CN103515273A - Wafer transmission system - Google Patents
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- CN103515273A CN103515273A CN201210300941.8A CN201210300941A CN103515273A CN 103515273 A CN103515273 A CN 103515273A CN 201210300941 A CN201210300941 A CN 201210300941A CN 103515273 A CN103515273 A CN 103515273A
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 40
- 235000012431 wafers Nutrition 0.000 claims abstract description 148
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 230000004807 localization Effects 0.000 claims description 47
- 238000003860 storage Methods 0.000 claims description 24
- 238000007664 blowing Methods 0.000 claims description 22
- 238000007599 discharging Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 29
- 238000006073 displacement reaction Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 5
- 238000004643 material aging Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer transmission system which is suitable for transmitting a plurality of wafers from a wafer box. The wafer transmission system comprises a positioning jig, a feeding mechanism, a bearing unit and a taking and placing unit. The positioning fixture is provided with a plurality of accommodating grooves corresponding to the wafers, and the feeding mechanism is suitable for loading the wafers in the wafer box into the accommodating grooves of the positioning fixture along a first direction on a plane. The bearing unit comprises a rotating disk, and a plurality of bearing parts are arranged on the rotating disk. The rotating disc is suitable for rotating along an axial direction vertical to the plane, so that the bearing parts sequentially pass through a discharging position, and projections of the discharging position and the positioning jig on the plane are arranged along a first direction. The picking and placing unit is used for respectively and sequentially transmitting the wafers in the positioning jig to the bearing part positioned at the picking and placing position.
Description
Technical field
The present invention relates to a kind of wafer transmission system.
Background technology
Along with amassing into of the semiconductor element of the integrated circuit benefit of subsisting increases, the accuracy of manufacture craft and production efficiency are relatively important.In semiconductor fabrication process, there is mistake slightly, just may cause manufacture craft failure, cause the damage of wafer, thereby expend great amount of cost.
Yet the structure of known wafer transmission system and motion mode very complex, must be by comprising that the mechanical arm of rod member and bearing etc. is rotated, extends and the action such as retraction, with by wafer transmission to location, therefore cause production efficiency limited.Yet, after the frequent use of mechanical arm, tend to cause material aging, abrasion or even the distortion of actuated element, and cause the generation of material granule and dust to drop, become pollutant sources.At mechanical arm, transmit in the process of wafer, these particles that drop conventionally can produce defect (defect) or cause surperficial scratch or the situation such as fragmentation even on wafer along with the flow direction of manufacture craft gas.
In addition; wafer transmission system is after long-term use, and the material aging of above-mentioned actuated element, abrasion are more beneficial serious, thereby just must shut down element aging to change, abrasion after the time of one section of board running; cause the waste of time and cost, affect manufacture craft productive rate.
Summary of the invention
The object of the present invention is to provide a kind of wafer transmission system, its structure and motion mode are simple, and can transmit fast materials and parts, thereby can significantly extend useful life of actuated element, prevent material aging, abrasion, contribute to reduce costs, promote production capacity (throughput).
Another object of the present invention is to provide a kind of wafer transmission system, can be by pan feeding step and follow-up classification or other manufacturing process steps automations, with the cost of saving time.
For reaching above-mentioned purpose, the present invention proposes a kind of wafer transmission system, is suitable for transmission from a plurality of wafers of a wafer cassette (cassette).Described wafer transmission system comprises localization tool (locating jig), feeding mechanism (feeding mechanism), load bearing unit and picking and placing unit (unload/load unit).Localization tool has a plurality of storage tanks corresponding to described wafer, and feeding mechanism is suitable for along the first direction in a plane, the described a plurality of wafers in wafer cassette being written into simultaneously the described storage tank of localization tool.Load bearing unit comprises a rotating disk (rotary table), is provided with a plurality of supporting parts on rotating disk.Rotating disk is suitable for the axial rotation along vertical plane, makes described a plurality of supporting part sequentially by a blowing position (load position), and wherein the projection in the plane of blowing position and localization tool is arranged along first direction.Picking and placing unit is in order to be sent to respectively and in order by the wafer in localization tool the supporting part that is positioned at blowing position.
In one embodiment of this invention, described wafer cassette is suitable for moving along the second direction in plane, and second direction is in fact perpendicular to first direction.
In one embodiment of this invention, the wafer in wafer cassette is mutually stacked along a third direction of vertical plane, and third direction is perpendicular to aforementioned second direction.Correspondingly, the storage tank of localization tool can be arranged along third direction, and each storage tank has one first relative opening and one second opening in a first direction.Each wafer is suitable for entering storage tank by the first opening, and is suitable for leaving storage tank by the second opening.
In one embodiment of this invention, described picking and placing unit is suitable for carrying corresponding wafer and along described first direction, moves to the top of blowing position, and along described third direction, wafer is positioned on the supporting part of blowing position.
In one embodiment of this invention, described rotating disk is circular or symmetrical polygon.
In one embodiment of this invention, the bottom hollow out of described localization tool, and the bottom hollow out of described a plurality of supporting parts of rotating disk.Picking and placing unit is positioned at the below of localization tool and rotating disk, to pick and place wafer via described a plurality of hollow parts.
In one embodiment of this invention, picking and placing unit comprises a mechanical arm and a vacuum slot module.Described vacuum slot module is positioned at one end of mechanical arm, in order to draw wafer.
In one embodiment of this invention, be arranged on rotating disk described a plurality of supporting parts etc. minute.
Accompanying drawing explanation
Fig. 1 is a kind of wafer transmission system of one embodiment of the invention;
Fig. 2 is the partial enlarged drawing of the wafer transmission system of Fig. 1;
Fig. 3 A ~ Fig. 3 D is the illustrative view according to the wafer transmission system of one embodiment of the invention;
Fig. 4 is the top view of the load bearing unit of another embodiment of the present invention;
Fig. 5 is the enlarged drawing of the laser displacement sensor of Fig. 1.
Main element symbol description
100: wafer transmission system
102: wafer
110: feeding mechanism
112: pneumatic cylinder
114: connecting rod
114a: jacking block
120: localization tool
122: storage tank
122a: the first opening of storage tank
122b: the second opening of storage tank
130: load bearing unit
130a: the supporting part of load bearing unit
140: picking and placing unit
142: mechanical arm
144: vacuum slot module
160: mechanical arm
170: laser displacement sensor
172: fixed jig
172a: the fluting of fixed jig
180: wafer cassette
190: conveyer belt
230: load bearing unit
230a, 230b: supporting part
P1: pan feeding position
S1: blowing position
S2, S3: position
X, Y, Z: direction
A: rotating shaft
D1: direction of rotation
Embodiment
The accompanying drawing of arranging in pairs or groups by the following examples illustrates the enforcement aspect that wafer transmission system of the present invention is possible.
Fig. 1 illustrates a kind of wafer transmission system 100 according to one embodiment of the invention.Fig. 2 is the partial enlarged drawing of wafer transmission system 100 for this reason.The wafer transmission system 100 of the present embodiment comprises feeding mechanism 110, localization tool 120, load bearing unit 130 and picking and placing unit 140.The enlarged drawing of Fig. 2 has omitted load bearing unit 130, to know the picking and placing unit 140 that represents to be positioned at load bearing unit 130 belows.
The wafer transmission system 100 of the present embodiment can be applicable in semiconductor fabrication process, in order at each manufacture craft reacting chamber space transferring wafer 102.Conventionally, wafer 102 is stored in wafer cassette 180, and by wafer transmission system 100, wafer 102 is taken out from wafer cassette 180, to carry out manufacture craft in manufacture craft reative cell.After manufacture craft completes, more predetermined carrying out in another manufacture craft reative cell of follow-up manufacturing process steps fetched and be sent to wafer 102; Or, after manufacture craft finishes, wafer 102 is sent back in wafer cassette 180, to complete a series of manufacturing process steps.
As shown in Figure 1, a plurality of wafer cassette 180 are carried respectively the wafer 102 of different batches, and are transferred with 190 and are sequentially sent to the pan feeding position P1 between feeding mechanism 110 and localization tool 120 along the Y-direction on X-Y plane.Conventionally, wafer 102 is to be stored in wafer cassette 180 with overlapped way.Please, simultaneously referring to Fig. 3 A ~ 3D, corresponding to the setting of wafer cassette 180, in localization tool 120, be provided with a plurality of storage tanks 122 that can hold with a collection of wafer 102.For example, the wafer 102 of the present embodiment is to be laminated in wafer cassette 180 along Z direction, and the storage tank 122 of localization tool 120 is also to arrange along Z direction.
In addition, each storage tank 122 has the first relative opening 122a and the second opening 122b on directions X.Feeding mechanism 110 is suitable for along directions X, the wafer 102 that is positioned at the wafer cassette 180 of pan feeding position P1 being written into simultaneously the storage tank 122 of localization tool 120.Particularly, the feeding mechanism 110 of the present embodiment and localization tool 120 lay respectively at the relative both sides of wafer cassette 180.Feeding mechanism 110 comprises pneumatic cylinder 112 and the connecting rod 114 that connects pneumatic cylinder 112, wherein pneumatic cylinder 112 is suitable for drive link 114 and moves along directions X, and the jacking block 114a that is positioned at connecting rod 114 front ends is suitable for the simultaneously wafer 102 of ejection wafer cassette 180, make all wafers 102 in wafer cassette 180 along directions X, by the first opening 122a of each storage tank 122, enter localization tool 120 respectively.At this, even if wafer 102 is subjected to displacement or misplaces while being transferred in wafer cassette 180, still can pass through the ejection of jacking block 114a and the location of localization tool 120, wafer 102 is fitly arranged in localization tool 120, in order to the carrying out of follow-up manufacturing process steps.
After wafer 102 is written into the storage tank 122 of localization tool 120, can the wafer in localization tool 120 102 be taken out and classify or other manufacturing process steps by load bearing unit 130 and picking and placing unit 140.The load bearing unit 130 of the present embodiment is for example rotating disk (rotary table), and it is suitable for rotating along the rotating shaft A of vertical X-Y plane, so that a plurality of supporting part 130a of rotation to be mutually provided.Described a plurality of supporting part 130a is arranged on load bearing unit 130, and sequentially passes through blowing position S1 along with load bearing unit 130 rotations.Thus, can form the supporting part 130a of mutual rotation, and can the wafer in localization tool 120 102 be sent to respectively and in order by picking and placing unit 140 to the supporting part 130a that is positioned at blowing position S1.
Please be simultaneously referring to Fig. 3 A ~ Fig. 3 D, blowing position S1 and the projection of localization tool 120 on X-Y plane are arranged along directions X, and picking and placing unit 140 has two freedoms of motion of directions X and Z direction, be with all wafers 102 in wafer cassette 180 respectively after directions X is written into localization tool 120, picking and placing unit 140 can the second opening 122b by storage tank 122 take out wafer 102, and wafer 102 is sent to the supporting part 130a of load bearing unit 130 along directions X and Z direction.
On the other hand, in order to facilitate picking and placing unit 140 operations, the bottom of the bottom of the localization tool 120 of the present embodiment and the supporting part 130a of load bearing unit 130 is hollow out.So, be positioned at localization tool 120 and can pick and place wafer 102 via aforementioned hollow part with the picking and placing unit 140 of load bearing unit 130 belows.Picking and placing unit 140 is for example the mechanical arm 142 that end is provided with vacuum slot module 144, and vacuum slot module 144 is in order to draw wafer 102, and by mechanical arm 142, is taken to the supporting part 130a of load bearing unit 130.
The illustrative view of the wafer transmission system 100 of the present embodiment as shown in Fig. 3 A ~ Fig. 3 D, first the wafer cassette 180 of bearing wafer 102 is sent to the pan feeding position P1 shown in Fig. 3 A, and then feeding mechanism 110 is written into localization tool 120 by the wafer in wafer cassette 180 102 by the first opening 122a of storage tank 122 along directions X.Then, feeding mechanism 110 can be return original position.Afterwards, as shown in Figure 3 C, picking and placing unit 140 is up moved along Z direction by the below of localization tool 120, to draw wafer 102 by vacuum slot module 144.Again as shown in Figure 3 D, by picking and placing unit 140, drive wafer 102 to move along directions X, make wafer 102 leave localization tool 120 by the second opening 122b of storage tank 122.When wafer 102 moves to the supporting part 130a top of load bearing unit 130, then picking and placing unit 140 is moved down along Z direction, so that wafer 102 is positioned on the supporting part 130a that is positioned at blowing position S1.
In other words, the present embodiment by pan feeding position P1, localization tool 120 and blowing position S1 along directions X setting, wherein by the feeding mechanism 110 along directions X start, reach wafer cassette 180 and 102 transmission of the wafer between localization tool 120 on the P1 of pan feeding position, and reach wafer 102 transmission between localization tool 120 and load bearing unit 130 by thering is the picking and placing unit 140 of the freedom of motion of directions X and Z direction.
In the present embodiment, localization tool 120 not only can position the wafer 102 in wafer cassette 180, also can be used as the buffering area that wafer 102 is written into.That is, carrying out aforementioned step as shown in Fig. 3 C and 3D, when the wafer in localization tool 120 102 sequentially being taken out and being sent to by picking and placing unit 140 load bearing unit 130, another wafer cassette 180 of carrying next group wafer 102 can be moved to the other preparation of localization tool 120.Last wafer 102 in localization tool 120 is removed and is sent in the process of load bearing unit 130, can carry out the step shown in Fig. 3 A and Fig. 3 B simultaneously, by feeding mechanism 110, next group wafer 102 is written into localization tool 120.So, load bearing unit 130 is after completing the step shown in Fig. 3 D, localization tool 120 still has wafer 102, makes the steps such as pan feeding, feeding, blowing be able to automation incessantly and implements, and can significantly promote manufacture craft efficiency (processing efficiency).
In addition, the form of the load bearing unit 130 of the present embodiment is not limited to rotating disk.The design of the supporting part 130a that continues rotation can be provided such as, all can be used as the load bearing unit 130 of the present embodiment.In addition, the shape of rotating disk is not limited yet, and the rotating disk of the shape such as circular or symmetrical polygon all can reach similar effect such as.
As shown in Figure 1, the load bearing unit 130 of the present embodiment for example has three supporting part 130a, can correspond respectively to blowing position S1 and other Liang Ge position S2 and S3.Position S2 for example can be set to wafer 102 detect or the Zhan Bie，Er position S3 of other manufacturing process steps other as the station of discharging.Load bearing unit 130 D1 rotation in the counterclockwise direction.When a supporting part 130a is after blowing position S1 obtains wafer 102, can be along with load bearing unit 130 moves to position S2, by for example laser displacement sensor 170, wafer 102 is detected, or can to wafer 102, carry out other manufacturing process steps by other devices.
More specifically; the action of pan feeding carrying can not carried out in the aforementioned station corresponding to position S1; corresponding to the station of position S2, can not carry out for example thickness detection, uniformity detection, particulate or dust detecting, visual inspection (color, light transmittance, scratch ...), electrical functionality test, laser preparing (repairing scratch defect), clean, sentence again ... wait action, and can not carry out discharging transmission or the action such as sentence again corresponding to the station of position S3.
Certainly, load bearing unit of the present invention is not limited to only have three supporting parts.For example, supporting part can increase to more than four, and now the corresponding station increasing not can be and carries out one of not performed action in the station of aforementioned location S2.
In addition, although three supporting part 130a of previous embodiment etc. minutes be arranged on load bearing unit (rotating disk) 130.In other words, the angle theta 1 of the line at wantonly two adjacent supporting part 130a and load bearing unit 130 centers is about 120 degree.Yet the present invention does not limit the setting position of supporting part on load bearing unit.For example, supporting part does not need to wait to divide and is arranged on load bearing unit.Fig. 4 is the top view of the load bearing unit 230 of another embodiment of the present invention.Load bearing unit 230 is for example a rotating disk, has supporting part 230a and 230b on it, and the angle theta 2 of the line at supporting part 230a, 230b and load bearing unit 230 centers is about 90 degree.
Fig. 5 is the enlarged drawing of the laser displacement sensor 170 of Fig. 1.As shown in Fig. 1 and Fig. 5, laser displacement sensor 170 is to be for example fixed on position S2 by fixed jig 172, and fixed jig 172 has fluting 172a, make load bearing unit 130 can drive wafer 102 to enter fluting 172a, to judge the evenness of wafer 102 by laser displacement sensor 170.
After wafer 102 position S2 completes detection or other manufacturing process steps, load bearing unit 130 can continue to drive wafer 102 in-position S3, and wafer 102 is classified, wafer 102 is sent to predetermined another manufacture craft reative cell that carries out follow-up manufacturing process steps by mechanical arm 160 or other conveying devices.
Certainly, the quantity of the supporting part 130a of load bearing unit 130 is not limited to three shown in the present embodiment, and it is determined by demand, respectively wafer 102 is carried out to different processing.For example, the quantity of supporting part 130a can be increased to four, and the station of setting up afterwards checking in the station of discharging other (position S3) is other, in order to judgement by this checking station other supporting part 130a headroom whether, while avoiding returning blowing position S1 because supporting part 130a has still retained wafer 102, cause manufacture craft mistake.
In sum, wafer transmission system of the present invention by actuated element framework in same direction, avoid complicated organization distribution and can simplify the transmission action of wafer, therefore can transmit fast wafer, contribute to accelerate the carrying out of the automation steps such as pan feeding, feeding, blowing, the cost of saving time; In addition, also can significantly extend the useful life of actuated element, prevent material aging, abrasion, contribute to reduce costs, promote manufacture craft productive rate.Moreover localization tool can position the wafer in wafer cassette, and can be used as the buffering area that wafer is written into.When picking and placing unit sequentially takes out the wafer in localization tool, just the wafer cassette of carrying next group wafer can be moved to the other preparation of localization tool, therefore make the steps such as pan feeding, feeding, blowing be able to automation incessantly and implement, significantly to promote manufacture craft efficiency.
Although invention has disclosed the present invention in conjunction with above embodiment; yet it is not in order to limit the present invention; under any, in technical field, be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, therefore being as the criterion of should being defined with the invention claim of enclosing of protection scope of the present invention.
Claims (9)
1. a wafer transmission system, it is suitable for transmission from a plurality of wafers of a wafer cassette, and this wafer transmission system comprises:
Localization tool, has a plurality of storage tanks corresponding to those wafers;
Feeding mechanism, is suitable for along the first direction in a plane, those wafers in this wafer cassette being written into simultaneously those storage tanks of this localization tool;
Load bearing unit, comprise rotating disk, on this rotating disk, be provided with a plurality of supporting parts, and this rotating disk is suitable for along an axial rotation of vertical this plane, make those supporting parts sequentially by a blowing position, this blowing position and the projection of this localization tool in this plane are arranged along this first direction; And
Picking and placing unit, in order to be sent to those wafers in this localization tool respectively and in order those supporting parts that are positioned at this blowing position.
2. wafer transmission system as claimed in claim 1, wherein this wafer cassette is suitable for moving along the second direction in this plane, and this second direction is in fact perpendicular to this first direction.
3. wafer transmission system as claimed in claim 2, wherein those wafers in this wafer cassette are mutually stacked along a third direction of vertical this plane, and this third direction is perpendicular to this second direction.
4. wafer transmission system as claimed in claim 3, wherein those storage tanks of this localization tool are arranged along this third direction, and respectively this storage tank has the first relative opening and the second opening on this first direction, respectively this wafer is suitable for entering this storage tank by this first opening, and is suitable for leaving this storage tank by this second opening.
5. wafer transmission system as claimed in claim 3, wherein this picking and placing unit is suitable for corresponding this wafer of carrying and along this first direction, moves to the top of this blowing position, and along this third direction, this wafer is positioned on this supporting part of this blowing position.
6. the wafer transmission system as described in invention claim 1, wherein this rotating disk is circular or symmetrical polygon.
7. wafer transmission system as claimed in claim 1, the bottom hollow out of this localization tool wherein, the bottom hollow out of those supporting parts of this rotating disk, and this picking and placing unit is positioned at the below of this localization tool and this rotating disk, to pick and place those wafers via those hollow parts.
8. wafer transmission system as claimed in claim 1, wherein this picking and placing unit comprises mechanical arm and vacuum slot module, this vacuum slot module is positioned at one end of this mechanical arm, in order to draw those wafers.
9. wafer transmission system as claimed in claim 1 is wherein arranged on this rotating disk those supporting parts etc. minute.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101121912 | 2012-06-19 | ||
| TW101121912A TWI465380B (en) | 2012-06-19 | 2012-06-19 | Wafer transfer system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103515273A true CN103515273A (en) | 2014-01-15 |
| CN103515273B CN103515273B (en) | 2016-12-07 |
Family
ID=49897779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210300941.8A Expired - Fee Related CN103515273B (en) | 2012-06-19 | 2012-08-22 | Wafer transmission system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103515273B (en) |
| TW (1) | TWI465380B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600015A (en) * | 2015-02-11 | 2015-05-06 | 北京中电科电子装备有限公司 | Chip conveying device |
| CN107803647A (en) * | 2017-11-23 | 2018-03-16 | 东莞市铁生辉制罐有限公司 | A kind of lid automatic assembling |
| CN108695220A (en) * | 2018-05-22 | 2018-10-23 | 北京锐洁机器人科技有限公司 | A kind of multifunctional efficient rewinder |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6303556B2 (en) * | 2014-02-05 | 2018-04-04 | 東京エレクトロン株式会社 | Substrate transport mechanism position detection method, storage medium, and substrate transport mechanism position detection device |
| TWI628133B (en) * | 2017-11-03 | 2018-07-01 | 東台精機股份有限公司 | Bidirectional carrying vehicle |
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| JPS5638468A (en) * | 1979-09-06 | 1981-04-13 | Dainippon Screen Mfg Co Ltd | Loading equipment of wafer |
| JPS59117230A (en) * | 1982-12-24 | 1984-07-06 | Hitachi Electronics Eng Co Ltd | Parts transfer device |
| US5951770A (en) * | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
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2012
- 2012-06-19 TW TW101121912A patent/TWI465380B/en not_active IP Right Cessation
- 2012-08-22 CN CN201210300941.8A patent/CN103515273B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
| CN1611429A (en) * | 2003-10-28 | 2005-05-04 | 显示器生产服务株式会社 | System and method for conveying flat panel display |
| TWM360446U (en) * | 2009-01-22 | 2009-07-01 | Chroma Ate Inc | Solar wafer transferring device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600015A (en) * | 2015-02-11 | 2015-05-06 | 北京中电科电子装备有限公司 | Chip conveying device |
| CN104600015B (en) * | 2015-02-11 | 2018-01-02 | 北京中电科电子装备有限公司 | A kind of chip transmitting device |
| CN107803647A (en) * | 2017-11-23 | 2018-03-16 | 东莞市铁生辉制罐有限公司 | A kind of lid automatic assembling |
| CN107803647B (en) * | 2017-11-23 | 2024-03-15 | 东莞市铁生辉制罐有限公司 | Automatic lid assembling machine |
| CN108695220A (en) * | 2018-05-22 | 2018-10-23 | 北京锐洁机器人科技有限公司 | A kind of multifunctional efficient rewinder |
| CN108695220B (en) * | 2018-05-22 | 2020-09-29 | 北京锐洁机器人科技有限公司 | Multifunctional efficient sheet rewinding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103515273B (en) | 2016-12-07 |
| TWI465380B (en) | 2014-12-21 |
| TW201400392A (en) | 2014-01-01 |
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