JP2022177010A - Conveying unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prober comprising a conveying unit that conveys a conveyed object between a conveyed object storage section and a measurement section, the conveying unit improving throughput in the measurement section.

SOLUTION: In a prober 10, a conveying unit 16 conveys a conveyed object (for example, wafer or probe card PC) between a conveyed object storage section 12 and a measurement section 14. The conveying unit 16 has environment control means (for example, temperature controlling gas supply source including heater and cooler, blower, and duct connecting blower and housing of conveying unit) that, when conveying the conveyed object from one to the other of the conveyed object storage section 12 and the measurement section 14, control a conveyance environment of the conveyed object so that the conveyance environment of the conveyed object becomes closer to the environment of the other.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2023,JPO&INPIT

Description

TECHNICAL FIELD The present invention relates to a prober for inspecting electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly, to a prober that moves between an article storage section and a plurality of measurement sections to inspect the articles. The present invention relates to a transport unit that transports an object to a storage unit or each measuring unit, and a prober equipped with the transport unit.

Conventionally, a transported object storage unit (cassette stock unit that stores a plurality of wafers), a plurality of measurement units (wafer inspection unit), and a transfer object storage unit and each measurement unit. A prober (wafer inspection apparatus) has been proposed that includes a transport unit (self-propelled chassis) that transports a transported object to a transported object storage unit or each measuring unit (for example, see Patent Document 1). According to the prober described in Patent Literature 1, for example, when using N measurement units, the inspection time can be reduced to 1/N compared to the case where one measurement unit is used.

Further, conventionally, in a prober, an electrical characteristic test (high temperature test or low temperature test) is performed at a high temperature (or low temperature) of a wafer. This inspection is usually carried out by transferring a wafer from a cassette to a wafer chuck by a transfer arm, heating (or cooling) the wafer to an inspection temperature on the wafer chuck, inspecting the electrical characteristics, and after the inspection is completed, the wafer chuck The wafer is cooled (or heated) above, and after the temperature reaches normal temperature, the transfer arm returns the wafer to the cassette.

JP-A-5-343497

However, in the prober described in Patent Document 1, when a high temperature test or a low temperature test is performed in each measurement unit, the environment of the transported object storage unit (normal temperature environment) and the environment of each measurement unit (high temperature environment or low temperature environment) are different. The following problems arise due to the difference between

For example, when performing high-temperature inspection, a waiting time (for preheating) is required for each measurement unit to bring the wafers and probe cards at room temperature closer to the inspection temperature before the inspection starts. There is a problem that (processing capacity per unit time) is lowered. In particular, when the high temperature test is performed again after replacing the wafer or probe card, it takes time for the wafer chuck to reach a high temperature again. Throughput in the measurement section is further reduced. In addition, when performing high-temperature inspection, when exchanging wafers and probe cards after the inspection is completed, waiting time is required for the wafers and probe cards in a high-temperature state to approach room temperature in each measurement section, and this also causes each measurement to be delayed. There is a problem that the throughput in the part is lowered.

Similarly, when performing low-temperature inspection, there is a problem that a waiting time is required for each measurement unit to bring wafers and probe cards in a room temperature state closer to the inspection temperature before the inspection starts, and the throughput at each measurement unit decreases. There is In particular, when the low-temperature inspection is to be performed again after replacing the wafer or probe card, it takes time for the wafer chuck to return to a low temperature. Throughput in the measurement section is further reduced. In addition, when performing low-temperature inspection, after the inspection is completed, each measurement unit requires a waiting time to bring the low-temperature wafers and probe cards to a temperature at which condensation does not occur (usually room temperature). There is a problem that the throughput in the part is lowered.

As described above, in the prober described in Patent Document 1, when high temperature inspection or low temperature inspection is performed in each measurement unit, the environment of the conveyed object storage unit (usually room temperature environment) and the environment of each measurement unit (high temperature environment or The problem is that the waiting time for conveyed objects to approach a predetermined temperature (e.g., inspection temperature or room temperature) in each measuring unit increases due to the difference between the temperature and the environment (low temperature environment), and the throughput in each measuring unit decreases. There is a need to improve this and improve the throughput in each measurement unit.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a method for storing objects (for example, at least one of a wafer and a probe card) by moving between an object storage unit and a plurality of measurement units. It is an object of the present invention to provide a prober and a transport unit that can improve the throughput in each measuring part in a prober equipped with a transport unit that transports to a measuring part or to each measuring part.

In order to achieve the above object, the prober of the present invention controls a transported object storage unit for storing a plurality of transported objects, a plurality of measuring units, a housing for storing the transported objects, and an environment within the housing. an environment control means, a transport unit that moves between the transported object storage unit and each measuring unit and transports the transported object into the transported object storage unit or into each measuring unit; and a moving device for moving between the storage section and each measuring section, wherein the environment control means controls the environment in the housing so as to correspond to the environment of the destination of the transported article.

The transport unit of one aspect of the prober of the present invention further includes a sensor that detects an environment within the housing, and the environment control means controls the interior of the housing to a target environment based on the detection result of the sensor. .

In one aspect of the prober of the present invention, when the transfer destination of the transfer unit is a measurement section, the environment control means controls the environment within the housing so as to create an environment corresponding to the inspection performed in the measurement section at the transfer destination. control the environment.

In one aspect of the prober of the present invention, when the transfer destination of the transfer unit is a measurement unit in which a high-temperature test is performed, the environment control means controls the transfer object accommodated in the housing to be heated. Control the environment within the housing.

In one aspect of the prober of the present invention, the transport destination of the transport unit is the transported article storage section, and the transport unit transports the transported article, which has reached a high temperature due to a high temperature inspection, into the transported article storage section. In this case, the environment control means controls the environment within the housing so that the article to be transported accommodated within the housing is cooled.

In one aspect of the prober of the present invention, when the transfer destination of the transfer unit is a measurement unit in which a low-temperature test is performed, the environment control means controls the transfer object accommodated in the housing to be cooled. Control the environment within the housing.

In one aspect of the prober of the present invention, the transport destination of the transport unit is the transported article storage section, and the transport unit transports the transported article, which is in a low temperature state due to the low temperature inspection, into the transported article storage section. In this case, the environment control means controls the environment within the housing so that the article to be conveyed stored within the housing is heated.

In one aspect of the prober of the present invention, when the transfer destination of the transfer unit is a measurement section in which inspection is performed under a predetermined gas atmosphere, the environment control means controls the inside of the housing to be in the predetermined gas atmosphere. to control the environment in the housing.

One aspect of the prober of the present invention is a transported object holding arm that is provided in the transport unit and holds the transported object. An object holding arm is provided which is accommodated in the housing together with the object to be conveyed in a held state.

In one aspect of the prober of the present invention, the transported article storage section and the measuring sections are arranged at regular intervals with their surfaces on the side accessed by the transport unit facing each other, and the transport unit is: It is arranged between the transported object storage section and each measuring section.

One aspect of the prober of the present invention includes a transport unit rotation mechanism that rotates the transport unit so that the opening through which the transported object holding arm enters and exits faces the transported object storage section or each measuring section.

Each measuring section of one aspect of the prober of the present invention is two-dimensionally arranged in the horizontal direction and the vertical direction.

In one aspect of the prober of the present invention, the moving device includes a first movable body that moves in a horizontal direction, which is the arrangement direction of each measuring section, between the conveyed object storage section and each measuring section; a first movable body moving mechanism for moving the body in a horizontal direction; and a first movable body mounted to be movable in the vertical direction, which is the arrangement direction of each measurement unit, and the conveying unit rotating about the vertical axis. a second movable body that rotatably supports a second movable body; a second movable body moving mechanism that moves the second movable body in a vertical direction; and a transport unit rotation mechanism that rotates as

In one aspect of the prober of the present invention, the transferred object is at least one of a wafer and a probe card, and the transferred object holding arm includes a wafer arm that holds the wafer and a probe card arm that holds the probe card. at least one of

Each of the plurality of measurement units of one aspect of the prober of the present invention includes a wafer chuck adjusted to a target temperature and a probe card holding unit to which a probe card is detachably attached.

The environment control means, which is one aspect of the prober of the present invention, is provided on the upper surface inside the housing.

The environment control means, which is one aspect of the prober of the present invention, is provided substantially at the center of the upper surface.

According to another aspect of the present invention, a transport unit moves between a transported object storage unit that stores a plurality of transported objects and a plurality of measuring units, and transports the transported objects into the transported object storage unit or into each of the measuring units. and an environment control means for controlling the environment in the housing so that the environment in the housing corresponds to the environment of the destination where the goods are to be conveyed. , provided.

According to the present invention, a transfer unit that moves between an article storage section and a plurality of measurement sections to transfer an article (for example, at least one of a wafer and a probe card) to the article storage section or each measurement section. WHEREIN: The prober and conveyance unit which can improve the throughput in each measurement part can be provided.

FIG. 2 is a perspective view showing a schematic configuration of the prober of this embodiment; Front view of each measuring section Perspective view of transport unit Longitudinal cross-sectional view showing a schematic configuration of the transport unit Perspective view of moving device Partially enlarged perspective view of the moving device Longitudinal cross-sectional view showing the schematic configuration of the transport unit and the measuring section Longitudinal cross-sectional view showing a schematic configuration of the transport unit

Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic configuration of the prober 10 of this embodiment.

As shown in FIG. 1, the prober 10 of the present embodiment moves between a transported article storage section 12, a plurality of measuring sections 14, and the transported articles (books) between the transported article storage section 12 and each measuring section 14. In the embodiment, at least one of a wafer and a probe card) is transported into the transported object storage unit 12 or into each measurement unit 14, and the transport unit 16 is provided between the transported object storage unit 12 and each measurement unit 14. and a moving device (conveyance unit moving device) 22 for moving the transport unit.

The conveyed article storage section 12 and the measurement sections 14 are arranged at a constant interval in the Y direction with the surfaces on the side accessed by the conveying unit 16 facing each other (that is, facing each other).

The transport unit 16 is arranged between the transported object storage section 12 and each measurement section 14 .

The transported object storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers and a probe card storage unit 12b that stores a plurality of probe cards. There are no particular restrictions on the number or arrangement of the object storage units 12. In this embodiment, four object storage units 12, including the wafer storage unit 12a and the probe card storage unit 12b, are accessed by the transport unit 16. (the right side in FIG. 1) are arranged in the horizontal direction (X-axis direction). The side opposite to the side accessed by the transfer unit 16 (the left side in FIG. 1) is accessed by an operator when collecting wafers or probe cards.

As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measurement chamber (also called a prober chamber), in which, as shown in FIG. A head (not shown) and a first probe card holding mechanism 36 for holding the probe card PC are arranged.

FIG. 2 is a front view of each measuring section 14. FIG.

The number and layout of the measurement units 14 are not particularly limited, and in the present embodiment, as shown in FIGS. are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface of the side accessed by the transport unit 16 (the left surface in FIG. 1) facing in the same direction.

A wafer holding arm (wafer arm: transfer object holding arm) 16b and a probe card holding arm (probe card arm) 16c of the transfer unit 16 are provided on each measurement section 14 (the side accessed by the transfer unit 16). An opening 14a for entering and exiting is formed. A surface other than the surface on which the opening 14a of each measurement part 14 is formed may be closed, or an opening may be formed.

The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a well-known temperature control device (for example, a heat plate, a chiller device, etc. built into the wafer chuck 18).

The environment inside each measurement unit 14 is controlled as follows. For example, the temperature inside each measurement unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 arranged inside each measurement unit 14 . Also, the humidity in each measuring section 14 is controlled to a target humidity by purging dry air into each measuring section 14 by a well-known mechanism. Further, the environment inside each measuring section 14 is controlled by purging a predetermined gas (for example, nitrogen gas) inside each measuring section 14 by a well-known mechanism. Each measurement unit 14 performs a plurality of types of inspection, such as a high-temperature inspection, a low-temperature inspection, and an inspection under a predetermined gas (for example, nitrogen gas) atmosphere, which will be described later. The environment inside each measuring unit 14 is controlled so that the environment inside each measuring unit 14 corresponds to the inspection performed by each measuring unit 14 . It should be noted that the inspection performed by each measurement unit 14 may be the same or different among the measurement units.

The first probe card holding mechanism 36 is means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC conveyed to the first probe card holding mechanism 36 by a probe card conveying mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Unexamined Patent Application Publication No. 2000-150596), further explanation will be omitted.

Each measurement unit group includes an alignment device 38 for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and an alignment device 38 for four measurements. A movement device (not shown) is arranged for mutual movement between the sections 14 . The alignment device 38 is mutually moved among the four measurement units 14 included in the measurement unit group in which it is arranged, and is shared among the four measurement units 14 . As for the moving device for moving the alignment device 38 between the four measurement units 14, for example, the device described in JP-A-2014-150168 can be applied.

The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is raised and lowered in the Z-axis direction. It is composed of a moving/rotating mechanism for moving the wafer chuck 18 in the XYZ-θ directions, such as the axial movable portion 38a, the Z-axis fixed portion 38b, and the XY movable portion 38c. The alignment device 38 moves the wafer W held by the wafer chuck 18 while mainly moving in the XYZ-.theta. It is used for alignment, electrical contact between the wafer W and the probes, and inspection of the electrical characteristics of the wafer W through the test head.

The alignment device 38 holds the wafer chuck 18 in the measuring unit 14, and positions the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the preheating position P2 below the first probe card holding mechanism 36. (See FIG. 7(b)). This movement is accomplished by a well-known alignment device movement device (not shown).

The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and moves the first probe card holding mechanism 36 of the probe card PC. The alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the preheating position P2.

The alignment device 38 includes a second probe card holding mechanism 40 (also called a card lifter).

The second probe card holding mechanism 40 is means for receiving and holding the probe card PC from the probe card holding arm 16c. It is composed of a portion 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that elevates the holding portion 40a in the Z-axis direction with respect to the Z-axis movable portion 38a.

To receive and hold the probe card PC, the alignment device 38 is moved to the probe card receiving position P1, and the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to receive the probe card PC (lower surface outer peripheral edge). ), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18 .

The probe card transport mechanism is means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, and is provided in the alignment device 38, for example, in the Z-axis direction. It is configured by a Z-axis movable portion 38a that moves up and down.

The probe card PC is conveyed to the first probe card holding mechanism 36 by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the preheating position P2.

3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view showing a schematic configuration of the transport unit 16. As shown in FIG.

The transfer unit 16 moves in the X-axis direction and the Z-axis direction between the transfer object storage unit 12 and each measurement unit 14 to transfer the wafer W or the probe card PC into the transfer object storage unit 12 or each measurement unit 14 . As shown in FIGS. 3 and 4, a means for carrying a wafer W and a probe card PC, which is a housing for housing the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm 16c). is provided with a housing 16a formed with an opening 16f for entering and exiting. The housing 16a has a rectangular parallelepiped shape, and contains a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and a housing 16a. An environment control means 16d for controlling the environment inside the housing 16a and a sensor 16e for detecting the environment inside the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in this embodiment. Two transport units 16 are depicted in FIG. 1, and this is a state in which one transport unit 16 accesses the transported article storage section 12 (probe card storage section 12b) (lower right in FIG. 1). (see transport unit 16 drawn) and access to the measurement unit 14 (see transport unit 16 drawn at the upper left in FIG. 1).

The wafer holding arm 16b is means for holding the wafer W, and is arranged in the housing 16a so as to be horizontally movable along a guide rail (not shown) provided in the housing 16a. there is The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W. As shown in FIG.

The probe card holding arm 16c is means for holding the probe card PC, and is arranged in the housing 16a so as to be horizontally movable along guide rails (not shown) provided in the housing 16a. It is The probe card holding arm 16c is accommodated in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

The number and arrangement of the arms 16b and 16c are not particularly limited. In this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged vertically in three stages. there is

The arm moving mechanism is composed of a well-known mechanism such as a drive motor (not shown) provided in the housing 16a. By rotating the drive motor in forward and reverse directions, the arms 16b and 16c reciprocate independently in the horizontal direction to enter and exit through an opening 16f formed in the housing 16a.

The transport unit 16 is provided with air curtain forming means 42 .

The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a a sealed or substantially sealed space. It is configured.

The number, shape, and arrangement of the air injection ports are not particularly limited, and in this embodiment, as shown in FIG. They are arranged along the edge (perpendicular to the plane of the paper in FIG. 4). An arrow 44 in FIG. 4 indicates an example of the dry air flow jetted from the environment control means 16d, and the wafer chuck 18 is indicated.

The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a can be adjusted to the target temperature and humidity under a predetermined gas atmosphere by purging dry air (high-temperature or low-temperature dry air) or a predetermined gas (nitrogen gas) into each measurement unit 14. controlled. This includes well-known environmental control means 16d, for example, a temperature-controlled gas supply source including a heater and a cooler (cooler), a blower, and a pipe ( not shown). Environmental control means 16d may include a dehumidifier. The gas (high temperature or low temperature dry air) whose temperature (and humidity) has been adjusted by the temperature-controlled gas supply source is supplied into the housing 16a through the pipe line by the blower, and is jetted from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The supply source of the gas supplied into the housing 16a and the supply source of the gas injected from the air injection port may be the same or different. The surface of the housing 16a other than the surface on which the opening 16f is formed may be closed, or an opening may be formed. The environment control means 16d may be attached to the housing 16a or may be attached to the arms 16b and 16c.

The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. Sensor 16e may be included in environmental control means 16d.

The environment control means 16d controls the environment inside the housing 16a so as to correspond to the environment of the destination of the transported article. Specifically, the environment control means 16d controls the inside of the housing 16a to the target environment based on the detection result of the sensor 16e. For example, the environment control means 16d controls the temperature control gas supply source based on the detection result of the sensor 16e so that the temperature and humidity inside the housing 16a reach the target temperature and humidity. The function of the environment control means 16d is realized, for example, by feedback control by a controller (not shown) to which the sensor 16e and temperature control gas supply source (heater and cooler) are electrically connected. Incidentally, the environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, a downward air ejection port may be provided to block the opening 16f, and an air ejection port for dry air may be provided to control the environment inside the housing 16a. Here, it is preferable that the air injection port of the dry air for controlling the environment inside the housing 16a is provided in such a direction that the dry air to be injected is well circulated inside the housing 16a. By integrating the environment control means 16d and the air curtain forming means 42, the space for installing the environment control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be used effectively. . Further, by integrating the environment control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater and a cooler (cooler), and A blower or the like can be shared.

5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22. FIG.

The moving device 22 is means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transported article storage unit 12 and each measuring unit 14. For example, as shown in FIGS. The first movable body 24 moves in the horizontal direction (X-axis direction), which is the arrangement direction of each measuring section 14, between the conveyed object storage section 12 and each measuring section 14, and the first movable body 24 moves in the horizontal direction (X-axis direction). A first movable body moving mechanism (not shown) that moves in the direction), is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring section 14, and the transport unit A second movable body 26 that rotatably supports 16 about a vertical axis (Z-axis), and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , and the second movable body 26 and configured by a transport unit rotation mechanism 28 that rotates the transport unit 16 about the vertical axis (Z-axis).

The first movable body 24 is, for example, a frame body configured by connecting four corners of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction. It is movably connected to two guide rails 30 extending in the X-axis direction and arranged parallel to each other on a base 34 between each measuring section 14 .

The first movable body moving mechanism is composed of a well-known moving mechanism, such as a ball screw connected to the first movable body 24 and a drive motor (none of which is shown) that rotates the ball screw. By rotating the drive motor forward and backward, the first movable body 24 (transport unit 16) moves along the guide rail 30 in the X-axis direction. Of course, not limited to this, the first movable body moving mechanism is a mechanism for making the first movable body 24 self-propelled, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. good too.

The second movable body 26 is movably connected to two guide rails 32 arranged parallel to each other on the first movable body 24 and extending in the Z-axis direction.

The second movable body moving mechanism is composed of a well-known moving mechanism, such as a ball screw connected to the second movable body 26 and a drive motor (both not shown) that rotates the ball screw. By rotating the drive motor forward and backward, the second movable body 26 (transport unit 16) moves along the guide rail 32 in the Z-axis direction. Of course, not limited to this, the second movable body moving mechanism is a mechanism for self-running the second movable body 26, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. good too.

The transfer unit rotating mechanism 28 is composed of a known rotating mechanism, for example, a rotating shaft (vertical shaft) provided on the second movable body 26 and a driving motor 28a for rotating the rotating shaft. The transport unit 16 has its upper surface fixed to a rotating shaft (vertical shaft). By rotating the drive motor 28a forward and backward, the transport unit 16 rotates 180° about the vertical axis (Z-axis), and the opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is opened. It will be in a state of facing the conveyed object storage unit 12 or each measuring unit 14 .

Note that each device and mechanism such as the alignment device 38, the arm moving mechanism, the environment control means 16d, the moving device 22 (the first movable body moving mechanism, the second movable body moving mechanism, and the transport unit rotating mechanism 28) are not shown. It is driven by control by control means (controller or the like).

Next, an operation example of the transport unit 16 in the prober 10 of this embodiment will be described.

<Wafer transfer operation example 1>
First, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (eg, room temperature 23° C.) to the measurement unit 14 where high-temperature inspection (eg, inspection temperature 80° C.) is performed will be described.

First, the transfer unit 16 is moved to a position where the wafer housing part 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180° so that the arms 16b and 16c enter and exit the transfer unit 16. The opening 16f formed in .theta. is opposed to the wafer housing portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer housing portion 12a to take out one wafer W from the wafer housing portion 12a and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 (in this case, the high temperature test at 80° C. performed inside the measurement unit 14). Specifically, a gas temperature-controlled by a temperature-controlled gas supply source (for example, dry air or nitrogen temperature-controlled to 60° C.) is supplied into the housing 16a and is jetted from the air jet port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The target temperature for which the temperature control gas supply source adjusts the temperature is not limited to 60° C., but the distance and time for the wafer W to be transported from the wafer storage unit 12a to the measuring unit 14 at the transport destination, and the measurement unit 14 at the transport destination An appropriate temperature can be set in consideration of the inspection temperature, etc.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the wafer W can be handed over), and the transfer unit 16 is rotated by 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is made to face the measurement section 14, which is the transport destination. During this time, the wafer W accommodated in the transfer unit 16 continues to be heated by the gas supplied inside the housing 16a (the closed or substantially closed space).

Next, the wafer holding arm 16b is advanced into the measurement section 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed, and the wafer W is loaded onto the wafer chuck 18. FIG. The wafer holding arm 16b advances into the measuring section 14 while holding the wafer W through the opening 16f closed by the air curtain. At that time, the wafer W is further heated by the air curtain.

Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the following effects can be achieved.

First, similar to the case where the opening 16f is closed by a physical door or shutter, the inside of the housing 16a can be made into a sealed or substantially sealed space, and the temperature inside the sealed housing 16a can be controlled. By supplying the gas, the environment in the housing 16a is changed to the environment corresponding to the environment of the measurement unit 14 to which the transfer is made (here, the high temperature test at 80° C. performed in the measurement unit 14). be able to.

Secondly, the probe card holding arm 16c can be advanced into the measuring section 14 while keeping the inside of the housing 16a sealed.

Third, compared to closing the opening 16f with a physical door or shutter, there is no need to open and close the physical door or shutter. can be made

Fourthly, when the probe card PC is delivered, the probe card PC can be heated by the action of the air curtain blown onto the probe card PC.

Fifth, when the opening 16f is closed with a physical door or shutter, the gas supplied to the inside of the housing 16a touches the physical door or shutter and enters the external environment through the physical door or shutter. Heat is radiated, and as a result, the temperature of the gas supplied to the inside of the housing 16a decreases. Since the gas coming in contact with the air curtain having the same temperature as the air curtain, it is possible to suppress the temperature drop of the gas supplied to the inside of the housing 16a.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W is heated by the wafer chuck 18 and waits until it reaches the inspection temperature (here, 80° C.). The wafer W held by the wafer chuck 18 is aligned with the probes of the probe card PC held above the wafer chuck 18 by a well-known method. By bringing the wafer W into electrical contact with the probes, the electrical characteristics of the wafer W are inspected through the test head.

In this way, the environment in the transfer unit 16 is controlled (by heating the wafer) by using the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature at 14, it is possible to shorten (or eliminate) the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination, compared with the conventional technology. Thereby, the throughput in the measurement unit 14 can be improved.

<Wafer transfer operation example 2>
Next, a description will be given of an operation example when the transfer unit 16 transfers the wafer W, which has been brought to a high temperature state (for example, 80° C.) by the high temperature inspection, from the measurement unit 14 into the wafer storage unit 12a (for example, the room temperature is 23° C.). .

First, the wafer W immediately after the high-temperature inspection is taken out from the measuring section 14 by the wafer holding arm 16b, and stored in the housing 16a. This is performed in the reverse order of the wafer transfer operation example 1 described above. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment (here, the room temperature is 23° C.) of the wafer storage unit 12a to which the wafer is transferred. Specifically, a gas temperature-controlled by a temperature-controlled gas supply source (for example, dry air or nitrogen temperature-controlled to 40° C.) is supplied into the housing 16a and jetted from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to 40° C., and the distance and time for the wafer W to be transported from the measurement unit 14 to the wafer storage unit 12a as the transport destination, the wafer storage unit 12a as the transport destination, etc. An appropriate temperature can be set in consideration of the temperature at the temperature. Immediately after the high-temperature inspection, the wafer W is held by the wafer holding arm 16b, passes through the opening 16f closed by the air curtain, is picked up from the measuring section 14, and is housed in the housing 16a. be. At that time, the wafer W is cooled by the air curtain blown thereon and further cooled by the gas supplied into the housing 16a.

Next, the transfer unit 16 is moved to a position (a position where the wafer W can be handed over) at which the wafer storage unit 12a of the transfer destination can be accessed, and the transfer unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 to which the wafer is to be transferred faces the wafer housing portion 12a to which the wafer is to be transferred. During this time, the wafers W accommodated in the transfer unit 16 continue to be cooled by the gas supplied inside the housing 16a (the closed or substantially closed space).

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the wafer holding arm 16b is advanced into the wafer housing portion 12a to return the wafer W into the wafer housing portion 12a.

In this manner, the environment in the transfer unit 16 is controlled (the wafer is cooled) by using the time from the measurement unit 14 to the transfer destination wafer storage unit 12a until the transfer destination wafer storage unit 12a. By reducing the difference from the temperature of the part 12a, it is possible to eliminate (or shorten) the waiting time for the wafer to approach the normal temperature in the measuring part 14, compared with the conventional technology, and the wafer that has undergone the high temperature inspection can be It can be immediately taken out from the measuring section 14 and returned to the wafer storage section 12a. Thereby, the throughput in the measurement unit 14 can be improved. In addition, it is possible to eliminate (or shorten) the waiting time until the worker collects the wafer after the wafer is stored.

<Wafer transfer operation example 3>
Next, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (eg, room temperature 23° C.) to the measurement unit 14 where the low-temperature inspection (eg, inspection temperature −10° C.) is performed will be described. do.

First, the transfer unit 16 is moved to a position where the wafer housing part 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180° so that the arms 16b and 16c enter and exit the transfer unit 16. The opening 16f formed in .theta. is opposed to the wafer housing portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer housing portion 12a to take out one wafer W from the wafer housing portion 12a and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 (in this case, the low-temperature test of −10° C. performed inside the measurement unit 14). Specifically, a gas whose temperature or humidity is adjusted by a temperature-adjusted gas supply source (for example, dry air or nitrogen whose temperature is adjusted to −15° C.) is supplied into the housing 16a, and is supplied from the air injection port. An air curtain is formed that closes the opening 16f formed in the housing 16a by being jetted. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to −15° C., and the distance and time for the wafer W to be transported from the wafer storage unit 12a to the measuring unit 14 at the transport destination, and the measuring unit 14 at the transport destination An appropriate temperature can be set in consideration of the inspection temperature and the like.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the wafer W can be handed over), and the transfer unit 16 is rotated by 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is made to face the measurement section 14, which is the transport destination. During this time, the wafers W accommodated in the transfer unit 16 continue to be temperature-controlled (for example, cooled) and dried by the gas supplied into the housing 16a (closed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being transported to the measurement unit 14 at the transport destination.

Next, the wafer holding arm 16b is advanced into the measurement section 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed, and the wafer W is loaded onto the wafer chuck 18. FIG. The wafer holding arm 16b advances into the measuring section 14 while holding the wafer W through the opening 16f closed by the air curtain. At that time, the wafer W is further cooled and dried by the air curtain. As a result, it is possible to prevent condensation from occurring on the wafer W when the wafer W is transferred.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W is cooled by the wafer chuck 18 and waits until it reaches the inspection temperature (−10° C. in this case). The wafer W held by the chuck 18 is aligned with the probes of the probe card PC held above the wafer chuck 18 by a well-known method. By bringing the wafer W and the probes into electrical contact with each other through the test head, the electrical characteristics of the wafer W are inspected. In addition, in the measurement unit 14 at the transfer destination, a dew point gas (for example, 20° C.) that does not condense at the cooling temperature of the wafer and the probe card is prepared by known means so that dew condensation does not occur on the wafer and the probe card during the low-temperature inspection. dry air) is supplied, and the low-temperature inspection is performed in an environment where this gas is supplied.

In this manner, the environment in the transfer unit 16 is controlled (the wafer is cooled) by using the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature of 14, the waiting time for bringing the wafer close to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) compared to the conventional technology. Thereby, the throughput in the measurement unit 14 can be improved.

<Wafer Transfer Operation Example 4>
Next, a description will be given of an operation example in which the transfer unit 16 transfers the wafer W, which has been brought to a low temperature state (eg, -40° C.) by the low temperature inspection, from the measuring section 14 into the wafer storage section 12a (eg, room temperature 23° C.). do.

First, the wafer W immediately after the low-temperature inspection is completed is taken out from the measuring unit 14 by the wafer holding arm 16b, and stored in the housing 16a. This is performed in the reverse order of the wafer transfer operation example 3 described above. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment (here, the room temperature is 23° C.) of the wafer storage unit 12a to which the wafer is transferred. Specifically, a gas whose temperature or humidity is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 15° C.) is supplied into the housing 16a and is ejected from the air ejection port. An air curtain is formed to block the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature for which the temperature control gas supply source adjusts the temperature is not limited to 15° C., and the distance and time for the wafer W to be transported from the measuring unit 14 to the wafer storage unit 12a as the transport destination, the wafer storage unit 12a as the transport destination, etc. An appropriate temperature can be set in consideration of the temperature at the temperature. Immediately after the low-temperature inspection, the wafer W is held by the wafer holding arm 16b, passes through the opening 16f closed by the air curtain, is picked up from the measuring section 14, and is housed in the housing 16a. be. At that time, the wafer W is heated by the air curtain blown thereon and further heated by the gas supplied into the housing 16a. As a result, it is possible to prevent condensation from occurring on the wafer W when the wafer W is transferred.

Next, the transfer unit 16 is moved to a position (a position where the wafer W can be handed over) at which the wafer storage unit 12a of the transfer destination can be accessed, and the transfer unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 to which the wafer is to be transferred faces the wafer housing portion 12a to which the wafer is to be transferred. During this time, the wafer W accommodated in the transfer unit 16 continues to be heated by the gas supplied inside the housing 16a (the closed or substantially closed space). As a result, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being transported to the wafer housing portion 12a.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the wafer holding arm 16b is advanced into the wafer housing portion 12a to return the wafer W into the wafer housing portion 12a.

In this manner, the environment in the transfer unit 16 is controlled (heated) by using the time from the measurement unit 14 to the transfer destination wafer storage unit 12a until the wafer transfer destination wafer storage unit 12a is transferred. By reducing the difference from the temperature of the part 12a, it is possible to eliminate (or shorten) the waiting time for the wafer to approach the room temperature in the measuring part 14, compared with the conventional technology, and the wafer after the low temperature inspection is finished. It can be immediately taken out from the measuring section 14 and returned to the wafer storage section 12a. Thereby, the throughput in the measurement unit 14 can be improved. Further, it is possible to prepare a temperature environment that prevents dew condensation from occurring on the wafer before the wafer is transported into the wafer storage section 12a.

<Wafer transfer operation example 5>
Next, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (eg, room temperature 23° C.) into the measurement unit 14 where inspection is performed under a predetermined gas (eg, nitrogen gas) atmosphere. will be explained.

First, the transfer unit 16 is moved to a position where the wafer storage part 12a can be accessed (a position where the wafer can be taken out), and the transfer unit 16 is rotated by 180° to move the arms 16b and 16c into and out of the transfer unit 16. The formed opening 16f is made to face the wafer housing portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer housing portion 12a to take out one wafer W from the wafer housing portion 12a and store it in the housing 16a. Along with this, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 to which it is transferred (in this case, the inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a gas (e.g., nitrogen gas) for preventing oxidation of wiring (especially, copper wiring) exposed on the wafer surface and probes of the probe card is supplied into the housing 16a, and an air injection port is supplied. An air curtain is formed that closes the opening 16f formed in the housing 16a by being jetted from the housing 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the wafer W can be handed over), and the transfer unit 16 is rotated by 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is made to face the measurement section 14, which is the transport destination. During this time, the anti-oxidation gas continues to be supplied into the transfer unit 16 (closed or substantially closed space). Thereby, it is possible to prevent the wafer W from being oxidized while being transported to the measurement unit 14 at the transport destination. In addition, an anti-oxidation gas is also supplied to the inside of the measurement unit 14, which is the transfer destination, by a well-known means.

Next, the wafer holding arm 16b is advanced into the measurement section 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed, and the wafer W is loaded onto the wafer chuck 18. FIG. The wafer holding arm 16b advances into the measuring section 14 while holding the wafer W through the opening 16f closed by the air curtain. At that time, the wafer W is prevented from being oxidized by the action of the air curtain.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the alignment device 38 moves in the XYZ-.theta. Next, the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probes, whereby the electrical characteristics of the wafer W are inspected via the test head. . Note that the inspection is performed in an environment in which an anti-oxidation gas is supplied.

In this manner, the wafers are inspected under a predetermined gas (for example, nitrogen gas) atmosphere until the wafers are transferred from the wafer storage unit 12a to the measurement unit 14, which is the destination of the transfer. environment, the wiring (in particular, copper wiring) exposed on the wafer surface is prevented from being oxidized during transportation and delivery.

Note that this operation example 5 can be implemented in combination with the wafer transfer operation examples 1 to 4 described above.

<Probe card transport operation example 1>
Next, an operation example in which the transport unit 16 transports the probe card PC from the probe card storage unit 12b (room temperature 23° C., for example) to the measurement unit 14 where high-temperature inspection (inspection temperature, for example, 80° C.) is performed. explain.

First, the transport unit 16 is moved to a position where the probe card storage part 12b can be accessed (a position where the probe card PC can be taken out), and the transport unit 16 is rotated by 180° to transport the arms 16b and 16c in and out. An opening 16f formed in the unit 16 is made to face the probe card storage section 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to take out one probe card PC from the probe card storage section 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 (in this case, the high temperature test at 80° C. performed inside the measurement unit 14). Specifically, a gas temperature-controlled by a temperature-controlled gas supply source (for example, dry air or nitrogen temperature-controlled to 60° C.) is supplied into the housing 16a and is jetted from the air jet port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to 60° C. The distance and time for the probe card PC to be transported from the probe card storage unit 12b to the measuring unit 14 at the transport destination, the measuring unit at the transport destination An appropriate temperature can be set in consideration of the inspection temperature at 14 and the like.

Next, the transport unit 16 is moved to a position where the measuring section 14 of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the conveying unit 16 is made to face the measuring section 14 of the conveying destination. During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied inside the housing 16a (the closed or substantially closed space).

Next, the probe card holding arm 16c is advanced into the measurement section 14 through the opening 16f on the transport unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed (see FIG. 7A). The probe card holding arm 16c advances into the measuring section 14 through the opening 16f closed by the air curtain while holding the probe card PC. At that time, the probe card PC is further heated by the air curtain blown thereon.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, while the alignment device 38 holding the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature of 80° C.) is moved to the probe card receiving position P1, the holding portion 40a is moved along the Z axis. The portion 38a is lifted in the Z-axis direction to abut on the probe card PC (the outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is transferred to the holding portion 40a and held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is heated by radiant heat from the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80° C.) is moved to the preheating position P2 (see FIG. 7B). During this time, the probe card PC is also heated by the radiant heat of the wafer chuck 18 below it.

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, while the alignment device 38 holding the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature of 80° C.) is moved to the preheating position P2, the Z-axis movable portion 38a (second probe The probe card PC held by the second probe card holding mechanism 40 is transported to the first probe card holding mechanism 36 by raising the card holding mechanism 40) in the Z-axis direction. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36 . During this time, the probe card PC is also heated by the radiant heat of the wafer chuck 18 below it.

As described above, the probe card PC is not only heated in the transfer unit 16, but is also held by the first probe card holding mechanism 36 after being transferred from the probe card holding arm 16c. continue to be seamlessly heated (preheated) by the radiant heat of the

As a result, even if it takes about 10 to several tens of seconds for the probe card PC heated in the transport unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, The probe card PC in the preheated state can be held by the first probe card holding mechanism 36 without the temperature of the probe card PC dropping.

In this way, the environment in the transport unit 16 is controlled (by heating the probe card) using the time until the probe card is transported from the probe card storage unit 12b to the measurement unit 14 at the transport destination. By reducing the difference from the inspection temperature in the measurement unit 14 of the transfer destination, the waiting time (for preheating) for the probe card to approach the inspection temperature in the measurement unit 14 at the destination is shortened compared to the conventional technology. (or eliminate). Thereby, the throughput in the measurement unit 14 can be improved.

<Probe card transport operation example 2>
Next, an operation example in which the transport unit 16 transports the probe card PC, which has been brought to a high temperature state (e.g., 80° C.) by the high temperature inspection, from the measurement unit 14 into the probe card storage unit 12b (e.g., room temperature 23° C.). explain.

First, the probe card PC immediately after completion of the high temperature inspection is taken out from the measuring unit 14 by the probe card holding arm 16c and stored in the housing 16a. This is carried out in the reverse order of the probe card transport operation example 1 described above. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment (here, the room temperature is 23° C.) of the destination probe card storage section 12b. Specifically, a gas temperature-controlled by a temperature-controlled gas supply source (for example, dry air or nitrogen temperature-controlled to 40° C.) is supplied into the housing 16a and jetted from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to 40° C., and the distance and time for the probe card PC to be transported from the measurement unit 14 to the probe card storage unit 12b of the transport destination, the probe card of the transport destination An appropriate temperature can be set in consideration of the temperature in the storage portion 12b. Immediately after the high-temperature test, the probe card PC is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, is taken out of the measuring section 14, and is transferred into the housing 16a. be housed. At that time, the probe card PC is cooled by the air curtain blown thereon and further cooled by the gas supplied into the housing 16a.

Next, the transport unit 16 is moved to a position where the probe card storage section 12b of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated by 180° to move the arms 16b and 16c. The opening 16f formed in the conveying unit 16 through which the . During this time, the probe card PC housed in the transport unit 16 continues to be cooled by the gas supplied inside the housing 16a (sealed or substantially sealed space).

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the probe card holding arm 16c is advanced into the probe card housing portion 12b, and the probe card PC is returned into the probe card housing portion 12b.

In this way, the environment in the transport unit 16 is controlled (cooling the probe card) by using the time from the measuring unit 14 to the time when the probe card is transported into the probe card storage part 12b of the transport destination. By reducing the difference between the temperature of the probe card storage unit 12b and the temperature of the probe card storage unit 12b, it is possible to eliminate (or shorten) the waiting time for the probe card to approach normal temperature in the measurement unit 14 compared to the conventional technology. After the end of the measurement, the probe card can be immediately taken out from the measuring section 14 and returned to the probe card storage section 12b. Thereby, the throughput in the measurement unit 14 can be improved. In addition, it is possible to eliminate (or shorten) the waiting time until the worker collects the probe card after storing the probe card.

<Probe card transport operation example 3>
Next, an operation example in which the transport unit 16 transports the probe card PC from the probe card storage unit 12b (room temperature 23° C., for example) to the measuring unit 14 where the low-temperature inspection (test temperature −10° C., for example) is performed. will be explained.

First, the transport unit 16 is moved to a position where the probe card storage part 12b can be accessed (a position where the probe card can be taken out), and the transport unit 16 is rotated by 180° to move the arms 16b and 16c into and out of the transport unit. The opening 16f formed in 16 is made to face the probe card housing portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to take out one probe card PC from the probe card storage section 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 (in this case, the low-temperature test of −10° C. performed inside the measurement unit 14). Specifically, a gas whose temperature or humidity is adjusted by a temperature-adjusted gas supply source (for example, dry air or nitrogen whose temperature is adjusted to −15° C.) is supplied into the housing 16a, and is supplied from the air injection port. An air curtain is formed that closes the opening 16f formed in the housing 16a by being jetted. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to −15° C., and the distance and time for the probe card PC to be transported from the probe card storage unit 12b to the measurement unit 14 at the transport destination, and the measurement of the transport destination An appropriate temperature can be set in consideration of the inspection temperature in the unit 14 and the like.

Next, the transport unit 16 is moved to a position where the measuring section 14 of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the conveying unit 16 is made to face the measuring section 14 of the conveying destination. During this time, the probe card PC housed in the transport unit 16 continues to be cooled and dried by the gas supplied inside the housing 16a (the closed or substantially closed space). As a result, it is possible to prevent condensation from occurring on the probe card PC while the probe card PC is being transported to the measurement unit 14 at the transport destination.

Next, the probe card holding arm 16c is advanced into the measurement section 14 through the opening 16f on the transport unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed (see FIG. 7A). The probe card holding arm 16c advances into the measuring section 14 through the opening 16f closed by the air curtain while holding the probe card PC. At that time, the probe card PC is further cooled and dried by the air curtain blown thereon. As a result, it is possible to prevent dew condensation from occurring on the probe card PC when the probe card PC is delivered.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, the alignment device 38, which holds the wafer chuck 18 cooled to the target temperature (here, the inspection temperature −10° C.), is moved to the probe card receiving position P1, and the holding portion 40a is moved to the Z axis. The movable portion 38a is lifted in the Z-axis direction to abut on the probe card PC (the outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is transferred to the holding portion 40a and held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature -10° C.) is moved to the position P2 (see FIG. 7B). During this time, the probe card PC is also cooled by the wafer chuck 18 below it.

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, the Z-axis movable part 38a (the second probe The probe card PC held by the second probe card holding mechanism 40 is transported to the first probe card holding mechanism 36 by raising the card holding mechanism 40) in the Z-axis direction. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36 . During this time, the probe card PC is also cooled by the wafer chuck 18 below it.

As described above, the probe card PC is not only cooled in the transfer unit 16, but is also held by the first probe card holding mechanism 36 after being transferred from the probe card holding arm 16c. continue to be cooled seamlessly by

As a result, even if it takes about 10 to several tens of seconds for the probe card PC cooled in the transport unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, The cooled probe card PC can be held by the first probe card holding mechanism 36 without the temperature of the probe card PC rising in . In addition, a dew point gas (for example, dry air of 20° C.) that does not condense at the cooling temperature of the wafer or the probe card is supplied to the measurement unit 14 at the transfer destination by known means.

In this way, the environment in the transfer unit 16 is controlled (the wafer is cooled) by using the time until the probe card is transferred from the probe card storage unit 12b to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature of the measuring unit 14, the waiting time for bringing the probe card closer to the inspection temperature in the measuring unit 14 at the transfer destination can be shortened (or eliminated) compared to the conventional technology. Thereby, the throughput in the measurement unit 14 can be improved.

<Probe card transport operation example 4>
Next, an operation example in which the transport unit 16 transports the probe card PC, which has been brought to a low temperature state (eg, −40° C.) by the low temperature inspection, from the measuring unit 14 into the probe card storage unit 12b (eg, room temperature 23° C.). will be explained.

First, the probe card PC immediately after the low-temperature inspection is completed is taken out from the measuring unit 14 by the probe card holding arm 16c, and stored in the housing 16a. This is carried out in the reverse order of the probe card transport operation example 3 described above. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment (here, the room temperature is 23° C.) of the destination probe card storage section 12b. Specifically, a gas whose temperature or humidity is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 15° C.) is supplied into the housing 16a and is ejected from the air ejection port. An air curtain is formed to block the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to 15° C., and the distance and time for the probe card PC to be transported from the measurement unit 14 to the probe card storage unit 12b of the transport destination, the probe card of the transport destination An appropriate temperature can be set in consideration of the temperature in the storage portion 12b. Immediately after the low-temperature inspection, the probe card PC is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, is taken out from the measurement unit 14, and is transferred into the housing 16a. be stored. At that time, the probe card PC is heated by the air curtain blown thereon, and further heated by the gas supplied into the housing 16a. As a result, it is possible to prevent dew condensation from occurring on the probe card PC when the probe card PC is delivered.

Next, the transport unit 16 is moved to a position where the probe card storage section 12b of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated by 180° to move the arms 16b and 16c. The opening 16f formed in the conveying unit 16 through which the . During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied inside the housing 16a (the closed or substantially closed space). As a result, it is possible to prevent condensation from occurring on the probe card PC while the probe card PC is being transported to the probe card housing portion 12b.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

Next, the probe card holding arm 16c is advanced into the probe card housing portion 12b, and the probe card PC is returned into the probe card housing portion 12b.

In this way, the environment in the transport unit 16 is controlled (by heating the probe card) by using the time from the measurement unit 14 to the time when the probe card is transported into the probe card storage part 12b of the transport destination. By reducing the difference between the temperature of the probe card storage unit 12b and the temperature of the probe card storage unit 12b, it is possible to eliminate (or shorten) the waiting time for the probe card to approach normal temperature in the measurement unit 14 compared to the conventional technology. After the end of the measurement, the probe card can be immediately taken out from the measuring section 14 and returned to the probe card storage section 12b. Thereby, the throughput in the measurement unit 14 can be improved. Moreover, it is possible to prepare a temperature environment that prevents dew condensation from occurring on the probe card before the probe card is conveyed into the probe card storage section 12b.

<Probe card transport operation example 5>
Next, when the transport unit 16 transports the probe card PC from the probe card storage part 12b (for example, room temperature 23° C.) into the measurement part 14 where inspection is performed under a predetermined gas (for example, nitrogen gas) atmosphere, An operation example will be described.

First, the transport unit 16 is moved to a position where the probe card storage part 12b can be accessed (a position where the probe card can be taken out), and the transport unit 16 is rotated by 180° to move the arms 16b and 16c into and out of the transport unit. The opening 16f formed in 16 is made to face the probe card housing portion 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to take out one probe card PC from the probe card storage section 12b and store it in the housing 16a. Along with this, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 to which it is transferred (in this case, the inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a gas (e.g., nitrogen gas) for preventing oxidation of wiring (especially, copper wiring) exposed on the wafer surface and probes of the probe card is supplied into the housing 16a, and an air injection port is supplied. An air curtain is formed that closes the opening 16f formed in the housing 16a by being jetted from the housing 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space.

Next, the transport unit 16 is moved to a position where the measuring section 14 of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the conveying unit 16 is made to face the measuring section 14 of the conveying destination. During this time, the anti-oxidation gas continues to be supplied into the transfer unit 16 (closed or substantially closed space). As a result, it is possible to prevent the probe card PC from being oxidized while the probe card PC is being transported to the measurement unit 14 at the transport destination. In addition, an anti-oxidation gas is also supplied to the inside of the measurement unit 14, which is the transfer destination, by a well-known means.

Next, the probe card holding arm 16c is advanced into the measurement section 14 through the opening 16f on the side of the transport unit 16 and the opening 14a on the side of the measurement section 14 where the air curtain is formed. The probe card holding arm 16c advances into the measuring section 14 through the opening 16f closed by the air curtain while holding the probe card PC. At that time, the probe card PC is prevented from being oxidized by the action of the air curtain.

In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in Example 1 of the wafer transfer operation can be obtained.

After that, the probe card PC is transported to the first probe card holding mechanism 36 in the same procedure as in the probe card transport operation examples 1 and 3, and is detachably held by the first probe card holding mechanism 36 .

In this manner, the probe card is inspected under a predetermined gas (for example, nitrogen gas) atmosphere until the probe card is transported from the probe card storage unit 12b to the measuring unit 14 at the transport destination. 14, the probes of the probe card are prevented from oxidizing during transportation and delivery.

It should be noted that this operation example 5 can also be carried out in combination with the probe card transport operation examples 1 to 4 described above.

As described above, according to the present embodiment, an object (for example, at least one of a wafer and a probe card) is moved between the object storage unit 12 and the plurality of measurement units 14 and placed in the object storage unit. 12 or each measuring section 14, it is possible to provide a prober capable of improving the throughput at each measuring section 14. FIG.

This is because the environment (for example, temperature and humidity) in the transport unit 16 (housing 16a) is controlled using the time until the transported object is transported to the transport destination (measuring unit 14 or transported object storage unit 12). and, as a result, compared with the conventional technology, it is possible to shorten (or eliminate) the waiting time for bringing the conveyed object closer to a predetermined temperature (for example, inspection temperature or room temperature) in each measuring unit. be.

Further, according to the present embodiment, the environment inside the housing 16a, which is smaller than the entire prober 10, is controlled instead of controlling the environment of the entire prober 10. is locally controlled, energy saving can be achieved compared to the case where the environment of the entire prober 10 is controlled. Also, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

Moreover, according to this embodiment, the installation area of the prober 10 can be minimized. In addition, the time required for the transport unit 16 to access the transported object storage section 12 or each measuring section 14 can be minimized.

This is because the transported object storage unit 12 and the measurement units 14 are arranged at regular intervals in the Y direction with the surfaces of the side accessed by the transport unit 16 facing each other (that is, facing each other). and that the transport unit 16 is arranged between the transported object storage unit 12 and each measuring unit 14 .

Next, another embodiment of the transport unit 16 will be described.

FIG. 8 is a longitudinal sectional view showing a schematic configuration of a transport unit 16 of another embodiment. In addition, the same code|symbol is attached|subjected to the location which already demonstrated in FIG. 4, and description is abbreviate|omitted.

In the transport unit 16 shown in FIG. 8, the environment control means 16d and the air curtain forming means 42 are provided separately. By providing the environment control means 16d and the air curtain forming means 42 separately (independently) in this manner, the environment control means 16d and the air curtain forming means 42 can be operated independently. For example, the environment control means 16d and the air curtain formation means 42 are operated independently so that the environment control means 16d controls the environment inside the housing 16a with warm air, and the air curtain formation means 42 closes the opening 16f with cool air. be able to. Further, when the environment control means 16d and the air curtain forming means 42 are provided separately, the environment control means 16d is provided on the upper surface inside the housing 16a, so that the environment control means 16d can be efficiently controlled by the housing. The environment within 16a can be controlled. Furthermore, when the environment control means 16d and the air curtain forming means 42 are provided separately, by providing the environment control means 16d substantially in the center of the upper surface of the housing 16a, the environment control means 16d can be efficiently controlled by the housing. The environment within 16a can be controlled. Here, "substantially at the center" means that it does not have to be the exact center, and means that it is sufficient if it is near the center or near the center.

Next, a modified example will be described.

In this embodiment, the arms 16b and 16c of the transport unit 16 move in and out through the opening 16f formed in the housing 16a. A similar opening (not shown) is formed on the side opposite to the side on which the opening 16f is formed, and each of the arms 16b and 16c individually reciprocates in the horizontal direction to open the opening 16f and the opposite side. It may be configured to enter and exit through an opening. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, without rotating the transport unit 16, the arms 16b and 16c can access the transported article storage section 12 or the measurement sections 14. FIG. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transfer unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is formed. By providing the transport unit 16 with a similar air curtain forming means, the inside of the housing 16a can be made into a sealed or substantially sealed space, and the same effect as the above embodiment can be achieved.

Further, in the present embodiment, the configuration in which the measurement units 14 are two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) was exemplified. may be arranged in only one row in the horizontal direction (X-axis direction), or may be arranged in only one row in the vertical direction (Z-axis direction). By arranging the measurement units 14 in only one row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. In addition, by arranging the measurement units 14 in only one row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

Also, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the configuration is not limited to this, and multiple transport units 16 and multiple moving devices 22 may be used. By doing so, the throughput in each measurement unit 14 can be further improved.

Further, in the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c was exemplified. may be used.

In this embodiment, the arms 16b and 16c are provided in the transport unit 16. However, the arms 16b and 16c (or A corresponding arm) may be provided. With this configuration as well, it is possible to pick up an article to be transferred from the article storage section 12 or the measurement section 14 and store it in the transfer unit 16 by each arm, and to pick up the article from the transfer unit 16 to the transfer article storage section 12 or the measurement section 14 . It can be handed over to the measurement unit 14 .

In the present embodiment, the opening 16f formed in the housing 16a is closed by an air curtain. The conveying unit 16 may be provided with opening opening/closing means such as a shutter or a door that is closed during transportation, and the opening 16f may be opened and closed by this opening opening/closing means. Further, the opening 14a formed in each measuring section 14 may be closed with a similar air curtain, or the opening 14a may be opened and closed with a similar opening opening/closing means.

As described above, the transport unit (housing unit) is designed to create an environment suitable for the environment of the transport destination by utilizing the time until the transport object is transported to the transport destination (measuring unit or transport object storage unit). ) is not limited to the prober of the above-described embodiment. It can be applied to probers equipped with all kinds of transport units (for example, a self-propelled chassis described in Japanese Patent Application Laid-Open No. 5-343497).

Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and of course various improvements and modifications may be made without departing from the gist of the present invention. be.

DESCRIPTION OF SYMBOLS 10... Prober 12... Transferred article storage part 12a... Wafer storage part 12b... Probe card storage part 14... Measurement part 14a... Opening 16... Transfer unit 16a... Housing 16b... Wafer holding arm 16c ...probe card holding arm 16d...environment control means 16e...sensor 16f...opening 18...wafer chuck 20...head stage 22...moving device 24...first movable body 26...second movable body 28 ... transfer unit rotation mechanism, 28a... drive motor, 30, 32... guide rail, 34... base, CH... card holder, PC... probe card, W... wafer

Claims (1)

a transported object storage unit for storing transported objects;
a plurality of measuring units having an environment different from the environment of the transported article storage unit and arranged facing each other at a predetermined distance from the transported object storage unit;
a transport unit that transports the transported object between the transported object storage unit and the measuring unit;
The transport unit has environment control means for controlling a transport environment of the transported object,
The environment control means controls the transport environment of the transported object so that the transport environment of the transported object approaches the environment of the measuring unit when the transported object is transported from the transported object storage unit to the measuring unit.
prober.

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