CN103199045A - Optics centering system positioning center of chip and centering method thereof - Google Patents
Optics centering system positioning center of chip and centering method thereof Download PDFInfo
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- CN103199045A CN103199045A CN201210001264XA CN201210001264A CN103199045A CN 103199045 A CN103199045 A CN 103199045A CN 201210001264X A CN201210001264X A CN 201210001264XA CN 201210001264 A CN201210001264 A CN 201210001264A CN 103199045 A CN103199045 A CN 103199045A
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Abstract
The invention belongs to the field of chip accurate positioning in a semiconductor chip machining process, and particularly provides an optics centering system positioning the center of a chip and a centering method thereof. According to the optics centering system, an X-axis moving servo control system is installed on a bottom plate, a Y-axis moving servo control system is arranged on the X-axis moving servo control system, the chip is installed on the Y-axis moving servo control system through a vacuum suction cup, the chip has freedom of reciprocating axial motion along the X-axis and the Y-axis, and an opposite-injection type laser sensor is installed on the bottom plate and located above the chip. The centering method comprises the following steps that accurate positioning of the center of the chip can be achieved through the opposite-injection type laser sensor, the position of the center of the chip can be determined accurately by means of scanning of the opposite-injection type laser sensor, and the movement of the chip is controlled through the X-axis moving servo control system and the Y-axis moving servo control system, so that the actual center of the chip can coincide with the theoretical center of the chip. The optics centering system is simple and reliable in structure, high in control accuracy, and stable in movement. The centering method is easy to operate and accurate in calculation.
Description
Technical field
The invention belongs to the accurate positioning field of wafer in the semiconductor wafer course of processing, specifically a kind of optics center support system and centering method thereof that center wafer is positioned.
Background technology
In the semiconductor wafer course of processing, need carry out accurate localization to center wafer, so that center wafer can overlap with the servomotor pivot exactly.Present semiconductor equipment mostly adopts mechanical centering or optics center support system, the machinery accuracy of alignment is lower, and traditional optics center support system, can't be used in the equipment of some low and middle-ends so cost is very high owing to adopt high performance ccd sensor (CCD imageing sensor).
Summary of the invention
The object of the present invention is to provide a kind of optics center support system and centering method thereof that center wafer is positioned, satisfy the hi-Fix control of low cost, high-precision requirement semiconductor wafer processing is carried out to(for) center wafer, solved the problem that wafer center wafer and servomotor pivot in the course of processing can not overlap fully.
The objective of the invention is to be achieved through the following technical solutions:
Center support system of the present invention comprises correlation laser sensor, vacuum cup, y-axis shift moving servo-control system, X-axis shift servo control system and base plate, wherein X-axis shift servo control system is installed on the base plate, and the moving servo-control system of y-axis shift is arranged on the X-axis shift servo control system; Need the wafer of centering to be installed on the moving servo-control system of y-axis shift by vacuum cup, have the degree of freedom that axially moves back and forth along X-axis and Y-axis; Described correlation laser sensor is installed on the base plate, be positioned at the top of described wafer.
Wherein: the moving servo-control system of described y-axis shift is by driving axially the moving back and forth along X-axis of X-axis shift servo control system, described vacuum cup is arranged on the moving servo-control system of y-axis shift, need the wafer of centering be installed on this vacuum cup, with the driving of vacuum cup by the moving servo-control system of y-axis shift along axially the moving back and forth of Y-axis, and with moving servo-control system axially the moving back and forth along X-axis of y-axis shift; Described correlation laser sensor is installed on the base plate by support.
Centering method of the present invention is: earlier by standard wafer determine wafer radius, correlation laser sensor in X-axis Y-axis coordinate system the position and the movement velocity of wafer, mobile wafer, by the correlation laser sensor to twice response time of wafer and the movement velocity of wafer, draw the chord length of correlation laser sensor scanning, calculate the practical center of wafer and theoretical center then at the eccentricity value of X-axis and Y direction, under the driving of the moving servo-control system of y-axis shift and X-axis shift servo control system, the practical center of wafer is overlapped with theoretical center.
Wherein: the coordinate of described correlation laser sensor in X-axis Y-axis coordinate system is (X
0, Y
0), the practical center of wafer is O, theoretical center is O
0, the radius of wafer is R; Described wafer moves along Y direction earlier, and the correlation laser sensor is from Y
1Point begins response, to Y
2Point finishes; By the response time of correlation laser sensor and the movement velocity of wafer, draw the chord length of wafer | Y
1-Y
2|, half of chord length
Distance between wafer practical center O and the described string
So wafer practical center O and theoretical center O
0Eccentricity value in X-direction
Wafer practical center O and theoretical center O
0Eccentricity value in Y direction
The moving servo-control system of y-axis shift and X-axis shift servo control system drive wafer respectively then, make practical center O and theoretical center O
0Overlap.
Advantage of the present invention and good effect are:
1. center support system of the present invention is simple and reliable for structure, and cost is low.
2. center support system of the present invention adopts the motion of shift servo control system control wafer, the control precision height, and motion is steadily; The shift servo control system realizes that by the mode transmission of driven by motor ball-screw wafer X, y-axis shift move; In addition, also have the guide rail guiding, steadily reliable.
3. the device of center support system detection wafer of the present invention is the correlation laser sensor, has significantly reduced cost.
4. centering method of the present invention is by the accurate location of correlation laser sensor realization to center wafer, can determine the center of wafer accurately by the scanning of correlation laser sensor, by X, the moving servo-control system control of y-axis shift movement of wafers, the practical center of wafer is overlapped with theoretical center.
Description of drawings
Fig. 1 is the structural representation of center support system of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the schematic diagram of centering method of the present invention;
Wherein: 1 is the correlation laser sensor, and 2 is wafer, and 3 is vacuum cup, and 4 are the moving servo-control system of y-axis shift, and 5 is X-axis shift servo control system, and 6 is base plate.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, center support system of the present invention comprises correlation laser sensor 1, vacuum cup 3, y-axis shift moving servo-control system 4, X-axis shift servo control system 5 and base plate 6, wherein X-axis shift servo control system 5 is installed on the base plate 6, the moving servo-control system 4 of y-axis shift is arranged on the X-axis shift servo control system 5, by driving axially the reciprocatingly moving along X-axis of X-axis shift servo control system 5; Described vacuum cup 3 is arranged on the moving servo-control system 4 of y-axis shift, need the wafer 2 of centering to be installed on this vacuum cup 3, with driving axially the reciprocatingly moving along Y-axis of vacuum cup 3 by the moving servo-control system 4 of y-axis shift, and along axially the moving back and forth of X-axis, namely need the wafer 2 of centering to have the degree of freedom that axially moves back and forth along X-axis and Y-axis with the moving servo-control system 4 of y-axis shift; Described correlation laser sensor 1 is installed on the base plate 6 by support, is positioned at the top of described wafer 2.
Centering method of the present invention is: determine wafer radius by standard wafer earlier, the position of correlation laser sensor 1 in X-axis Y-axis coordinate system and the movement velocity of wafer 2, mobile wafer 2, by twice response time of 1 pair of wafer 2 of correlation laser sensor and the movement velocity of wafer 2, draw the chord length of correlation laser sensor 1 scanning, calculate the practical center of wafer 2 and theoretical center then at the eccentricity value of X-axis and Y direction, under the driving of the moving servo-control system 4 of y-axis shift and X-axis shift servo control system 5, the practical center of wafer 2 is overlapped with theoretical center.Concrete steps are as follows:
Earlier determine wafer radius, the position of correlation laser sensor 1 in X-axis Y-axis coordinate system and the parameters such as movement velocity of wafer 2 by standard wafer, the coordinate of correlation laser sensor 1 in X-axis Y-axis coordinate system is X
0, Y
0, the practical center of wafer 2 is 0, theoretical center is O
0, the radius of wafer 2 is R; Wafer 2 elder generations move in the positive direction of the driving lower edge Y-axis of the moving servo-control system 4 of y-axis shift, and when wafer 2 sheltered from correlation laser sensor 1, correlation laser sensor 1 began response, namely from Y
1Point begins response, to Y
2Point finishes; By the response time of correlation laser sensor 1 and the movement velocity of wafer 2, draw the chord length of wafer 2 | Y
1-Y
2|, half of chord length
Distance between wafer 2 practical center O and the described string
So wafer 2 practical center O and theoretical center O
0Eccentricity value in X-direction
Wafer 2 practical center O and theoretical center O
0Eccentricity value in Y direction
The moving servo-control system 4 of y-axis shift and X-axis shift servo control system 5 drive wafer 2 respectively then, make practical center O and the theoretical center O of wafer 2
0Overlap.
Claims (5)
1. optics center support system that center wafer is positioned, it is characterized in that: comprise correlation laser sensor (1), vacuum cup (3), y-axis shift moving servo-control system (4), X-axis shift servo control system (5) and base plate (6), wherein X-axis shift servo control system (5) is installed on the base plate (6), and y-axis shift moves servo-control system (4) and is arranged on the X-axis shift servo control system (5); Need the wafer (2) of centering to be installed on the moving servo-control system (4) of y-axis shift by vacuum cup (3), have the degree of freedom that axially moves back and forth along X-axis and Y-axis; Described correlation laser sensor (1) is installed in the top that base plate (6) is gone up, is positioned at described wafer (2).
2. by the described optics center support system that center wafer is positioned of claim 1, it is characterized in that: described y-axis shift moves servo-control system (4) by driving axially the moving back and forth along X-axis of X-axis shift servo control system (5), described vacuum cup (3) is arranged on the moving servo-control system (4) of y-axis shift, need the wafer (2) of centering to be installed on this vacuum cup (3), with the driving of vacuum cup (3) by the moving servo-control system (4) of y-axis shift along axially the moving back and forth of Y-axis, and with moving servo-control system (4) axially the moving back and forth along X-axis of y-axis shift.
3. by the described optics center support system that center wafer is positioned of claim 1, it is characterized in that: described correlation laser sensor (1) is installed on the base plate (6) by support.
4. press claim 1 for one kind, the centering method of the 2 or 3 described optics center support systems that center wafer is positioned, it is characterized in that: determine wafer radius by standard wafer earlier, the position of correlation laser sensor (1) in X-axis Y-axis coordinate system and the movement velocity of wafer (2), mobile wafer (2), by correlation laser sensor (1) to twice response time of wafer (2) and the movement velocity of wafer (2), draw the chord length of correlation laser sensor (1) scanning, calculate the practical center of wafer (2) and theoretical center then at the eccentricity value of X-axis and Y direction, under the driving of the moving servo-control system (4) of y-axis shift and X-axis shift servo control system (5), the practical center of wafer (2) is overlapped with theoretical center.
5. by the described centering method of claim 4, it is characterized in that: the coordinate of described correlation laser sensor (1) in X-axis Y-axis coordinate system is (X
0, Y
0), the practical center of wafer (2) is O, theoretical center is O
0, the radius of wafer (2) is R; Described wafer (2) moves along Y direction earlier, and correlation laser sensor (1) is from Y
1Point begins response, to Y
2Point finishes; By the response time of correlation laser sensor (1) and the movement velocity of wafer (2), draw the chord length of wafer (2) | Y
1-Y
2|, half of chord length
Distance between wafer (2) practical center O and the described string
So wafer (2) practical center O and theoretical center O
0Eccentricity value in X-direction
Wafer (2) practical center O and theoretical center O
0Eccentricity value in Y direction
The moving servo-control system (4) of y-axis shift and X-axis shift servo control system (5) drive wafer (2) respectively then, make practical center O and theoretical center O
0Overlap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210001264XA CN103199045A (en) | 2012-01-04 | 2012-01-04 | Optics centering system positioning center of chip and centering method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210001264XA CN103199045A (en) | 2012-01-04 | 2012-01-04 | Optics centering system positioning center of chip and centering method thereof |
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|---|---|
| CN103199045A true CN103199045A (en) | 2013-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210001264XA Pending CN103199045A (en) | 2012-01-04 | 2012-01-04 | Optics centering system positioning center of chip and centering method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105129689A (en) * | 2015-09-07 | 2015-12-09 | 成都信息工程大学 | Automatic seal cover taking control system for nuclear waste steel drum |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1070177A (en) * | 1996-08-27 | 1998-03-10 | Matsushita Electric Ind Co Ltd | Method and apparatus for positioning disc-shaped body |
| US5917601A (en) * | 1996-12-02 | 1999-06-29 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Position difference detecting device and method thereof |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
-
2012
- 2012-01-04 CN CN201210001264XA patent/CN103199045A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1070177A (en) * | 1996-08-27 | 1998-03-10 | Matsushita Electric Ind Co Ltd | Method and apparatus for positioning disc-shaped body |
| US5917601A (en) * | 1996-12-02 | 1999-06-29 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Position difference detecting device and method thereof |
| CN101216686A (en) * | 2008-01-10 | 2008-07-09 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105129689A (en) * | 2015-09-07 | 2015-12-09 | 成都信息工程大学 | Automatic seal cover taking control system for nuclear waste steel drum |
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Application publication date: 20130710 |