备有限公司 | Wafer detection device and method |
| CN110670127B (en) * | 2019-09-27 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | Wafer epitaxial equipment |
-
2020
- 2020-01-17 CN CN202010053365.6A patent/CN111288889B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111288889A (en) | 2020-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108493124B (en) | Automatic wafer test machine | |
| CN111288889B (en) | Position detection device and position detection method of chamber process assembly | |
| US7248931B2 (en) | Semiconductor wafer position shift measurement and correction | |
| EP2658958B1 (en) | Methods and systems for calibration of a positional orientation between a sample container and nozzle tip | |
| US9299599B2 (en) | Thermal processing apparatus for thermal processing substrate and positioning method of positioning substrate transfer position | |
| US9352466B2 (en) | Robot positioning system for semiconductor tools | |
| JP3996851B2 (en) | Probe tip alignment method for precision liquid handler | |
| US7457686B2 (en) | Robotic arm alignment | |
| US11468590B2 (en) | Wireless substrate-like teaching sensor for semiconductor processing | |
| JP4782953B2 (en) | Probe card characteristic measuring device, probe device, and probe method | |
| WO2004114392A1 (en) | Method and equipment for inspecting electric characteristics of specimen | |
| CN110788852B (en) | Calibration method and calibration device for manipulator and semiconductor processing equipment | |
| JP2009216504A (en) | Dimension measuring system | |
| JP6801290B2 (en) | Method of positioning the operator with respect to the target object and nozzle device | |
| CN212300309U (en) | Detection mechanism | |
| CN115405077A (en) | Height leveling actuator and floor tile laying method | |
| CN112908898B (en) | Control wafer measuring method and measuring device | |
| CN112713112B (en) | Wafer pusher jig and pushing method thereof | |
| KR102676848B1 (en) | Verifying end effector flatness using electrical continuity | |
| CN210270067U (en) | Wafer test equipment | |
| CN110082262B (en) | Automatic needle penetration instrument and needle alignment method thereof | |
| CN117542759B (en) | Square resistance measuring device and measuring method | |
| CN212964680U (en) | Wafer defect measuring equipment | |
| CN219223704U (en) | Measuring device for detecting flatness and concentricity of rotary graphite tray | |
| KR102091755B1 (en) | Apparatus for measuring flatness |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |