TW201708830A - Electronic component testing classifier consisting of a material supply device, a temperature control device, a conveying device, a test device and a central control device - Google Patents

Electronic component testing classifier consisting of a material supply device, a temperature control device, a conveying device, a test device and a central control device Download PDF

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TW201708830A
TW201708830A TW104128365A TW104128365A TW201708830A TW 201708830 A TW201708830 A TW 201708830A TW 104128365 A TW104128365 A TW 104128365A TW 104128365 A TW104128365 A TW 104128365A TW 201708830 A TW201708830 A TW 201708830A
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Taiwan
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electronic component
receiving
zone
tray
feeding
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TW104128365A
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Chinese (zh)
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TWI576598B (en
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Yong-Hong Chen
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Hon Tech Inc
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Abstract

Provided is an electronic component testing classifier, which has a platform equipped with a material supply device, a temperature control device, a conveying device, a test device and a central control device, wherein the machine is at least provided with one preheating zone. The material supply device is equipped with a material supply plate portion outside of the preheating zone for accepting the material supply plate, and is provided with at least one material supply buffer portion in the interior of the preheating zone for accepting the placement of electronic components to be tested on the material supply plate outputted from the material supply plate portion. The temperature control device uses a first thermostat to enable the preheating zone to form a preheated working environment, and a built-in second thermostat is arranged in the preheating zone for accepting and preheating electronic components, when the material supply plate of the material supply buffer portion is supplying material in the preheating zone, the electronic components to be tested on the material supply plate are arranged for a first stage preheating. The conveying device is to take out the preheated electronic components using a material conveyor from the feeding plate and then is transferred to the second thermostat for a second stage preheating, so that the electronic components to be tested are quickly preheated to a predetermined temperature, then the material conveyor conveys the preheated electronic components to a tester of the test device for a test operation, thereby effectively shortening the operation time for preheating the electronic components, hence, the disclosed the improves production efficiency.

Description

電子元件測試分類機 Electronic component test sorter

本發明係提供一種利用供料裝置於預溫區供料之同時,令供料盤上之電子元件先行預溫,再移載至第二溫控器接續預溫至預設作業溫度,以有效縮短預溫電子元件之作業時間,進而提高生產效能之電子元件測試分類機。 The invention provides a method for feeding the electronic component on the feeding tray by using the feeding device in the pre-warming zone, and then transferring the electronic component to the second thermostat to continue the pre-warming to the preset operating temperature, so as to be effective. An electronic component test sorting machine that shortens the operation time of pre-warmed electronic components and further improves production efficiency.

在現今,電子元件日後實際使用之場所可能為低溫環境或高溫環境,業者為確保電子元件於低溫或高溫環境下之使用品質,於電子元件製作完成後,必須以測試分類機對電子元件進行冷測或熱測作業,而淘汰出不良品,以測試分類機執行電子元件冷測作業為例,係使電子元件於-40度低溫模擬環境下執行測試作業,若直接將常溫之電子元件置入於測試裝置,該測試裝置必須空等電子元件由常溫降溫至-40度低溫,方可執行冷測作業,以致測試裝置相當耗費等待時間而降低生產效能。 Nowadays, the actual use of electronic components in the future may be low-temperature environment or high-temperature environment. In order to ensure the use quality of electronic components in low temperature or high temperature environment, electronic components must be cooled by test sorter after the electronic components are manufactured. For the purpose of measuring or thermal testing, and eliminating defective products, the tester performs the electronic component cold test operation as an example. The electronic components are tested in a -40 degree low temperature simulation environment, and the electronic components at normal temperature are directly placed. In the test device, the test device must have an empty electronic component cooled from a normal temperature to a low temperature of -40 degrees, so that the cold test operation can be performed, so that the test device consumes waiting time and reduces the production efficiency.

因此,請參閱第1圖,該測試分類機係於機台11上設有供料裝置12,該供料裝置12係設有至少一具待測電子元件13之供料盤121,一裝配於機台11上之預冷盤14,係用以預冷待測之電子元件13,一裝配於機台11之輸送裝置15,係以移料器151作第一、二、三方向(如X、Y、Z方向)位移將預冷盤14內一批次已預冷至-40度的電子元件13移載至一測試裝置16之測試座161,再於供料裝置12之供料盤121取出下一批次待測之電子元件13,並移載至預冷盤14執行預冷作業,在此同時,該測試裝置16即對上一批次已預冷之電子元件13進行測試作業,毋需空等電子元件13降溫,於測試完畢後,輸送裝置15之移料器151再於測試裝置16之測試座161取出已測之電子元件13,並移載至一收料裝置17之收料盤171上收置;惟,該待測之電子元件13雖可於預冷盤14上預冷,以避免測試裝置16耗 時空等電子元件降溫,但該供料裝置12處之待測電子元件13係為常溫,當輸送裝置15之移料器151將常溫之待測電子元件13移入預冷盤14後,預冷盤14仍需耗時將常溫之電子元件13降溫預冷至預設冷測溫度,方可供輸送裝置15之移料器151將待測之電子元件13移載至測試裝置16,以致無法有效縮短預冷作業時間及提高生產效能;再者,該測試裝置16處之已測電子元件13係呈低溫狀態,當輸送裝置15之移料器151將低溫之已測電子元件13移載至收料裝置17時,收料裝置17上之低溫已測電子元件13並無法迅速回溫至常溫,以致低溫之已測電子元件13會接觸到周遭環境含水量高之空氣,造成收料裝置17上之已測電子元件發生結露之缺失。 Therefore, referring to FIG. 1 , the test sorting machine is provided with a feeding device 12 on the machine table 11 , and the feeding device 12 is provided with at least one feeding tray 121 of the electronic component 13 to be tested. The pre-cooling tray 14 on the machine table 11 is used for pre-cooling the electronic component 13 to be tested, and the conveying device 15 mounted on the machine table 11 is in the first, second and third directions (such as X, the shifter 151). Y, Z direction) displacement, a batch of electronic components 13 precooled to -40 degrees in the pre-cooling tray 14 are transferred to the test socket 161 of a test device 16, and then taken out from the supply tray 121 of the feeding device 12. A batch of electronic components 13 to be tested is transferred to the pre-cooling tray 14 to perform a pre-cooling operation. At the same time, the testing device 16 performs a test operation on the pre-cooled electronic component 13 of the previous batch. The electronic component 13 is cooled. After the test is completed, the feeder 151 of the conveying device 15 takes out the measured electronic component 13 from the test socket 161 of the testing device 16, and transfers it to the receiving tray 171 of a receiving device 17. Upside down; however, the electronic component 13 to be tested can be pre-cooled on the pre-cooling disk 14 to avoid the consumption of the test device 16 The electronic components such as time and space are cooled, but the electronic component 13 to be tested at the feeding device 12 is at a normal temperature. When the feeder 151 of the conveying device 15 moves the electronic component 13 to be tested at normal temperature into the pre-cooling tray 14, the pre-cooling tray 14 remains The electronic component 13 at normal temperature is cooled and pre-cooled to a preset cold measurement temperature, so that the loader 151 of the conveying device 15 can transfer the electronic component 13 to be tested to the testing device 16, so that the pre-cooling cannot be effectively shortened. The working time and the improvement of the production efficiency; furthermore, the tested electronic component 13 at the testing device 16 is in a low temperature state, when the feeder 151 of the conveying device 15 transfers the low temperature tested electronic component 13 to the receiving device 17 At this time, the low-temperature electronic component 13 on the receiving device 17 cannot be quickly warmed to normal temperature, so that the measured electronic component 13 at a low temperature will contact the air having a high ambient water content, resulting in the measured device 17 being tested. Defects in condensation of electronic components.

本發明之目的一,係提供一種電子元件測試分類機,其係於 機台上配置有供料裝置、溫控裝置、輸送裝置、測試裝置及中央控制裝置,該機台係設有至少一預溫區,該供料裝置係於預溫區之外部設有承置供料盤之供料置盤部,並於預溫區之內部設有至少一供料暫置部,以承置該供料置盤部輸出之具待測電子元件的供料盤,該溫控裝置係以第一溫控器使預溫區形成一預溫作業環境,並於預溫區設有可承置及預溫電子元件之第二溫控器,當供料暫置部之供料盤於預溫區供料之同時,可使供料盤之待測電子元件先作第一階段預溫,該輸送裝置係以移料器於供料盤上取出已先預溫之待測電子元件,並移載至第二溫控器上接續作第二階段預溫,使得待測之電子元件迅速預溫至預設測試溫度,該移料器再將已完成預溫之待測電子元件移載至測試裝置之測試器執行測試作業,進而有效縮短預溫電子元件之作業時間,達到提升生產效能之實用效益。 A first object of the present invention is to provide an electronic component test classification machine, which is The machine is equipped with a feeding device, a temperature control device, a conveying device, a testing device and a central control device. The machine is provided with at least one pre-warming zone, and the feeding device is provided outside the pre-warming zone. a feeding tray portion of the feeding tray, and at least one feeding temporary portion is disposed inside the preheating portion to receive the feeding tray of the electronic component to be tested outputted by the feeding tray portion, the temperature The control device adopts a first thermostat to form a pre-warming working environment, and a second thermostat capable of receiving and pre-warning electronic components in the pre-warming zone, when the feeding temporary portion is provided While the tray is feeding in the pre-warming zone, the electronic component to be tested of the feeding tray can be pre-warmed in the first stage, and the conveying device is taken out from the feeding tray by the feeder to be pre-warmed. The electronic component is transferred to the second thermostat for the second stage pre-heating, so that the electronic component to be tested is quickly pre-warmed to a preset test temperature, and the shifter then completes the pre-warmed electronic device to be tested. The component is transferred to the tester of the test device to perform the test operation, thereby effectively shortening the working time of the pre-warmed electronic component L produce practical benefits of performance.

本發明之目的二,係提供一種電子元件測試分類機,其中, 該機台係設有至少一回溫區,該溫控裝置係於回溫區設有第三溫控器,以使回溫區形成一回溫作業環境,一收料裝置係於機台之回溫區內部設有具收料盤之收料暫置部,並於收料盤承置已測電子元件之同時,可使已測之電子元件進行由低溫回溫至常溫之回溫作業,於收料盤完成收料後,收料裝置係將具常溫已測之電子元件輸出至位於回溫區外部之收料置盤部,進而有效防止已測之電子元件結露,達到提升電子元件品質之實用效益。 An object of the present invention is to provide an electronic component test sorting machine, wherein The machine platform is provided with at least one temperature recovery zone, and the temperature control device is provided with a third temperature controller in the temperature recovery zone, so that the temperature recovery zone forms a warming working environment, and a receiving device is attached to the machine platform. The receiving part of the receiving area is provided inside the returning temperature zone, and the tested electronic components can be subjected to the temperature returning from the low temperature back to the normal temperature while the receiving tray is placed on the tested electronic components. After the receiving tray completes the receiving, the receiving device outputs the electronic component with the measured temperature at normal temperature to the receiving tray portion located outside the temperature returning region, thereby effectively preventing the measured electronic components from dew condensation and improving the quality of the electronic component. Practical benefits.

〔習知〕 [study]

11‧‧‧機台 11‧‧‧ machine

12‧‧‧供料裝置 12‧‧‧Feeding device

121‧‧‧供料盤 121‧‧‧ Feeding tray

13‧‧‧電子元件 13‧‧‧Electronic components

14‧‧‧預冷盤 14‧‧‧Pre-cooling tray

15‧‧‧輸送裝置 15‧‧‧Conveyor

151‧‧‧移料器 151‧‧‧Transfer

16‧‧‧測試裝置 16‧‧‧Testing device

161‧‧‧測試座 161‧‧‧ test seat

17‧‧‧收料裝置 17‧‧‧ Receiving device

171‧‧‧收料盤 171‧‧‧ receiving tray

〔本發明〕 〔this invention〕

20‧‧‧機台 20‧‧‧ machine

21‧‧‧預溫區 21‧‧‧Preheating zone

22‧‧‧測試區 22‧‧‧Test area

23‧‧‧回溫區 23‧‧‧Return zone

24‧‧‧空匣區 24‧‧‧Open area

251‧‧‧第一閘門 251‧‧‧ first gate

252‧‧‧第二閘門 252‧‧‧second gate

253‧‧‧第三閘門 253‧‧‧ third gate

254‧‧‧第四閘門 254‧‧‧fourth gate

255‧‧‧第五閘門 255‧‧‧ fifth gate

256‧‧‧第六閘門 256‧‧‧ sixth gate

30‧‧‧供料裝置 30‧‧‧Feeding device

31‧‧‧供料置盤部 31‧‧‧Feeding and placing department

32‧‧‧供料盤 32‧‧‧ Feeding tray

33‧‧‧供料暫置部 33‧‧‧Feeding Temporary Department

34‧‧‧供料輸送器 34‧‧‧Feed conveyor

40‧‧‧收料裝置 40‧‧‧Receiving device

41‧‧‧收料暫置部 41‧‧‧Receipt Temporary Department

42‧‧‧收料盤 42‧‧‧ receiving tray

43‧‧‧收料置盤部 43‧‧‧Receiving and placing department

44‧‧‧收料輸送器 44‧‧‧ Receiving conveyor

50‧‧‧測試裝置 50‧‧‧Testing device

51‧‧‧電路板 51‧‧‧ boards

52‧‧‧測試座 52‧‧‧ test seat

60‧‧‧溫控裝置 60‧‧‧temperature control device

61‧‧‧第一溫控器 61‧‧‧First thermostat

62‧‧‧第二溫控器 62‧‧‧Second thermostat

63‧‧‧第三溫控器 63‧‧‧ third thermostat

64‧‧‧第四溫控器 64‧‧‧ fourth thermostat

65‧‧‧第五溫控器 65‧‧‧ fifth thermostat

70‧‧‧輸送裝置 70‧‧‧Conveyor

71‧‧‧第一移料器 71‧‧‧First mover

72‧‧‧第一入料載台 72‧‧‧First feeding platform

73‧‧‧第二入料載台 73‧‧‧Second feed stage

74‧‧‧第二移料器 74‧‧‧Second shifter

75‧‧‧第三移料器 75‧‧‧third shifter

76‧‧‧第一出料載台 76‧‧‧First discharge stage

77‧‧‧第二出料載台 77‧‧‧Second discharge platform

78‧‧‧第四移料器 78‧‧‧fourth shifter

79‧‧‧第五移料器 79‧‧‧ fifth shifter

80‧‧‧空匣裝置 80‧‧‧Air equipment

81‧‧‧空盤暫置部 81‧‧‧ Empty Position Temporary Department

82‧‧‧空盤收置部 82‧‧‧ Empty Disk Collection Department

83‧‧‧空盤輸送器 83‧‧‧ empty tray conveyor

第1圖:習知電子元件測試分類機之示意圖。 Figure 1: Schematic diagram of a conventional electronic component test sorter.

第2圖:本發明電子元件測試分類機之示意圖。 Figure 2: Schematic diagram of the electronic component test sorter of the present invention.

第3圖:本發明電子元件測試分類機之使用示意圖(一)。 Figure 3: Schematic diagram of the use of the electronic component test sorter of the present invention (1).

第4圖:本發明電子元件測試分類機之使用示意圖(二)。 Figure 4: Schematic diagram of the use of the electronic component test sorter of the present invention (2).

第5圖:本發明電子元件測試分類機之使用示意圖(三)。 Figure 5: Schematic diagram of the use of the electronic component test sorter of the present invention (3).

第6圖:本發明電子元件測試分類機之使用示意圖(四)。 Figure 6: Schematic diagram of the use of the electronic component test sorter of the present invention (4).

第7圖:本發明電子元件測試分類機之使用示意圖(五)。 Figure 7: Schematic diagram of the use of the electronic component test sorter of the present invention (5).

第8圖:本發明電子元件測試分類機之使用示意圖(六)。 Figure 8: Schematic diagram of the use of the electronic component test sorter of the present invention (6).

第9圖:本發明電子元件測試分類機之使用示意圖(七)。 Figure 9: Schematic diagram of the use of the electronic component test sorter of the present invention (7).

第10圖:本發明電子元件測試分類機之使用示意圖(八)。 Figure 10: Schematic diagram of the use of the electronic component test sorter of the present invention (8).

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第2圖,本發明電子元件測試分類機包含機台20、供料裝置30、收料裝置40、測試裝置50、溫控裝置60、輸送裝置70及中央控制裝置(圖未示出),於本實施例中,更包含承置空料盤之空匣裝置80,該機台20係設有至少一預溫區,於本實施例中,該機台20係設有預溫區21、測試區22、回溫區23及空匣區24,該預溫區21與供料裝置30之間係設有可啟閉之第一閘門251,預溫區21與空匣區24之間設有可啟閉之第二閘門252,該測試區22與回溫區23之間設有可啟閉之第三閘門253,該回溫區23與收料裝置40之間設有可啟閉之第四閘門254,回溫區23與空匣區24之間設有可啟閉之第五閘門255,該空匣區24與空匣裝置80之間設有可啟閉之第六閘門256,當工作人員欲修護回溫區23處之機構時,則可關閉第三、五閘門253、255,以避免機器外部環境含水量高之空氣大量流入於預溫區21及測試區22,進而防止低溫之電子元件結露;該供料裝置30係於機台20之預溫區21外部設有至少一供料置盤部31,該供料置盤部31係容納至少一具待測電子元件之供料盤32,另於機台20之預溫 區21內部設有至少一供料暫置部33,以承置該供料置盤部31輸出之具電子元件的供料盤32,於本實施例中,供料裝置30係設有呈第二方向(如Y方向)配置之供料輸送器34,該供料輸送器34可為皮帶輪組或載台等,以將供料置盤部31處之具常溫待測電子元件的供料盤32輸送通過第一閘門251,並輸送至供料暫置部33以供取料;該收料裝置40係於機台20之回溫區23內部設有至少一收料暫置部41,該收料暫置部41係具有至少一承置已測電子元件之收料盤42,另於機台20之回溫區23外部設有至少一收料置盤部43,以收置該收料暫置部41輸出之收料盤,於本實施例中,該收料裝置40係設有呈第二方向(如Y方向)配置之收料輸送器44,該收料輸送器44可為皮帶輪組或載台等,以將收料暫置部41之具已測電子元件的收料盤42輸送通過第四閘門254,並輸送至收料置盤部43收置;該測試裝置50係裝配於機台20之測試區22,並設有至少一測試器,用以測試電子元件,於本實施例中,該測試器係具有電性連接之電路板51及測試座52,用以測試電子元件;該溫控裝置60係於機台20之預溫區21設有第一溫控器61,以使預溫區21形成一預溫作業環境,並於預溫區21設有承置待測電子元件之第二溫控器62,以預溫待測之電子元件,於本實施例中,該第一溫控器61係對預溫區21之內部輸送低溫乾燥空氣,不僅可使預溫區21形成一低溫作業環境,並於供料暫置部33上的供料盤32在預溫區21供料之同時,使供料盤32上之待測電子元件先作第一階段預冷,亦可降低預溫區21之空氣含水量,而防止預冷之電子元件結露,該第二溫控器62係為具致冷晶片之承置件,於承置已先預冷之待測電子元件後,可利用致冷晶片接續對已先預冷之待測電子元件作第二階段預溫,使得電子元件迅速預溫至預設測試溫度,另於機台20之回溫區23設有第三溫控器63,以使回溫區23形成一回溫作業環境,於本實施例中,該第三溫控器63係對回溫區23之內部輸送熱乾燥空氣,以使回溫區23形成一回溫作業環境,令收料暫置部41處之低溫已測電子元件於回溫區23逐漸回溫至常溫,進而防止已測之電子元件結露;該輸送裝置70係裝配於機台20上,並設有至少一移料器,以於該供料裝置30、該測試裝置50、該溫控裝置60及收料裝置40間移載電子元件,於本實施例中,係於預 溫區21設有作第一、二、三方向(如X、Y、Z方向)位移之第一移料器71,該第一移料器71係於供料裝置30之供料暫置部33處的供料盤32上取出待測電子元件,並移載至溫控裝置60的第二溫控器62,以及移出第二溫控器62上已預溫之待測電子元件,又於測試裝置50之兩側設有作X方向位移之第一入料載台72及第二入料載台73,第一、二入料載台72、73可承置第一移料器71移入已預溫之待測電子元件,並載送至測試裝置50之側方,二配置於測試裝置50處之第二、三移料器74、75,第二、三移料器74、75係作Y-Z方向位移,並分別提供該溫控裝置60裝配第四、五溫控器64、65,第二、三移料器74、75可分別於第一、二入料載台72、73上取出待測之電子元件,並移載至測試裝置50之測試座52,以及移出測試座52之已測電子元件,二配置於測試裝置50兩側且作X方向位移之第一、二出料載台76、77,係分別供第二、三移料器74、75移入已測之電子元件,並載送至回溫區23,一裝配於回溫區23之第四移料器78,係作X-Y-Z方向位移,以於第一、二出料載台76、77取出已測之電子元件,並載送至收料暫置部41之收料盤42收置,另設有一作X-Z方向位移之第五移料器79,用以於供料裝置30之供料暫置部33、空匣裝置80及收料裝置40之收料暫置部41間移載空的料盤;該空匣裝置80係於機台20之空匣區24內部設有至少一空盤暫置部81,以供第五移料器79移入空的供料盤32,並於機台20之空匣區24外部設有至少一空盤收置部82,以收置該空盤暫置部81輸出之空供料盤,該空盤收置部82並可將空供料盤補充於空盤暫置部81,於本實施例中,輸送裝置70之第五移料器79係由供料裝置30處取出空的供料盤32,並將空的供料盤32補充於收料裝置40之收料暫置部41,另設有呈Y方向配置之空盤輸送器83,該空盤輸送器83可為皮帶輪組或載台等,以於空盤暫置部81及空盤收置部82間載送空的供料盤;該中央控制裝置(圖未示出)係用以控制及整合各裝置作動,以執行自動化作業。 In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Referring to FIG. 2, the electronic component testing and sorting machine of the present invention comprises a machine 20 and a feeding device. The device 30, the receiving device 40, the testing device 50, the temperature control device 60, the conveying device 70, and the central control device (not shown) further comprise an empty device 80 for holding an empty tray in the embodiment. The machine 20 is provided with at least one pre-warming zone. In this embodiment, the machine 20 is provided with a pre-warming zone 21, a test zone 22, a temperature return zone 23 and an open area 24, and the pre-warming zone 21 is provided. An openable and closable first gate 251 is disposed between the preheating zone 21 and the open space 24, and the second gate 252 is opened and closed. The test zone 22 and the temperature return zone 23 are provided. There is a third gate 253 that can be opened and closed, and a fourth gate 254 that can be opened and closed is arranged between the temperature recovery zone 23 and the receiving device 40. The temperature return zone 23 and the open area 24 are provided between The fifth gate 255 of the opening and closing is provided with a sixth gate 256 that can be opened and closed between the open area 24 and the open space device 80. When the staff wants to repair the mechanism of the returning temperature zone 23, The third and fifth gates 253 and 255 are closed to prevent a large amount of air having a high water content in the external environment of the machine from flowing into the preheating zone 21 and the test zone 22, thereby preventing dew condensation of the electronic components at a low temperature; the feeding device 30 is attached to the machine 20 The preheating zone 21 is provided with at least one feeding tray portion 31 for accommodating at least one feeding tray 32 of the electronic component to be tested, and preheating the machine table 20 The inside of the area 21 is provided with at least one feeding temporary portion 33 for receiving the supply tray 32 with electronic components outputted by the supply tray portion 31. In the embodiment, the feeding device 30 is provided with a a feed conveyor 34 disposed in two directions (such as the Y direction), the feed conveyor 34 may be a pulley set or a stage, etc., to feed the supply tray of the electronic component to be tested at room temperature at the supply tray portion 31 32 is conveyed through the first gate 251 and sent to the feeding temporary portion 33 for taking out the material; the receiving device 40 is disposed in the temperature returning region 23 of the machine table 20 and is provided with at least one receiving temporary portion 41. The receiving temporary portion 41 has at least one receiving tray 42 for receiving the tested electronic components, and at least one receiving tray portion 43 is disposed outside the temperature returning region 23 of the machine 20 for receiving the receiving materials. In the present embodiment, the receiving device 40 is provided with a receiving conveyor 44 arranged in a second direction (such as the Y direction), and the receiving conveyor 44 can be a pulley. a group or a stage or the like for conveying the receiving tray 42 of the electronic component to be measured of the receiving temporary portion 41 through the fourth gate 254 and transporting it to the receiving tray portion 43 for storage; the testing device 50 The test unit 22 is mounted on the test area 22 of the machine 20, and is provided with at least one tester for testing the electronic components. In this embodiment, the tester has an electrically connected circuit board 51 and a test stand 52 for testing. The temperature control device 60 is provided with a first temperature controller 61 in the pre-heating zone 21 of the machine 20, so that the pre-warming zone 21 forms a pre-warming working environment, and is disposed in the pre-warming zone 21. The second temperature controller 62 of the electronic component to be tested preheats the electronic component to be tested. In the embodiment, the first thermostat 61 delivers low temperature dry air to the interior of the preheating zone 21, which can The preheating zone 21 forms a low temperature working environment, and the feeding tray 32 on the feeding temporary portion 33 feeds the preheating zone 21, and the electronic component to be tested on the feeding tray 32 is first staged. Pre-cooling can also reduce the air moisture content of the pre-warming zone 21, and prevent the pre-cooling of the electronic components from dew condensation. The second thermostat 62 is a bearing with a cooling chip, which is pre-cooled. After the electronic component to be tested, the second stage pre-warming of the electronic component to be tested, which has been pre-cooled, can be performed by using the cooled wafer to make the electronic element The temperature is automatically pre-warmed to the preset test temperature, and the temperature-recovering zone 23 of the machine 20 is provided with a third temperature controller 63, so that the temperature-recovering zone 23 forms a warming operating environment. In this embodiment, the third The temperature controller 63 is configured to transport the hot dry air to the interior of the temperature recovery zone 23, so that the temperature recovery zone 23 forms a warming operating environment, so that the low temperature measured electronic components at the receiving temporary portion 41 are gradually formed in the temperature returning zone 23. Returning to normal temperature, thereby preventing condensation of the measured electronic components; the conveying device 70 is mounted on the machine table 20, and is provided with at least one feeder for the feeding device 30, the testing device 50, the temperature The electronic component is transferred between the control device 60 and the receiving device 40. In this embodiment, it is pre- The temperature zone 21 is provided with a first shifter 71 for displacement in the first, second and third directions (for example, X, Y, Z directions), and the first shifter 71 is attached to the feeding temporary portion of the feeding device 30. The electronic component to be tested is taken out from the feeding tray 32 at 33, and transferred to the second thermostat 62 of the temperature control device 60, and the electronic component to be tested that has been preheated on the second thermostat 62 is removed. The first loading stage 72 and the second loading stage 73 are disposed on both sides of the testing device 50 for X-direction displacement, and the first and second loading stages 72, 73 can be loaded into the first feeder 71. The electronic component to be tested that has been pre-warmed is carried to the side of the test device 50, the second and third feeders 74, 75 disposed at the test device 50, and the second and third feeders 74, 75 Displacement in the YZ direction, and separately providing the temperature control device 60 to the fourth and fifth temperature controllers 64, 65, and the second and third feeders 74, 75 respectively on the first and second loading stages 72, 73 The electronic component to be tested is taken out and transferred to the test stand 52 of the test device 50, and the tested electronic components of the test stand 52 are removed, and the first and second discharges are arranged on both sides of the test device 50 and displaced in the X direction. Load 76, 77, respectively, for the second and third feeders 74, 75 to move into the measured electronic components, and carried to the temperature recovery zone 23, a fourth feeder 78 assembled in the temperature recovery zone 23, The XYZ direction is displaced, so that the first and second discharge stages 76, 77 take out the measured electronic components, and carry them to the receiving tray 42 of the receiving temporary portion 41, and another one for XZ direction displacement. The fifth shifter 79 is configured to transfer an empty tray between the feeding temporary portion 33 of the feeding device 30, the empty device 80 and the receiving temporary portion 41 of the receiving device 40; the empty device The 80 series is provided with at least one empty tray temporary portion 81 inside the open space 24 of the machine table 20 for the fifth feeder 79 to be moved into the empty supply tray 32 and disposed outside the open space 24 of the machine table 20. There is at least one empty tray receiving portion 82 for receiving the empty feeding tray outputted by the empty tray temporary portion 81. The empty tray receiving portion 82 can replenish the empty feeding tray to the empty tray temporary portion 81. In the present embodiment, the fifth feeder 79 of the conveying device 70 takes out the empty feeding tray 32 from the feeding device 30, and replenishes the empty feeding tray 32 to the receiving portion of the receiving device 40. 41, another configuration in the Y direction An empty tray conveyer 83, which may be a pulley set or a stage, etc., for carrying an empty supply tray between the empty tray temporary portion 81 and the empty tray storage portion 82; the central control device ( The figure is not shown) to control and integrate the various devices to perform automated operations.

請參閱第3、4圖,於使用時,該供料裝置30之供料輸送 器34係將供料置盤部31之具待測電子元件91的供料盤32載送通過第一閘門251,並輸送至位於預溫區21內之供料暫置部33,由於溫 控裝置60利用第一溫控器61對預溫區21注入低溫乾燥空氣,而使預溫區21形成一低溫之預溫作業環境,不僅可降低空氣之含水量而防止結露,並可使處於預溫區21之供料暫置部33上的待測電子元件91進行第一階段預溫作業,當輸送裝置70之第一移料器71於供料暫置部33之供料盤32取出一批次待測之電子元件91時,供料盤32上之其他待測電子元件91仍可於預溫區21內持續進行預溫作業,第一移料器71於供料暫置部33之供料盤32取出一批次待測之電子元件91後,並移載至溫控裝置60之第二溫控器62上,由於待測之電子元件91已於預溫區21進行第一階段預溫作業,其待測電子元件91本身之溫度已降溫(例如降溫至-20度),該第二溫控器62即可對已先行預溫之待測電子元件91作第二階段預溫作業,使得待測之電子元件91迅速預溫至預設測試溫度(例如降溫至-40度),不僅縮短預溫作業時間,亦可提高整體生產效能。 Please refer to Figures 3 and 4 for feeding and feeding of the feeding device 30 during use. The feeder 34 carries the supply tray 32 of the supply tray portion 31 with the electronic component 91 to be tested through the first gate 251, and is sent to the feeding temporary portion 33 located in the pre-warming zone 21 due to the temperature. The control device 60 injects the low temperature dry air into the preheating zone 21 by using the first thermostat 61, so that the preheating zone 21 forms a low temperature preheating working environment, which not only reduces the moisture content of the air but also prevents condensation, and can be in the The electronic component 91 to be tested on the feeding temporary portion 33 of the pre-warming zone 21 performs the first-stage pre-warming operation, and when the first feeder 71 of the conveying device 70 is taken out from the feeding tray 32 of the feeding temporary portion 33 When a batch of electronic components 91 to be tested is detected, the other electronic components to be tested 91 on the supply tray 32 can continue to perform the pre-warming operation in the pre-warming zone 21, and the first shifter 71 is in the feeding temporary portion 33. The feeding tray 32 takes out a batch of electronic components 91 to be tested, and transfers them to the second thermostat 62 of the temperature control device 60. Since the electronic component 91 to be tested has been first in the pre-warming zone 21 In the stage pre-warming operation, the temperature of the electronic component 91 to be tested has been cooled (for example, to -20 degrees), and the second thermostat 62 can perform the second stage pre-measurement on the electronic component 91 to be tested which has been pre-warmed. Warm operation, so that the electronic component 91 to be tested is quickly pre-warmed to a preset test temperature (for example, cooling to -40 degrees), not only shortening the pre-warming Industrial time can also improve overall production efficiency.

請參閱第5、6圖,於待測之電子元件91預溫至預設測試 溫度後,輸送裝置70之第一移料器71係於溫控裝置60之第二溫控器62取出已預溫之待測電子元件91,並移載至第一入料載台72,該第一入料載台72係將已預溫之待測電子元件91載送至測試裝置50之側方,輸送裝置70之第二移料器74係於第一入料載台72取出已預溫之待測電子元件91,並移入於測試座52,由於第二移料器74上配置有第四溫控器64,該第四溫控器64使第二移料器74呈一低溫狀態,於第二移料器74下壓該測試座52內之待測電子元件91執行測試作業時,可使待測之電子元件91於模擬低溫環境中執行冷測作業,測試座52並經電路板51將測試資料傳輸至中央控制裝置。 Please refer to Figures 5 and 6 for pre-warning the electronic component 91 to be tested to the preset test. After the temperature, the first shifter 71 of the transport device 70 is taken out by the second thermostat 62 of the temperature control device 60 to take out the pre-warmed electronic component 91 to be tested and transferred to the first loading stage 72. The first loading stage 72 carries the pre-warmed electronic component 91 to be tested to the side of the testing device 50, and the second feeder 74 of the conveying device 70 is taken out from the first loading stage 72. The electronic component 91 is tested and moved into the test socket 52. Since the second shifter 74 is disposed with the fourth thermostat 64, the fourth thermostat 64 causes the second shifter 74 to be in a low temperature state. When the second loader 74 presses the electronic component 91 to be tested in the test socket 52 to perform a test operation, the electronic component 91 to be tested can perform a cold test operation in a simulated low temperature environment, and the test block 52 passes through the circuit. The board 51 transmits the test data to the central control unit.

請參閱第7、8、9、10圖,於測試完畢後,第二移料器 74係於測試座52取出已測之電子元件91,並移載至第一出料載台76上,該第一出料載台76係通過第三閘門253,將已測之電子元件91載送至回溫區23,由於測試分類機外部環境之空氣含水量高,為避免低溫之已測電子元件91結露,可利用溫控裝置60之第三溫控器63對回溫區23注入熱乾燥空氣,使回溫區23形成一回溫作業環境,不僅可降低回溫區23之空氣含水量,當第四移料器78將第一出料載台76上 之已測電子元件91移載至收料裝置40之收料暫置部41的收料盤42上時,可使收料盤42於收料之同時,令收料盤42上低溫之已測電子元件91先於回溫區23進行回溫至常溫之作業,並不會直接接觸測試分類機外部環境之空氣,即可防止已測之電子元件91結露,於已測之電子元件91回溫至常溫後,收料裝置40之收料輸送器44即將收料暫置部41處具已測電子元件91之收料盤42輸送通過第四閘門254,而輸送至收料置盤部43收置。 Please refer to Figures 7, 8, 9, and 10. After the test is completed, the second feeder 74 is taken out of the test stand 52 to take out the measured electronic component 91, and transferred to the first discharge stage 76, the first discharge stage 76 is passed through the third gate 253, the measured electronic component 91 The temperature is sent to the temperature recovery zone 23. Since the air content of the external environment of the test sorter is high, in order to avoid dew condensation of the measured electronic component 91 at a low temperature, the third temperature controller 63 of the temperature control device 60 can be used to inject heat into the temperature return zone 23. The air is dried to form a warming working environment 23, which not only reduces the air moisture content of the temperature returning zone 23, but also when the fourth feeder 78 is to be placed on the first discharging stage 76. When the tested electronic component 91 is transferred to the receiving tray 42 of the receiving temporary portion 41 of the receiving device 40, the receiving tray 42 can be used to receive the low temperature of the receiving tray 42 while receiving the material. The electronic component 91 performs the operation of returning the temperature to the normal temperature before the temperature returning zone 23, and does not directly contact the air of the external environment of the test sorter, thereby preventing the measured electronic component 91 from dew condensation and returning to the measured electronic component 91. After the normal temperature, the receiving conveyor 44 of the receiving device 40 conveys the receiving tray 42 of the measured electronic component 91 at the receiving temporary portion 41 through the fourth gate 254, and transports it to the receiving tray portion 43. Set.

20‧‧‧機台 20‧‧‧ machine

21‧‧‧預溫區 21‧‧‧Preheating zone

22‧‧‧測試區 22‧‧‧Test area

23‧‧‧回溫區 23‧‧‧Return zone

24‧‧‧空匣區 24‧‧‧Open area

251‧‧‧第一閘門 251‧‧‧ first gate

252‧‧‧第二閘門 252‧‧‧second gate

253‧‧‧第三閘門 253‧‧‧ third gate

254‧‧‧第四閘門 254‧‧‧fourth gate

255‧‧‧第五閘門 255‧‧‧ fifth gate

256‧‧‧第六閘門 256‧‧‧ sixth gate

30‧‧‧供料裝置 30‧‧‧Feeding device

31‧‧‧供料置盤部 31‧‧‧Feeding and placing department

32‧‧‧供料盤 32‧‧‧ Feeding tray

33‧‧‧供料暫置部 33‧‧‧Feeding Temporary Department

34‧‧‧供料輸送器 34‧‧‧Feed conveyor

40‧‧‧收料裝置 40‧‧‧Receiving device

41‧‧‧收料暫置部 41‧‧‧Receipt Temporary Department

42‧‧‧收料盤 42‧‧‧ receiving tray

43‧‧‧收料置盤部 43‧‧‧Receiving and placing department

44‧‧‧收料輸送器 44‧‧‧ Receiving conveyor

50‧‧‧測試裝置 50‧‧‧Testing device

51‧‧‧電路板 51‧‧‧ boards

52‧‧‧測試座 52‧‧‧ test seat

60‧‧‧溫控裝置 60‧‧‧temperature control device

61‧‧‧第一溫控器 61‧‧‧First thermostat

62‧‧‧第二溫控器 62‧‧‧Second thermostat

63‧‧‧第三溫控器 63‧‧‧ third thermostat

64‧‧‧第四溫控器 64‧‧‧ fourth thermostat

65‧‧‧第五溫控器 65‧‧‧ fifth thermostat

70‧‧‧輸送裝置 70‧‧‧Conveyor

71‧‧‧第一移料器 71‧‧‧First mover

72‧‧‧第一入料載台 72‧‧‧First feeding platform

73‧‧‧第二入料載台 73‧‧‧Second feed stage

74‧‧‧第二移料器 74‧‧‧Second shifter

75‧‧‧第三移料器 75‧‧‧third shifter

76‧‧‧第一出料載台 76‧‧‧First discharge stage

77‧‧‧第二出料載台 77‧‧‧Second discharge platform

78‧‧‧第四移料器 78‧‧‧fourth shifter

79‧‧‧第五移料器 79‧‧‧ fifth shifter

80‧‧‧空匣裝置 80‧‧‧Air equipment

81‧‧‧空盤暫置部 81‧‧‧ Empty Position Temporary Department

82‧‧‧空盤收置部 82‧‧‧ Empty Disk Collection Department

83‧‧‧空盤輸送器 83‧‧‧ empty tray conveyor

Claims (10)

一種電子元件測試分類機,包含:機台:係設有至少一預溫區;供料裝置:係於該機台之預溫區外部設有至少一供料置盤部,該供料置盤部係容納至少一具待測電子元件之供料盤,另於該機台之預溫區內部設有至少一供料暫置部,以承置該供料置盤部輸出之供料盤;測試裝置:係裝配於該機台上,並設有至少一測試該電子元件之測試器;溫控裝置:係於該機台之預溫區設有至少一第一溫控器,並於該預溫區設有至少一承置及預溫該電子元件之第二溫控器;輸送裝置:係裝配於該機台上,並設有至少一移料器,以於該供料裝置、該測試裝置及該溫控裝置間移載該電子元件;中央控制裝置:係用以控制及整合各裝置作動。 An electronic component testing and sorting machine comprises: a machine: at least one pre-warming zone; and a feeding device: at least one feeding tray is arranged outside the pre-warming zone of the machine, the feeding tray The department is provided with at least one feeding tray for the electronic component to be tested, and at least one feeding temporary portion is disposed inside the pre-heating zone of the machine to receive the feeding tray outputted by the feeding tray portion; The test device is mounted on the machine and is provided with at least one tester for testing the electronic component; the temperature control device is provided with at least one first thermostat in the pre-heating zone of the machine, and The preheating zone is provided with at least one second thermostat for holding and preheating the electronic component; the conveying device is mounted on the machine table and is provided with at least one feeder for the feeding device, The electronic component is transferred between the test device and the temperature control device; the central control device is used to control and integrate the operation of each device. 依申請專利範圍第1項所述之電子元件測試分類機,其中,該機台係設有該預溫區、測試區及回溫區,該測試區係供裝配該測試裝置,該回溫區係供已測之電子元件回溫。 The electronic component testing and sorting machine according to claim 1, wherein the machine is provided with the pre-heating zone, the testing zone and the temperature-recovering zone, and the testing zone is for assembling the testing device, the temperature-recovering zone It is used to return the temperature of the tested electronic components. 依申請專利範圍第1或2項所述之電子元件測試分類機,其中,該溫控裝置之第一溫控器係對該機台之預溫區輸送預溫乾燥空氣。 The electronic component test sorting machine according to claim 1 or 2, wherein the first thermostat of the temperature control device delivers pre-warmed dry air to the preheating zone of the machine. 依申請專利範圍第2項所述之電子元件測試分類機,其中,該供料裝置係設有呈第二方向配置之供料輸送器,該供料輸送器係於該供料置盤部與該供料暫置部間輸送該供料盤。 The electronic component testing and sorting machine according to claim 2, wherein the feeding device is provided with a feeding conveyor arranged in a second direction, and the feeding conveyor is attached to the feeding and placing portion The supply tray is transported between the supply temporary portions. 依申請專利範圍第2項所述之電子元件測試分類機,更包含設有收料裝置,該收料裝置係於該機台之回溫區內部設有至少一收料暫置部,該收料暫置部係具有至少一承置已測電子元件之收料盤,另於該機台之回溫區外部設有至少一收料置盤部,該收料置盤部係接收該收料暫置部輸出之該收料盤。 The electronic component testing and sorting machine according to item 2 of the patent application scope further includes a receiving device, wherein the receiving device is provided with at least one receiving temporary portion inside the temperature returning area of the machine, the receiving device The material temporary portion has at least one receiving tray for receiving the tested electronic component, and at least one receiving tray portion is disposed outside the temperature returning region of the machine, and the receiving tray portion receives the receiving material The receiving tray is output by the temporary part. 依申請專利範圍第5項所述之電子元件測試分類機,其中,該收料裝置係設有呈第二方向配置之收料輸送器,該收料輸送器係於該收料置 盤部與該收料暫置部間輸送該收料盤。 The electronic component testing and sorting machine according to claim 5, wherein the receiving device is provided with a receiving conveyor arranged in a second direction, and the receiving conveyor is attached to the receiving device. The receiving tray is transported between the disk portion and the receiving portion. 依申請專利範圍第5項所述之電子元件測試分類機,其中,該溫控裝置係於該機台之回溫區設有第三溫控器。 The electronic component testing and sorting machine according to claim 5, wherein the temperature control device is provided with a third temperature controller in a temperature returning zone of the machine. 依申請專利範圍第2項所述之電子元件測試分類機,其中,該機台係於該預溫區與該供料裝置間設有第一閘門,該測試區與該回溫區間係設有第三閘門,該回溫區與該收料裝置間設有第四閘門。 The electronic component testing and sorting machine according to the second aspect of the patent application, wherein the machine is provided with a first gate between the preheating zone and the feeding device, and the testing zone and the temperature returning zone are provided The third gate is provided with a fourth gate between the temperature recovery zone and the receiving device. 依申請專利範圍第2項所述之電子元件測試分類機,其中,該輸送裝置係於該機台之預溫區設有第一移料器,以於該供料暫置部之供料盤與該溫控裝置之第二溫控器間移載該待測之電子元件,又於該測試裝置之一側設有載送該待測電子元件及該已測電子元件之第一入、出料載台,於該測試裝置之另一側設有載送該待測電子元件及該已測電子元件之第二入、出料載台,二配置於該測試裝置處之第二、三移料器,該第二移料器係於該測試裝置及該第一入、出料載台間移載該電子元件,該第三移料器係於該測試裝置及該第二入、出料載台間移載該電子元件,另於該機台之回溫區設有第四移料器,以於該第一、二出料載台與該收料暫置部之收料盤間移載該已測之電子元件。 The electronic component testing and sorting machine according to claim 2, wherein the conveying device is provided with a first shifting device in a preheating zone of the machine for supplying a feeding tray of the feeding temporary portion And the electronic component to be tested is transferred between the second temperature controller of the temperature control device, and the first input and the output of the electronic component to be tested and the electronic component to be tested are disposed on one side of the testing device. a material loading platform, on the other side of the testing device, a second loading and discharging station for carrying the electronic component to be tested and the tested electronic component, and second and third shifting at the testing device a second shifter for transferring the electronic component between the test device and the first inlet and discharge carrier, the third feeder being attached to the testing device and the second inlet and outlet The electronic component is transferred between the stages, and a fourth shifter is arranged in the temperature returning zone of the machine to move between the first and second discharge loading platforms and the receiving tray of the receiving temporary part Load the measured electronic components. 依申請專利範圍第9項所述之電子元件測試分類機,更包含空匣裝置,該機台係設有空匣區,該空匣裝置係於該機台之空匣區內部設有至少一暫置空料盤之空盤暫置部,並於該空匣區之外部設有至少一空盤收置部,以接收該空盤暫置部輸出之空料盤。 The electronic component test sorting machine according to claim 9 of the patent application scope further comprises an open space device, wherein the machine platform is provided with an open area, and the open space device is provided with at least one inside the open space of the machine. The empty tray temporary portion of the empty tray is temporarily disposed, and at least one empty tray receiving portion is disposed outside the open space to receive the empty tray outputted by the empty tray temporary portion.
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CN110308379A (en) * 2018-03-20 2019-10-08 精工爱普生株式会社 Electronic component transmission device and electronic component check device

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TWI534437B (en) * 2013-10-08 2016-05-21 Chroma Ate Inc Electronic device testing equipment for integrated high and low temperature test and its detection method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110308379A (en) * 2018-03-20 2019-10-08 精工爱普生株式会社 Electronic component transmission device and electronic component check device

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