CN213794933U - High-precision positioning device for chip welding - Google Patents
High-precision positioning device for chip welding Download PDFInfo
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- CN213794933U CN213794933U CN202022396727.XU CN202022396727U CN213794933U CN 213794933 U CN213794933 U CN 213794933U CN 202022396727 U CN202022396727 U CN 202022396727U CN 213794933 U CN213794933 U CN 213794933U
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- 238000003466 welding Methods 0.000 title abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000005070 sampling Methods 0.000 claims abstract description 5
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 7
- 238000005245 sintering Methods 0.000 abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The application provides a high accuracy positioner for chip bonding, wherein, the device includes: a mobile device and a positioning assembly; the moving device is used for driving the positioning assembly to move; the positioning assembly comprises an image acquisition device and a pick-and-place device; the image acquisition device is used for sampling the position of the material, and the taking and placing device is used for taking and placing the material. The method and the device can improve the sintering precision, and avoid collision and offset generated in the positioning process and displacement of the position of the chip in the welding process.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a high-precision positioning device for chip welding.
Background
At present, because the manufacturing cost of the chip is higher, the chip sintering effect directly influences the qualified rate of chip production in the chip sintering process.
The existing high-precision positioning device for chip welding mostly utilizes a suction nozzle to adsorb a chip and a heat sink in a material box, the chip is directly attached to the heat sink in a welding material area for sintering, the pressing speed and the pressing height of the suction nozzle are not considered in the process, so that the suction nozzle generates collision deviation with the chip and the heat sink in the high-speed pressing process, and the chip is shifted in the welding process, so that the sintering precision is reduced.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application aims to provide a high-precision positioning device for die bonding to improve the sintering precision.
The embodiment of the application provides a high accuracy positioner for chip bonding, includes: a mobile device and a positioning assembly;
the moving device is used for driving the positioning assembly to move;
the positioning assembly comprises an image acquisition device, a taking and placing device and a positioning sensor;
the image acquisition device is used for sampling the position of the material, and the taking and placing device is used for taking and placing the material.
In an alternative embodiment, the positioning assembly further comprises: a positioning sensor;
the positioning sensor is arranged on the positioning assembly and used for detecting the relative position between the positioning assembly and the material.
In an alternative embodiment, the positioning sensor is a laser ranging sensor.
In an alternative embodiment, the image capture device comprises: a first camera and a second camera.
In an alternative embodiment, the taking and placing device is a vacuum adsorption structure or a negative pressure adsorption structure.
In an alternative embodiment, the pick-and-place device comprises: a first suction nozzle and a second suction nozzle.
In an alternative embodiment, the positioning assemblies are at least two sets; two sets of locating component symmetry sets up.
In an alternative embodiment, the image capture device is a camera; the image acquisition device comprises a first camera and a second camera.
In an alternative embodiment, the mobile device comprises: the first moving assembly moves along the X axis, the second moving assembly moves along the Y axis and the third moving assembly moves along the Z axis;
the first moving assembly and the second moving assembly are respectively provided with a main structural part, a high-precision linear motion guide rail, a linear motor, a high-precision grating ruler, a mechanical limiting buffer and a cable installation drag chain assembly.
In an alternative embodiment, the number of the third moving assemblies is two.
The embodiment of the application provides a high accuracy positioner for chip bonding includes: a mobile device and a positioning assembly; the moving device is used for driving the positioning assembly to move; the positioning assembly comprises an image acquisition device and a pick-and-place device; the image acquisition device is used for sampling the position of the material, and the taking and placing device is used for taking and placing the material. The scheme of this application embodiment can realize placing the chip accurately, can avoid because the suction nozzle produces the drift error when absorbing the material, can reach the accurate positioning of welding set and chip, improves the sintering precision.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic structural diagram illustrating a high-precision positioning apparatus for die bonding according to an embodiment of the present disclosure;
fig. 2 shows a schematic structural diagram of two third moving assemblies provided in the embodiment of the present application;
fig. 3 shows a schematic structural diagram of a third moving assembly provided in an embodiment of the present application.
Icon: 23-a first moving assembly; 24-a second moving assembly; 25-a third moving assembly; 26-a positioning assembly; 27-a first camera; 28-a second camera; 29-a second suction nozzle; 30-a positioning sensor; 31-first suction nozzle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the present application further provides a high-precision positioning device for die bonding, and some embodiments of the present application are described in detail below with reference to fig. 1 to 3.
A high accuracy positioner for chip bonding includes: a mobile device and positioning assembly 26;
the moving device is used for driving the positioning component 26 to move;
the positioning assembly 26 comprises an image acquisition device, a pick-and-place device and a positioning sensor 30;
the image acquisition device is used for sampling the position of the material, and the taking and placing device is used for taking and placing the material.
In an alternative embodiment, the positioning assemblies 26 are at least two sets, and the two sets of positioning assemblies 26 are symmetrically arranged.
In an alternative embodiment, a positioning sensor 30 is provided on the positioning assembly 26, the positioning sensor 30 being used to detect the relative position between the positioning assembly 26 and the material; specifically, in this embodiment, the adsorption structure is a vacuum adsorption or negative pressure adsorption structure, and can realize adsorption and placement of the chip and the heat sink through negative pressure.
In alternative embodiments, the positioning sensor 30 is a distance sensor, or a laser ranging sensor.
In alternative embodiments, the pick-and-place device may be an absorption structure, but it is not limited to the absorption structure, and it may also be another structure, such as a robot, etc., as long as it can pick and place the chip and the heat sink.
In an alternative embodiment, the pick-and-place device comprises in particular a first suction nozzle 31 and a second suction nozzle 29.
In an alternative embodiment, the image capturing device is a camera, and may specifically include a first camera 27, a second camera 28, and a bottom camera; in this embodiment, the camera multiples in two sets of locating component 26 are different, and when using, use the low power camera earlier and carry out preliminary location, use the high power camera again to carry out the accurate positioning, and then guarantee the accuracy of location.
In an alternative embodiment, the moving device is an XYZ triaxial assembly, comprising: the first moving assembly 23 moving along the X axis, the second moving assembly 24 moving along the Y axis and the third moving assembly 25 moving along the Z axis are arranged on the first moving assembly 23 and the second moving assembly 24, and a main body structural member, a high-precision linear motion guide rail, a linear motor, a high-precision grating ruler, a mechanical limiting buffer and a cable installation drag chain assembly are arranged on the first moving assembly 23 and the second moving assembly 24.
In an alternative embodiment, there are two third moving assemblies 25, each connected to one positioning assembly 26, wherein one third moving assembly 25 includes: the device comprises a high-precision motion module, a coaxial white light source, an annular red light source, a laser displacement sensor, a material rotating device, a high-precision zero switch and a photoelectric limit switch. The positioning assembly 26 is disposed on the high precision motion module.
In an alternative embodiment, the third moving assembly 25 includes a high-precision moving module, a coaxial white light source, an annular red light source, a laser displacement sensor, a high-precision piezoelectric ceramic rotating device for materials, a chip pressure adjusting assembly, a chip down-pressing motion guide, a limit assembly, a high-precision zero switch, and a photoelectric limit switch.
In an alternative embodiment, a bottom calibration camera is provided below the third moving assembly 25, the bottom calibration camera comprising a double camera assembly, a coaxial white light source, a large annular white light source.
According to the high-precision positioning device for chip welding, each moving assembly of an XY axis of the device adopts a high-precision linear guide rail + a linear motor + a Renyshao high-precision grating ruler, a Z axis assembly adopts a high-precision linear guide rail module + a servo motor to transmit, and a control system adopts an eight-axis high-precision control card to ensure the motion precision.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the present invention. Are all covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A high accuracy positioning device for die bonding, comprising: a mobile device and a positioning assembly;
the moving device is used for driving the positioning assembly to move;
the positioning assembly comprises an image acquisition device and a pick-and-place device;
the image acquisition device is used for sampling the position of the material, and the taking and placing device is used for taking and placing the material.
2. A high precision positioning device for die bonding according to claim 1 wherein the positioning assembly further comprises: a positioning sensor;
the positioning sensor is arranged on the positioning assembly and used for detecting the relative position between the positioning assembly and the material.
3. A high precision positioning device for chip bonding according to claim 2, wherein the positioning sensor is a laser ranging sensor.
4. The high precision positioning device for chip bonding according to claim 1, wherein the image capturing device comprises: a first camera and a second camera.
5. The high-precision positioning device for chip bonding according to claim 1, wherein the pick-and-place device is a vacuum adsorption structure or a negative pressure adsorption structure.
6. The high precision positioning device for chip bonding according to claim 1, wherein the pick-and-place device comprises: a first suction nozzle and a second suction nozzle.
7. The high-precision positioning device for chip bonding according to claim 1, wherein the positioning components are at least two groups; two sets of locating component symmetry sets up.
8. The high-precision positioning device for chip bonding according to claim 1, wherein the image acquisition device is a camera; the image acquisition device comprises a first camera and a second camera.
9. A high precision positioning device for chip bonding according to claim 1, wherein the moving device comprises: the first moving assembly moves along the X axis, the second moving assembly moves along the Y axis and the third moving assembly moves along the Z axis;
the first moving assembly and the second moving assembly are respectively provided with a main structural part, a high-precision linear motion guide rail, a linear motor, a high-precision grating ruler, a mechanical limiting buffer and a cable installation drag chain assembly.
10. The high precision positioning device for die bonding according to claim 9, wherein the number of the third moving assemblies is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396727.XU CN213794933U (en) | 2020-10-23 | 2020-10-23 | High-precision positioning device for chip welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022396727.XU CN213794933U (en) | 2020-10-23 | 2020-10-23 | High-precision positioning device for chip welding |
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| CN213794933U true CN213794933U (en) | 2021-07-27 |
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| CN202022396727.XU Active CN213794933U (en) | 2020-10-23 | 2020-10-23 | High-precision positioning device for chip welding |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259458A (en) * | 2020-10-23 | 2021-01-22 | 浙江热刺激光技术有限公司 | Chip sintering method and device, electronic equipment and readable storage medium |
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2020
- 2020-10-23 CN CN202022396727.XU patent/CN213794933U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259458A (en) * | 2020-10-23 | 2021-01-22 | 浙江热刺激光技术有限公司 | Chip sintering method and device, electronic equipment and readable storage medium |
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| GR01 | Patent grant | ||
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-precision positioning device for chip soldering Granted publication date: 20210727 Pledgee: Zhejiang Wenling Rural Commercial Bank Co.,Ltd. Pledgor: Zhejiang Thermal Stimulation Optical Technology Co.,Ltd. Registration number: Y2024330000001 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |