JP2017073543A - Transfer unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer unit, transferring an object to be transferred between a transferred object storage unit and a measurement unit, capable of improving throughput at the measurement unit.SOLUTION: A transfer unit 16 transfers an object to be transferred, such as a wafer and a probe card PC, between a transferred object storage unit 12 and a measurement unit 14. The transfer unit 16 includes environmental control means for controlling a transfer environment of an object to be transferred so that the transfer environment of the object to be transferred approaches the other environment when transferring the object to be transferred from either one of the transferred object storage unit 12 and the measurement unit 14 to the other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a prober for inspecting electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and in particular, moves between a transported object storage unit and a plurality of measurement units to transfer a transported object. The present invention relates to a transport unit that transports to a transport object storage unit or each measurement unit and a prober that includes the transport unit.

  Conventionally, a transfer object storage unit (a cassette stock unit for storing a plurality of wafers) that stores a plurality of transfer objects, a plurality of measurement units (wafer inspection units), and a transfer object storage unit and each measurement unit. Thus, a prober (wafer inspection apparatus) including a transport unit (self-propelled vehicle stand) that transports a transported object to a transported object storage unit or each measurement unit has been proposed (for example, see Patent Document 1). According to the prober described in Patent Document 1, for example, when N measurement units are used, the inspection time can be shortened to 1 / N as compared with the case where one measurement unit is used.

  Conventionally, in a prober, inspection of electrical characteristics (high temperature inspection or low temperature inspection) of a wafer at a high temperature (or a low temperature) has been performed. In this inspection, the wafer is usually transferred from the cassette to the wafer chuck by the transfer arm, the wafer is heated (or cooled) to the inspection temperature on the wafer chuck, and the electrical characteristics are inspected. The wafer is cooled (or heated) above, and after the temperature reaches room temperature, the wafer is returned to the cassette by the transfer arm.

Japanese Patent Laid-Open No. 5-343497

  However, in the prober described in Patent Document 1, when a high-temperature inspection or a low-temperature inspection is performed in each measurement unit, the environment of the conveyed product storage unit (usually normal temperature environment) and the environment of each measurement unit (high temperature environment or low temperature environment) The following problems arise due to the difference.

  For example, when high-temperature inspection is performed, a waiting time (for preheating) is required for each measurement unit to bring the wafer or probe card at room temperature close to the inspection temperature before starting the inspection. There is a problem that (processing capacity per unit time) decreases. In particular, when performing a high temperature inspection again after exchanging a wafer or probe card, it takes time for the wafer chuck to become high temperature again, so the waiting time becomes longer until the next high temperature inspection can be performed. The throughput at the measurement unit is further reduced. Also, when performing high temperature inspections, when exchanging wafers and probe cards after the inspection is completed, it is necessary to wait for each measurement unit to bring the wafers and probe cards in a high temperature state to room temperature, and this also makes each measurement There is a problem that the throughput in the section decreases.

  Similarly, when performing low-temperature inspection, a waiting time is required for each measuring unit to bring the wafer or probe card in the normal temperature state close to the inspection temperature before starting the inspection, resulting in a decrease in throughput at each measuring unit. There is. In particular, when a low temperature inspection is performed again after exchanging a wafer or a probe card, since it takes time for the wafer chuck to become low temperature again, the standby time becomes longer until the next low temperature inspection can be performed. The throughput at the measurement unit is further reduced. In addition, when performing low-temperature inspection, it is necessary to wait for each measurement unit to bring the wafer or probe card in the low-temperature state close to the temperature at which condensation does not occur (usually normal temperature) after each inspection. There is a problem that the throughput in the section decreases.

  As described above, in the prober described in Patent Document 1, when the high-temperature inspection or the low-temperature inspection is performed in each measurement unit, the environment (usually normal temperature environment) of the conveyed product storage unit and the environment of each measurement unit (high temperature environment or Due to the difference from the low temperature environment), the waiting time for bringing the conveyed product close to a predetermined temperature (for example, inspection temperature or normal temperature) in each measuring unit becomes long, and the throughput in each measuring unit is reduced. There is a need to improve this and improve the throughput of each measurement unit.

  The present invention has been made in view of such circumstances, and moves between a transported object storage unit and a plurality of measurement units to store a transported object (for example, at least one of a wafer and a probe card). It is an object of the present invention to provide a prober and a transport unit that can improve the throughput of each measurement unit.

  In order to achieve the above object, a prober of the present invention controls a transported object storage unit that stores a plurality of transported objects, a plurality of measurement units, a casing that stores the transported objects, and an environment in the casing. An environmental control means, and a transport unit that moves between the transport object storage unit and each measurement unit to transport the transport object into the transport object storage unit or each measurement unit; and And a movement device that moves between the storage unit and each measurement unit, and the environment control unit controls the environment in the casing so as to be an environment according to the environment of the transport destination of the transported object.

  The transport unit according to an aspect of the prober of the present invention further includes a sensor that detects an environment in the housing, and the environment control unit controls the inside of the housing to a target environment based on a detection result of the sensor. .

  According to one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement unit, the environment control means is arranged in the casing so as to have an environment according to an inspection performed in the measurement unit of the transport destination. Control the environment.

  According to one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement unit that performs a high-temperature inspection, the environment control unit is configured to heat the transported object stored in the housing. Control the environment in the housing.

  According to one aspect of the prober of the present invention, the transport unit of the transport unit is the transport object storage unit, and the transport unit is transported into the transport object storage unit when the transport unit is in a high temperature state by a high temperature inspection. In this case, the environment control unit controls the environment in the casing so that the transported object stored in the casing is cooled.

  According to one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement unit that performs a low-temperature inspection, the environment control unit is configured to cool the transported object stored in the housing. Control the environment in the housing.

  According to one aspect of the prober of the present invention, the transport destination of the transport unit is the transport object storage unit, and the transport unit is transported into the transport object storage unit when the transport unit is in a low temperature state by a low temperature inspection. In this case, the environment control unit controls the environment in the casing so that the transported object stored in the casing is heated.

  According to one aspect of the prober of the present invention, when the transport destination of the transport unit is a measuring unit that performs an inspection under a predetermined gas atmosphere, the environment control unit is configured so that the inside of the housing has the predetermined gas atmosphere. To control the environment in the housing.

  One aspect of the prober of the present invention is a transport object holding arm that is provided in the transport unit and holds the transport object. The prober enters and exits through an opening formed in the housing, and the transport object is A transported object holding arm stored in the casing together with the transported object in a held state is provided.

  In the prober according to the aspect of the present invention, the transported object storage unit and each measurement unit are arranged at regular intervals in a state where the surfaces on the side accessed by the transport unit face each other. It arrange | positions between the said conveyed product storage part and each measurement part.

  One aspect of the prober of the present invention includes a transport unit rotation mechanism that rotates the transport unit so that the opening through which the transport object holding arm enters and exits faces the transport object storage unit or each measurement unit.

  Each measuring unit of one aspect of the prober of the present invention is two-dimensionally arranged in the horizontal direction and the vertical direction.

  According to one aspect of the prober of the present invention, the moving device includes a first movable body that moves in a horizontal direction that is an arrangement direction of each measurement unit between the transported object storage unit and each measurement unit, and the first movable unit. A first movable body moving mechanism for moving the body in a horizontal direction, and the first movable body is attached to the first movable body so as to be movable in a vertical direction that is an arrangement direction of each measurement unit, and the transport unit is set with a vertical axis as a rotation center A second movable body that is rotatably supported, a second movable body moving mechanism that moves the second movable body in a vertical direction, and a transfer unit that is attached to the second movable body and that rotates the transport unit about a vertical axis. And a transport unit rotating mechanism that rotates as described above.

  In the prober according to an aspect of the present invention, the transported object is at least one of a wafer and a probe card, and the transported object holding arm includes a wafer arm that holds the wafer and a probe card arm that holds the probe card. At least one of them.

  Each of the plurality of measurement units according to an aspect of the prober of the present invention includes a wafer chuck that is adjusted to a target temperature, and a probe card holding unit to which a probe card is detachably attached.

  The environmental control means of one aspect of the prober of the present invention is provided on the upper surface inside the casing.

  The environment control means according to one aspect of the prober of the present invention is provided at substantially the center of the upper surface.

  A transport unit according to another aspect of the present invention moves between a transport object storage unit that stores a plurality of transport objects and a plurality of measurement units, and transports the transport object into the transport object storage unit or each measurement unit. A transport unit that houses a transported object, and an environment control unit that controls the environment in the housing so that the environment in the housing becomes an environment according to the environment of the transport destination of the transported object .

  According to the present invention, a transport unit that moves between a transport object storage unit and a plurality of measurement units and transports a transport object (for example, at least one of a wafer and a probe card) to the transport object storage unit or each measurement unit. A prober and a transport unit that can improve the throughput in each measurement unit can be provided.

The perspective view which shows schematic structure of the prober of this embodiment Front view of each measuring unit Perspective view of transport unit Longitudinal sectional view showing schematic configuration of transport unit Perspective view of moving device Partial enlarged perspective view of moving device Longitudinal sectional view showing schematic configuration of transport unit and measuring unit Longitudinal sectional view showing schematic configuration of transport unit

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

  As shown in FIG. 1, the prober 10 according to the present embodiment moves between a transported object storage unit 12, a plurality of measurement units 14, a transported object storage unit 12, and each measurement unit 14, In the embodiment, at least one of the wafer and the probe card) is transported into the transported object storage unit 12 or into each measurement unit 14, and the transport unit 16 is disposed between the transported object storage unit 12 and each measurement unit 14. And a moving device (conveying unit moving device) 22 that is moved at the same time.

  The transported object storage unit 12 and each measuring unit 14 are arranged at a constant interval in the Y direction in a state where the surfaces accessed by the transport unit 16 face each other (that is, face to face).

  The transport unit 16 is disposed between the transported object storage unit 12 and each measurement unit 14.

  The conveyed product storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers and a probe card storage unit 12b that stores a plurality of probe cards. The number and arrangement of the transported object storage units 12 are not particularly limited. In this embodiment, four transported object storage units 12 including the wafer storage unit 12a and the probe card storage unit 12b are accessed by the transport unit 16. Are arranged in the horizontal direction (X-axis direction) with their surfaces (the right-side surface in FIG. 1) oriented in the same direction. Note that the side opposite to the side accessed by the transfer unit 16 (the left side in FIG. 1) is accessed by an operator when collecting a wafer or a probe card.

  As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped configured by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measurement chamber (also called a prober chamber), as shown in FIG. 7, includes a wafer chuck 18 for holding a wafer, a head stage 20, and a test placed on the head stage 20. A head (not shown) and a first probe card holding mechanism 36 that holds the probe card PC are arranged.

  FIG. 2 is a front view of each measurement unit 14.

  The number and arrangement form of the measurement units 14 are not particularly limited. In this embodiment, as shown in FIGS. 1 and 2, a measurement unit group including four measurement units 14 arranged in the horizontal direction (X-axis direction). Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface (the left surface in FIG. 1) accessed by the transport unit 16 facing the same direction.

  On each measuring section 14 (surface on the side accessed by the transfer unit 16), a wafer holding arm (wafer arm: transfer object holding arm) 16b and a probe card holding arm (probe card arm) 16c of the transfer unit 16 are provided. An entrance / exit 14a is formed. Surfaces other than the surface on which the opening 14a of each measurement unit 14 is formed may be closed or an opening may be formed.

  The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a known temperature adjusting device (for example, a heat plate or a chiller device built in the wafer chuck 18).

  The environment in each measurement unit 14 is controlled as follows. For example, the temperature in each measurement unit 14 is controlled to the target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed in each measurement unit 14. The humidity in each measurement unit 14 is controlled to the target humidity by purging dry air into each measurement unit 14 by a known mechanism. The environment in each measurement unit 14 is controlled by purging a predetermined gas (for example, nitrogen gas) into each measurement unit 14 by a known mechanism. Each measurement unit 14 performs a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection under a predetermined gas (for example, nitrogen gas) atmosphere. The environment in each measurement unit 14 is controlled so that the environment in each measurement unit 14 becomes an environment according to the inspection performed in each measurement unit 14. In addition, the test | inspection implemented by each measurement part 14 may be the same between each measurement part, and may mutually differ.

  The first probe card holding mechanism 36 is a means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC transported to the first probe card holding mechanism 36 by a probe card transport mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further explanation is omitted.

  Each measurement unit group includes four alignment devices 38 and alignment devices 38 that perform relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18. A moving device (not shown) that moves between the units 14 is arranged. The alignment device 38 is moved between the four measurement units 14 included in the measurement unit group in which the alignment device 38 is arranged, and is shared among the four measurement units 14. As the moving device that moves the alignment device 38 between the four measuring units 14, for example, a device described in Japanese Patent Application Laid-Open No. 2014-150168 can be applied.

  The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 and is moved up and down in the Z-axis direction. It is composed of a moving / rotating mechanism for moving the wafer chuck 18 in the XYZ-θ directions such as the shaft movable portion 38a, the Z-axis fixed portion 38b, and the XY movable portion 38c. The alignment device 38 mainly moves the wafer W held on the wafer chuck 18 while moving in the XYZ-θ direction to the probe of the probe card PC held above the wafer chuck 18 by a known method. Alignment is performed, the wafer W and the probe are brought into electrical contact, and the wafer W is used to inspect the electrical characteristics through the test head.

  The alignment device 38 holds the wafer chuck 18 in the measurement unit 14 and the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the preheat position P2 below the first probe card holding mechanism 36. (See FIG. 7B). This movement is realized by a known alignment apparatus moving device (not shown).

  The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and the first probe card holding mechanism 36 of the probe card PC. When the wafer is conveyed, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the preheat position P2.

  The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

  The second probe card holding mechanism 40 is a means for receiving the probe card PC from the probe card holding arm 16c and holding it, for example, a holding attached to the Z-axis movable portion 38a in a state of surrounding the wafer chuck 18. The part 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that raises and lowers the holding part 40a in the Z-axis direction with respect to the Z-axis movable part 38a.

  To receive and hold the probe card PC, the holding unit 40a is lifted in the Z-axis direction with respect to the Z-axis movable unit 38a while the alignment device 38 is moved to the probe card receiving position P1, and the probe card PC ) And the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. The probe card PC is held immediately above the wafer chuck 18.

  The probe card transport mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. For example, the probe card transport mechanism is provided in the alignment device 38 in the Z-axis direction. It is comprised by the Z-axis movable part 38a moved up and down.

  The conveyance of the probe card PC to the first probe card holding mechanism 36 is realized by raising the Z-axis movable portion 38a in the Z-axis direction in a state where the alignment device 38 has moved to the preheat position P2.

  FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view illustrating a schematic configuration of the transport unit 16.

  The transfer unit 16 moves between the transfer object storage unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction to place the wafer W or the probe card PC in the transfer object storage unit 12 or in each measurement unit 14. As shown in FIG. 3 and FIG. 4, it is a housing for storing the wafer W and the probe card PC, and the wafer W and the probe card PC (wafer holding arm 16 b and probe card holding arm 16 c). Is provided with a housing 16a in which an opening 16f is formed. The housing 16a has a rectangular parallelepiped shape, and includes a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and the housing 16a. An environmental control means 16d for controlling the internal environment and a sensor 16e for detecting the internal environment of the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in the present embodiment. In FIG. 1, two transport units 16 are depicted. This is because one transport unit 16 is accessing the transport object storage unit 12 (probe card storage unit 12 b) (in the lower right in FIG. 1). The drawing shows the state of accessing the measurement unit 14 and the measurement unit 14 (see the conveyance unit 16 drawn on the upper left in FIG. 1).

  The wafer holding arm 16b is a means for holding the wafer W. For example, the wafer holding arm 16b is arranged in the casing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the casing 16a. Yes. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W.

  The probe card holding arm 16c is a means for holding the probe card PC. For example, the probe card holding arm 16c is arranged in the casing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the casing 16a. Has been. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

  The number and arrangement form of the arms 16b and 16c are not particularly limited. In this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages. Yes.

  The arm moving mechanism is configured by a known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor forward and backward, the arms 16b and 16c individually move back and forth in the horizontal direction and enter and exit through an opening 16f formed in the housing 16a.

  The transport unit 16 includes air curtain forming means 42.

  The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a sealed or substantially sealed space. It is configured.

  The number, shape, and arrangement of the air injection ports are not particularly limited. In the present embodiment, as shown in FIG. 4, the upper end is located near the upper end edge of the opening 16 f in a posture in which a plurality of air injection ports inject downward. It is arranged along the edge (in a direction perpendicular to the paper surface in FIG. 4). An arrow 44 in FIG. 4 shows an example of the flow of dry air injected from the environment control means 16d, and the wafer chuck 18 is shown.

  The environment in the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a are set to the target temperature and humidity in a predetermined gas atmosphere by purging dry air (high-temperature or low-temperature dry air) or a predetermined gas (nitrogen gas) into each measurement unit 14. Be controlled. This is a known environment control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a pipe line (not shown) and a pipe line (not shown) connected to the casing 16a. (Not shown). The environment control means 16d may include a dehumidifier. A gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by a temperature-controlled gas supply source is supplied into the housing 16a through a duct by a blower, and is jetted from an air injection port. An air curtain that closes the opening 16f formed in 16a is formed. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The gas supply source supplied into the housing 16a and the gas supply source injected from the air injection port may be the same or different. Surfaces other than the surface on which the opening 16f of the housing 16a is formed may be closed or an opening may be formed. The environment control means 16d may be attached to the housing 16a or may be attached to the arms 16b and 16c.

  The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environment control unit 16d.

  The environment control unit 16d controls the environment in the housing 16a so as to be an environment according to the environment of the transport destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to a target environment based on the detection result of the sensor 16e. For example, the environment control unit 16d controls the temperature control gas supply source based on the detection result of the sensor 16e so that the temperature and humidity in the housing 16a become the target temperature and humidity. The function of the environmental control means 16d is realized by feedback control by a controller (not shown) to which the sensor 16e and a temperature control gas supply source (heater and cooler) are electrically connected, for example. The environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one apparatus, an air injection port may be provided downward so as to close the opening 16f, and a dry air air injection port for controlling the environment in the housing 16a may be provided. Here, it is preferable that the air injection port of the dry air for controlling the environment in the housing 16a is provided in such a direction that the dry air to be injected circulates well in the housing 16a. By integrating the environment control means 16d and the air curtain forming means 42, a space for providing the environment control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be used effectively. . Further, by integrating the environmental control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater and a cooler (cooler) between the environmental control means 16d and the air curtain forming means 42, and A blower or the like can be used in common.

  FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

  The moving device 22 is a means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transport object storage unit 12 and each measurement unit 14, for example, as shown in FIGS. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction) that is the arrangement direction of each measurement unit 14 between the transported object storage unit 12 and each measurement unit 14 are arranged in the horizontal direction (X-axis). A first movable body moving mechanism (not shown) that is moved in the direction), and is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring unit 14, and a transport unit A second movable body 26 that rotatably supports 16 around a vertical axis (Z axis) as a rotation center, and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , Attached to the second movable body 26, and the transport unit 16 is It is constituted by the transport unit rotating mechanism 28 for rotating the rotating around the Z axis).

  The first movable body 24 is, for example, a frame body configured by connecting four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and a lower portion thereof is connected to the transported object storage unit 12. It is movably connected to two guide rails 30 extending in the X-axis direction and arranged in parallel to each other on a base 34 between each measurement unit 14.

  The first movable body moving mechanism is configured by a known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor (none of which is shown), or the like that rotates the ball screw. By rotating the drive motor forward and backward, the first movable body 24 (conveyance unit 16) moves along the guide rail 30 in the X-axis direction. Of course, not limited to this, the first movable body moving mechanism is a mechanism for causing the first movable body 24 to self-run, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. Also good.

  The second movable body 26 is movably connected to two guide rails 32 that extend in the Z-axis direction and are arranged in parallel to the first movable body 24.

  The second movable body moving mechanism includes a known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor (none of which is shown) that rotates the same, and the like. By rotating the drive motor forward and reverse, the second movable body 26 (conveyance unit 16) moves along the guide rail 32 in the Z-axis direction. Of course, not limited to this, the second movable body moving mechanism is a mechanism for causing the second movable body 26 to self-run, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. Also good.

  The transport unit rotation mechanism 28 includes a known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotation axis (vertical axis). By rotating the drive motor 28a forward and backward, the transport unit 16 rotates 180 ° about the vertical axis (Z axis), and an opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is provided. It will be in the state which opposes the conveyed product storage part 12 or each measurement part 14. FIG.

  In addition, each device and mechanism such as the alignment device 38, the arm moving mechanism, the environment control means 16d, and the moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28) are not shown. It is driven by control by a control means (controller or the like).

  Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Wafer transfer operation example 1>
First, an operation example when the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) into the measurement unit 14 where high temperature inspection (for example, inspection temperature 80 ° C.) is performed will be described.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed on the wafer is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, and one wafer W is taken out from the wafer storage unit 12a and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 60 ° C.) is supplied into the housing 16a and is injected from the air injection port to be supplied to the housing. An air curtain that closes the opening 16f formed in the body 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature to be adjusted by the temperature control gas supply source is not limited to 60 ° C., but the distance and time at which the wafer W is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the measurement unit 14 at the transfer destination. It is possible to set the temperature appropriately in consideration of the inspection temperature.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space).

  Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side where the air curtain is formed and the opening 14a on the measuring unit 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the wafer W. At that time, the wafer W is further heated by the air curtain.

  Thus, the following effects can be produced by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art.

  First, as in the case of closing the opening 16f with a physical door or shutter, the inside of the housing 16a can be sealed or substantially sealed, and the temperature is adjusted in the sealed housing 16a. As a result of the gas being supplied, the environment in the housing 16a is set to an environment according to the environment of the measurement unit 14 at the transport destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). be able to.

  Second, the probe card holding arm 16c can be advanced into the measurement unit 14 while keeping the inside of the housing 16a sealed.

  Third, as compared with the case where the opening 16f is closed with a physical door or shutter, the time for opening and closing the physical door or shutter is not required, so that the probe card holding arm 16c is quickly advanced into the measuring unit 14. Can be made.

  Fourth, when delivering the probe card PC, the probe card PC can be heated by the action of an air curtain sprayed on the probe card PC.

  Fifth, when the opening 16f is closed with a physical door or shutter, the gas supplied to the inside of the housing 16a touches the physical door or shutter and enters the external environment via the physical door or shutter. The temperature of the gas supplied to the inside of the casing 16a is reduced due to the heat dissipation, whereas when the opening 16f is closed with an air curtain as in this example, the temperature is supplied to the inside of the casing 16a. Since the gas which touches the air curtain of the same temperature as this, it can suppress that the temperature of the gas supplied to the inside of the housing | casing 16a falls.

  The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W is heated by the wafer chuck 18 to reach the inspection temperature (here, 80 ° C.). When the inspection temperature is reached, the alignment device 38 moves in the XYZ-θ direction while moving the wafer chuck. The wafer W held on the wafer 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38. By bringing the wafer W and the probe into electrical contact, an electrical property inspection of the wafer W is performed via the test head.

  In this way, the environment in the transfer unit 16 is controlled (heating the wafer) by using the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature at 14, the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) as compared with the conventional technique. Thereby, the throughput in the measurement part 14 can be improved.

<Wafer transfer operation example 2>
Next, an operation example in the case where the transfer unit 16 transfers the wafer W, which has become a high temperature state (for example, 80 ° C.) by the high temperature inspection, from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23 ° C.) will be described. .

  First, the wafer W immediately after the high-temperature inspection is completed is taken out from the measuring unit 14 by the wafer holding arm 16b and stored in the housing 16a. This is performed in the reverse procedure of the wafer transfer operation example 1 described above. At the same time, the environment in the casing 16a is controlled so as to be an environment corresponding to the environment (here, room temperature 23 ° C.) of the wafer storage unit 12a as the transfer destination. Specifically, a gas whose temperature is adjusted by a temperature control gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40 ° C.) is supplied into the housing 16a and is also injected from the air injection port. An air curtain that closes the opening 16f formed in the body 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature to be adjusted by the temperature control gas supply source is not limited to 40 ° C. The distance and time at which the wafer W is transferred from the measurement unit 14 to the transfer destination wafer storage unit 12a, and the transfer destination wafer storage unit 12a. It can be set to an appropriate temperature in consideration of the temperature at The wafer W immediately after completion of the high temperature inspection is taken out of the measurement unit 14 through the opening 16f closed by the air curtain while being held by the wafer holding arm 16b, and stored in the housing 16a. The At that time, the wafer W is cooled by the air curtain sprayed thereon, and further cooled by the gas supplied into the housing 16a.

  Next, the transfer unit 16 is moved to a position where the transfer destination wafer storage unit 12a can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 to be transferred is opposed to the wafer storage unit 12a as the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be cooled by the gas supplied into the housing 16a (sealed or substantially sealed space).

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a to return the wafer W into the wafer storage unit 12a.

  As described above, the environment in the transfer unit 16 is controlled (cooling the wafer) by using the time until the wafer is transferred from the measurement unit 14 into the transfer destination wafer storage unit 12a. By reducing the difference from the temperature of the unit 12a, it is possible to eliminate (or reduce) the waiting time for bringing the wafer close to room temperature in the measuring unit 14 as compared with the prior art, and the wafer whose high-temperature inspection has been completed can be eliminated. It can be immediately taken out from the measurement unit 14 and returned to the wafer storage unit 12a. Thereby, the throughput in the measurement part 14 can be improved. Further, it is possible to eliminate (or shorten) the waiting time until the operator collects the wafer after the wafer is stored.

<Example 3 of wafer transfer operation>
Next, an operation example when the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) to the measurement unit 14 where the low temperature inspection (for example, inspection temperature −10 ° C.) is performed will be described. To do.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed on the wafer is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, and one wafer W is taken out from the wafer storage unit 12a and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, a low temperature inspection of −10 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature is adjusted or humidity-adjusted with a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to −15 ° C.) is supplied into the housing 16a and from the air injection port. An air curtain that closes the opening 16f formed in the casing 16a by being ejected is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature adjusted by the temperature control gas supply source is not limited to −15 ° C., but the distance and time at which the wafer W is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the measurement unit 14 at the transfer destination. It is possible to set the temperature appropriately in consideration of the inspection temperature and the like.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the wafer W accommodated in the transfer unit 16 continues to be temperature-controlled (for example, cooled) and dried by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation on the wafer W during the transfer of the wafer W to the measurement unit 14 as the transfer destination.

  Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side where the air curtain is formed and the opening 14a on the measuring unit 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the wafer W. At that time, the wafer W is further cooled and dried by the air curtain. Thereby, it is possible to prevent dew condensation on the wafer W during delivery of the wafer W.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W is cooled by the wafer chuck 18 and waits until it reaches the inspection temperature (here, −10 ° C.). When the inspection temperature is reached, the alignment device 38 moves in the XYZ-θ direction while moving the wafer. The wafer W held on the chuck 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38. Thus, the electrical characteristics of the wafer W are inspected through the test head by bringing the wafer W and the probe into electrical contact. In the measurement unit 14 at the transport destination, a dew point gas (for example, 20 ° C.) that does not condense at the cooling temperature of the wafer or the probe card by a known means so that no condensation occurs on the wafer or the probe card during the low temperature inspection. Dry air) is supplied, and the low-temperature inspection is performed in an environment where this gas is supplied.

  Thus, the environment in the transfer unit 16 is controlled (cooling the wafer) by using the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature 14, the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) as compared with the conventional technique. Thereby, the throughput in the measurement part 14 can be improved.

<Wafer transfer operation example 4>
Next, an example of operation in the case where the transfer unit 16 transfers the wafer W that has become a low temperature state (for example, −40 ° C.) by the low temperature inspection from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23 ° C.) will be described. To do.

  First, the wafer W immediately after the low-temperature inspection is completed is taken out from the measurement unit 14 by the wafer holding arm 16b and stored in the housing 16a. This is performed in the reverse procedure of the wafer transfer operation example 3 described above. At the same time, the environment in the casing 16a is controlled so as to be an environment corresponding to the environment (here, room temperature 23 ° C.) of the wafer storage unit 12a as the transfer destination. Specifically, a gas whose temperature is adjusted or humidity-adjusted with a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 15 ° C.) is supplied into the housing 16a and injected from the air injection port. Thus, an air curtain that closes the opening 16f formed in the housing 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature to be adjusted by the temperature control gas supply source is not limited to 15 ° C., and the distance and time at which the wafer W is transferred from the measurement unit 14 to the transfer destination wafer storage unit 12a, the transfer destination wafer storage unit 12a. It can be set to an appropriate temperature in consideration of the temperature at The wafer W immediately after completion of the low temperature inspection is taken out of the measurement unit 14 through the opening 16f closed by the air curtain while being held by the wafer holding arm 16b, and stored in the housing 16a. The At that time, the wafer W is heated by the air curtain sprayed thereon, and further heated by the gas supplied into the housing 16a. Thereby, it is possible to prevent dew condensation on the wafer W when the wafer W is delivered.

  Next, the transfer unit 16 is moved to a position where the transfer destination wafer storage unit 12a can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16f formed in the transfer unit 16 to be transferred is opposed to the wafer storage unit 12a as the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation on the wafer W during the transfer of the wafer W to the wafer storage unit 12a.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a to return the wafer W into the wafer storage unit 12a.

  As described above, the environment in the transfer unit 16 is controlled (heating the wafer) by using the time until the wafer is transferred from the measurement unit 14 into the transfer destination wafer storage unit 12a. By reducing the difference from the temperature of the unit 12a, it is possible to eliminate (or shorten) the waiting time for bringing the wafer close to room temperature in the measuring unit 14 as compared with the prior art, and the wafer having undergone the low-temperature inspection can be removed. It can be immediately taken out from the measurement unit 14 and returned to the wafer storage unit 12a. Thereby, the throughput in the measurement part 14 can be improved. In addition, it is possible to adjust the temperature environment to prevent the wafer from being condensed before the wafer is transferred into the wafer storage unit 12a.

<Wafer transfer operation example 5>
Next, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23 ° C.) into the measurement unit 14 where the inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere. Will be described.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (position where the wafer can be taken out), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c into and out of the transfer unit 16. The formed opening 16f is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, and one wafer W is taken out from the wafer storage unit 12a and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (in this case, an inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a wiring (in particular, copper wiring) exposed on the wafer surface or a gas (for example, nitrogen gas) for preventing oxidation of the probe of the probe card is supplied into the housing 16a, and the air injection port An air curtain is formed which closes the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination. During this time, the antioxidant gas is continuously supplied into the transport unit 16 (sealed or substantially sealed space). Thereby, it is possible to prevent the wafer W from being oxidized while the wafer W is being transferred to the measurement unit 14 as the transfer destination. It should be noted that an antioxidant gas is also supplied into the measurement unit 14 at the transport destination by a known means.

  Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side where the air curtain is formed and the opening 14a on the measuring unit 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the wafer W. At this time, the wafer W is prevented from being oxidized by the action of the air curtain.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the alignment device 38 aligns the wafer W held on the wafer chuck 18 with the probe of the probe card PC held above the wafer chuck 18 by a known method while moving in the XYZ-θ direction. Then, the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to bring the wafer W and the probe into electrical contact with each other, so that the electrical characteristics of the wafer W are inspected via the test head. . The inspection is carried out in an environment where an antioxidation gas is supplied.

  In this way, the wafer is the same as the measurement unit 14 in which inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination. Therefore, the wiring exposed to the wafer surface (particularly, copper wiring) is prevented from being oxidized during transfer and delivery.

  This operation example 5 can also be implemented in combination with the above wafer transfer operation examples 1 to 4.

<Probe card transport operation example 1>
Next, an operation example when the transport unit 16 transports the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) to the measurement unit 14 where the high temperature inspection (for example, inspection temperature 80 ° C.) is performed. explain.

  First, the transport unit 16 is moved to a position where the probe card storage unit 12b can be accessed (position where the probe card PC can be taken out), and the transport unit 16 is rotated by 180 ° to transport the arms 16b and 16c in and out. The opening 16f formed in the unit 16 is opposed to the probe card storage portion 12b.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and one probe card PC is taken out from the probe card storage portion 12b and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, the high temperature inspection at 80 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 60 ° C.) is supplied into the housing 16a and is injected from the air injection port to be supplied to the housing. An air curtain that closes the opening 16f formed in the body 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature to be adjusted by the temperature-controlled gas supply source is not limited to 60 ° C., and the distance and time at which the probe card PC is transported from the probe card storage unit 12b to the transport destination measurement unit 14 and the transport destination measurement unit. 14 can be set to an appropriate temperature in consideration of the inspection temperature and the like.

  Next, the conveyance unit 16 is moved to a position where the measurement unit 14 at the conveyance destination can be accessed (position where the probe card PC can be handed over), and the conveyance unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 to be transported is opposed to the measurement unit 14 at the transport destination. During this time, the probe card PC stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space).

  Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (see FIG. 7A). The probe card holding arm 16c advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the probe card PC. At that time, the probe card PC is further heated by the air curtain sprayed thereon.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the probe card PC is received from the probe card holding arm 16c and held by the holding portion 40a of the second probe card holding mechanism 40. Specifically, the holding unit 40a is movable in the Z-axis while the alignment device 38 holding the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature 80 ° C.) is moved to the probe card receiving position P1. The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that is raised in the Z-axis direction with respect to the portion 38a and brought into contact with the probe card PC (lower surface outer peripheral edge). As a result, the probe card PC is delivered to the holding unit 40a, and held by the holding unit 40a directly above the wafer chuck 18. During this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

  Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature 80 ° C.) is moved to the preheat position P2 (see FIG. 7B). Also during this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

  Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, the Z-axis movable portion 38a (second probe) is moved in a state where the alignment device 38 holding the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature 80 ° C.) is moved to the preheat position P2. The probe card PC held by the second probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36 by raising the card holding mechanism 40) in the Z-axis direction. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. Also during this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

  As described above, the probe card PC is not only heated in the transfer unit 16 but also transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36 in the wafer chuck 18. It continues to be heated (preheated) seamlessly by radiant heat.

  Thereby, even if it takes about 10 to several tens of seconds until the probe card PC heated in the transport unit 16 is delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36, Thus, the probe card PC in the preheated state can be held by the first probe card holding mechanism 36 without lowering the temperature of the probe card PC.

  In this way, the environment in the transport unit 16 is controlled (heating the probe card) by using the time until the probe card is transported from the probe card storage unit 12b to the measurement unit 14 at the transport destination. By reducing the difference from the inspection temperature at the measuring unit 14, the waiting time for bringing the probe card close to the inspection temperature (preheating) in the measuring unit 14 at the transport destination is shortened as compared with the conventional technique. (Or disappear). Thereby, the throughput in the measurement part 14 can be improved.

<Example 2 of probe card transport operation>
Next, an operation example in the case where the transport unit 16 transports the probe card PC, which has become a high temperature state (for example, 80 ° C.) by the high temperature inspection, from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23 ° C.). explain.

  First, the probe card PC immediately after the high temperature inspection is completed is taken out from the measuring unit 14 by the probe card holding arm 16c, and stored in the housing 16a. This is performed in the reverse order of the probe card transport operation example 1 described above. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment (here, room temperature 23 ° C.) of the probe card storage unit 12b as the transport destination. Specifically, a gas whose temperature is adjusted by a temperature control gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40 ° C.) is supplied into the housing 16a and is also injected from the air injection port. An air curtain that closes the opening 16f formed in the body 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. Note that the target temperature to be adjusted by the temperature control gas supply source is not limited to 40 ° C., and the distance and time at which the probe card PC is transported from the measurement unit 14 to the probe card storage unit 12b of the transport destination, and the probe card of the transport destination An appropriate temperature can be set in consideration of the temperature in the storage portion 12b. The probe card PC immediately after the completion of the high-temperature inspection is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, and is taken out from the measurement unit 14 and is put into the housing 16a. Stored. At this time, the probe card PC is cooled by an air curtain sprayed on the probe card PC and further cooled by a gas supplied into the housing 16a.

  Next, the transport unit 16 is moved to a position where the probe card storage unit 12b of the transport destination can be accessed (position where the probe card PC can be handed over), and the transport unit 16 is rotated by 180 ° to each arm 16b, 16c. The opening 16f formed in the transport unit 16 where the card enters and exits is opposed to the probe card storage unit 12b as the transport destination. During this time, the probe card PC accommodated in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (sealed or substantially sealed space).

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and the probe card PC is returned into the probe card storage portion 12b.

  As described above, the environment in the transport unit 16 is controlled (cooling the probe card) using the time until the probe card is transported from the measurement unit 14 into the probe card storage unit 12b of the transport destination. By reducing the difference between the temperature of the probe card storage unit 12b and the temperature of the probe card storage unit 12b, it is possible to eliminate (or shorten) the waiting time for bringing the probe card close to the room temperature in the measurement unit 14 as compared with the prior art. After the process is completed, the probe card can be immediately taken out from the measurement unit 14 and returned to the probe card storage unit 12b. Thereby, the throughput in the measurement part 14 can be improved. Further, it is possible to eliminate (or shorten) the waiting time until the operator collects the probe card after storing the probe card.

<Example 3 of probe card transport operation>
Next, an operation example when the transport unit 16 transports the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) to the measurement unit 14 where the low temperature inspection (for example, inspection temperature −10 ° C.) is performed. Will be described.

  First, the transport unit 16 is moved to a position where the probe card storage unit 12b can be accessed (position where the probe card can be taken out), and the transport unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in 16 is opposed to the probe card storage portion 12b.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and one probe card PC is taken out from the probe card storage portion 12b and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (here, a low temperature inspection of −10 ° C. performed in the measurement unit 14). Specifically, a gas whose temperature is adjusted or humidity-adjusted with a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to −15 ° C.) is supplied into the housing 16a and from the air injection port. An air curtain that closes the opening 16f formed in the casing 16a by being ejected is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. The target temperature to be adjusted by the temperature control gas supply source is not limited to −15 ° C., and the distance, time, and measurement of the transport destination at which the probe card PC is transported from the probe card storage portion 12b to the transport destination measurement portion 14 are measured. The temperature can be set to an appropriate temperature in consideration of the inspection temperature in the section 14 and the like.

  Next, the conveyance unit 16 is moved to a position where the measurement unit 14 at the conveyance destination can be accessed (position where the probe card PC can be handed over), and the conveyance unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 to be transported is opposed to the measurement unit 14 at the transport destination. During this time, the probe card PC stored in the transport unit 16 continues to be cooled and dried by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent condensation on the probe card PC from being generated while the probe card PC is being transported to the measurement unit 14 as the transport destination.

  Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (see FIG. 7A). The probe card holding arm 16c advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the probe card PC. At that time, the probe card PC is further cooled and dried by an air curtain sprayed on the probe card PC. As a result, it is possible to prevent condensation on the probe card PC when the probe card PC is delivered.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the probe card PC is received from the probe card holding arm 16c and held by the holding portion 40a of the second probe card holding mechanism 40. Specifically, with the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature −10 ° C.) moved to the probe card receiving position P1, the holding unit 40a is moved to the Z axis. The movable portion 38a is raised in the Z-axis direction and brought into contact with the probe card PC (lower outer peripheral edge), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is delivered to the holding unit 40a, and held by the holding unit 40a directly above the wafer chuck 18. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

  Next, the alignment device 38 holding the wafer chuck 18 cooled to the probe card PC and the target temperature (in this case, the inspection temperature −10 ° C.) is moved to the position P2 (see FIG. 7B). Also during this time, the probe card PC is cooled by the wafer chuck 18 below it.

  Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, in a state where the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature −10 ° C.) has moved to the position P2, the Z-axis movable portion 38a (second probe) The probe card PC held by the second probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36 by raising the card holding mechanism 40) in the Z-axis direction. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. Also during this time, the probe card PC is cooled by the wafer chuck 18 below it.

  As described above, the probe card PC is not only cooled in the transfer unit 16 but also transferred from the probe card holding arm 16c until it is held by the first probe card holding mechanism 36. Keeps you cool seamlessly.

  Thereby, even if it takes about 10 to several tens of seconds for the probe card PC cooled in the transport unit 16 to be delivered from the probe card holding arm 16c and held by the first probe card holding mechanism 36, Thus, the probe card PC in the cooled state can be held by the first probe card holding mechanism 36 without increasing the temperature of the probe card PC. Note that a dew point gas (for example, 20 ° C. dry air) that does not condense at the cooling temperature of the wafer or the probe card is supplied into the measurement unit 14 at the transfer destination by a known means.

  In this way, the environment in the transfer unit 16 is controlled (cooling the wafer) by using the time until the probe card is transferred from the probe card storage unit 12b to the measurement unit 14 at the transfer destination. By reducing the difference from the inspection temperature of the measurement unit 14, it is possible to shorten (or eliminate) the waiting time for bringing the probe card closer to the inspection temperature in the measurement unit 14 at the transport destination as compared with the conventional technique. Thereby, the throughput in the measurement part 14 can be improved.

<Example 4 of probe card transport operation>
Next, an operation example in the case where the transport unit 16 transports the probe card PC that has become a low temperature state (for example, −40 ° C.) by the low temperature inspection from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23 ° C.). Will be described.

  First, the probe card PC immediately after the low-temperature inspection is completed is taken out from the measuring unit 14 by the probe card holding arm 16c, and stored in the housing 16a. This is performed in the reverse order of the probe card transport operation example 3 described above. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment (here, room temperature 23 ° C.) of the probe card storage unit 12b as the transport destination. Specifically, a gas whose temperature is adjusted or humidity-adjusted with a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 15 ° C.) is supplied into the housing 16a and injected from the air injection port. Thus, an air curtain that closes the opening 16f formed in the housing 16a is formed. As a result, the inside of the housing 16a is sealed or substantially sealed. Note that the target temperature to be adjusted by the temperature control gas supply source is not limited to 15 ° C., and the distance and time at which the probe card PC is transported from the measurement unit 14 to the probe card storage unit 12b of the transport destination, and the probe card of the transport destination An appropriate temperature can be set in consideration of the temperature in the storage portion 12b. The probe card PC immediately after the end of the low-temperature inspection is held by the probe card holding arm 16c, passes through the opening 16f closed by the air curtain, and is taken out from the measurement unit 14, and is put into the housing 16a. Stored. At that time, the probe card PC is heated by the air curtain sprayed on the probe card PC and further heated by the gas supplied into the housing 16a. As a result, it is possible to prevent condensation on the probe card PC when the probe card PC is delivered.

  Next, the transport unit 16 is moved to a position where the probe card storage unit 12b of the transport destination can be accessed (position where the probe card PC can be handed over), and the transport unit 16 is rotated by 180 ° to each arm 16b, 16c. The opening 16f formed in the transport unit 16 where the card enters and exits is opposed to the probe card storage unit 12b as the transport destination. During this time, the probe card PC stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent the condensation on the probe card PC while the probe card PC is being conveyed to the probe card storage unit 12b.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and the probe card PC is returned into the probe card storage portion 12b.

  In this way, the environment in the transport unit 16 is controlled (heating the probe card) using the time until the probe card is transported from the measurement unit 14 to the probe card storage unit 12b of the transport destination. By reducing the difference between the temperature of the probe card storage unit 12b and the temperature of the probe card storage unit 12b, it is possible to eliminate (or shorten) the waiting time for bringing the probe card close to the room temperature in the measurement unit 14 as compared with the prior art. After the process is completed, the probe card can be immediately taken out from the measurement unit 14 and returned to the probe card storage unit 12b. Thereby, the throughput in the measurement part 14 can be improved. In addition, it is possible to adjust the temperature environment to prevent condensation from occurring on the probe card before the probe card is transported into the probe card storage unit 12b.

<Example 5 of probe card transport operation>
Next, when the transport unit 16 transports the probe card PC from the probe card storage unit 12b (for example, room temperature 23 ° C.) into the measurement unit 14 where the inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere. An operation example will be described.

  First, the transport unit 16 is moved to a position where the probe card storage unit 12b can be accessed (position where the probe card can be taken out), and the transport unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in 16 is opposed to the probe card storage portion 12b.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and one probe card PC is taken out from the probe card storage portion 12b and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transport destination (in this case, an inspection under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a wiring (in particular, copper wiring) exposed on the wafer surface or a gas (for example, nitrogen gas) for preventing oxidation of the probe of the probe card is supplied into the housing 16a, and the air injection port An air curtain is formed which closes the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the conveyance unit 16 is moved to a position where the measurement unit 14 at the conveyance destination can be accessed (position where the probe card PC can be handed over), and the conveyance unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 to be transported is opposed to the measurement unit 14 at the transport destination. During this time, the antioxidant gas is continuously supplied into the transport unit 16 (sealed or substantially sealed space). Thereby, it is possible to prevent the probe card PC from being oxidized while the probe card PC is being transported to the measurement unit 14 as the transport destination. It should be noted that an antioxidant gas is also supplied into the measurement unit 14 at the transport destination by a known means.

  Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side. The probe card holding arm 16c advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the probe card PC. At this time, the probe card PC is prevented from being oxidized by the action of the air curtain.

  Thus, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be obtained.

  Thereafter, the probe card PC is conveyed to the first probe card holding mechanism 36 in the same procedure as in the probe card conveying operation examples 1 and 3, and is detachably held by the first probe card holding mechanism 36.

  In this manner, the probe card is inspected in a predetermined gas (for example, nitrogen gas) atmosphere until the probe card is conveyed from the probe card storage unit 12b to the measurement unit 14 as the conveyance destination. 14, the probe of the probe card is prevented from being oxidized during transportation and delivery.

  In addition, this operation example 5 can also be implemented in combination with the said probe card conveyance operation examples 1-4.

  As described above, according to the present embodiment, the transported object (for example, at least one of a wafer and a probe card) moves between the transported object storage unit 12 and the plurality of measurement units 14 to transfer the transported object storage unit. In the prober 10 including the transport unit 16 transported to the 12 or each measurement unit 14, a prober capable of improving the throughput in each measurement unit 14 can be provided.

  This is because the environment (for example, temperature and humidity) in the transport unit 16 (housing 16a) is controlled using the time until the transported object is transported to the transport destination (measurement unit 14 or transported object storage unit 12). And, thereby, compared with the prior art, the waiting time for bringing the conveyed product close to a predetermined temperature (for example, inspection temperature or room temperature) in each measuring unit can be shortened (or eliminated). is there.

  In addition, according to the present embodiment, since the environment of the prober 10 is not controlled, the environment in the housing 16a having a size smaller than that of the entire prober 10 is controlled, that is, the environment in the housing 16a. Therefore, energy saving can be realized as compared with the case where the environment of the entire prober 10 is controlled. In addition, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

  Moreover, according to this embodiment, the installation area of the prober 10 can be minimized. Moreover, the time for the transport unit 16 to access the transported object storage unit 12 or each measurement unit 14 can be minimized.

  This is because the transported object storage unit 12 and each measuring unit 14 are arranged at regular intervals in the Y direction in a state where the surfaces accessed by the transport unit 16 face each other (that is, facing each other). This is because the conveyance unit 16 is disposed between the conveyance object storage unit 12 and each measurement unit 14.

  Next, another embodiment of the transport unit 16 will be described.

  FIG. 8 is a longitudinal sectional view illustrating a schematic configuration of the transport unit 16 according to another embodiment. In addition, the part already demonstrated in FIG. 4 attaches | subjects the same code | symbol, and abbreviate | omits description.

  In the transport unit 16 shown in FIG. 8, the environment control means 16d and the air curtain forming means 42 are provided separately. Thus, by providing the environment control means 16d and the air curtain forming means 42 separately (independently), the operation of the environment control means 16d and the air curtain forming means 42 can be performed independently. For example, the environment control means 16d controls the environment inside the housing 16a with hot air, and the air curtain forming means 42 operates the environment control means 16d and the air curtain forming means 42 independently so as to close the opening 16f with cold air. be able to. Further, when the environment control means 16d and the air curtain forming means 42 are provided separately, the environment control means 16d is provided on the upper surface inside the case 16a, so that the environment control means 16d is efficiently provided with the case. The environment within 16a can be controlled. Further, when the environmental control means 16d and the air curtain forming means 42 are provided separately, the environmental control means 16d is provided more efficiently in the case by providing the environmental control means 16d substantially at the center of the upper surface of the case 16a. The environment within 16a can be controlled. Here, the “substantially center” means that it does not have to be a strict center, and it means that it may be near or near the center.

  Next, a modified example will be described.

  In the present embodiment, the configuration in which the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a is exemplified. A similar opening (not shown) is formed on the surface opposite to the side on which the opening 16f is formed, and the arms 16b and 16c are individually reciprocated in the horizontal direction to open the opening 16f and its opposite side. You may comprise so that it may enter / exit through opening. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, without the transport unit 16 being rotated, access to the transport object storage unit 12 or each measurement unit 14 by the arms 16b and 16c can be realized. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transport unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is provided. By providing the air curtain forming means to be formed in the transport unit 16, the inside of the housing 16a can be sealed or substantially sealed space, and the same effect as in the above embodiment can be obtained.

  Further, in the present embodiment, the configuration in which each measurement unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the measurement unit 14 is not limited thereto. May be arranged only in a line in the horizontal direction (X-axis direction), or may be arranged only in a line in the vertical direction (Z-axis direction). The second movable body moving mechanism can be omitted by arranging the measuring units 14 in only one row in the horizontal direction (X-axis direction). Also, the first movable body moving mechanism can be omitted by arranging the measuring units 14 in only one line in the vertical direction (Z-axis direction).

  Further, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. In this way, the throughput in each measurement unit 14 can be further improved.

  In the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c has been exemplified. However, the configuration is not limited thereto, and only the wafer holding arm 16b may be used, or only the probe card holding arm 16c may be used. It may be used.

  Further, in the present embodiment, the configuration in which the arms 16b and 16c are provided in the transport unit 16 is illustrated, but not limited thereto, the arms 16b and 16c (or the transport unit storage unit 12 side and the measurement unit 14 side) are provided. An arm corresponding to this may be provided. Also by this, it is possible to take out the conveyed product from the conveyed product storage unit 12 or the measurement unit 14 by each arm and store it in the conveyance unit 16, and to take out the conveyed product from the conveyance unit 16 and to store the conveyed product storage unit 12 or It can be delivered to the measurement unit 14.

  Further, in the present embodiment, the configuration in which the opening 16f formed in the casing 16a is closed with an air curtain is illustrated, but the present invention is not limited thereto, and the opening is opened when the transported object is taken out or delivered, and An opening / closing means such as a shutter or a door that is closed during the conveyance may be provided in the conveyance unit 16, and the opening 16f may be opened / closed by the opening / closing means. Moreover, you may comprise so that the opening 14a formed in each measurement part 14 may be obstruct | occluded with the same air curtain, or you may comprise so that the opening 14a may be opened and closed with the same opening opening / closing means.

  As described above, the transport unit (housing) is configured so that the environment according to the environment of the transport destination of the transport object is obtained by using the time until the transport object is transported to the transport destination (measurement unit or transport object storage unit). The concept of controlling the environment in (2) is not only the prober of the above embodiment, but also moves between the transported object storage unit and the plurality of measuring units to transport the transported object in the transported object storage unit or in the plurality of measuring units. Therefore, the present invention can be applied to a prober equipped with all kinds of transport units (for example, a self-propelled vehicle platform described in JP-A-5-343497).

  Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the scope of the present invention. is there.

  DESCRIPTION OF SYMBOLS 10 ... Prober, 12 ... Conveyed object storage part, 12a ... Wafer storage part, 12b ... Probe card storage part, 14 ... Measurement part, 14a ... Opening, 16 ... Conveyance unit, 16a ... Case, 16b ... Wafer holding arm, 16c DESCRIPTION OF SYMBOLS ... Probe card holding arm, 16d ... Environmental control means, 16e ... Sensor, 16f ... Opening, 18 ... Wafer chuck, 20 ... Head stage, 22 ... Moving device, 24 ... First movable body, 26 ... Second movable body, 28 ... transport unit rotation mechanism, 28a ... drive motor, 30, 32 ... guide rail, 34 ... base, CH ... card holder, PC ... probe card, W ... wafer

Claims (4)

A transport unit that transports a transported object between a transported object storage unit and a measurement unit,
Environment control for controlling the transport environment of the transported object so that the transport environment of the transported object approaches the other environment when transporting the transported object from one of the transported object storage unit and the measurement unit to the other With means,
Transport unit. A housing for storing the transported object;
The environment control means controls the environment in the housing as a transport environment of the transported object.
The transport unit according to claim 1. The environment control means controls the transport environment of the transported object according to the inspection temperature of the measurement unit when transporting the transported object from the transported object storage unit to the measurement unit.
The transport unit according to claim 1 or 2. Provided in a prober provided with the transported object storage unit and the measurement unit,
The conveyance unit according to any one of claims 1 to 3.

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