CN114530398A - High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process - Google Patents
High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process Download PDFInfo
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- CN114530398A CN114530398A CN202210107031.1A CN202210107031A CN114530398A CN 114530398 A CN114530398 A CN 114530398A CN 202210107031 A CN202210107031 A CN 202210107031A CN 114530398 A CN114530398 A CN 114530398A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000008569 process Effects 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 title claims description 17
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 230000002457 bidirectional effect Effects 0.000 claims description 54
- 238000006243 chemical reaction Methods 0.000 claims description 35
- 238000003860 storage Methods 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007306 turnover Effects 0.000 description 31
- 239000000758 substrate Substances 0.000 description 27
- 238000003825 pressing Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 230000002146 bilateral effect Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a high accuracy top gum after semiconductor module chip sputter processing procedure is got and is put equipment relates to chip production technical field, and it includes the frame, is provided with loading attachment, rotary device, handling device in the frame, tears the chip device open, empty tool handling device, unloader and conveyer. After the chip sputtering process, the jig and the product are placed on the feeding device together, the feeding device moves the jig to the lower side of the rotating device, the rotating device clamps the jig with the chip, then the rotating device rises, then the carrying device comes to the upper side of the rotating device, the jig and the chip are carried to the upper side of the chip dismounting device together, after the chip and the jig are separated, the jig comes to an empty jig carrying device to carry the jig up, then the chip is taken down by the discharging device, and finally the chip is transported by the transporting device. This application has the convenience that promotes the chip and take off from the tool, promotes the production efficiency of chip, prevents simultaneously that the chip from taking place the effect of damaging at the in-process of pulling down.
Description
Technical Field
The application relates to the technical field of chip production, in particular to high-precision top glue taking and placing equipment after a semiconductor module chip sputtering process.
Background
At present, a chip is an important component of electronic equipment such as a computer and a mobile phone, and is a silicon chip structure which contains an integrated circuit inside and has a small volume. The chip is mostly in a cubic structure, and other five surfaces of the chip except the bottom surface need to be sputtered with a metal film in the manufacturing process so as to protect the chip, and the bottom surface is used as a welding surface and does not need to be sputtered with a film.
In the related technology, a chip is placed on a jig, then glue is smeared on the bottom surface of the chip, then sputtering is carried out on the chip, the bottom surface glue is removed by using a chemical cleaning agent after the chip passes through a furnace, the chip is manually taken down from the jig after the chip sputtering process, and the taken-down chip is packaged in the next step.
For the related art in the foregoing, the inventor thinks that the efficiency of manually taking off the chip from the jig is low, which affects the production efficiency of the chip, and meanwhile, the manual taking off easily causes the chip to be damaged and unusable.
Disclosure of Invention
In order to improve the manual lower problem of efficiency of taking off the chip from the tool, this application provides a high accuracy top gum after semiconductor module chip sputter processing is got and is put equipment.
The application provides a high accuracy top gum after semiconductor module chip sputter processing procedure is got and is put equipment adopts following technical scheme:
a high-precision top glue taking and placing device after a semiconductor module chip sputtering process comprises a rack, wherein a feeding device, a rotating device, a carrying device, a chip dismounting device, an empty jig carrying device, a discharging device and a conveying device are sequentially arranged on the rack; the feeding device comprises a first tray, the first tray is erected on the rack in a sliding mode, and a jig with chips is placed on the first tray; the rotating device is positioned on the upper side of the feeding device and is used for grabbing the jig on the first tray; the carrying device and the chip removing device are arranged on the rack in a sliding mode, the carrying device conveys the jig on the rotating device to the chip removing device, and the chip removing device removes the chip on the jig; the empty jig carrying device carries the jig with the chip removed; the blanking device carries the chips to the conveying device, and the conveying device conveys the chips.
Optionally, the feeding device includes a first driving motor and a first screw, the first driving motor is erected on the frame, the first screw is fixed to an output shaft of the first driving motor, and the first screw is in threaded connection with the first tray.
Optionally, the rotating device includes a rotating electrical machine and a first bidirectional cylinder, the rotating electrical machine is erected on the frame, the first bidirectional cylinder is fixed on the rotating electrical machine, a first clamping plate is arranged on the first bidirectional cylinder, and the first clamping plate is arranged on the first bidirectional cylinder in a relative manner.
Optionally, the carrying device comprises a first driving cylinder, a lifting cylinder and a second bidirectional cylinder, the first driving cylinder drives the lifting cylinder to slide on the rack, the lifting cylinder is vertically arranged, the second bidirectional cylinder is fixed on a piston rod of the lifting cylinder, a second clamping plate is arranged on the second bidirectional cylinder, and the second clamping plate is oppositely arranged on the second bidirectional cylinder.
Optionally, the chip detaching device comprises a second tray and a sliding motor, the sliding motor drives the second tray to slide on the rack, a first ejection cylinder and a second ejection cylinder are further arranged on the rack, the first ejection cylinder and the second ejection cylinder are oppositely arranged, a pressure head is arranged on the first ejection cylinder, and a thimble is arranged on the second ejection cylinder.
Optionally, the empty jig carrying device comprises a third bidirectional cylinder and a third clamping plate, the third bidirectional cylinder is slidably erected on the rack, and the third clamping plate is arranged on the third bidirectional cylinder in a relative manner.
Optionally, the blanking device comprises a turnover motor, the turnover motor is erected on the rack, a turnover plate is arranged on an output shaft of the turnover motor, the turnover plate is fixed on the output shaft of the turnover motor, a suction head is arranged on the turnover plate, and the suction head on the turnover plate adsorbs the chips.
Optionally, the transportation device includes storage frame and conveyer belt, the storage frame with the conveyer belt is all erect in the frame, be provided with lifting subassembly and conversion subassembly on the storage frame, the lifting subassembly is in slide on the storage frame, the conversion subassembly is in the storage frame with reciprocate between the conveyer belt.
To sum up, this application includes following at least one semiconductor module chip high accuracy top gum behind the sputter processing procedure and gets and put equipment beneficial technological effect:
in the application, chip sputtering process back, place tool and product on loading attachment together, loading attachment removes the tool to the rotary device downside, rotary device presss from both sides the tool that has the chip, then rotary device rises, later handling device comes to the rotary device top, carry tool and chip together to tear chip device top open, chip and tool break away from the back, the tool comes to empty tool handling device and removes the tool, unloader takes off the chip afterwards, at last through conveyer with the chip transport to process on next step, help promoting the convenience that the chip took off from the tool, promote the production efficiency of chip, prevent the condition that the chip takes place the damage at the in-process of pulling down simultaneously.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a high-precision top-glue pick-and-place apparatus after a sputtering process of a semiconductor module chip according to the present embodiment;
FIG. 2 is a schematic view of the loading device according to the present embodiment;
FIG. 3 is a schematic view of a rotary device according to the present embodiment;
FIG. 4 is a schematic view of the conveying apparatus according to the present embodiment;
FIG. 5 is a schematic structural diagram of a chip detachment apparatus according to the present embodiment;
FIG. 6 is a schematic structural diagram of a handling apparatus for empty jigs according to the present embodiment;
FIG. 7 is a schematic view of a blanking structure according to the present embodiment;
fig. 8 is a schematic view of the transportation device according to the present embodiment.
Reference numerals: 1. a frame; 11. a guide groove; 2. a feeding device; 21. a first drive motor; 22. a first screw; 23. a first tray; 231. a first positioning block; 24. a slider; 3. a rotating device; 31. a rotating electric machine; 32. a first bidirectional cylinder; 321. a first clamping plate; 322. a first card slot; 33. a lifting motor; 331. a second screw; 34. a fixing plate; 35. a scanning gun; 4. a carrying device; 41. a first substrate; 411. a lifting cylinder; 42. a second substrate; 43. a connecting rod; 44. a first driving cylinder; 45. a first guide bar; 451. a first guide block; 46. a second bidirectional cylinder; 461. a second clamping plate; 462. a second card slot; 5. detaching the chip device; 51. a second tray; 511. a second positioning block; 52. a second guide bar; 521. a second guide block; 53. a slip motor; 531. a third screw; 54. a first ejection cylinder; 541. a pressure head; 55. a second ejection cylinder; 551. a thimble; 56. a pressure sensor; 57. detecting a camera; 6. an empty jig carrying device; 61. a support plate; 62. a second driving cylinder; 63. a third bidirectional cylinder; 631. a third clamping plate; 632. a third card slot; 7. a blanking device; 71. turning over a motor; 72. a turnover plate; 73. a suction head; 74. a balance robot; 8. a transportation device; 81. a storage rack; 82. a conveyor belt; 83. a lifting assembly; 831. a lifting cylinder; 832. a fourth screw; 833. lifting the plate; 84. a conversion component; 841. a conversion cylinder; 842. a switching disk; 843. an air tap.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely in the following with reference to the drawings of the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the application without inventive effort, are within the scope of protection of the application.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of the present application do not denote a limitation of quantity, but rather denote the presence of at least one.
The present application is described in further detail below with reference to figures 1-8.
The embodiment of the application discloses high-precision top glue taking and placing equipment after a semiconductor module chip sputtering process.
Referring to fig. 1, the high-precision glue ejection taking and placing equipment after the semiconductor module chip sputtering process comprises a rack 1, wherein a feeding device 2, a rotating device 3, a carrying device 4, a chip dismounting device 5, an empty jig carrying device 6, a discharging device 7 and a conveying device 8 are arranged on the rack 1. After the chip sputtering process, place tool and product on loading attachment 2 together, loading attachment 2 removes the tool to rotary device 3 downside, rotary device 3 presss from both sides the tool that has the chip, then rotary device 3 rises, afterwards handling device 4 comes to rotary device 3 top, carry tool and chip together to tear chip device 5 top open, chip and tool break away from the back, the tool comes to empty tool handling device 6 and removes the tool, unloader 7 takes off the chip afterwards, transport the chip to process on next step through conveyer 8 at last.
The feeding device 2 comprises a first driving motor 21 and a first screw 22, the first driving motor 21 is horizontally erected on the frame 1, and one end of the first screw 22 is coaxially fixed with an output shaft of the first driving motor 21. Be provided with first tray 23 on the frame 1, first tray 23 is whole to be the level setting, and the downside of first tray 23 is provided with slider 24, and slider 24 is fixed on first tray 23, and first screw rod 22 and slider 24 threaded connection. When the tray is used, the first driving motor 21 drives the first screw 22 to rotate, and the first screw 22 drives the first tray 23 to reciprocate along the axial direction of the first screw 22.
The first tray 23 is provided with four first positioning blocks 231, the first positioning blocks 231 are arranged on the first tray 23 at intervals, and when the jig with the chips is used, the jig with the chips is placed among the four first positioning blocks 231.
Because the tool corresponds with the chip, consequently can beat unified two-dimensional code on the tool, in process of production, need discernment correspond the two-dimensional code on the tool, for the accuracy that promotes the chip and dismantle, be provided with scanning rifle 35 in the frame 1, scanning rifle 35 erects in frame 1, and scanning rifle 35's one end is towards first bidirectional cylinder 32, drives the tool when rotating electrical machines 31 and rotates the back, and scanning rifle 35 scans the two-dimensional code on the tool.
The carrying device 4 includes a first substrate 41 and a second substrate 42, the first substrate 41 and the second substrate 42 are arranged in parallel at intervals, a connecting rod 43 is arranged between the first substrate 41 and the second substrate 42, four connecting rods 43 are arranged at intervals between the first substrate 41 and the second substrate 42, one end of each of the four connecting rods 43 is fixed with the second substrate 42, the other end of each of the four connecting rods 43 penetrates through the first substrate 41, and the first substrate 41 and the connecting rods 43 are in sliding fit.
The first substrate 41 is provided with a lifting cylinder 411, the lifting cylinder 411 is vertically erected on the first substrate 41, a piston rod of the lifting cylinder 411 is fixed to the second substrate 42, and the lifting cylinder 411 drives the second substrate 42 to slide on the first substrate 41. The frame 1 is provided with a first driving cylinder 44, the first driving cylinder 44 is horizontally erected on the frame 1, a piston rod of the first driving cylinder 44 is fixed to the first substrate 41, the frame 1 is provided with a guide groove 11, the first substrate 41 and the second substrate 42 are respectively located on two sides of the guide groove 11, the connecting rod 43 penetrates through the guide groove 11, and the first driving cylinder 44 drives the first substrate 41 and the second substrate 42 to slide on the frame 1.
For promoting the stability that first base plate 41 and second base plate 42 slided in frame 1, be provided with first guide bar 45 in frame 1, first guide bar 45 is provided with two relatively in frame 1, and two equal level of first guide bar 45 fix in frame 1, be provided with first guide block 451 on the first base plate 41, first guide block 451 corresponds with first guide bar 45, the one end of two first guide blocks 451 all is fixed with first base plate 41, the other end all with the cooperation of sliding of corresponding first guide bar 45.
The second base plate 42 is provided with a second bidirectional cylinder 46, the second bidirectional cylinder 46 is detachably fixed on the second base plate 42, the second bidirectional cylinder 46 is provided with a second clamping plate 461, the second clamping plates 461 are oppositely arranged on the second bidirectional cylinder 46, and the second bidirectional cylinder 46 drives the second clamping plates 461 to move towards the side close to or away from each other. Second clamping grooves 462 are formed in the mutually close sides of the two second clamping plates 461, in use, the first driving air cylinder 44 drives the first substrate 41 and the second substrate 42 to move towards the side close to the first bidirectional air cylinder 32, after the second bidirectional air cylinder 46 moves to the upper side of the first bidirectional air cylinder 32, the lifting air cylinder 411 drives the second bidirectional air cylinder 46 to move towards the side close to the first bidirectional air cylinder 32, then the second bidirectional air cylinder 46 drives the two second clamping plates 461 to move towards the mutually close side, the second clamping grooves 462 on the two second clamping plates 461 clamp the jig, after the second clamping grooves 462 on the second clamping plates 461 clamp the jig, the first clamping plates 321 move towards the mutually far side under the driving of the first bidirectional air cylinder 32, and therefore the jig is taken down from the first clamping plates 321 by the second clamping plates 461.
The rotating device 3 is located on one side of the moving direction of the carrying device 4, and the chip removing device 5 is located on the other side of the moving direction of the carrying device 4.
The chip detaching device 5 includes a second tray 51, and the second tray 51 is disposed horizontally as a whole. The rack 1 is provided with two second guide rods 52, the two second guide rods 52 are arranged oppositely, the length direction of the two second guide rods 52 is the same as that of the second guide rods 52, the second tray 51 is provided with a second guide block 521, the second guide block 521 corresponds to the second guide rods 52, one end of the second guide block 521 is fixed with the tray, and the other end of the second guide block 521 is matched with the corresponding second guide rod 52 in a sliding manner.
The second tray 51 is provided with the second positioning blocks 511, the second positioning blocks 511 are arranged on the second tray 51 at intervals, and the four second positioning blocks 511 are provided with the converting clamp, so that in use, the jig is placed on the converting clamp of the second tray 51 by the second clamping plate 461.
The rack 1 is provided with a sliding motor 53, the sliding motor 53 is horizontally erected on the rack 1, an output shaft of the sliding motor 53 is provided with a third screw 531, one end of the third screw 531 is fixed with the output shaft of the sliding motor 53, the third screw 531 is in threaded connection with the second tray 51, the sliding motor 53 drives the third screw 531 to rotate, and the third screw 531 drives the second tray 51 to slide along the length direction of the second guide rod 52.
The chip detaching device 5 comprises a first ejection cylinder 54 and a second ejection cylinder 55, the first ejection cylinder 54 and the second ejection cylinder 55 are arranged oppositely, piston rods of the first ejection cylinder 54 and the second ejection cylinder 55 face the second tray 51, a pressure head 541 is arranged on the first ejection cylinder 54, a plurality of pressure heads 541 are uniformly arranged on the first ejection cylinder 54 at intervals, a thimble 551 is arranged on the second ejection cylinder 55, and a plurality of thimbles 551 are uniformly arranged on the second ejection cylinder 55 at intervals. When the device is used, the first ejection cylinder 54 drives the pressure head 541 to move towards one side close to the jig, the second ejection cylinder 55 drives the ejector pin 551 to move towards one side close to the jig, the pressure head 541 descends to press the chip and simultaneously vacuum-suck the chip, the lower ejector pin 551 penetrates through the conversion fixture to push the upper jig upwards, so that the jig and the chip generate relative movement, and the chip and the jig are separated.
Because the pressure head 541 has corresponding resistance in the process of pressing the chip, the pressure head 541 has corresponding resistance, in order to ensure that each chip can be taken down from the jig, after the improvement of a designer, the first ejection cylinder 54 is provided with the pressure sensor 56, the pressure sensor 56 judges whether the chip is completely separated from the jig according to pressure data, and after the chip is separated from the jig, the pressure head 541 descends through the first ejection cylinder 54, and the chip is placed on the conversion fixture.
The sliding motor 53 drives the conversion fixture on the second tray 51 to move to one side of the empty fixture carrying device 6, the empty fixture carrying device 6 lifts the fixture on the second tray 51, the detection camera 57 is arranged on the rack 1, the detection camera 57 photographs the chip on the replacement fixture, when the chip is not in the conversion fixture photographed by the detection camera 57, the second driving motor drives the second tray 51 to move between the pressing head 541 and the needle punching, the step of detaching the chip by the pressing head 541 and the thimble 551 is repeated, and if the chip is not in the conversion fixture photographed by the detection camera 57, the sliding motor 53 drives the second tray 51 to move to one side of the discharging device 7.
The empty jig carrying device 6 comprises a supporting plate 61, the supporting plate 61 is slidably erected on the frame 1, a second driving cylinder 62 and a third bidirectional cylinder 63 are arranged on the supporting plate 61, the second driving cylinder 62 is erected on the supporting plate 61, the second driving cylinder 62 is integrally vertically arranged, the third bidirectional cylinder 63 is fixed on the second driving cylinder 62, a third clamping plate 631 is arranged on the third bidirectional cylinder 63, two third clamping plates 631 are oppositely arranged on the third bidirectional cylinder 63, third clamping grooves 632 are formed in the sides, close to each other, of the two third clamping plates 631, the third bidirectional cylinder 63 drives the third clamping plates 631 to move towards the sides, close to or away from each other, when in use, the supporting plate 61 drives the second driving cylinder 62 and the third bidirectional cylinder 63 to slidably move to the upper side of the second tray 51, the second driving cylinder 62 drives the third bidirectional cylinder 63 to descend towards the side, close to the second tray 51, then the third bidirectional cylinder 63 drives the two third clamping plates 631 to move to the side close to each other, the third clamping grooves 632 on the third clamping plates 631 clamp the jig, and then the jig is taken down from the second tray 51, so that the automation degree of the jig taken down from the second tray 51 is improved.
The blanking device 7 comprises a turnover motor 71 and a turnover plate 72, the turnover motor 71 is horizontally erected on the machine frame 1, one end of the turnover plate 72 is fixed with an output shaft of the turnover motor 71, the other end of the turnover plate extends to one side close to the transportation device 8 in the horizontal direction, suction heads 73 are arranged on the upper side of the turnover plate 72 in the thickness direction, the suction heads 73 are uniformly arranged on the turnover plate 72 at intervals, in use, the turnover motor 71 drives the turnover plate 72 to turn to one side of the second tray 51, the suction heads 73 on the turnover plate 72 adsorb chips onto the suction heads 73, and then the turnover motor 71 drives the turnover plate 72 to turn to one side close to the transportation device 8. In order to improve the efficiency of chip tray loading, after improvement of designers, a tray placing robot 74 is arranged on the frame 1, and the tray placing robot 74 sequentially takes the chips off the suction heads 73 of the turnover tray and places the chips on the conveying device 8.
The transportation device 8 includes a storage rack 81 and a conveyor belt 82, the storage rack 81 is installed on the rack 1, the conveyor belt 82 is installed on one side of the rack 1 close to the storage rack 81, and the process trays are stacked in the storage rack 81. Be provided with lifting subassembly 83 and conversion components 84 on the storage frame 81, lifting subassembly 83 includes lifting cylinder 831 and fourth screw 832, lifting cylinder 831 erects vertically in frame 1, and the output shaft of lifting cylinder 831 is towards the upside of vertical direction, the one end of fourth screw 832 is coaxial fixed with the output shaft of lifting cylinder 831, it is provided with lifting plate 833 to slide on the frame 1, and fourth screw 832 and lifting plate 833 threaded connection, during the use, lifting plate 833 transports the process tray of storage frame 81 bottom to the upside of storage frame 81 under the effect of lifting cylinder 831 and lifting plate 833. Conversion subassembly 84 is including conversion cylinder 841, conversion cylinder 841 is located and slides between storage frame 81 and the conveyer belt 82, and conversion cylinder 841 wholly is vertical setting, the piston rod orientation of conversion cylinder 841 is close to one side of storage frame 81, the piston rod one end of conversion cylinder 841 is provided with conversion dish 842, be provided with air cock 843 on the conversion dish 842, air cock 843 can dismantle and fix on conversion dish 842, when lifting plate 833 with the upside of preparation tray lifting to storage frame 81, conversion cylinder 841 slides to the upside of storage frame 81, then conversion cylinder 841 drives air cock 843 and removes to one side that is close to storage frame 81, air cock 843 on the conversion dish 842 adsorbs the preparation tray, the preparation tray removes to the conveyer belt 82 under the drive of conversion cylinder 841 at last.
The placement robot 74 places the chips on the process trays on the conveyor 82.
The implementation principle of the high-precision top glue taking and placing equipment after the sputtering process of the semiconductor module chip is as follows: in application, the first driving motor 21 drives the first screw 22 to rotate, the first screw 22 drives the first tray 23 to move along the axial direction of the first screw 22, the lifting motor 33 drives the second screw 331 to rotate, the screw drives the first clamping plates 321 to move towards one side close to the first tray 23, the first bidirectional cylinder 32 drives the two first clamping plates 321 to move towards the first side close to each other, the first clamping grooves 322 on the two first clamping plates 321 are clamped at two sides of the jig, the scanning gun 35 scans the two-dimensional codes on the jig, the first driving cylinder 44 drives the first substrate 41 and the second substrate 42 to move towards one side close to the first bidirectional cylinder 32, when the second bidirectional cylinder 46 moves to the upper side of the first bidirectional cylinder 32, the lifting cylinder 411 drives the second bidirectional cylinder 46 to move towards one side close to the first bidirectional cylinder 32, the second bidirectional cylinder 46 drives the two second clamping plates 461 to move towards one side close to each other, the second clamping grooves 462 on the two second clamping plates 461 clamp the jig, when the second clamping grooves 462 on the second clamping plates 461 clamp the jig, the first clamping plates 321 are driven by the first bidirectional cylinders 32 to move towards the sides far away from each other, the second clamping plates 461 take the jig from the first clamping plates 321, the taken jig is placed on the conversion clamp of the second tray 51, the first ejection cylinders 54 drive the pressing heads 541 to move towards the sides near the jig, the second ejection cylinders 55 drive the ejector pins 551 to move towards the sides near the jig, the pressing heads 541 descend, the chips are pressed and simultaneously vacuum-sucked, the lower ejector pins penetrate through the conversion clamp to push the upper jig upwards, so that the relative movement is generated between the jig and the chips, the chips and the jig are separated, the pressure sensors 56 judge whether the chips are completely separated from the jig through pressure data, after the chips are separated from the jig, the pressing heads 551 descend through the first ejection cylinders 54, placing the chip on the conversion fixture, taking a picture of the chip on the conversion fixture by the detection camera 57, when the chip is not on the conversion fixture shot by the detection camera 57, the second driving motor drives the second tray 51 to move between the pressing head 541 and the needle, repeating the steps of detaching the chip by the pressing head 541 and the thimble 551, if the chip is not on the conversion fixture shot by the detection camera 57, the sliding motor 53 drives the second tray 51 to move to one side of the feeding device 7, the support plate 61 drives the second driving cylinder 62 and the third bidirectional cylinder 63 to slide to the upper side of the second tray 51, the second driving cylinder 62 drives the third bidirectional cylinder 63 to descend to one side close to the second tray 51, the third bidirectional cylinder 63 drives the two third clamping plates 631 to move to the side close to each other, the third clamping grooves 632 on the third clamping plates 631 are clamped, and the jig is taken down from the second tray 51, the turnover motor 71 drives the turnover plate 72 to turn over toward one side of the second tray 51, the suction head 73 on the turnover plate 72 sucks the chip on the suction head 73, then the turnover motor 71 drives the turnover plate 72 to turn over toward the side close to the transportation device 8, the tray-placing robot 74 sequentially takes the chips off the suction heads 73 of the turnover tray, the lifting plate 833 transports the process trays at the bottom of the storage rack 81 to the upper side of the storage rack 81 under the action of the lifting cylinder 831 and the lifting plate 833, when the lifting plate 833 lifts the process trays to the upper side of the storage rack 81, the conversion cylinder 841 slides to the upper side of the storage rack 81, the conversion cylinder 841 drives the air nozzles 843 to move to one side close to the storage rack 81, the air nozzles 843 on the conversion disc 842 adsorb the process trays, finally, the process trays move to the conveying belt 82 under the drive of the conversion cylinder 841, and the tray placing robot 74 places the chips on the process trays of the conveying belt 82.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides an equipment is got to high accuracy top gum after semiconductor module chip sputter processing procedure, includes frame (1), its characterized in that: the automatic chip removing machine is characterized in that a feeding device (2), a rotating device (3), a carrying device (4), a chip removing device (5), an empty jig carrying device (6), a discharging device (7) and a conveying device (8) are sequentially arranged on the rack (1);
the feeding device (2) comprises a first tray (23), the first tray (23) is erected on the rack (1) in a sliding mode, and a jig with chips is placed on the first tray (23);
the rotating device (3) is positioned on the upper side of the feeding device (2), and the rotating device (3) is used for grabbing the jigs on the first tray (23);
the carrying device (4) and the chip removing device (5) are arranged on the rack (1) in a sliding mode, the carrying device (4) transfers the jig on the rotating device (3) to the chip removing device (5), and the chip removing device (5) removes the chip on the jig;
the empty jig carrying device (6) carries the jig with the chips removed;
the blanking device (7) conveys the chips to the conveying device (8), and the conveying device (8) conveys the chips.
2. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip according to claim 1, wherein the equipment comprises: the feeding device (2) comprises a first driving motor (21) and a first screw (22), the first driving motor (21) is erected on the rack (1), the first screw (22) is fixed with an output shaft of the first driving motor (21), and the first screw (22) is in threaded connection with the first tray (23).
3. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip in claim 1 is characterized in that: the rotating device (3) comprises a rotating motor (31) and a first bidirectional cylinder (32), the rotating motor (31) is erected on the rack (1), the first bidirectional cylinder (32) is fixed on the rotating motor (31), a first clamping plate (321) is arranged on the first bidirectional cylinder (32), and the first clamping plate (321) is arranged on the first bidirectional cylinder (32) oppositely.
4. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip in claim 1 is characterized in that: the carrying device (4) comprises a first driving air cylinder (44), a lifting air cylinder (411) and a second bidirectional air cylinder (46), the first driving air cylinder (44) drives the lifting air cylinder (411) to slide on the rack (1), the lifting air cylinder (411) is vertically arranged, the second bidirectional air cylinder (46) is fixed on a piston rod of the lifting air cylinder (411), a second clamping plate (461) is arranged on the second bidirectional air cylinder (46), and the second clamping plate (461) is oppositely arranged on the second bidirectional air cylinder (46).
5. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip in claim 1 is characterized in that: the chip dismounting device (5) comprises a second tray (51) and a sliding motor (53), the sliding motor (53) drives the second tray (51) to slide on the rack (1), a first ejection cylinder (54) and a second ejection cylinder (55) are further arranged on the rack (1), the first ejection cylinder (54) and the second ejection cylinder (55) are oppositely arranged, a pressure head (541) is arranged on the first ejection cylinder (54), and a thimble (551) is arranged on the second ejection cylinder (55).
6. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip according to claim 1, wherein the equipment comprises: empty tool handling device (6) include third two-way cylinder (63) and third cardboard (631), third two-way cylinder (63) slide and erect in frame (1) is last, third cardboard (631) are in be relative setting on third two-way cylinder (63).
7. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip in claim 1 is characterized in that: unloader (7) are including upset motor (71), establish upset motor (71) frame (1) on frame (1), just be provided with returning face plate (72) on the output shaft of upset motor (71), returning face plate (72) are fixed on the output shaft of upset motor (71), be provided with suction head (73) on returning face plate (72), on returning face plate (72) suction head (73) adsorb the chip.
8. The high-precision top glue taking and placing equipment used after the sputtering process of the semiconductor module chip in claim 1 is characterized in that: conveyer (8) include storage frame (81) and conveyer belt (82), storage frame (81) with conveyer belt (82) all erect in frame (1), be provided with lifting subassembly (83) and conversion subassembly (84) on storage frame (81), lifting subassembly (83) are in slide on storage frame (81), conversion subassembly (84) are in storage frame (81) with reciprocating between conveyer belt (82).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210107031.1A CN114530398A (en) | 2022-01-28 | 2022-01-28 | High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process |
| CN202222173484.2U CN219123186U (en) | 2022-01-28 | 2022-08-18 | High-precision top glue taking and placing equipment for semiconductor module chip after sputtering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210107031.1A CN114530398A (en) | 2022-01-28 | 2022-01-28 | High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114530398A true CN114530398A (en) | 2022-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210107031.1A Pending CN114530398A (en) | 2022-01-28 | 2022-01-28 | High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process |
| CN202222173484.2U Active CN219123186U (en) | 2022-01-28 | 2022-08-18 | High-precision top glue taking and placing equipment for semiconductor module chip after sputtering process |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222173484.2U Active CN219123186U (en) | 2022-01-28 | 2022-08-18 | High-precision top glue taking and placing equipment for semiconductor module chip after sputtering process |
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| CN (2) | CN114530398A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115301610A (en) * | 2022-08-02 | 2022-11-08 | 牧哲(上海)自动化科技有限公司 | Chip all-dimensional cleaning and sorting machine and cleaning method |
| CN115301610B (en) * | 2022-08-02 | 2024-07-09 | 牧哲(上海)自动化科技有限公司 | Chip omnibearing cleaning and sorting machine and cleaning method |
-
2022
- 2022-01-28 CN CN202210107031.1A patent/CN114530398A/en active Pending
- 2022-08-18 CN CN202222173484.2U patent/CN219123186U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115301610A (en) * | 2022-08-02 | 2022-11-08 | 牧哲(上海)自动化科技有限公司 | Chip all-dimensional cleaning and sorting machine and cleaning method |
| CN115301610B (en) * | 2022-08-02 | 2024-07-09 | 牧哲(上海)自动化科技有限公司 | Chip omnibearing cleaning and sorting machine and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN219123186U (en) | 2023-06-02 |
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Application publication date: 20220524 |