CN219123186U

CN219123186U - High-precision top glue taking and placing equipment for semiconductor module chip after sputtering process

Info

Publication number: CN219123186U
Application number: CN202222173484.2U
Authority: CN
Inventors: 罗琳; 徐戎; 胡路平; 马兵; 张远
Original assignee: Muzhe Shanghai Automation Technology Co ltd
Current assignee: Muzhe Shanghai Automation Technology Co ltd
Priority date: 2022-01-28
Filing date: 2022-08-18
Publication date: 2023-06-02
Anticipated expiration: 2032-08-18
Also published as: CN114530398A

Abstract

The application relates to a high-precision top glue taking and placing device after a semiconductor module chip sputtering process, relates to the technical field of chip production, and comprises a frame, wherein a feeding device, a rotating device, a carrying device, a chip disassembling device, an empty jig carrying device, a discharging device, a conveying device and a material blocking device are arranged on the frame. After the chip sputtering process, the feeding device moves the jig to the lower side of the rotating device, the rotating device clamps the jig with the chip, then the rotating device ascends, the carrying device goes to the upper part of the rotating device to carry the jig and the chip together to the upper part of the chip disassembling device, after the chip and the jig are separated, the jig goes to the empty jig carrying device to carry the jig, then the discharging device takes down the chip, and finally the chip is transported through the transporting device, and the blocking device blocks the transported chip. This application has the convenience that promotes the chip and take off from the tool, promotes the production efficiency of chip, prevents the effect that the chip took place to damage at the in-process of pull down simultaneously.

Description

High-precision top glue taking and placing equipment for semiconductor module chip after sputtering process

Technical Field

The application relates to the technical field of chip production, in particular to high-precision top glue picking and placing equipment for a semiconductor module chip after a sputtering process.

Background

At present, a chip, which is an important component of electronic equipment such as a computer, a mobile phone and the like, is a silicon chip structure with an integrated circuit inside and a small volume. Most of the chips are of a cube structure, in the manufacturing process, metal films need to be sputtered on the five surfaces of the chips except the bottom surface so as to protect the chips, the bottom surface is used as a welding surface, and the films do not need to be sputtered.

In the related art, a chip is placed on a jig, then the chip is smeared on the bottom surface of the chip by using glue, then sputtering is carried out on the chip, the glue on the bottom surface is removed by using a chemical cleaning agent after passing through a furnace, the chip is manually taken down from the jig after the chip sputtering process, and the taken-down chip is packaged in the next step.

With respect to the above related art, the inventor considers that there is a problem that the efficiency of manually removing the chip from the jig is low, which affects the production efficiency of the chip, and the manual removal easily causes the chip to be damaged and not to be used.

Disclosure of Invention

In order to solve the problem that the efficiency of manually taking the chip off the jig is low, the application provides high-precision adhesive ejection picking and placing equipment for the semiconductor module chip after the sputtering process.

The application provides a high accuracy top glue after semiconductor module chip sputtering process gets equipment of putting adopts following technical scheme:

the high-precision glue ejection and placement equipment after the sputtering process of the semiconductor module chip comprises a rack, wherein a feeding device, a rotating device, a carrying device, a chip detaching device, an empty jig carrying device, a discharging device and a conveying device are sequentially arranged on the rack; the feeding device comprises a first tray, the first tray is glidingly erected on the rack, and a jig with a chip is placed on the first tray; the rotating device is positioned on the upper side of the feeding device and is used for grabbing the jig on the first tray; the carrying device and the chip disassembling device are both glidingly arranged on the rack, the carrying device transfers the jig on the rotating device to the chip disassembling device, and the chip disassembling device disassembles chips on the jig; the empty jig carrying device carries the jigs after the chips are removed; the blanking device carries the chips to the conveying device, and the conveying device conveys the chips.

Optionally, the loading attachment includes first driving motor and first screw rod, first driving motor erects in the frame, first screw rod with first driving motor's output shaft is fixed, first screw rod with first tray threaded connection.

Optionally, the rotating device comprises a rotating motor and a first bidirectional air cylinder, the rotating motor is erected on the frame, the first bidirectional air cylinder is fixed on the rotating motor, a first clamping plate is arranged on the first bidirectional air cylinder, and the first clamping plate is oppositely arranged on the first bidirectional air cylinder.

Optionally, the handling device includes first actuating cylinder, lift cylinder and second bidirectional cylinder, first actuating cylinder drives the lift cylinder slides in the frame, just the lift cylinder thematically is vertical setting, the second bidirectional cylinder is fixed on the piston rod of lift cylinder, be provided with the second cardboard on the second bidirectional cylinder, the second cardboard is relative setting on the second bidirectional cylinder.

Optionally, tear chip device open includes second tray, motor that slides, the motor that slides drives the second tray slides in the frame, still be provided with first ejecting cylinder and the ejecting cylinder of second in the frame, first ejecting cylinder is relative setting with the ejecting cylinder of second, just be provided with the pressure head on the ejecting cylinder of first, be provided with the thimble on the ejecting cylinder of second.

Optionally, the empty jig carrying device comprises a third bidirectional cylinder and a third clamping plate, the third bidirectional cylinder is slidingly erected on the frame, and the third clamping plate is oppositely arranged on the third bidirectional cylinder.

Optionally, the unloader includes the upset motor, the upset motor erects in the frame, just be provided with the upset board on the output shaft of upset motor, the upset board is fixed on the output shaft of upset motor, be provided with the suction head on the upset board, on the upset board the suction head adsorbs the chip.

Optionally, the conveyer includes storage rack and conveyer belt, the storage rack with the conveyer belt all erects in the frame, be provided with lifting subassembly and conversion subassembly on the storage rack, the lifting subassembly is in slide on the storage rack, conversion subassembly is in the storage rack with reciprocate between the conveyer belt.

Optionally, the material blocking device comprises a baffle and a driving cylinder, wherein the driving cylinder is installed on the frame, and the baffle is installed on a piston rod of the driving cylinder.

In summary, the application includes the following beneficial technical effects of the high-precision top-glue pick-and-place device after the sputtering process of at least one semiconductor module chip:

in the application, after the chip sputtering process, place tool and product on loading attachment together, loading attachment removes the tool to the rotary device downside, and rotary device presss from both sides the tool that has the chip, then rotary device rises, and then handling device comes to the rotary device top, and with tool and chip transport to tear open chip device top together, after chip and tool break away from, the tool comes to empty tool handling device and carries the tool up, and then the unloader takes off the chip, and at last carries the chip to next process through conveyer, after the staff takes off the chip from the frame, stop device stops the chip, and after the staff takes off the packing completion with preceding chip, stop device is released the chip again, and the staff packs the chip again, helps promoting the convenience that the chip was taken off from the tool, promotes the production efficiency of chip, prevents simultaneously that the chip from taking place the condition of damage in the in-process of pulling down.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a high-precision top-glue pick-and-place apparatus after a sputtering process of a semiconductor module chip according to the present embodiment;

fig. 2 is a schematic structural diagram of a feeding device in the embodiment;

FIG. 3 is a schematic view of a rotating device according to the present embodiment;

fig. 4 is a schematic structural view of a carrying device according to the present embodiment;

FIG. 5 is a schematic diagram of a chip detachment apparatus according to the present embodiment;

FIG. 6 is a schematic diagram of a handling apparatus for empty jigs according to the present embodiment;

FIG. 7 is a schematic view of the main body blanking apparatus structure of the present embodiment;

FIG. 8 is a schematic view of a transportation device according to the present embodiment;

fig. 9 is a schematic diagram of a structure of a dam device according to the present embodiment.

Reference numerals: 1. a frame; 11. a guide groove; 2. a feeding device; 21. a first driving motor; 22. a first screw; 23. a first tray; 231. a first positioning block; 24. a slide block; 3. a rotating device; 31. a rotating electric machine; 32. a first bidirectional cylinder; 321. a first clamping plate; 322. a first clamping groove; 33. a lifting motor; 331. a second screw; 34. a fixing plate; 35. a scanning gun; 4. a carrying device; 41. a first substrate; 411. a lifting cylinder; 42. a second substrate; 43. a connecting rod; 44. a first driving cylinder; 45. a first guide bar; 451. a first guide block; 46. a second bidirectional cylinder; 461. a second clamping plate; 462. a second clamping groove; 5. the chip disassembling device; 51. a second tray; 511. a second positioning block; 52. a second guide bar; 521. a second guide block; 53. a slip motor; 531. a third screw; 54. a first ejection cylinder; 541. a pressure head; 55. a second ejection cylinder; 551. a thimble; 56. a pressure sensor; 57. detecting a camera; 6. an empty jig carrying device; 61. a support plate; 62. a second driving cylinder; 63. a third bidirectional cylinder; 631. a third clamping plate; 632. a third clamping groove; 7. a blanking device; 71. a turnover motor; 72. a turnover plate; 73. a suction head; 74. a wobble plate robot; 8. a transport device; 81. a storage rack; 82. a conveyor belt; 83. a lifting assembly; 831. lifting a cylinder; 832. a fourth screw; 833. a lifting plate; 84. a conversion assembly; 841. a switching cylinder; 842. a switching plate; 843. an air tap; 9. a material blocking device; 91. a baffle; 92. a driving cylinder; 93. a laser emitter; 94. a laser receiver.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without the benefit of the present disclosure, are intended to be within the scope of the present application based on the described embodiments.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. As used in the specification and claims of this application, the terms "a" and "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one.

The present application is described in further detail below in conjunction with figures 1-9.

The embodiment of the application discloses high-precision top glue picking and placing equipment after a sputtering process of a semiconductor module chip.

Referring to fig. 1-9, a high-precision adhesive ejection and placement device after a sputtering process of a semiconductor module chip comprises a frame 1, wherein a feeding device 2, a rotating device 3, a carrying device 4, a chip detaching device 5, an empty jig carrying device 6, a discharging device 7 and a conveying device 8 are arranged on the frame 1. After the chip sputtering process, the jig and the product are placed on the feeding device 2 together, the feeding device 2 moves the jig to the lower side of the rotating device 3, the rotating device 3 clamps the jig with the chip, then the rotating device 3 ascends, the carrying device 4 goes above the rotating device 3, the jig and the chip are carried together to the upper part of the chip disassembling device 5, after the chip and the jig are separated, the jig goes to the empty jig carrying device 6 to carry the jig, then the discharging device 7 takes down the chip, and finally the chip is transported to the next process through the transporting device 8.

The feeding device 2 comprises a first driving motor 21 and a first screw rod 22, wherein the first driving motor 21 is horizontally erected on the frame 1, and one end of the first screw rod 22 is coaxially fixed with an output shaft of the first driving motor 21. The frame 1 is provided with a first tray 23, the whole first tray 23 is horizontally arranged, the lower side of the first tray 23 is provided with a sliding block 24, the sliding block 24 is fixed on the first tray 23, and the first screw 22 is in threaded connection with the sliding block 24. When in use, the first driving motor 21 drives the first screw 22 to rotate, and the first screw 22 drives the first tray 23 to reciprocate along the axial direction of the first screw 22.

The first tray 23 is provided with first positioning blocks 231, and the first positioning blocks 231 are arranged on the first tray 23 at intervals, and in use, the jig with the chip is placed between the four first positioning blocks 231.

The rotary device 3 is located the upside of material loading subassembly, and the rotary subassembly includes rotating electrical machines 31, first two-way cylinder 32 and first cardboard 321, is provided with elevator motor 33 and second screw rod 331 in the frame 1, and elevator motor 33 is vertical to be erect in frame 1, and elevator motor 33's output shaft is towards the upside of vertical direction, and the axis direction of the axis direction first screw rod 22 of second screw rod 331 is perpendicular, and the one end of second screw rod 331 is fixed with the one end of elevator motor 33 output shaft. The frame 1 is provided with a fixed plate 34, the fixed plate 34 is in sliding fit with the frame 1, the second screw 331 is in threaded connection with the fixed plate 34, and the lifting motor 33 drives the second screw 331 to rotate, so that the fixed plate 34 slides along the axis direction of the second screw 331. The rotating electrical machines 31 wholly are the level setting, and rotating electrical machines 31 erect on fixed plate 34, first two-way cylinder 32 is fixed with rotating electrical machines 31's rotation axis, first cardboard 321 is relative setting on first two-way cylinder 32, first two-way cylinder 32 drives two first cardboard 321 to keeping away from each other or the one side that is close to each other and removes, first draw-in groove 322 has all been seted up to one side that two first cardboard 321 are close to each other, during the use, elevator motor 33 drives second screw 331 and rotates, the screw rod drives first cardboard 321 to the one side that is close to first tray 23 and removes, then first two-way cylinder 32 drives two first cardboard 321 to be close to each other the first side and remove, first draw-in groove 322 chucking on two first cardboard 321 is in the both sides of tool.

Because the tool corresponds with the chip, therefore can beat unified two-dimensional code on the tool, in the production process, need discern the two-dimensional code on the corresponding tool, for promoting the accuracy that the chip was dismantled, be provided with scanning rifle 35 on the frame 1, scanning rifle 35 erects on frame 1, and the one end of scanning rifle 35 is towards first two-way cylinder 32, when rotating electrical machines 31 drive the tool and rotate the back, scanning rifle 35 scans the two-dimensional code on the tool.

The carrying device 4 comprises a first substrate 41 and a second substrate 42, wherein the first substrate 41 and the second substrate 42 are arranged at parallel intervals, a connecting rod 43 is arranged between the first substrate 41 and the second substrate 42, four connecting rods 43 are arranged between the first substrate 41 and the second substrate 42 at intervals, one ends of the four connecting rods 43 are fixed with the second substrate 42, the other ends of the four connecting rods penetrate through the first substrate 41, and the first substrate 41 is in sliding fit with the connecting rods 43.

The first substrate 41 is provided with a lifting cylinder 411, the lifting cylinder 411 is vertically erected on the first substrate 41, a piston rod of the lifting cylinder 411 is fixed with the second substrate 42, and the lifting cylinder 411 drives the second substrate 42 to slide on the first substrate 41. The frame 1 is provided with a first driving air cylinder 44, the first driving air cylinder 44 is horizontally erected on the frame 1, a piston rod of the first driving air cylinder 44 is fixed with the first substrate 41, the frame 1 is provided with a guide groove 11, the first substrate 41 and the second substrate 42 are respectively positioned on two sides of the guide groove 11, a connecting rod 43 penetrates through the guide groove 11, and the first driving air cylinder 44 drives the first substrate 41 and the second substrate 42 to slide on the frame 1.

In order to improve the sliding stability of the first substrate 41 and the second substrate 42 on the frame 1, the frame 1 is provided with first guide rods 45, the two first guide rods 45 are oppositely arranged on the frame 1, the two first guide rods 45 are horizontally fixed on the frame 1, the first substrate 41 is provided with first guide blocks 451, the first guide blocks 451 correspond to the first guide rods 45, one ends of the two first guide blocks 451 are fixed with the first substrate 41, and the other ends of the two first guide blocks 451 are in sliding fit with the corresponding first guide rods 45.

The second base plate 42 is provided with a second bidirectional air cylinder 46, the second bidirectional air cylinder 46 is detachably fixed on the second base plate 42, the second bidirectional air cylinder 46 is provided with a second clamping plate 461, the second clamping plates 461 are oppositely arranged on the second bidirectional air cylinder 46, and the second bidirectional air cylinder 46 drives the second clamping plates 461 to move towards one side close to or far away from each other. When the two second clamping plates 461 are close to each other, the first driving cylinder 44 drives the first substrate 41 and the second substrate 42 to move towards the side close to the first bidirectional cylinder 32, after the second bidirectional cylinder 46 moves to the upper side of the first bidirectional cylinder 32, the lifting cylinder 411 drives the second bidirectional cylinder 46 to move towards the side close to the first bidirectional cylinder 32, then the second bidirectional cylinder 46 drives the two second clamping plates 461 to move towards the side close to each other, the second clamping grooves 462 on the two second clamping plates 461 clamp the jig, and after the second clamping grooves 462 on the second clamping plates 461 clamp the jig, the first clamping plates 321 move towards the side far away from each other under the driving of the first bidirectional cylinder 32, so that the second clamping plates 461 take the jig off the first clamping plates 321.

The rotating device 3 is positioned at one side of the sliding direction of the carrying device 4, and the chip detaching device 5 is positioned at the other side of the sliding direction of the carrying device 4.

The chip removing device 5 includes a second tray 51, and the second tray 51 is horizontally disposed as a whole. The frame 1 is provided with second guide rods 52, two second guide rods 52 are oppositely arranged, the length direction of the two second guide rods 52 is the same as that of the second guide rods 52, the second tray 51 is provided with second guide blocks 521, the second guide blocks 521 correspond to the second guide rods 52, one ends of the second guide blocks 521 are fixed with the tray, and the other ends of the second guide blocks 521 are in sliding fit with the corresponding second guide rods 52.

The second tray 51 is provided with second positioning blocks 511, four second positioning blocks 511 are arranged on the second tray 51 at intervals, and conversion clamps are arranged between the four second positioning blocks 511, and when the jig is used, the second clamping plate 461 places the jig on the conversion clamps of the second tray 51.

The frame 1 is provided with a sliding motor 53, the sliding motor 53 is horizontally erected on the frame 1, the output shaft of the sliding motor 53 is provided with a third screw 531, one end of the third screw 531 is fixed with the output shaft of the sliding motor 53, the third screw 531 is in threaded connection with the second tray 51, the sliding motor 53 drives the third screw 531 to rotate, and the third screw 531 drives the second tray 51 to slide along the length direction of the second guide rod 52.

The chip disassembling device 5 comprises a first ejection cylinder 54 and a second ejection cylinder 55, the first ejection cylinder 54 and the second ejection cylinder 55 are integrally arranged oppositely, piston rods of the first ejection cylinder 54 and the second ejection cylinder 55 face the second tray 51, a pressing head 541 is arranged on the first ejection cylinder 54, a plurality of pressing heads 541 are uniformly arranged on the first ejection cylinder 54 at intervals, a thimble 551 is arranged on the second ejection cylinder 55, and a plurality of thimble 551 are uniformly arranged on the second ejection cylinder 55 at intervals. When the die is used, the first ejection cylinder 54 drives the pressure head 541 to move towards one side close to the jig, the second ejection cylinder 55 drives the ejector pin 551 to move towards one side close to the jig, the pressure head 541 descends, the die is pressed and simultaneously the die is sucked in vacuum, the lower ejector pin 551 penetrates through the conversion jig, the upper jig is ejected upwards, relative movement is generated between the jig and the die, and the die and the jig are separated.

Because the pressure head 541 has corresponding resistance on the pressure head 541 in the process of pressing the chips, in order to ensure that each chip can be taken down from the jig, after the improvement of a designer, the first ejection cylinder 54 is provided with the pressure sensor 56, the pressure sensor 56 judges whether the chip is completely separated from the jig through pressure data, and after the chip is separated from the jig, the pressure head 541 descends through the first ejection cylinder 54 to place the chip on the conversion jig.

The sliding motor 53 drives the conversion fixture on the second tray 51 to move to the side of the empty fixture carrying device 6, the empty fixture carrying device 6 lifts the fixture on the second tray 51, the detection camera 57 is arranged on the rack 1, the detection camera 57 photographs the chip on the mounting and replacing fixture, when the chip is lack on the conversion fixture photographed by the detection camera 57, the second driving motor drives the second tray 51 to move between the pressing head 541 and the injection, the steps of detaching the chip by the pressing head 541 and the ejector pin 551 are repeated, and if the chip is not lack on the conversion fixture photographed by the detection camera 57, the sliding motor 53 drives the second tray 51 to move to one side of the blanking device 7.

The empty jig carrying device 6 comprises a support plate 61, the support plate 61 is slidably arranged on the frame 1, a second driving cylinder 62 and a third bidirectional cylinder 63 are arranged on the support plate 61, the second driving cylinder 62 is arranged on the support plate 61 in an erected mode, the whole second driving cylinder 62 is vertically arranged, the third bidirectional cylinder 63 is fixed on the second driving cylinder 62, a third clamping plate 631 is arranged on the third bidirectional cylinder 63, two opposite clamping plates 631 are arranged on the third bidirectional cylinder 63, a third clamping groove 632 is formed in one side, close to each other, of the two third clamping plates 631, the third bidirectional cylinder 63 drives the third clamping plates 631 to move to one side, close to each other or far away from each other, during use, the support plate 61 drives the second driving cylinder 62 and the third bidirectional cylinder 63 to slide to the upper side of the second pallet 51, the second driving cylinder 62 drives the third bidirectional cylinder 63 to descend to one side, then the third bidirectional cylinder 63 drives the two third clamping plates 631 to move to one side, close to each other, the third clamping grooves 632 in the third clamping plates 631 are oppositely arranged, and then the jig is automatically lifted from the second pallet 631 to the second pallet 51.

The blanking device 7 comprises a turnover motor 71 and a turnover plate 72, wherein the turnover motor 71 is horizontally erected on the frame 1, one end of the turnover plate 72 is fixed with an output shaft of the turnover motor 71, the other end of the turnover plate 72 extends to one side, close to the conveying device 8, of the turnover plate 72 in the horizontal direction, suction heads 73 are arranged on the upper side of the turnover plate 72 in the thickness direction, a plurality of suction heads 73 are uniformly arranged on the turnover plate 72 at intervals, when the blanking device is used, the turnover motor 71 drives the turnover plate 72 to turn to one side of the second tray 51, the suction heads 73 on the turnover plate 72 adsorb chips on the suction heads 73, and then the turnover motor 71 drives the turnover plate 72 to turn to one side, close to the conveying device 8. In order to improve the efficiency of chip tray loading, after the improvement of a designer, a tray robot 74 is arranged on the rack 1, and the tray robot 74 sequentially takes down chips from the suction heads 73 of the turnover tray and places the chips on the conveying device 8.

The transporting device 8 comprises a material storage rack 81 and a conveying belt 82, the material storage rack 81 is arranged on the frame 1, the conveying belt 82 is arranged on one side of the frame 1, which is close to the material storage rack 81, and the process trays are stacked in the material storage rack 81. Be provided with lifting subassembly 83 and conversion subassembly 84 on the storage frame 81, lifting subassembly 83 includes lifting cylinder 831 and fourth screw 832, lifting cylinder 831 is vertical to be erect on frame 1, and lifting cylinder 831's output shaft is towards the upside of vertical direction, fourth screw 832's one end and lifting cylinder 831's output shaft coaxial fixed, the last slip of frame 1 is provided with lifting plate 833, and fourth screw 832 and lifting plate 833 threaded connection, during the use, lifting plate 833 is under lifting cylinder 831 and lifting plate 833's effect, with the processing tray transportation of storage frame 81 bottom to the upside of storage frame 81. The conversion assembly 84 comprises a conversion cylinder 841, the conversion cylinder 841 is located between the storage rack 81 and the conveying belt 82 and slides, the whole conversion cylinder 841 is vertically arranged, a piston rod of the conversion cylinder 841 faces one side close to the storage rack 81, a conversion disc 842 is arranged at one end of the piston rod of the conversion cylinder 841, an air nozzle 843 is arranged on the conversion disc 842, the air nozzle 843 is detachably fixed on the conversion disc 842, when the lifting plate 833 lifts a process tray to the upper side of the storage rack 81, the conversion cylinder 841 slides to the upper side of the storage rack 81, then the conversion cylinder 841 drives the air nozzle 843 to move to one side close to the storage rack 81, the air nozzle 843 on the conversion disc 842 adsorbs the process tray, and finally the process tray moves to the conveying belt 82 under the driving of the conversion cylinder 841.

Wobble plate robot 74 places chips on process trays on conveyor 82.

When the staff packs the chip on the conveyer belt 82, because the staff has certain delay at the in-process of packing, lead to the staff unable timely process tray of taking down on the conveyer belt 82, lead to the staff to need quick packing to the chip, thereby the working strength of staff has been promoted, after the designer improves, stop device 9 includes baffle 91 and actuating cylinder 92, actuating cylinder 92 is provided with two respectively in the both sides of conveyer belt 82, two actuating cylinders 92 are all vertical to be installed on frame 1, and the piston rod of two actuating cylinders 92 all is towards the one side that is close to conveyer belt 82, and baffle 91 is rectangular platy, baffle 91 length direction's both sides are connected with the piston rod of two actuating cylinders 92 respectively, when the staff is at the packing chip, then actuating cylinder 92 drives baffle 91 to be close to the one side of conveyer belt 82, baffle 91 blocks the process tray that is equipped with the chip, after the staff packs, baffle 91 is released the process tray, thereby reduce the working strength of staff.

In order to promote the automatic length that baffle 91 blockked the process tray, be provided with laser receiver 94 and laser emitter 93 on the frame 1, laser that laser emitter 93 sent is received by laser receiver 94, in the in-process of using, the staff can adjust laser receiver 94 and laser emitter 93 according to the actual storage volume that the packing box can, during the use, when the process tray is through laser emitter 93 and laser receiver 94, laser emitter 93 sent laser is blocked, wait after laser emitter 93 sent laser is blocked the prescribed number of times, laser emitter 93 control drive cylinder 92 removes baffle 91 to one side of conveyer belt 82, wait that the staff packing is accomplished the back that drive cylinder 92 redrives baffle 91 and lifts up.

The implementation principle of the high-precision top glue picking and placing equipment after the sputtering process of the semiconductor module chip is as follows: in application, the first driving motor 21 drives the first screw 22 to rotate, the first screw 22 drives the first tray 23 to move along the axial direction of the first screw 22, the lifting motor 33 drives the second screw 331 to rotate, the screw drives the first clamping plates 321 to move towards one side close to the first tray 23, the first bidirectional air cylinders 32 drive the two first clamping plates 321 to move towards one side close to each other, the first clamping grooves 322 on the two first clamping plates 321 are clamped on two sides of the jig, the scanning gun 35 scans the two-dimension code on the jig, the first driving air cylinder 44 drives the first substrate 41 and the second substrate 42 to move towards one side close to the first bidirectional air cylinders 32, when the second bidirectional air cylinders 46 move to the upper side of the first bidirectional air cylinders 32, the lifting air cylinders 411 drive the second bidirectional air cylinders 46 to move towards one side close to the first bidirectional air cylinders 32, the second bidirectional air cylinders 46 drive the two second clamping plates 461 to move towards one side close to each other, the second clamping grooves 462 on the two second clamping plates 461 clamp the jig, when the second clamping grooves 462 on the second clamping plates 461 clamp the jig, the first clamping plate 321 moves to the side far away from each other under the drive of the first bidirectional air cylinder 32, the second clamping plates 461 remove the jig from the first clamping plate 321, the removed jig is placed on the conversion jig of the second tray 51, the first ejection air cylinder 54 drives the press head 541 to move to the side close to the jig, the second ejection air cylinder 55 drives the ejector pins 551 to move to the side close to the jig, the press head 541 descends, the chip is pressed while vacuum sucked, the lower ejector pins 551 pass through the conversion jig, the upper jig is ejected, relative movement is generated between the jig and the chip, the chip and the jig are separated, the pressure sensor 56 judges whether the chip and the jig are completely separated through pressure data, after the chip and the jig are separated, the pressure head 541 descends through the first ejection cylinder 54 to place the chip on the conversion fixture, the detection camera 57 photographs the chip on the mounting and replacing fixture, when the chip on the conversion fixture photographed by the detection camera 57 lacks, the second driving motor drives the second tray 51 to move between the pressure head 541 and the injection, the steps of detaching the chip by the pressure head 541 and the injection needle 551 are repeated, if the chip on the conversion fixture photographed by the detection camera 57 does not lack, the sliding motor 53 drives the second tray 51 to move to one side of the blanking device 7, the support plate 61 drives the second driving cylinder 62 and the third bidirectional cylinder 63 to slide to the upper side of the second tray 51, the second driving cylinder 62 drives the third bidirectional cylinder 63 to descend to one side close to the second tray 51, the third bidirectional cylinder 63 drives the two third clamping plates 631 to move to one side close to each other, the third clamping grooves 632 on the third clamping plates 631 clamp the jig, the jig is taken down from the second tray 51, the turnover motor 71 drives the turnover plate 72 to turn over to one side of the second tray 51, the suction head 73 on the turnover plate 72 adsorbs chips on the suction head 73, then the turnover motor 71 drives the turnover plate 72 to turn over to one side close to the conveying device 8, the tray swinging robot 74 sequentially takes chips off the suction head 73 of the turnover plate, the lifting plate 833 conveys the process tray at the bottom of the storage rack 81 to the upper side of the storage rack 81 under the action of the lifting cylinders 831 and the lifting plate 833, when the lifting plate 833 lifts the process tray to the upper side of the storage rack 81, the switching cylinder 841 slides to the upper side of the storage rack 81, the switching cylinder 843 drives the air nozzle 843 to move to one side close to the storage rack 81, the air nozzle 843 on the switching plate 842 adsorbs the process tray, and finally the process tray moves to the conveying belt 82 under the driving of the switching cylinder 841, the swing tray robot 74 places chips on a process tray of the conveyor 82, when the process tray passes through the laser emitter 93 and the laser receiver 94, laser emitted by the laser emitter 93 is blocked, after the laser emitted by the laser emitter 93 is blocked for a specified number of times, the laser emitter 93 controls the driving cylinder 92 to move the baffle 91 to one side of the conveyor 82, and after the packaging of workers is completed, the driving cylinder 92 drives the baffle 91 to lift again.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. The utility model provides a high accuracy top is glued and is got and put equipment after semiconductor module chip sputtering process, includes frame (1), its characterized in that: the machine frame (1) is sequentially provided with a feeding device (2), a rotating device (3), a carrying device (4), a chip detaching device (5), an empty jig carrying device (6), a discharging device (7) and a conveying device (8);

the feeding device (2) comprises a first tray (23), the first tray (23) is glidingly erected on the frame (1), and a jig with a chip is placed on the first tray (23);

the rotating device (3) is positioned on the upper side of the feeding device (2), and the rotating device (3) grabs the jig on the first tray (23);

the carrying device (4) and the chip disassembling device (5) are both arranged on the frame (1) in a sliding manner, the carrying device (4) transfers the jig on the rotating device (3) to the chip disassembling device (5), and the chip disassembling device (5) disassembles the chip on the jig;

the empty jig carrying device (6) carries the jigs after the chips are removed;

the chip is carried to the conveying device (8) by the blanking device (7), and the chip is conveyed by the conveying device (8).

2. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the feeding device (2) comprises a first driving motor (21) and a first screw rod (22), wherein the first driving motor (21) is erected on the frame (1), the first screw rod (22) is fixed with an output shaft of the first driving motor (21), and the first screw rod (22) is in threaded connection with the first tray (23).

3. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the rotating device (3) comprises a rotating motor (31) and a first bidirectional air cylinder (32), wherein the rotating motor (31) is erected on the frame (1), the first bidirectional air cylinder (32) is fixed on the rotating motor (31), a first clamping plate (321) is arranged on the first bidirectional air cylinder (32), and the first clamping plates (321) are oppositely arranged on the first bidirectional air cylinder (32).

4. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the carrying device (4) comprises a first driving cylinder (44), a lifting cylinder (411) and a second bidirectional cylinder (46), wherein the first driving cylinder (44) drives the lifting cylinder (411) to slide on the frame (1), the lifting cylinder (411) is arranged vertically, the second bidirectional cylinder (46) is fixed on a piston rod of the lifting cylinder (411), a second clamping plate (461) is arranged on the second bidirectional cylinder (46), and the second clamping plates (461) are arranged oppositely on the second bidirectional cylinder (46).

5. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the chip disassembling device (5) comprises a second tray (51) and a sliding motor (53), the sliding motor (53) drives the second tray (51) to slide on the frame (1), a first ejection cylinder (54) and a second ejection cylinder (55) are further arranged on the frame (1), the first ejection cylinder (54) and the second ejection cylinder (55) are oppositely arranged, a pressing head (541) is arranged on the first ejection cylinder (54), and a thimble (551) is arranged on the second ejection cylinder (55).

6. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the empty jig carrying device (6) comprises a third bidirectional air cylinder (63) and a third clamping plate (631), the third bidirectional air cylinder (63) is glidingly erected on the frame (1), and the third clamping plate (631) is oppositely arranged on the third bidirectional air cylinder (63).

7. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: unloader (7) are including upset motor (71), upset motor (71) frame (1) are established on frame (1), just be provided with on the output shaft of upset motor (71) upset board (72), upset board (72) are fixed on the output shaft of upset motor (71), be provided with suction head (73) on upset board (72), suction head (73) on upset board (72) adsorb the chip.

8. The apparatus for picking and placing high precision top glue after sputtering process of semiconductor module chip as defined in claim 1, wherein: the conveying device (8) comprises a material storage frame (81) and a conveying belt (82), wherein the material storage frame (81) and the conveying belt (82) are arranged on the frame (1), a lifting assembly (83) and a conversion assembly (84) are arranged on the material storage frame (81), the lifting assembly (83) slides on the material storage frame (81), and the conversion assembly (84) reciprocates between the material storage frame (81) and the conveying belt (82).