CN216413014U

CN216413014U - Wafer detection device

Info

Publication number: CN216413014U
Application number: CN202122542125.5U
Authority: CN
Inventors: 包林; 向雪燕
Original assignee: Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
Current assignee: Chongqing Kangjia Optoelectronic Technology Co ltd
Priority date: 2021-10-20
Filing date: 2021-10-20
Publication date: 2022-04-29
Anticipated expiration: 2031-10-20

Abstract

The application relates to a wafer detection device, which comprises a bearing jig used for bearing a wafer; the storage unit is used for storing the bearing jig bearing the wafer; the workbench is positioned on one side of the storage unit and used for placing and fixing the bearing jig and the wafer borne by the bearing jig; the transfer unit is used for transferring the bearing jig and the wafer borne by the bearing jig from the storage unit to the workbench; the detection unit is positioned at one side of the workbench and used for performing appearance detection on the wafer so as to judge whether defect crystal grains exist in the wafer and position the defect crystal grains; and the control unit is used for matching all components in the wafer detection device. The wafer detection device is used for achieving automation of wafer appearance detection, and therefore wafer detection efficiency and accuracy are improved.

Description

Wafer detection device

Technical Field

The utility model relates to the technical field of detection equipment, in particular to a wafer detection device.

Background

In the production process of a traditional Light-emitting diode (LED), after the LED product is sorted, appearance detection needs to be performed on a wafer product, and when the appearance detection is generally performed on a wafer, the wafer needs to be placed on a carrying jig, and then the carrying jig is fixed in a workbench to perform appearance detection on the wafer. In the detection process, the carrying jig carrying the wafer may deviate or rotate relative to the workbench, that is, the carrying jig is not accurately positioned, so that the detection is not accurate and the defective crystal grains cannot be accurately positioned.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, the present application is directed to an apparatus for accurately positioning a wafer and automatically inspecting the appearance of the wafer.

In one embodiment of the present application, a wafer inspecting apparatus is provided, which includes

The bearing jig is used for bearing the wafer;

the storage unit is used for storing the bearing jig bearing the wafer;

the workbench is positioned on one side of the storage unit and used for placing and fixing the bearing jig and the wafer borne by the bearing jig;

the transfer unit is used for transferring the bearing jig and the wafer borne by the bearing jig from the storage unit to the workbench;

the detection unit is positioned at one side of the workbench and used for performing appearance detection on the wafer so as to judge whether defect crystal grains exist in the wafer and position the defect crystal grains;

and the control unit is used for matching all components in the wafer detection device.

In this embodiment, through this application wafer detection device, can realize the automation that wafer outward appearance detected to guarantee that the location of wafer in the outward appearance testing process is accurate, and then improve efficiency and the accurate rate that wafer outward appearance detected.

Optionally, the carrying jig comprises a supporting portion and a flexible film, the supporting portion is arranged around the periphery of the flexible film, and the flexible film is used for attaching and carrying the wafer.

Optionally, the workbench comprises a first positioning plate and a second positioning plate which are stacked and spaced from each other, and a supporting member connected between the first positioning plate and the second positioning plate, the bearing jig is inserted between the first positioning plate and the second positioning plate to be fixed on the workbench, and the first positioning plate is further provided with a first hollow area for exposing the wafer. In this embodiment, the first positioning plate, the second positioning plate and the supporting member can fix the carrier tool carrying the wafer.

Optionally, the first positioning plate includes a first surface facing the second positioning plate, the second positioning plate includes a second surface facing the first positioning plate, at least one limiting portion is disposed on the first surface and/or the second surface, and the limiting portion is used for abutting against and fixing the supporting portion.

In this embodiment, the bearing jig for bearing the wafer is fixed by the limiting portion, so that the requirements on the flatness and the levelness of the first positioning plate and the second positioning plate can be reduced, and the difficulty in the manufacturing process of the first positioning plate and the second positioning plate can be reduced.

Optionally, the supporting parts include a first supporting part and a second supporting part, the first supporting part and the second supporting part are arranged at two opposite sides of the first hollow area along a first direction, and the first supporting part and the second supporting part are respectively abutted to two opposite side surfaces of the supporting part to position the supporting part.

Optionally, the supporting member includes a limiting member and a locking portion, the limiting member and the locking portion are arranged in a second direction on opposite sides of the first hollow area, the bearing jig is inserted between the first positioning plate and the second positioning plate from one side of the locking portion, the limiting member and the locking portion are respectively abutted against opposite side surfaces of the supporting portion to position the supporting portion, and the second direction is perpendicular to the first direction.

In this embodiment, the supporting jig carrying the wafer can be further fixed by the stopper and the locking portion.

Optionally, the worktable further comprises a position sensing unit, and the position sensing unit is electrically connected to the detection unit and used for determining the position of the defective die relative to the worktable.

Optionally, the wafer inspection apparatus further includes a die sucking unit and a die collecting unit, the die collecting unit is located on one side of the worktable, and the die sucking unit moves relative to the worktable, and is configured to suck the defective die and place the defective die in the die collecting unit.

Optionally, the second positioning plate includes a second hollow area, the wafer detection apparatus further includes an ejector pin, the ejector pin and the die sucking unit are arranged on two opposite sides of the worktable, and the ejector pin is disposed corresponding to the second hollow area, can reciprocate relative to the second hollow area, and is configured to push the wafer to move toward the die sucking unit.

Optionally, the ejector pin and the workbench may move relatively, so that the ejector pin aligns with a geometric center of the defective die and pushes the defective die.

In the embodiment, the defect crystal grains can be jacked up from the flexible film through the thimble, so that the crystal grain suction unit can suck the defect crystal grains conveniently, and the damage to the qualified crystal grains around the defect crystal grains can be avoided.

In the wafer detection device, the wafer to be detected is borne by the bearing jig, and the bearing jig is inserted into the workbench to perform appearance detection on the wafer and accurately position the defective crystal grains. Through mutually supporting between first locating plate, second locating plate, support piece, locating part and the locking part in the workstation, can fix the tool that bears in the workstation, prevent to bear the tool and incline or skew appear in the testing process, and then realize the defect crystalline grain in the accurate location wafer to improve this application wafer detection device's detection precision and rate of accuracy.

Drawings

To more clearly illustrate the structural features and effects of the present invention, a detailed description is given below with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic structural view of a carrying fixture;

FIG. 2 is a partial enlarged view of the wafer shown in FIG. 1;

FIG. 3 is a schematic side view of the present application;

FIG. 4 is a schematic structural diagram of another side view of the present application;

FIG. 5 is a schematic side view of the worktable;

FIG. 6 is a schematic view of the other side of the worktable;

FIG. 7 is a schematic view of the worktable from a side view;

FIG. 8 is a schematic side view of the second positioning plate;

fig. 9 is a schematic structural view of a side view of the die pick-up unit and the die collection unit;

fig. 10 is a structural diagram of another side view of the die pick-up unit and the die collection unit.

Description of reference numerals:

100-wafer inspection device; 001-first direction; 002-a second direction; 003-third direction; 110-a bearing jig; 111-a support; 112-a flexible membrane; 113-circular wall; 120-a storage unit; 121-cassette layer; 130-a workbench; 131-a first positioning plate; 1311-first hollowed-out area; 1312-a first sidewall; 1313-a second side wall; 1314-bottom wall; 1315-a first surface; 132-a second positioning plate; 1321-a second hollowed-out area; 1322-a receiving chamber; 1325 — a second surface; 133-a support; 1331-a first support; 1332-a second support; 1333-a third side wall; 1334-a fourth side wall; 134-a stop; 1341-a third surface; 135-a locking part; 1351-sliding end; 1352-blocking end; 136-a limiting part; 1361-first limit feature; 1362-second limit feature; 140-a transport unit; 141-a robotic arm; 1411-a jaw; 142-a slide rail; 150-a detection unit; 151-image sensor; 160-a wafer; 161-crystal grains; 162-defective grains; 163-first die; 170-a die pick-up unit; 171-a suction nozzle; 1711-vacuum pump; 1712-sealing tube; 180-a die collection unit; 181-opening; 190-ejector pins; 191-an eccentric shaft; 192-motor.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The structure and operation of the wafer inspecting apparatus 100 according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to fig. 1-2, fig. 1 is a schematic structural diagram of a carrier tool 110, and fig. 2 is an enlarged partial diagram of a wafer 160 in fig. 1. The wafer 160 is an object to be inspected of the wafer inspection apparatus 100 of the present application, and the carrying fixture 110 is used for carrying the wafer 160. As shown in fig. 1, the supporting fixture 110 includes a supporting portion 111 and a flexible film 112, and the supporting portion 111 is disposed around the flexible film 112 to fix the flexible film 112. It is contemplated that the supporting portion 111 may be a rectangular or circular frame structure, or any other closed frame structure, and the embodiment is not limited thereto. In the embodiment shown in fig. 1, the supporting portion 111 is a circular hollow frame structure, and the material thereof may be a metal material. The flexible film 112 is used to carry the wafer 160, and may be a blue film or other adhesive film, which is not limited in this embodiment. As shown in fig. 1 and 2, the wafer 160 is composed of a plurality of dies 161, and the plurality of dies 161 are distributed and adhered to the flexible film 112. Among the plurality of dies 161 of the wafer 160, there may be a die having an appearance defect, i.e., a defective die 162.

Referring to fig. 3-4, fig. 3 is a schematic view of a side view of the wafer inspection apparatus 100 of the present application, and fig. 4 is a schematic view of another side view of the wafer inspection apparatus 100 of the present application. As shown in fig. 3-4, the wafer inspecting apparatus 100 of the present invention includes a carrying fixture 110, a storage unit 120, a worktable 130, a transfer unit 140, an inspection unit 150, and a control unit (not shown). The carrying fixture 110 is used for carrying a wafer 160, the storage unit 120 is used for storing the carrying fixture 110 carrying the wafer 160, the worktable 130 is located at one side of the storage unit 120 and is used for placing and fixing the carrying fixture 110 and the wafer 160 carried by the carrying fixture 110, the transferring unit 140 is used for transferring the carrying fixture 110 and the wafer 160 carried by the carrying fixture 110 from the storage unit 120 to the worktable 130, and the detecting unit 150 is located at one side of the worktable 130 and is used for performing appearance detection on the wafer 160 to determine whether a defective die 162 exists in the wafer 160 and locate the position of the defective die 162. The control unit is used for cooperation of each component in the wafer inspection apparatus 100.

Specifically, as shown in fig. 3, the storage unit 120 is a cassette structure, and includes a plurality of cassette layers 121, and each cassette layer can store at least one carrying fixture 110. In the embodiment, the cassette layer 121 is a hollow disc or a square frame structure, and corresponds to different shapes of the carrying fixture 110. In the embodiment shown in fig. 3, the supporting fixture 110 is circular, and the corresponding cassette layer 121 is also a disk structure. The inner diameter and thickness of the cassette layer 121 are adapted to the outer diameter and thickness of the supporting portion 111 of the supporting fixture 110, and are used for engaging and fixing the supporting fixture 110. In addition, an opening corresponding to the outer diameter of the supporting portion 111 is formed at a side of the cassette layer 121 opposite to the transferring unit 140, and is used for inserting the carrying jig 110 into the cassette layer 121, it can be understood that at least one cassette layer 121 may be sequentially stacked along the same direction (schematically shown as a third direction 003, and the third direction 003 may be a vertical direction), and can store at least one carrying jig 110.

As shown in fig. 3 and 4, the transfer unit 140 is located between the storage unit 120 and the work table 130, and the transfer unit 140 further includes a robot arm 141 and a slide rail 142. The mechanical arm 141 is slidably connected to the slide rail 142, that is, the mechanical arm 141 can reciprocate along the third direction 003 on the slide rail 142. Specifically, the robot 141 includes a clamping jaw 1411, and the clamping jaw 1411 may implement an operation of grabbing or replacing the carrier tool 110 carrying the wafer 160 from the cassette layer 121 of the storage unit 120, and may also implement an operation of clamping the carrier tool 110 carrying the wafer 160 into the worktable 130 or taking the carrier tool 110 from the worktable 130.

It can be understood that, when the carrier tool 110 carrying the wafer 160 to be inspected and placed in a certain cassette layer 121 of the storage unit 120 needs to be taken out, the robot 141 in the transferring unit 140 moves on the slide rail 142 along the third direction 003 from the initial position to a position opposite to the opening of the cassette layer 121 where the carrier tool 110 is located, and at this time, the robot 141 aligns the clamping jaw 1411 with the carrier tool 110, and then clamps the carrier tool 110 in the cassette layer 121 through the clamping jaw 1411. After the robot 141 picks up the carrier fixture 110, the robot 141 moves along the third direction 003 on the slide rail 142, aligns the robot 141 and the table 130 in the third direction 003, and then places the carrier fixture 110 into the table 130 through the clamping jaw 1411 and engages the carrier fixture 110.

In some embodiments, the transferring unit 140 may also implement the transferring function of the carrying fixture 110 by other ways, and the structure and composition of the transferring unit 140 are not strictly limited in this embodiment.

After the transfer unit 140 takes the carrier jig 110 carrying the wafer 160 out of the storage unit 120, the carrier jig 110 needs to be clamped into the worktable 130 and fixed, so as to perform appearance inspection on the wafer 160.

Referring to fig. 5, fig. 5 is a schematic structural view of a side view of the worktable 130. As shown in fig. 5, the table 130 includes a first positioning plate 131 and a second positioning plate 132. The first positioning plate 131 and the second positioning plate 132 are stacked and spaced apart from each other in the third direction 003, and the supporting jig 110 is inserted between the first positioning plate 131 and the second positioning plate 132 and is fixed on the worktable 130.

Specifically, the first positioning plate 131 includes a first surface 1315 opposite to the second positioning plate 132, the second positioning plate 132 includes a second surface 1325 opposite to the first positioning plate 131, the first surface 1315 and the second surface 1325 are horizontal planes perpendicular to the third direction 003, and a relative distance between the first surface 1315 and the second surface 1325 along the third direction 003 matches a thickness of the supporting portion 111 of the supporting jig 110, so as to limit a displacement of the supporting jig 110 relative to the worktable 130 along the third direction 003.

As shown in fig. 5, the working table 130 further includes a limiting member 134 and a locking portion 135, wherein the limiting member 134 is connected between the first positioning plate 131 and the second positioning plate 132 and is disposed at one end of the first positioning plate 131 and the second positioning plate 132 away from the transferring unit 140. The locking portion 135 is disposed on the first positioning plate 131 and/or the second positioning plate 132, and is opposite to the limiting member 134. That is, the locking portion 135 is disposed at one end of the first positioning plate 131 and/or the second positioning plate 132 close to the transfer unit 140, and is used for the transfer unit 140 to smoothly insert the carrier jig 110 carrying the wafer 160 on the workbench 130 or take the carrier jig out of the workbench 130. When the supporting fixture 110 is inserted between the first positioning plate 131 and the second positioning plate 132 from the side of the locking portion 135 of the worktable 130, the supporting fixture 110 abuts against the limiting member 134 and the locking portion 135, and is fixed on the worktable 130.

Specifically, the limiting member 134 may be a rectangular plate, and further includes a third surface 1341, the third surface 1341 is a side surface of the limiting member 134 opposite to the transferring unit 140 in the second direction 002, the third surface 1341 is tangent to and abuts against one side of the circular wall 113 (see fig. 1) of the supporting portion 111 along the third direction 003, where the circular wall 113 is a side wall of the supporting portion 111 along the third direction 003.

The number of the locking portions 135 is at least one, and the structure thereof may be a snap structure or other structures, and the embodiment is not particularly limited. In the embodiment shown in fig. 5, one locking portion 135 is disposed at an end of the second positioning plate 132 opposite to the third supporting member limiting member 134, and is located in a middle portion of the second positioning plate 132 in the first direction 001 (see fig. 6), wherein both the first direction 001 and the second direction 002 are perpendicular to the third direction 003, and the first direction 001 and the second direction 002 are perpendicular to each other. In the present embodiment, when the third direction 003 is a vertical direction, the first direction 001 and the second direction 002 are two horizontal directions perpendicular to each other. Specifically, the locking portion 135 may include a sliding end 1351 and a blocking end 1352, and a receiving cavity 1322 is formed in the second positioning plate 132 corresponding to the locking portion 135, where the receiving cavity 1322 is configured to receive the locking portion 135 and allow the locking portion 135 to slide relative to the receiving cavity 1322, so that the blocking end 1352 of the locking portion 135 at least partially protrudes to abut against the supporting portion 111.

It will be appreciated that a spring connection may be employed between the sliding end 1351 of the latching portion 135 and the receiving chamber 1322 to effect sliding and repositioning of the latching portion relative to the receiving chamber; in other embodiments, an electromagnet, an electric telescopic rod, or the like may be used to drive the sliding and returning of the locking portion 135 relative to the receiving cavity 1322. In this embodiment, the sliding end 1351 is connected to the receiving cavity 1322 by a spring, and when the supporting jig 110 is inserted into the workbench 130 from the locking portion 135, the sliding end 1351 drives the blocking block 1352 to retract into the receiving cavity 1322, so as to provide a way for the supporting jig 110, thereby facilitating the supporting jig 110 to be smoothly inserted into the workbench 130. When the supporting fixture 110 is completely inserted into the worktable 130, the sliding end 1351 drives the blocking block 1352 to extend out of the receiving cavity 1322, so that one side of the blocking block 1352 is tangent to and abuts against one side of the circular wall 113 of the supporting portion 111. In contrast, the supporting jig 110 engaged with the table 130 is taken out from the locking portion 135.

Through the cooperation of the locking portion 135 and the limiting member 134, that is, respectively abutting against the opposite sides of the circular wall 113 of the supporting portion 111 in the second direction 002, the displacement of the bearing fixture 110 relative to the workbench 130 in the second direction 002 can be limited.

In some embodiments, as shown in fig. 5, the working table 130 further includes at least one limiting portion 136, the limiting portions 136 are arranged on the first surface 1315 of the first positioning plate 131 and/or the second surface 1325 of the second positioning plate 132, and a relative distance between different limiting portions 136 along the third direction 003 matches a thickness dimension of the supporting portion 111 of the carrying fixture 110. In the embodiment shown in fig. 5, the position-limiting portion 136 includes a first position-limiting portion 1361 and a second position-limiting portion 1362, the first position-limiting portion 1361 is fixedly disposed on the first surface 1315 of the first positioning plate 131, the second position-limiting portion 1362 is fixedly disposed on the second surface 1325 of the second positioning plate 132, a relative distance between the first position-limiting portion 1361 and the second position-limiting portion 1362 along the third direction 003 is matched with a thickness of the supporting portion 111 of the carrying fixture 110, so that the first position-limiting portion 1361 and the second position-limiting portion 1362 respectively abut against two opposite side surfaces of the supporting portion 111 along the third direction 003, and the carrying fixture 110 is further fixed. Through spacing portion 136, can further fixed bear tool 110, and reduce the requirement to the roughness and the levelness of first locating plate 131 and second locating plate 132, avoid the not accurate location of bearing tool 110 in workstation 130 that the surface slope that first locating plate 131 and second locating plate 132 probably appear leads to.

Referring to fig. 6, fig. 6 is a schematic structural view of another side of the worktable 130. As shown in fig. 6, the working table 130 further includes a supporting member 133, and the supporting member 133 is connected between the first positioning plate 131 and the second positioning plate 132 and includes a first supporting member 1331 and a second supporting member 1332. The first supporting element 1331 and the second supporting element 1332 are respectively arranged on two sides of the middle portion of the first positioning plate 131 and the second positioning plate 132 at a certain distance in the first direction 001, and the distance in the first direction 001 matches with the outer diameter of the circular wall 113 and is respectively abutted against the circular wall 113.

It is understood that the first support 1331 and the second support 1332 may be cylindrical, rectangular or other rod members, and may also be screws, and the embodiments of the present invention are not limited thereto. In the present embodiment, the first supporting member 1331 and the second supporting member 1332 are rectangular parallelepiped rods and are fixedly disposed at the middle positions of the first positioning plate 131 and the second positioning plate 132 in the second direction 002. The first support 1331 further includes a third side wall 1333 opposite to the second support 1332, the second support 1332 further includes a fourth side wall 1334 opposite to the first support 1331, a relative distance between the third side wall 1333 and the fourth side wall 1334 along the first direction 001 matches with an outer diameter of the support portion 111, that is, the third side wall 1333 and the fourth side wall 1334 are respectively tangent to and abut against two opposite sides of the circular wall 113, so as to limit a displacement of the carrying fixture 110 in the first direction 001 relative to the workbench 130.

In other embodiments, when the supporting portion 111 is rectangular, it has two parallel sidewalls opposite to each other along the first direction 001, and the first supporting member 1331 and the second supporting member 1332 respectively contact with the sidewalls, so as to limit the displacement of the carrying fixture 110 relative to the worktable 130 along the first direction 001. Moreover, when the supporting portion 111 is rectangular, the first supporting element 1331 and the second supporting element 1332 can be offset relative to the middle portions of the first positioning plate 131 and the second positioning plate 132, respectively, and ensure the abutting positioning effect between the supporting elements and the side walls of the supporting portion on the respective sides.

Referring to fig. 7, fig. 7 is a schematic structural view of a side view of the worktable 130. As shown in fig. 7, the first positioning plate 131 includes a first hollow area 1311, and the first hollow area 1311 can completely expose the wafer 160 carried on the flexible film 112. Specifically, the first positioning plate 131 has a "U" shape, and further includes a first sidewall 1312, a second sidewall 1313, and a bottom wall 1314. The opening of the "U" shape faces the transfer unit 140, the first sidewall 1312 and the second sidewall 1313 are two opposite sidewalls of the "U" shape, and the bottom wall 1314 is connected to the first sidewall 1312 and the second sidewall 1313, respectively, and is opposite to the transfer unit 140.

It is understood that the relative distance between the first sidewall 1312 and the second sidewall 1313 in the first direction 001 and the distance between the bottom wall 1314 and the "U" shaped opening in the second direction 002 ensure that at least the wafer 160 carried on the support film 112 is completely exposed.

Referring to fig. 8, fig. 8 is a schematic structural view of a side view of the second positioning plate 132. As shown in fig. 8, the second positioning plate 132 includes a second hollow 1321 for exposing a region of the wafer 160 carried by the flexible film 112 of the carrying fixture 110. In the embodiment shown in fig. 8, the second hollow 1321 is circular, which ensures that the area of the flexible film 112 carrying the wafer 160 can be completely exposed from the second hollow 1321.

At present, in the process of performing the appearance inspection on the wafer 160, the carrying fixture 110 carrying the wafer 160 is prone to shift or tilt by a small distance, so that the carrying fixture 110 is not accurately positioned, and the defective die 162 in the wafer 160 cannot be accurately positioned.

In this application wafer detection device 100, first locating plate 131 through workstation 130, second locating plate 132, support piece 133, mutually support between locating part 134 and the locking part 135, thereby at first direction 001, the displacement of establishing into workstation 130's the bearing tool 110 of establishing is fixed to the definite insert on second direction 002 and the third direction 003, further make bearing tool 110 to be blocked and accurate fixed inserting behind workstation 130, prevent to bear tool 110 and take place small rotation and/or removal in the testing process, make the wafer 160 that bears tool 110's flexible membrane 112 and can accurate location in the testing process, and then improve this application wafer detection device 100's detection precision and rate of accuracy.

Referring to fig. 3, after the carrier jig 110 carrying the wafer 160 is fixed in the worktable 130, the wafer 160 is subjected to appearance inspection by the inspection unit 150 disposed at one side of the worktable 130. As shown in fig. 3, the inspection unit 150 is located vertically above the worktable 130 in the third direction 003 for performing appearance inspection on a plurality of dies 161 in the wafer 160, and determining whether a defective die 162 exists in the wafer 160, thereby locating the position of the defective die 162. In the embodiment shown in fig. 3, the detecting unit 150 includes an image sensor 151 and an analyzing module (not shown), wherein the image sensor 151 faces the first hollow 1311 of the stage 130 in the third direction 003, i.e., the image sensor 151 faces the wafer 160 carried on the flexible film 112 in the third direction 003.

It can be understood that the image sensor 151 converts the collected optical signal of the wafer 160 loaded on the flexible film 112 into the digital image signal of the wafer 160, and then transmits the digital image signal to the analysis module, and the analysis module analyzes and processes the obtained digital image signal of the wafer 160, wherein the digital image signal obtained by the image sensor 151 is an image of all the dies 161 loaded on the flexible film 112. Specifically, the analysis module receives the digital image signal transmitted from the image sensor 151, decomposes the acquired image of the die 161 into a plurality of points, and performs coordinate positioning on each point. Then, the analysis module selects a first crystal grain 163 from the local image of the digital image signal as a standard image, the first crystal grain 163 is a crystal grain whose appearance meets the detection standard, the image of the first crystal grain 163 is further decomposed into N pixels, and the grayscale standard value of each pixel is recorded. The analysis module scans the dies 161 at each coordinate point one by one, and compares the pixel point decomposed by each scanned die 161 with the gray scale value of each pixel point of the first die 163 one by one, thereby analyzing whether each die 161 meets the standard. In addition, the analysis module sets a threshold range according to the standard die pixel, that is, the similarity between each pixel point of each die 161 in the digital image signal and each pixel point of the first die 163 after comparison is greater than a preset value, and determines that the die 161 on the image coordinate is a qualified die, otherwise, it is a defective die 162.

It is understood that, in other embodiments, the inspection unit 150 may be implemented by other image inspection devices without affecting the functional implementation of the wafer inspection apparatus 100 of the present application.

The control unit is used for coordinating the components in the wafer inspection device 100 to realize the overall automation of the appearance inspection of the wafer 160.

In one embodiment, the control unit includes a first position detection unit (not shown), which acts on the transfer unit 140 to realize the mutual cooperation between the components inside the transfer unit 140. It can be understood that the first position detecting unit is used for detecting an initial position of the robot 141 relative to the carrying fixture 110 carrying the wafer 160 to be detected in the storage unit 120 or detecting an initial position of the robot 141 relative to the worktable 130, and further the control unit adjusts a moving displacement of the robot 141 relative to the slide rail 142 along the third direction 003, so that the clamping jaw 1411 is aligned with the carrying fixture 110 in the storage unit 120 or the worktable 130, respectively.

In one embodiment, the control unit comprises a second position detection unit, which acts on the detection unit 150. It can be understood that, when the second position detecting unit detects that the carrying fixture 110 is inserted into the workbench 130 and fixed, the wafer 160 carried on the carrying fixture 110 is automatically detected and analyzed.

The wafer detection device 100 of the present application can realize automatic operation through the control unit. It is understood that when the inspection unit 150 finishes inspecting the appearance of the wafer 160, the second position inspection unit transmits a signal to the first position inspection unit, and the second position inspection unit turns off the inspection unit 150 after the first position inspection unit takes the carrier fixture 110 out of the worktable 130.

In one embodiment, the wafer inspection apparatus 100 further includes a position sensing unit (not shown) electrically connected to the inspection unit 150 for sensing a moving position of the inspection unit 150 during the process of inspecting the appearance of the wafer 160. The defective die 162 is positioned by cooperation between the position sensing unit and the inspection unit 150. In this embodiment, the position sensing unit may be a grating scale, and when the analysis module of the detection unit 150 scans each die 161, the grating scale records the moving position of the scanning process. Further, when the inspection unit 150 detects the defective die 162 in the wafer 160, the inspection unit 150 converts the moving coordinates of the optical ruler to correspond to the coordinate points of the defective die 162 divided by the analysis module, and transmits the converted signal data to the control unit, and the control unit controls the stage 130 (shown in fig. 4) to move in the first direction 001 and/or the second direction 002 with respect to the inspection unit 150 according to the coordinate data of the defective die 162.

In one embodiment, the wafer inspection apparatus 100 further includes a die pick-up unit 170 and a die collection unit 180, as shown in fig. 9 and 10. Fig. 9 is a schematic structural diagram of a side view of the die pick-up unit 170 and the die collection unit 180, and fig. 10 is a schematic structural diagram of another side view of the die pick-up unit 170 and the die collection unit 180.

As shown in fig. 9 and 10, the die collecting unit 180 is located at one side of the worktable 130, and is a container having a storage function, or another structure capable of realizing the storage function, and the embodiment is not limited thereto. In the embodiment shown in fig. 9 and 10, the die collection unit 180 includes an opening 181, and the defective die 162 can be placed in the die collection unit 180 through the opening 181.

In addition, the die pick-up unit 170 is configured to pick up the defective die 162 in the wafer 160, and place the picked-up defective die 162 in the die collection unit 180 through the opening 181. Specifically, the die sucking unit 170 is a suction nozzle 171, the bottom of the suction nozzle 171 is a sealing tube 1712 connected to a vacuum pump 1711, and the suction nozzle 171 faces the wafer 160 on the flexible film 112.

In one embodiment, as shown in fig. 9, after the detecting unit 150 cooperates with the position sensing unit to position the defective die 162, the detecting unit 150 transmits the coordinate data of the defective die 162 to the control unit, so that the control unit controls the stage 130 (shown in fig. 4) and the die pick-up unit 170 to move relatively, i.e., the stage 130 moves in the first direction 001 and/or the second direction 002 with respect to the die pick-up unit 170. The geometric center of the defective die 162 is further aligned with the suction nozzle 171 in the third direction 003 by the movement of the table 130 relative to the die-sucking unit 170, so that the die-sucking unit 170 can pick up the defective die 162 from the wafer 160 by the suction nozzle 171. As can be appreciated, the suction nozzle 171 sucks air inside the suction nozzle 171 by the vacuum pump 1711, so that the suction nozzle 171 is attracted to the surface of the defective die 162.

After the die sucking unit 170 sucks the defective die 162, the suction nozzle 171 rotates around the third direction 003 in a direction away from the worktable 130 until facing the collection opening of the die collection unit 180 and placing the defective die 162 into the die collection unit 180.

In some embodiments, the die pick-up unit 170 may also move relative to the stage 130. It is understood that after the detecting unit 150 and the position sensing unit locate the defective die 162, the coordinate data of the defective die 162 is transmitted to the control unit, and the control unit controls the die sucking unit 170 to move relative to the stage 130, i.e. the stage 130 is in a stationary state.

It is understood that the relative movement between the die sucking unit 170 and the worktable 130 is not specifically limited in the embodiments of the present application.

In some embodiments, as shown in fig. 9, the wafer inspection apparatus 100 further includes a thimble 190. In the embodiment shown in fig. 9, the ejector pins 190 are disposed on a side of the worktable 130 opposite to the suction nozzle 171 in the third direction 003, i.e. the ejector pins 190 are directed to a side away from the wafer 160 carried by the flexible film 112 through the second hollow 1321 and opposite to the suction nozzle 171 in the third direction 003. The thimble 190 further comprises an eccentric shaft 191 and a motor 192, the thimble 190 is disposed on the eccentric shaft 191, the eccentric shaft 191 is connected to the motor 192, and the rotation of the motor 192 drives the eccentric shaft 191 to reciprocate along the third direction 003 relative to the worktable 130, i.e. the thimble 190 reciprocates along the third direction 003 relative to the worktable 130.

It is understood that after the detecting unit 150 and the position sensing unit locate the defective die 162 in the wafer 160, the coordinate data of the defective die 162 is transmitted to the control unit, and the control unit controls the table 130 and the thimble 190 to move relatively. In the present embodiment, the table 130 may be moved along the first direction 001 and/or the second direction 002 with respect to the ejector pin 190, so that the geometric center of the defective die 162 in the wafer is aligned with the ejector pin 190 along the third direction 003.

Further, after the thimble 190 moves in the third direction 003 to approach the worktable 130 for a certain distance, the thimble 190 may slightly lift the flexible film 112, i.e. lift the defective die 162 carried on the flexible film 112. When the defective die 162 is lifted by the ejector pins 190, the die sucking unit 170 sucks the defective die 162 by the suction nozzle 171. By the cooperation between the thimble 190 and the die sucking unit 170, the defective die 162 can be accurately taken out without damaging the die around the defective die 162.

In the wafer inspection apparatus 100 of the present application, the crystalline grain suction unit 170 may further cooperate with the thimble 190 to more accurately pick up the defective crystalline grain 162, and the crystalline grain suction unit 170 and the thimble 190 may also work independently to pick up the defective crystalline grain 162, or implement the function of picking up the defective crystalline grain 162 through other manners, and the present application does not specifically limit the structure and manner of picking up the defective crystalline grain 162.

Further, when the defective die 162 is picked up by the die pick-up unit 170 and/or the thimble 190, if the positioning of the carrier jig 110 in the worktable 130 is not accurate, the defective die 162 cannot be picked up accurately, and even a small deviation, damage to other qualified dies is easily caused in the process of picking up the defective die 162. Through the cooperation of the wafer inspection device 100 of the present application with the die pick-up unit 170 and/or the ejector pin 190, the accuracy and efficiency of picking up the defective die 162 can be improved.

It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims

1. A wafer inspection apparatus, comprising:

the bearing jig is used for bearing the wafer;

the storage unit is used for storing the bearing jig bearing the wafer;

2. The wafer detection device according to claim 1, wherein the carrying fixture comprises a supporting portion and a flexible film, the supporting portion is disposed around the flexible film, and the flexible film is used for attaching and carrying the wafer.

3. The wafer detection apparatus according to claim 2, wherein the worktable comprises a first positioning plate and a second positioning plate stacked and spaced apart from each other, and a supporting member connected between the first positioning plate and the second positioning plate, the carrying jig is inserted between the first positioning plate and the second positioning plate to be fixed on the worktable, and the first positioning plate is further provided with a first hollow area for exposing the wafer.

4. The wafer detection apparatus as claimed in claim 3, wherein the first positioning plate includes a first surface facing the second positioning plate, the second positioning plate includes a second surface facing the first positioning plate, at least one position-limiting portion is disposed on the first surface and/or the second surface, and the position-limiting portion is configured to abut against and fix the support portion.

5. The wafer detection apparatus as claimed in claim 3, wherein the support member includes a first support member and a second support member, the first support member and the second support member are arranged along a first direction at two opposite sides of the first hollow area, and the first support member and the second support member are respectively abutted against two opposite sides of the support portion to position the support portion.

6. The apparatus of claim 5, wherein the supporting member comprises a limiting member and a locking portion, the limiting member and the locking portion are arranged on two opposite sides of the first hollow region along a second direction, the supporting fixture is inserted between the first positioning plate and the second positioning plate from one side of the locking portion, the limiting member and the locking portion are respectively abutted against two opposite sides of the supporting portion to position the supporting portion, and the second direction is perpendicular to the first direction.

7. The wafer inspection device of any of claims 3-6, wherein the stage further comprises a position sensing unit electrically connected to the inspection unit for determining a position of the defective die relative to the stage.

8. The wafer inspection device as claimed in claim 7, further comprising a die pick-up unit and a die collection unit, wherein the die collection unit is located at one side of the worktable, and the die pick-up unit moves relative to the worktable for picking up the defective die and placing the defective die in the die collection unit.

9. The wafer detecting device according to claim 8, wherein the second positioning plate includes a second hollow, and the wafer detecting device further includes a pin, the pin and the die sucking unit are respectively arranged at two opposite sides of the worktable, and the pin is disposed corresponding to the second hollow and can reciprocate relative to the second hollow for pushing the wafer to move toward the die sucking unit.

10. The wafer inspection apparatus of claim 9, wherein the ejector pin and the stage are relatively movable to align the ejector pin with a geometric center of the defective die and push the defective die.