CN220299702U

CN220299702U - PCB extracting device

Info

Publication number: CN220299702U
Application number: CN202321281476.8U
Authority: CN
Inventors: 黄招凤; 陈罡彪; 游燚; 陈学志
Original assignee: Shenzhen Yitian Semiconductor Equipment Co ltd
Current assignee: Shenzhen Yitian Semiconductor Equipment Co ltd
Priority date: 2023-05-24
Filing date: 2023-05-24
Publication date: 2024-01-05
Anticipated expiration: 2033-05-24

Abstract

The utility model belongs to the technical field of semiconductor processing equipment, and particularly relates to a PCB taking device which is arranged on a rack, comprises a Y-direction module arranged on the rack, a Z-direction module movably arranged on the Y-direction module, and a suction assembly arranged on the Z-direction module and used for sucking a workpiece or a workpiece carrier; and the frame is also provided with a workpiece or workpiece carrier transferring carrier assembly. The vacuum chuck of the suction assembly sucks the processed PCB and lifts the processed PCB, at the moment, the work suction platform without carrying the workpiece moves to the lower part of the supporting frame, the pushing block retracts, the unprocessed PCB placed in the supporting frame falls onto the work suction platform, the unprocessed PCB is sent to the processing station by the work suction platform, the processed PCB moves to the point B from the linear module, and the processed PCB is placed in the supporting frame; the processed PCB is taken away by the conveying line, and the supporting frame can receive the unprocessed PCB, namely, feeding; compared with the prior art, no matter loading or unloading is needed to wait for the station for placing the workpiece, thereby being beneficial to improving the processing efficiency.

Description

PCB extracting device

Technical Field

The utility model relates to the technical field of semiconductor processing equipment, in particular to a device for taking and placing a PCB workpiece.

Background

At present, in the process of processing the PCB by using the equipment, a station is shared by PCB feeding and discharging, the structural design is adopted, after the processing of the PCB is completed on the equipment, the finished PCB is placed at the station, after the finished PCB is taken away by a conveying module, the unprocessed PCB can be placed at the station, and then the unprocessed PCB is taken away again, so that the subsequent operation can be carried out, and therefore, the unprocessed PCB is required to be waited, thereby being unfavorable for improving the processing efficiency.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model aims to provide the PCB taking device.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the PCB material taking device is arranged on a rack and comprises a Y-direction module arranged on the rack, a Z-direction module movably arranged on the Y-direction module, and a suction assembly arranged on the Z-direction module and used for sucking a workpiece or a workpiece carrier; the frame is also provided with a workpiece or workpiece carrier transferring carrier assembly; the Y-direction module comprises a linear module fixedly arranged on the frame, a servo motor arranged at one end of the linear module and a movable base movably arranged on the linear module; the Z-direction module comprises a sliding table cylinder fixedly arranged on the back of the movable base, the sliding table cylinder comprises a movable plate, an arm movable plate arranged on the movable plate and a sucker frame fixing plate arranged on the bottom surface of the arm movable plate.

Further, the transferring carrier assembly comprises a first side plate and a second side plate which are fixedly connected with the frame, a supporting frame which is arranged between the bottoms of the first side plate and the second side plate and is fixedly connected with the bottom of the first side plate, and a first optical fiber sensor which is arranged in the upper surface of one side frame of the supporting frame.

The sucker frame fixing plate is perpendicular to the arm moving plate, one end of the sucker frame fixing plate protrudes out of the outer side edge of the arm moving plate, and the other end of the sucker frame fixing plate is located below the linear module.

The suction assembly comprises two sucker fixing frames which are fixedly arranged on the sucker frame fixing plate and are parallel to each other, at least one vacuum sucker arranged on each sucker fixing frame, and a second optical fiber sensor arranged on the sucker frame fixing plate and positioned between the two sucker fixing frames.

One of the sucker fixing frames is arranged on the upper surface of one end of the sucker frame fixing plate, and the sucker fixing frame is positioned on the outer side of the arm movable plate; the other sucker fixing frame is positioned below the linear module; the number of the vacuum chucks arranged on each chuck fixing frame is two.

Two transverse air cylinders are respectively arranged on three side frames of the supporting frame, and a push block which is especially driven and transversely stretches out and draws back is respectively arranged at the front end of each transverse air cylinder; each pushing block extends out of the supporting frame.

The technical effect is that the linear module on the Y-direction module is set with A, B at two positions, when the PCB is processed and transported to the lower part of the point A by the work adsorption platform on the equipment, the processed PCB is adsorbed and lifted by the vacuum chuck of the adsorption assembly, at the moment, the work adsorption platform without carrying the workpiece can move to the lower part of the supporting frame, the push block is retracted, the unprocessed PCB placed in the supporting frame falls onto the work adsorption platform and is sent to the processing station, the processed PCB is moved to the point B by the linear module and is placed in the supporting frame, and the processed PCB is supported by the stretched push block, so that the blanking purpose is achieved; the processed PCB is taken away by the conveying line, and the supporting frame can receive the unprocessed PCB, namely, feeding; compared with the prior art, no matter loading or unloading is needed to wait for the station for placing the workpiece, thereby being beneficial to improving the processing efficiency.

Drawings

FIG. 1 is a perspective view of a reclaimer device in accordance with an embodiment of the present utility model;

FIG. 2 is a front view of a reclaimer device in accordance with an embodiment of the present utility model;

FIG. 3 is a perspective view of the reclaimer device disposed on a frame in accordance with an embodiment of the present utility model;

FIG. 4 is another perspective view of the reclaimer device disposed on a frame according to an embodiment of the present utility model;

FIG. 5 is an exploded view of a reclaimer device in accordance with an embodiment of the present utility model;

fig. 6 is an exploded view of a transfer stage assembly according to an embodiment of the present utility model.

Reference numerals: the device comprises a frame-1, a Y-direction module-2, a linear module-201, a servo motor-202, a movable base-203, a Z-direction module-3, a sliding table cylinder-301, a movable plate-301 a, an arm movable plate-302, a sucker frame fixing plate-303, a sucking component-4, a sucker fixing frame-401, a vacuum sucker-402, a second optical fiber sensor-403, a carrier component-5, a first side plate-501, a second side plate-502, a supporting frame-503, a first optical fiber sensor-504, a workpiece or workpiece carrier-6, a transverse cylinder-7 and a pushing block-8.

Detailed Description

In order to better understand the aspects of the present utility model, the present utility model will be described in further detail with reference to the drawings and embodiments.

As shown in fig. 1-4, an embodiment of the present utility model provides a PCB board material taking device, which is disposed on a frame 1, and includes a Y-direction module 2 disposed on the frame, a Z-direction module 3 movably disposed on the Y-direction module, and a suction assembly 4 disposed on the Z-direction module for sucking a workpiece or a workpiece carrier; for placing the workpiece or workpiece carrier 6, a workpiece or workpiece carrier transfer table assembly 5 is also provided on the frame 1.

In this embodiment, as shown in fig. 5-6, the workpiece or workpiece carrier transferring stage assembly 5 includes a first side plate 501 and a second side plate 502 fixedly connected to the frame 1, a supporting frame 503 disposed between the bottoms of the two and fixedly connected to the two, and a first optical fiber sensor 504 disposed in an upper surface of a side frame of the supporting frame; the first fiber optic sensor is used to detect whether the carrier assembly 5 has a workpiece or workpiece carrier 6.

Two transverse air cylinders 7 are respectively arranged on three side frames of the supporting frame 503, and a push block 8 which is especially driven and transversely stretches out and draws back is respectively arranged at the front end of each transverse air cylinder; each pushing block extends out of the supporting frame. When the unprocessed PCB (i.e. workpiece) or the finished PCB needs to be supported, each pushing block 8 extends out to the supporting frame 503, and when the unprocessed PCB or the finished PCB needs to be put down, each pushing block 8 retracts under the driving of the transverse air cylinder connected with the pushing block, so that the unprocessed PCB or the finished PCB falls down and falls on other modules of the device.

As shown in fig. 5, specifically, here, the Y-direction module 2 includes a linear module 201 fixed on the frame 1, a servo motor 202 disposed at one end of the linear module, and a moving base 203 movably disposed on the linear module; the movable base 203 moves back and forth along the Y direction on the linear module, the linear module 201 is a commercially available standard component, and when in use, the movable base 203 is set to A, B two positions, namely, the movable base 203 stays at A, B two positions in the moving process.

As shown in fig. 1-2 and fig. 5, the Z-direction module 3 includes a sliding table cylinder 301 fixedly disposed on the back of the moving base 203, the sliding table cylinder includes a movable plate 301a, an arm moving plate 302 disposed on the movable plate, a suction cup frame fixing plate 303 disposed on the bottom surface of the arm moving plate, the moving base 203 drives the Z-direction module 3 to move integrally when moving in the Y-direction, and the sliding table cylinder drives the movable plate 301a to reciprocate in the Z-direction when being started, and the arm moving plate 302 moves along with the Z-direction.

As shown in fig. 5, specifically, the suction cup frame fixing plate 303 is perpendicular to the arm moving plate 302, and has one end protruding from the outer edge of the arm moving plate and the other end located below the linear module 201.

During assembly, the suction assembly 4 comprises two sucker fixing frames 401 which are fixedly arranged on the sucker frame fixing plate 303 and are parallel to each other, at least one vacuum sucker 402 which is arranged on each sucker fixing frame, and a second optical fiber sensor 403 which is arranged on the sucker frame fixing plate and is positioned between the two sucker fixing frames, wherein the second optical fiber sensor is used for detecting whether a workpiece or a workpiece carrier exists on the suction assembly 4.

Specifically, one of the suction cup holders 401 is disposed on an upper surface of one end of the suction cup holder fixing plate and is located at an outer side of the arm moving plate 302; the other sucker fixing frame is positioned below the linear module 201; there are two vacuum chucks 402 provided on each chuck holder 401.

The workpiece herein refers to a PCB board and the workpiece carrier refers to a glass plate on which the PCB board is placed.

By adopting the material taking device, the material taking device is matched with other modules on equipment, and the process is as follows:

1. the conveying line of the equipment is used for placing the unprocessed PCB into the supporting frame 503, and the pushing block 8 extends out to hold the processed PCB;

2. then the working adsorption platform of the equipment moves to the lower part of the supporting frame 503, the pushing block 8 is driven by the transverse air cylinder 7 to retract, and the unprocessed PCB falls onto the working adsorption platform and is sent to the processing station;

3. in the processing process, the conveying line puts the unprocessed PCB into the supporting frame 503, and the pushing block 8 extends out to hold the processed PCB;

4. the processed PCB (finished product) is moved to the point A by the working adsorption platform, and is adsorbed and lifted by the vacuum chuck 402 of the adsorption assembly 4;

5. the work adsorption platform without the workpiece moves to the lower part of the supporting frame 503, the pushing block 8 retracts, and the unprocessed PCB falls onto the work adsorption platform and is sent to the processing station;

6. the processed PCB moves from the linear module 201 to the point B, the push block 8 extends out, the processed PCB descends, the broken vacuum is placed in the supporting frame 503, and the processed PCB is supported by the extending push block 8;

7. the processed PCB is taken away by the conveying line and the operation of the process 1 is repeated.

In the above description, it should be noted that the terms "mounted," "connected," and the like should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the two parts can be directly connected or indirectly connected through an intermediate medium, and can be communicated with each other inside the two parts; "disposed" is understood to mean "mounted to, disposed on," and includes mounting means such as fixed mounting, movable mounting, and the like.

It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.

Claims

1. The PCB material taking device is arranged on a frame (1) and is characterized by comprising a Y-direction module (2) arranged on the frame, a Z-direction module (3) movably arranged on the Y-direction module, and a suction assembly (4) arranged on the Z-direction module and used for sucking a workpiece or a workpiece carrier; the machine frame (1) is also provided with a workpiece or workpiece carrier transferring carrier assembly (5); the Y-direction module (2) comprises a linear module (201) fixedly arranged on the frame (1), a servo motor (202) arranged at one end of the linear module, and a movable base (203) movably arranged on the linear module; the Z-direction module (3) comprises a sliding table cylinder (301) fixedly arranged on the back of the movable base (203), the sliding table cylinder comprises a movable plate (301 a), an arm movable plate (302) arranged on the movable plate and a sucker frame fixing plate (303) arranged on the bottom surface of the arm movable plate.

2. A PCB board pick-up device according to claim 1, wherein the workpiece or workpiece carrier transport carrier assembly (5) comprises a first side plate (501) fixedly connected to the frame, a second side plate (502), a support frame (503) arranged between the bottoms of the first side plate and the second side plate and fixedly connected to the bottom of the first side plate, and a first optical fiber sensor (504) arranged in the upper surface of one side frame of the support frame.

3. A PCB extracting apparatus as claimed in claim 1, wherein the suction cup holder fixing plate (303) is perpendicular to the arm moving plate (302) and has one end protruding from an outer edge of the arm moving plate and the other end located below the linear module (201).

4. A PCB board pick-up device according to claim 3, characterized in that the suction assembly (4) comprises two suction cup holders (401) fixed on the suction cup holder fixing plate (303) and parallel to each other, at least one vacuum suction cup (402) provided on each suction cup holder, and a second optical fiber sensor (403) provided on the suction cup holder fixing plate and located between the two suction cup holders.

5. A PCB extracting apparatus as claimed in claim 4, wherein one of the suction cup holders (401) is provided on an upper surface of one end of the suction cup holder fixing plate and the suction cup holder is located at an outer side of the arm moving plate (302); the other sucker fixing frame is positioned below the linear module (201); the number of the vacuum chucks (402) arranged on each chuck fixing frame (401) is two.

6. A PCB extracting device as claimed in claim 2, characterized in that two transverse cylinders (7) are respectively arranged on three side frames of the supporting frame (503), and a push block (8) which is especially driven and stretches transversely is respectively arranged at the front end of each transverse cylinder; each pushing block extends out of the supporting frame.